Substrate holding member, substrate processing system, and substrate transport method

Abstract

The invention provides a substrate holding member capable of selectively receiving substrates from a plurality of substrates arranged in a vertical posture in a horizontal direction, a substrate processing system, and a substrate transport method. A substrate holding member according to one embodiment of the present invention comprises: a main body having a first arm part and a second arm part, the front ends of which are spaced apart from each other and the base ends of which are connected to each other; a first holding guide which is fixed to the tip of the first arm and holds the peripheral edge of the substrate; and a second holding guide fixed to the front end portion of the second arm portion for holding the peripheral edge portion of the substrate, the length between the first holding guide and the second holding guide being shorter than the diameter of the substrate, and in the same plane as the first arm portion and the second arm portion, the distance between the first holding guide and the second holding guide is smaller than the diameter of the substrate. The first arm portion, the second arm portion, the first holding guide, and the second holding guide are positioned radially outward of the substrate in a state where the substrate is positioned closer to the base end than the position held by the first holding guide and the second holding guide.

Description

Technical Field

[0001] The present invention relates to a substrate holding component, a substrate processing system and a substrate conveying method. Background Art

[0002] There are known substrate conveying devices that take out and convey (i.e., transport) a substrate held in a vertical posture (see, for example, Patent Documents 1 and 2). There are known conveying robots that clamp and hold a substrate placed on a hand using a pusher (see, for example, Patent Document 3).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2022-57798

[0006] Patent Document 2: Japanese Patent Application Laid-Open No. 9-162157

[0007] Patent Document 3: Japanese Patent Application Publication No. 2009-200476 Summary of the invention

[0008] Technical problem to be solved by the invention

[0009] The present invention provides a technology capable of selectively receiving a substrate from a plurality of substrates arranged in a horizontal direction in a vertical posture.

[0010] Technical solutions for solving technical problems

[0011] A substrate holding component of one embodiment of the present invention includes: a main body, which has a first arm portion and a second arm portion separated by a gap at a front end and connected at a root end; a first holding guide, which is fixed to the front end portion of the first arm portion and is used to hold the peripheral portion of the substrate; and a second holding guide, which is fixed to the front end portion of the second arm portion and is used to hold the peripheral portion of the substrate, the length between the first holding guide and the second holding guide is shorter than the diameter of the substrate, and in the same plane as the first arm portion and the second arm portion, when the substrate is located at a position closer to the root end than the position held by the first holding guide and the second holding guide, the first arm portion, the second arm portion, the first holding guide and the second holding guide are located radially outward of the substrate.

[0012] Effects of the Invention

[0013] According to the present invention, a substrate can be selectively received from a plurality of substrates arranged in a horizontal direction in a vertical posture. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic top view showing a substrate processing system according to an embodiment.

[0015] Figure 2 This is a schematic three-dimensional diagram (1) showing the second interface portion.

[0016] Figure 3 This is a schematic three-dimensional diagram (2) showing the second interface portion.

[0017] Figure 4 is a flowchart showing a substrate processing method according to an embodiment.

[0018] Figure 5 It is a perspective view showing the third transport arm.

[0019] Figure 6 It is a diagram for explaining the end holding position.

[0020] Figure 7 It is a figure explaining the back side holding position.

[0021] Figure 8 It is a diagram illustrating the position where a substrate passes.

[0022] Fig. 9 FIG. (1) is a diagram showing the substrate receiving action.

[0023] Fig.10 FIG. (2) is a diagram showing the substrate receiving action.

[0024] Fig.11 FIG. (3) is a diagram showing the substrate receiving action.

[0025] Fig.12 FIG. (4) is a diagram showing the substrate receiving action.

[0026] Fig.13 FIG. (5) is a diagram showing the substrate receiving action.

[0027] Fig.14 FIG. (1) is a diagram showing the substrate transfer action.

[0028] Fig.15 FIG. (2) is a diagram showing the substrate transfer action.

[0029] Fig.16 FIG. (3) is a diagram showing the substrate transfer action.

[0030] Fig.17 FIG. (4) is a diagram showing the substrate transfer action.

[0031] Fig.18 FIG. (5) is a diagram showing the substrate transfer action.

[0032] Description of Reference Numerals

[0033] 53a The third conveyor arm

[0034] 110 Main Body

[0035] 111 First arm

[0036] 111a Front end

[0037] 112 Second arm

[0038] 112a Front end

[0039] 120 first retaining guide

[0040] 130 second holding guide

[0041] W substrate. DETAILED DESCRIPTION

[0042] Hereinafter, non-limiting exemplary embodiments of the present invention will be described with reference to the accompanying drawings. In all the drawings, the same or corresponding parts or components are marked with the same or corresponding reference numerals, and repeated descriptions are omitted. In this specification, the X-axis direction, the Y-axis direction, and the Z-axis direction are mutually perpendicular directions. The X-axis direction and the Y-axis direction are horizontal directions, and the Z-axis direction is a vertical direction.

[0043] [Substrate processing system]

[0044] Reference Figures 1 to 3 , a substrate processing system according to an embodiment of the present invention is described. Figure 1 As shown, the substrate processing system 1 includes a loading and unloading unit 2 , a first interface unit 3 , a batch processing unit 4 , a second interface unit 5 , a single-wafer processing unit 6 , and a control device 9 .

[0045] The loading and unloading section 2 serves as both a loading section and an unloading section. Therefore, the substrate processing system 1 can be miniaturized. The loading and unloading section 2 includes a loading port 21 , a stocker 22 , a loader 23 , and a cassette transport device 24 .

[0046] The loading port 21 is arranged on the negative side of the loading and unloading section 2 in the X-axis direction. There are a plurality of loading ports 21 (for example, 4) arranged along the Y-axis direction. However, the number of loading ports 21 is not particularly limited. A box C is placed at the loading port 21. The box C accommodates a plurality of (for example, 25) substrates W, which are loaded and unloaded relative to the loading port 21. Inside the box C, the substrate W is held horizontally and held in the vertical direction at a second pitch P2 (P2=N×P1) that is N times the first pitch P1. N is a natural number greater than 2, and is 2 in the present embodiment, but may also be greater than 3.

[0047] The accumulator 22 is configured with multiple (for example, 4) in the X-axis direction center of the carrying-in and carrying-out part 2 along the Y-axis direction. The accumulator 22 is configured with multiple (for example, two) adjacent to the first interface part 3 along the Y-axis direction on the X-axis direction positive side of the carrying-in and carrying-out part 2. The accumulator 22 can also be configured with multiple layers in the vertical direction. The accumulator 22 temporarily keeps the box C that contains the substrate W before the cleaning process, the box C that is empty inside after taking out the substrate W, etc. In addition, the number of the accumulator 22 is not particularly limited.

[0048] The loader 23 is adjacent to the first interface unit 3 and is arranged on the positive side of the loading and unloading unit 2 in the X-axis direction. The cassette C can be placed on the loader 23. The loader 23 is provided with a cover opening and closing mechanism (not shown) for opening and closing the cover of the cassette C. There may be multiple loaders 23. The loaders 23 may be arranged in multiple layers in the vertical direction.

[0049] The box conveying device 24 is, for example, a multi-joint conveying robot and conveys the box C between the loading port 21 , the stocker 22 , and the loader 23 .

[0050] The first interface 3 is disposed on the positive side in the X-axis direction of the loading / unloading section 2. The first interface 3 transports the substrate W between the loading / unloading section 2, the batch processing section 4, and the single-wafer processing section 6. The first interface 3 includes a substrate transfer device 31, a lot forming section 32, and a first transfer station 33.

[0051] The substrate transfer device 31 transports the substrate W between the cassette C placed on the loader 23, the batch forming unit 32, and the first transfer station 33. The substrate transfer device 31 is composed of a multi-axis (e.g., 6-axis) arm robot, and has a substrate holding arm 31a at its front end. The substrate holding arm 31a has a plurality of holding claws (not shown) that can hold a plurality of (e.g., 25) substrates W. The substrate holding arm 31a can take any position and posture in a three-dimensional space while holding the substrate W with the holding claws.

[0052] The batch forming section 32 is disposed on the positive side in the X-axis direction of the first interface section 3. The batch forming section 32 forms a batch L by holding a plurality of substrates W at a first pitch P1.

[0053] The first transfer station 33 is adjacent to the single wafer processing unit 6 and is disposed on the positive side in the Y-axis direction of the first interface unit 3. The first transfer station 33 receives the substrate W from the fourth transport device 61 and temporarily stores it until it is delivered to the loading / unloading unit 2.

[0054] The batch processing unit 4 is arranged on the positive side of the first interface unit 3 in the X-axis direction. That is, the loading and unloading unit 2, the first interface unit 3 and the batch processing unit 4 are arranged in this order from the negative side of the X-axis direction to the positive side of the X-axis direction. The batch processing unit processes a batch L together, and the batch L contains a plurality of (for example, 50 or 100) substrates W at a first pitch P1. One batch L, for example, is composed of substrates W in M ​​boxes C. M is a natural number greater than 2. M can be a natural number the same as N, or a natural number different from N. The batch processing unit 4 has a liquid tank 41, a rinse tank 42, a first conveying device 43, a processing tool 44 and a driving device 45.

[0055] The chemical tank 41 and the rinse tank 42 are arranged along the X-axis direction. For example, the chemical tank 41 and the rinse tank 42 are arranged in sequence from the positive side of the X-axis direction to the negative side of the X-axis direction. In addition, the chemical tank 41 and the rinse tank 42 are collectively referred to as a processing tank. The number of chemical tanks 41 and rinse tanks 42 is not limited to Figure 1 For example, the drug solution tank 41 and the rinse solution tank 42 are Figure 1 There is 1 group in the example, but there can be multiple groups.

[0056] The chemical solution tank 41 stores the chemical solution for dipping the batch L. The chemical solution is, for example, a phosphoric acid aqueous solution (H 3 PO 4 ). The phosphoric acid aqueous solution selectively etches and removes the silicon oxide film and the silicon nitride film in the silicon nitride film. The chemical solution is not limited to the phosphoric acid aqueous solution. For example, it can also be DHF (dilute hydrofluoric acid), BHF (a mixture of hydrofluoric acid and ammonium fluoride), dilute sulfuric acid, SPM (a mixture of sulfuric acid, hydrogen peroxide and water), SC1 (a mixture of ammonia, hydrogen peroxide and water), SC2 (a mixture of hydrochloric acid, hydrogen peroxide and water), TMAH (a mixture of tetramethylammonium hydroxide and water), a plating solution, etc. The chemical solution can be used for stripping treatment or plating treatment. The number of chemical solutions is not particularly limited and can be multiple.

[0057] The rinse liquid tank 42 stores a first rinse liquid in which the batch L is immersed. The first rinse liquid is pure water for removing the chemical solution from the substrate W, for example, DIW (deionized water).

[0058] The first conveying device 43 has a guide rail 43a and a first conveying arm 43b. The guide rail 43a is arranged at a position closer to the negative side of the Y-axis direction than the processing tank. The guide rail 43a extends from the first interface part 3 to the batch processing part 4 along the horizontal direction (X-axis direction). The first conveying arm 43b moves in the horizontal direction (X-axis direction) along the guide rail 43a. The first conveying arm 43b can move in the vertical direction or rotate around the vertical axis. The first conveying arm 43b conveys the batch L between the first interface part 3 and the batch processing part 4.

[0059] The processing tool 44 receives the batch L from the first transfer arm 43 b and holds the batch L. The processing tool 44 holds the plurality of substrates W at a first pitch P1 in the Y-axis direction and holds the plurality of substrates W vertically.

[0060] The driving device 45 moves the treatment tool (treatment piece) 44 in the X-axis direction and the Z-axis direction. The treatment tool 44 immerses the batch L in the drug solution stored in the drug solution tank 41, then immerses the batch L in the first rinse solution stored in the rinse solution tank 42, and then transfers the batch L to the first conveying device 43.

[0061] The number of the treatment tool 44 and the driving device 45 units is one in this embodiment, but may be more than one. In the latter case, one unit immerses the batch L in the drug solution stored in the drug solution tank 41, and the other unit immerses the batch L in the first rinse solution stored in the rinse solution tank 42. In this case, the driving device 45 only needs to move the treatment tool 44 along the Z-axis direction, and may not move the treatment tool 44 along the X-axis direction.

[0062] The second interface 5 is disposed on the positive side in the Y-axis direction of the batch processing unit 4. The second interface 5 transports the substrate W between the batch processing unit 4 and the single wafer processing unit 6. The second interface 5 includes a dipping tank 51, a second transport device 52, a third transport device 53, a second transfer stage 54, and a pushing member 55.

[0063] The immersion tank 51 is arranged outside the moving range of the first conveying arm 43b. For example, the immersion tank 51 is arranged at a position offset to the positive side of the Y-axis direction relative to the processing tank. The immersion tank 51 stores the second rinsing liquid for the batch L to be immersed therein. The second rinsing liquid is, for example, DIW (deionized water). The substrate W is kept in the second rinsing liquid until it is lifted from the second rinsing liquid by the third conveying device 53. Since the substrate W exists below the liquid surface of the second rinsing liquid, the surface tension of the second rinsing liquid does not act on the substrate W, which can prevent the collapse of the concave-convex pattern of the substrate W. The immersion tank 51 can also be configured to be movable in the X-axis direction. In this case, when the batch L is immersed in the immersion tank 51, the positional offset in the X-axis direction between the immersion tank 51 and the batch L can be corrected. The X-axis drive device (not shown) that moves the immersion tank 51 in the X-axis direction is, for example, installed on the lower surface of the immersion tank 51.

[0064] The second transport device 52 includes a Y-axis driving device 52 a , a Z-axis driving device 52 b , and a second transport arm 52 c .

[0065] The Y-axis drive device 52a is arranged on the positive side of the second interface portion 5 in the X-axis direction. The Y-axis drive device 52a extends from the second interface portion 5 to the batch processing portion 4 in the horizontal direction (Y-axis direction). The Y-axis drive device 52a moves the Z-axis drive device 52b and the second conveying arm 52c in the Y-axis direction. The Y-axis drive device 52a may include a ball screw. The Y-axis drive device 52a is an example of a horizontal drive device.

[0066] The Z-axis drive device 52b is movably mounted on the Y-axis drive device 52a. The Z-axis drive device 52b moves the second conveying arm 52c in the Z-axis direction. The Z-axis drive device 52b may include a ball screw. The Z-axis drive device 52b is an example of a vertical drive device.

[0067] The second conveying arm 52c is movably mounted on the Z-axis drive device 52b. The second conveying arm 52c is configured to be able to keep a plurality of substrates W at intervals from each other. The second conveying arm 52c receives and holds the batch L from the first conveying arm 43b. The second conveying arm 52c holds a plurality of substrates W at a first pitch P1 in the Y-axis direction. The second conveying arm 52c holds a plurality of substrates W in a vertical posture respectively. The second conveying arm 52c is an example of a vertical holding member. The second conveying arm 52c moves in the Y-axis direction and the Z-axis direction by the Y-axis drive device 52a and the Z-axis drive device 52b. The second conveying arm 52c is configured to be able to move between a plurality of positions including a handover position, an immersion position and a standby position. The second conveying arm 52c can also be configured to be able to move in the X-axis direction. In this case, when the batch L is immersed in the immersion tank 51, the positional offset in the X-axis direction between the immersion tank 51 and the batch L can be corrected. An X-axis drive device (not shown) that moves the second transport arm 52c in the X-axis direction is movably mounted on the Z-axis drive device 52b, for example. In this case, the second transport arm 52c is movably mounted on the X-axis drive device.

[0068] The handover position is a position where the first transport arm 43 b and the second transport arm 52 c hand over the batch L. The handover position is a position on the negative side in the Y-axis direction and on the positive side in the Z-axis direction.

[0069] The immersion position is a position where the batch L is immersed in the immersion tank 51. The immersion position is a position on the positive side in the Y-axis direction and on the negative side in the Z-axis direction relative to the handover position.

[0070] The standby position is the position where the second conveying arm 52c stands by when the handover of the batch L and the dipping of the batch L into the dipping tank 51 are not performed. The standby position is directly below the handover position (negative side in the Z-axis direction), and is a position that does not hinder the movement of the first conveying arm 43b. In this case, since the second conveying arm 52c can be moved to the handover position only by moving upward (positive side in the Z-axis direction), productivity is improved. The standby position can also be the same position as the dipping position. In this case, it is possible to prevent particles that may be generated as the first conveying device 43 moves from adhering to the second conveying arm 52c. The standby position can also be a position directly above the dipping position (positive side in the Z-axis direction). In this way, by setting the standby position at a position different from the handover position, it is possible to prevent the first conveying arm 43b from contacting the second conveying arm 52c.

[0071] The second transport device 52 moves the second transport arm 52c to the immersion position or the standby position during the operation of the first transport device 43. In this case, it is possible to prevent the first transport arm 43b from contacting the second transport arm 52c.

[0072] The third conveying device 53 is composed of a multi-axis (e.g., 6-axis) arm robot. The third conveying device 53 has a third conveying arm 53a at the front end. The third conveying arm 53a is configured to hold the substrate W. The third conveying arm 53a can take any position and posture in a three-dimensional space while holding the substrate W. The third conveying device 53 conveys the substrate W between the second conveying arm 52c located at the immersion position and the second transfer station 54. Specifically, first, as Figure 2 As shown in FIG. 1 , the third transport arm 53a receives the substrate W in a vertical posture held by the second transport arm 52c located at the immersion position. Figure 3 As shown, the third conveying arm 53a changes the substrate W from the vertical posture to the horizontal posture. Then, the third conveying arm 53a delivers the substrate W in the horizontal posture to the second handover station 54. At this time, since the immersion tank 51 is configured outside the moving range of the first conveying arm 43b, the first conveying arm 43b and the third conveying arm 53a do not interfere with each other. Thus, one of the first conveying device 43 and the third conveying device 53 can be independently operated without relying on the operating state of the other. Therefore, since the first conveying device 43 and the third conveying device 53 can be operated at any time (timing, opportunity), the time required for the transportation of the substrate W can be shortened. As a result, the productivity of the substrate processing system 1 is improved.

[0073] The second handover station 54 is adjacent to the single chip processing unit 6 and is configured on the negative side of the X-axis direction of the second interface unit 5. The second handover station 54 receives the substrate W from the third conveying device 53 and temporarily keeps it until it is handed over to the single chip processing unit 6. The substrate W taken out from the immersion tank 51 is placed on the second handover station 54. The second handover station 54 keeps the substrate W in a horizontal posture. The second handover station 54 is an example of a horizontal holding member. The substrate W placed on the second handover station 54 is, for example, preferably in a state where the surface is wetted by the second rinse liquid. In this case, the surface tension of the second rinse liquid does not act on the substrate W, and the collapse of the concave-convex pattern of the substrate W can be suppressed. The second handover station 54 can also be configured with multiple layers (for example, two layers) in the vertical direction.

[0074] The second transfer platform 54 has a loading plate 54a and three pins 54b. The loading plate 54a has, for example, a rectangular plate shape. The loading plate 54a may also have a circular plate shape. The pins 54b are arranged on the loading plate 54a. In the present embodiment, the number of the pins 54b is three, but it may be four or more. The three pins 54b are arranged to form an equilateral triangle when viewed from above. The pins 54b support the substrate W from below above the loading plate 54a.

[0075] The push-against component 55 is arranged at each second handover platform 54. The push-against component 55 is configured above each loading plate 54a and on the negative side of the X-axis direction of each loading plate 54a. In this case, the moving distance of the third conveying arm 53a from the position where the substrate W is pushed against the push-against component 55 to the position where the substrate W is handed over to the second handover platform 54 becomes shorter. The position where the push-against component 55 is set is not limited to this. The push-against component 55 can also be set at other positions as long as it is set at the position that the third conveying arm 53a can reach. For example, the push-against component 55 can also be configured between the second handover platforms 54 adjacent in the vertical direction and at a position closer to the positive side of the X-axis direction than the second handover platform 54. In this case, compared with the situation where the push-against component 55 is set at each second handover platform 54, the number of the push-against component 55 can be reduced. The push-against component 55 contacts the substrate W held by the third conveying arm 53a, so that the substrate W moves horizontally relative to the third conveying arm 53a.

[0076] The single-wafer processing unit 6 is arranged on the negative side of the second interface unit 5 in the X-axis direction and on the positive side of the Y-axis direction of the loading / unloading unit 2, the first interface unit 3 and the batch processing unit 4. The single-wafer processing unit 6 processes the substrates W one by one. The single-wafer processing unit 6 includes a fourth conveying device 61, a liquid processing device 62 and a drying device 63.

[0077] The fourth conveying device 61 has a guide rail 61a and a fourth conveying arm 61b. The guide rail 61a is arranged on the negative side of the single-chip processing unit 6 in the Y-axis direction. The guide rail 61a extends in the horizontal direction (X-axis direction) in the single-chip processing unit 6. The fourth conveying arm 61b moves in the horizontal direction (X-axis direction) and the vertical direction along the guide rail 61a, and rotates around the vertical axis (vertical axis). The fourth conveying arm 61b conveys the substrate W between the second transfer station 54, the liquid processing device 62, the drying device 63 and the first transfer station 33. The number of the fourth conveying arm 61b can be either one or more. In the latter case, the fourth conveying device 61 conveys multiple (for example, 5) substrates W at a time.

[0078] The liquid treatment device 62 is arranged on the positive side of the X-axis direction and the positive side of the Y-axis direction of the monolithic processing unit 6. The liquid treatment device 62 is a monolithic type, and treats the substrates W one by one (one by one) with the treatment liquid. The liquid treatment device 62 is configured with multiple layers (for example, 3 layers) in the vertical direction (Z-axis direction). Thus, multiple substrates W can be treated with the treatment liquid at the same time. The treatment liquid can be of multiple types, for example, pure water such as DIW and a dry liquid with a lower surface tension than pure water. The dry liquid can be, for example, an alcohol such as IPA (isopropyl alcohol).

[0079] The drying device 63 is arranged adjacent to the liquid processing device 62 on the negative side in the X-axis direction. In this case, the end face on the positive side in the Y-axis direction of the single-chip processing unit 6 and the end face on the positive side in the Y-axis direction of the second interface unit 5 can be arranged to be on one plane (flush) or approximately on one plane. Therefore, since there is almost no dead zone, the occupied area of ​​the substrate processing system 1 can be reduced. In contrast, when the drying device 63 is arranged adjacent to the liquid processing device 62 on the positive side in the Y-axis direction, the end face on the positive side in the Y-axis direction of the single-chip processing unit 6 protrudes more than the end face on the positive side in the Y-axis direction of the second interface unit 5, and a dead zone may be generated. The drying device 63 is a single-chip type, and a supercritical fluid is used to dry the substrates W one by one. The drying device 63 is arranged in multiple layers (for example, 3 layers) in the vertical direction. Thus, multiple substrates W can be dried simultaneously.

[0080] It is also possible that both the liquid processing device 62 and the drying device 63 are not of a single-wafer type, or that the liquid processing device 62 is of a single-wafer type and the drying device 63 is of a batch type. The drying device 63 may also use a supercritical fluid to dry a plurality of substrates W at once. The number of substrates W processed at once in the drying device 63 may be greater than the number of substrates W processed at once in the liquid processing device 62, but may also be less. Devices other than the liquid processing device 62 and the drying device 63 may also be arranged in the single-wafer processing unit 6.

[0081] The control device 9 is, for example, a computer. The control device 9 includes a CPU (Central Processing Unit) 91 and a recording medium 92 such as a memory. The recording medium 92 stores programs for controlling various processes performed in the substrate processing system 1. The control device 9 controls the operation of the substrate processing system 1 by causing the CPU 91 to execute the program stored in the recording medium 92. The control device 9 includes an input interface 93 and an output interface 94. The control device 9 receives signals from the outside through the input interface 93 and sends signals to the outside through the output interface 94.

[0082] The above-mentioned program is stored in a computer-readable recording medium, for example, and is installed from the recording medium to the recording medium 92 of the control device 9. Examples of the computer-readable recording medium include a hard disk (HD), a floppy disk (FD), a compact disk (CD), a magneto-optical disk (MO), a memory card, etc. Among them, the program can also be downloaded from a server via the Internet and installed in the recording medium 92 of the control device 9.

[0083] In the substrate processing system 1 , the substrate W is transported from the loading / unloading section 2 to the first interface section 3 , the batch processing section 4 , the second interface section 5 , and the single-wafer processing section 6 in this order, and then returned to the loading / unloading section 2 .

[0084] [Operation of the substrate processing system]

[0085] Reference Figure 4 , the operation of the substrate processing system 1 according to the embodiment, that is, the substrate processing method, will be described. Figure 4 The processing shown is carried out under the control of the control device 9 .

[0086] First, the cassette C is carried into the loading and unloading section 2 in a state of storing a plurality of substrates W, and is placed on the loading port 21. The substrates W are held horizontally inside the cassette C, and are held at a second pitch P2 (P2 = N × P1) in the vertical direction. N is a natural number greater than or equal to 2, and is 2 in the present embodiment, but may be 3 or greater.

[0087] Next, the cartridge transport device 24 transports the cartridge C from the loading port 21 to the loader 23. The cartridge C transported to the loader 23 has its cover opened by the cover opening and closing mechanism.

[0088] Next, the substrate transfer device 31 receives the substrate W stored in the box C ( Figure 4 S101) and transport it to the batch forming unit 32.

[0089] Next, the batch forming unit 32 holds a plurality of substrates W at a first pitch P1 (P1=P2 / N) to form a batch L ( Figure 4One batch L, for example, is composed of substrates W in M ​​boxes C. Since the pitch of the substrates W is narrowed from the second pitch P2 to the first pitch P1, the number of substrates W that can be processed at once can be increased.

[0090] Next, the first conveying device 43 receives the batch L from the batch forming unit 32 and conveys it to the processing tool 44 .

[0091] Next, the treatment tool 44 descends from the top of the chemical solution tank 41, immerses the batch L in the chemical solution, and performs chemical solution treatment ( Figure 4 Then, the treatment tool 44 rises to lift the batch L from the liquid medicine, and then moves in the horizontal direction (towards the negative side in the X-axis direction) toward the top of the rinse liquid tank 42.

[0092] Next, the treatment tool 44 descends from the top of the rinse liquid tank 42, immerses the batch L in the first rinse liquid, and performs the rinse liquid treatment ( Figure 4 After that, the processing device 44 rises to lift the batch L from the first rinse liquid. Then, the first conveying device 43 receives the batch L from the processing device 44 and transfers it to the second conveying device 52.

[0093] Next, the second conveying arm 52c of the second conveying device 52 moves in the horizontal direction (toward the positive side in the Y-axis direction) and descends from above the immersion tank 51 to immerse the batch L in the second rinse liquid ( Figure 4 The plurality of substrates W of the batch L are kept in the second rinsing liquid until they are lifted from the second rinsing liquid by the third conveying device 53. Since the substrates W are below the liquid surface of the second rinsing liquid, the surface tension of the second rinsing liquid does not act on the substrates W, thereby preventing the concave-convex pattern of the substrates W from collapsing.

[0094] Next, the third transport device 53 transports the substrates W of the batch L held by the second transport arm 52c in the second rinse liquid to the second transfer stage 54. The third transport device 53 transports the substrates W to the second transfer stage 54 one by one.

[0095] Next, the fourth transport device 61 receives the substrate W from the second transfer station 54 and transports it to the liquid processing device 62 .

[0096] Next, the liquid processing device 62 processes the substrates W one by one with the liquid ( Figure 4 The liquid may be a plurality of liquids, for example, pure water such as DIW and a drying liquid having a lower surface tension than pure water. The drying liquid may be, for example, an alcohol such as IPA. The liquid processing device 62 sequentially supplies pure water and drying liquid to the upper surface of the substrate W to form a liquid film of the drying liquid.

[0097] Next, the fourth transport device 61 receives the substrate W from the liquid processing device 62 and horizontally holds the substrate W with the liquid film of the drying liquid facing upward. The fourth transport device 61 transports the substrate W from the liquid processing device 62 to the drying device 63 .

[0098] Next, the drying device 63 uses the supercritical fluid to dry the substrates W one by one ( Figure 4 S105). The drying liquid can be replaced by the supercritical fluid, and the collapse of the concave-convex pattern of the substrate W caused by the surface tension of the drying liquid can be suppressed. The supercritical fluid requires a pressure-resistant container, so in order to miniaturize the pressure-resistant container, batch processing is not performed, but single-chip processing is performed.

[0099] In addition, the drying device 63 is a single-chip type in this embodiment, but as mentioned above, it can also be a batch type. The batch type drying device 63 uses a supercritical fluid to dry a plurality of substrates W formed with a liquid film at once. The single-chip drying device 63 has a conveying arm for holding the substrate W, while the batch type drying device 63 has a plurality of conveying arms.

[0100] Next, the fourth transport device 61 receives the substrate W from the drying device 63 and transports it to the first transfer station 33 .

[0101] Next, the substrate transfer device 31 receives the substrate W from the first transfer station 33 and stores it in the box C ( Figure 4 The box C is unloaded from the loading / unloading section 2 in a state where the plurality of substrates W are stored.

[0102] [Third conveyor arm]

[0103] Reference Figures 5 to 8 , the third transport arm 53a will be described. Figure 5 It is a perspective view showing the third transport arm 53a. Figure 6 It is a diagram for explaining the end holding position. Figure 6 (a) is a diagram when viewed from above from a direction perpendicular to the front side (surface) Wa of the substrate W. Figure 6 (b) is Figure 6 This is a cross-sectional view when viewed in the direction of arrow 6B-6B in (a). Figure 6 (c) is an enlarged perspective view of the first holding guide 120 . Figure 7 It is a figure explaining the back side holding position. Figure 7 (a) is a diagram when viewed from above from a direction perpendicular to the front surface Wa of the substrate W. Figure 7 (b) is Figure 7 This is a cross-sectional view when viewed in the direction of arrow 7B-7B in (a). Figure 7 (c) is an enlarged perspective view of the first holding guide 120 . Figure 8 It is a diagram illustrating the position where a substrate passes. Figure 8(a) is a diagram when viewed from above from a direction perpendicular to the front surface Wa of the substrate W. Figure 8 (b) is Figure 8 This is a cross-sectional view when viewed in the direction of arrow 8B-8B in (a).

[0104] The third transport arm 53 a is an example of a substrate holding member and includes a main body 110 , a first holding guide 120 , a second holding guide 130 , a first clamping member 140 , a second clamping member 150 , and a back surface holding mechanism 160 .

[0105] The main body 110 has a substantially U-shape. The main body 110 has a first surface 110a and a second surface 110b. The second surface 110b is a surface opposite to the first surface 110a. The main body 110 has a first arm 111 and a second arm 112. The first arm 111 includes a front end 111a and a root end 111b. The second arm 112 includes a front end 112a and a root end 112b. The front end 111a of the first arm 111 and the front end 112a of the second arm 112 are spaced apart from each other. The root end 111b of the first arm 111 and the root end 112b of the second arm 112 are connected to each other.

[0106] The first holding guide 120 is fixed to the inner side of the front end portion 111a of the first arm portion 111. The first holding guide 120 holds the peripheral portion of the substrate W. The first holding guide 120 has a first surface 120a and a second surface 120b. The second surface 120b is a surface opposite to the first surface 120a. The first holding guide 120 has a support groove 121 and a support surface 122. The support groove 121 supports the peripheral portion of the substrate W from both the front side Wa and the back side Wb of the substrate W. The support groove 121 widens (expands) as it goes from the bottom to the opening. In this case, the peripheral portion of the substrate W easily enters the support groove 121. The support surface 122 is set at a position closer to the center of the substrate W than the support groove 121. The support surface 122 supports the peripheral portion of the substrate W from the back side Wb of the substrate W. The support surface 122 tilts from the first surface 120a side to the second surface 120b side as it moves away from the support groove 121.

[0107] The second holding guide 130 is fixed to the inner side of the front end portion 112a of the second arm portion 112. The second holding guide 130 holds the peripheral portion of the substrate W. The second holding guide 130 has a first surface 130a and a second surface 130b. The second surface 130b is a surface opposite to the first surface 130a. The second holding guide 130 has a support groove 131 and a support surface 132. The support groove 131 supports the peripheral portion of the substrate W from both the front surface Wa and the back surface Wb of the substrate W. The support groove 131 widens (expands) as it goes from the bottom to the opening. In this case, the peripheral portion of the substrate W easily enters the support groove 131. The support surface 132 is set at a position closer to the center of the substrate W than the support groove 131. The support surface 132 supports the peripheral portion of the substrate W from the back surface Wb of the substrate W. The support surface 132 tilts from the first surface 130a side to the second surface 130b side as it moves away from the support groove 131.

[0108] The length (distance) L1 between the first holding guide 120 and the second holding guide 130 is shorter than the diameter of the substrate W. The diameter of the substrate W is, for example, 300 mm.

[0109] The first clamping member 140 is provided at the root end portion 111b. The first clamping member 140 is configured to be capable of clamping (holding) the peripheral edge portion of the substrate W in a closed position ( Figure 6 The position shown by the dashed line in (a) and the open position ( Figure 6 The first clamping member 140 is driven by a first air cylinder 141.

[0110] The second clamping member 150 is provided at the root end portion 112b. The second clamping member 150 is configured to be capable of clamping the peripheral edge portion of the substrate W in a closed position ( Figure 6 The position shown by the dashed line in (a) and the open position ( Figure 6 The second clamping member 150 is driven by a second air cylinder 151.

[0111] The back holding mechanism 160 is provided at the root end portions 111b and 112b. The back holding mechanism 160 is provided between the first clamping member 140 and the second clamping member 150. The back holding mechanism 160 is configured to be able to hold the substrate W from the back in the closed position ( Figure 6 The position indicated by the dashed line in (a) is different from the opening position radially outward from the substrate W ( Figure 6 The back holding mechanism 160 is driven by a cylinder 161.

[0112] The main body 110 is configured to be movable among an end holding position, a back holding position, and a substrate passing position.

[0113] like Figure 6 (a) Figure 6 (b) and Figure 6 As shown in (c), the end holding position is a position where the support groove 121 of the first holding guide 120 and the support groove 131 of the second holding guide 130 support the peripheral edge of the substrate W from both the front side Wa and the back side Wb of the substrate W.

[0114] like Figure 7 (a) Figure 7 (b) and Figure 7 As shown in (c), the back holding position is a position where the support surface 122 of the first holding guide 120 and the support surface 132 of the second holding guide 130 support the peripheral edge of the substrate W from the back side Wb of the substrate W. The back holding position is a position where the root ends 111b and 112b of the main body 110 are closer to the center of the substrate W by a first distance than the end holding position. The first distance is, for example, 10 mm to 20 mm, and is 12 mm in the present embodiment.

[0115] like Figure 8 (a) and Figure 8 As shown in (b), the substrate passing position is a position where the first holding guide 120 and the second holding guide 130 do not hold the substrate W. The substrate passing position is a position where the root ends 111b and 112b of the main body 110 are closer to the center of the substrate W than the back holding position. The substrate passing position is a position where the root ends 111b and 112b of the main body 110 are closer to the center of the substrate W by a second distance than the end holding position. The second distance is, for example, 20 mm to 40 mm, and is 30 mm in the present embodiment. At the substrate passing position, in the same plane as the main body 110, the first arm 111, the second arm 112, the first holding guide 120 and the second holding guide 130 are located radially outward of the substrate W. At the substrate passing position, when viewed from a direction perpendicular to the front Wa of the substrate W, the first arm 111, the second arm 112, the first holding guide 120 and the second holding guide 130 do not overlap with the substrate W. Therefore, the main body 110 can move in a direction perpendicular to the front surface Wa of the substrate W without contacting the substrate W at the substrate passing position.

[0116] [Substrate conveying method]

[0117] The following describes a substrate transport method in which the third transport arm 53a receives the substrate W held in a vertical posture by the second transport arm 52c, changes the substrate W from the vertical posture to a horizontal posture, and delivers the substrate W to the second delivery stage 54, thereby transporting the substrate W from the second transport arm 52c to the second delivery stage 54.

[0118] (Substrate receiving action)

[0119] Reference Figures 9 to 13 The operation of the third transport arm 53a receiving the substrates W of the batch L held by the second transport arm 52c in the second rinse liquid (hereinafter referred to as "substrate receiving operation") is described. The substrate receiving operation is performed under the control of the control device 9. Fig. 9 As shown in (b), the second transport arm 52c alternately holds substrates W1 with the front surface Wa facing the positive side in the Y-axis direction and substrates W2 with the back surface Wb facing the positive side in the Y-axis direction at a first pitch P1.

[0120] First, if Fig. 9 (a) and Fig. 9 As shown in (b), the main body 110 moves to the substrate passing position on the negative side in the Y-axis direction relative to the second transport arm 52c while making the first surface 110a parallel to the front surface Wa and the back surface Wb of the substrates W1 and W2.

[0121] Then, if Fig.10 (a) and Fig.10 As shown in (b), the main body 110 moves toward the positive side in the Y-axis direction and stops at the same plane as the substrate W1 to be received. At the substrate passing position, when viewed from the Y-axis direction, the first arm 111, the second arm 112, the first holding guide 120 and the second holding guide 130 do not overlap with the substrates W1 and W2. Therefore, at the substrate passing position, the main body 110 can move horizontally toward the positive side in the Y-axis direction to the same plane as the substrate W1 to be received without contacting the substrates W1 and W2.

[0122] Then, if Fig.11 (a) and Fig.11 As shown in (b), the main body 110 moves toward the positive side in the Z-axis direction and stops at the end holding position. Thus, the support groove 121 of the first holding guide 120 and the support groove 131 of the second holding guide 130 support the peripheral edge of the substrate W1 from both sides of the front side Wa and the back side Wb of the substrate W1.

[0123] Then, if Fig.12 As shown in FIG. 1 , the first clamping member 140 and the second clamping member 150 are respectively moved from the open position (ie, the open position) to the closed position. As a result, the peripheral edge of the substrate W1 is clamped by the first clamping member 140 and the second clamping member 150. Fig.12 As shown, the back retaining mechanism 160 moves from an open position to a closed position.

[0124] Then, if Fig.13 As shown in FIG. 1 , the main body 110 moves toward the positive side in the Z-axis direction. As a result, the third transport arm 53a receives the substrate W1 held by the second transport arm 52c.

[0125] In the substrate receiving operation, the main body 110 moves to a desired position in the Y-axis direction at the substrate passing position, thereby selectively receiving any substrate W1 or W2 of the batch L held by the second conveying arm 52c.

[0126] (Substrate transfer action)

[0127] Reference Figures 14 to 18 Next, the operation of the third transport arm 53a delivering the substrate W to the second delivery stage 54 (hereinafter referred to as "substrate delivery operation") will be described. The substrate delivery operation is performed under the control of the control device 9.

[0128] First, if Fig.14 As shown, the third conveying arm 53a changes the substrate W in the vertical posture received from the second conveying arm 52c into a horizontal posture. At this time, the substrate W is supported by the supporting groove 121 of the first holding guide 120 and the supporting groove 131 of the second holding guide 130, and is clamped by the first clamping member 140 and the second clamping member 150. Therefore, even if the substrate W changes from the vertical posture to the horizontal posture, the substrate W will not fall from the main body 110.

[0129] Then, if Fig.15 As shown, the first clamping member 140 and the second clamping member 150 move from the closed position to the open position. As a result, the first clamping member 140 and the second clamping member 150 release the clamping of the substrate W. As a result, the peripheral edge of the substrate W is supported by the support groove 121 of the first holding guide 120 and the support groove 131 of the second holding guide 130, and the substrate W is held from the back by the back holding mechanism 160.

[0130] Then, if Fig.16 As shown, the main body 110 moves to the negative side of the X-axis direction and pushes the substrate W against the pushing component 55, thereby making the substrate W move from the position supported by the supporting grooves 121 and 131 to the position supported by the supporting surfaces 122 and 132. That is, the main body 110 moves from the end holding position to the back holding position. When the main body 110 moves at a high speed, the substrate W supported by the supporting surfaces 122 and 132 is prone to positional displacement. Therefore, the main body 110 moves at a low speed when the substrate W is supported by the supporting surfaces 122 and 132. When the main body 110 moves from the position of pushing the substrate W against the pushing component 55 to the position of the second handover station 54, the distance moved by the main body 110 at a low speed becomes shorter, so the conveying time of the substrate W can be shortened. Therefore, the pushing component 55 is preferably configured above each carrier plate 54a and on the negative side of the X-axis direction of each carrier plate 54a.

[0131] Then, if Fig.17As shown in FIG. 1 , the main body 110 moves toward the positive side in the X-axis direction to move the substrate W to the position directly above the second transfer stage 54. Then, the main body 110 moves toward the negative side in the Z-axis direction. Thus, the substrate W supported by the support surface 122, the support surface 132 and the back holding mechanism 160 is transferred to the three pins 54b of the second transfer stage 54.

[0132] Then, if Fig.18 As shown, the main body 110 moves toward the positive side in the X-axis direction. In the above manner, the substrate transfer operation for one substrate W is completed.

[0133] In the above-mentioned substrate conveying method, the case where the substrate W is moved from the position supported by the supporting grooves 121 and 131 to the position supported by the supporting surfaces 122 and 132 by pushing the substrate W held by the main body 110 against the pushing member 55 is described, but the present invention is not limited thereto. For example, a suction (suction) line may be provided in the back holding mechanism 160 instead of the pushing member 55. In this case, by using the line to suck the substrate W, the substrate W can be moved from the position supported by the supporting grooves 121 and 131 to the position supported by the supporting surfaces 122 and 132.

[0134] In the above-mentioned substrate conveying method, the third conveying arm 53a has a single main body 110 and conveys substrates W one by one from the second conveying arm 52c to the second transfer station 54, but the present invention is not limited thereto. For example, the third conveying arm 53a may have a plurality of main bodies 110 and convey a plurality of substrates W from the second conveying arm 52c to the second transfer station 54 at the same time.

[0135] The embodiments described in this specification should be considered to be illustrative in all aspects and not restrictive. The above-mentioned embodiments may be omitted, replaced, and changed in various ways without departing from the present invention and its spirit.

Claims

1. A substrate holding member, characterized in that: include: A main body having a first arm portion and a second arm portion which are spaced apart at the front end and connected at the root end; a first holding guide, fixed to the front end of the first arm portion, for holding the peripheral edge of the substrate; and a second holding guide, which is fixed to the front end of the second arm portion and is used to hold the peripheral edge of the substrate, The length between the first holding guide and the second holding guide is shorter than the diameter of the substrate, In the same plane as the first arm portion and the second arm portion, when the substrate is located closer to the root end portion than the position held by the first holding guide and the second holding guide, the first arm portion, the second arm portion, the first holding guide and the second holding guide are located radially outward of the substrate.

2. The substrate holding member according to claim 1, wherein: having a clamping member disposed at the root end, The clamp member is movable between a closed position for clamping the peripheral edge of the substrate and an open position for releasing the clamp from the substrate.

3. The substrate holding member according to claim 1, wherein: having a back side holding mechanism disposed at the root end, The back surface holding mechanism is movable between a closed position for holding the substrate from the back surface and an open position radially outward of the substrate.

4. The substrate holding member according to any one of claims 1 to 3, wherein: The first holding guide and the second holding guide each have: A supporting groove that supports the peripheral edge of the substrate from both the front and back sides of the substrate; and The support surface is provided at a position closer to the center of the substrate than the support groove, and supports the peripheral edge portion of the substrate from the back side of the substrate.

5. A substrate processing system, characterized in that: include: A vertical holding member for holding the substrate in a vertical posture; A horizontal holding member for holding the substrate in a horizontal posture; and a conveying device for conveying the substrate held by the vertical holding member to the horizontal holding member, The conveying device has a substrate holding member for holding the substrate, The substrate holding member comprises: A main body having a first arm portion and a second arm portion which are spaced apart at the front end and connected at the root end; a first holding guide fixed to the front end portion of the first arm portion and configured to hold a peripheral edge portion of a substrate; and a second holding guide fixed to the front end of the second arm portion and configured to hold the peripheral edge of the substrate; The length between the first holding guide and the second holding guide is shorter than the diameter of the substrate, In the same plane as the first arm portion and the second arm portion, when the substrate is located closer to the root end portion than the position held by the first holding guide and the second holding guide, the first arm portion, the second arm portion, the first holding guide and the second holding guide are located radially outward of the substrate.

6. The substrate processing system according to claim 5, wherein: comprising a control device for controlling the conveying device, The control device performs: The substrate holding member receives the substrate held by the plumb holding member; The substrate holding member changes the substrate from a vertical posture to a horizontal posture; and The step of transferring the substrate in a horizontal posture to a transfer stage by the substrate holding member.

7. The substrate processing system according to claim 6, wherein: having a clamping member disposed at the root end, The clamp member is movable between a closed position for clamping the peripheral edge of the substrate and an open position for releasing the clamp from the substrate.

8. The substrate processing system according to claim 7, wherein: The control device moves the clamping member to the closed position before changing the substrate from the vertical posture to the horizontal posture.

9. The substrate processing system according to claim 6, wherein: having a back side holding mechanism disposed at the root end, The back surface holding mechanism is movable between a closed position for holding the substrate from the back surface and an open position radially outward of the substrate.

10. The substrate processing system according to claim 9, wherein: The control device moves the back surface holding mechanism to the closed position before changing the substrate from the vertical posture to the horizontal posture.

11. A substrate processing system according to any one of claims 6 to 10, characterized in that: The first holding guide and the second holding guide each have: A supporting groove that supports the peripheral edge of the substrate from both the front and back sides of the substrate; and The support surface is provided at a position closer to the center of the substrate than the support groove, and supports the peripheral edge portion of the substrate from the back side of the substrate.

12. The substrate processing system according to claim 11, wherein: A biasing member is provided, the biasing member contacts the end of the substrate held in a horizontal posture by the substrate holding member, and moves the substrate from a position supported by the supporting groove to a position supported by the supporting surface.

13. The substrate processing system according to claim 12, wherein: The step of the substrate holding member delivering the substrate in a horizontal posture to the delivery stage includes: pushing the substrate against the pushing component by horizontal movement of the substrate holding member, thereby moving the substrate from a position supported by the supporting groove to a position supported by the supporting surface.

14. The substrate processing system according to claim 6, wherein: The vertical holding member is configured to hold the plurality of substrates at intervals from each other. The step of the substrate holding member receiving the substrate held by the plumb holding member comprises: a step of moving the substrate holding member in a direction perpendicular to the front surface of the substrate to the same plane as the substrate; and The step of moving the substrate holding member upward to hold the substrate using the first holding guide and the second holding guide.

15. The substrate processing system according to claim 6, wherein: The vertical holding member is configured to hold the plurality of substrates at intervals from each other. The conveying device has a plurality of substrate holding members. The step of receiving the substrate held by the vertical holding member by the substrate holding member includes the step of simultaneously receiving the plurality of substrates held by the vertical holding member by the plurality of substrate holding members.

16. A substrate conveying method, wherein a conveying device conveys a substrate from a vertical holding member that holds the substrate in a vertical posture to a horizontal holding member that holds the substrate in a horizontal posture, wherein the substrate conveying method is characterized by: The conveying device has a substrate holding member for holding the substrate, The substrate holding member comprises: A main body having a first arm portion and a second arm portion which are spaced apart at the front end and connected at the root end; a first holding guide, fixed to the front end of the first arm portion, for holding the peripheral edge of the substrate; and a second holding guide fixed to the front end of the second arm portion and configured to hold the peripheral edge of the substrate; The length between the first holding guide and the second holding guide is shorter than the diameter of the substrate, In the same plane as the first arm and the second arm, when the substrate is located closer to the root end than the position held by the first holding guide and the second holding guide, the first arm, the second arm, the first holding guide, and the second holding guide are located radially outward from the substrate. The substrate conveying method comprises: The substrate holding member receives the substrate held by the plumb holding member; The substrate holding member changes the substrate from a vertical posture to a horizontal posture; and The step of transferring the substrate in a horizontal posture to a transfer stage by the substrate holding member.

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