Film tearing machine for HDI circuit board and control method, device and medium thereof

Abstract

This invention proposes a film-peeling machine for HDI circuit boards, along with its control method, apparatus, and medium. The film-peeling machine includes an adsorption platform with an easy-tear adhesive label picking position for placing the circuit board. The surface of the circuit board is covered with a thin film and has adhesive tape attached. A first X-axis linear motor, a second X-axis linear motor, a Y-axis linear motor, and two Z-axis linear motors are arranged on the outer side of the platform. Two film-peeling assemblies are mounted on the Z-axis linear motors and include a gripper assembly and a first drive assembly. The gripper assembly includes a large gripper, a small gripper located inside the large gripper, an adsorption pressure head near or away from the small gripper, and a camera aligned with the adsorption platform. A controller is communicatively connected to the adsorption platform, the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor, and the film-peeling assemblies. According to the technical solution of this invention, the large gripper grasps the adhesive joint between the easy-tear adhesive label and the high-adhesion adhesive tape, thus peeling off the film from the HDI circuit board.

Description

Technical Field

[0001] This invention relates to the field of film peeling equipment technology, and in particular to a film peeling machine for HDI circuit boards and its control method, device and medium. Background Technology

[0002] The production environment for High Density Interconnector (HDI) circuit boards is complex, so a thin film is covered on the surface of the HDI circuit board. The film has adhesive tape on its surface. The film can protect the HDI circuit board from external environmental interference. Before the HDI circuit board enters the subsequent production, the film on the HDI circuit board is removed.

[0003] Existing film-removing equipment uses grippers to pick up easy-tear labels, attaching them to the adhesive tape on the HDI circuit board. The grippers then peel off the film from the HDI circuit board using the easy-tear label and adhesive tape. However, this equipment is only suitable for removing films with low-tack and standard-viscosity adhesive tapes. When removing films with high-tack tape, the grippers in existing equipment encounter difficulties because the high adhesiveness of the tape requires greater force than that required for low-tack and standard-viscosity tapes. During the peeling process, the adhesion between the high-tack tape and the easy-tear label exceeds the friction between the grippers and the easy-tear label, causing the easy-tear label to detach from the grippers and resulting in peeling failure. Summary of the Invention

[0004] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a film-removing machine for HDI circuit boards, as well as its control method, device, and medium. The machine uses small grippers to pick up easy-tear adhesive tape, and large grippers to pick up the adhesive joint between the easy-tear tape and the high-tack tape, making the gripping effect of the easy-tear tape more stable. This achieves the removal of the film with high-tack tape on the HDI circuit board through a dual-gripper structure.

[0005] In a first aspect, embodiments of the present invention provide a film-peeling machine for HDI circuit boards, comprising:

[0006] An adsorption platform is provided with an easy-tear adhesive picking position. The adsorption platform is used to place circuit boards. The surface of the circuit boards is covered with a thin film, and the surface of the thin film is attached with adhesive tape. A first X-axis linear motor, a second X-axis linear motor, and a Y-axis linear motor are provided on the outside of the adsorption platform. The Y-axis linear motor can slide on the first X-axis linear motor and the second X-axis linear motor. Two Z-axis linear motors are provided on one side of the Y-axis linear motor.

[0007] Two film-tearing assemblies are mounted on the front side of the Z-axis linear motor. The Z-axis linear motor drives the film-tearing assembly to slide vertically. Each film-tearing assembly includes a gripper assembly and a first drive assembly. The first drive assembly is connected to the gripper assembly and is used to drive the gripper assembly to rotate. The gripper assembly includes a small gripper, a large gripper, an adsorption pressure head, and a camera. The small gripper is located inside the large gripper and is connected to a finger cylinder. The large gripper is connected to a second drive assembly. The adsorption pressure head is connected to a third drive assembly and is used to drive the adsorption pressure head to move closer to or away from the small gripper. The camera is fixed to one side of the film-tearing assembly, and the camera's shooting direction is aligned with the adsorption platform.

[0008] The controller is communicatively connected to the adsorption platform, the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor, and the film-tearing assembly.

[0009] According to some embodiments of the present invention, the upper clamping portion of the small gripper is provided with a first through hole, and the lower clamping portion of the small gripper is provided with a second through hole. The first through hole and the second through hole are interconnected. An optical fiber sensor is provided above the first through hole, and the optical fiber sensor is communicatively connected to the controller.

[0010] According to some embodiments of the present invention, the first drive assembly includes a first servo motor, a first harmonic reducer, a second servo motor, and a second harmonic reducer. The first servo motor is mounted on the front side of the Z-axis linear motor. The first harmonic reducer is connected below the first servo motor. The first harmonic reducer is connected to the second harmonic reducer via a mounting plate. The second servo motor is connected to the side of the second harmonic reducer away from the adsorption platform. The gripper assembly is connected to the side of the second harmonic reducer closer to the adsorption platform. A pressure sensor is disposed between the second harmonic reducer and the gripper assembly. The first servo motor, the second servo motor, and the pressure sensor are respectively communicatively connected to the controller.

[0011] According to some embodiments of the present invention, pressure plate assemblies are provided on both opposite sides of the adsorption platform. Each pressure plate assembly includes a pressure plate, a cylinder, a third servo motor, and a transmission assembly. The third servo motor is connected to the pressure plate through the transmission assembly and drives the pressure plate to move closer to or away from the adsorption platform through the transmission assembly. The cylinder is connected to the pressure plate and is used to drive the pressure plate to move vertically. An ion bar is provided above the pressure plate assembly, and the outlet of the ion bar is aligned with the adsorption platform. The cylinder, the third servo motor, and the ion bar are respectively communicatively connected to the controller.

[0012] In a second aspect, embodiments of the present invention provide a control method for a film-removing machine for HDI circuit boards, applied to the film-removing machine for HDI circuit boards described in the first aspect, the method comprising:

[0013] After the circuit board is placed on the adsorption platform, the adsorption platform is controlled to work. When the adsorption platform adsorbs the circuit board, the camera is controlled to position the circuit board and generate a positioning result. The positioning result is sent to the controller. Then, the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor and the first drive assembly are controlled to move the gripper assembly to the easy-tear adhesive picking position.

[0014] The second drive assembly and the finger cylinder are controlled to make the small gripper pick up the easy-tear sticker, and the third drive assembly is controlled to make the adsorption head move towards the small gripper. When the adsorption head comes into contact with the easy-tear sticker, the adsorption head is controlled to adsorb the easy-tear sticker.

[0015] Based on the positioning result, the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor, and the first drive assembly are controlled to make the adsorption head press the easy-tear adhesive tape attached to the circuit board;

[0016] The third drive assembly and the adsorption head are controlled to make the adsorption head release the easy-tear sticker and move away from the small gripper. Then, the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor and the first drive assembly are controlled to increase the angle between the small gripper and the adsorption platform.

[0017] When the small gripper is perpendicular to the adsorption platform, the first drive assembly and the second drive assembly are controlled to make the large gripper close and rotate. When the large gripper rotates to the film-tearing angle, the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor, and the first drive assembly are controlled to make the large gripper move along a preset trajectory. When the large gripper is at the end of the preset trajectory, the camera is controlled to acquire an image of the circuit board. The comparison result between the image of the circuit board and the preset image is sent to the controller. When the comparison result is inconsistent, the controller alarms.

[0018] According to some embodiments of the present invention, the upper clamping part of the small gripper is provided with a first through hole, the lower clamping part of the small gripper is provided with a second through hole, the first through hole and the second through hole are interconnected, and an optical fiber sensor is provided above the first through hole, the optical fiber sensor being communicatively connected to the controller.

[0019] Controlling the second drive assembly and finger cylinder to cause the small gripper to pick up the easy-tear sticker includes:

[0020] Control the second drive component to open the large gripper;

[0021] Control the finger cylinder to cause the small gripper to open and then close;

[0022] When the easy-tear adhesive is located between the first through hole and the second through hole, the fiber optic sensor sends a material picking completion signal to the controller.

[0023] According to some embodiments of the present invention, pressure plate assemblies are provided on both opposite sides of the adsorption platform. Each pressure plate assembly includes a pressure plate, a cylinder, a third servo motor, and a transmission assembly. The third servo motor is connected to the pressure plate through the transmission assembly and drives the pressure plate to move closer to or away from the adsorption platform through the transmission assembly. The cylinder is connected to the pressure plate and is used to drive the pressure plate to move vertically. An ion air bar is provided above the pressure plate assembly, and the air outlet of the ion air bar is aligned with the adsorption platform. The cylinder, the third servo motor, and the ion air bar are respectively communicatively connected to the controller.

[0024] Before controlling the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor, and the first drive assembly based on the positioning result to press the suction head firmly against the easy-tear adhesive tape attached to the circuit board, the method further includes:

[0025] The third servo motor is controlled to move the pressure plate above the pressing edge position of the adsorption platform;

[0026] Control the cylinder to move the pressure plate downwards until the pressure plate abuts against the circuit board;

[0027] The ion bar is activated, and it outputs ion wind towards the adsorption platform.

[0028] According to some embodiments of the present invention, the first drive assembly includes a first servo motor, a first harmonic reducer, a second servo motor, and a second harmonic reducer. The first servo motor is mounted on the front side of the Z-axis linear motor. The first harmonic reducer is connected below the first servo motor. The first harmonic reducer is connected to the second harmonic reducer via a mounting plate. The second servo motor is connected to the side of the second harmonic reducer away from the adsorption platform. The gripper assembly is connected to the side of the second harmonic reducer close to the adsorption platform. A pressure sensor is provided between the second harmonic reducer and the gripper assembly. The first servo motor, the second servo motor, and the pressure sensor are respectively communicatively connected to the controller.

[0029] After controlling the third drive assembly and the suction head to release the easy-tear adhesive and moving it away from the small gripper, the process further includes:

[0030] The pressure sensor is activated to send real-time pressure values ​​to the controller.

[0031] The first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor, the first servo motor, and the second servo motor are controlled to move the large gripper along the preset trajectory. When the large gripper is located on the preset trajectory and the real-time pressure value is zero, the pressure sensor is controlled to send an alarm signal to the controller.

[0032] Thirdly, embodiments of the present invention provide a control device for a film-peeling machine for HDI circuit boards, including at least one control processor and a memory for communicatively connecting to the at least one control processor; the memory stores instructions executable by the at least one control processor, which, when executed by the at least one control processor, enables the at least one control processor to perform the control method for the film-peeling machine for HDI circuit boards as described in the second aspect above.

[0033] Fourthly, embodiments of the present invention provide a computer-readable storage medium storing computer-executable instructions for performing the control method for a film-peeling machine for HDI circuit boards as described in the second aspect above.

[0034] The film-peeling machine for HDI circuit boards according to embodiments of the present invention has at least the following beneficial effects: An adsorption platform, wherein the adsorption platform is provided with an easy-peel adhesive material picking position, the adsorption platform is used to place the circuit board, the surface of the circuit board is covered with a thin film, the surface of the thin film is attached with adhesive tape, a first X-axis linear motor, a second X-axis linear motor, and a Y-axis linear motor are arranged on the outside of the adsorption platform, the Y-axis linear motor is slidable between the first X-axis linear motor and the second X-axis linear motor, and two Z-axis linear motors are arranged on one side of the Y-axis linear motor; two film-peeling assemblies, the film-peeling assemblies are mounted on the front side of the Z-axis linear motors, the Z-axis linear motors drive the film-peeling assemblies to slide in a vertical direction, the film-peeling assemblies include a gripper assembly and a first drive assembly. The first driving component is connected to the gripper assembly and is used to drive the gripper assembly to rotate. The gripper assembly includes a small gripper, a large gripper, an adsorption pressure head, and a camera. The small gripper is located inside the large gripper and is connected to a finger cylinder. The large gripper is connected to a second driving component, and the adsorption pressure head is connected to a third driving component. The third driving component is used to drive the adsorption pressure head to move closer to or away from the small gripper. The camera is fixed to one side of the film-peeling assembly, and the camera's shooting direction is aligned with the adsorption platform. A controller is communicatively connected to the adsorption platform, the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor, and the film-peeling assembly. According to the technical solution of this embodiment, by using the small gripper to pick up the easy-tear sticker and the large gripper to pick up the adhesive joint between the easy-tear sticker and the high-adhesion tape, the gripper's effect on picking up the easy-tear sticker is more stable, realizing the removal of the film with high-adhesion tape on the HDI circuit board through the dual-gripper structure. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of the structure of a first X-axis linear motor, a second X-axis linear motor, a Y-axis linear motor, a Z-axis linear motor, and a film-tearing assembly provided in one embodiment of the present invention;

[0036] Figure 2 This is a schematic diagram of the adsorption platform provided in another embodiment of the present invention;

[0037] Figure 3 This is a schematic diagram of the structure of a film-peeling assembly provided in another embodiment of the present invention;

[0038] Figure 4 This is a side view of a film-peeling assembly provided in another embodiment of the present invention;

[0039] Figure 5 This is a rear view of a film-peeling assembly provided in another embodiment of the present invention;

[0040] Figure 6 This is a flowchart of the working process of a film-peeling machine for HDI circuit boards provided in another embodiment of the present invention;

[0041] Figure 7 This is a structural diagram of a control device for a film-peeling machine for HDI circuit boards provided in another embodiment of the present invention. Detailed Implementation

[0042] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0043] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0044] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0045] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0046] The film-peeling machine for HDI circuit boards according to embodiments of the present invention has at least the following beneficial effects: An adsorption platform, wherein the adsorption platform is provided with an easy-peel adhesive material picking position, the adsorption platform is used to place the circuit board, the surface of the circuit board is covered with a thin film, the surface of the thin film is attached with adhesive tape, a first X-axis linear motor, a second X-axis linear motor, and a Y-axis linear motor are arranged on the outside of the adsorption platform, the Y-axis linear motor is slidable between the first X-axis linear motor and the second X-axis linear motor, and two Z-axis linear motors are arranged on one side of the Y-axis linear motor; two film-peeling assemblies, the film-peeling assemblies are mounted on the front side of the Z-axis linear motors, the Z-axis linear motors drive the film-peeling assemblies to slide in a vertical direction, the film-peeling assemblies include a gripper assembly and a first drive assembly. The first driving component is connected to the gripper assembly and is used to drive the gripper assembly to rotate. The gripper assembly includes a small gripper, a large gripper, an adsorption pressure head, and a camera. The small gripper is located inside the large gripper and is connected to a finger cylinder. The large gripper is connected to a second driving component, and the adsorption pressure head is connected to a third driving component. The third driving component is used to drive the adsorption pressure head to move closer to or away from the small gripper. The camera is fixed to one side of the film-peeling assembly, and the camera's shooting direction is aligned with the adsorption platform. A controller is communicatively connected to the adsorption platform, the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor, and the film-peeling assembly. According to the technical solution of this embodiment, by using the small gripper to pick up the easy-tear sticker and the large gripper to pick up the adhesive joint between the easy-tear sticker and the high-adhesion tape, the gripper's effect on picking up the easy-tear sticker is more stable, realizing the removal of the film with high-adhesion tape on the HDI circuit board through the dual-gripper structure.

[0047] First, refer to Figures 1 to 5 The film-peeling machine for HDI circuit boards provided in this application embodiment includes:

[0048] The adsorption platform 10 is provided with an easy-tear adhesive picking position. The adsorption platform 10 is used to place circuit boards. The surface of the circuit boards is covered with a film, and the surface of the film is covered with adhesive tape. A first X-axis linear motor 20, a second X-axis linear motor 30 and a Y-axis linear motor 40 are provided on the outside of the adsorption platform 10. The Y-axis linear motor 40 can slide on the first X-axis linear motor 20 and the second X-axis linear motor 30. Two Z-axis linear motors 50 are provided on one side of the Y-axis linear motor 40.

[0049] Two film-tearing assemblies 60 are mounted on the front side of a Z-axis linear motor 50. The Z-axis linear motor 50 drives the film-tearing assembly 60 to slide vertically. The film-tearing assembly 60 includes a gripper assembly 62 and a first drive assembly 61. The first drive assembly 61 is connected to the gripper assembly 62 and is used to drive the gripper assembly 62 to rotate. The gripper assembly 62 includes a small gripper 622, a large gripper 621, an adsorption pressure head 623, and a camera 63. The small gripper 622 is located inside the large gripper 621 and is connected to a finger cylinder 624. The large gripper 621 is connected to a second drive assembly. The adsorption pressure head 623 is connected to a third drive assembly. The third drive assembly is used to drive the adsorption pressure head 623 to move closer to or away from the small gripper 622. The camera 63 is fixed to one side of the film-tearing assembly 60, and the camera 63's shooting direction is aligned with the adsorption platform 10.

[0050] The controller is communicatively connected to the adsorption platform 10, the first X-axis linear motor 20, the second X-axis linear motor 30, the Y-axis linear motor 40, the Z-axis linear motor 50, and the film-tearing assembly 60.

[0051] It should be noted that the adsorption platform 10 includes multiple vacuum logic valves. A circuit board is placed on the adsorption platform 10, forming a sealed space between the circuit board and the vacuum logic valves. The controller controls the adsorption platform 10 to operate, opening the vacuum logic valves and allowing a pump connected to the vacuum logic valves to extract air from the sealed space. When the vacuum logic valve detects that the internal pressure of the sealed space is less than a preset threshold, it indicates that the adsorption platform 10 has successfully adsorbed the circuit board, and the vacuum logic valve sends a signal to the controller. The adsorption platform 10 secures the circuit board, enabling the film-peeling machine to handle the film-peeling process for circuit boards of various sizes. After the film is peeled off, the controller closes the vacuum logic valves, breaking the vacuum and allowing the adsorption platform 10 to release the circuit board, thus removing it from the adsorption platform 10.

[0052] It should be noted that one end of the Y-axis linear motor 40 is located at the first X-axis linear motor 20, and the other end is located at the second X-axis linear motor 30. The first X-axis linear motor 20 and the second X-axis linear motor 30 work together to drive the Y-axis linear motor 40 to move in the X-axis direction, thereby realizing the movement of the gripper assembly 62 in the X-axis direction. The Y-axis linear motor 40 drives the gripper assembly 62 through the Z-axis linear motor 50, realizing the movement of the gripper assembly 62 in the Y-axis direction. The first drive assembly 61 is installed on the front side of the Z-axis linear motor 50, and the Z-axis linear motor 50 drives the gripper assembly 62 to move in the Z-axis direction through the first drive assembly 61.

[0053] It should be noted that the first drive component 61 includes a servo motor and a harmonic reducer. The servo motor drives the gripper component 62 to rotate through the harmonic reducer, thereby achieving high-precision control of the rotation angle of the gripper component 62.

[0054] It should be noted that the second drive assembly is connected to the rear side of the large gripper 621. The second drive assembly includes a cylinder 72, and two rack plates are connected to both sides of the cylinder 72. Racks are provided on both the upper and lower sides of the rack plates. The large gripper 621 is hinged to a fixed plate connected to the first drive assembly 61. Two integrally formed gears are provided on both sides of the large gripper 621. The gears of the large gripper 621 mesh with the rack plates. The cylinder 72 drives the rack plates to move back and forth, driving the gears to rotate, thereby driving the large gripper 621 to open and close.

[0055] It should be noted that the finger cylinder 624 is connected to the rear side of the small gripper 622. The finger cylinder 624 drives the small gripper 622 to open and close. The upper and lower surfaces of the gripping part of the small gripper 622 are inclined. When the small gripper 622 sticks the easy-tear sticker to the tape on the circuit board, the inclined surface of the lower surface of the small gripper 622 is parallel to the adsorption platform 10 and abuts against the circuit board.

[0056] It should be noted that the third drive assembly includes a telescopic cylinder and a lateral cylinder. The telescopic cylinder is connected to the lateral cylinder, and the lateral cylinder is connected to the adsorption head 623. The telescopic cylinder is used to drive the lateral cylinder and the adsorption head 623 to move along the X-axis, and the lateral cylinder is used to drive the adsorption head 623 to move along the Y-axis. The side of the adsorption head 623 near the large gripper 621 is set with an inclined surface parallel to the inclined surface of the lower surface of the small gripper 622. When the small gripper 622 sticks the easy-tear sticker to the tape, the inclined surface of the adsorption head 623 is parallel to the adsorption platform 10 and abuts against the circuit board, thereby enabling the adsorption head 623 to press the easy-tear sticker tightly onto the tape.

[0057] It should be noted that after the small gripper 622 picks up the easy-tear sticker, the suction head 623 is controlled to approach the small gripper 622, and the suction head 623 abuts against the easy-tear sticker, thus controlling the suction head 623 to adsorb the easy-tear sticker.

[0058] It should be noted that the camera 63 is used to locate the tape on the circuit board located on the adsorption platform 10 and sends the positioning result to the controller. Based on the positioning result, the controller controls the first X-axis linear motor 20, the second X-axis linear motor 30, and the Y-axis linear motor 40 to drive the gripper assembly 62 to move from the easy-tear tape picking position to the positioning result position, i.e., the tape on the circuit board, after the film is removed from the circuit board, the camera 63 is controlled to acquire an image of the circuit board and compare the acquired image of the circuit board with a preset image. The comparison result is sent to the controller. When the acquired image of the circuit board is inconsistent with the preset image, the comparison result is that the images are inconsistent, indicating that there is film residue on the circuit board. The controller issues an alarm to remind the staff that there is film residue on the surface of the circuit board located on the adsorption platform 10.

[0059] It should be noted that in the prior art, only one jaw grips the easy-tear sticker, and after the easy-tear sticker is attached to the tape, the jaw moves to remove the film. That is, the jaw only grips the easy-tear sticker throughout the entire process, which causes the easy-tear sticker to fall off the jaw when removing the film with highly tack tape. In this application, the small jaw 622 grips the easy-tear sticker, and the large jaw 621 grips the adhesive part of the easy-tear sticker and the tape. The tape is attached to the film, so the gripping part of the large jaw 621 holds the easy-tear sticker, the tape and the film, making the gripping effect of the jaw more stable. This achieves the removal of the film with highly tack tape on the HDI circuit board by means of a dual-jaw structure.

[0060] It should be noted that after the circuit board is placed on the adsorption platform 10, the adsorption platform 10 is activated, the vacuum logic valve opens, and the vacuum pump extracts the air from the sealed space between the circuit board and the vacuum logic valve. When the vacuum logic valve detects that the air pressure in the sealed space between the circuit board and the vacuum logic valve is less than a preset threshold, the vacuum logic valve sends a signal to the controller. The controller controls the camera 63 to acquire an image of the circuit board, obtain the positioning result of the tape on the circuit board, and send it to the controller. The controller controls the first X-axis linear motor 20, the second X-axis linear motor 30, and the Y-axis linear motor 63. Motor 40 and Z-axis linear motor 50 move the gripper assembly 62 to the easy-tear label picking position, control the film-tearing assembly 60 to make the small gripper 622 pick up the easy-tear label, control the third drive assembly to make the suction head 623 approach the small gripper 622, and control the suction head 623 to adsorb the easy-tear label when it comes into contact with the easy-tear label; based on the positioning result, the controller controls the first X-axis linear motor 20, the second X-axis linear motor 30, the Y-axis linear motor 40, the Z-axis linear motor 50 and the film-tearing assembly 60, and controls the small gripper 622 to stick the easy-tear label onto the line. At the tape on the road surface, the suction head 623 presses the easy-tear sticker firmly against the tape. The third drive assembly is controlled to move the suction head 623 to its initial position. The first X-axis linear motor 20, the second X-axis linear motor 30, the Y-axis linear motor 40, the Z-axis linear motor 50, and the first drive assembly 61 are controlled to increase the angle between the small gripper 622 and the suction platform 10, preventing the large gripper 621 from colliding with the suction platform 10 when holding the easy-tear sticker and tape. When the small gripper 622 is perpendicular to the suction platform 10, the large gripper 621 is controlled to close. Clamping easy-tear stickers, tapes, and films; controlling the first X-axis linear motor 20, the second X-axis linear motor 30, the Y-axis linear motor 40, the Z-axis linear motor 50, and the first drive assembly 61 to make the gripper assembly 62 move along a preset trajectory. When the gripper assembly 62 moves to the end of the preset trajectory, the camera 63 is controlled to acquire an image of the circuit board and compare the image with a preset image. The comparison result is sent to the controller. When the comparison result is inconsistent, the controller issues an alarm to remind the staff that there is film residue on the surface of the circuit board on the adsorption platform 10.

[0061] Additionally, in one embodiment, reference is made to Figure 4 The upper clamping part of the small gripper 622 is provided with a first through hole, and the lower clamping part of the small gripper 622 is provided with a second through hole. The first through hole and the second through hole are connected to each other. An optical fiber sensor 6222 is provided above the first through hole, and the optical fiber sensor 6222 is communicatively connected to the controller.

[0062] It should be noted that before the small gripper 622 picks up the easy-tear label, the first through hole is connected to the second through hole, and the fiber optic sensor 6222 can receive the light signal; after the small gripper 622 picks up the easy-tear label, the easy-tear label is located between the first through hole and the second through hole, and the fiber optic sensor 6222 cannot receive the light signal. The fiber optic sensor 6222 sends a material picking completion signal to the controller, and the controller drives the small gripper 622 to move.

[0063] Additionally, in one embodiment, reference is made to Figures 2 to 5 The first drive assembly 61 includes a first servo motor 611, a first harmonic reducer 612, a second servo motor 613, and a second harmonic reducer 614. The first servo motor 611 is mounted on the front side of the Z-axis linear motor 50. The first harmonic reducer 612 is connected below the first servo motor 611. The first harmonic reducer 612 is connected to the second harmonic reducer 614 via a mounting plate. The second servo motor 613 is connected to the side of the second harmonic reducer 614 away from the adsorption platform 10. The gripper assembly 62 is connected to the side of the second harmonic reducer 614 closer to the adsorption platform 10. A pressure sensor 615 is provided between the second harmonic reducer 614 and the gripper assembly 62. The first servo motor 611, the second servo motor 613, and the pressure sensor 615 are respectively communicatively connected to the controller.

[0064] It should be noted that the first servo motor 611 and the first harmonic reducer 612 work together to realize the rotation of the gripper assembly 62 on the horizontal plane; the second servo motor 613 and the second harmonic reducer 614 work together to realize the rotation of the gripper assembly 62 on the vertical plane, wherein the vertical plane is parallel to the first X-axis linear motor 20.

[0065] It should be noted that the pressure sensor 615 is located between the second harmonic reducer 614 and the gripper assembly 62. During the film tearing process, the gripper assembly 62 is rotated by the first drive assembly 61. The pressure sensor 615 is subjected to the pressure between the second harmonic reducer 614 and the gripper assembly 62, and feeds back the real-time pressure value to the controller. The real-time pressure value is the magnitude of the film tearing force on the gripper assembly 62. When the gripper assembly 62 is in the preset trajectory and the real-time pressure value is zero, it means that the film has broken during the film tearing process and the film tearing has failed. At this time, the controller controls the first X-axis linear motor 20, the second X-axis linear motor 30, the Y-axis linear motor 40, the Z-axis linear motor 50 and the film tearing assembly 60 to stop running and issues an alarm to remind the staff.

[0066] Additionally, in one embodiment, reference is made to Figure 2The adsorption platform 10 has pressure plate assemblies on both sides. The pressure plate assembly includes a pressure plate 71, a cylinder 72, a third servo motor 73, and a transmission assembly 74. The third servo motor 73 is connected to the pressure plate 71 through the transmission assembly 74. The third servo motor 73 drives the pressure plate 71 to move closer to or away from the adsorption platform 10 through the transmission assembly 74. The cylinder 72 is connected to the pressure plate 71 and is used to drive the pressure plate 71 to move vertically. An ion air bar 80 is provided above the pressure plate assembly. The air outlet of the ion air bar 80 is aligned with the adsorption platform 10. The cylinder 72, the third servo motor 73, and the ion air bar 80 are all communicatively connected to the controller.

[0067] It should be noted that the transmission assembly 74 includes a coupling and a lead screw. The third servo motor 73 is connected to the coupling, the coupling is connected to the lead screw, and the lead screw is connected to the pressure plate 71. Through the coupling and the lead screw, the rotation of the shaft of the third servo motor 73 is converted into the linear movement of the pressure plate 71 in the horizontal direction.

[0068] It should be noted that when the third servo motor 73 operates, it drives the pressure plate 71 to move above the pressing position of the adsorption platform 10 via a coupling and a lead screw. Then, it controls the cylinder 72 to move the pressure plate 71 horizontally, ensuring it contacts the circuit board. This prevents insufficient suction from the adsorption platform 10, which could cause the circuit board to detach during the film removal process. After the circuit board completes the film removal step, the cylinder 72 drives the pressure plate 71 to rise and move away from the circuit board, while the third servo motor 73 controls the pressure plate 71 to move away from the adsorption platform 10.

[0069] It should be noted that before the gripper assembly 62 applies the easy-tear tape to the circuit board, the ion air bar 80 is activated. The ion air bar 80 blows ion air onto the adsorption platform 10 to remove the static electricity generated during the film removal process.

[0070] In addition, embodiments of the present invention provide a control method for a film-peeling machine for HDI circuit boards, applicable to... Figures 1 to 5 The illustrated embodiment of the film-peeling machine for HDI circuit boards refers to... Figure 6 The method includes, but is not limited to, the following steps:

[0071] S10, after the circuit board is placed on the adsorption platform, the adsorption platform is controlled to work. When the adsorption platform adsorbs the circuit board, the camera is controlled to position the circuit board and generate a positioning result. The positioning result is sent to the controller. Then, the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor and the first drive assembly are controlled to move the gripper assembly to the easy-tear label picking position.

[0072] S20, control the second drive assembly and the finger cylinder to make the small gripper pick up the easy-tear sticker, control the third drive assembly to make the suction head move towards the small gripper, and when the suction head comes into contact with the easy-tear sticker, control the suction head to pick up the easy-tear sticker.

[0073] S30, based on the positioning result, control the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor and the first drive assembly to make the adsorption head press the easy-to-tear adhesive tape on the circuit board;

[0074] S40, control the third drive component and the adsorption head so that after the adsorption head releases the easy-tear sticker, it moves away from the small gripper. Then control the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor and the first drive component to increase the angle between the small gripper and the adsorption platform.

[0075] S50: When the small gripper is perpendicular to the adsorption platform, the first drive component and the second drive component are controlled to make the large gripper close and rotate. When the large gripper rotates to the film-tearing angle, the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor and the first drive component are controlled to make the large gripper move along a preset trajectory. When the large gripper is at the end of the preset trajectory, the camera is controlled to acquire an image of the circuit board. The comparison result between the image of the circuit board and the preset image is sent to the controller. When the comparison result is inconsistent, the controller alarms.

[0076] It should be noted that the technical principle of the film-removing machine used for HDI circuit boards to remove film from HDI circuit boards with highly viscous adhesive tape can be found in [reference needed]. Figures 1 to 5 I will not repeat the details here.

[0077] In another embodiment, step S20 may include, but is not limited to, the following steps:

[0078] S21, control the second drive assembly to open the large gripper;

[0079] S22, controls the finger cylinder to open and close the small gripper;

[0080] S23, when the easy-tear label is located between the first through hole and the second through hole, the fiber optic sensor sends a material picking completion signal to the controller.

[0081] It should be noted that the principle of using fiber optic sensors to determine whether the small gripper has successfully picked up the easy-tear sticker can be referred to the above. Figure 2 The description of the illustrated embodiments will not be repeated here.

[0082] In another embodiment, step S30 may include, but is not limited to, the following steps:

[0083] S31, control the third servo motor to move the pressure plate above the pressing edge position of the adsorption platform;

[0084] S32 controls the cylinder to move the pressure plate downwards until the pressure plate abuts against the circuit board;

[0085] S33 controls the ion fan bar to start, and the ion fan bar outputs ion wind towards the adsorption platform.

[0086] It should be noted that the principles of fixing the circuit board based on the pressure plate assembly and eliminating static electricity generated during the film peeling process using an ion bar can be referred to the above. Figure 2 The description of the illustrated embodiments will not be repeated here.

[0087] In another embodiment, the external clock rising edge acquisition unit is connected to the internal clock counter. After step S40 is completed, the following steps are included, but not limited to:

[0088] S41, control the pressure sensor to start, and send the real-time pressure value to the controller;

[0089] S42 controls the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor, the first servo motor, and the second servo motor to make the large gripper move along a preset trajectory. When the large gripper is on the preset trajectory and the real-time pressure value is zero, the pressure sensor is controlled to send an alarm signal to the controller.

[0090] It should be noted that the principle of monitoring the film-tearing process by the gripper using a pressure sensor can be referred to the above. Figures 2 to 5 The description of the illustrated embodiments will not be repeated here.

[0091] like Figure 7 As shown, Figure 7 This is a structural diagram of a control device for a film-removing machine for HDI circuit boards according to an embodiment of the present invention. The present invention also provides a control device for a film-removing machine for HDI circuit boards, comprising:

[0092] The processor 501 can be implemented using a general-purpose central processing unit (CPU), microprocessor, application specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this application.

[0093] The memory 502 can be implemented as a read-only memory (ROM), static storage device, dynamic storage device, or random access memory (RAM). The memory 502 can store the operating system and other application programs. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program code is stored in the memory 502 and is called and executed by the processor 501 to execute the control method for the film-peeling machine for HDI circuit boards according to the embodiments of this application.

[0094] The input / output interface 503 is used to implement information input and output;

[0095] The communication interface 504 is used to enable communication and interaction between this device and other devices. Communication can be achieved through wired means (such as USB, network cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.).

[0096] Bus 505 transmits information between various components of the device (e.g., processor 501, memory 502, input / output interface 503, and communication interface 504);

[0097] The processor 501, memory 502, input / output interface 503, and communication interface 504 are connected to each other within the device via bus 505.

[0098] This application embodiment also provides a storage medium, which is a computer-readable storage medium storing a computer program. When the computer program is executed by a processor, it implements the above-described control method for the film peeling machine for HDI circuit boards.

[0099] Memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. Furthermore, memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, memory may optionally include memory remotely located relative to the processor, and these remote memories can be connected to the processor via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof. The device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separate, and may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0100] It will be understood by those skilled in the art that all or some of the steps and systems in the methods disclosed above can be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components can be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, which can include computer storage media (or non-transitory media) and communication media (or transient media). As is known to those skilled in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disc (DVD) or other optical disc storage, magnetic cartridges, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and is accessible to a computer. Furthermore, as is known to those skilled in the art, communication media typically include computer-readable instructions, data structures, program modules, or other data in modulated data signals such as carrier waves or other transmission mechanisms, and may include any information delivery medium.

[0101] The above provides a detailed description of the preferred embodiments of the present invention. However, the present invention is not limited to the above embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention. All such equivalent modifications or substitutions are included within the scope defined by the claims of the present invention.

Claims

1. A film-peeling machine for HDI circuit boards, characterized in that, include: An adsorption platform is provided with an easy-tear adhesive picking position. The adsorption platform is used to place circuit boards. The surface of the circuit boards is covered with a thin film, and the surface of the thin film is attached with adhesive tape. A first X-axis linear motor, a second X-axis linear motor, and a Y-axis linear motor are provided on the outside of the adsorption platform. The Y-axis linear motor can slide on the first X-axis linear motor and the second X-axis linear motor. Two Z-axis linear motors are provided on one side of the Y-axis linear motor. Two film-tearing assemblies are mounted on the front side of the Z-axis linear motor. The Z-axis linear motor drives the film-tearing assembly to slide vertically. Each film-tearing assembly includes a gripper assembly and a first drive assembly. The first drive assembly is connected to the gripper assembly and is used to drive the gripper assembly to rotate. The gripper assembly includes a small gripper, a large gripper, an adsorption pressure head, and a camera. The small gripper is located inside the large gripper and is connected to a finger cylinder. The large gripper is connected to a second drive assembly. The adsorption pressure head is connected to a third drive assembly and is used to drive the adsorption pressure head to move closer to or away from the small gripper. The camera is fixed to one side of the film-tearing assembly, and the camera's shooting direction is aligned with the adsorption platform. The controller is communicatively connected to the adsorption platform, the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor, and the film-tearing assembly.

2. The film-peeling machine for HDI circuit boards according to claim 1, characterized in that, The upper gripping part of the small gripper is provided with a first through hole, and the lower gripping part of the small gripper is provided with a second through hole. The first through hole and the second through hole are interconnected. An optical fiber sensor is provided above the first through hole, and the optical fiber sensor is communicatively connected to the controller.

3. The film-peeling machine for HDI circuit boards according to claim 1, characterized in that, The first drive assembly includes a first servo motor, a first harmonic reducer, a second servo motor, and a second harmonic reducer. The first servo motor is mounted on the front side of the Z-axis linear motor. The first harmonic reducer is connected below the first servo motor. The first harmonic reducer is connected to the second harmonic reducer via a mounting plate. The second servo motor is connected to the side of the second harmonic reducer away from the adsorption platform. The gripper assembly is connected to the side of the second harmonic reducer closer to the adsorption platform. A pressure sensor is provided between the second harmonic reducer and the gripper assembly. The first servo motor, the second servo motor, and the pressure sensor are all communicatively connected to the controller.

4. The film-peeling machine for HDI circuit boards according to claim 1, characterized in that, The adsorption platform has pressure plate assemblies on both opposite sides. Each pressure plate assembly includes a pressure plate, a cylinder, a third servo motor, and a transmission assembly. The third servo motor is connected to the pressure plate via the transmission assembly and drives the pressure plate to move closer to or away from the adsorption platform. The cylinder is connected to the pressure plate and drives the pressure plate to move vertically. An ion bar is positioned above the pressure plate assembly, with its outlet aligned with the adsorption platform. The cylinder, the third servo motor, and the ion bar are all communicatively connected to the controller.

5. A control method for a film-peeling machine for HDI circuit boards, characterized in that, A controller for a film-peeling machine for HDI circuit boards according to any one of claims 1 to 4, the method comprising: After the circuit board is placed on the adsorption platform, the adsorption platform is controlled to work. When the adsorption platform adsorbs the circuit board, the camera is controlled to position the circuit board and generate a positioning result. The positioning result is sent to the controller. Then, the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor and the first drive assembly are controlled to move the gripper assembly to the easy-tear adhesive picking position. The second drive assembly and the finger cylinder are controlled to make the small gripper pick up the easy-tear sticker, and the third drive assembly is controlled to make the adsorption head move towards the small gripper. When the adsorption head comes into contact with the easy-tear sticker, the adsorption head is controlled to adsorb the easy-tear sticker. Based on the positioning result, the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor, and the first drive assembly are controlled to make the adsorption head press the easy-tear adhesive tape attached to the circuit board; The third drive assembly and the adsorption head are controlled to make the adsorption head release the easy-tear sticker and move away from the small gripper. Then, the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor and the first drive assembly are controlled to increase the angle between the small gripper and the adsorption platform. When the small gripper is perpendicular to the adsorption platform, the first drive assembly and the second drive assembly are controlled to make the large gripper close and rotate. When the large gripper rotates to the film-tearing angle, the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor, and the first drive assembly are controlled to make the large gripper move along a preset trajectory. When the large gripper is at the end of the preset trajectory, the camera is controlled to acquire an image of the circuit board. The comparison result of the image of the circuit board and the preset image is sent to the controller. When the comparison result is inconsistent, the controller alarms.

6. The control method for a film-peeling machine for HDI circuit boards according to claim 5, characterized in that, The upper clamping part of the small gripper is provided with a first through hole, and the lower clamping part of the small gripper is provided with a second through hole. The first through hole and the second through hole are interconnected. An optical fiber sensor is provided above the first through hole, and the optical fiber sensor is communicatively connected to the controller. Controlling the second drive assembly and finger cylinder to cause the small gripper to pick up the easy-tear sticker includes: Control the second drive component to open the large gripper; Control the finger cylinder to cause the small gripper to open and then close; When the easy-tear adhesive is located between the first through hole and the second through hole, the fiber optic sensor sends a material picking completion signal to the controller.

7. The control method for a film-peeling machine for HDI circuit boards according to claim 5, characterized in that, The adsorption platform is equipped with pressure plate assemblies on both opposite sides. Each pressure plate assembly includes a pressure plate, a cylinder, a third servo motor, and a transmission assembly. The third servo motor is connected to the pressure plate through the transmission assembly and drives the pressure plate to move closer to or away from the adsorption platform. The cylinder is connected to the pressure plate and drives the pressure plate to move vertically. An ion air bar is provided above the pressure plate assembly, and the air outlet of the ion air bar is aligned with the adsorption platform. The cylinder, the third servo motor, and the ion air bar are all communicatively connected to the controller. Before controlling the first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor, and the first drive assembly based on the positioning result to press the suction head firmly against the easy-tear adhesive tape attached to the circuit board, the method further includes: The third servo motor is controlled to move the pressure plate above the pressing edge position of the adsorption platform; Control the cylinder to move the pressure plate downwards until the pressure plate abuts against the circuit board; The ion bar is activated, and it outputs ion wind towards the adsorption platform.

8. The control method for a film-peeling machine for HDI circuit boards according to claim 5, characterized in that, The first drive assembly includes a first servo motor, a first harmonic reducer, a second servo motor, and a second harmonic reducer. The first servo motor is mounted on the front side of the Z-axis linear motor. The first harmonic reducer is connected below the first servo motor. The first harmonic reducer is connected to the second harmonic reducer via a mounting plate. The second servo motor is connected to the side of the second harmonic reducer away from the adsorption platform. The gripper assembly is connected to the side of the second harmonic reducer closer to the adsorption platform. A pressure sensor is provided between the second harmonic reducer and the gripper assembly. The first servo motor, the second servo motor, and the pressure sensor are respectively communicatively connected to the controller. After controlling the third drive assembly and the suction head to release the easy-tear adhesive and moving it away from the small gripper, the process further includes: The pressure sensor is activated to send real-time pressure values ​​to the controller. The first X-axis linear motor, the second X-axis linear motor, the Y-axis linear motor, the Z-axis linear motor, the first servo motor, and the second servo motor are controlled to move the large gripper along the preset trajectory. When the large gripper is located on the preset trajectory and the real-time pressure value is zero, the pressure sensor is controlled to send an alarm signal to the controller.

9. A control device for a film-peeling machine for HDI circuit boards, characterized in that, It includes at least one control processor and a memory for communicatively connecting to the at least one control processor; the memory stores instructions executable by the at least one control processor to enable the at least one control processor to perform the control method for a film peeling machine for HDI circuit boards as described in any one of claims 5 to 8.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions for causing a computer to perform the control method for a film-peeling machine for HDI circuit boards as described in any one of claims 5 to 8.

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