Semiconductor etching equipment

Abstract

The invention relates to the technical field of semiconductors, and particularly discloses semiconductor etching equipment, which comprises a specification detection mechanism arranged in a conveying workbench and used for detecting the length and width of a device so as to obtain the area of the device, the device at least has the following beneficial effects that by arranging the specification detection mechanism and the thickness detection mechanism, the length, the width and the thickness in the conveying period can be detected, and then measured data are fed back to the controller.

Description

Technical Field

[0001] The invention relates to the field of semiconductor technology, in particular to semiconductor etching equipment. Background Art

[0002] Semiconductor etching equipment refers to technical equipment that overflows part of the material through chemical reaction or physical impact in the process of manufacturing semiconductors. According to different etching methods, semiconductor etching equipment can be divided into two different etching methods: wet etching and dry etching. Wet etching refers to etching using corrosive chemical solution, while dry etching uses plasma or special gas for etching. However, when the existing semiconductor etching equipment uses wet etching to perform etching work, the etched devices have two different specifications and models. However, when the corrosive chemical solution is used for extraction and use, the area difference between the two devices of different specifications will cause the corrosive chemical solution to be extracted too much or too little, and then the required corrosive chemical etching solution cannot be added according to the specifications of the etched device. In this way, once the entire device encounters a device with a larger specification area during etching work, the extracted corrosive chemical solution is too little, and the etching work cannot be completed. If the device with a smaller specification area is encountered, the extracted corrosive chemical solution is too much, and the solution is accumulated inside the device for many times, which affects the subsequent etching work. For this reason, we propose a semiconductor etching device. Summary of the invention

[0003] The object of the present invention is to provide a semiconductor etching device to solve the problem raised in the above background technology that when the existing semiconductor etching equipment adopts wet etching to perform etching work, the etched devices have two different specifications and models. However, when using a corrosive chemical solution for extraction and use, the difference in area between the two devices of different specifications will cause the corrosive chemical solution to be extracted too much or too little, and thus the required corrosive chemical etching solution cannot be added according to the specifications of the etched device. In this way, once the entire device encounters a device with a larger specification area during the etching work, the extracted corrosive chemical solution is too little, and the etching work cannot be completed. If a device with a smaller specification area is encountered, the extracted corrosive chemical solution is too much, and the solution is accumulated inside the device for many times, which affects the subsequent etching work.

[0004] To achieve the above object, the present invention provides the following technical solution: a semiconductor etching device, comprising:

[0005] A specification detection mechanism is arranged inside the conveying workbench and is used to detect the length and width of the device, thereby obtaining the area of ​​the device;

[0006] A thickness detection mechanism, which is arranged inside the specification detection mechanism and is used in conjunction with the specification detection mechanism to detect the thickness of the device;

[0007] A solution replenishing mechanism, which is disposed inside the conveying workbench and is used to replenish and discharge the etching solution, and to extract the residual etching solution;

[0008] A transmission mechanism, the transmission mechanism is arranged on the top of the specification detection mechanism, and the transmission mechanism is used to adjust the required volume of etching solution according to the area of ​​the device;

[0009] A solution volume regulating mechanism, which is arranged on the top of the solution replenishing mechanism and driven by a transmission mechanism to adjust the amount of etching solution according to the area and thickness of the etching device;

[0010] The drip regulating mechanism is arranged at the bottom of the solution replenishing mechanism, and is used to adjust the size of the droplets discharged by the solution replenishing mechanism.

[0011] Among them, the specification detection mechanism includes a first cylinder fixedly connected to both sides of the conveying workbench, the output ends of the two first cylinders are fixedly connected to a positioning plate, a first slide groove is opened inside the positioning plate, a first motor is fixedly connected to the bottom of the inner wall of the first slide groove, and a bidirectional screw rod is fixedly connected to the output end of the first motor. The outer side of the bidirectional screw rod is threadedly connected to two threaded clamping plates, the two threaded clamping plates are slidably connected to the first slide groove, a first distance sensor is arranged inside the threaded clamping plate, and a second distance sensor is fixedly connected to the top of the threaded clamping plate.

[0012] Among them, the thickness detection mechanism includes a third slide groove opened inside the positioning plate, a first electromagnet is fixedly connected to the top of the inner wall of the third slide groove, two fourth springs are fixedly connected to the top of the inner wall of the third slide groove, a thickness measuring block is fixedly connected to the bottom of the two fourth springs, the thickness measuring block is slidably connected to the third slide groove, a first magnet is fixedly connected to the top of the thickness measuring block and located below the first electromagnet, and a third distance sensor is arranged at the bottom of the thickness measuring block.

[0013] Among them, the solution replenishing mechanism includes two second cylinders fixedly connected to the inner side of the conveying workbench, the output ends of the two second cylinders are fixedly connected to a liquid equalizing plate, two second limiting telescopic rods are fixedly connected between the top of the liquid equalizing plate and the inner side of the conveying workbench, one side of the liquid equalizing plate is fixedly connected to a pump body, the bottom of the liquid equalizing plate is fixedly connected to a plurality of etching heads, and the bottom of the etching head is fixedly connected to an anti-corrosion telescopic rubber head.

[0014] Among them, the transmission mechanism includes a first limiting telescopic rod fixedly connected to one side of the threaded clamping plate, one side of the first limiting telescopic rod is fixedly connected to a fixed rod, the outer side of the fixed rod is slidably connected to a limiting inner empty plate, one side of the liquid equalizing plate is provided with a limiting groove matching the limiting inner empty plate, a connecting plate is fixedly connected between the two limiting inner empty plates, and the top of the connecting plate is fixedly connected to a slope block plate.

[0015] Among them, the solution volume regulating mechanism includes a first fixed plate fixedly connected to the top of the liquid equalizing plate, a second slide groove is opened inside the first fixed plate, and a built-in slide groove plate is slidably connected to the inner wall of the second slide groove, and a first spring is fixedly connected to the bottom of the built-in slide groove plate and located in the second slide groove, and the internal sliding connection of the built-in slide groove plate is limited. The driving plate is fixedly connected to the thickness measuring block, and the top of the liquid equalizing plate is fixedly connected to the temporary storage tank, and a first solenoid valve is arranged inside the temporary storage tank, and a liquid guiding funnel is fixedly connected to the top of the temporary storage tank, and a connecting rod is slidably connected to the internal limit driving plate, and the top of the connecting rod is fixedly connected to a double-headed slope block plate, and a second spring is sleeved on the outside of the connecting rod and located under the double-headed slope block plate, and the bottom of the double-headed slope block plate is fixedly connected to a second limit rod, and the second limit rod is slidably connected to the built-in slide groove plate, and the bottom of the connecting rod and the fixed block located in the temporary storage tank are fixedly connected, and a corrosion-resistant liquid level detector is arranged inside the fixed block.

[0016] Among them, the drip adjustment mechanism includes a motor fixedly connected to the inside of the liquid equal distribution plate, the output end of the motor is fixedly connected to a reciprocating screw, the outer side of the reciprocating screw is threadedly connected to an inner ramp plate, the top of the inner ramp plate is fixedly connected to a third limit rod, and the inside of the liquid equal distribution plate is provided with a limit rod groove that matches the third limit rod. Two semicircular blocks are symmetrically fixedly connected around the etching head, a flip plate is rotatably connected between the two semicircular blocks, one end of the flip plate is fixedly connected to the anti-corrosion telescopic rubber head, and a third spring is fixedly connected between the flip plate and the etching head.

[0017] Among them, two first limiting rods are fixedly connected to one side of the positioning plate, and the two first limiting rods are slidably connected to the conveying workbench.

[0018] Among them, it also includes a dredging mechanism, which is arranged on one side of the solution replenishing mechanism and is used to dredge the droplet discharge head to ensure the smooth progress of subsequent etching work;

[0019] The dredging mechanism includes a second fixed plate fixedly connected to one side of the liquid equalizing plate, a fourth slide groove is provided inside the second fixed plate, an inner wall of the fourth slide groove is slidably connected to the first sliding block, one side of the first sliding block and located in the fourth slide groove is fixedly connected to a fifth spring, the fifth spring is fixedly connected to one side of the inner wall of the fourth slide groove away from the side of the first sliding block, the bottom of the first sliding block is fixedly connected to the third limiting telescopic rod, the bottom of the third limiting telescopic rod is fixedly connected to the multi-head dredging plate, the outer side of the third limiting telescopic rod and located between the second fixed plate and the multi-head dredging plate is provided with a sixth spring, the top of the multi-head dredging plate is fixedly connected to two second electromagnets, the bottom of the second fixed plate is fixedly connected to two third electromagnets, the top of the multi-head dredging plate is fixedly connected to a connecting slide plate, the second fixed plate is provided with a fifth slide groove matching the connecting slide plate, one side of the connecting slide plate and located in the fifth slide groove is fixedly connected to the second magnet, and one side of the inner wall of the fifth slide groove is fixedly connected to the fourth electromagnet.

[0020] Among them, it also includes a solution storage mechanism, which is arranged inside the conveying workbench and is used to store the etching solution and discharge it in time when it is used;

[0021] The solution storage mechanism comprises a solution storage tank arranged inside the conveying workbench, and a second electromagnetic valve is arranged inside the solution storage tank.

[0022] The present invention has at least the following beneficial effects:

[0023] By providing a specification detection mechanism and a thickness detection mechanism, the length, width and thickness during the conveying period can be detected, and the measured data can be fed back to the controller to obtain the area size of the device. At the same time, when measuring the device, the solution volume adjustment mechanism can be driven by the transmission mechanism, and then when measuring devices of two different specifications of large and small areas and thicknesses, the amount of solution required for the large device is twice that of the small device, so that when the solution volume adjustment mechanism is moved, the measured moving height of the large device is twice the moving height of the small device, and then the solution replenishing mechanism can be used to add the liquid level set by the solution volume adjustment mechanism to introduce the required amount of corrosive protective chemical solution. In this way, when encountering two devices of different specifications and models, the problem of introducing too much or too little solution is solved, and then all the solution inside the equipment can be discharged for use for a single device, ultimately ensuring the smooth progress of the etching work. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a rear view schematic diagram of the overall structure of the present invention;

[0025] Figure 2 It is a schematic diagram of the overall structure of the present invention;

[0026] Figure 3 It is a schematic diagram of the structure of the specification detection mechanism, transmission mechanism, solution replenishment mechanism, solution volume adjustment mechanism, drip adjustment mechanism and thickness detection mechanism of the present invention;

[0027] Figure 4 It is a schematic diagram of the top view of the specification detection mechanism of the present invention;

[0028] Figure 5 It is a structural schematic diagram of the specification detection mechanism and the transmission mechanism of the present invention;

[0029] Figure 6 This is a schematic diagram of the internal structure of the positioning plate of the present invention;

[0030] Figure 7 It is a structural schematic diagram of the thickness detection mechanism of the present invention;

[0031] Figure 8 For the present invention Figure 7 A is an enlarged structural diagram;

[0032] Fig. 9 It is a structural schematic diagram of the thickness measuring block of the present invention;

[0033] Fig.10 It is a structural schematic diagram of the solution volume regulating mechanism of the present invention;

[0034] Fig.11 It is a structural schematic diagram of the transmission mechanism of the present invention;

[0035] Fig.12 It is a structural schematic diagram of the drip adjustment mechanism of the present invention;

[0036] Fig.13 It is a schematic diagram of the structure of the etching head, the anti-corrosion telescopic rubber head, the flip plate, the third spring and the semicircular block of the present invention;

[0037] Fig.14 is a schematic diagram of the internal structure of the fourth chute of the present invention;

[0038] Fig.15 It is a structural schematic diagram of the dredging mechanism of the present invention;

[0039] Fig.16 is a schematic diagram of the internal structure of the fifth chute of the present invention;

[0040] Fig.17 It is a structural schematic diagram of the solution storage mechanism of the present invention.

[0041] In the figure: 1. conveying workbench; 2. specification detection mechanism; 21. first cylinder; 22. first limit rod; 23. positioning plate; 24. first slideway; 25. first motor; 26. bidirectional screw rod; 27. threaded clamping plate; 28. first distance sensor; 29. ​​second distance sensor; 3. transmission mechanism; 31. first limit telescopic rod; 32. fixing rod; 33. limit inner empty plate; 34. connecting plate; 35. slope block plate; 36. limit groove; 4. dissolving Liquid replenishing mechanism; 41, second cylinder; 42, second limit telescopic rod; 43, liquid equalizing plate; 44, pump body; 45, etching head; 46, anti-corrosion telescopic rubber head; 5, solution volume adjustment mechanism; 51, first fixed plate; 52, second slide; 53, built-in slide plate; 54, first spring; 55, limit driving plate; 56, connecting rod; 57, double-head slope block plate; 58, second spring; 59, second limit rod; 590, fixed block; 591, Temporary storage tank; 592, first solenoid valve; 593, liquid guide funnel; 594, corrosion-resistant liquid level detector; 6, drip adjustment mechanism; 61, motor; 62, reciprocating screw rod; 63, inner ramp plate; 64, third limit rod; 65, limit rod groove; 66, flip plate; 67, third spring; 68, semicircular block; 7, thickness detection mechanism; 71, third slide groove; 72, thickness measuring block; 73, first electromagnet; 74, first magnet; 75, fourth spring; 76, The third distance sensor; 8. dredging mechanism; 81. the second fixed plate; 82. the fourth slide groove; 83. the first slider; 84. the fifth spring; 85. the third limit telescopic rod; 86. the sixth spring; 87. the multi-head dredging plate; 88. the second electromagnet; 89. the third electromagnet; 890. the fifth slide groove; 891. the fourth electromagnet; 892. the connecting slide plate; 893. the second magnet; 9. the solution storage mechanism; 91. the solution storage tank; 92. the second solenoid valve. DETAILED DESCRIPTION

[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] Embodiment 1

[0044] See also Figures 1 to 17 The present invention provides a technical solution: a semiconductor etching device, comprising:

[0045] The specification detection mechanism 2 is arranged inside the conveying workbench 1, and the specification detection mechanism 2 is used to detect the length and width of the device, and then obtain the area of ​​the device;

[0046] A thickness detection mechanism 7, which is disposed inside the specification detection mechanism 2, and is used in conjunction with the specification detection mechanism 2 to detect the thickness of the device;

[0047] A solution replenishing mechanism 4, which is disposed inside the conveying workbench 1 and is used to replenish and discharge the etching solution, and to extract the residual etching solution;

[0048] A transmission mechanism 3, which is arranged on the top of the specification detection mechanism 2, and is used to adjust the required volume of the etching solution according to the area of ​​the device;

[0049] A solution volume regulating mechanism 5, which is arranged on the top of the solution replenishing mechanism 4, and is driven by the transmission mechanism 3 to adjust the amount of etching solution according to the area and thickness of the etching device;

[0050] A drip regulating mechanism 6, which is disposed at the bottom of the solution replenishing mechanism 4 and is used to adjust the size of the droplets discharged by the solution replenishing mechanism 4;

[0051] By providing the specification detection mechanism 2 and the thickness detection mechanism 7, the length, width and thickness during the conveying period can be detected, and the measured data can be fed back to the controller to obtain the area size of the device. At the same time, when measuring the device, the solution volume adjustment mechanism 5 can be driven by the transmission mechanism 3. When measuring devices of two different specifications of large and small areas and thicknesses, the amount of solution required for the large device is twice that of the small device, so that when the solution volume adjustment mechanism 5 is driven to be moved, the moving height of the large device is measured to be twice that of the small device. After that, the solution replenishing mechanism 4 can be used to add the liquid level set by the solution volume adjustment mechanism 5 to the position, and the required amount of corrosive protective chemical solution can be introduced. In this way, when encountering two devices of different specifications and models, the problem of too much or too little solution being introduced is solved, and all the solution inside the equipment can be discharged for use for a single device, which ultimately ensures the smooth progress of the etching work.

[0052] When in use, the device is transported into the specification detection mechanism 2 through the transport workbench 1, and the operation controller controls the specification detection mechanism 2 to operate to clamp the device for detection, and the device thickness is detected by the thickness detection mechanism 7. When the thickness detection mechanism 7 is in operation, the solution volume adjustment mechanism 5 is driven to move through the transmission mechanism 3. When a large device is transported, the solution volume adjustment mechanism 5 can be raised to twice the liquid level of a small device through the transmission mechanism 3, and then the liquid volume required for etching is adjusted according to the two different sizes of devices, and then the droplet adjustment mechanism 6 is used to adjust the droplet size required for etching, and then the etching work is carried out;

[0053] The specification detection mechanism 2 includes a first cylinder 21 fixedly connected to both sides of the conveying workbench 1, a positioning plate 23 fixedly connected to the output ends of the two first cylinders 21, a first slide groove 24 is provided inside the positioning plate 23, a first motor 25 is fixedly connected to the bottom of the inner wall of the first slide groove 24, a bidirectional screw rod 26 is fixedly connected to the output end of the first motor 25, the outer side of the bidirectional screw rod 26 is threadedly connected to two threaded clamping plates 27, the two threaded clamping plates 27 are slidably connected to the first slide groove 24, a first distance sensor 28 is arranged inside the threaded clamping plate 27, and a second distance sensor 29 is fixedly connected to the top of the threaded clamping plate 27;

[0054] When in use, after the conveying workbench 1 conveys the device to the specification detection mechanism 2, the specification detection mechanism 2 is operated to control the first cylinder 21 to push the positioning plate 23, so that the two positioning plates 23 are close to the two sides of the device, and then the first motor 25 is controlled to operate and rotate the bidirectional screw rod 26, so that the rotating bidirectional screw rod 26 drives the two threaded clamping plates 27 to slide close in the first slide groove 24, so that the two threaded clamping plates 27 clamp and fix the device, and the length and width of the device can be detected by the first distance sensor 28 and the second distance sensor 29, and then the information is fed back to the controller to obtain the area;

[0055] The thickness detection mechanism 7 includes a third slide groove 71 provided inside the positioning plate 23, a first electromagnet 73 is fixedly connected to the top of the inner wall of the third slide groove 71, two fourth springs 75 are fixedly connected to the top of the inner wall of the third slide groove 71, a thickness measuring block 72 is fixedly connected to the bottom of the two fourth springs 75, the thickness measuring block 72 is slidably connected to the third slide groove 71, a first magnet 74 is fixedly connected to the top of the thickness measuring block 72 and located below the first electromagnet 73, and a third distance sensor 76 is arranged at the bottom of the thickness measuring block 72;

[0056] When in use, when thickness detection is performed, the first electromagnet 73 and the first magnet 74 have the same magnetic pole facing each other, and then the controller is operated to energize the first electromagnet 73, so that the first electromagnet 73 pushes the thickness measuring block 72 at the bottom of the first magnet 74 to move downward, and when the thickness measuring block 72 slides downward in the third slide slot 71, the fourth spring 75 is stretched, and then when the bottom of the thickness measuring block 72 is close to the device, the thickness of the device is detected by the third distance sensor 76, and when the first electromagnet 73 is powered off, the thickness measuring block 72 is reset by the stretched fourth spring 75;

[0057] The solution replenishing mechanism 4 includes two second cylinders 41 fixedly connected to the inner side of the conveying workbench 1, the output ends of the two second cylinders 41 are fixedly connected to a liquid equalizing plate 43, two second limiting telescopic rods 42 are fixedly connected between the top of the liquid equalizing plate 43 and the inner side of the conveying workbench 1, one side of the liquid equalizing plate 43 is fixedly connected to a pump body 44, the bottom of the liquid equalizing plate 43 is fixedly connected to a plurality of etching heads 45, and the bottom of the etching head 45 is fixedly connected to an anti-corrosion telescopic rubber head 46;

[0058] When in use, the operation controller controls the second cylinder 41 to adjust the liquid averaging plate 43 to a desired position, and the two second limiting telescopic rods 42 are used to guide and limit the liquid averaging plate 43, and the etching liquid can be discharged through the etching head 45 to perform etching work, and the size of the etching solution droplets can be adjusted by the anti-corrosion telescopic rubber head 46, and the residual liquid in the liquid averaging plate 43 after the etching work is completed can be pumped out through the pump body 44;

[0059] The transmission mechanism 3 includes a first position-limiting telescopic rod 31 fixedly connected to one side of the threaded clamping plate 27, a fixed rod 32 fixedly connected to one side of the first position-limiting telescopic rod 31, a limited inner hollow plate 33 slidably connected to the outer side of the fixed rod 32, a position-limiting groove 36 matched with the limited inner hollow plate 33 is provided on one side of the liquid equalizing plate 43, a connecting plate 34 is fixedly connected between the two limited inner hollow plates 33, and a slope block plate 35 is fixedly connected to the top of the connecting plate 34;

[0060] When in use, the first limit telescopic rod 31 is driven to drive the limit inner empty plate 33 to move through the fixed rod 32, so that the moving limit inner empty plate 33 slides and limits in the limit groove 36, and the limit inner empty plate 33 drives the connecting plate 34 to move, and when the connecting plate 34 moves, it drives the slope block plate 35 to the specified position;

[0061] The solution volume regulating mechanism 5 includes a first fixed plate 51 fixedly connected to the top of the liquid equalizing plate 43, a second chute 52 is provided inside the first fixed plate 51, a built-in chute plate 53 is slidably connected to the inner wall of the second chute 52, a first spring 54 is fixedly connected to the bottom of the built-in chute plate 53 and located in the second chute 52, a limited driving plate 55 is slidably connected inside the built-in chute plate 53, and the limited driving plate 55 is fixedly connected to the thickness measuring block 72, a temporary storage tank 591 is fixedly connected to the top of the liquid equalizing plate 43, and a first solenoid valve 592 is arranged inside the temporary storage tank 591 The top of the temporary storage tank 591 is fixedly connected with a liquid guide funnel 593, the inside of the limit driving plate 55 is slidably connected with a connecting rod 56, the top of the connecting rod 56 is fixedly connected with a double-headed slope block plate 57, the outside of the connecting rod 56 and below the double-headed slope block plate 57 are sleeved with a second spring 58, the bottom of the double-headed slope block plate 57 is fixedly connected with a second limit rod 59, the second limit rod 59 is slidably connected with the built-in slide plate 53, the bottom of the connecting rod 56 and located in the temporary storage tank 591 is fixedly connected with a fixed block 590, and the interior of the fixed block 590 is provided with a corrosion-resistant liquid level detector 594;

[0062] When in use, when the slope block plate 35 moves to the bottom of the double-headed slope block plate 57, and when the thickness detection mechanism 7 is in operation, the built-in slide groove plate 53 will be driven downward by the limit driving plate 55, so that the built-in slide groove plate 53 moving downward slides in the second slide groove 52 to compress the first spring 54, and at the same time, the double-headed slope block plate 57 is driven downward by the second limit rod 59. At this time, the slope block plate 35 drives the double-headed slope block plate 57 to two grid positions, thereby causing the double-headed slope block plate 57 to compress the second spring 58, so that the thickness detection mechanism 7 can bring the fixed block 590 to the required liquid level of the temporary storage tank 591 when measuring the thickness of a small device. When measuring a large device, the slope block plate 35 is moved Move to the bottom of the double-headed slope block plate 57, and at this time control the thickness detection mechanism 7 to drive the double-headed slope block plate 57 to move downward, so that the double-headed slope block plate 57 is raised to the required position under the action of the slope block plate 35, so that the double-headed slope block plate 57 is raised by two grids, and the second spring 58 is stretched by the double-headed slope block plate 57, and then the corrosion-resistant liquid level detector can monitor the introduction of the solution into the temporary storage tank 591 to detect the specified liquid level, and then feed back the information to the controller, and when the required amount of solution in the temporary storage tank 591 is discharged, the first solenoid valve 592 is controlled to open to discharge the solution in the temporary storage tank 591, and the solution in the temporary storage tank 591 is used for a single etching device;

[0063] The drip adjustment mechanism 6 includes a motor 61 fixedly connected to the inside of the liquid equal distribution plate 43, the output end of the motor 61 is fixedly connected to a reciprocating screw 62, the outer side of the reciprocating screw 62 is threadedly connected to an inner ramp plate 63, the top of the inner ramp plate 63 is fixedly connected to a third limit rod 64, the liquid equal distribution plate 43 is provided with a limit rod groove 65 that matches the third limit rod 64, the etching head 45 is symmetrically fixedly connected to two semicircular blocks 68 around, a flip plate 66 is rotatably connected between the two semicircular blocks 68, one end of the flip plate 66 is fixedly connected to the anti-corrosion telescopic rubber head 46, and a third spring 67 is fixedly connected between the flip plate 66 and the etching head 45;

[0064] During use, when the droplet size of the anti-corrosion telescopic rubber head 46 needs to be adjusted, the operating controller controls the motor 61 to run the rotating reciprocating screw 62, so that the rotating reciprocating screw 62 drives the inner ramp plate 63 to move upward, and when the inner ramp plate 63 moves upward, it will drive the third limit rod 64 to slide and limit in the limit rod groove 65, and the slope opened in the inner ramp plate 63 can drive the four flip plates 66 around the etching head 45 to flip close, so that the moving flip plate 66 compresses the third spring 67, and makes the semicircular block 68 pull open the anti-corrosion telescopic rubber head 46, thereby completing the adjustment of the opening size of the anti-corrosion telescopic rubber head 46.

[0065] Embodiment 2

[0066] like Figure 1-17 In the second embodiment, other structures remain unchanged, and the difference from the first embodiment is

[0067] Two first limiting rods 22 are fixedly connected to one side of the positioning plate 23, and the two first limiting rods 22 are slidably connected to the conveying workbench 1. When in use, the first limiting rods 22 can provide a guiding limiting force when the positioning plate 23 moves, thereby preventing position deviation from occurring during measurement work, resulting in inaccurate measurement results.

[0068] It also includes a dredging mechanism 8, which is arranged on one side of the solution replenishing mechanism 4, and is used to dredge the droplet discharge head to ensure that the subsequent etching work proceeds smoothly;

[0069] The dredging mechanism 8 includes a second fixed plate 81 fixedly connected to one side of the liquid equalizing plate 43, a fourth slide groove 82 is provided inside the second fixed plate 81, a first slider 83 is slidably connected to the inner wall of the fourth slide groove 82, a fifth spring 84 is fixedly connected to one side of the first slider 83 and located in the fourth slide groove 82, a side of the fifth spring 84 away from the first slider 83 is fixedly connected to one side of the inner wall of the fourth slide groove 82, a third limiting telescopic rod 85 is fixedly connected to the bottom of the first slider 83, a multi-head dredging plate 87 is fixedly connected to the bottom of the third limiting telescopic rod 85, and a A sixth spring 86 is sleeved on the outer side and located between the second fixed plate 81 and the multi-head dredging plate 87. Two second electromagnets 88 are fixedly connected to the top of the multi-head dredging plate 87. Two third electromagnets 89 are fixedly connected to the bottom of the second fixed plate 81. A connecting slide 892 is fixedly connected to the top of the multi-head dredging plate 87. A fifth slide groove 890 matching the connecting slide 892 is provided inside the second fixed plate 81. A second magnet 893 is fixedly connected to one side of the connecting slide 892 and located in the fifth slide groove 890. A fourth electromagnet 891 is fixedly connected to one side of the inner wall of the fifth slide groove 890.

[0070] During use, when the etching head 45 needs to be unblocked, the fourth electromagnet 891 and the second magnet 893 have opposite magnetic poles facing each other, and the fourth electromagnet 891 is controlled to be powered off, so that the fourth electromagnet 891 no longer attracts the second magnet 893. At this time, the stretched fifth spring 84 drives the first slider 83 to slide in the fourth slide groove 82, and the moving first slider 83 drives the multi-head unblocking plate 87 to move to the bottom of the etching head 45 through the third limiting telescopic rod 85, so that the unblocking rod on the top of the multi-head unblocking plate 87 moves to the bottom of the etching head 45, and then the controller is operated to control the third electromagnet 89 and the second electromagnet 88 to be energized, and the third electromagnet 89 attracts the second The electromagnet 88 approaches, and the upwardly moving multi-head dredging plate 87 compresses the sixth spring 86, and the dredging rod on the top of the multi-head dredging plate 87 enters the etching head 45 to perform dredging work. When the second electromagnet 88 and the third electromagnet 89 are powered off, the dredging rod is brought out by the compressed sixth spring 86. In this way, the second electromagnet 88 and the third electromagnet 89 are repeatedly powered on and off, and the reciprocating dredging work of the etching head 45 is achieved in cooperation with the sixth spring 86. After the dredging is completed, the fourth electromagnet 891 is powered on to attract the second magnet 893, so that the second magnet 893 drives the multi-head dredging plate 87 to reset through the connecting slide 892;

[0071] It also includes a solution storage mechanism 9, which is arranged inside the conveying workbench 1 and is used to store the etching solution and discharge it in time when it is used;

[0072] The solution storage mechanism 9 includes a solution storage tank 91 disposed inside the conveying workbench 1, and a second solenoid valve 92 is disposed inside the solution storage tank 91;

[0073] When in use, the operation of the second solenoid valve 92 is controlled by the controller according to the area of ​​the detection device, thereby controlling the amount of solution discharged from the solution storage tank 91. When the required solution is introduced for discharge, the second solenoid valve 92 is controlled to be closed.

[0074] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0075] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A semiconductor etching device, characterized in that: include: A specification detection mechanism (2), wherein the specification detection mechanism (2) is arranged inside the conveying workbench (1), and the specification detection mechanism (2) is used to detect the length and width of the device, thereby obtaining the area of ​​the device; A thickness detection mechanism (7), wherein the thickness detection mechanism (7) is arranged inside the specification detection mechanism (2), and the thickness detection mechanism (7) is used in conjunction with the specification detection mechanism (2) to detect the thickness of the device; A solution replenishing mechanism (4), wherein the solution replenishing mechanism (4) is arranged inside the conveying workbench (1), and the solution replenishing mechanism (4) is used to replenish and discharge the etching solution, and to extract the residual etching solution; A transmission mechanism (3), wherein the transmission mechanism (3) is arranged on the top of the specification detection mechanism (2), and the transmission mechanism (3) is used to adjust the required volume of etching solution according to the area of ​​the device; A solution volume regulating mechanism (5), wherein the solution volume regulating mechanism (5) is arranged on the top of the solution replenishing mechanism (4), and the solution volume regulating mechanism (5) is driven by the transmission mechanism (3) to regulate the amount of etching solution according to the area and thickness of the etching device; A liquid drop regulating mechanism (6), wherein the liquid drop regulating mechanism (6) is arranged at the bottom of the solution replenishing mechanism (4), and the liquid drop regulating mechanism (6) is used to regulate the size of liquid droplets discharged by the solution replenishing mechanism (4).

2. The semiconductor etching equipment according to claim 1, characterized in that: The specification detection mechanism (2) comprises a first cylinder (21) fixedly connected to both sides of the conveying workbench (1), the output ends of the two first cylinders (21) are fixedly connected to a positioning plate (23), a first slide groove (24) is provided inside the positioning plate (23), a first motor (25) is fixedly connected to the bottom of the inner wall of the first slide groove (24), a bidirectional screw rod (26) is fixedly connected to the output end of the first motor (25), the outer side of the bidirectional screw rod (26) is threadedly connected to two threaded clamping plates (27), the two threaded clamping plates (27) are slidably connected to the first slide groove (24), a first distance sensor (28) is arranged inside the threaded clamping plate (27), and a second distance sensor (29) is fixedly connected to the top of the threaded clamping plate (27).

3. The semiconductor etching equipment according to claim 2, characterized in that: The thickness detection mechanism (7) comprises a third slide groove (71) provided inside the positioning plate (23); a first electromagnet (73) is fixedly connected to the top of the inner wall of the third slide groove (71); two fourth springs (75) are fixedly connected to the top of the inner wall of the third slide groove (71); a thickness measuring block (72) is fixedly connected to the bottom of the two fourth springs (75); the thickness measuring block (72) is slidably connected to the third slide groove (71); a first magnet (74) is fixedly connected to the top of the thickness measuring block (72) and located below the first electromagnet (73); and a third distance sensor (76) is arranged at the bottom of the thickness measuring block (72).

4. The semiconductor etching equipment according to claim 3, characterized in that: The solution replenishing mechanism (4) comprises two second cylinders (41) fixedly connected to the inner side of the conveying workbench (1); the output ends of the two second cylinders (41) are fixedly connected to a liquid equalizing plate (43); two second limiting telescopic rods (42) are fixedly connected between the top of the liquid equalizing plate (43) and the inner side of the conveying workbench (1); one side of the liquid equalizing plate (43) is fixedly connected to a pump body (44); the bottom of the liquid equalizing plate (43) is fixedly connected to a plurality of etching heads (45); the bottom of the etching head (45) is fixedly connected to an anti-corrosion telescopic rubber head (46).

5. The semiconductor etching equipment according to claim 4, characterized in that: The transmission mechanism (3) comprises a first limit telescopic rod (31) fixedly connected to one side of the threaded clamping plate (27); a fixed rod (32) is fixedly connected to one side of the first limit telescopic rod (31); the outer side of the fixed rod (32) is slidably connected to a limit inner hollow plate (33); a limit groove (36) matching the limit inner hollow plate (33) is provided on one side of the liquid equalizing plate (43); a connecting plate (34) is fixedly connected between the two limit inner hollow plates (33); and a slope block plate (35) is fixedly connected to the top of the connecting plate (34).

6. The semiconductor etching equipment according to claim 5, characterized in that: The solution volume adjustment mechanism (5) comprises a first fixed plate (51) fixedly connected to the top of the liquid equalizing plate (43); a second slide groove (52) is provided inside the first fixed plate (51); an inner wall of the second slide groove (52) is slidably connected to an internal slide groove plate (53); a first spring (54) is fixedly connected to the bottom of the internal slide groove plate (53) and located in the second slide groove (52); a limit driving plate (55) is slidably connected inside the internal slide groove plate (53); the limit driving plate (55) is fixedly connected to the thickness measuring block (72); a temporary storage tank (591) is fixedly connected to the top of the liquid equalizing plate (43); a first solenoid valve (592) is provided inside the temporary storage tank (591). The top of the temporary storage tank (591) is fixedly connected with a liquid guide funnel (593), the interior of the limit driving plate (55) is slidably connected with a connecting rod (56), the top of the connecting rod (56) is fixedly connected with a double-headed slope block plate (57), the outer side of the connecting rod (56) and located below the double-headed slope block plate (57) is sleeved with a second spring (58), the bottom of the double-headed slope block plate (57) is fixedly connected with a second limit rod (59), the second limit rod (59) is slidably connected with the built-in slide plate (53), the bottom of the connecting rod (56) and located in the temporary storage tank (591) is fixedly connected with a fixed block (590), and the interior of the fixed block (590) is provided with a corrosion-resistant liquid level detector (594).

7. The semiconductor etching equipment according to claim 6, characterized in that: The drop regulating mechanism (6) comprises a motor (61) fixedly connected to the inside of the liquid equalizing plate (43); the output end of the motor (61) is fixedly connected to a reciprocating screw (62); the outer side of the reciprocating screw (62) is threadedly connected to an inner ramp plate (63); the top of the inner ramp plate (63) is fixedly connected to a third limiting rod (64); the inside of the liquid equalizing plate (43) is provided with a limiting rod groove (65) matched with the third limiting rod (64); two semicircular blocks (68) are symmetrically fixedly connected to the etching head (45) around; a flip plate (66) is rotatably connected between the two semicircular blocks (68); one end of the flip plate (66) is fixedly connected to an anti-corrosion telescopic rubber head (46); and a third spring (67) is fixedly connected between the flip plate (66) and the etching head (45).

8. The semiconductor etching equipment according to claim 2, characterized in that: Two first limiting rods (22) are fixedly connected to one side of the positioning plate (23), and the two first limiting rods (22) are slidably connected to the conveying workbench (1).

9. The semiconductor etching equipment according to claim 4, characterized in that: It also includes a dredging mechanism (8), which is arranged on one side of the solution replenishing mechanism (4), and is used to dredge the droplet discharge head, so as to ensure that subsequent etching work proceeds smoothly; The dredging mechanism (8) comprises a second fixed plate (81) fixedly connected to one side of the liquid equalizing plate (43); a fourth sliding groove (82) is provided inside the second fixed plate (81); a first slider (83) is slidably connected to the inner wall of the fourth sliding groove (82); a fifth spring (84) is fixedly connected to one side of the first slider (83) and located in the fourth sliding groove (82); a side of the fifth spring (84) away from the first slider (83) is fixedly connected to one side of the inner wall of the fourth sliding groove (82); a third limiting telescopic rod (85) is fixedly connected to the bottom of the first slider (83); a multi-head dredging plate (87) is fixedly connected to the bottom of the third limiting telescopic rod (85); and the third limiting telescopic rod (85) is fixedly connected to the inner wall of the fourth sliding groove (82). 5) and is sleeved with a sixth spring (86) on the outer side and located between the second fixed plate (81) and the multi-head dredging plate (87); the top of the multi-head dredging plate (87) is fixedly connected with two second electromagnets (88); the bottom of the second fixed plate (81) is fixedly connected with two third electromagnets (89); the top of the multi-head dredging plate (87) is fixedly connected with a connecting slide plate (892); the interior of the second fixed plate (81) is provided with a fifth slide groove (890) that matches the connecting slide plate (892); one side of the connecting slide plate (892) and located in the fifth slide groove (890) is fixedly connected with a second magnet (893); one side of the inner wall of the fifth slide groove (890) is fixedly connected with a fourth electromagnet (891).

10. The semiconductor etching equipment according to claim 1, characterized in that: It also includes a solution storage mechanism (9), which is arranged inside the conveying workbench (1) and is used to store the etching solution and discharge it in time when in use; The solution storage mechanism (9) comprises a solution storage tank (91) arranged inside the conveying workbench (1), and a second electromagnetic valve (92) is arranged inside the solution storage tank (91).

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