A GaN power device

Abstract

The present invention discloses a GaN power device, which relates to the technical field of semiconductor devices, and comprises a main body and a plurality of pins arranged on the GaN power device body. The GaN power device can push the solder paste diffused between two adjacent pins to a position close to the pins during patching; during welding, it can absorb the heat on the circuit board, and at the same time, it can separate two adjacent pins, and can scrape and clean the excess solder paste after melting to avoid the solder paste from connecting together after melting; after welding, the hollow plate can effectively support the main body, and at the same time, it can ensure that there is a certain distance between the GaN power device body and the circuit board, and under the joint action of the hollow plate and the through hole, the heat dissipation effect of the GaN power device body can be improved, thereby improving the use effect of the GaN power device and increasing its service life.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor devices, and in particular to a GaN power device. Background Art

[0002] ‌GaN power device is a high-performance power semiconductor device based on gallium nitride (GaN) material‌. As a typical representative of the third-generation semiconductor materials, GaN has significant characteristics such as high frequency, high power and low energy consumption. In terms of key performance such as bandgap width, breakdown field strength, electron mobility, thermal conductivity and maximum operating temperature, GaN shows obvious advantages over traditional semiconductor materials. These characteristics make GaN power devices widely used in many fields such as communications, radar, satellites, power electronics, etc., and gradually become the core components in these fields. It is mainly composed of a main body and multiple pins. When in use, it needs to be soldered to the pad of the circuit board. When soldering, it is necessary to first use a solder paste printer to print solder paste on the pad of the circuit board, and then transport it to the placement machine to place the GaN power device on the placement operation so that the pin is placed on the solder paste. Finally, it is transported to the reflow soldering machine. There is a heating area inside the reflow soldering machine, which is used to heat the circuit board after placement, melt the solder paste and solder the pin to the pad together‌‌.

[0003] However, when the existing GaN power devices are in use, during soldering, during the process of solder paste printing and patching, the solder paste is easily diffused to the area between two adjacent pins. After the soldering is completed, the solder paste may be connected to each other when it melts, forming a short circuit or poor welding, affecting the quality of the welding. At the same time, during the welding process, the temperature of the heating area is high, which is easy to cause damage to the circuit board and the GaN power device. Moreover, after the welding is completed, the GaN power device is directly attached to the circuit board, and the heat dissipation effect is poor. The GaN power device may generate a large amount of heat during operation, which is easy to cause a sharp increase in the junction temperature, and may even cause the GaN power device to burn out, affecting its use effect and life.

[0004] To this end, we propose a GaN power device. Summary of the invention

[0005] The object of the present invention is to provide a GaN power device to solve the problems raised in the above background technology.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solution: a GaN power device, comprising a main body and a plurality of pins arranged on the GaN power device body, the bottom of the main body is connected to two symmetrically arranged U-shaped plates through a moving mechanism, and the side wall fixed sleeve of each U-shaped plate is provided with a plurality of hollow plates arranged in an array, the top of the hollow plate is in contact with the bottom of the main body, and the hollow plate is filled with alcohol, and the side wall of each hollow plate is provided with a scraping mechanism, and the scraping mechanism is used to scrape and clean excess solder paste between two adjacent pins.

[0007] Preferably, the scraping mechanism comprises two symmetrically arranged scrapers fixedly connected to the side wall of the hollow plate, and each scraper comprises a first inclined surface.

[0008] Preferably, the moving mechanism includes two symmetrically arranged L-shaped plates fixedly connected to the top of the U-shaped plate, and a U-shaped frame is fixedly connected between the tops of the two L-shaped plates, the side walls of the U-shaped frame are fixedly connected to iron blocks, each of the L-shaped plates is connected to the side wall of the main body through a first reset mechanism, and the side wall of the main body is provided with a limiting mechanism for limiting the L-shaped plate.

[0009] Preferably, the first reset mechanism includes a first spring fixedly connected to the side wall of the L-shaped plate, and the other end of the first spring is fixedly connected to the first connecting block, the first connecting block is fixed to the side wall of the main body, and a guide assembly is arranged between the L-shaped plate and the first connecting block.

[0010] Preferably, the guide assembly includes a first set of rods fixedly connected to the side wall of the L-shaped plate, and the side wall of the first set of rods is sleeved with a first sleeve, and the other end of the first sleeve is fixed to the side wall of the first connecting block.

[0011] Preferably, the limiting mechanism comprises a limiting block, and the limiting block comprises a second inclined surface and a limiting surface, and the limiting block is connected to the side wall of the main body through a lifting mechanism.

[0012] Preferably, the lifting mechanism includes two symmetrically arranged connecting rods fixedly connected to the top of the limit block, and the side walls of the connecting rods are sleeved with a second connecting block, the second connecting block is fixed to the side wall of the main body, and the upper end of the connecting rod is fixedly connected to a block, a reset piece is provided between the limit block and the second connecting block, and the movement of the block is pushed by a pushing mechanism.

[0013] Preferably, the reset member comprises a second spring sleeved on the side wall of each connecting rod, and two ends of the second spring are respectively fixed to the limit block and the second connecting block.

[0014] Preferably, the pushing mechanism includes a fixed block fixedly connected to the side wall of the main body, and an L-shaped tube is fixedly inserted into the side wall of the fixed block, a moving rod is inserted into the upper end of the L-shaped tube, and the upper end of the moving rod passes through the top of the second connecting block and is fixed to the bottom of the stop block, and the lower end of the L-shaped tube is connected to the interior of the hollow plate through a hose.

[0015] Preferably, the side wall of the hollow plate is provided with a plurality of through holes arranged in an array.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The present invention is provided with a moving mechanism and a scraping mechanism, etc. When it is necessary to mount a chip, the GaN power device body is first adsorbed by a mounting head, then the GaN power device body is placed on a circuit board, and the pins are placed on the printed solder paste, then two electromagnets are energized, and after the electromagnets are energized, the iron blocks are attracted, so that the two U-shaped frames move away from each other, and at the same time, the two U-shaped plates are driven to move away from each other by the L-shaped plate, the first spring is compressed, and then the multiple hollow plates are driven to move synchronously, and the hollow plates are moved between two adjacent pins. At the same time, when the hollow plate moves, the scraper is driven to move synchronously, and under the action of the first inclined surface, the solder paste can be pushed to a position close to the pins, thereby ensuring the quality of subsequent welding, and when the top of the L-shaped plate is aligned with the first inclined surface, the scraper is driven to move synchronously, and the solder paste can be pushed to a position close to the pins, thereby ensuring the quality of subsequent welding. When the two inclined surfaces abut against each other, the limit block can be pushed to move upward. At the same time, the second spring is compressed. When the L-shaped plate passes over the limit block, the limit block can be reset downward under the action of the second spring, and under the action of the first spring, the limit surface is abutted against the side wall of the L-shaped plate to achieve the limit operation of the L-shaped plate. Then, the two electromagnets are powered off and the mounting head is moved upward and reset. Then, the circuit board and the GaN power device body can be transported to the reflow soldering machine for welding. During welding, the circuit board after mounting is heated by the heating area to melt the solder paste and weld the GaN power device body to the pad of the circuit board. Under the action of the hollow plate, two adjacent pins can be separated to avoid the solder paste from being connected together after melting, thereby ensuring the quality of welding.

[0018] The present invention provides a limiting mechanism and a pushing mechanism, etc., so that when the circuit board is heated, the alcohol in the hollow board can be gradually vaporized. At the same time, under the action of the through hole, the heat dissipation area can be increased, so that the heat on the circuit board can be absorbed, and the main body and the GaN power device body can be prevented from being damaged by excessive temperature. After the solder paste is melted, as the alcohol in the hollow board is gradually vaporized, the vaporized alcohol can enter the L-shaped tube through the hose, and when the pressure is large enough, it can push the moving rod and the stopper to move upward, thereby driving the limiting block to move upward. At the same time, the second spring is compressed. At this time, the limiting block It is separated from the L-shaped plate and loses its limiting function, so that the L-shaped plate can move and reset under the action of the first spring, and drive the hollow plate to move and reset through the U-shaped plate, and then drive the scraper to move and reset. At this time, the scraper can scrape and clean the excess solder paste after melting between two adjacent pins to ensure the quality of welding. After the hollow plate is reset and the welding is completed, it can effectively support the main body. At the same time, it can ensure that there is a certain distance between the GaN power device body and the circuit board. Under the joint action of the hollow plate and the through hole, the heat dissipation effect of the GaN power device body can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the use state of the present invention;

[0020] Figure 2 It is a schematic diagram of the overall structure of the present invention;

[0021] Figure 3 It is a schematic diagram of the overall structure of the present invention from another perspective;

[0022] Figure 4 for Figure 1 Enlarged view of point A in the middle;

[0023] Figure 5 for Figure 2 Enlarged view of point B in the middle;

[0024] Figure 6 for Figure 3 Enlarged view of point C in the middle;

[0025] Figure 7 for Figure 5 Enlarged view of point D in the middle;

[0026] Figure 8 for Figure 6 Enlarged view of point E in the middle.

[0027] In the figure: 1, main body; 101, pin; 201, L-shaped plate; 202, U-shaped frame; 203, iron block; 302, limit block; 303, second inclined surface; 304, limit surface; 401, fixed block; 402, L-shaped tube; 403, moving rod; 404, hose; 501, first connecting block; 502, first spring; 601, first sleeve; 602, first sleeve rod; 701, connecting rod; 702, stopper; 703, second connecting block; 8, second spring; 901, scraper; 902, first inclined surface; 10, through hole; 11, circuit board; 12, mounting head; 13, mounting frame; 14, electromagnet; 15, U-shaped plate; 16, hollow plate. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] See also Figure 1-Figure 8 A GaN power device shown in the figure includes a main body 1 and a plurality of pins 101 arranged on the GaN power device body. The bottom of the main body 1 is connected to two symmetrically arranged U-shaped plates 15 through a moving mechanism, and the side wall of each U-shaped plate 15 is fixedly sleeved with a plurality of hollow plates 16 arranged in an array, that is, a cavity is arranged in the hollow plate 16, and the top of the hollow plate 16 is in contact with the bottom of the main body 1, and the cavity of the hollow plate 16 is filled with alcohol, and only a part of it needs to be filled, and it does not need to be filled. A scraping mechanism is arranged on the side wall of each hollow plate 16, and the scraping mechanism is used to scrape and clean the excess solder paste between two adjacent pins 101. When mounting the chip, the solder paste diffused between the two adjacent pins 101 can be pushed to the vicinity of the pin 10 1 to ensure the quality of subsequent welding; during welding, the heat on the circuit board 11 can be absorbed to prevent the main body 1 and the GaN power device body from being damaged by excessive temperature. At the same time, the hollow plate 16 can be used to separate two adjacent pins 101 to prevent the solder paste from being connected together after melting, and the excess solder paste between the two adjacent pins 101 can be scraped and cleaned to ensure the quality of welding; after welding, the hollow plate 16 can effectively support the main body 1, and at the same time, it can ensure that there is a certain distance between the GaN power device body and the circuit board 11, and under the joint action of the hollow plate 16 and the through hole 10, the heat dissipation effect of the GaN power device body can be improved.

[0030] The scraping mechanism includes two symmetrically arranged scrapers 901 fixedly connected to the side wall of the hollow plate 16 , and each scraper 901 includes a first inclined surface 902 , and the bottom of the scraper 901 is flush with the bottom of the hollow plate 16 .

[0031] The moving mechanism includes two symmetrically arranged L-shaped plates 201 fixedly connected to the top of the U-shaped plate 15, and a U-shaped frame 202 is fixedly connected between the tops of the two L-shaped plates 201, and the side walls of the U-shaped frame 202 are fixedly connected with iron blocks 203. Each L-shaped plate 201 is connected to the side wall of the main body 1 through a first reset mechanism, and the side wall of the main body 1 is provided with a limiting mechanism for limiting the L-shaped plate 201. When patching is required, the placement head 12 is a component of the patch machine, which is used to pick up, move and place components. It is a well-known technology in the technical field, and its structure and principle are not repeated here. When in use, the two electric The magnet 14 is fixed on the side wall of the mounting head 12 through the mounting frame 13. The GaN power device body is first adsorbed by the mounting head 12, and then the GaN power device body is placed on the circuit board 11, and the pin 101 is placed on the printed solder paste. Then, the two electromagnets 14 are energized. After the electromagnets 14 are energized, they attract the iron block 203, so that the two U-shaped frames 202 move away from each other. At the same time, the two U-shaped plates 15 are driven to move away from each other through the L-shaped plate 201, thereby driving multiple hollow plates 16 to move synchronously, and the hollow plates 16 are moved between two adjacent pins 101.

[0032] The first reset mechanism includes a first spring 502 fixedly connected to the side wall of the L-shaped plate 201, and the other end of the first spring 502 is fixedly connected to the first connecting block 501, the first connecting block 501 is fixed to the side wall of the main body 1, and a guide component is arranged between the L-shaped plate 201 and the first connecting block 501 to reset the movement of the L-shaped plate 201.

[0033] The guide assembly includes a first rod 602 fixedly connected to the side wall of the L-shaped plate 201, and the side wall of the first rod 602 is sleeved with a first sleeve 601, and the other end of the first sleeve 601 is fixed to the side wall of the first connecting block 501 to guide the movement of the L-shaped plate 201.

[0034] The limiting mechanism includes a limiting block 302, and the limiting block 302 includes a second inclined surface 303 and a limiting surface 304. The limiting block 302 is connected to the side wall of the main body 1 through a lifting mechanism. When the top of the L-shaped plate 201 abuts against the second inclined surface 303, the limiting block 302 can be pushed to move upward. When the L-shaped plate 201 passes over the limiting block 302, the limiting block 302 can be reset downward under the action of the reset member, so that the limiting surface 304 abuts against the side wall of the L-shaped plate 201, thereby realizing the limiting operation of the L-shaped plate 201.

[0035] The lifting mechanism includes two symmetrically arranged connecting rods 701 fixedly connected to the top of the limit block 302, and the side wall of the connecting rod 701 is sleeved with a second connecting block 703, the second connecting block 703 is fixed to the side wall of the main body 1, and the upper end of the connecting rod 701 is fixedly connected with a stopper 702, a reset member is arranged between the limit block 302 and the second connecting block 703, and the movement of the stopper 702 is pushed by a pushing mechanism. When the circuit board 11 is heated, the alcohol in the hollow plate 16 can gradually vaporize, which can push the limit block 302 to move upward. At the same time, the connecting rod 701 slides on the second connecting block 703 to play a guiding role.

[0036] The reset member includes a second spring 8 sleeved on the side wall of each connecting rod 701 , and two ends of the second spring 8 are respectively fixed to the limit block 302 and the second connecting block 703 , so as to reset the movement of the limit block 302 .

[0037] The pushing mechanism includes a fixed block 401 fixedly connected to the side wall of the main body 1, and an L-shaped tube 402 is fixedly inserted into the side wall of the fixed block 401, a moving rod 403 is inserted into the upper end of the L-shaped tube 402, and the upper end of the moving rod 403 passes through the top of the second connecting block 703 and is fixed to the bottom of the stop block 702, and the lower end of the L-shaped tube 402 is connected to the interior of the hollow plate 16 through a hose 404. As the alcohol in the hollow plate 16 gradually vaporizes, the vaporized alcohol can enter the L-shaped tube 402 through the hose 404, and when the pressure is large enough, it can push the moving rod 403 and the stop block 702 to move upward, thereby driving the limit block 302 to move upward.

[0038] The side wall of the hollow plate 16 is provided with a plurality of through holes 10 arranged in an array, and the through holes 10 are not connected to the interior of the hollow plate 16 , which can increase the heat dissipation area and achieve a better heat dissipation effect.

[0039] Working principle: When it is necessary to mount the chip, the GaN power device body is first adsorbed by the mounting head 12, and then the GaN power device body is placed on the circuit board 11, and the pin 101 is placed on the printed solder paste. Then, the two electromagnets 14 are energized. After the electromagnets 14 are energized, the iron block 203 is attracted, so that the two U-shaped frames 202 move away from each other. At the same time, the two U-shaped plates 15 are driven to move away from each other through the L-shaped plate 201, and the first spring 502 is compressed, thereby driving the multiple hollow plates 16 to move synchronously, and the hollow plates 16 are moved between two adjacent pins 101. At the same time, when the hollow plate 16 moves, it drives the scraper 901 to move synchronously. Under the action of the first inclined surface 902, the solder paste can be pushed to a position close to the pin 101 to ensure the quality of subsequent welding.

[0040] When the top of the L-shaped plate 201 abuts against the second inclined surface 303, the limit block 302 can be pushed to move upward. At the same time, the second spring 8 is compressed. When the L-shaped plate 201 passes over the limit block 302, the limit block 302 can be reset downward under the action of the second spring 8, and under the action of the first spring 502, the limit surface 304 abuts against the side wall of the L-shaped plate 201 to achieve the limit operation of the L-shaped plate 201. Then, the two electromagnets 14 are powered off, and the mounting head 12 is moved upward and reset. Then, the circuit board 11 and the GaN power device body can be transported to the reflow soldering machine for welding. During welding, the circuit board 11 after the patch is heated by the heating area to melt the solder paste and weld the GaN power device body to the solder pad of the circuit board 11. Under the action of the hollow plate 16, two adjacent pins 101 can be separated to avoid the solder paste from being connected together after melting, thereby ensuring the quality of welding.

[0041] When the circuit board 11 is heated, the alcohol in the hollow plate 16 can be gradually vaporized. At the same time, under the action of the through hole 10, the heat dissipation area can be increased, so that the heat on the circuit board 11 can be absorbed to avoid damage to the main body 1 and the GaN power device body due to excessive temperature. After the solder paste is melted, as the alcohol in the hollow plate 16 is gradually vaporized, the vaporized alcohol can enter the L-shaped tube 402 through the hose 404;

[0042] When the pressure is large enough, the moving rod 403 and the stopper 702 can be pushed upward, thereby driving the limit block 302 to move upward. At the same time, the second spring 8 is compressed. At this time, the limit block 302 is separated from the L-shaped plate 201 and loses its limiting effect, so that the L-shaped plate 201 can move and reset under the action of the first spring 502, and the hollow plate 16 is driven to move and reset through the U-shaped plate 15, thereby driving the scraper 901 to move and reset. At this time, the scraper 901 can scrape and clean the excess solder paste after melting between two adjacent pins 101 to ensure the quality of welding.

[0043] Moreover, after the hollow plate 16 is reset and the welding is completed, the main body 1 can be effectively supported, and at the same time, a certain distance can be ensured between the GaN power device body and the circuit board 11. Moreover, under the joint action of the hollow plate 16 and the through hole 10, the heat dissipation effect of the GaN power device body can be improved.

[0044] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0045] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A GaN power device, comprising a main body (1) and a plurality of pins (101) arranged on a GaN power device body, characterized in that: The bottom of the main body (1) is connected to two symmetrically arranged U-shaped plates (15) via a moving mechanism, and the side wall of each U-shaped plate (15) is fixedly sleeved with a plurality of hollow plates (16) arranged in an array, the top of the hollow plate (16) is in contact with the bottom of the main body (1), and the hollow plate (16) is filled with alcohol, and the side wall of each hollow plate (16) is provided with a scraping mechanism, and the scraping mechanism is used to scrape and clean excess solder paste between two adjacent pins (101); The scraping mechanism comprises two symmetrically arranged scrapers (901) fixedly connected to the side wall of the hollow plate (16), and each scraper (901) comprises a first inclined surface (902); The moving mechanism comprises two symmetrically arranged L-shaped plates (201) fixedly connected to the top of the U-shaped plate (15), a U-shaped frame (202) fixedly connected between the tops of the two L-shaped plates (201), an iron block (203) fixedly connected to the side wall of the U-shaped frame (202), each of the L-shaped plates (201) being connected to the side wall of the main body (1) via a first reset mechanism, and a limiting mechanism for limiting the position of the L-shaped plates (201) is provided on the side wall of the main body (1); The first reset mechanism comprises a first spring (502) fixedly connected to the side wall of the L-shaped plate (201), and the other end of the first spring (502) is fixedly connected to the first connection block (501), the first connection block (501) is fixed to the side wall of the main body (1), and a guide assembly is provided between the L-shaped plate (201) and the first connection block (501); The limiting mechanism comprises a limiting block (302), and the limiting block (302) comprises a second inclined surface (303) and a limiting surface (304), and the limiting block (302) is connected to the side wall of the main body (1) via a lifting mechanism.

2. A GaN power device according to claim 1, characterized in that: The guide assembly comprises a first rod (602) fixedly connected to the side wall of the L-shaped plate (201), and a first sleeve (601) is provided on the side of the first rod (602), and the other end of the first sleeve (601) is fixed to the side wall of the first connection block (501).

3. A GaN power device according to claim 1, characterized in that: The lifting mechanism comprises two symmetrically arranged connecting rods (701) fixedly connected to the top of the limit block (302), and the side walls of the connecting rods (701) are sleeved with second connecting blocks (703), the second connecting blocks (703) are fixed to the side walls of the main body (1), and the upper end of the connecting rod (701) is fixedly connected to the stop block (702), a reset member is arranged between the limit block (302) and the second connecting block (703), and the movement of the stop block (702) is driven by a driving mechanism.

4. A GaN power device according to claim 3, characterized in that: The reset member comprises a second spring (8) sleeved on the side wall of each connecting rod (701), and two ends of the second spring (8) are respectively fixed to the limit block (302) and the second connecting block (703).

5. A GaN power device according to claim 3, characterized in that: The pushing mechanism comprises a fixed block (401) fixedly connected to the side wall of the main body (1), and an L-shaped tube (402) is fixedly inserted into the side wall of the fixed block (401), a moving rod (403) is inserted into the upper end of the L-shaped tube (402), and the upper end of the moving rod (403) passes through the top of the second connecting block (703) and is fixed to the bottom of the stopper (702), and the lower end of the L-shaped tube (402) is connected to the inside of the hollow plate (16) through a hose (404).

6. A GaN power device according to claim 1, characterized in that: The side wall of the hollow plate (16) is provided with a plurality of through holes (10) arranged in an array.

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