Electronic device
By setting up decorative ring components and shielding covers on the housing of the electronic device, a larger installation space is provided, which solves the problem of low space utilization due to the setting of openings on the main circuit board, and achieves higher speaker performance and circuit board space utilization.
Patent Information
- Application Number
- CN202411811983.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-10
- Publication Date
- 2025-03-07
Smart Images

Figure CN119583695A_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to an electronic equipment. Background Art
[0002] In the related art, the electronic device has a speaker, and the speaker is arranged in the area where the main circuit board is located. In order to ensure that the speaker has sufficient installation space, an opening needs to be provided at a position corresponding to the speaker on the main circuit board, and the speaker is installed in the opening. However, since the opening needs to be provided on the main circuit board, the opening occupies the main circuit board, reducing the area on the main circuit board where components can be arranged, thereby resulting in low space utilization of the main circuit board. Summary of the invention
[0003] The present application aims to provide an electronic device, which at least solves one of the problems that an opening provided on a main circuit board occupies the space of the main circuit board, thereby resulting in low space utilization of the main circuit board.
[0004] In order to solve the above technical problems, this application is implemented as follows:
[0005] In the first aspect, an embodiment of the present application proposes an electronic device, including a shell, a circuit board, a shielding cover, a decorative ring assembly and a speaker module; the shell is provided with a first opening and a first sound outlet; the circuit board is arranged in the shell; the shielding cover is arranged on the circuit board, and is located on the side of the circuit board close to the first opening; the decorative ring assembly covers the first opening and protrudes from the outer wall surface of the shell; the speaker module includes a box body and a speaker, the box body is arranged between the shielding cover and the decorative ring assembly, the speaker is arranged in the box body, and the side of the speaker close to the circuit board and the box body enclose a first sound cavity, and the first sound cavity is connected to the first sound outlet.
[0006] The electronic device provided by the present application has a larger installation space between the decorative ring assembly and the shielding cover because the cover of the decorative ring assembly protrudes from the outer wall surface of the housing. A larger speaker module can also be installed in the larger installation space, thereby improving the overall performance of the speaker module. In addition, the speaker module is installed between the decorative ring assembly and the shielding cover, which reduces the encroachment on the circuit board due to the installation of the speaker module, increases the area on the circuit board where devices can be arranged, and improves the space utilization of the circuit board. Since the circuit board has a larger area where devices can be arranged, the arrangement of devices on the circuit board is more flexible.
[0007] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0008] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:
[0009] Figure 1 is a cross-sectional view of an electronic device according to an embodiment of the present application;
[0010] Figure 2 is one of the partial schematic diagrams of an electronic device according to an embodiment of the present application;
[0011] Figure 3 is an exploded view of a speaker module according to an embodiment of the present application;
[0012] Figure 4 is a schematic structural diagram of a first sound cavity, a first sound output channel, and a resonance cavity according to an embodiment of the present application;
[0013] Figure 5 is a second partial schematic diagram of an electronic device according to an embodiment of the present application;
[0014] Figure 6 for Figure 5 A cross-sectional view of an electronic device along CC according to an embodiment of the present application is shown;
[0015] Figure 7 is a third partial schematic diagram of an electronic device according to an embodiment of the present application;
[0016] Figure 8 This is a fourth partial schematic diagram of an electronic device according to an embodiment of the present application.
[0017] Reference numerals:
[0018] 100 shell, 110 first opening, 120 first sound outlet hole, 122 first through hole, 124 first gap, 130 frame, 132 second opening, 140 frame, 142 first channel, 150 second sound outlet channel, 160 outer wall, 170 back cover, 200 circuit board, 210 gap, 300 shielding cover, 400 decorative ring assembly, 410 decorative plate, 500 speaker module, 510 box, 512 first box, 514 second box, 516 second sound outlet hole, 520 speaker, 530 first sound cavity, 540 second sound cavity, 550 resonant cavity, 560 first sound outlet channel, 562 second channel, 564 third channel, 570 first sealing foam, 600 screen module, 700 second camera module, 710 first camera module, 800 decorative ring, 900 second sealing foam. DETAILED DESCRIPTION
[0019] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.
[0020] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.
[0021] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0022] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0023] Combine the following Figures 1 to 8 An electronic device according to an embodiment of the present application is described.
[0024] like Figure 1As shown, an electronic device according to some embodiments of the present application includes a shell 100, a circuit board 200, a shielding cover 300, a decorative ring assembly 400 and a speaker module 500; the shell 100 is provided with a first opening 110 and a first sound outlet 120; the circuit board 200 is arranged in the shell 100; the shielding cover 300 is arranged on the circuit board 200, and is located on a side of the circuit board 200 close to the first opening 110; the decorative ring assembly 400 covers the first opening 110 and protrudes from the outer wall surface 160 of the shell 100; the speaker module 500 includes a box body 510 and a speaker 520, the box body 510 is arranged between the shielding cover 300 and the decorative ring assembly 400, the speaker 520 is arranged in the box body 510, and a side of the speaker 520 close to the circuit board 200 and the box body 510 enclose a first sound cavity 530, and the first sound cavity 530 is connected to the first sound outlet 120.
[0025] In this embodiment, the electronic device includes a shell 100, a circuit board 200 and a shielding cover 300. The shielding cover 300 is arranged on the circuit board 200 and is located on a side of the circuit board 200 close to the first opening 110. The circuit board 200 is arranged in the shell 100, and the circuit board 200 is installed and accommodated by the shell 100.
[0026] The electronic device also includes a decorative ring assembly 400 and a speaker module 500. The shell 100 is provided with a first opening 110, and the position of the first opening 110 is opposite to the shielding cover 300. The decorative ring assembly 400 covers the first opening 110 and protrudes from the outer wall surface 160 of the shell 100. There is an installation space between the decorative ring assembly 400 and the shielding cover 300.
[0027] The electronic device also includes a speaker module 500, which is disposed in the installation space between the decorative ring assembly 400 and the shielding cover 300, thereby achieving installation and fixation of the speaker module 500 and improving the stability of the speaker module 500 during operation of the electronic device.
[0028] The shell 100 is provided with a first sound outlet 120, and the speaker module 500 includes a box body 510 and a speaker 520. The box body 510 is arranged between the shielding cover 300 and the decorative ring assembly 400, and the speaker 520 is arranged in the box body 510. The side of the speaker 520 close to the circuit board 200 and the box body 510 enclose a first sound cavity 530, and the first sound cavity 530 is connected with the first sound outlet 120. When the electronic device makes a sound through the speaker module 500, the sound generated by the speaker 520 is transmitted to the first sound outlet 120 through the first sound cavity 530, and then the sound is transmitted to the outside of the electronic device through the first sound outlet 120.
[0029] Since the decorative ring assembly 400 is protruding from the outer wall surface 160 of the housing 100, there is a larger installation space between the decorative ring assembly 400 and the shielding cover 300, and a larger speaker module 500 can be installed in the larger installation space, thereby improving the overall performance of the speaker module 500. In addition, the speaker module 500 is installed between the decorative ring assembly 400 and the shielding cover 300, which reduces the encroachment on the circuit board 200 caused by the installation of the speaker module 500, increases the area on the circuit board 200 where components can be arranged, and improves the space utilization of the circuit board 200. Since the circuit board 200 has a larger area where components can be arranged, the arrangement of components on the circuit board 200 is more flexible.
[0030] Specifically, the first sound cavity 530 is the front sound cavity of the speaker module 500 .
[0031] According to some embodiments of the present application, Figure 1 As shown, the box body 510 is provided with a first sound outlet channel 560 , a first end of the first sound outlet channel 560 is communicated with the first sound cavity 530 , and a second end of the first sound outlet channel 560 faces the first sound outlet hole 120 .
[0032] In this embodiment, the box body 510 is provided with a first sound outlet channel 560, and the two ends of the first sound outlet channel 560 are respectively connected to the first sound cavity 530 and the first sound outlet hole 120, and the sound generated by the speaker 520 is transmitted from the first sound cavity 530 to the first sound outlet hole 120 through the first sound outlet channel 560, thereby realizing the sound of the speaker module 500. Since there is a larger installation space between the decorative ring assembly 400 and the shielding cover 300, the design of the first sound outlet channel 560 is flexible, and the sound quality of the speaker module 500 is further improved.
[0033] According to some embodiments of the present application, Figure 1 As shown, the housing 100 includes a frame 130 and a border 140 ; the circuit board 200 is disposed in the frame 130 , and the border 140 is arranged around the frame 130 ; the first sound outlet 120 includes a first through hole 122 , and the first through hole 122 is disposed in the frame 130 .
[0034] In this embodiment, the housing 100 includes a frame 130 and a frame 140; the circuit board 200 is disposed on the frame 130, thereby realizing the installation and fixation of the circuit board 200. The frame 140 is arranged around the frame 130; the first sound outlet 120 includes a first through hole 122, and the first through hole 122 is disposed on the frame 130, thereby enabling the sound generated by the speaker module 500 to be transmitted to the outside of the electronic device through the first through hole 122 disposed on the frame 140, thereby realizing the external speaker function of the electronic device.
[0035] Furthermore, the housing 100 further includes a back cover 170 . The back cover 170 covers the frame 140 and the frame body 130 . The first opening 110 is disposed on the back cover 170 .
[0036] According to some embodiments of the present application, Figure 1 As shown, the speaker module 500 also includes a first sealing foam 570 , which covers the second end of the first sound outlet channel 560 , one side of the first sealing foam 570 is connected to the box body 510 , and the other side is connected to the frame 140 .
[0037] In this embodiment, the speaker module 500 further includes a first sealing foam 570, which is disposed between the box body 510 and the frame 140 and covers the second end of the first sound outlet channel 560, thereby achieving a waterproof seal between the box body 510 and the frame 140, thereby improving the sealing effect of the electronic device. Furthermore, the waterproof seal between the box body 510 and the frame 140 is achieved by the first sealing foam 570, which simplifies the sealing structure and reduces the difficulty of sealing.
[0038] Furthermore, the box body 510 and the frame 140 may be sealed by a silicone sealant.
[0039] Furthermore, one side of the first sealing foam 570 is bonded to the box body 510 , and the other side of the first sealing foam 570 is bonded to the frame 140 .
[0040] According to some embodiments of the present application, Figure 1 As shown, there is a gap 210 between the circuit board 200 and the frame 140 , and at least a portion of the second end of the first sound outlet channel 560 and at least a portion of the first sealing foam 570 extend into the gap 210 .
[0041] In this embodiment, there is a gap 210 between the circuit board 200 and the frame 140, and the first sound output channel 560 and the first sealing foam 570 extend into the gap 210. The gap 210 between the circuit board 200 and the frame 140 provides more sufficient installation space for the installation of the first sound output channel 560 and the first sealing foam 570. The first sound output channel 560 can have a larger volume, thereby improving the sound output effect of the speaker module 500, thereby improving the sound quality of the speaker module 500.
[0042] According to some embodiments of the present application, Figure 1 As shown, the electronic device further includes a screen module 600 , which is disposed on a side of the frame 130 away from the decorative ring assembly 400 ; the first sound outlet 120 further includes a first gap 124 , which is located between the frame 140 and the screen module 600 .
[0043] In this embodiment, a first gap 124 is provided between the frame 140 and the screen module 600, and the sound generated by the speaker module 500 can be output through the first gap 124. When the user is talking on the electronic device, the sound generated by the speaker module 500 can be transmitted to the user's ear through the first gap 124, thereby improving the privacy of the sound transmission of the electronic device.
[0044] Specifically, a side of the circuit board 200 close to the frame 140 is broken, so that a gap 210 is formed between the circuit board 200 and the frame 140 .
[0045] Furthermore, the diaphragm of the speaker 520 is placed toward the screen module 600 , and the diaphragm is directly opposite to the first sound cavity 530 .
[0046] According to some embodiments of the present application, Figure 1 As shown, the frame 140 is provided with a first channel 142 , a first end of the first channel 142 faces the first sound outlet channel 560 , a second end of the first channel 142 is communicated with the first gap 124 , and the first channel 142 is communicated with the first through hole 122 .
[0047] In this embodiment, the frame 140 is provided with a first channel 142, the first channel 142 is connected to the first sound output channel 560, and the first channel 142 passes through the first through hole 122 and the first gap 124 in sequence, so that the sound generated by the speaker module 500 can be transmitted to the first through hole 122 and the first gap 124 respectively through the first channel 142, thereby facilitating the electronic device to control the sound output direction.
[0048] Furthermore, if Figure 1 As shown, the diaphragm of the speaker 520 vibrates to emit sound waves. Figure 1 The light is transmitted in the direction indicated by the arrow A through the first sound cavity 530 , the first sound output channel 560 , the first channel 142 and the first gap 124 to the outside of the electronic device.
[0049] like Figure 1 As shown, the diaphragm of the speaker 520 vibrates to emit sound waves. Figure 1 The light is transmitted in the direction indicated by the middle arrow B through the first sound cavity 530 , the first sound output channel 560 , the first channel 142 and the first through hole 122 to the outside of the electronic device.
[0050] According to some embodiments of the present application, Figure 2 , Figure 3 and Figure 4 As shown, there are multiple first sound output channels 560 , which are arranged in parallel, and the first ends of the multiple first sound output channels 560 are respectively connected to the first sound cavity 530 .
[0051] In this embodiment, a plurality of first sound output channels 560 are arranged in parallel and are respectively connected to the first sound cavity 530 , thereby increasing the sound output area of the speaker module 500 , improving the flow rate and bandwidth of the speaker 520 , and thereby improving the sound quality of the speaker module 500 .
[0052] Specifically, the mid- and high-frequency performance of the closed speaker 520 system is mainly related to the volume of the first sound cavity 530 .
[0053] Among them, F h is the high frequency cut-off frequency, s is the sound output area of the first sound output hole 120 , and v is the volume of the first sound cavity 530 .
[0054] The larger the volume of the first sound cavity 530 is, the forward shift of the peak frequency of the high-frequency cutoff frequency will cause attenuation in the frequency band after the high-frequency cutoff frequency. A larger high-frequency cutoff frequency can effectively improve the high-frequency attenuation. Reasonable setting of the volume of the first sound cavity 530 can avoid the loss of high frequency and cause a deterioration in the listening experience, thereby improving the high-frequency quality of the speaker 520.
[0055] According to some embodiments of the present application, Figure 2 , Figure 3 and Figure 4 As shown, the plurality of first sound outlet channels 560 include a second channel 562 and a third channel 564 , and the second end of the second channel 562 extends in a direction away from the second end of the third channel 564 .
[0056] In this embodiment, the second end of the second channel 562 extends in a direction away from the second end of the third channel 564, so that the second channel 562 and the third channel 564 extend in a V-shape, so that the sound generated by the speaker module 500 can extend to a wide area, further improving the sound effect of the speaker module 500.
[0057] According to some embodiments of the present application, Figure 1 and Figure 3 As shown, the speaker 520 and the box body 510 on one side close to the decorative ring assembly 400 enclose a second sound cavity 540 .
[0058] In this embodiment, the speaker 520 and the side of the box 510 close to the decorative ring assembly 400 enclose a second sound cavity 540, and the side of the box 510 close to the decorative ring assembly 400 can extend to the side close to the decorative ring assembly 400, and the decorative ring assembly 400 protrudes from the outer wall of the housing 100, so the side of the box 510 close to the decorative ring assembly 400 can have a larger installation space, thereby making the second sound cavity 540 have a larger volume, improving the low-frequency sensitivity of the speaker module 500, improving the low-frequency sound quality of the speaker module 500, and further improving the quality of the speaker module 500. In addition, the second sound cavity 540 can make fuller use of the space inside the decorative ring assembly 400, improve the flow rate and frequency response of the speaker module 500, and further improve the performance of the speaker module 500.
[0059] Furthermore, if Figure 1 and Figure 3 As shown, the box 510 includes a first box 512 and a second box 514. The second box 514 is connected to the shell 100 and to the first box 512, and is located on the side of the first box 512 away from the circuit board 200. One side of the speaker 520 is connected to the first box 512, and the other side is connected to the second box 514. A first sound cavity 530 is formed between the speaker 520 and the first box 512, and a second sound cavity 540 is formed between the speaker 520 and the second box 514.
[0060] The second box 514 is connected to the housing 100, thereby realizing the installation and fixation of the speaker module 500. A first sound cavity 530 is formed between the speaker 520 and the first box 512, and the first sound cavity 530 can be used as the front sound cavity of the speaker module 500. A second sound cavity 540 is formed between the speaker 520 and the second box 514, and the second sound cavity 540 can be used as the rear sound cavity of the speaker module 500. Further, a closed second sound cavity 540 is formed between the speaker 520 and the second box 514.
[0061] According to some embodiments of the present application, Figure 4 As shown, the box body 510 is provided with a resonance cavity 550 , and the resonance cavity 550 is arranged in parallel with the first sound cavity 530 and is communicated with the first sound cavity 530 .
[0062] In this embodiment, the box body 510 is provided with a resonance cavity 550, which is arranged in parallel with the first sound cavity 530 and is connected with the first sound cavity 530, thereby increasing the volume of the first sound cavity 530, which can effectively improve the high-frequency performance of the speaker module 500. At the same time, the frequency response trough formed by the resonance cavity 550 is relatively high, and the external sibilance of the speaker module 500 can also be optimized, thereby further improving the quality of the speaker module 500.
[0063] Furthermore, the resonant cavity 550 is disposed in the first box 512 .
[0064] The resonant cavity 550 is arranged at the side of the first sound cavity 530 , and a communication channel is arranged between the resonant cavity 550 and the first sound cavity 530 , and the resonant cavity 550 is communicated with the first sound cavity 530 through the communication channel.
[0065] According to some embodiments of the present application, Figure 5 and Figure 6 As shown, a second opening 132 is provided on the frame 130; the box 510 is provided with a second sound hole 516 connected to the first sound cavity 530, and the second sound hole 516 faces the second opening 132; there is a second sound outlet channel 150 between the frame 130 and the screen module 600, and the second sound outlet channel 150 extends from the second opening 132 to the first gap 124.
[0066] In this embodiment, the frame 130 is provided with a second opening 132, the box 510 is provided with a second sound outlet hole 516 communicating with the first sound cavity 530, and a second sound outlet channel 150 is provided between the frame 130 and the screen module 600. The first sound cavity 530 is communicated with the first gap 124 through the second sound outlet hole 516, the second opening 132 and the second sound outlet channel 150, so that the sound generated by the speaker module 500 can pass through the second sound outlet hole 516, the second opening 132 and the second sound outlet channel 150, and then be transmitted to the outside of the electronic device through the first gap 124, simplifying the structure of the speaker module 500, making the arrangement of the sound outlet channel of the speaker module 500 simpler, reducing the assembly cost of the electronic device, and facilitating the mass reuse of the upper speaker module 500. In addition, the second sound outlet channel 150 is provided between the frame 130 and the screen module 600, which has less impact on the layout of the circuit board 200, and is conducive to the extreme stacking of the circuit board 200.
[0067] Specifically, the second sound outlet 516 is disposed in the first box body 512 .
[0068] According to some embodiments of the present application, Figure 5 and Figure 6 As shown, the first camera module 710 is arranged on a side of the circuit board 200 close to the first gap 124, and the first camera module 710 faces the screen module 600; the second sound output channel 150 passes through the space between the first camera module 710 and the screen module 600, and is connected to the first gap 124.
[0069] In this embodiment, the second sound output channel 150 is arranged by utilizing the space between the first camera module 710 and the screen module 600, which further simplifies the structure of the electronic device and improves the space utilization of the electronic device.
[0070] Furthermore, there are multiple second sound output channels 150, and at least two of the multiple second sound output channels 150 are arranged on both sides of the first camera module 710 of the electronic device. Only one second sealing foam 900 is required between the circuit board 200 and the speaker module 500 to achieve the sealing effect, which can save auxiliary material costs and reduce engineering assembly requirements.
[0071] A second sealing foam 900 is disposed between the box body 510 and the frame body 130 .
[0072] Furthermore, if Figure 6 As shown, the first gap 124 is arranged in the Y direction of the first camera module 710.
[0073] When the electronic device is a mobile phone, an opening is set on the circuit board 200, and the speaker module 500 is set in the opening. The opening area is 450mm 2 The arrangement of the speaker module 500 provided in the present application does not require a large area of holes to be made on the circuit board 200. A hole is only made at the sealing position between the circuit board 200 and the second opening 132. The size of the hole on the circuit board 200 is 7.6mm×3.3mm. Components are arranged on both sides of the circuit board. The area occupied by the hole on the circuit board 200 where the components are arranged is about 50mm. 2 That is, the impact on the stacking layout of the circuit board 200 is relatively small.
[0074] Specifically, the diaphragm of the speaker 520 vibrates to emit sound waves. Figure 6 The light is transmitted in the direction indicated by the arrow D through the first sound cavity 530 , the second sound outlet hole 516 , the second opening 132 , the second sound outlet channel 150 and the first gap 124 to the outside of the electronic device.
[0075] According to some embodiments of the present application, Figure 7 and Figure 8 As shown, the electronic device also includes a second camera module 700, and the number of the second camera modules 700 is multiple.
[0076] like Figure 7 As shown, the speaker module 500 is disposed between multiple second camera modules 700 .
[0077] like Figure 8 As shown, there is at least one second camera module 700 , and the speaker module 500 is disposed on the side of at least one second camera module 700 .
[0078] In this embodiment, the speaker module 500 is disposed between multiple second camera modules 700, or the speaker module 500 is disposed on the side of at least one second camera module 700, so that the speaker module 500 and the second camera module 700 are arranged more closely, thereby improving the space utilization inside the electronic device.
[0079] According to some embodiments of the present application, Figure 1 and Figure 6 As shown, the decoration ring assembly 400 further includes a decoration ring 800 and a decoration plate 410 . The decoration ring 800 is arranged along the edge of the first opening 110 and protrudes from the outer wall surface 160 of the housing 100 ; the decoration plate 410 covers the decoration ring 800 .
[0080] In this embodiment, the decorative ring 800 protrudes from the outer wall surface 160 of the shell 100, and the decorative plate 410 is covered on the decorative ring 800, so that the space enclosed by the decorative ring 800 can protrude from the outer wall surface 160 of the shell 100, and part of the speaker module 500 is arranged in the decorative ring 800, so that the speaker module 500 has a larger installation space, further improving the sound quality of the speaker module 500.
[0081] According to some embodiments of the present application, the electronic device includes a mobile phone, a tablet computer, a smart wearable device or a laptop computer.
[0082] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.
[0083] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.
Claims
1. An electronic device, characterized in that: include: A housing, wherein the housing is provided with a first opening and a first sound outlet; A circuit board, wherein the circuit board is arranged in the housing; A shielding cover, the shielding cover is arranged on the circuit board and is located on a side of the circuit board close to the first opening; A decorative ring assembly, the decorative ring assembly is covered on the first opening and protrudes from the outer wall surface of the shell; A speaker module, the speaker module includes a box and a speaker, the box is arranged between the shielding cover and the decorative ring assembly, the speaker is arranged in the box, the side of the speaker close to the circuit board and the box enclose a first sound cavity, and the first sound cavity is connected to the first sound outlet.
2. The electronic device according to claim 1, characterized in that: The box body is provided with a first sound outlet channel, a first end of the first sound outlet channel is communicated with the first sound cavity, and a second end of the first sound outlet channel faces the first sound outlet hole.
3. The electronic device according to claim 2, characterized in that: The housing comprises a frame and a frame; the circuit board is arranged in the frame, and the frame is arranged around the frame; The first sound outlet hole includes a first through hole, and the first through hole is disposed in the frame body.
4. The electronic device according to claim 3, characterized in that: The speaker module also includes: A first sealing foam, wherein the first sealing foam covers the second end of the first sound outlet channel, one side of the first sealing foam is connected to the box body, and the other side of the first sealing foam is connected to the frame.
5. The electronic device according to claim 4, characterized in that: A gap is provided between the circuit board and the frame, and at least a portion of the second end of the first sound outlet channel and at least a portion of the first sealing foam extend into the gap.
6. The electronic device according to claim 3, characterized in that: Also includes: A screen module, wherein the screen module is arranged on a side of the frame away from the decorative ring assembly; The first sound outlet further includes a first gap, and the first gap is located between the frame and the screen module.
7. The electronic device according to claim 6, characterized in that: The frame is provided with a first channel, a first end of the first channel faces the first sound output channel, a second end of the first channel is communicated with the first gap, and the first channel is communicated with the first through hole.
8. The electronic device according to claim 6, characterized in that: The number of the first sound output channels is multiple; A plurality of the first sound output channels are arranged in parallel, and first ends of the plurality of the first sound output channels are respectively connected to the first sound cavity; and / or The plurality of first sound output channels include a second channel and a third channel, and the second end of the second channel extends in a direction away from the second end of the third channel.
9. The electronic device according to any one of claims 6 to 8, characterized in that: The speaker and the box body form a second sound cavity on one side close to the decorative ring assembly; and / or The box body is provided with a resonant cavity, which is arranged in parallel with the first sound cavity and is communicated with the first sound cavity.
10. The electronic device according to claim 9, characterized in that: The frame is provided with a second opening; The box body is provided with a second sound outlet hole communicating with the first sound cavity, and the second sound outlet hole faces the second opening; A second sound outlet channel is provided between the frame and the screen module, and the second sound outlet channel extends from the second opening to the first gap.
11. The electronic device according to claim 10, characterized in that: Also includes: A first camera module, which is disposed on a side of the circuit board close to the first slit and faces the screen module; The second sound output channel passes through the space between the first camera module and the screen module and is connected to the first gap.