Chip testing method based on S905X4 platform, electronic equipment and medium

Abstract

The invention discloses a chip testing method based on an S905X4 platform, electronic equipment and a medium, and relates to the technical field of chip testing. The method comprises the following steps: acquiring an S905X4 platform; placing a limiting device on the surface of each mounting area; the two DDR4 chips are placed in the corresponding limiting holes respectively, so that the DDR4 chips are in contact with the corresponding conductive adhesives; placing a pressing device on each limiting device, and pressing the DDR4 chip through the pressing devices; the S905X4 platform is connected with an upper computer; and the S905X4 platform tests the DDR4 chip and sends a test result to the upper computer. According to the method provided by the embodiment of the invention, when the DDR4 chip is tested, the DDR4 chip is more convenient to mount and dismount, and the test efficiency can be improved.

Description

Technical Field

[0001] The present invention relates to the field of chip testing technology, and in particular to a chip testing method, electronic equipment and medium based on an S905X4 platform. Background Art

[0002] DDR4, or Double Data Rate 4th Generation Synchronous Dynamic Random Access Memory, is a high-speed computer memory specification. Compared with its predecessor DDR3, DDR4 has significant improvements in speed, power consumption, capacity, etc. During the production process of DDR4 chips, they need to be tested to verify whether their various functions are normal. In the prior art, when testing DDR4 chips, the DDR4 chips are usually soldered to a test circuit board, and the chips are tested through the test circuit board. However, in this way, the DDR4 chips need to be soldered to the test circuit board during testing, and the DDR4 chips cannot be easily removed after the test, and the installation and disassembly of the DDR4 chips are less convenient. Summary of the invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a chip testing method, electronic equipment, and medium based on the S905X4 platform, so that when testing the DDR4 chip, the installation and removal of the DDR4 chip are more convenient.

[0004] In a first aspect, according to a chip testing method based on the S905X4 platform according to an embodiment of the present invention, the method comprises the following steps: Obtain an S905X4 platform; the S905X4 platform is provided with two installation areas, an S905X4 chip is provided between the two installation areas, each installation area is provided with a conductive adhesive, the conductive adhesive is provided with an elastic insulating layer and a plurality of conductive columns penetrating the elastic insulating layer, and the conductive columns correspond to the test pins of the DDR4 chip; A limiting device is placed on the surface of each installation area; the limiting device is provided with a limiting hole adapted to the conductive adhesive; Place two DDR4 chips in the corresponding limiting holes respectively, so that the DDR4 chips are in contact with the corresponding conductive adhesive; A pressing device is placed on each of the limiting devices to press the DDR4 chip through the pressing device; Connect the S905X4 platform to the host computer; According to the test instruction of the host computer, the S905X4 platform tests the DDR4 chip and sends the test result to the host computer.

[0005] According to some embodiments of the present invention, the installation area is provided with a first positioning hole, and the limiting device is provided with a second positioning hole; the step of placing the limiting device on the surface of each installation area includes: Placing the limiting device in the corresponding installation area so that the second positioning hole is aligned with the first positioning hole; Screw the first screw into the first positioning hole and the second positioning hole to fix the limiting device on the S905X4 platform. According to some embodiments of the present invention, the clamping device includes: a base, a pressing block, a connecting rod and a screwing block; wherein the screwing block is arranged on the surface of the base, the connecting rod is inserted into the base, one end of the connecting rod is connected to the screwing block, a connecting column is arranged on the surface of the pressing block, the connecting column is inserted into the base, the pressing block is located below the base, and the other end of the connecting rod is threadedly connected to the connecting column; the step of placing a clamping device on each of the limiting devices and pressing the DDR4 chip by the clamping device includes: Placing the base on the corresponding limiting device so that the pressing block is placed in the limiting hole; The screwing block is rotated to make the connecting rod drive the connecting column and the pressing block to press downward, and the DDR4 chip is pressed tightly by the pressing block. According to some embodiments of the present invention, a limiting member is further provided between the screw block and the base, the limiting member is rotatably provided on the surface of the base, the connecting rod is penetrated through the limiting member, a limiting groove is provided on the surface of the limiting member, a limiting column is provided at the bottom of the screw block, the limiting column is inserted into the limiting groove, a plurality of adjustment holes are further provided on the side of the limiting member, the base is provided with an elastic adjustment switch, the elastic adjustment switch is provided with an adjustment block adapted to the adjustment hole, and the adjustment block is located in one of the adjustment holes; the step of placing a pressing device on each of the limiting devices and pressing the DDR4 chip by the pressing device also includes: Obtaining the thickness of the DDR4 chip; Determining the maximum downward pressing stroke of the pressing block according to the thickness of the DDR4 chip; According to the maximum downward stroke, the elastic adjustment switch is pressed to make the adjustment block leave the current adjustment hole, and the limiting member is rotated to make the new adjustment hole located at the adjustment block, and the elastic adjustment switch is released to place the adjustment block in the new adjustment hole. According to some embodiments of the present invention, a mounting notch is provided on the surface of the base, and the elastic adjustment switch includes: a spring column and a push switch, the spring column is arranged in the mounting notch, the push switch includes a first connecting block and a second connecting block, the first connecting block is horizontally arranged on the spring column, the second connecting block is connected to the first connecting block, and the second connecting block is arranged tilted upward, and the adjustment block is arranged on the surface of the first connecting block. According to some embodiments of the present invention, a scale line is provided at each of the adjustment holes. According to some embodiments of the present invention, a first magnetic member is disposed at the bottom of the base, and a second magnetic member matching the first magnetic member is disposed on the surface of the limiting device; or, the base is disposed with a first threaded hole, and the limiting device is disposed with a second threaded hole matching the first threaded hole; the step of placing the base on the corresponding limiting device so that the pressing block is placed in the limiting hole includes: Placing the base on the limiting device, and fixing the base by the first magnetic attraction member and the second magnetic attraction member; Alternatively, the base is placed on the limiting device, and a second screw is screwed into the first threaded hole and the second threaded hole to fix the base.

[0006] According to some embodiments of the present invention, the base includes a first base body and a second base body hinged to each other.

[0007] In a second aspect, an electronic device according to an embodiment of the present invention includes: A memory for storing program instructions; The processor is used to call the program instructions stored in the memory, and execute the chip testing method based on the S905X4 platform described in the first aspect embodiment according to the obtained program instructions.

[0008] In a third aspect, according to a storage medium of an embodiment of the present invention, the storage medium stores computer executable instructions, and the computer executable instructions are used to enable a computer to execute the chip testing method based on the S905X4 platform described in the embodiment of the first aspect.

[0009] According to the chip testing method, electronic device, and medium based on the S905X4 platform of the embodiment of the present invention, at least the following beneficial effects are achieved: by setting the installation area, the limiting device, and the pressing device, the placement and limiting of the DDR4 chip can be achieved, and the DDR4 chip is connected to the S905X4 platform through the conductive adhesive, so that the S905X4 platform 100 can test the DDR4 chip and send the test results to the host computer. The DDR4 chip does not need to be soldered on the S905X4 platform, and the installation and disassembly are relatively convenient, and two DDR4 chips can be tested at the same time, thereby improving the test efficiency.

[0010] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which: Figure 1 This is a flow chart of the steps of a chip testing method based on the S905X4 platform according to an embodiment of the present invention; Figure 2 It is a schematic diagram of the structure of the S905X4 platform according to an embodiment of the present invention; Figure 3 It is a schematic structural diagram of a limiting device and a pressing device according to an embodiment of the present invention; Figure 4 It is a structural schematic diagram of a pressing device according to an embodiment of the present invention; Figure 5 This is a schematic structural diagram of the pressing device of an embodiment of the present invention after the base is removed; Figure 6 A schematic structural diagram of a clamping device according to an embodiment of the present invention from another perspective; Figure 7 An exploded schematic diagram of a clamping device according to an embodiment of the present invention; Figure 8 It is a structural schematic diagram of a twisting block according to an embodiment of the present invention; Reference numerals: S905X4 platform 100, installation area 110, conductive glue 120, elastic insulating layer 121, conductive column 122, first positioning hole 130, limiting device 200, limiting hole 210, second positioning hole 220, second threaded hole 230, clamping device 300, base 310, first seat body 311, second seat body 312, installation notch 313, pressing block 320, screwing block 330, limiting column 331, connecting rod 340, connecting column 350, limiting member 360, adjusting hole 361, limiting groove 362, through hole 363, elastic adjustment switch 370, adjusting block 371, spring column 372, second connecting block 373, first connecting block 374. DETAILED DESCRIPTION

[0012] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and are not to be construed as limitations on the present application. For the step numbers in the following embodiments, they are only provided for the convenience of explanation, and the order between the steps is not limited in any way, and the execution order of each step in the embodiment can be adaptively adjusted according to the understanding of those skilled in the art.

[0013] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0014] The terms "first", "second", "third" and "fourth" etc. in the specification and claims of the present invention and the drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units that are not listed, or may optionally include other steps or units that are inherent to these processes, methods, products or devices.

[0015] Reference to "embodiments" in the present invention means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0016] During the production process of DDR4 chips, they need to be tested to verify whether their various functions are normal. In the prior art, when testing DDR4 chips, the DDR4 chips are usually soldered to a test circuit board, and the chips are tested through the test circuit board. However, in this way, the DDR4 chips need to be soldered to the test circuit board during testing, and the DDR4 chips cannot be easily removed after the test, making the installation and removal of DDR4 chips inconvenient.

[0017] To this end, the embodiment of the present invention provides a chip testing method, electronic device, and medium based on the S905X4 platform. By setting an installation area, a limiting device, and a pressing device, the placement and limiting of the DDR4 chip can be achieved, and the DDR4 chip is connected to the S905X4 platform through a conductive adhesive, so that the S905X4 platform 100 can test the DDR4 chip and send the test results to the host computer. The DDR4 chip does not need to be soldered on the S905X4 platform, and the installation and removal are relatively convenient, and two DDR4 chips can be tested at the same time, thereby improving the test efficiency.

[0018] The chip testing method, electronic device, and medium based on the S905X4 platform according to an embodiment of the present invention are described in detail below with reference to the accompanying drawings.

[0019] On the one hand, the embodiment of the present invention proposes a chip testing method based on the S905X4 platform, such as Figure 1 As shown, the method comprises the following steps: Step S100: Acquire an S905X4 platform 100; The S905X4 platform 100 is provided with two mounting areas 110, an S905X4 chip is provided between the two mounting areas 110, each mounting area 110 is provided with a conductive adhesive 120, and the conductive adhesive 120 is provided with a conductive column 122; Specifically, Figure 2As shown, in this example, the S905X4 platform 100 is an intelligent platform equipped with an S905X4 chip, which is commonly used in electronic products such as set-top boxes and TV boxes. The S905X4 chip is a quad-core ARM Cortex-A55 processor with a main frequency of up to 2.0GHz and supports a variety of memory and storage configurations. In order to verify whether the DDR4 chip can read and write normally when it is installed on the S905X4 platform 100, in this application, two installation areas 110 are set for the installation position of the DDR4 chip, and the installation area 110 is provided with a conductive glue 120 for connecting to the DDR4 chip. It should be noted that the S905X4 chip can connect two DDR4 chips at the same time, so in order to improve the test efficiency of the DDR4 chip, two installation areas 110 are set so that the two DDR4 chips can be tested at the same time. At the same time, the conductive glue 120 includes an elastic insulating layer 121 and a conductive column 122, a plurality of conductive columns 122 are arranged at intervals in the elastic insulating layer 121 and penetrate the elastic insulating layer 121, a plurality of conductive columns 122 are distributed one-to-one with a plurality of test pins of the DDR4 chip, one end of the conductive column 122 is used to connect the test pin corresponding to the DDR4 chip, and the other end is connected to the test circuit of the S905X4 platform 100, so that the S905X4 platform 100 is connected to the DDR4 chip through the conductive column 122. Since the conductive column 122 is arranged on the elastic insulating layer 121, when the test pin of the DDR4 chip contacts the conductive column 122, the elastic insulating layer 121 can play a certain buffering role, play a certain protective role for the DDR4 chip, and avoid damage to the chip to be tested.

[0020] Step S200: placing a limiting device 200 on the surface of each installation area 110; the limiting device 200 is provided with a limiting hole 210 adapted to the conductive adhesive 120; It should be noted that if Figure 2 and Figure 3 As shown, the limiting device 200 is arranged at the installation area 110, and the limiting device 200 has a limiting hole 210, which is adapted to the conductive adhesive 120. When the DDR4 chip is subsequently installed in the limiting hole 210, the test pin of the DDR4 chip is connected to the conductive column 122, and the limiting hole 210 serves to limit the chip and prevent the DDR4 chip from shifting.

[0021] Furthermore, if Figure 2 and Figure 3 As shown, the installation area 110 is provided with a first positioning hole 130, and the limiting device 200 is provided with a second positioning hole 220, and the first positioning hole 130 and the second positioning hole 220 correspond to each other. The above-mentioned step S200: the step of placing the limiting device 200 on the surface of each installation area 110 includes the following two steps: Step S210: placing the limiting device 200 in the corresponding installation area 110 so that the second positioning hole 220 is aligned with the first positioning hole 130; Step S220 : Screw the first screw into the first positioning hole 130 and the second positioning hole 220 to fix the limiting device 200 on the S905X4 platform 100 .

[0022] Specifically, in this example, by setting four first positioning holes 130 at the four corners of the installation area 110 and setting corresponding four second positioning holes 220 at the four corners of the limiting device 200, when the limiting device 200 is installed, the limiting device 200 can be positioned through the first positioning holes 130 and the second positioning holes 220, and the limiting device 200 can be fixed on the S905X4 platform 100.

[0023] Step S300: placing two DDR4 chips in corresponding limiting holes 210 respectively, so that the DDR4 chips are in contact with corresponding conductive adhesive 120; Specifically, each limiting hole 210 is used to place a DDR4 chip. By placing the DDR4 chip in the limiting hole 210, the test pin of the DDR4 chip is connected to the conductive column 122 of the conductive glue 120, so that the S905X4 platform 100 can be connected to the DDR4 chip through the conductive glue 120, and then the DDR4 chip can be tested. The limiting hole 210 can play a role in positioning the DDR4 chip and prevent the position of the DDR4 chip from being offset.

[0024] Step S400: placing a pressing device 300 on each limiting device 200, pressing the DDR4 chip by the pressing device 300, so that the DDR4 chip is connected to the surface pad 510; like Figure 3 As shown, after the DDR4 chip is placed in the limiting hole 210, although the DDR4 chip can contact the conductive glue 120, there will be poor contact between the test pin of the DDR4 chip and the conductive column 122. Therefore, the DDR4 chip needs to be pressed by the clamping device 300 to ensure the stable connection between the test pin of the DDR4 chip and the conductive column 122.

[0025] Step S500: Connect the S905X4 platform 100 to the host computer; Step S600: According to the test instruction of the host computer, the S905X4 platform 100 tests the DDR4 chip and sends the test result to the host computer. Specifically, the S905X4 platform 100 can be connected to the host computer through a communication interface (such as RS-485, RS232), etc., so as to receive the test instructions of the host computer, and perform the test on the DDR4 chip according to the test instructions, and finally send the test results to the host computer so that the staff can analyze the test results. After the S905X4 platform 100 tests the DDR4 chip, it can verify whether the DDR4 chip can read and write normally on the S905X4 platform 100, and send the test results to the host computer for analysis and display.

[0026] According to the chip testing method based on the S905X4 platform of the embodiment of the present invention, by setting the limiting device 200 and the pressing device 300, the placement and limiting of the DDR4 chip can be achieved, and the DDR4 chip is connected to the S905X4 platform 100 through the conductive adhesive 120, so that the S905X4 platform 100 can test the DDR4 chip and send the test result to the host computer. The DDR4 chip does not need to be welded on the S905X4 platform 100, and the installation and disassembly are relatively convenient, and two DDR4 chips can be tested at the same time, thereby improving the test efficiency.

[0027] Furthermore, if Figure 4 and Figure 5 As shown, in some embodiments of the present invention, the clamping device 300 includes: a base 310, a pressing block 320, a connecting rod 340 and a screwing block 330; wherein, a connecting column 350 is provided on the surface of the pressing block 320, the connecting column 350 is penetrated in the base 310, the pressing block 320 is located below the base 310, the screwing block 330 is provided on the surface of the base 310, the connecting rod 340 is provided in the base 310, one end of the connecting rod 340 is threadedly connected to the connecting column 350, and the other end of the connecting rod 340 is connected to the screwing block 330. The above-mentioned step S400: placing the clamping device 300 on each limiting device 200, and the step of pressing the DDR4 chip by the clamping device 300 includes the following two steps: Step S410: placing the base 310 on the corresponding limiting device 200 so that the pressing block 320 is placed in the limiting hole 210; Step S420: Rotate the screw block 330 to make the connecting rod 340 drive the connecting column 350 and the pressing block 320 to press down, and the pressing block 320 presses the DDR4 chip tightly.

[0028] Specifically, when the screwing block 330 is rotated, the connecting rod 340 will be driven to rotate. Since the connecting rod 340 is threadedly connected to the connecting column 350, when the connecting rod 340 rotates, the connecting column 350 will be driven to descend. The connecting column 350 drives the pressing block 320 to press down, pressing the DDR4 chip, so that the test pin of the DDR4 chip is stably connected to the conductive column 122.

[0029] Furthermore, if Figures 4 to 8 As shown, in some embodiments of the present invention, a limiting member 360 is further provided between the screw block 330 and the base 310, and the limiting member 360 is rotatably provided on the surface of the base 310, and a limiting groove 362 is provided on the surface of the limiting member 360, and a limiting column 331 is provided at the bottom of the screw block 330, and the limiting column 331 is inserted into the limiting groove 362. A plurality of adjustment holes 361 are also provided on the side of the limiting member 360, and the base 310 is provided with an elastic adjustment switch 370, and the elastic adjustment switch 370 is provided with an adjustment block 371 adapted to the adjustment hole 361, and the adjustment block 371 is located in one of the adjustment holes 361; the limiting member 360 is also provided with a through hole 363, so that the connecting rod 340 can pass through the through hole 363 to connect with the screw block 330. The above-mentioned step S400: placing a clamping device 300 on each limiting device 200, and the step of pressing the DDR4 chip by the clamping device 300, includes the following two steps: and also includes the following three steps: Step S430: Obtaining the thickness of the DDR4 chip; Step S440: determining the maximum downward pressing stroke of the pressing block 320 according to the thickness of the DDR4 chip; Step S450: According to the maximum downward stroke, press the elastic adjustment switch 370 to make the adjustment block 371 leave the current adjustment hole 361, and rotate the limiting member 360 to make the corresponding adjustment hole 361 located at the adjustment block 371, release the elastic adjustment switch 370, so that the adjustment block 371 is placed in the corresponding adjustment hole 361.

[0030] It should be noted that, since the DDR4 chip is relatively fragile, if the pressing force of the pressing block 320 is large, it may cause damage to the DDR4 chip. Therefore, it is necessary to control the downward stroke of the pressing block 320 to ensure that the pressing block 320 can press the DDR4 chip tightly without causing damage to the DDR4 chip. To this end, the thickness of the DDR4 chip is first measured, and then the maximum downward stroke of the pressing block 320 is determined, and then the rotation stroke of the screw block 330 is limited by the limiting member 360. Since the surface of the limiting member 360 is provided with a limiting groove 362, and the bottom of the screw block 330 is provided with a limiting column 331, and the limiting column 331 is inserted into the limiting groove 362, the rotation stroke of the screw block 330 can be limited by rotating the position of the limiting groove 362. When the position of the limit slot 362 is to be changed, the elastic adjustment switch 370 is pressed to make the adjustment block 371 leave the current adjustment hole 361, and then the limit member 360 is rotated to place the limit slot 362 at the desired position, and then the elastic adjustment switch 370 is released to place the adjustment block 371 in the new adjustment hole 361, so as to fix the position of the limit member 360 and determine the rotation stroke of the screw block 330. Through the above design, it can be ensured that the pressing block 320 can press the DDR4 chip tightly without damaging the DDR4 chip, and the limit member 360 can be applied to chips of different models.

[0031] Furthermore, if Figure 6 As shown, in some embodiments of the present invention, a mounting notch 313 is provided on the surface of the base 310, and the elastic adjustment switch 370 includes: a spring column 372 and a press switch, the spring column 372 is provided in the mounting notch 313, the press switch includes a first connection block 374 and a second connection block 373, the first connection block 374 is horizontally provided on the spring column 372, the second connection block 373 is connected to the first connection block 374, and the second connection block 373 is tilted upward, and the adjustment block 371 is provided on the surface of the first connection block 374. When the second connection block 373 is pressed, the first connection block 374 will tilt upward, driving the adjustment block 371 to leave the current adjustment hole 361. At this time, after the rotation limiter 360, the second connection block 373 is released, so that the first connection block 374 is reset, and the adjustment block 371 is placed in the new adjustment hole 361.

[0032] Furthermore, in some embodiments of the present invention, each adjustment hole 361 is provided with a scale line, so that the user can determine the specific adjustment stroke when adjusting the limiting member 360, thereby making the adjustment more convenient and accurate.

[0033] Furthermore, in some embodiments of the present invention, a first magnetic member (not shown) is disposed at the bottom of the base 310, and a second magnetic member (not shown) matching the first magnetic member is disposed on the surface of the limiting device 200; or Figure 3As shown, the base 310 is provided with a first threaded hole, and the limiting device 200 is provided with a second threaded hole 230 that matches the first threaded hole. The above step S410: placing the base 310 on the corresponding limiting device 200 so that the pressing block 320 is placed in the limiting hole 210 includes the following two steps: Step S411: placing the base 310 on the limiting device 200, and fixing the base 310 by the first magnetic attraction member and the second magnetic attraction member; Step S412: Alternatively, the base 310 is placed on the limiting device 200 , and the second screw is screwed into the first threaded hole and the second threaded hole 230 to fix the base 310 .

[0034] In the present application, the connection method between the base 310 and the limiting device 200 can be magnetic or threaded. When the magnetic method is used, a first magnetic member is provided at the bottom of the base 310, and a second magnetic member is provided on the surface of the limiting device 200. The base 310 is fixed to the surface of the limiting device 200 by the cooperation of the first magnetic member and the second magnetic member. When the threaded connection method is used, the base 310 is provided with a first threaded hole, and the limiting device 200 is provided with a second threaded hole 230 that cooperates with the first threaded hole. The second screw is screwed into the first threaded hole and the second threaded hole to fix the base 310 on the limiting device 200. Through the above two methods, the detachable connection between the base 310 and the limiting device 200 is realized.

[0035] Furthermore, in some embodiments of the present invention, the base 310 includes a first base body 311 and a second base body 312 which are hinged to each other, and the screw block 330 is arranged on the surface of the first base body 311. When the first base body 311 is opened, it can drive the connecting rod 340, the connecting column 350 and the pressing block 320 to rise above the bottom of the second base body 312. Therefore, under normal circumstances, the second base body 312 can be directly fixed on the limiting device 200, and the first base body 311 is in an open state. When the DDR4 chip is to be pressed, the first base body 311 is closed again, and the screw block 330 is rotated so that the pressing block 320 presses the DDR4 chip.

[0036] On the other hand, an embodiment of the present invention further provides an electronic device, including: A memory for storing program instructions; The processor is used to call the program instructions stored in the memory and execute the above-mentioned chip testing method based on the S905X4 platform according to the obtained program instructions.

[0037] The processor may be implemented by a general-purpose central processing unit (CPU), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present application; The memory can be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device or a random access memory (RAM). The memory can store an operating system and other application programs. When the technical solution provided in the embodiments of this specification is implemented by software or firmware, the relevant program code is stored in the memory, and the processor calls and executes the shift control method of the bicycle electronic transmission in the embodiments of this application; the memory and the processor can be connected through a bus or the like.

[0038] On the other hand, an embodiment of the present invention further provides a storage medium, which is a computer-readable storage medium and stores a computer program. When the computer program is executed by a processor, the above-mentioned chip testing method based on the S905X4 platform is implemented.

[0039] As a non-transient computer-readable storage medium, the memory can be used to store non-transient software programs and non-transient computer executable programs. In addition, the memory may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage devices. In some embodiments, the memory may optionally include a memory remotely arranged relative to the processor, and these remote memories may be connected to the processor via a network. Examples of the above-mentioned networks include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof. The device embodiments described above are merely schematic, wherein the units described as separate components may or may not be physically separated, and are implemented to be located in one place, or may also be distributed to multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the present embodiment.

[0040] Although specific embodiments are described herein, those of ordinary skill in the art will recognize that many other modifications or alternative embodiments are also within the scope of the present disclosure. For example, any of the functions and / or processing capabilities described in conjunction with a particular device or component may be performed by any other device or component. In addition, although various exemplary implementations and architectures have been described according to embodiments of the present disclosure, those of ordinary skill in the art will recognize that many other modifications to the exemplary implementations and architectures described herein are also within the scope of the present disclosure.

[0041] Some aspects of the present disclosure are described above with reference to the block diagram and flow chart of the system, method, system and / or computer program product according to the exemplary embodiments.It should be understood that the combination of one or more blocks in the block diagram and the flow chart and the blocks in the block diagram and the flow chart can be realized by executing computer executable program instructions respectively.Equally, according to some embodiments, some blocks in the block diagram and the flow chart may not need to be executed in the order shown, or may not need to be executed in full.In addition, additional components and / or operations beyond those components and / or operations shown in the blocks in the block diagram and the flow chart may be present in certain embodiments.

[0042] Therefore, the blocks in the block diagrams and flow charts support the combination of devices for performing the specified functions, the combination of elements or steps for performing the specified functions, and the program instruction devices for performing the specified functions. It should also be understood that each block in the block diagrams and flow charts and the combination of blocks in the block diagrams and flow charts can be implemented by a special-purpose hardware computer system or a combination of special-purpose hardware and computer instructions that performs a specific function, element or step.

[0043] The program modules, applications, etc. described herein may include one or more software components, including, for example, software objects, methods, data structures, etc. Each such software component may include computer-executable instructions that, in response to execution, cause at least a portion of the functionality described herein (e.g., one or more operations of the illustrative methods described herein) to be performed.

[0044] Software components can be encoded with any of various programming languages. An exemplary programming language can be a low-level programming language, such as an assembly language associated with a specific hardware architecture and / or an operating system platform. The software component comprising assembly language instructions may need to be converted to executable machine code by an assembler before being executed by hardware architecture and / or platform. Another exemplary programming language can be a higher-level programming language, which can be transplanted across multiple architectures. The software component comprising a higher-level programming language may need to be converted to an intermediate representation by an interpreter or a compiler before execution. Other examples of programming languages ​​include but are not limited to macro languages, shells or command languages, job control languages, scripting languages, database queries or search languages ​​or report writing languages. In one or more exemplary embodiments, the software component comprising the instruction of one of the above-mentioned programming language examples can be directly executed by an operating system or other software components, without first being converted into another form.

[0045] Software components may be stored as files or other data storage structures. Software components of similar type or related functions may be stored together, such as in a specific directory, folder, or library. Software components may be static (e.g., preset or fixed) or dynamic (e.g., created or modified at execution time).

[0046] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

Claims

1. A chip testing method based on the S905X4 platform, characterized in that: The method comprises the following steps: Obtain an S905X4 platform; the S905X4 platform is provided with two installation areas, an S905X4 chip is provided between the two installation areas, each installation area is provided with a conductive adhesive, the conductive adhesive is provided with an elastic insulating layer and a plurality of conductive columns penetrating the elastic insulating layer, and the conductive columns correspond to the test pins of the DDR4 chip; A limiting device is placed on the surface of each installation area; the limiting device is provided with a limiting hole adapted to the conductive adhesive; Place two DDR4 chips in the corresponding limiting holes respectively, so that the DDR4 chips are in contact with the corresponding conductive adhesive; A pressing device is placed on each of the limiting devices to press the DDR4 chip through the pressing device; Connect the S905X4 platform to the host computer; According to the test instruction of the host computer, the S905X4 platform tests the DDR4 chip and sends the test result to the host computer.

2. The chip testing method based on the S905X4 platform according to claim 1, characterized in that: The installation area is provided with a first positioning hole, and the limiting device is provided with a second positioning hole; the step of placing the limiting device on the surface of each installation area includes: Placing the limiting device in the corresponding installation area so that the second positioning hole is aligned with the first positioning hole; Screw the first screw into the first positioning hole and the second positioning hole to fix the limiting device on the S905X4 platform.

3. The chip testing method based on the S905X4 platform according to claim 1, characterized in that: The clamping device comprises: a base, a pressing block, a connecting rod and a screwing block; wherein the screwing block is arranged on the surface of the base, the connecting rod is inserted into the base, one end of the connecting rod is connected to the screwing block, a connecting column is arranged on the surface of the pressing block, the connecting column is inserted into the base, the pressing block is located below the base, and the other end of the connecting rod is threadedly connected to the connecting column; the step of placing a clamping device on each of the limiting devices and pressing the DDR4 chip by the clamping device comprises: Placing the base on the corresponding limiting device so that the pressing block is placed in the limiting hole; The screwing block is rotated to make the connecting rod drive the connecting column and the pressing block to press downward, and the DDR4 chip is pressed tightly by the pressing block.

4. The chip testing method based on the S905X4 platform according to claim 3, characterized in that: A limiting member is also provided between the screwing block and the base, the limiting member is rotatably provided on the surface of the base, the connecting rod is passed through the limiting member, a limiting groove is provided on the surface of the limiting member, a limiting column is provided at the bottom of the screwing block, the limiting column is inserted into the limiting groove, a plurality of adjustment holes are also provided on the side of the limiting member, the base is provided with an elastic adjustment switch, the elastic adjustment switch is provided with an adjustment block adapted to the adjustment hole, and the adjustment block is located in one of the adjustment holes; The step of placing a pressing device on each of the limiting devices and pressing the DDR4 chip by the pressing device also includes: Obtaining the thickness of the DDR4 chip; Determining the maximum downward pressing stroke of the pressing block according to the thickness of the DDR4 chip; According to the maximum downward stroke, the elastic adjustment switch is pressed to make the adjustment block leave the current adjustment hole, and the limiting member is rotated to make the new adjustment hole located at the adjustment block, and the elastic adjustment switch is released to place the adjustment block in the new adjustment hole.

5. The chip testing method based on the S905X4 platform according to claim 4, characterized in that: The surface of the base is provided with a mounting notch, the elastic adjustment switch comprises: a spring column and a push switch, the spring column is arranged in the mounting notch, the push switch comprises a first connecting block and a second connecting block, the first connecting block is horizontally arranged on the spring column, the second connecting block is connected to the first connecting block, and the second connecting block is arranged tilted upward, and the adjustment block is arranged on the surface of the first connecting block.

6. The chip testing method based on the S905X4 platform according to claim 4, characterized in that: Each of the adjustment holes is provided with a scale line.

7. The chip testing method based on the S905X4 platform according to claim 3, characterized in that: The bottom of the base is provided with a first magnetic attraction member, and the surface of the limiting device is provided with a second magnetic attraction member that matches the first magnetic attraction member; or, the base is provided with a first threaded hole, and the limiting device is provided with a second threaded hole that matches the first threaded hole; the step of placing the base on the corresponding limiting device so that the pressing block is placed in the limiting hole includes: Placing the base on the limiting device, and fixing the base by the first magnetic attraction member and the second magnetic attraction member; Alternatively, the base is placed on the limiting device, and a second screw is screwed into the first threaded hole and the second threaded hole to fix the base.

8. The chip testing method based on the S905X4 platform according to claim 3, characterized in that: The base comprises a first base body and a second base body which are hinged to each other.

9. An electronic device, characterized in that: include: A memory for storing program instructions; A processor is used to call the program instructions stored in the memory, and execute the chip testing method based on the S905X4 platform according to any one of claims 1-8 according to the obtained program instructions.

10. A storage medium, characterized in that: The storage medium stores computer executable instructions, and the computer executable instructions are used to enable a computer to execute the chip testing method based on the S905X4 platform according to any one of claims 1 to 8.

Images