Temperature control coupling tool of optical assembly

Abstract

The invention provides a temperature control coupling tool for an optical assembly, and the tool comprises a pedestal, a sliding rail disposed on the pedestal, at least one sliding table assembly in sliding connection with the sliding rail, a fixed pedestal disposed on the at least one sliding table assembly, a spring seat, a movable pressing block, and a first limiting part, a heat transfer sheet, a supporting part, and a heat dissipation part which are disposed on the fixed pedestal. The sliding rail and the at least one sliding table assembly are used for adjusting the position of the optical assembly, the first limiting piece limits the optical assembly, and the heat transfer piece makes contact with a circuit board provided with the optical assembly. A mounting groove is formed in the supporting piece, the spring seat moves in the mounting groove, the dynamic pressing block is elastically connected with the spring seat, the dynamic pressing block extrudes and fixes the optical assembly through spring force, the heat dissipation piece makes contact with the heat transfer piece through the heat dissipation pieces, air holes are formed in the heat dissipation piece, and air is introduced into the air holes so that heat can be dissipated through the air. According to the invention, external temperature control heat dissipation is carried out on the optical assembly through the temperature control coupling platform, and the coupling reject ratio of the optical assembly is reduced.

Description

Technical Field

[0001] The present disclosure relates to the technical field of optical module packaging, and in particular to a temperature control coupling tool for an optical component. Background Art

[0002] With the development of new services and application models such as cloud computing, mobile Internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules, as one of the key components in optical communication equipment, can realize the conversion of optical and electrical signals. In the development of optical communication technology, the data transmission rate of optical modules is required to be continuously improved.

[0003] An optical module generally includes a circuit board, an optical transmitter component and / or an optical receiver component. The optical transmitter component and / or the optical receiver component are generally installed on the circuit board. The laser of the optical transmitter component generates heat when working. Since there is no temperature control device on the circuit board, the heat generated by the laser causes the internal temperature of the optical module to rise, which can easily affect the coupling yield of the optical device due to excessive temperature. Traditional methods often use aluminum and copper tooling to directly contact the optical device for heat dissipation.

[0004] However, the heat dissipation method of using aluminum and copper tooling to contact optical devices is mostly passive heat dissipation, which is accompanied by problems such as long heat dissipation time and poor heat dissipation effect, making it impossible to obtain the most effective solution to the heat dissipation of optical components. Summary of the invention

[0005] The disclosed embodiment provides a temperature-controlled coupling tool for an optical component to solve the problem of poor coupling of the optical component caused by excessively high temperature of the optical module.

[0006] In a first aspect, the present disclosure provides a temperature control coupling tool for an optical component, comprising:

[0007] Base;

[0008] A slide rail, mounted on the base;

[0009] At least one slide assembly is slidably connected to the slide rail, and the at least one slide assembly is used to adjust the position of the optical assembly;

[0010] A fixed base, mounted on the at least one slide assembly, wherein a mounting hole is formed in the fixed base;

[0011] A first limiting member is installed on the fixed base, and the first limiting member is used to limit the optical component in the Y-axis direction;

[0012] A heat transfer sheet is mounted on the fixed base, the heat transfer sheet covers the mounting hole, and the heat transfer sheet is in contact with the circuit board on which the optical component is mounted;

[0013] A support member is installed on the fixed base, and a mounting groove is formed on the support member;

[0014] A spring seat is located in the mounting groove, and the spring seat can move in the mounting groove;

[0015] A dynamic pressure block is elastically connected to the spring seat, and is used to press the optical component to fix the optical component;

[0016] A heat sink is mounted on the fixed base, the heat sink is in contact with the heat transfer plate via a heat sink, an air hole is formed in the heat sink, one end of the air hole is connected to an air inlet pipe, and the air inlet pipe is inserted into the mounting hole; the other end of the air hole is connected to an exhaust pipe to dissipate heat from the heat sink through gas.

[0017] In a second aspect, the present disclosure provides a temperature control coupling tool for an optical component, comprising:

[0018] Base;

[0019] A slide rail, mounted on the base;

[0020] At least one slide assembly, slidably connected to the slide rail;

[0021] A fixed base, mounted on the at least one slide assembly, wherein a mounting hole is formed on the fixed base;

[0022] A first limiting member is installed on the fixed base;

[0023] A heat transfer sheet is installed on the fixed base, and the heat transfer sheet covers the installation hole;

[0024] A support member is installed on the fixed base, and a mounting groove is formed on the support member;

[0025] A spring seat, located in the mounting groove;

[0026] A dynamic pressure block, elastically connected to the spring seat via a spring;

[0027] a heat sink mounted on the fixed base, the heat sink being in contact with the heat transfer sheet via a heat sink, an air hole being formed in the heat sink, one end of the air hole being connected to an air inlet pipe, the air inlet pipe being inserted into the mounting hole, and the other end of the air hole being connected to an exhaust pipe;

[0028] Among them, a circuit board with an optical component installed is installed on the heat transfer sheet, and the spring seat provides pressure to the dynamic pressure block through the spring, so as to fix the optical component through the dynamic pressure block and the first limit member, and the at least one slide assembly drives the fixed base to adjust the position in different directions to adjust the position of the optical component and realize the coupling of the optical component; the heat generated by the optical component is conducted to the heat transfer sheet, and the heat transfer sheet conducts the heat to the heat sink through the heat sink to dissipate the heat of the optical component.

[0029] As can be seen from the above embodiments, the temperature control coupling tooling of the optical component provided in the embodiments of the present disclosure includes a base, a slide rail, at least one slide assembly, a fixed base, a first limiter, a heat transfer sheet, a support, a spring seat, a dynamic pressure block and a heat sink. The slide rail is installed on the base, at least one slide assembly is slidably connected to the slide rail, the fixed base is installed on at least one slide assembly, and the circuit board with the optical component installed is located on the fixed base, so that the position of the fixed base can be adjusted in different directions through the slide rail and at least one slide assembly, so as to move the optical component to a preset position and improve the optical coupling efficiency; a mounting hole is formed in the fixed base, the first limiter is installed on the fixed base, and the first limiter is used to limit the optical component in the Y-axis direction to facilitate the fixation of the optical component, the heat transfer sheet is installed on the fixed base, the heat transfer sheet covers the mounting hole, and the heat transfer sheet and the circuit board are connected. The boards are in contact with each other, and the heat generated by the operation of the optical component is conducted to the heat transfer sheet via the circuit board; the support member is installed on the fixed base, and an installation groove is formed on the support member, the spring seat is located in the installation groove, the dynamic pressure block is elastically connected to the spring seat, and the spring seat can move in the installation groove to drive the dynamic pressure block to move, so that the dynamic pressure block squeezes the optical component to achieve the fixation of the optical component; the heat sink is installed on the fixed base, the heat sink is in contact with the heat transfer sheet through the heat sink, and the heat transfer sheet conducts the heat to the heat sink via the heat sink, and an air hole is formed in the heat sink, one end of the air hole is connected to the air inlet pipe, the air inlet pipe is inserted into the installation hole, and the other end of the air hole is connected to the exhaust pipe to dissipate the heat to the heat sink through the gas. Since the temperature of the heat sink is relatively low, the heat of the heat transfer sheet will be conducted to the heat sink, and the heat of the circuit board will be conducted to the heat transfer sheet, so that the heat dissipation of the optical component can be achieved.

[0030] The present invention realizes position adjustment functions in different directions through slide rails and at least one slide assembly, can realize automatic coupling of optical components, and uses compressed air to discharge the heat conducted from the optical components to the heat sink, and has the characteristics of continuous heat dissipation and strong real-time performance. In this way, the optical components are externally temperature-controlled and heat-dissipated through the temperature control coupling tooling of the optical components, which can solve the problem of poor coupling of optical components caused by excessive temperature of the circuit board due to the heat generated by the optical components during operation, thereby improving the production yield of optical modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary operators in the field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not intended to limit the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0032] Figure 1 A structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0033] Figure 2 An exploded view of an optical module provided according to some embodiments of the present disclosure;

[0034] Figure 3 A structural diagram of a temperature-controlled coupling tool for an optical component provided according to some embodiments of the present disclosure;

[0035] Figure 4 A structural diagram of a slide mechanism in a temperature-controlled coupling tooling of an optical component provided according to some embodiments of the present disclosure;

[0036] Figure 5 A structural diagram of a first slide assembly in a temperature-controlled coupling tooling of an optical assembly provided according to some embodiments of the present disclosure;

[0037] Figure 6 A partial exploded view of a first slide assembly in a temperature-controlled coupling tooling of an optical assembly provided according to some embodiments of the present disclosure;

[0038] Figure 7 A structural diagram of a second slide assembly in a temperature-controlled coupling tooling of an optical assembly provided according to some embodiments of the present disclosure;

[0039] Figure 8 A partial exploded view of a second slide assembly in a temperature-controlled coupling tooling of an optical assembly provided according to some embodiments of the present disclosure;

[0040] Fig. 9 A structural diagram of a third slide assembly in a temperature-controlled coupling tooling of an optical assembly provided according to some embodiments of the present disclosure;

[0041] Fig.10 A partial exploded view of a third slide assembly in a temperature-controlled coupling tooling of an optical assembly provided according to some embodiments of the present disclosure;

[0042] Fig.11 A structural diagram of a connector in a temperature-controlled coupling tooling of an optical component provided according to some embodiments of the present disclosure;

[0043] Fig.12 A structural diagram of a stage mechanism in a temperature-controlled coupling tooling of an optical component provided according to some embodiments of the present disclosure;

[0044] Fig.13 Another angle structural diagram of a stage mechanism in a temperature-controlled coupling tooling of an optical component provided according to some embodiments of the present disclosure;

[0045] Fig.14 A structural diagram of a fixed base in a temperature-controlled coupling tooling of an optical component provided according to some embodiments of the present disclosure;

[0046] Fig.15 Another angle structural diagram of a fixed base in a temperature-controlled coupling tooling of an optical component provided according to some embodiments of the present disclosure;

[0047] Fig.16 A structural diagram of a first position-limiting member in a temperature-controlled coupling tooling of an optical component provided according to some embodiments of the present disclosure;

[0048] Fig.17 A structural diagram of a second position-limiting member in a temperature-controlled coupling tooling of an optical component provided according to some embodiments of the present disclosure;

[0049] Fig.18 A structural diagram of a heat-insulating sheet in a temperature-controlled coupling tooling of an optical component provided according to some embodiments of the present disclosure;

[0050] Fig.19 A structural diagram of a dynamic pressure block mechanism in a temperature-controlled coupling tooling of an optical component provided according to some embodiments of the present disclosure;

[0051] Fig. 20 A partial exploded view of a dynamic pressure block mechanism in a temperature-controlled coupling tooling of an optical component provided according to some embodiments of the present disclosure;

[0052] Fig.21 An assembly diagram of a stage mechanism and a dynamic pressure block mechanism in a temperature-controlled coupling tooling of an optical component provided according to some embodiments of the present disclosure;

[0053] Fig. 22 A structural diagram of a pigtail fixing mechanism in a temperature-controlled coupling tooling of an optical component provided according to some embodiments of the present disclosure;

[0054] Fig.23 A structural diagram of a heat dissipation mechanism in a temperature-controlled coupling tooling of an optical component provided according to some embodiments of the present disclosure;

[0055] Fig.24 A partial exploded view of a heat dissipation mechanism in a temperature-controlled coupling tooling of an optical component provided according to some embodiments of the present disclosure;

[0056] Fig.25 An assembly diagram of a stage mechanism and a heat dissipation mechanism in a temperature-controlled coupling tooling of an optical component provided according to some embodiments of the present disclosure;

[0057] Fig.26 It is an assembly cross-sectional view of a stage mechanism and a heat dissipation mechanism in a temperature-controlled coupling tooling of an optical component provided according to some embodiments of the present disclosure;

[0058] Fig. 27 The present invention is a structural diagram of a silencer mechanism in a temperature-controlled coupling tooling of an optical component provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0059] The following will be combined with the accompanying drawings to clearly and in detail describe the technical solutions in some embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary operators in the field are within the scope of protection of the present disclosure.

[0060] In optical communication technology, in order to establish information transmission between information processing devices, it is necessary to load information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When optical signals are transmitted in information transmission equipment, the loss of optical power can be reduced, so high-speed, long-distance, and low-cost information transmission can be achieved. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment usually includes optical network terminals (Optical Network Unit, ONU), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment usually includes optical fibers and optical waveguides.

[0061] The optical module can realize the mutual conversion between optical signals and electrical signals between information processing equipment and information transmission equipment. For example, at least one of the optical signal input end or the optical signal output end of the optical module is connected to an optical fiber, and at least one of the electrical signal input end or the electrical signal output end of the optical module is connected to an optical network terminal; the first optical signal from the optical fiber is transmitted to the optical module, and the optical module converts the first optical signal into a first electrical signal, and transmits the first electrical signal to the optical network terminal; the second electrical signal from the optical network terminal is transmitted to the optical module, and the optical module converts the second electrical signal into a second optical signal, and transmits the second optical signal to the optical fiber. Since multiple information processing devices can transmit information through electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, and all information processing devices do not need to be directly connected to the optical module. Here, the information processing device directly connected to the optical module is called the upper computer of the optical module. In addition, the optical signal input end or the optical signal output end of the optical module can be called an optical port, and the electrical signal input end or the electrical signal output end of the optical module can be called an electrical port.

[0062] Figure 1 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, Figure 2 FIG. 1 is an exploded view of an optical module provided according to some embodiments of the present disclosure. Figure 1 and Figure 2 As shown, the optical module includes a shell, a circuit board 300 disposed in the shell, an optical emitting component 400, an optical receiving component 500 and a pigtail. However, the present disclosure is not limited thereto. In some embodiments, the optical module includes one of the optical emitting component 400 and the optical receiving component 500.

[0063] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square body.

[0064] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0065] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0066] The direction of the connection line of the two openings 204 and 205 may be consistent with the length direction of the optical module, or may be inconsistent with the length direction of the optical module. For example, the opening 204 is located at the end of the optical module ( Figure 1 The opening 205 is also located at the end of the optical module ( Figure 1 Alternatively, the opening 204 is located at the end of the optical module, and the opening 205 is located at the side of the optical module. The opening 204 is an electrical port, and the gold finger of the circuit board 300 extends from the electrical port and is inserted into the electrical connector of the host computer 100; the opening 205 is an optical port, which is configured to access an external optical fiber so that the optical fiber connects the optical emitting component 400 and the optical receiving component 500 in the optical module.

[0067] In some embodiments, the optical module further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module and the host computer 100, or to release the fixed connection between the optical module and the host computer 100.

[0068] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, transistors, metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET). The chip may include a microcontroller unit (Microcontroller Unit, MCU), a laser driver chip, a transimpedance amplifier (Transimpedance Amplifier, TIA), a limiting amplifier (Limiting Amplifier, LA), a clock and data recovery chip (Clock and Data Recovery, CDR), a power management chip, and a digital signal processing (Digital Signal Processing, DSP) chip.

[0069] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage of the host computer.

[0070] The circuit board 300 also includes a gold finger formed on the end surface thereof, and the gold finger is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage, and the gold finger is connected to the electrical connector in the cage. The gold finger can be provided on the surface of only one side of the circuit board 300 (for example, Figure 2The upper surface shown in the figure) can also be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, so as to adapt to occasions where the number of pins is large. The gold finger is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0071] In some embodiments, the light emitting component 400 and the light receiving component 500 may be directly disposed on the circuit board 300. For example, the light emitting component 400 and the light receiving component 500 may be disposed on the surface of the circuit board 300 or on the side of the circuit board 300.

[0072] The optical emitting component 400 generally includes optical components such as a laser and a lens. The laser can be connected to the circuit board 300 by wiring to drive the laser to generate a laser beam. The laser needs to be optically coupled with the lens, and the lens is optically coupled with the pigtail. In this way, the laser beam is coupled to the pigtail via the lens to realize light emission.

[0073] However, a large amount of heat is generated when the laser is working, and the heat will be conducted to the circuit board 300. Since there are no temperature control components on the circuit board 300, the temperature of the circuit board 300 will rise. When the optical components such as the laser, lens, and pigtail on the circuit board 300 are coupled, the temperature of the circuit board 300 is too high, which may cause the optical components to deform, affecting the coupling yield of the optical components, increasing the return rate during the production of the optical module, affecting the pass rate, and causing a waste of manpower costs. At the same time, there will also be problems such as the product quality cannot be effectively guaranteed.

[0074] In response to the above problems, an embodiment of the present disclosure provides a temperature control coupling tool for an optical component, which adopts an external active temperature control technical method to solve the problem of poor coupling of optical components caused by excessive temperature of the circuit board due to the heat generated by the operation of the optical component, so as to improve the production yield of the optical module.

[0075] Figure 3 FIG. 1 is a structural diagram of a temperature control coupling tool for an optical component provided according to some embodiments of the present disclosure. Figure 3As shown, the temperature control coupling tooling of the optical component provided by the embodiment of the present disclosure includes a base 10, a slide mechanism 20, a carrier mechanism 30, a dynamic pressure block mechanism 50 and a heat dissipation mechanism 40. The slide mechanism 20 is installed on the base 10. The slide mechanism 20 can be adjusted in the Y-axis direction, the X-axis direction, the TY rotation and the TZ rotation. The carrier mechanism 30 is installed on the slide mechanism 20. The slide mechanism 20 drives the carrier mechanism 30 to adjust the position in different directions; the dynamic pressure block mechanism 50 is fixedly connected to the carrier mechanism 30, and the dynamic pressure block mechanism 50 cooperates with the carrier mechanism 30 to fix the light emitting component 400. After the light emitting component 400 is fixed, the position of the light emitting component 400 is adjusted by the slide mechanism 20 to facilitate the optical coupling of the light emitting component 400 and the pigtail; the heat dissipation mechanism 40 is fixedly connected to the carrier mechanism 30, and the heat dissipation mechanism 40 is located below the circuit board 300, so that the heat dissipation mechanism 40 is used to dissipate the heat of the circuit board 300. In this way, the heat generated by the light emitting component 400 is transferred to the circuit board 300, and the heat dissipation mechanism 40 dissipates the heat of the circuit board 300, thereby avoiding the problem of poor coupling of optical components caused by the excessive temperature of the circuit board 300.

[0076] Figure 4 FIG. 1 is a structural diagram of a slide mechanism in a temperature-controlled coupling tooling of an optical component according to some embodiments of the present disclosure. Figure 4 As shown, the slide mechanism 20 includes a slide rail 21 and at least one slide assembly. The slide rail 21 is installed on the base 10. The slide rail 21 can be set along the Y-axis direction. At least one slide assembly is slidably connected to the slide rail 21, so that at least one slide assembly moves back and forth along the Y-axis direction with the slide rail 21 to adjust the position of at least one slide assembly in the Y-axis direction.

[0077] In order to drive the slide assembly to move back and forth along the Y-axis direction along the slide rail 21, the slide mechanism 20 also includes a drag chain 28, one end of the drag chain 28 is fixedly connected to the slide assembly, and the other end of the drag chain 28 is fixedly connected to the base 10. The movement of the drag chain 28 drives the slide assembly to move back and forth on the slide rail 21.

[0078] In some embodiments, the slide rail 21 may also be arranged along the X-axis direction, and at least one slide assembly moves back and forth along the X-axis direction with the slide rail 21 to adjust the position of at least one slide assembly in the X-axis direction.

[0079] In some embodiments, a positioning pin 11 is provided on the base 10, and the positioning pin 11 is embedded in the base 10, and the positioning pin 11 and the base 10 are interference fit to achieve the positioning of the slide rail 21. The slide rail 21 is an electric slide rail, which can automatically drive at least one slide assembly to move along the slide rail 21, and can achieve the coupling requirement in the Y-axis direction when the light emitting component 400 is coupled.

[0080] At least one slide assembly includes a first slide assembly 24, a second slide assembly 26 and a third slide assembly 27. The first slide assembly 24 is installed on the slide rail 21. The first slide assembly 24 can be slidably connected to the slide rail 21 so that the slide rail 21 drives the first slide assembly 24 to move back and forth along the Y-axis direction.

[0081] In some embodiments, the first slide assembly 24 is an electric X-slide assembly, which can realize electric movement in the X-axis direction and can realize the coupling requirements in the X-axis direction when the light emitting component 400 is coupled.

[0082] Figure 5 is a structural diagram of a first slide assembly in a temperature-controlled coupling tooling of an optical assembly provided according to some embodiments of the present disclosure, Figure 6 FIG. 1 is a partial exploded view of a first slide assembly in a temperature-controlled coupling tooling of an optical assembly according to some embodiments of the present disclosure. Figure 5 and Figure 6 As shown, the first slide assembly 24 includes a slider 240, a support block 241 and a drive motor 242. A groove 2411 is formed in the support block 241. A lead screw 2412 is arranged in the groove 2411. The lead screw 2412 is connected to the output shaft of the drive motor 242. The drive motor 242 drives the lead screw 2412 to rotate.

[0083] The slider 240 is covered on the support block 241. A rotating block 2401 is provided on the side of the slider 240 facing the support block 241. The lead screw 2412 is inserted into the rotating block 2401, and the lead screw 2412 is threadedly connected to the rotating block 2401. When the lead screw 2412 rotates, the rotating block 2401 can move back and forth on the lead screw 2412.

[0084] A guide column 2410 is provided on the support block 241, and a guide groove 2402 is provided on the slider 240. The guide column 2410 is slidably connected to the guide groove 2402. When the lead screw 2412 rotates, the slider 240 slides back and forth along the guide column 2410 to move in the X-axis direction.

[0085] When the driving motor 242 is working, the driving motor 242 drives the lead screw 2412 to rotate. When the lead screw 2412 rotates, it drives the slider 240 to slide along the guide column 2410, so that the slider 240 slides back and forth along the X-axis direction, which can realize the electric movement of the slider 240 in the X-axis direction, and can realize the coupling requirements in the X-axis direction when the light emitting component 400 is coupled.

[0086] In some embodiments, the first slide assembly 24 can also be a Y-axis slide assembly. When the drive motor is working, the drive motor drives the screw to rotate. When the screw rotates, it drives the slider to slide along the guide column, so that the slider slides back and forth along the Y-axis direction, thereby realizing the electric movement of the slider in the Y-axis direction.

[0087] The second slide assembly 26 is mounted on the first slide assembly 24 , and the second slide assembly 26 moves along the X-axis direction along with the first slide assembly 24 to adjust the position of the second slide assembly 26 in the X-axis direction.

[0088] In some embodiments, the second slide assembly 26 is a TY slide assembly, which is mainly used for adjustment in the TY direction, that is, swing adjustment around the Y-axis direction, and can achieve the coupling requirements in the TY direction when the optical emitting component 400 is coupled with the pigtail.

[0089] Figure 7 is a structural diagram of a second slide assembly in a temperature-controlled coupling tooling of an optical assembly provided according to some embodiments of the present disclosure, Figure 8 FIG. 1 is a partial exploded view of a second slide assembly in a temperature-controlled coupling tooling of an optical assembly according to some embodiments of the present disclosure. Figure 7 and Figure 8 As shown, the second slide assembly 26 includes a support plate 261 and a swing block 260, a boss 2611 is formed on the support plate 261, the width of the boss 2611 is smaller than the width of the support plate 261, and the top surface of the support plate 261 is an arc-shaped surface; the swing block 260 is covered on the support plate 261, the bottom surface 2601 of the swing block 260 is an arc-shaped surface, a recess 2602 is formed on the bottom surface of the swing block 260, and the boss 2611 is embedded in the recess 2602 to realize the connection between the swing block 260 and the support plate 261.

[0090] A knob is provided on the support plate 261 . After the swing block 260 is connected to the support plate 261 , the operator can adjust the position of the swing block 260 through the knob so that the swing block 260 swings around the Y-axis direction to adjust the angle of the swing block 260 .

[0091] In some embodiments, the second slide assembly 26 may also be a TX slide assembly for adjustment in the TX direction, that is, pitch adjustment around the X-axis direction, which can achieve coupling requirements in the YX direction when the optical emitting component 400 is coupled with the pigtail.

[0092] The third slide assembly 27 is installed on the second slide assembly 26. The third slide assembly 27 swings back and forth around the Y-axis direction along with the second slide assembly 26, and the third slide assembly 27 is used for adjustment in the TZ direction.

[0093] In some embodiments, the third slide assembly 27 is a TZ slide assembly, which is mainly used for adjustment in the TZ direction, that is, rotation adjustment around the Z axis, and can achieve the coupling requirements in the TZ direction when the optical emitting component 400 is coupled with the pigtail.

[0094] Fig. 9is a structural diagram of a third slide assembly in a temperature-controlled coupling tooling of an optical assembly provided according to some embodiments of the present disclosure, Fig.10 FIG. 1 is a partial exploded view of a third slide assembly in a temperature-controlled coupling tooling of an optical assembly according to some embodiments of the present disclosure. Fig. 9 and Fig.10 As shown, the third slide assembly 27 includes a base plate 270, a rotating ring 271 and a turntable 272. The base plate 270 is installed on the swing block 260. A first protrusion 2701 is provided on the base plate 270. A second protrusion 2720 is provided on the turntable 272. The second protrusion 2720 on the turntable 272 is rotatably connected to the first protrusion 2701 on the base plate 270.

[0095] The bottom surface of the rotating ring 271 is connected to the top surface of the bottom plate 270 , and the top surface of the rotating ring 271 is connected to the turntable 272 . The rotating ring 271 surrounds the turntable 272 , and the turntable 272 can be driven to rotate around the Z axis by applying a rotational force to the rotating ring 271 .

[0096] A connecting block 2710 is provided on the rotating ring 271, and rotating rods 273 are provided on both sides of the connecting block 2710. Applying a rotating force to the rotating rods 273 can drive the rotating ring 271 to rotate. Two sleeves 2703 are provided on the bottom plate 270, and there is a gap 2702 between the two sleeves 2703. The connecting block 2710 is placed in the gap 2702, and the rotating rod 273 is located in the sleeve 2703. The operator grasps the rotating rod 273 to make the connecting block 2710 rotate at a preset angle in the gap 2702. When the connecting block 2710 rotates, it drives the rotating ring 271 to rotate, and the rotating ring 271 drives the turntable 272 to rotate, so that the turntable 272 rotates around the Z axis.

[0097] In some embodiments, angles may be engraved on the turntable 272, and the operator turns the rotating rod 273 to achieve the rotation of the turntable 272 at different angles, so as to achieve the coupling requirement in the TZ direction when the light emitting component 400 is coupled with the pigtail.

[0098] Fig.11 FIG. 1 is a structural diagram of a connector in a temperature-controlled coupling tooling of an optical component according to some embodiments of the present disclosure. Figure 4 and Fig.11 As shown, in order to facilitate the connection between the slide rail 21 and at least one slide assembly, the slide mechanism 20 may also include a first connecting member 22, a second connecting member 23 and a third connecting member 25. The first connecting member 22 is slidably connected to the slide rail 21, and the drag chain 28 can be fixedly connected to the first connecting member 22. The drag chain 28 drives the first connecting member 22 to slide back and forth on the slide rail 21.

[0099] The second connecting member 23 is fixedly mounted on the first connecting member 22, and the supporting block 241 of the first slide assembly 24 is fixedly mounted on the second connecting member 23. The first connecting member 22 drives the second connecting member 23 to move back and forth along the Y-axis direction, and the second connecting member 23 drives the first slide assembly 24 to move back and forth along the Y-axis direction.

[0100] The drag chain 28 may be fixedly connected to the second connecting member 23 , and the drag chain 28 drives the second connecting member 23 and the first connecting member 22 to slide back and forth on the slide rail 21 .

[0101] In some embodiments, the slide mechanism 20 may further include a fourth connecting member 29, one side of the fourth connecting member 29 is fixedly connected to the second connecting member 23, and the other side of the fourth connecting member 29 is fixedly connected to the drag chain 28, so that the second connecting member 23 and the drag chain 28 are fixedly connected through the fourth connecting member 29, so that the drag chain 28 drives the second connecting member 23 and the first connecting member 22 to slide back and forth on the slide rail 21.

[0102] The third connecting member 25 can be arranged between the first slide assembly 24 and the second slide assembly 26. The third connecting member 25 is fixedly installed on the slider 240 of the first slide assembly 24, and the support plate 261 of the second slide assembly 26 is fixedly installed on the third connecting member 25, so as to realize the connection between the first slide assembly 24 and the second slide assembly 26 through the third connecting member 25, so as to avoid the second slide assembly 26 being directly installed on the first slide assembly 24, causing the first slide assembly 24 to move when the second slide assembly 26 swings, thereby affecting the coupling accuracy of the optical emitting component 400 and the pigtail.

[0103] Fig.12 A structural diagram of a stage mechanism in a temperature-controlled coupling tooling of an optical component provided according to some embodiments of the present disclosure; Fig.13 Another angle structural diagram of a stage mechanism in a temperature-controlled coupling tooling of an optical component provided according to some embodiments of the present disclosure. Fig.12 and Fig.13 As shown, the stage mechanism 30 is installed on the third slide assembly 27, and the drag chain 28 drives the second connecting member 23 to slide back and forth along the slide rail 21, and the stage mechanism 30 slides back and forth along the slide rail 21 to achieve the position adjustment of the stage mechanism 30 in the Y-axis direction; the first slide assembly 24 drives the stage mechanism 30 to move back and forth along the X-axis direction to achieve the position adjustment of the stage mechanism 30 in the X-axis direction; the second slide assembly 26 drives the stage mechanism 30 to rotate around the Y-axis direction to achieve the swing adjustment of the stage mechanism 30 in the TY direction; the third slide assembly 27 drives the stage mechanism 30 to rotate around the Z-axis direction to achieve the rotation adjustment of the stage mechanism 30 in the TZ direction.

[0104] The carrier mechanism 30 includes a fixed base 301, a first limiting member 310 and a heat transfer sheet 312. The fixed base 301 is fixedly installed on the turntable 272. The first limiting member 310 is fixedly installed on the fixed base 301. The circuit board 300 is located on the fixed base 301. The first limiting member 310 limits the light emitting component 400. The heat transfer sheet 312 is fixedly installed on the fixed base 301. The heat transfer sheet 312 contacts the bottom surface of the circuit board 300. The light emitting component 400 transfers heat to the circuit board 300. The circuit board 300 transfers heat to the heat transfer sheet 312. The heat dissipation mechanism 40 can be used to dissipate heat from the heat transfer sheet 312 to achieve external heat dissipation and temperature control of the circuit board 300.

[0105] A ventilation groove 313 is formed on the side of the fixed base 301, and a ventilation hole is formed in the ventilation groove 313. The ventilation hole extends to the bottom of the heat transfer plate 312. The ventilation hole is connected to the vacuum air pipe 314. Air is injected into the ventilation hole through the vacuum air pipe 314. The circuit board 300 and the heat transfer plate 312 are vacuum-adsorbed, so that the circuit board 300 and the heat transfer plate 312 maintain close contact, thereby ensuring continuous heat dissipation of the circuit board 300.

[0106] In some embodiments, the carrier mechanism 30 also includes a thermistor, which is inserted into the heat transfer plate 312. The thermistor is used to obtain the real-time temperature of the heat transfer plate 312 to feedback the real-time temperature of the circuit board 300, so as to facilitate the control of the heat dissipation mechanism 40 to perform external heat dissipation and temperature control on the circuit board 300.

[0107] Fig.14 This is a structural diagram of a fixed base in a temperature-controlled coupling tooling of an optical component provided according to some embodiments of the present disclosure. Fig.15 Another angle structural diagram of a fixed base in a temperature-controlled coupling tooling of an optical component provided according to some embodiments of the present disclosure. Fig.14 and Fig.15 As shown, a notch 304 is formed on the fixed base 301 , and the notch 304 extends from the side surface of the fixed base 301 toward the central axis direction of the fixed base 301 , so that an L-shaped notch is formed on the fixed base 301 .

[0108] The fixed base 301 is also formed with a mounting hole 306, a first mounting surface 316 and a second mounting surface 315. The mounting hole 306 passes through the fixed base 301. The upper portion of the mounting hole 306 may be a square hole, and the lower portion of the mounting hole 306 may be a round hole. An opening is formed on one side of the mounting hole 306. The mounting hole 306 is connected to the notch 304 through the opening to facilitate the connection between the heat dissipation mechanism 40 and the fixed base 301.

[0109] The first mounting surface 316 surrounds the mounting hole 306, and the heat transfer sheet 312 is fixedly mounted on the first mounting surface 316 so that the heat transfer sheet 312 covers the mounting hole 306. A portion of the heat dissipation mechanism 40 is inserted into the mounting hole 306 so that the heat dissipation mechanism 40 is close to the heat transfer sheet 312, thereby dissipating heat from the heat transfer sheet 312 through the heat dissipation mechanism 40.

[0110] In some embodiments, the first mounting surface 316 is an L-shaped mounting surface that surrounds the mounting hole 306 , and the heat transfer sheet 312 is fixedly mounted on the L-shaped mounting surface such that the heat transfer sheet 312 covers the mounting hole 306 .

[0111] Fig.16 FIG. 1 is a structural diagram of a first stopper in a temperature control coupling tooling of an optical component provided according to some embodiments of the present disclosure. Fig.12 and Fig.16 As shown, the second mounting surface 315 protrudes from the first mounting surface 316, the second mounting surface 315 is connected to the first mounting surface 316 through the connecting surface, the first limiting member 310 is fixedly mounted on the second mounting surface 315, and the first limiting member 310 is arranged along the Y-axis direction. After the circuit board 300 is placed on the heat transfer sheet 312, the light emitting component 400 is limited in the Y-axis direction by the first limiting member 310 to ensure that the circuit board 300 is installed and fixed.

[0112] The first stopper 310 includes an assembly surface 3102, which is fixedly mounted on the second mounting surface 315, so as to fix the first stopper 310 on the fixed base 301. Since the heat transfer sheet 312 is located below the first stopper 310, in order to prevent the first stopper 310 from affecting the installation of the heat transfer sheet 312, a recess is formed on the assembly surface 3102 of the first stopper 310, and the heat transfer sheet 312 is avoided by the recess.

[0113] The end face of one side of the first limiting member 310 is a limiting surface 3101, which is an inclined surface. After the circuit board 300 is placed on the heat transfer sheet 312, the limiting surface 3101 contacts the tube shell of the light emitting component 400, so that the limiting surface 3101 presses against the tube shell to limit the light emitting component 400 in the Y-axis direction.

[0114] After the light emitting component 400 is limited in the Y-axis direction by the first limiting member 310 , in order to fix the light emitting component 400 , the light emitting component 400 also needs to be limited in the X-axis direction.

[0115] Fig.17 FIG. 1 is a structural diagram of a second stopper in a temperature control coupling tooling of an optical component provided according to some embodiments of the present disclosure. Fig.12 and Fig.17As shown, the stage mechanism 30 also includes a second limiter 309, which is fixedly mounted on the fixed base 301 and is located in the X-axis direction. The second limiter 309 is used to limit the light emitting component 400 in the X-axis direction.

[0116] The second limiting member 309 includes a first limiting plate 3090 and a second limiting plate 3091. The first limiting plate 3090 can be perpendicular to the second limiting plate 3091. The first limiting plate 3090 and the second limiting plate 3091 form an L-shaped limiting member. The second limiting plate 3091 is fixed on the fixed base 301 by screws, so that the first limiting plate 3090 is perpendicular to the top surface of the fixed base 301. The tube shell of the light emitting component 400 is against the first limiting plate 3090 to limit the light emitting component 400 in the X-axis direction.

[0117] An avoidance groove 3092 is formed on the first limiting plate 3090 , and the optical fiber connector connected to the light emitting component 400 is located in the avoidance groove 3092 so that the optical fiber connector is supported by the first limiting plate 3090 .

[0118] In some embodiments, the angle between the first limit plate 3090 and the second limit plate 3091 is not limited to 90°. As long as the difference between the angle between the first limit plate 3090 and the second limit plate 3091 and 90° is within a preset range, the first limit plate 3090 and the second limit plate 3091 can be considered to be perpendicular.

[0119] In some embodiments, the first limiting plate 3090 and the second limiting plate 3091 may not be perpendicular. For example, the first limiting plate 3090 is tilted, and the angle between the first limiting plate 3090 and the second limiting plate 3091 is an acute angle, or the angle between the first limiting plate 3090 and the second limiting plate 3091 is an obtuse angle, as long as the first limiting plate 3090 can limit the light emitting component 400 in the X-axis direction.

[0120] Reference Fig.14 A third mounting surface 302 is also formed on the fixed base 301, and the third mounting surface 302 is recessed in the first mounting surface 316. The second limiting plate 3091 is fixedly installed on the third mounting surface 302, and the first limiting plate 3090 abuts against the connecting surface between the third mounting surface 302 and the first mounting surface 316, so that the second limiting member 309 limits the light emitting component 400 in the X-axis direction.

[0121] In some embodiments, after placing the circuit board 300 on the heat transfer sheet 312, since the heat transfer sheet 312 is in contact with the fixed base 301, after the heat of the circuit board 300 is transferred to the heat transfer sheet 312, the heat of the heat transfer sheet 312 will be transferred to the fixed base 301, and the fixed base 301 may transfer the heat to the circuit board 300 again, which will affect the heat dissipation of the circuit board 300 by the heat dissipation mechanism 40.

[0122] Fig.18 The structure diagram of a heat insulation sheet in a temperature control coupling tooling of an optical component provided according to some embodiments of the present disclosure. Fig.12 and Fig.18 As shown, in order to prevent the heat of the heat transfer sheet 312 from being conducted to the fixed base 301, the carrier mechanism 30 also includes a first thermal insulation sheet 311. The first thermal insulation sheet 311 is fixedly mounted on the first mounting surface 316, and the heat transfer sheet 312 is fixedly mounted on the first thermal insulation sheet 311. The first thermal insulation sheet 311 mainly plays a thermal insulation role, so that the fixed base 301 and the heat transfer sheet 312 are separated by the first thermal insulation sheet 311 to prevent heat from being conducted between the fixed base 301 and the heat transfer sheet 312.

[0123] In some embodiments, the first thermal insulation sheet 311 is an L-shaped thermal insulation sheet, which is installed on the L-shaped installation surface so that the first thermal insulation sheet 311 surrounds the installation hole 306 .

[0124] The circuit board 300 is placed on the heat transfer sheet 312, and the first limiting piece 310 is located on one side of the light emitting component 400. The light emitting component 400 is limited by the first limiting piece 310, but the light emitting component 400 may move to the side away from the first limiting piece 310. Therefore, the dynamic pressure block mechanism 50 is located on the side of the light emitting component 400 away from the first limiting piece 310. The light emitting component 400 is limited by the dynamic pressure block mechanism 50, so that the dynamic pressure block mechanism 50 and the first limiting piece 310 cooperate to clamp and fix the light emitting component 400.

[0125] Fig.19 is a structural diagram of a dynamic pressure block mechanism in a temperature control coupling tooling of an optical component provided according to some embodiments of the present disclosure, Fig. 20 This is a partial exploded view of a dynamic pressure block mechanism in a temperature control coupling tooling of an optical component provided according to some embodiments of the present disclosure. Fig.19 and Fig. 20As shown, the dynamic pressure block mechanism 50 includes a support member 501, a spring seat 505 and a dynamic pressure block 507. The support member 501 is fixedly mounted on the fixed base 301. A mounting groove 503 is formed on the support member 501. The spring seat 505 is located in the mounting groove 503. The dynamic pressure block 507 is elastically connected to the spring seat 505. The spring seat 505 can move back and forth in the mounting groove 503 to provide different dynamic pressures to the dynamic pressure block 507 to drive the dynamic pressure block 507 to move along the Y-axis direction, so that the dynamic pressure block 507 is against the light emitting component 400, and the light emitting component 400 is locked and fixed by the dynamic pressure block 507.

[0126] A fourth mounting surface 303 is formed on the side of the fixed base 301, and the fourth mounting surface 303 is recessed in the side of the fixed base 301; a fifth mounting surface 502 is formed on one side of the support member 501, and the fifth mounting surface 502 is fixedly connected to the fourth mounting surface 303 to fix the support member 501 on the fixed base 301.

[0127] The mounting groove 503 on the support member 501 is a U-shaped groove. An opening is formed on one side of the mounting groove 503 facing the fixed base 301 , and the spring seat 505 is placed in the mounting groove 503 through the opening.

[0128] A third adjustment hole 504 is formed on the support member 501. The third adjustment hole 504 is a long hole, which is arranged along the Y-axis direction. The locking screw passes through the third adjustment hole 504 and is fixedly connected to the spring seat 505. The spring seat 505 can be moved by moving the locking screw. The position of the spring seat 505 can be adjusted by adjusting the position of the locking screw in the third adjustment hole 504, so that the spring seat 505 is fixed at different positions of the mounting groove 503.

[0129] In some embodiments, scale lines are formed on the top surface of the support member 501 , and the scale lines are located on the side walls of the mounting groove 503 , so that the position of the spring seat 505 can be determined by the scale lines.

[0130] A through hole 509 is formed on the support member 501, and a top screw 510 passes through the through hole 509 to be connected to the spring seat 505. The spring seat 505 can be driven to move in the mounting groove 503 by the top screw 510, that is, the locking screw is loosened, and the operator rotates the top screw 510 to drive the spring seat 505 to move in the mounting groove 503 by the top screw 510. When the spring seat 505 moves to the preset scale line, the operator tightens the locking screw to fix the spring seat 505 at the corresponding position of the mounting groove 503.

[0131] A spring column is provided on the side of the spring seat 505 facing away from the support member 501, and a spring 506 is sleeved on the spring column; a spring hole is formed on the side of the dynamic pressure block 507 facing the support member 501, and the spring 506 is inserted into the spring hole to achieve an elastic connection between the dynamic pressure block 507 and the spring seat 505.

[0132] When the spring seat 505 moves in the mounting groove 503 , the dynamic pressure applied by the spring seat 505 to the dynamic pressure block 507 can be adjusted to adjust the locking force of the dynamic pressure block 507 on the light emitting component 400 .

[0133] The dynamic pressure block mechanism 50 also includes a linear guide rail 508, which is fixedly installed on the fixed base 301. The linear guide rail 508 is set along the Y-axis direction. The dynamic pressure block 507 is slidably connected to the linear guide rail 508. The spring seat 505 applies a spring force to the dynamic pressure block 507. The dynamic pressure block 507 slides back and forth along the linear guide rail 508 under the action of the spring force to adjust the distance between the dynamic pressure block 507 and the light emitting component 400, so as to facilitate the dynamic pressure block 507 to press against the light emitting component 400.

[0134] Reference Fig.14 A first baffle 305 and a second baffle 307 are provided on the fixed base 301. The first baffle 305 is the side wall of the notch 304. The first baffle 305 and the second baffle 307 protrude from the top surface of the fixed base 301. There is a gap between the first baffle 305 and the second baffle 307, so that a receiving groove 308 is formed between the first baffle 305 and the second baffle 307. The receiving groove 308 is located on the side of the mounting hole 306 facing away from the first limiting member 310.

[0135] The linear guide rail 508 is fixedly installed in the receiving groove 308, and the dynamic pressure block 507 is movably installed on the linear guide rail 508. The dynamic pressure block 507 can move back and forth in the receiving groove 308 under the action of the spring force applied by the spring seat 505. By adjusting the position of the dynamic pressure block 507, the dynamic pressure block 507 can clamp and fix the light emitting component 400.

[0136] Fig.21 The figure is an assembly diagram of a stage mechanism and a dynamic pressure block mechanism in a temperature-controlled coupling tooling of an optical component provided according to some embodiments of the present disclosure. Fig.21 As shown, the heat insulating sheet 311 is fixed on the first mounting surface 316, the heat transfer sheet 312 is fixedly mounted on the heat insulating sheet 311, the first limit member 310 is fixed on the second mounting surface 315, and the second limit member 309 is fixed on the third mounting surface 302 to complete the assembly of the platform mechanism 30; then the spring seat 505 is installed in the mounting groove 503 of the support member 501, the dynamic pressure block 507 is connected to the spring seat through the spring 506, and then the linear guide 508 is fixed to the accommodating groove 308, the support member 501 is fixed to the fourth mounting surface 303, and the dynamic pressure block 507 is slidably connected to the linear guide 508 to complete the assembly of the platform mechanism 30 and the dynamic pressure block mechanism 50.

[0137] The circuit board 300 is placed on the heat transfer sheet 312, one side of the light emitting component 400 is abutted against the limiting surface 3101 of the first limiting member 310, the side of the light emitting component 400 connected to the optical fiber is abutted against the second limiting member 309, and the optical fiber connector connected to the light emitting component 400 is embedded in the avoidance groove of the second limiting member 309; then the operator rotates the top screw 510 to adjust the position of the spring seat 505 in the installation groove 503, and the spring seat 505 applies dynamic pressure to the dynamic pressure block 507. The dynamic pressure block 507 slides along the linear guide rail 508 under the action of the dynamic pressure until the clamping surface 5071 of the dynamic pressure block 507 abuts against the light emitting component 400, and the light emitting component 400 is clamped and fixed by the dynamic pressure block 507 and the first limiting member 310, thereby realizing the fixation of the circuit board 300 on the carrier mechanism 30.

[0138] After the light emitting component 400 is locked and fixed by the stage mechanism 30 and the dynamic pressure block mechanism 50, the pigtail needs to be fixed in order to achieve optical coupling between the light emitting component 400 and the pigtail.

[0139] Fig. 22 FIG. 1 is a structural diagram of a pigtail fixing mechanism in a temperature-controlled coupling tooling of an optical component according to some embodiments of the present disclosure. Figure 3 and Fig. 22 As shown, the pigtail fixing mechanism 60 includes a fixing plate 601 and a pigtail fixing block 603. The fixing plate 601 is arranged along the X-axis direction. One end of the fixing plate 601 is fixedly mounted on the third mounting surface 302 of the fixing base 301. A second adjustment hole 602 is formed on the fixing plate 601. The second adjustment hole 602 extends along the X-axis direction. The pigtail fixing block 603 is mounted on the fixing plate 601. The pigtail fixing block 603 can move back and forth along the second adjustment hole 602 to adjust the position of the pigtail fixing block 603 on the fixing plate 601, so as to adapt to different pigtail adapters.

[0140] A fixing hole is formed on the pigtail fixing block 603 , and a locking screw passes through the fixing hole and is placed in the second adjustment hole 602 . After the pigtail fixing block 603 is moved to a preset position, the locking screw is tightened to fix the pigtail fixing block 603 on the fixing plate 601 .

[0141] An assembly groove 604 is formed on the pigtail fixing block 603 , and the assembly groove 604 is arranged along the X-axis direction. The assembly groove 604 passes through the pigtail fixing block 603 . The pigtail adapter is fixed on the pigtail fixing block 603 , and the optical fiber connected to the pigtail adapter and the optical emitting component 400 is placed in the assembly groove 604 .

[0142] In order to fix the pigtail adapter, a rotating shaft, a pressure cover 605 and a magnet 606 are provided on the pigtail fixing block 603. The pressure cover 605 is rotatably connected to the pigtail fixing block 603 via the rotating shaft. The magnet 606 can lock the pressure cover 605 by magnetic force, so that the pigtail adapter can be fixed by rotating the pressure cover 605 and using the magnetic force of the magnet 606.

[0143] Since there are no temperature control components on the circuit board 300 , after the circuit board 300 is locked and fixed by the stage mechanism 30 and the dynamic pressure block mechanism 50 , the circuit board 300 needs to be cooled by the external heat dissipation mechanism 40 .

[0144] Fig.23 The structure diagram of a heat dissipation mechanism in a temperature-controlled coupling tooling of an optical component provided according to some embodiments of the present disclosure is shown in FIG. Fig.24 The following is a partial exploded view of a heat dissipation mechanism in a temperature-controlled coupling tooling of an optical component according to some embodiments of the present disclosure. Fig.23 and Fig.24 As shown, the heat dissipation mechanism 40 is fixedly installed on the carrier mechanism 30, and the heat dissipation mechanism 40 includes a heat dissipation element 402. The heat dissipation element 402 can be installed on the fixed base 301. The heat dissipation element 402 is in contact with the heat transfer sheet 312, and the heat of the circuit board 300 is transferred to the heat dissipation element 402 via the heat transfer sheet 312; air holes are formed in the heat dissipation element 402, one end of the air hole is connected to the air inlet pipe, and the other end of the air hole is connected to the exhaust pipe, and gas is injected into the air holes of the heat dissipation element 402 to take away the heat of the heat dissipation element through the air, thereby realizing heat dissipation and temperature control of the circuit board 300.

[0145] The air holes in the heat sink 402 are distributed in a mesh shape, and three air holes are reserved as exhaust holes, which are connected to the exhaust pipe, and the remaining air holes are sealed with top screws. The mesh air holes can promote the heat to be quickly dissipated through the heat sink 402, thereby improving the heat dissipation efficiency of the heat sink 402.

[0146] To facilitate the connection between the heat sink 402 and the fixed base 301, the heat dissipation mechanism 40 also includes a support frame 401, which includes a first support plate 4010 and a second support plate 4011. The first support plate 4010 can be perpendicular to the second support plate 4011, that is, the support frame 401 is an L-shaped support frame.

[0147] The second support plate 4011 is fixedly mounted on the first baffle 305 . The first support plate 4010 is parallel to the circuit board 300 . The heat sink 402 is fixedly mounted on the first support plate 4010 . The heat sink 402 is fixedly mounted on the fixed base 301 through the support frame 401 .

[0148] In some embodiments, a second thermal insulation sheet 407 is provided between the first supporting plate 4010 and the bottom surface of the heat sink 402. The second thermal insulation sheet 407 is fixedly mounted on the first supporting plate 4010, and the heat sink 402 is fixedly mounted on the second thermal insulation sheet 407. The second thermal insulation sheet 407 mainly plays a role of thermal insulation to prevent the heat sink 402 from transferring heat between the support frame 401 and the fixed base 301, thereby affecting the heat dissipation effect of the heat sink 402.

[0149] In some embodiments, a first adjustment hole is provided on the second supporting plate 4011, and the first adjustment hole is provided along the Z-axis direction. The locking screw passes through the first adjustment hole and is fixedly connected to the first baffle 305, and the upper and lower positions of the heat dissipation mechanism 40 can be fine-tuned through the first adjustment hole.

[0150] In order to improve the heat dissipation efficiency, the heat sink 402 needs to be placed in contact with the heat transfer sheet 312. A heat conductive block 4021 is formed at one end of the heat sink 402. The heat conductive block 4021 protrudes from the heat sink 402. When the heat sink 402 is fixedly installed on the fixed base 301, the heat conductive block 4021 is located in the installation hole 306 to place the heat conductive block 4021 below the heat transfer sheet 312.

[0151] Furthermore, a placement groove 4022 is formed on the heat conductive block 4021, and a heat sink 403 is installed in the placement groove 4022. The heat sink 403 is in contact with the bottom surface of the heat transfer plate 312, and the heat transfer plate 312 conducts heat to the heat sink 403, and the heat sink 403 is connected to the heat sink 402 through a cable.

[0152] In some embodiments, the heat sink 403 is a semiconductor refrigerator (Thermoelectric cooler, TEC), the upper surface of the TEC sheet is the cooling surface, and the lower surface of the TEC sheet is the heating surface. The upper surface of the TEC sheet contacts the heat transfer sheet 312, and the lower surface of the TEC sheet contacts the heat sink 402, so that the heat of the circuit board 300 is cooled by the cooling surface of the TEC sheet through the heat transfer sheet 312, and the heat generated by the heating surface of the TEC sheet can be dissipated through the heat sink 402.

[0153] A cable groove 4020 is provided in the heat sink 402, and multiple cables are placed in the cable groove 4020. The heat sink 403 is connected to the thermistor and the cables, so that the heat of the heat sink 403 and the thermistor is conducted through the cable, and the temperature of the circuit board 300 is fed back in real time through the thermistor to achieve a continuous temperature control effect.

[0154] In order to avoid confusion of cables in the cable groove 4020, the heat dissipation mechanism 40 also includes a wire cover 404, which covers the cable groove 4020 and is mainly used to seal the heat dissipation cables and thermistor cables in the cable groove 4020 to protect the heat dissipation cables and thermistor cables.

[0155] An air inlet hole is formed in the heat conductive block 4021, and the air inlet hole is connected to the air inlet pipe through the air inlet pipe joint 405. The air inlet hole is communicated with the air hole in the heat sink 402. The air hole is connected to the exhaust pipe through the exhaust pipe joint 406 so that compressed air is blown into the air hole through the air inlet pipe and the compressed air is discharged through the exhaust pipe. The air hole is located below the cable groove 4020, and the heat in the heat sink 402 is taken away by the compressed air.

[0156] Fig.25 The figure is an assembly diagram of a stage mechanism and a heat dissipation mechanism in a temperature-controlled coupling tooling of an optical component provided according to some embodiments of the present disclosure. Fig.26 The figure is a cross-sectional view of the assembly of a stage mechanism and a heat dissipation mechanism in a temperature-controlled coupling tool of an optical component provided according to some embodiments of the present disclosure. Fig.25 and Fig.26 As shown, the heat sink 402 is fixedly installed on the support frame 401, the heat sink 403 is placed in the placement groove 4022 of the heat conductive block 4021, the heat sink 403 is connected to the heat dissipation cable in the heat sink 402, and then the heat conductive block 4021 is placed in the mounting hole 306 along the X-axis direction, and the air inlet pipe joint and the air inlet pipe connected to the air inlet hole of the heat conductive block 4021 extend along the mounting hole 306 to the bottom surface 317 of the fixed base 301, so that the heat sink 403 is in contact and connected with the bottom surface of the heat transfer plate 312; then the support frame 401 is fixedly installed on the first baffle 305, and the thermistor is connected to the thermistor cable in the heat sink 402 to realize the assembly of the stage mechanism 30 and the heat dissipation mechanism 40.

[0157] Reference Fig.15 A connecting groove 318 is formed on the bottom surface 317 of the fixed base 301 , and the connecting groove 318 extends from the side of the fixed base 301 to the mounting hole 306 . The air intake pipe is installed in the connecting groove 318 to protect the air intake pipe through the connecting groove 318 .

[0158] The heat generated by the light emitting component 400 is conducted to the circuit board 300, the circuit board 300 conducts the heat to the heat transfer sheet 312, the heat transfer sheet 312 conducts the heat to the heat sink 403, and compressed air is blown into the air inlet hole of the heat conduction block 4021 through the air inlet pipe. The compressed air dissipates the heat generated by the heat sink 403 through the air inlet hole, the air holes in the heat sink 402, and the exhaust holes, thereby realizing external heat dissipation and temperature control of the circuit board 300.

[0159] When the circuit board 300 is subjected to external heat dissipation and temperature control through the heat dissipation mechanism 40 , compressed air is blown into the heat dissipation mechanism 40 . When the compressed air takes away the heat of the heat sink 402 , a large noise is generated, which affects the user experience.

[0160] Fig. 27 The structure diagram of a silencer mechanism in a temperature-controlled coupling tooling of an optical component provided according to some embodiments of the present disclosure. Figure 3 and Fig. 27 As shown, in order to reduce the noise of the temperature control coupling tooling, a silencer mechanism 70 is also included. The silencer mechanism 70 is fixedly mounted on the base 10. The silencer mechanism 70 is connected to the exhaust pipe of the heat dissipation mechanism 40 through an air pipe so as to eliminate the noise generated by the heat dissipation mechanism 40 through the silencer mechanism 70.

[0161] The silencer mechanism 70 includes a fixing frame 701, a silencer 702 and an air pipe joint 703. The fixing frame 701 is an L-shaped fixing frame. A fixing plate in the fixing frame 701 parallel to the base 10 is fixed on the base 10. The silencer 702 is installed on a fixing plate in the fixing frame 701 perpendicular to the base 10 so that the silencer 702 is fixed on the base 10 through the fixing frame 701.

[0162] One end of the muffler 702 is connected to the exhaust pipe of the heat dissipation mechanism 40 through an air pipe joint 703. The noise generated when the exhaust pipe of the heat dissipation mechanism 40 is exhausted is eliminated by the muffler 702, thereby reducing the noise of the temperature control coupling tooling.

[0163] The temperature control coupling tooling of the optical component provided by the embodiment of the present disclosure includes a base, a slide mechanism, a carrier mechanism, a dynamic pressure block mechanism, a heat dissipation mechanism, a pigtail fixing mechanism and a silencer mechanism. The slide mechanism and the silencer mechanism are installed on the base, the carrier mechanism is installed on the slide mechanism, the dynamic pressure block mechanism, the heat dissipation mechanism and the pigtail fixing mechanism are installed on the carrier mechanism, and the circuit board with the light emitting component installed is located on the carrier mechanism. The carrier mechanism has a vacuum adsorption function to ensure the tightness of the circuit board and the carrier mechanism; the light emitting component is locked and fixed by the dynamic pressure block mechanism and the carrier mechanism, and the slide mechanism has an XY The sliding mechanism has the manual adjustment function in TZ and TY directions. The pigtail fixing mechanism is used to fix the pigtail adapter. The optical emitting component is adjusted through the sliding mechanism to facilitate the optical coupling between the optical emitting component and the pigtail adapter. The dynamic pressure block mechanism has a variable force clamping function to ensure that the optical emitting component is not damaged. The heat dissipation mechanism uses compressed air to discharge the heat generated by the heating surface of the TEC heat sink, and has the characteristics of continuous heat dissipation and strong real-time performance, while also having the advantages of cleanliness and safety. The silencer mechanism is used to eliminate the noise generated by the heat dissipation mechanism, and has the function of silencer and noise reduction.

[0164] The optical component temperature control coupling tooling provided by the present invention performs external temperature control and heat dissipation on optical components such as light emitting components, thereby solving the problem of poor coupling of optical components caused by excessively high circuit board temperature due to heat generated by the operation of the optical components, and improving the production yield of optical modules.

[0165] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, ordinary operators in the art should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. A temperature control coupling tool for an optical component, characterized in that: include: Base; A slide rail, mounted on the base; At least one slide assembly is slidably connected to the slide rail, and the at least one slide assembly is used to adjust the position of the optical assembly; A fixed base, mounted on the at least one slide assembly, wherein a mounting hole is formed in the fixed base; A first limiting member is installed on the fixed base, and the first limiting member is used to limit the optical component in the Y-axis direction; A heat transfer sheet is mounted on the fixed base, the heat transfer sheet covers the mounting hole, and the heat transfer sheet is in contact with the circuit board on which the optical component is mounted; A support member is installed on the fixed base, and a mounting groove is formed on the support member; A spring seat is located in the mounting groove, and the spring seat can move in the mounting groove; A dynamic pressure block is elastically connected to the spring seat, and is used to press the optical component to fix the optical component; A heat sink is mounted on the fixed base, the heat sink is in contact with the heat transfer plate via a heat sink, an air hole is formed in the heat sink, one end of the air hole is connected to an air inlet pipe, and the air inlet pipe is inserted into the mounting hole; the other end of the air hole is connected to an exhaust pipe to dissipate heat from the heat sink through gas.

2. The temperature control coupling tooling of the optical component according to claim 1, characterized in that: The at least one slide assembly comprises: A first slide assembly is mounted on the slide rail, and the first slide assembly is slidably connected to the slide rail so that the first slide assembly moves along the Y-axis direction with the slide rail; A second slide assembly is mounted on the first slide assembly, and the second slide assembly moves along the X-axis direction with the first slide assembly; The third slide assembly is installed on the second slide assembly, the fixed base is installed on the third slide assembly, the third slide assembly swings around the Y-axis direction along with the second slide assembly, and the third slide assembly is used to drive the fixed base to rotate around the Z-axis direction.

3. The temperature control coupling tool for an optical component according to claim 1, characterized in that: Also includes: A second limiting member is installed on the fixed base, and the second limiting member is used to limit the optical component in the X-axis direction; A first heat insulation sheet is mounted on the fixed base, the first heat insulation sheet surrounds the mounting hole, the heat transfer sheet is mounted on the first heat insulation sheet, and the first heat insulation sheet is used to thermally isolate the fixed base from the heat transfer sheet; A thermistor is inserted into the heat transfer sheet, and the thermistor is used to obtain the real-time temperature of the heat transfer sheet.

4. The temperature control coupling tool for an optical component according to claim 1, characterized in that: A vent hole is formed on the side of the fixed base, and the vent hole extends to the bottom of the heat transfer sheet. The vent hole is connected to a vacuum air pipe to achieve vacuum adsorption of the circuit board and the heat transfer sheet.

5. The temperature control coupling tool for an optical component according to claim 1, characterized in that: Also includes: The linear guide is fixed on the fixed base, and the dynamic pressure block is slidably connected to the linear guide, so that the dynamic pressure block moves along the linear guide under the action of the spring force.

6. The temperature control coupling tool for an optical component according to claim 1, characterized in that: A heat conducting block is formed at one end of the heat dissipation element, a placement groove is formed on the heat conducting block, and the heat dissipation fin is located in the placement groove; An air inlet hole is formed in the heat conducting block, the air inlet hole is communicated with the air hole, and the air inlet hole is connected with the air inlet pipe.

7. The temperature control coupling tool for an optical component according to claim 6, characterized in that: Also includes: A support frame, mounted on the fixed base, wherein a first adjustment hole is formed on the support frame, so as to adjust the position of the heat sink through the first adjustment hole; A second heat insulating sheet is installed on the support frame, the heat sink is installed on the second heat insulating sheet, and the second heat insulating sheet is used to thermally isolate the heat sink from the support frame.

8. The temperature control coupling tool for an optical component according to claim 1, characterized in that: Also includes: A fixing plate, mounted on the fixing base, wherein a second adjustment hole is formed on the fixing plate; A pigtail fixing block is mounted on the fixing plate, a mounting groove is formed on the pigtail fixing block, the pigtail adapter is located in the mounting groove, and the pigtail fixing block can be moved in the second adjustment hole to adjust the position of the pigtail fixing block; A fixing frame, mounted on the base; A muffler is installed on the fixing frame, the muffler is connected to the exhaust pipe through a muffler air pipe, and the muffler is used to eliminate the noise generated when the gas is discharged.

9. A temperature control coupling tool for an optical component, characterized in that: include: Base; A slide rail, mounted on the base; At least one slide assembly, slidably connected to the slide rail; A fixed base, mounted on the at least one slide assembly, wherein a mounting hole is formed on the fixed base; A first limiting member is installed on the fixed base; A heat transfer sheet is installed on the fixed base, and the heat transfer sheet covers the installation hole; A support member is installed on the fixed base, and a mounting groove is formed on the support member; A spring seat, located in the mounting groove; A dynamic pressure block, elastically connected to the spring seat via a spring; a heat sink mounted on the fixed base, the heat sink being in contact with the heat transfer sheet via a heat sink, an air hole being formed in the heat sink, one end of the air hole being connected to an air inlet pipe, the air inlet pipe being inserted into the mounting hole, and the other end of the air hole being connected to an exhaust pipe; Among them, a circuit board with an optical component installed is installed on the heat transfer sheet, and the spring seat provides pressure to the dynamic pressure block through the spring, so as to fix the optical component through the dynamic pressure block and the first limit member, and the at least one slide assembly drives the fixed base to adjust the position in different directions to adjust the position of the optical component and realize the coupling of the optical component; the heat generated by the optical component is conducted to the heat transfer sheet, and the heat transfer sheet conducts the heat to the heat sink through the heat sink to dissipate the heat of the optical component.

10. The temperature control coupling tool for an optical component according to claim 9, characterized in that: The support member is formed with a third adjustment hole and a through hole, a top screw passes through the through hole and is connected to the spring seat, and the spring seat is driven to move in the installation groove by the top screw; The locking screw passes through the third adjustment hole and is connected to the spring seat to fix the spring seat at different positions in the mounting groove.

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