Wafer substrate positioning method, device, equipment, storage medium and program product

Abstract

The application provides a wafer substrate positioning method, device, equipment, storage medium and program product, and relates to the technical field of semiconductors. The method does not depend on a wafer substrate image and an edge detection algorithm, but calculates deviation between a wafer substrate and a rotating chuck through data collected during wafer substrate rotation, and performs positioning and deviation correction based on the deviation between the wafer substrate and the rotating chuck. The method can avoid the problem of poor positioning effect caused by image quality degradation, and improves the accuracy and reliability of wafer substrate positioning results.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a wafer substrate positioning method, apparatus, device, storage medium, and program product. Background Technology

[0002] In the semiconductor manufacturing industry, wafer substrates are the basic material for chip manufacturing, and their processing precision and quality control are crucial. Before chamfering the wafer substrate, accurately positioning and correcting the center position (i.e., the center point) and the processing groove positions on the wafer substrate is a key step to ensure the smooth progress of subsequent processing steps and product quality.

[0003] Most wafer substrates are circular, but to accommodate the loading and unloading requirements in engineering, processing grooves need to be cut around the perimeter of the wafer substrate. Currently, processing grooves on wafer substrates can be divided into two types: orientation planes (OF) and V-shaped notches (i.e., notch openings). Positioning methods for wafer substrates with orientation planes are relatively mature, but positioning methods used for orientation plane wafer substrates are generally difficult to directly apply to wafer substrates with V-shaped notches. Therefore, it is necessary to explore positioning methods for wafer substrates with V-shaped notches.

[0004] In some related technologies, there are various technical solutions for determining the center and V-shaped notch location of a wafer substrate. The basic workflow of a common method is as follows: First, images of the wafer substrate are captured by three cameras from different angles or positions; then, these images are converted to grayscale images to simplify subsequent processing; next, edge detection is performed on the grayscale images to extract the edge contours of the wafer substrate, resulting in a series of edge pixels; finally, these edge pixels are further processed and analyzed to determine the accurate location of the wafer substrate center and V-shaped notch.

[0005] However, this method based on multiple camera image sampling has some obvious problems and limitations in practical applications: since the method relies on image processing and edge detection algorithms, it is easily affected by environmental factors, such as changes in light, camera lens contamination, or wafer surface defects. These factors may lead to a decrease in image quality, thereby affecting the accuracy and stability of edge detection, and consequently affecting the positioning effect of the wafer substrate. Summary of the Invention

[0006] This invention provides a wafer substrate positioning method, apparatus, device, storage medium, and program product to address the shortcomings of existing wafer substrate positioning methods, such as low accuracy and poor positioning effect.

[0007] This invention provides a wafer substrate positioning method, applied to a wafer substrate positioning device. The wafer substrate positioning device includes a correction component and an adjustment mechanism. The correction component includes a correction mounting frame, a rotary chuck, and a correction sensor. The rotary chuck is rotatably connected to the correction mounting frame, and the correction sensor is mounted on the correction mounting frame. The adjustment mechanism and the correction component are arranged opposite to each other in a first direction. The method includes: obtaining the radius R of a calibration element, the first obstruction amount t of the correction sensor on the calibration element, and the first reference line LA; placing the wafer substrate to be positioned on the rotary chuck, controlling the rotation of the rotary chuck, and acquiring the rotation angle of the wafer substrate to be positioned in real time during the rotation of the rotary chuck. The second shielding amount of the bias correction sensor on the wafer substrate to be positioned Based on the radius R of the calibration component and the second occlusion amount And the first blocking amount t, determine the distance from a point on the edge of the wafer substrate to be positioned to the center of the rotary chuck. Determine the rotation angle of the wafer substrate to be positioned. The distance from a point on the edge of the wafer substrate to be positioned to the center of the rotary chuck. Is this data located on the second circular edge of the wafer substrate to be positioned? If it is the rotation angle of the wafer substrate to be positioned... The distance from a point on the edge of the wafer substrate to be positioned to the center of the rotary chuck. Given the data on the second circular edge of the wafer substrate to be positioned, then based on the rotation angle of the wafer substrate to be positioned... The distance from a point on the edge of the wafer substrate to be positioned to the center of the rotary chuck. The coordinates of the center of the wafer substrate to be positioned in the rectangular coordinate system are fitted based on the least squares method. , The rectangular coordinate system has the center of the rotating suction cup as the origin, the first direction as the horizontal axis, and the second direction as the vertical axis, with the second direction perpendicular to the first direction; based on the center coordinates ( , Determine the center position deviation between the center of the wafer substrate to be positioned and the center of the rotating chuck. and angular deviation β; based on center position deviation The angle deviation β and the first reference line LA are adjusted by the adjustment mechanism to position and correct the center of the wafer substrate to be positioned; after the center of the wafer substrate to be positioned is positioned and corrected, the V-shaped notch of the wafer substrate to be positioned is positioned and corrected.

[0008] According to the wafer substrate positioning method provided by the present invention, the center position deviation The calculation formula is:

[0009] ;

[0010] ;

[0011] ;

[0012] ;

[0013] ;

[0014] in, It is the first transition variable; It is the second transition variable; Coordinates of the center of the circle ( , The x-coordinate of ) Coordinates of the center of the circle ( , The ordinate of the coordinate; the formula for calculating the angle deviation β is:

[0015]

[0016] Where π is the ratio of a circle's diameter to its circumference; Coordinates of the center of the circle ( , The x-coordinate of ) Coordinates of the center of the circle ( , The vertical axis of ).

[0017] According to the present invention, a wafer substrate positioning method is provided, wherein the V-shaped notch includes a first end point and a second end point; the rotation angle of the wafer substrate to be positioned is determined. The distance from a point on the edge of the wafer substrate to be positioned to the center of the rotary chuck. Whether the data pertains to the second circular edge of the wafer substrate to be positioned includes: the rotation angle of the wafer substrate to be positioned based on the currently sampled data. The distance from the point on the edge of the currently sampled wafer substrate to the center of the rotating chuck. The rotation angle of the wafer substrate to be positioned in the next sampling. The distance from the point on the edge of the wafer substrate to be positioned in the next sampling to the center of the rotating chuck. Determine the coordinates of the first endpoint in the polar coordinate system. The coordinates of the second endpoint in the polar coordinate system The polar coordinate system has the center of the rotating suction cup as the pole and the first direction as the polar axis; based on the coordinates of the first endpoint... Second endpoint coordinates Determine the maximum angle value and minimum angle value And calculate the maximum angle value. and minimum angle value The difference; based on the difference, determine the rotation angle of the wafer substrate to be positioned. The distance from a point on the edge of the wafer substrate to be positioned to the center of the rotary chuck. Is the data located on the second circular edge of the wafer substrate to be positioned? Wherein, the first endpoint and the second endpoint satisfy... and ; The transition variable calculated for the current sampling. This will serve as a transition variable for the next sampling calculation. A preset threshold is used to determine the first and second endpoints.

[0018] According to the present invention, a wafer substrate positioning method is provided, based on the center position deviation. Based on the angle deviation β and the first reference line LA, the center of the wafer substrate to be positioned is positioned and corrected through an adjustment mechanism, including: controlling the rotation of the rotary chuck based on the angle deviation β to rotate the center of the wafer substrate to be positioned onto the second reference line LB; the second reference line LB passes through the center of the rotary chuck and is parallel to the first reference line LA; based on the center position deviation... The wafer substrate to be positioned is moved by adjusting the mechanism so that the center of the wafer substrate to be positioned is coaxial with the center of the rotating chuck.

[0019] According to the present invention, a wafer substrate positioning method is provided, which, after completing the positioning and correction of the center of the wafer substrate to be positioned, performs positioning and correction on the V-shaped notch of the wafer substrate to be positioned, including: after determining that the center of the wafer substrate to be positioned is coaxial with the center of the rotating chuck, a coaxial wafer substrate to be positioned is obtained; the rotating chuck is controlled to rotate, and the rotation angle of the coaxial wafer substrate to be positioned is collected in real time during the rotation of the rotating chuck. The third occlusion amount of the alignment sensor on the coaxial wafer substrate to be positioned Based on the radius R of the calibration component, the first occlusion amount t, and the third occlusion amount Determine the distance from a point on the edge of the coaxial wafer substrate to be positioned to the center of the rotating chuck. Determine the rotation angle of the coaxial wafer substrate to be positioned. The distance from a point on the edge of the coaxial wafer substrate to be positioned to the center of the rotary chuck. Is the data located on the V-shaped notch of the coaxial wafer substrate to be positioned? If it is the rotation angle of the coaxial wafer substrate to be positioned... The distance from a point on the edge of the coaxial wafer substrate to be positioned to the center of the rotary chuck. For the data on the V-shaped notch of the coaxial wafer substrate to be positioned, a fourth-order polynomial is used to represent the polar coordinates of the V-shaped notch. A fitting calculation is performed to determine the angle deviation of the V-shaped notch; based on the angle deviation of the V-shaped notch, the rotation of the rotating suction cup is controlled to rotate the bottom of the V-shaped notch to the second baseline LB.

[0020] According to the wafer substrate positioning method provided by the present invention, the formula of the fourth-order polynomial is:

[0021] ;

[0022] in, For polar coordinates The results of the fitting; For polar coordinates The results of the fitting; For the first coefficient, For the coefficient of the second term, For the third coefficient, The coefficient of the fourth term; The coefficient of the fifth term is denoted as ; the angular deviation of the V-shaped notch is the minimum root value obtained by differentiating the fourth-order polynomial.

[0023] The present invention also provides a wafer substrate positioning device using any of the above-described wafer substrate positioning methods. The wafer substrate positioning device includes: a device body; a bias correction component, which is mounted on the device body and includes a bias correction mounting frame, a rotary chuck, and a bias correction sensor. The bias correction mounting frame is mounted on the device body, and the rotary chuck is rotatably connected to the bias correction mounting frame. The rotary chuck is used to place the wafer substrate to be positioned, and the bias correction sensor is mounted on the bias correction mounting frame; and an adjustment mechanism, which is mounted on the device body and is disposed opposite to the bias correction component.

[0024] The present invention also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement any of the wafer substrate positioning methods described above.

[0025] The present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements any of the wafer substrate positioning methods described above.

[0026] The present invention also provides a computer program product, including a computer program that, when executed by a processor, implements any of the wafer substrate positioning methods described above.

[0027] The wafer substrate positioning method, apparatus, device, storage medium, and program product provided by this invention do not rely on wafer substrate images and edge detection algorithms. Instead, they calculate the deviation between the wafer substrate and the rotating chuck by using data collected during the wafer substrate rotation process, and perform positioning correction based on the deviation between the wafer substrate and the rotating chuck. This avoids the problem of poor positioning effect caused by image quality degradation and improves the accuracy and reliability of wafer substrate positioning results. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0029] Figure 1 This is a schematic flowchart of the wafer substrate positioning method provided by the present invention.

[0030] Figure 2 This is a schematic diagram of the assembly structure of the wafer substrate positioning device provided by the present invention.

[0031] Figure 3 This is one of the schematic diagrams of the positioning process of the wafer substrate positioning device provided by the present invention.

[0032] Figure 4 This is the second schematic diagram of the positioning process of the wafer substrate positioning device provided by the present invention.

[0033] Figure 5 This is the third schematic diagram of the positioning process of the wafer substrate positioning device provided by the present invention.

[0034] Figure 6 This is a schematic diagram of the structure of the electronic device provided by the present invention. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.

[0036] Please see Figures 1 to 5 , Figure 1 This is a schematic flowchart of the wafer substrate positioning method provided by the present invention. Figure 2This is a schematic diagram of the assembly structure of the wafer substrate positioning device provided by the present invention. Figure 3 This is one of the schematic diagrams of the positioning process of the wafer substrate positioning device provided by the present invention. Figure 4 This is the second schematic diagram of the positioning process of the wafer substrate positioning device provided by the present invention. Figure 5 This is the third schematic diagram of the positioning process of the wafer substrate positioning device provided by the present invention.

[0037] In this embodiment, the wafer substrate positioning method is applied to the wafer substrate positioning device.

[0038] like Figures 2 to 5 As shown, the wafer substrate positioning device includes a device body 5, a spin correction component and an adjustment mechanism 1. The spin correction component includes a spin correction mounting frame 6, a rotary chuck 3 and a spin correction sensor 4. The spin correction mounting frame 6 is mounted on the device body 5, the rotary chuck 3 is rotatably connected to the spin correction mounting frame 6, and the spin correction sensor 4 is mounted on the spin correction mounting frame 6 through a sensor fixing plate 7. The adjustment mechanism 1 and the spin correction component are arranged opposite to each other in a first direction.

[0039] The first direction is the direction in which the correction component points to the adjustment mechanism 1.

[0040] Specifically, the alignment component also includes a direct drive motor 2, which is mounted on the alignment mounting bracket 6, and a rotary suction cup 3 is mounted on the direct drive motor 2. The direct drive motor 2 can drive the rotary suction cup 3 to rotate.

[0041] The adjustment mechanism 1 is a robotic arm. The adjustment mechanism 1 includes a horizontal moving component 12 (i.e., the radial moving axis of the robotic arm), a suction component 16, a rotating component 17, a mounting platform 13, and a height moving component 11. The horizontal moving component 12 is mounted on the rotating component 17, the suction cup mounting plate 15 is mounted on the horizontal moving component 12, and the suction component 16 is mounted on the suction cup mounting plate 15 for adsorbing or releasing the wafer substrate 8 to be positioned.

[0042] Optionally, the correction sensor 4 is a linear laser sensor, which includes a transmitter 41 and a receiver 42.

[0043] The wafer substrate positioning method includes steps S110 to S180, and the specific details of each step are as follows:

[0044] S110: Obtain the radius R of the calibration component, the first occlusion amount t of the correction sensor on the calibration component, and the first reference line LA.

[0045] Specifically, such as Figure 3As shown, before positioning the wafer substrate 8 to be positioned, the calibration component needs to be calibrated: the calibration component 9 with radius R and a straight edge 92 is aligned coaxially with the vacuum rotary chuck 3; the vacuum negative pressure of the vacuum rotary chuck 3 is turned on to adsorb the calibration component 9, so that the circular edge 91 of the calibration component 9 is within the measurement range of the correction sensor 4; the direct drive motor 2 is controlled to drive the rotary chuck 3 to rotate a certain angle, and at the same time, the correction sensor 4 collects the data of the first circular edge 91 of the calibration component 9; the arithmetic mean of the values ​​collected by the correction sensor 4 is taken to obtain the first amount of obstruction of the calibration component by the correction sensor 4. t is used to determine the position of the correction sensor 4 relative to the vacuum rotary chuck 3; the straight edge 92 on the calibration piece 9 is aligned parallel to the horizontal movement component 12 of the adjustment mechanism 1, that is, the radial movement axis of the robot is aligned parallel, and it is ensured that the adjustment mechanism 1 does not interfere with the vacuum rotary chuck 3 when it moves the wafer substrate 8 or the calibration piece 9 up and down. The angle A of the rotary motor 14 and the angle B of the direct drive motor 2 on the adjustment mechanism 1 are recorded at this time, and the direction of movement of the horizontal movement component 12 of the adjustment mechanism 1 at this time is recorded as the first reference line LA; the negative pressure of the vacuum rotary chuck 3 is disconnected, and the calibration piece 9 is removed.

[0046] S120: Place the wafer substrate to be positioned onto the rotary chuck, control the rotation of the rotary chuck, and collect the rotation angle of the wafer substrate in real time during the rotation of the rotary chuck. The second shielding amount of the bias correction sensor on the wafer substrate to be positioned .

[0047] Specifically, such as Figure 4 As shown, the wafer substrate 8 to be positioned includes a second circular edge 81 and a V-shaped notch 82. The V-shaped notch 82 includes a first end point E and a second end point F. The wafer substrate 8 to be positioned is placed on the vacuum rotary chuck 3 by adjusting the adsorption component 16 of the adjustment mechanism 1. The negative pressure of the adsorption component 16 on the adjustment mechanism 1 is disconnected, and the negative pressure of the vacuum rotary chuck 3 is turned on, thereby adsorbing the wafer substrate 8 to be positioned onto the vacuum rotary chuck 3.

[0048] Furthermore, the direct drive motor 2 is controlled to drive the rotary chuck 3 to rotate at a constant speed for one revolution, and the rotation angle of the wafer substrate 8 to be positioned is collected in real time during the rotation of the rotary chuck 3. Meanwhile, the correction sensor 4 can collect the second occlusion amount of the wafer substrate 8 to be positioned in real time. Complete the acquisition of edge data of the wafer substrate 8 to be positioned.

[0049] S130: Based on the radius R of the calibration piece, the second occlusion amount And the first blocking amount t, determine the distance from a point on the edge of the wafer substrate to be positioned to the center of the rotary chuck. .

[0050] Specifically, the data collected by the correction sensor 4 is processed: based on the radius R of the calibration component and the second occlusion amount. And the first blocking amount t, determine the distance from a point on the edge of the wafer substrate 8 to be positioned to the center O1 of the rotating chuck 3. , The calculation formula is as follows:

[0051] .

[0052] S140: Determine the rotation angle of the wafer substrate to be positioned. The distance from a point on the edge of the wafer substrate to be positioned to the center of the rotary chuck. Is the data located on the second circular edge of the wafer substrate to be positioned?

[0053] S150: If the rotation angle of the wafer substrate to be positioned The distance from a point on the edge of the wafer substrate to be positioned to the center of the rotary chuck. Given the data on the second circular edge of the wafer substrate to be positioned, then based on the rotation angle of the wafer substrate to be positioned... The distance from a point on the edge of the wafer substrate to be positioned to the center of the rotary chuck. The coordinates of the center of the wafer substrate to be positioned in the rectangular coordinate system are fitted based on the least squares method. , ).

[0054] The rectangular coordinate system has the center of the rotating suction cup as the origin, the first direction as the horizontal axis, and the second direction as the vertical axis, with the second direction perpendicular to the first direction.

[0055] like Figure 3 As shown, in this embodiment, a rectangular coordinate system is established with the center O1 of the rotating chuck as the origin, the first direction as the horizontal axis (x-axis), and the second direction as the vertical axis (y-axis). Generally, when the wafer substrate 8 to be positioned is placed on the vacuum rotating chuck 3, the center O3 of the wafer substrate 8 to be positioned is not completely coaxial with the center O1 of the rotating chuck 3. Therefore, it is necessary to perform positioning correction on the center O3 of the wafer substrate 8 to be positioned.

[0056] After determining the coordinate system, the rotation angle of the wafer substrate 8 to be positioned can be used as a reference. The distance from a point on the edge of the wafer substrate 8 to the center O1 of the rotating chuck 3 The coordinates of the center O3 of the wafer substrate 8 to be positioned in the rectangular coordinate system are fitted based on the least squares method. , ).

[0057] S160: Based on the coordinates of the center of the circle ( , Determine the center position deviation between the center of the wafer substrate to be positioned and the center of the rotating chuck. And angular deviation β.

[0058] S170: Based on center position deviation The angle deviation β and the first reference line LA are adjusted by the adjustment mechanism to position and correct the center of the wafer substrate to be positioned.

[0059] S180: After the center of the wafer substrate to be positioned is positioned and corrected, the V-shaped notch of the wafer substrate to be positioned is positioned and corrected.

[0060] The wafer substrate positioning method provided in this embodiment does not rely on wafer substrate images and edge detection algorithms. Instead, it calculates the deviation between the wafer substrate and the rotating chuck by using data collected during the wafer substrate rotation process. Based on the deviation between the wafer substrate and the rotating chuck, it performs positioning correction, which avoids the problem of poor positioning effect caused by image quality degradation and improves the accuracy and reliability of wafer substrate positioning results.

[0061] In some embodiments, center position deviation The calculation formula is:

[0062] ;

[0063] ;

[0064] ;

[0065] ;

[0066] ;

[0067] in, It is the first transition variable; It is the second transition variable; Coordinates of the center of the circle ( , The x-coordinate of ) Coordinates of the center of the circle ( , The ordinate of the coordinate; the formula for calculating the angle deviation β is:

[0068]

[0069] Where π is the ratio of a circle's diameter to its circumference; Coordinates of the center of the circle ( , The x-coordinate of ) Coordinates of the center of the circle ( , The vertical axis of ).

[0070] In some embodiments, the V-shaped notch includes a first end and a second end. The rotation angle of the wafer substrate to be positioned is determined. The distance from a point on the edge of the wafer substrate to be positioned to the center of the rotary chuck. Whether the data pertains to the second circular edge of the wafer substrate to be positioned includes: the rotation angle of the wafer substrate to be positioned based on the currently sampled data. The distance from the point on the edge of the currently sampled wafer substrate to the center of the rotating chuck. The rotation angle of the wafer substrate to be positioned in the next sampling. The distance from the point on the edge of the wafer substrate to be positioned in the next sampling to the center of the rotating chuck. Determine the coordinates of the first endpoint in the polar coordinate system. The coordinates of the second endpoint in the polar coordinate system The polar coordinate system has the center of the rotating suction cup as the pole and the first direction as the polar axis; based on the coordinates of the first endpoint... Second endpoint coordinates Determine the maximum angle value and minimum angle value And calculate the maximum angle value. and minimum angle value The difference; based on the difference, determine the rotation angle of the wafer substrate to be positioned. The distance from a point on the edge of the wafer substrate to be positioned to the center of the rotary chuck. Is the data located on the second circular edge of the wafer substrate to be positioned? Wherein, the first endpoint and the second endpoint satisfy... and ; The transition variable calculated for the current sampling. This will serve as a transition variable for the next sampling calculation. A preset threshold is used to determine the first and second endpoints.

[0071] like Figures 3 to 5 As shown, the wafer substrate 8 to be positioned includes a second rounded edge 81 and a V-shaped notch 82, the V-shaped notch 82 including a first endpoint E and a second endpoint F; the rotation angle of the wafer substrate 8 to be positioned is obtained. The distance from a point on the edge of the wafer substrate 8 to the center of the rotary chuck 3 Next, it is necessary to determine the rotation angle of the wafer substrate 8 to be positioned. The distance from a point on the edge of the wafer substrate 8 to the center O1 of the rotating chuck 3 Is it the data on the second circular edge 81 of the wafer substrate 8 to be positioned, or the data on the V-shaped notch 82?

[0072] Specifically, this embodiment uses the differential method to determine the positions of the first endpoint E and the second endpoint F on the second circular edge 81 of the wafer substrate 8 to be positioned; wherein the first endpoint E and the second endpoint F satisfy the following formula:

[0073] ;

[0074] ;

[0075] in, The transition variable calculated for the current sampling. This will serve as a transition variable for the next sampling calculation. To determine the preset threshold for the first endpoint E and the second endpoint F; This represents the rotation angle of the currently sampled wafer substrate 8 to be positioned; The rotation angle of the wafer substrate 8 to be positioned for the next sampling; The distance from a point on the edge of the currently sampled wafer substrate 8 to the center O1 of the rotating chuck 3; The distance from a point on the edge of the wafer substrate 8 to be positioned in the next sampling to the center O1 of the rotating chuck 3.

[0076] Furthermore, such as Figures 3 to 5 As shown, a polar coordinate system is established with the center O1 of the rotating suction cup 3 as the pole and the first direction as the polar axis. After determining the first endpoint E and the second endpoint F using the above formula, the coordinates of the first endpoint E in the polar coordinate system are determined. Coordinates of the second endpoint F in the polar coordinate system .

[0077] Furthermore, based on the coordinates of the first endpoint Second endpoint coordinates Determine the maximum angle value and minimum angle value And calculate the maximum angle value. and minimum angle value The difference Among them, the maximum angle value and minimum angle value The calculation formula is as follows:

[0078] ;

[0079] ;

[0080] Where max is the maximum value function and min is the minimum value function.

[0081] Furthermore, based on the difference Determine the rotation angle of the wafer substrate 8 to be positioned. The distance from a point on the edge of the wafer substrate 8 to the center O1 of the rotating chuck 3 Is it data on the second circular edge 81 of the wafer substrate 8 to be positioned?

[0082] Specifically, if The rotation angle of the wafer substrate 8 to be positioned These points are on the V-shaped notch 82, and the remaining points are on the second circular edge 81 of the wafer substrate 8 to be positioned.

[0083] Specifically, if The rotation angle of the wafer substrate 8 to be positioned These points are on the V-shaped notch 82, and the remaining points are on the second circular edge 81 of the wafer substrate 8 to be positioned.

[0084] in, A threshold is set to determine the starting position of the V-shaped notch 82 of the wafer substrate 8 to be positioned.

[0085] In some embodiments, based on center position deviation Based on the angle deviation β and the first reference line LA, the center of the wafer substrate to be positioned is positioned and corrected through an adjustment mechanism, including: controlling the rotation of the rotary chuck based on the angle deviation β to rotate the center of the wafer substrate to be positioned onto the second reference line LB; the second reference line LB passes through the center of the rotary chuck and is parallel to the first reference line LA; based on the center position deviation... The wafer substrate to be positioned is moved by adjusting the mechanism so that the center of the wafer substrate to be positioned is coaxial with the center of the rotating chuck.

[0086] Specifically, the direct drive motor 2 drives the rotary chuck 3 to rotate by an angle deviation β, rotating the center O3 of the wafer substrate 8 to be positioned onto the second reference line LB, which is parallel to the first reference line LA and passes through the center O1 of the rotary chuck 3. The center O3 of the wafer substrate 8 is then positioned between the center O1 of the vacuum rotary chuck 3 and the rotation center O2 of the adjustment mechanism 1. The rotary motor 14 on the adjustment mechanism 1 rotates, rotating the horizontal movement component 12 of the adjustment mechanism 1 onto the first reference line LA. The adjustment mechanism 1 moves upward along the Z-axis (here, the height movement component 11 is taken as the Z-axis), causing the adsorption component 16 to contact the wafer substrate 8 to be positioned, and vacuum adsorption of the wafer substrate 8 is activated, disengaging the negative pressure on the vacuum rotary chuck 3. The adjustment mechanism 1 drives the wafer substrate 8 to be positioned upward along the Z-axis, and the horizontal movement component 12 of the adjustment mechanism 1 moves towards the center O1 of the vacuum rotary chuck 3, moving the calculated center position deviation. This makes the center O3 of the wafer substrate 8 to be positioned coaxial with the center O1 of the rotating chuck 3. The adjustment mechanism 1 drives the wafer substrate 8 to be positioned to descend along the Z-axis and places the wafer substrate 8 to be positioned on the vacuum rotating chuck 3. The vacuum rotating chuck 3 is activated by negative pressure to adsorb the wafer substrate 8 to be positioned. The adsorption component 16 of the adjustment mechanism 1 is deactivated by negative pressure, and the adjustment mechanism 1 is moved to the initial position.

[0087] In some embodiments, after the center of the wafer substrate to be positioned is positioned and corrected, the V-shaped notch of the wafer substrate to be positioned is positioned and corrected, including: after determining that the center of the wafer substrate to be positioned is coaxial with the center of the rotary chuck, a coaxial wafer substrate to be positioned is obtained; the rotary chuck is controlled to rotate, and the rotation angle of the coaxial wafer substrate to be positioned is collected in real time during the rotation of the rotary chuck. The third occlusion amount of the alignment sensor on the coaxial wafer substrate to be positioned Based on the radius R of the calibration component, the first occlusion amount t, and the third occlusion amount Determine the distance from a point on the edge of the coaxial wafer substrate to be positioned to the center of the rotating chuck. Determine the rotation angle of the coaxial wafer substrate to be positioned. The distance from a point on the edge of the coaxial wafer substrate to be positioned to the center of the rotary chuck. Is the data located on the V-shaped notch of the coaxial wafer substrate to be positioned? If it is the rotation angle of the coaxial wafer substrate to be positioned... The distance from a point on the edge of the coaxial wafer substrate to be positioned to the center of the rotary chuck. For the data on the V-shaped notch of the coaxial wafer substrate to be positioned, a fourth-order polynomial is used to represent the polar coordinates of the V-shaped notch. A fitting calculation is performed to determine the angle deviation of the V-shaped notch; based on the angle deviation of the V-shaped notch, the rotation of the rotating suction cup is controlled to rotate the bottom of the V-shaped notch to the second baseline LB.

[0088] After the center O3 of the wafer substrate 8 to be positioned is positioned and corrected (i.e., the center O3 of the wafer substrate 8 to be positioned placed on the vacuum rotary chuck 3 is coaxial with the center O1 of the vacuum rotary chuck 3), the wafer substrate 8 to be positioned is used as the coaxial wafer substrate to be positioned.

[0089] Furthermore, measurements are taken on the wafer substrate 8 to be positioned after coaxial adjustment: the direct drive motor 2 is controlled to drive the rotary chuck 3 to rotate at a constant speed for one revolution, and the rotation angle of the wafer substrate 8 to be positioned after coaxial adjustment is collected in real time during the rotation of the rotary chuck 3. The third shielding amount of the wafer substrate 8 to be positioned after the alignment sensor is adjusted to be coaxial. The edge data of the wafer substrate 8 to be positioned was acquired after the coaxial adjustment was completed.

[0090] Furthermore, based on the radius R, the first occlusion amount t, and the third occlusion amount of the calibration component 9... Determine the distance from a point on the edge of the wafer substrate 8 to be positioned after coaxial adjustment to the center O1 of the rotating chuck 3. , The calculation formula is as follows:

[0091] .

[0092] Furthermore, determine the rotation angle of the wafer substrate 8 to be positioned after coaxial adjustment. The distance from a point on the edge of the wafer substrate 8 to be positioned after coaxial adjustment to the center O1 of the rotating chuck 3. Is it the data on the V-shaped notch 82 of the wafer substrate 8 to be positioned after the coaxial adjustment?

[0093] Specifically, a polar coordinate system is established with the center O1 of the rotating suction cup 3 as the pole and the first direction as the polar axis, and the coordinates are determined according to the formula... and formula After determining the first endpoint E and the second endpoint F of the wafer substrate 8 to be positioned after coaxial adjustment, the endpoint coordinates of the first endpoint E of the wafer substrate 8 to be positioned after coaxial adjustment are determined in the polar coordinate system. The endpoint coordinates of the second endpoint F in the polar coordinate system .

[0094] in, The transition variable calculated for the current sampling. This will serve as a transition variable for the next sampling calculation. To determine the preset threshold for the first endpoint E and the second endpoint F; The rotation angle of the wafer substrate 8 to be positioned after the current sampling and adjustment of the coaxial axis; The rotation angle of the wafer substrate 8 to be positioned is adjusted after coaxial alignment for the next sampling. The distance from a point on the edge of the wafer substrate 8 to be positioned after the current sampling and adjustment of the coaxial direction to the center O1 of the rotating chuck 3; The distance from a point on the edge of the wafer substrate 8 to be positioned to the center O1 of the rotating chuck 3 after the coaxial adjustment for the next sampling.

[0095] Furthermore, based on endpoint coordinates and endpoint coordinates Determine the maximum angle value and minimum angle value And calculate the maximum angle value. and minimum angle value The difference Among them, the maximum angle value and minimum angle value The calculation formula is as follows:

[0096] ;

[0097] ;

[0098] Where max is the maximum value function and min is the minimum value function.

[0099] Specifically, if Then adjust the rotation angle of the coaxial wafer substrate 8 to be positioned. These points are on the V-shaped notch 82, and the remaining points are on the second circular edge 81 of the wafer substrate 8 to be positioned.

[0100] Specifically, if Then adjust the rotation angle of the coaxial wafer substrate 8 to be positioned. These points are on the V-shaped notch 82, and the remaining points are on the second circular edge 81 of the wafer substrate 8 to be positioned.

[0101] in, A threshold is set to determine the starting position of the V-shaped notch 82 of the wafer substrate 8 to be positioned.

[0102] Furthermore, if the rotation angle of the coaxial wafer substrate 8 to be positioned is adjusted... The distance from a point on the edge of the wafer substrate 8 to be positioned after coaxial adjustment to the center O1 of the rotating chuck 3. To adjust the data on the V-shaped notch 82 of the wafer substrate 8 to be positioned after coaxial alignment, a fourth-order polynomial is used to adjust the polar coordinates of the V-shaped notch 82. A fitting calculation was performed to determine the angular deviation of the V-shaped notch 82.

[0103] The formula for the fourth-degree polynomial is:

[0104] ;

[0105] That is:

[0106] ;

[0107] Among them, in China, For polar coordinates The results of the fitting; For polar coordinates The results of the fitting; For the first coefficient, For the coefficient of the second term, For the third coefficient, The coefficient of the fourth term; is the fifth coefficient; is the rotation angle of the wafer substrate 8 to be positioned after coaxial adjustment when the collected point is at the position of the V-shaped notch 82; is the rotation angle of the wafer substrate 8 to be positioned after coaxial adjustment When, the distance from the point on the edge of the wafer substrate 8 to be positioned to the center O1 of the rotary chuck 3; k is a constant, k = 4; n is the number of fitting terms.

[0108] Further, take the derivative of the quartic polynomial and set it equal to 0, that is , and solve this equation to obtain 3 roots; the minimum root value γ is the angular value of the bottom N of the V-shaped notch 82 in the polar coordinate system, that is, the angular deviation of the V-shaped notch.

[0109] Further, based on the angular deviation γ of the V-shaped notch, control the rotation of the rotary chuck to rotate the bottom N of the V-shaped notch 82 to the second reference line LB.

[0110] Specifically, if the angular deviation γ > A, control the rotary chuck 3 to rotate clockwise by an angle γ - A; if the angular deviation γ < A, control the rotary chuck 3 to rotate counterclockwise by an angle γ - A, so as to rotate the bottom N of the V-shaped notch 82 to the second reference line LB that is parallel to the first reference line LA and passes through the center O1 of the rotary chuck 3, and complete the positioning and deviation correction of the V-shaped notch 82 of the wafer substrate 8 to be positioned.

[0111] In some embodiments, the formula of the quartic polynomial is:

[0112] ;

[0113] Among them, is the result of fitting the polar coordinates ; is the result of fitting the polar coordinates ; is the first coefficient, is the second coefficient, is the third coefficient, is the fourth coefficient; is the fifth coefficient; the angular deviation of the V-shaped notch is the minimum root value obtained by taking the derivative operation of the quartic polynomial.

[0114] The wafer substrate positioning method provided in this embodiment can collect the edge data of the wafer substrate by using a deviation correction sensor and a direct drive motor. The data collection method is stable, reliable and low-cost; at the same time, using the direct drive motor to directly drive the vacuum rotary chuck to rotate can eliminate the reduction unit, with high stability and high positioning accuracy.

[0115] The present invention also provides a wafer substrate positioning device. Please refer to Figures 2 to 5 In this embodiment, the wafer substrate positioning device uses any of the above-mentioned wafer substrate positioning methods. The wafer substrate positioning device includes: a device body; a correction component, which is mounted on the device body and includes a correction mounting frame, a rotary chuck, and a correction sensor. The correction mounting frame is mounted on the device body, the rotary chuck is rotatably connected to the correction mounting frame, and the rotary chuck is used to place the wafer substrate to be positioned. The correction sensor is mounted on the correction mounting frame; and an adjustment mechanism, which is mounted on the device body and is arranged opposite to the correction component.

[0116] The present invention also provides an electronic device. Figure 6 This is a schematic diagram of the structure of the electronic device provided by the present invention, such as... Figure 6 As shown, the electronic device may include a processor 610, a communications interface 620, a memory 630, and a communication bus 640, wherein the processor 610, the communications interface 620, and the memory 630 communicate with each other via the communication bus 640. The processor 610 can call logic instructions in the memory 630 to execute a wafer substrate positioning method.

[0117] Furthermore, the logical instructions in the aforementioned memory 630 can be implemented as software functional units and, when sold or used as independent products, can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0118] The present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, is implemented to perform the wafer substrate positioning method provided by the methods described above.

[0119] The present invention also provides a computer program product, the computer program product including a computer program, the computer program being stored on a non-transitory computer-readable storage medium, and when the computer program is executed by a processor, the computer is able to execute the wafer substrate positioning method provided by the above methods.

[0120] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. Those skilled in the art can understand and implement this without any creative effort.

[0121] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented by means of software plus necessary general-purpose hardware platforms, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solutions, in essence or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, magnetic disk, optical disk, etc., and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute the methods described in the various embodiments or some parts of the embodiments.

[0122] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method of positioning a wafer substrate, comprising: The application is applied to a wafer substrate positioning device, which comprises a deviation rectifying assembly and an adjusting mechanism, wherein the deviation rectifying assembly comprises a deviation rectifying mounting frame, a rotating chuck and a deviation rectifying sensor, the rotating chuck is rotationally connected to the deviation rectifying mounting frame, and the deviation rectifying sensor is mounted on the deviation rectifying mounting frame; the adjusting mechanism and the deviation rectifying assembly are oppositely arranged in a first direction. The method comprises: obtaining a radius R of a calibration piece, a first shielding amount t of the deviation rectifying sensor to the calibration piece and a first reference line LA; Placing a wafer substrate to be positioned on the rotating chuck, controlling the rotating chuck to rotate, and collecting a rotation angle θ of the wafer substrate to be positioned in real time during rotation of the rotating chuck i and a second shielding amount P of the wafer substrate to be positioned by the deviation correction sensor i ; based on a radius R of the reticle, the second amount of shielding P i and the first amount of shielding t, determine a distance L from the center of the spin chuck to a point on the edge of the wafer substrate to be positioned i ; determining a rotation angle θ of the wafer substrate to be positioned i and a distance L from a center of the spin chuck to a point on an edge of the wafer substrate to be positioned i whether the data is on a second circular edge of the wafer substrate to be positioned; if the rotation angle θ of the wafer substrate to be positioned i and the distance L of the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck i is the data on the second circle edge of the wafer substrate to be positioned, then according to the rotation angle θ of the wafer substrate to be positioned i and the distance L of the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck i , the center coordinates (a, b) of the center of the circle of the wafer substrate to be positioned in the rectangular coordinate system are fitted based on the least square method; the rectangular coordinate system takes the center of the rotating chuck as the origin, takes the first direction as the horizontal axis, and takes the second direction as the vertical axis, and the second direction is perpendicular to the first direction; determining a center position deviation δ and an angle deviation β between the center of the wafer substrate to be positioned and the center of the rotating chuck based on the center coordinates (a, b); positioning and rectifying the center of the wafer substrate to be positioned by the adjusting mechanism according to the center position deviation δ, the angle deviation β and the first reference line LA; after the positioning and rectifying of the center of the wafer substrate to be positioned is completed, positioning and rectifying a V-shaped notch of the wafer substrate to be positioned; the positioning and rectifying of the center of the wafer substrate to be positioned by the adjusting mechanism according to the center position deviation δ, the angle deviation β and the first reference line LA comprises: controlling the rotating chuck to rotate and rotate the center of the wafer substrate to be positioned to a second reference line LB based on the angle deviation β; the second reference line LB passes through the center of the rotating chuck, and the second reference line is parallel to the first reference line LA; moving the wafer substrate to be positioned by the adjusting mechanism based on the center position deviation δ so that the center of the wafer substrate to be positioned is coaxial with the center of the rotating chuck; the positioning and rectifying of the V-shaped notch of the wafer substrate to be positioned after the positioning and rectifying of the center of the wafer substrate to be positioned is completed comprises: after it is determined that the center of the wafer substrate to be positioned is coaxial with the center of the rotating chuck, a wafer substrate to be positioned coaxially is obtained; controlling the rotation of the rotary chuck, and collecting the rotation angle θ of the coaxial wafer substrate to be positioned in real time during the rotation of the rotary chuck i and the third shielding amount P of the coaxial wafer substrate to be positioned by the deviation correction sensor i ′; based on a radius R of the fiducial, the first amount of occlusion t, and the third amount of occlusion P i ′, determining a distance L of a point on the edge of the co-planar wafer substrate to be positioned to the center of the spin chuck i ′; judging whether the distance L from the center of the rotating chuck to a point on the edge of the coaxial wafer substrate to be positioned is data on a V-shaped notch of the coaxial wafer substrate to be positioned i ′ i ′ If the rotation angle θ of the coaxial wafer substrate to be positioned i and the distance L of the point on the edge of the coaxial wafer substrate to be positioned to the center of the rotating chuck i is the data on the V-shaped notch of the coaxial wafer substrate to be positioned, then a quartic polynomial is used to fit the polar coordinates (θ i ′, L i ′) of the V-shaped notch to determine the angle deviation of the V-shaped notch. controlling the rotating chuck to rotate and rotating the bottom of the V-shaped notch to the second reference line LB based on the angle deviation of the V-shaped notch; the formula of the quartic polynomial is: L=a0+a1*θ+a2*θ 2 +a3*θ 3 +a4*θ 4 ; Where L is the polar coordinate (θ) i ′,L i L in ′) i The result of fitting θ to the polar coordinates (θ'); θ is the result of fitting the polar coordinates (θ''). i ′,L i θ in ′) i The results of the fitting are: a1 is the first coefficient, a2 is the second coefficient, a3 is the third coefficient, a4 is the fourth coefficient, and a0 is the fifth coefficient. the angle deviation of the V-shaped notch is a minimum root value obtained by performing a derivative operation on the quartic polynomial.

2. The wafer substrate positioning method according to claim 1, wherein the calculation formula of the center position deviation δ is: x i = L i cos(θ i ); y i = L i sin(θ i ); wherein x i is a first transition variable; y i is a second transition variable; a is the abscissa of the center coordinate (a, b); and b is the ordinate of the center coordinate (a, b). the calculation formula of the angle deviation β is: wherein π is a circular constant, a is the horizontal coordinate of the center coordinates (a, b), and b is the vertical coordinate of the center coordinates (a, b).

3. The wafer substrate positioning method according to claim 1, wherein the V-shaped notch comprises a first end point and a second end point; judging whether the data of the second circle edge of the wafer substrate to be positioned is the data of the first circle edge of the wafer substrate to be positioned i and the distance L from the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck i whether the data of the second circle edge of the wafer substrate to be positioned is the data of the first circle edge of the wafer substrate to be positioned a rotation angle θ of the wafer substrate to be positioned according to the current sampling i and a distance L of a point on the edge of the wafer substrate to be positioned according to the current sampling to the center of the rotary chuck i a rotation angle θ of the wafer substrate to be positioned according to the next sampling i+1 and a distance L of a point on the edge of the wafer substrate to be positioned according to the next sampling to the center of the rotary chuck i+1 determine a first end point coordinate (θ e ,L e ) of the first end point and a second end point coordinate (θ f ,L f ) of the second end point in a polar coordinate system respectively; the polar coordinate system takes the center of the rotary chuck as the polar point and the first direction as the polar axis; based on the first end point coordinate (θ e ,L e ) and the second end point coordinate (θ f ,L f ), determine a maximum angle value θ max and a minimum angle value θ min , and calculate a difference value of the maximum angle value θ max and the minimum angle value θ min ; based on the difference, determine the rotation angle θ of the wafer substrate to be positioned i and the distance L from the point on the edge of the wafer substrate to be positioned to the center of the rotating chuck i whether the data is on the second circular edge of the wafer substrate to be positioned; Wherein the first endpoint and the second endpoint satisfy and |Δ i+1 -Δ i |>g;Δ i is a transition variable calculated for the current sampling, Δ i+1 is a transition variable calculated for the next sampling, and g is a preset threshold value for judging the first endpoint and the second endpoint.

4. A wafer substrate positioning apparatus, characterized by, the wafer substrate positioning device comprises: a device main body; a deviation rectifying assembly mounted on the device main body, the deviation rectifying assembly comprising a deviation rectifying mounting frame, a rotating chuck and a deviation rectifying sensor, the deviation rectifying mounting frame being mounted on the device main body, the rotating chuck being rotationally connected to the deviation rectifying mounting frame, the rotating chuck being used for placing a wafer substrate to be positioned, and the deviation rectifying sensor being mounted on the deviation rectifying mounting frame; An adjusting mechanism is mounted on the device body, and the adjusting mechanism and the deviation rectifying assembly are oppositely arranged.

5. An electronic device comprising a memory, a processor, and a computer program stored on the memory and executable on the processor, characterized in that, The computer program is executed by the processor to implement the wafer substrate positioning method according to any one of claims 1 to 3.

6. A non-transitory computer-readable storage medium having stored thereon a computer program, characterized in that, The computer program is executed by the processor to implement the wafer substrate positioning method according to any one of claims 1 to 3.

7. A computer program product comprising a computer program, characterized in that, The computer program is executed by the processor to implement the wafer substrate positioning method according to any one of claims 1 to 3. The computer program is executed by the processor to implement the wafer substrate positioning method according to any one of claims 1 to 3.

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