Stepping nanoimprint device

Abstract

The invention discloses stepping nanoimprint equipment which comprises a support and an imprint exposure module, the support comprises a horizontally-arranged base and a vertically-arranged fixed frame, the imprint exposure module comprises a leveling guide device, an ultraviolet exposure lamp and an imprint clamping device, and the leveling guide device comprises a movable frame and three differential leveling heads. The three differential leveling heads are fixed to the movable frame and located on the three-axis center line of the movable frame, the imprinting clamping device is provided with three pressure sensors and three leveling datum planes, the three pressure sensors are located on the three-axis center line of the upper end face of the imprinting clamping device, the three leveling datum planes are fixed to the side wall of the lower end of the imprinting clamping device, and the pressure sensors are located on the three-axis center line of the upper end face of the imprinting clamping device. The coining clamping device is reasonable in structure, the levelness of the coining clamping device and the levelness of the substrate adsorption device can be kept consistent by leveling the datum plane, and therefore the coining precision is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of imprinting equipment, and in particular to a stepping nanoimprinting equipment. Background Art

[0002] Nanoimprint Lithography (NIL) is a high-resolution, high-throughput nanofabrication technology used to replicate nanoscale structures on substrates. With the advancement of Moore's Law, the integrated circuit (IC) industry has an increasing demand for smaller feature sizes and higher density. However, traditional photolithography faces problems such as light source wavelength limitations, rising costs, and increased complexity. Therefore, nanoimprint lithography, as a technology with high resolution and low cost, has received widespread attention. The development of nanotechnology has promoted the exploration of various new materials and new processes, and nanoimprint lithography has emerged. It can achieve high-precision and high-reproducibility pattern transfer at the nanoscale, providing a new manufacturing method for nanodevices, optical devices, and biosensors. Nanoimprint lithography not only has important applications in semiconductor manufacturing, but also shows broad application prospects in optical component manufacturing, data storage, biomedicine, and other fields. For example, it is used to manufacture nanowire arrays, gratings, microlens arrays, nanoholes, etc., which have important applications in optical communications, data storage, sensor technology, etc.

[0003] Although the traditional nanoimprint process has significant advantages in resolution and cost, there are some problems in the large-area patterning process. For example, the overall imprinting method is difficult to avoid deformation and non-uniformity of large-area substrates. In addition, when dealing with large areas or large-scale production, the mold making cost of overall imprinting is high and the process steps are complicated. The semiconductor industry is constantly pursuing smaller feature sizes and higher integration. Step-and-scan technology has been widely used in traditional lithography, proving its advantages in processing large areas and high yields. Therefore, introducing step-and-scan technology into nanoimprinting can make full use of its high-precision and efficient production characteristics.

[0004] At present, in the domestic market, especially in the field of optical waveguides, the nanoimprint process often uses the ultraviolet nanoimprint process, which has relatively simple operation steps and does not require complex stepping and alignment systems. The whole process is carried out at room temperature, and no heating or cooling steps are required, so the process flow is relatively direct. In addition, the cost of equipment and materials required is relatively low, which is suitable for small and medium batch production and rapid prototyping. It uses ultraviolet light to cure photosensitive polymers, and the curing process is rapid, which can improve production efficiency. It can also achieve sub-10 nanometer pattern transfer, which is suitable for the production of high-precision nanostructures, and is also suitable for a variety of substrate materials (such as silicon wafers, glass, polymer films, etc.), and is widely used in nano-optics, microfluidics, biosensors and other fields.

[0005] However, the overall imprinting method may encounter problems such as substrate deformation and uneven pattern when transferring large-area patterns. Due to direct physical contact, the mold is easily worn during repeated use, affecting the pattern accuracy and life. In addition, when making multi-layer patterns, the alignment accuracy is relatively low, making it difficult to achieve high-precision inter-layer alignment. In response to the above problems, a solution is proposed below. Summary of the invention

[0006] The object of the present invention is to provide a stepping nanoimprinting device having the advantages of high resolution and high precision.

[0007] The above technical objectives of the present invention are achieved through the following technical solutions: A stepping nanoimprint device comprises a bracket and an imprint exposure module, wherein the bracket comprises a horizontally arranged base and a vertically arranged fixed frame, the lower end of the fixed frame is fixedly connected to the base, a vertical power mechanism is fixedly arranged on one side of the fixed frame, the imprint exposure module comprises a leveling guide device, an ultraviolet exposure lamp and an imprint clamping device, the leveling guide device is connected to the vertical power mechanism, the leveling guide device comprises a movable frame and three differential leveling heads, the three differential leveling heads are fixed on the movable frame and are located on the three-axis midline of the movable frame, the ultraviolet exposure lamp is fixed on the upper end of the movable frame, the imprint clamping device is fixed on the lower end of the movable frame, three pressure sensors and three leveling reference surfaces are arranged on the imprint clamping device, the three pressure sensors are located on the three-axis midline of the upper end face of the imprint clamping device, the three leveling reference surfaces are fixed on the side wall of the lower end of the imprint clamping device, a substrate adsorption device is also arranged on the base, and the three leveling reference surfaces are used to keep the levelness of the imprint clamping device and the substrate adsorption device consistent.

[0008] Preferably, the stamping clamping device includes an upper connecting plate, a lower connecting plate and a vacuum adsorption device, the upper connecting plate is connected to the movable frame by a fastener, the lower connecting plate is located at the lower end of the upper connecting plate and is connected to the upper connecting plate by a fastening mechanism, the vacuum adsorption device is fixed to the lower end surface of the lower connecting plate, the three leveling reference surfaces surround the circumference of the vacuum adsorption device, and there is a gap between the three leveling reference surfaces and the side of the vacuum adsorption device.

[0009] Preferably, six connecting mechanisms are arranged between the movable frame and the upper connecting plate, and the connecting mechanisms include two connecting columns and a tension spring. The movable frame and the upper connecting plate are both provided with six connecting holes, one of the connecting columns is transversely fixed to the upper end surface of the movable frame, and the other connecting column is transversely fixed to the lower end surface of the upper connecting plate. Both ends of the tension spring pass through the two connecting holes respectively and are fixedly connected to the two connecting columns.

[0010] Preferably, three fastening mechanisms are provided between the upper connecting plate and the lower connecting plate, and the fastening mechanisms include a fastening block and a plurality of fastening bolts. The fastening block is located between the upper connecting plate and the lower connecting plate, a part of the fastening bolts penetrate upward through the lower connecting plate and are threadedly connected to the lower end of the fastening block, and another part of the fastening bolts penetrate downward through the upper connecting plate and are threadedly connected to the upper end of the fastening block.

[0011] Preferably, the three leveling reference surfaces are respectively located directly below the three fastening mechanisms, three top blocks are fixedly provided on the upper end surface of the upper connecting plate, the three top blocks are located directly above the three fastening mechanisms, the upper end surface of the top blocks is a plane, and the lower ends of the three differential leveling heads are respectively located directly above the three top blocks.

[0012] Preferably, the substrate adsorption device is fixed to the upper end surface of the base through a support frame, and three dial indicators are arranged at the lower end of the substrate adsorption device. The needles of the three dial indicators pass through the substrate adsorption device upward and are located on the upper end surface of the substrate adsorption device. The needles of the three dial indicators are respectively located directly below the three leveling reference surfaces.

[0013] Preferably, the vertical power mechanism includes an electric cylinder, a fixed frame, two guide rails and two guide blocks, the fixed frame is fixed to the front side of the fixed frame, the electric cylinder is fixedly connected to the upper end of the fixed frame, the output shaft of the electric cylinder is vertically arranged downward, and a movable joint is provided on the output shaft of the electric cylinder, and the movable joint is fixedly connected to one side of the movable frame. The two guide rails are vertically fixed to both sides of the front side surface of the fixed frame, the two guide blocks are respectively located on the two guide rails and are slidably connected to the guide rails, and the two guide blocks are fixedly connected to one side of the movable frame.

[0014] Preferably, a stabilizing guide column is fixedly provided on the fixing frame, and the stabilizing guide column is located between the two guide rails, and the upper and lower ends of the stabilizing guide column are fixedly connected to the fixing frame, and a guide hole is opened on the movable joint block, and the guide hole is sleeved on the stabilizing guide column and slidably connected to the stabilizing guide column.

[0015] The beneficial effects of the present invention are: 1. Combining step-scan and UV curing technology, it can achieve sub-10 nanometer pattern transfer with extremely high alignment accuracy; 2. Through the step-scan method, highly uniform pattern transfer can be achieved on a large-area substrate, which is suitable for large-scale production; 3. The stepping distance and exposure time can be flexibly adjusted to meet the manufacturing needs of different patterns and sizes; 4. Since the imprinting area is small each time, the problems of substrate deformation and uneven pattern are effectively controlled. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of an embodiment; Figure 2 This is a schematic diagram of the structure of the vertical power mechanism used to illustrate the embodiment; Figure 3 This is a schematic diagram of the structure of an embodiment for showing an imprint exposure module; Figure 4 This is a schematic diagram of the structure of the embodiment for showing the imprint exposure module in another direction; Figure 5 The embodiment is a schematic structural diagram for illustrating a connecting mechanism.

[0017] Figure numerals: 1. base; 11. fixed frame; 2. imprint exposure module; 21. ultraviolet exposure lamp; 22. leveling guide device; 221. movable frame; 222. differential leveling head; 23. imprint clamping device; 231. pressure sensor; 232. leveling reference plane; 233. upper connecting plate; 234. lower connecting plate; 235. vacuum adsorption device; 3. substrate adsorption device; 31. support frame; 32. dial indicator; 33. needle; 4. connecting mechanism; 41. connecting column; 42. tension spring; 5. fastening block; 6. vertical power mechanism; 61. electric cylinder; 62. fixed frame; 63. guide rail; 64. guide block; 65. movable joint block; 66. stable guide column. DETAILED DESCRIPTION

[0018] The following is only a preferred embodiment of the present invention, and the protection scope is not limited to this embodiment. All technical solutions under the concept of the present invention should belong to the protection scope of the present invention. The same parts are represented by the same figure marks. It should be noted that the words "front", "rear", "left", "right", "up" and "down" used in the following description refer to the directions in the drawings, and the words "bottom" and "top", "inside" and "outside" refer to the directions toward or away from the geometric center of a specific component, respectively.

[0019] like Figures 1 to 5 As shown, a stepper nanoimprint device includes a bracket and an imprint exposure module 2, wherein the bracket includes a horizontally arranged base 1 and a vertically arranged fixed frame 11, and the lower end of the fixed frame 11 is fixedly connected to the base 1. A vertical power mechanism 6 is fixedly arranged on the front side of the fixed frame 11, and the vertical power mechanism 6 is used to drive the imprint exposure module 2 to move.

[0020] The vertical power mechanism 6 includes an electric cylinder 61 and a fixing frame 62. The fixing frame 62 is fixedly connected to one side of the fixing frame 11. The electric cylinder 61 is fixed to the upper end of the fixing frame 62, and the output shaft of the electric cylinder 61 is vertically arranged downward. The electric cylinder 61 used in this design is mainly used to provide downward power. Any component that can provide linear power, such as a hydraulic cylinder, a cylinder or a screw structure, can replace the electric cylinder 61 in this design.

[0021] The end of the output shaft of the electric cylinder 61 is connected to a movable joint block 65. The movable joint block 65 in the present design is in a shape similar to a cuboid. The front side of the movable joint block 65 is connected to the imprint exposure module 2 to drive the imprint exposure module 2 to move in the vertical direction.

[0022] In order to enhance the stability of the imprint exposure module 2 when moving, guide rails 63 are provided on both sides of the front side of the fixed frame 62. The guide rails 63 are arranged in a vertical direction. Guide blocks 64 are provided on the two guide rails 63 and are slidably connected to the guide rails 63. The front side of the guide block 64 is fixedly connected to the imprint exposure module 2 by fasteners such as bolts, so that the imprint exposure module 2 will not shake when moving up and down.

[0023] In order to further enhance the stability of the imprint exposure module 2 when moving, a guide hole is provided on the movable joint block 65, and a stable guide post 66 is provided on the fixed frame 62. The stable guide post 66 is arranged in a vertical direction, and the upper and lower ends of the stable guide post 66 are respectively fixedly connected to the upper and lower sides of the fixed frame 62. The guide hole on the movable joint block 65 is sleeved on the stable guide post 66, and can move up and down along the stable guide post 66.

[0024] Since the stabilizing guide post 66 and the two guide rails 63 are not on the same plane, the stabilizing structure composed of the stabilizing guide post 66 and the two guide rails 63 forms a triangle on the horizontal plane at the same height, which can enhance the stability of the imprint exposure module 2 when moving.

[0025] The imprint exposure module 2 includes a leveling guide device 22, an ultraviolet exposure lamp 21 and an imprint clamping device 23. The leveling guide device 22 includes a movable frame 221 and three differential leveling heads 222. The movable frame 221 is a component directly connected to the vertical power mechanism 6. The three differential leveling heads 222 are fixed on the three-axis midline at the bottom of the movable frame 221.

[0026] The ultraviolet exposure lamp 21 is fixed on the upper end of the movable frame 221. In order to allow the ultraviolet exposure lamp 21 to achieve exposure, openings are provided at the bottom of the movable frame 221 and at the position corresponding to the imprint exposure module 2.

[0027] The stamping clamping device 23 is fixed to the lower end of the movable frame 221, and the stamping clamping device 23 includes an upper connecting plate 233, a lower connecting plate 234 and a vacuum adsorption device 235. The vacuum adsorption device 235 is a vacuum pump in the prior art. In this design, its end face needs to be flat, so the end head of the adsorption external device is set to be square, and the square end head is set on the lower end face of the lower connecting plate 234. The vacuum adsorption device 235 can adsorb the external stamping template.

[0028] The upper connecting plate 233 is connected to the movable frame 221 through fasteners. The fasteners in this application are two upper and lower larger plates, which are fixed to the lower end surface of the upper connecting plate 233 and the upper end surface of the bottom of the movable frame 221 respectively, and fixed by screws. There is a vertical cylinder between the two plates, and the upper and lower ends of the cylinder are connected to the two plates by screws respectively, so that the upper connecting plate 233 is fixed below the movable frame 221. This design allows the upper connecting plate 233 to move upward along a number of cylinders to adjust the distance between the upper connecting plate 233 and the bottom of the movable frame 221. Three pressure sensors 231 are provided on the upper connecting plate 233, and the three pressure sensors 231 are sleeved on the cylinders of the three fasteners, and the three pressure sensors 231 are located on the three-axis midline of the upper connecting plate 233. The three pressure sensors 231 can detect the magnitude of the stamping force during the stamping process.

[0029] Six connection mechanisms 4 are further provided between the movable frame 221 and the upper connection plate 233 . The six connection mechanisms 4 are distributed at different positions on the bottom of the movable frame 221 and are symmetrically arranged, so as to stably fix the upper connection plate 233 below the movable frame 221 .

[0030] The connecting mechanism 4 includes two connecting columns 41 and a tension spring 42. Six connecting holes are provided on the movable frame 221 and the upper connecting plate 233. In the present design, an embedding groove is provided on the upper side of the connecting hole on the movable frame 221, and an embedding groove is provided on the lower side of the connecting hole on the connecting plate. The two connecting columns 41 are partially clamped in the two embedding grooves, and the two ends of the tension spring 42 pass through the two connecting holes respectively to tighten and fix the two connecting columns 41, thereby realizing the fixation between the upper connecting plate 233 and the movable frame 221.

[0031] The lower connecting plate 234 is located at the lower end of the upper connecting plate 233 and is connected to the upper connecting plate 233 by a fastening mechanism. The fastening mechanism in the present application includes a fastening block 5 and a plurality of fastening bolts. The fastening block 5 is located between the upper connecting plate 233 and the lower connecting plate 234. A portion of the fastening bolts penetrates the lower connecting plate 234 upwards and is threadedly connected to the lower end of the fastening block 5, and another portion of the fastening bolts penetrates the upper connecting plate 233 downwards and is threadedly connected to the upper end of the fastening block 5. The upper connecting plate 233 and the lower connecting plate 234 are fixed to the upper and lower ends of the fastening block 5, respectively, by fastening bolts, and a certain interval is maintained between the upper connecting plate 233 and the lower connecting plate 234.

[0032] The lower end of the lower connecting plate 234 is also provided with three leveling reference surfaces 232, which surround the circumference of the vacuum adsorption device 235, and there is a gap between the three leveling reference surfaces 232 and the side of the vacuum adsorption device 235. The three leveling reference surfaces 232 are respectively located directly below the three fastening mechanisms; the upper end surface of the upper connecting plate 233 is fixed with three top blocks, which are located directly above the three fastening mechanisms; the upper end surface of the top block is a plane, and the lower ends of the three differential leveling heads 222 are respectively located directly above the three top blocks.

[0033] The base 1 is also provided with a substrate adsorption device 3, which is also a prior art. Negative pressure is generated by a vacuum pump, and a plane with holes is connected to the joint of the vacuum pump, so that objects placed on the end surface of the plane can be adsorbed. The three leveling reference surfaces 232 are used to keep the horizontality of the imprint clamping device 23 and the substrate adsorption device 3 consistent.

[0034] The substrate adsorption device 3 is fixed to the upper end surface of the base 1 through the support frame 31, and three dial gauges 32 are arranged at the lower end of the substrate adsorption device 3. The needles 33 of the three dial gauges 32 pass through the substrate adsorption device 3 upward and are located at the upper end surface of the substrate adsorption device 3. The needles 33 of the three dial gauges 32 are respectively located directly below the three leveling reference surfaces 232. The three dial gauges 32 are used to read the relevant data values ​​at the needles 33.

[0035] The specific working logic process is: Step 1: First, adsorb the imprint template on the vacuum adsorption device; Step 2: adsorbing the imprint substrate sprayed with imprint glue on a substrate adsorption device; Step 3: Push the imprint exposure module downward through the vertical power mechanism; Step 4: Continue with step 3 until a value appears on the dial indicator. At this time, one of the needles contacts the leveling reference surface at the corresponding position and generates pressure. Since the needle is a spring device inside, when the stamping clamping device continues to descend as a whole, the three needles contact the three leveling reference surfaces and the vertical displacement is reflected on the three dial indicators. Step 5: Fine-tune the three micrometers by using the three micrometers to make the values ​​on the three dial indicators equal. At this time, the plane where the imprint clamping device is located will remain parallel to the plane where the imprint substrate is located. Step 6: Continue to descend slowly and at a constant speed through the vertical power mechanism; Step 7: Continue with step 6 until the values ​​of the three dial indicators reach the experimental set values; Step 8: Turn on the UV exposure lamp to make it work until the exposure process is completed; Step 9: Perform demoulding process, and complete the upward movement process again through the vertical power mechanism, and the movement speed should be kept slow and uniform; Step 10: Perform an inkjet process through the moving platform on the substrate adsorption device to spray ink on the next area to be imprinted on the substrate, and then repeat the above steps 3-10.

[0036] The specific embodiments described above further illustrate the technical problems, technical solutions and beneficial effects solved by the present invention. It should be understood that the above are only specific embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A stepper nanoimprint device, comprising a support and an imprint exposure module (2), characterized in that: The support comprises a horizontally arranged base (1) and a vertically arranged fixed frame (11); the lower end of the fixed frame (11) is fixedly connected to the base (1); a vertical power mechanism (6) is fixedly arranged on one side of the fixed frame (11); the imprint exposure module (2) comprises a leveling guide device (22), an ultraviolet exposure lamp (21) and an imprint clamping device (23); the leveling guide device (22) is connected to the vertical power mechanism (6); the leveling guide device (22) comprises a movable frame (221) and three differential leveling heads (222); the three differential leveling heads (222) are fixed on the movable frame (221) and are located on the three-axis midline of the movable frame (221). The ultraviolet exposure lamp (21) is fixed on the upper end of the movable frame (221), the stamping clamping device (23) is fixed on the lower end of the movable frame (221), and the stamping clamping device (23) is provided with three pressure sensors (231) and three leveling reference surfaces (232). The three pressure sensors (231) are located on the three-axis midline of the upper end surface of the stamping clamping device (23), and the three leveling reference surfaces (232) are fixed on the side wall of the lower end of the stamping clamping device (23). The base (1) is also provided with a substrate adsorption device (3), and the three leveling reference surfaces (232) are used to keep the levelness of the stamping clamping device (23) and the substrate adsorption device (3) consistent.

2. A stepper nanoimprinting device according to claim 1, characterized in that: The stamping clamping device (23) comprises an upper connecting plate (233), a lower connecting plate (234) and a vacuum adsorption device (235); the upper connecting plate (233) is connected to the movable frame (221) via a fastener; the lower connecting plate (234) is located at the lower end of the upper connecting plate (233) and is connected to the upper connecting plate (233) via a fastening mechanism; the vacuum adsorption device (235) is fixed to the lower end surface of the lower connecting plate (234); the three leveling reference surfaces (232) surround the circumference of the vacuum adsorption device (235), and there is a gap between the three leveling reference surfaces (232) and the side of the vacuum adsorption device (235).

3. A stepper nanoimprinting device according to claim 2, characterized in that: Six connection mechanisms (4) are arranged between the movable frame (221) and the upper connection plate (233), and the connection mechanisms (4) include two connection columns (41) and a tension spring (42). Six connection holes are arranged on the movable frame (221) and the upper connection plate (233), one of the connection columns (41) is transversely fixed to the upper end surface of the movable frame (221), and the other connection column (41) is transversely fixed to the lower end surface of the upper connection plate (233). Two ends of the tension spring (42) respectively pass through the two connection holes and are fixedly connected to the two connection columns (41).

4. A stepper nanoimprinting device according to claim 2, characterized in that: Three fastening mechanisms are provided between the upper connecting plate (233) and the lower connecting plate (234), and the fastening mechanisms include a fastening block (5) and a plurality of fastening bolts. The fastening block (5) is located between the upper connecting plate (233) and the lower connecting plate (234), a portion of the fastening bolts penetrate upwards through the lower connecting plate (234) and are threadedly connected to the lower end of the fastening block (5), and another portion of the fastening bolts penetrate downwards through the upper connecting plate (233) and are threadedly connected to the upper end of the fastening block (5).

5. A stepper nanoimprinting device according to claim 4, characterized in that: The three leveling reference surfaces (232) are respectively located directly below the three fastening mechanisms; the upper end surface of the upper connecting plate (233) is fixedly provided with three top blocks; the three top blocks are located directly above the three fastening mechanisms; the upper end surface of the top blocks is a plane; and the lower ends of the three differential leveling heads (222) are respectively located directly above the three top blocks.

6. The stepper nanoimprinting device according to claim 1, characterized in that: The substrate adsorption device (3) is fixed to the upper end surface of the base (1) through a support frame (31); three dial indicators (32) are arranged at the lower end of the substrate adsorption device (3); the needles (33) of the three dial indicators (32) pass through the substrate adsorption device (3) upward and are located on the upper end surface of the substrate adsorption device (3); the needles (33) of the three dial indicators (32) are respectively located directly below three leveling reference surfaces (232).

7. The stepper nanoimprinting device according to claim 1, characterized in that: The vertical power mechanism (6) comprises an electric cylinder (61), a fixed frame (62), two guide rails (63) and two guide blocks (64); the fixed frame (62) is fixed on the front side of the fixed frame (11); the electric cylinder (61) is fixedly connected to the upper end of the fixed frame (62); the output shaft of the electric cylinder (61) is vertically arranged downward; a movable joint block (65) is arranged on the output shaft of the electric cylinder (61); the movable joint block (65) is fixedly connected to one side of the movable frame (221); the two guide rails (63) are vertically fixed to both sides of the front side of the fixed frame (62); the two guide blocks (64) are respectively located on the two guide rails (63) and are slidably connected to the guide rails (63); and the two guide blocks (64) are fixedly connected to one side of the movable frame (221).

8. The stepper nanoimprinting device according to claim 7, characterized in that: The fixing frame (62) is also fixedly provided with a stabilizing guide column (66), the stabilizing guide column (66) is located between the two guide rails (63), and the upper and lower ends of the stabilizing guide column (66) are fixedly connected to the fixing frame (62), and the movable connecting block (65) is provided with a guide hole, the guide hole is sleeved on the stabilizing guide column (66), and is slidably connected to the stabilizing guide column (66).

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