Server and cabinet

Abstract

According to the server and the cabinet, a heat source assembly and a liquid cooling assembly are arranged in a case of the server, and the heat source assembly comprises a circuit printed board and a heat source device arranged on the front face of the circuit printed board. The heat source assembly is fixed to a case top plate of the server, the back face of the circuit printing plate faces the case top plate, and the front face of the circuit printing plate faces a case bottom plate. The liquid cooling assembly is in contact with a heat source device in the heat source assembly and used for dissipating heat of the heat source assembly. As the heat source assembly is fixed at the top of the case of the server, if the liquid cooling assembly leaks liquid, the leaked liquid drops to the bottom of the case of the server under the influence of gravity and does not contact a heat source device, so that the influence of the leaked liquid on the heat source device is effectively avoided, and unnecessary loss is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of server heat dissipation, and in particular to a server and a cabinet. Background Art

[0002] As the processing power of servers increases, the power consumption of servers also increases. The increase in power consumption easily causes the servers to overheat. In order to ensure that the servers can work normally, it is necessary to solve the heat dissipation problem of the servers in a timely and effective manner.

[0003] At present, liquid cooling plates are installed inside servers. The circulating cooling water inside the liquid cooling plates absorbs the heat of various components in the server (such as processors, graphics cards, etc.) and dissipates the heat inside the server to the outside to ensure that the server can dissipate heat in time.

[0004] In a common liquid cooling layout, a liquid cooling plate is placed above a device inside the server that easily dissipates heat. In this layout, if the liquid cooling plate leaks, the leaked liquid will quickly flow onto the device. The device will be exposed to the leaked liquid in a short period of time, causing losses. Summary of the invention

[0005] The present application provides a server and a cabinet, which are used to reduce the impact of liquid leakage on internal components of the server.

[0006] In a first aspect, the present application provides a server, wherein a heat source component and a liquid cooling component are arranged inside a chassis of the server, wherein the heat source component is a component that dissipates heat, and the liquid cooling component is a component that absorbs the heat dissipated by the heat source component and dissipates heat from the heat source component. The heat source component includes a printed circuit board and a heat source device disposed on the front of the printed circuit board (PCB). The heat source device is the main device in the heat source component that dissipates heat.

[0007] The heat source component is fixed on the chassis top plate of the server, with the back of the PCB facing the chassis top plate and the front of the circuit printed board (i.e. the side where the heat source device is located) facing the chassis bottom plate.

[0008] The liquid cooling component is in contact with the heat source device in the heat source component and is used to dissipate heat from the heat source component.

[0009] With the above server, since the heat source component is fixed on the top of the server chassis, if the liquid cooling component leaks, the leaked liquid will drip to the bottom of the server chassis due to gravity without contacting the heat source device, thereby effectively avoiding the impact of the leaked liquid on the heat source device and reducing unnecessary losses.

[0010] In a possible design, the liquid cooling assembly includes a liquid cooling buckle plate, and the liquid cooling buckle plate in the liquid cooling assembly is connected to the PCB via a first fixing member.

[0011] Through the above server, the liquid cooling buckle plate is fixedly connected to the PCB, and the liquid cooling buckle plate can better contact with the heat source device to dissipate heat for the heat source device.

[0012] In a possible design, the liquid cooling assembly also includes a chilled water pipe and a cooling water pipe. The chilled water pipe is used to transport cooling water to the liquid cooling buckle plate; the cooling water pipe is used to discharge the cooling water in the liquid cooling buckle plate; the chilled water pipe and the cooling water pipe are connected to the PCB or the chassis top plate through a second fixing member. That is, the chilled water pipe is connected to the PCB or the chassis top plate through the second fixing member, and the cooling water pipe is connected to the PCB or the chassis top plate through the second fixing member. When the chilled water pipe and the cooling water pipe are connected to the PCB (or the chassis top plate) through the second fixing member, the PCB (or the chassis top plate) can be connected through different second fixing members.

[0013] Through the above-mentioned server, the cooling water inside the liquid cooling plate can circulate through the freezing water pipe and the cooling water pipe, and promptly absorb the heat emitted by the heat source device. The cooling water pipe and the freezing water pipe are fixedly connected to the PCB or the top plate of the chassis, which can avoid the cooling water pipe and the freezing water pipe from pulling the liquid cooling plate, thereby ensuring that the liquid cooling plate can contact the heat source device.

[0014] In a possible design, a beam structure parallel to the PCB is arranged between the chassis top plate of the server and the PCB, and both ends of the beam structure are fixed to the side walls of the chassis of the server. The PCB is fixed to the chassis top plate of the server by a third fixing member, and the third fixing member passes through the beam structure.

[0015] With the above server, the crossbeam structure between the chassis top plate of the server and the PCB can support the PCB together with the chassis top plate of the server, thereby preventing the deformation of the chassis top plate caused by the fixed connection between the PCB and the chassis top plate.

[0016] In a possible design, a supporting structure is provided between the PCB and a chassis bottom plate of the server, and the supporting structure is used to support the PCB.

[0017] Through the above server, one end of the supporting structure contacts the PCB and the other end contacts the chassis bottom plate of the server, which can provide support for the PCB from the side where the heat source device is provided, thereby preventing the PCB from being deformed or falling due to the influence of its own gravity.

[0018] In a possible design, a guide groove is provided on the outside of the chilled water pipe and the cooling water pipe, and the guide groove is connected to the leakage pipe outside the server to guide the cooling water leaking from the chilled water pipe and the cooling water pipe to the leakage pipe.

[0019] With the above server, the setting of the guide groove can discharge the leaked liquid in time and avoid the accumulation of the leaked liquid inside the server.

[0020] In a possible design, water-immersed ropes are laid along the chilled water pipes and the cooling water pipes. A corresponding liquid cooling assembly can be provided for each heat source device on the PCB, and water-immersed ropes can be laid on the chilled water pipes and the cooling water pipes of each liquid cooling assembly.

[0021] With the above server, the water immersion rope is arranged near the freezing water pipe and the cooling water pipe where leakage is prone to occur, so as to ensure that leakage can be found in time.

[0022] In one possible design, since the PCB is inverted inside the server, the strength of the PCB itself can be enhanced. There are many ways to enhance the self-loudness of the PCB. Three of them are listed below:

[0023] The first type is that the PCB adopts a multi-layer structure.

[0024] Second, a metal material is attached to the bottom of the PCB, and the metal strength of the metal material is greater than the metal strength of copper.

[0025] The third method is to increase the thickness of the PCB.

[0026] By using the server, the strength of the PCB itself is enhanced, and the influence of gravity on the PCB when the PCB is inverted inside the server can be reduced, thereby preventing the PCB from being deformed.

[0027] In one possible design, the liquid cooling assembly includes a thermal pad located between the liquid cooling buckle plate and the heat source device.

[0028] Through the above server, the thermal pad can quickly transfer the heat emitted by the heat source device to the liquid cooling component, so that the liquid cooling component can quickly dissipate the heat of the heat source device.

[0029] In a second aspect, an embodiment of the present application further provides a server cabinet, the server cabinet comprising a plurality of servers;

[0030] For any server among the multiple servers, a liquid cooling component is arranged in a chassis of the server, and the liquid cooling component includes a liquid cooling buckle plate, a freezing water pipe and a guide groove arranged outside the freezing water pipe.

[0031] The chilled water pipe is connected to a cooling water supply device outside the server and is used to deliver cooling water to the liquid cooling buckle plate. The cooling water supply device is used to provide cooling water.

[0032] The guide groove is connected to the drain pipe outside the server and is used to guide the cooling water leaking from the chilled water pipe to the drain pipe. The drain pipe is a pipe set for discharging liquid.

[0033] Through the above server cabinet, the guide groove can receive the cooling water leaked from the freezing water pipe, ensuring that the cooling water leaked from the freezing water pipe will not drip onto the chassis bottom plate of the server. And because the guide groove can be connected to the drain pipe outside the server, it is ensured that the cooling water received by the guide groove is discharged outside the server in time, avoiding the cooling water leaked from the freezing water pipe staying inside the server for a long time, and avoiding the possible damage to the server caused by the presence of a large amount of leaked cooling water inside the server.

[0034] In one possible design, the chilled water pipe and the guide trough arranged on the outside of the chilled water pipe pass through the same hole on the chassis of the server, and a diverter device is arranged at the hole, which is used to separate the chilled water pipe and the guide trough and connect the guide trough to the drain pipe.

[0035] Through the above-mentioned server cabinet, the chilled water pipe and the guide groove pass through the same hole on the chassis of the server, and there is no need to set separate holes for the chilled water pipe and the guide groove, which can reduce damage to the server chassis on the one hand, and reduce the difficulty of laying the chilled water pipe and the guide groove on the other hand. The existence of the diversion device can ensure that the guide pipe and the chilled water pipe are separated outside the server, so that the guide pipe and the chilled water pipe can be connected to corresponding devices (such as a cooling water supply device and a drain pipe) respectively.

[0036] In a possible design, a heat source assembly is further disposed inside the chassis of the server, and the heat source assembly includes a PCB and a heat source device disposed on the front side of the PCB.

[0037] The heat source assembly is fixed on the top plate of the chassis of the server, and the back of the PCB faces the top plate of the chassis. The liquid cooling assembly contacts the heat source device in the heat source assembly to dissipate heat from the heat source assembly.

[0038] Inside the server, the heat source component is fixed on the top of the server chassis. If the liquid cooling component leaks, the leaked liquid will drip to the bottom of the server chassis due to gravity without contacting the heat source device, effectively avoiding the impact of the leaked liquid on the heat source device and reducing unnecessary losses.

[0039] In a possible design, the liquid cooling buckle plate is connected to the PCB via a first fixing member.

[0040] In one possible design, the liquid cooling assembly also includes a cooling water pipe, which is used to discharge the cooling water in the liquid cooling plate; inside the server chassis, the freezing water pipe and the cooling water pipe are connected to the PCB or the chassis top plate through a second fixing member.

[0041] In a possible design, a beam structure parallel to the PCB is arranged between the chassis top plate of the server and the PCB, and both ends of the beam structure are fixed to the side walls of the chassis of the server. The PCB is fixed to the chassis top plate of the server by a third fixing member, and the third fixing member passes through the beam structure.

[0042] In a possible design, a supporting structure is provided between the PCB and a chassis bottom plate of the server, and the supporting structure is used to support the PCB.

[0043] In a possible design, a guide groove is provided on the outside of the cooling water pipe.

[0044] In one possible design, water-immersed ropes are laid along the chilled water pipes as well as the cooling water pipes.

[0045] In one possible design, the PCB is a multi-layer structure.

[0046] In one possible design, a metal material is attached to the bottom of the PCB, and the metal strength of the metal material is greater than the metal strength of copper.

[0047] In one possible design, the liquid cooling assembly includes a thermal pad located between the liquid cooling buckle plate and the heat source device.

[0048] Inside any server of the server cabinet, the structure and arrangement of the heat source component and the liquid cooling plate are similar to the structure and arrangement of the heat source component and the liquid cooling plate inside the server in the first aspect. The relevant beneficial effects can be found in the relevant description in the first aspect and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 A schematic diagram of a liquid cooling layout inside a server;

[0050] Figure 2 A schematic diagram of the structure of a server provided for this application;

[0051] Figure 3 A schematic diagram of the structure of a liquid cooling component provided in this application;

[0052] Figure 4 A schematic diagram of the structure of another liquid cooling assembly provided for this application;

[0053] Figure 5 A schematic diagram of a heat source assembly provided in the present application being fixed to a top plate of a chassis;

[0054] Figure 6 A schematic diagram of another heat source assembly provided by the present application being fixed to a top plate of a chassis;

[0055] Figure 7A schematic diagram of another heat source assembly provided by the present application being fixed to a top plate of a chassis;

[0056] Figure 8 A side view of a chilled water pipe and a guide trough provided in the present application;

[0057] Fig. 9 A cross-sectional view of a chilled water pipe and a guide trough provided in the present application;

[0058] Fig.10 A schematic diagram of the connection between a guide groove and a drain pipe provided on the outer side of a chilled water pipe provided in the present application;

[0059] Fig.11A A schematic diagram of a hole where a chilled water pipe and a guide trough pass through a server provided in the present application;

[0060] Fig. 11B A schematic diagram of the structure of a flow diversion device provided in this application;

[0061] Fig.12 A schematic diagram of laying a water-immersed rope provided in this application;

[0062] Fig.13 A schematic diagram of the structure of a server cabinet provided in this application. DETAILED DESCRIPTION

[0063] like Figure 1 As shown in FIG. 1 , a schematic diagram of a liquid cooling layout is used inside a server. The electronic components in the server are installed on the PCB, that is, located on the front of the PCB. Among these electronic components, there are some components that need heat dissipation, such as processors, memory, etc. For the convenience of explanation, these components that need heat dissipation are called heat source components.

[0064] exist Figure 1 In the embodiment, a heat source device is installed on the PCB, and a liquid cooling plate and a water receiving tray are arranged in sequence on the heat source device.

[0065] The liquid cooling plate is a metal plate made of heat-conducting metal with a closed cavity. The liquid cooling plate is provided with a water inlet and a water outlet. Liquid (such as cooling water) can be input into the closed cavity in the liquid cooling plate through the water inlet, and the liquid in the closed cavity can flow out through the water outlet. Figure 1 In the process, the chilled water pipe and the cooling water pipe pass through the water receiving tray and are connected to the liquid cooling buckle plate. The chilled water pipe is connected to the water inlet of the liquid cooling buckle plate to supply cooling water to the liquid cooling buckle plate. The cooling water pipe is connected to the water outlet of the liquid cooling buckle to discharge the cooling water in the liquid cooling buckle plate.

[0066] It should be noted that the water inlet and the water outlet are two connection ports of the liquid cooling buckle plate. In some scenarios, the water inlet and the water outlet of the liquid cooling buckle plate are not distinguished, that is, the cooling water pipe and the freezing water pipe are respectively connected to the two connection ports of the liquid cooling buckle plate. In the embodiment of the present application, only for the convenience of distinguishing the two connection ports, the connection port connected to the freezing water pipe is defined as the water inlet, and the connection port connected to the cooling water pipe is called the water outlet.

[0067] The liquid cooling plate absorbs the heat emitted by the heat source device with the help of cooling water flowing in the closed cavity, and discharges the cooling water that has absorbed the heat as the cooling water is discharged.

[0068] The water receiving pan is usually an annular disc, which is located between the liquid cooling plate and the chilled water pipe and cooling water pipe. The water receiving pan is used to receive the leaked liquid (that is, the leaked cooling water) from the chilled water pipe and cooling water pipe, the liquid leaked from the connection between the liquid cooling plate and the chilled water pipe (that is, the water inlet), or the liquid leaked from the connection between the liquid cooling plate and the cooling water pipe (that is, the water outlet), to prevent the liquid from flowing onto the heat source device.

[0069] In such Figure 1 When a leak occurs in the liquid cooling layout shown, the liquid will flow directly to the heat source device, which will cause the heat source device to malfunction. Therefore, timely detection of the leak can avoid damage to the heat source device. However, in such a liquid cooling layout, the leak is difficult to detect and has a lag. Usually when the leak is discovered, the leaked liquid has already flowed to the heat source device. At this time, the heat source device is likely to have been damaged, affecting the reliability of the server.

[0070] In an embodiment of the present application, a PCB 110 provided with a heat source device 120 is inverted in a server 10, that is, the PCB 110 is fixed on the top plate of the chassis of the server 10. The liquid cooling assembly 200 contacts the heat source device 120 to dissipate heat for the heat source device 120. In this liquid cooling layout, if the liquid cooling assembly 200 leaks, the leaked liquid will drip onto the chassis bottom plate of the server 10 along the direction of gravity and will not contact the heat source device 120 of the PCB 110 fixed on the top plate of the chassis. In this way, the possibility of the heat source device 120 contacting the leaking liquid can be reduced. The server 10 provided in an embodiment of the present application is described below in conjunction with the accompanying drawings.

[0071] like Figure 2 As shown, a server 10 provided in an embodiment of the present application is provided, in which a heat source component 100 and a liquid cooling component 200 are arranged inside a chassis of the server 10 .

[0072] The heat source component 100 is a component that emits heat inside the server 10. The embodiment of the present application does not limit the specific structure and specific type of the heat source component 100. All components that emit heat inside the server 10 are applicable to the embodiment of the present application.

[0073] In the embodiment of the present application, the heat source assembly 100 includes a PCB 110 and a heat source device 120 disposed on the PCB 110. The part of the heat source assembly 100 that mainly dissipates heat is the heat source device 120. The heat source device 120 can be a processor, a memory, a logic circuit, etc., and the embodiment of the present application does not limit the specific type of the heat source device 120.

[0074] The heat source assembly 100 is fixed on the chassis top plate of the server 10 , that is, the back of the PCB 110 in the heat source assembly 100 faces the chassis top plate, and the heat source device 120 on the PCB 110 faces the chassis bottom plate.

[0075] The chassis top plate and the chassis bottom plate are two opposite sides of the chassis of the server 10 along the gravity direction when the server 10 is normally placed. The chassis top plate is above the chassis bottom plate.

[0076] The liquid cooling assembly 200 contacts the heat source device 120 in the heat source assembly 100 to dissipate heat for the heat source device 120 .

[0077] In the server 10 , the heat source assembly 100 is disposed on the top plate of the chassis of the server 10 , and the leaked liquid of the liquid cooling assembly 200 is not easy to contact the heat source assembly 100 , thereby preventing the heat source assembly 100 from contacting the leaked liquid and causing loss.

[0078] The fixing methods of the liquid cooling assembly 200 and the heat source assembly 100 are described below respectively.

[0079] 1. Liquid cooling assembly 200.

[0080] like Figure 3 , which is a schematic diagram of the structure of the liquid cooling assembly 200 provided in an embodiment of the present application, and the liquid cooling assembly 200 includes a liquid cooling buckle plate 210. The liquid cooling buckle plate 210 can contact the heat source device 120 in the heat source assembly 100. The liquid cooling buckle plate 210 can be connected to the PCB 110 through a first fixing member 300.

[0081] The first fixing member 300 forms a connection between the liquid cooling buckle plate 210 and the PCB 110 . The liquid cooling buckle plate 210 can be fixed on the PCB 110 and contact the heat source device 120 on the PCB 110 .

[0082] The present application does not limit the type of the first fixing member 300. For example, the first fixing member 300 may be a screw, an insulating hole is provided on the PCB 110, and an insulating hole is also provided on the liquid cooling buckle plate 210. The screw passes through the PCB 110 and the liquid cooling buckle plate 210, so that a connection is formed between the liquid cooling buckle plate 210 and the PCB 110. For another example, the first fixing member 300 is a binding strap, an insulating hole is provided on the PCB 110, and the binding strap passes through the insulating hole to bind the liquid cooling buckle plate 210 and the PCB 110 together. For another example, the first fixing member 300 may be two L-shaped or U-shaped connecting rods, and the two ends of the first fixing member 300 are respectively connected to the liquid cooling buckle plate 210 and the PCB 110.

[0083] The liquid cooling buckle plate 210 is a main component of the liquid cooling assembly 200. In order to conduct the heat of the heat source device 120 to the liquid cooling buckle plate 210, the liquid cooling assembly 200 also includes a thermal pad, which is located between the liquid cooling buckle plate 210 and the heat source device 120. The thermal pad is used to conduct the heat emitted by the heat source device 120 to the liquid cooling buckle plate 210. The thermal pad can be made of a material with a high thermal conductivity, such as silica gel, silicone, etc.

[0084] like Figure 4 As shown, the liquid cooling assembly 200 further includes a chilled water pipe 220 and a cooling water pipe 230. The chilled water pipe 220 is used to deliver cooling water to the liquid cooling buckle plate 210; the chilled water pipe 220 is connected to the water inlet of the liquid cooling assembly 200. The cooling water pipe 230 is used to discharge the cooling water in the liquid cooling buckle plate 210; the chilled water pipe 220 is connected to the water outlet of the liquid cooling assembly 200. The cooling water pipe 230 and the chilled water pipe 220 are connected to the PCB 110 or the chassis top plate through the second fixing member 310.

[0085] The way in which the cooling water pipe 230 is connected to the PCB110 or the top plate of the chassis through the second fixing member 310 is similar to the way in which the freezing water pipe 220 is connected to the PCB110 or the top plate of the chassis through the second fixing member 310. The following is only an example of the way in which the cooling water pipe 230 is connected to the PCB110 or the top plate of the chassis through the second fixing member 310. The way in which the freezing water pipe 220 is connected to the PCB110 or the top plate of the chassis through the second fixing member 310 can refer to the way in which the cooling water pipe 230 is connected to the PCB110 or the top plate of the chassis through the second fixing member 310, and will not be repeated here.

[0086] The present application does not limit the type of the second fixing member 310. For example, the second fixing member 310 is a binding strap, and an insulating hole is provided on the PCB 110. The binding strap passes through the insulating hole to suspend the cooling water pipe 230 and bind it to the PCB 110. For another example, the second fixing member 310 is a binding strap, and a hole is provided on the top plate of the chassis. The binding strap passes through the hole to suspend the cooling water pipe 230 and bind it to the PCB 110. For another example, the second fixing member 310 can be two L-shaped or U-shaped connecting rods. The second fixing member 310 suspends the cooling water pipe 230 and connects it to the PCB 110.

[0087] 2. Heat source assembly 100.

[0088] like Figure 5 , which is a schematic diagram of the structure of a heat source assembly 100 provided in an embodiment of the present application. The heat source assembly 100 includes a PCB 110 and a heat source device 120 disposed on the PCB 110 .

[0089] The above content has mentioned that the heat source assembly 100 is fixed on the chassis top plate of the server 10. The embodiment of the present application does not limit the way in which the heat source assembly 100 is fixed on the chassis top plate of the server 10. For example, a sticky material is applied on the back of the PCB 110, and the sticky material can bond the PCB 110 to the chassis top plate. The sticky material can be a silicone adhesive, quick-drying glue, hot-vulcanized glue, epoxy resin, etc.

[0090] Figure 5 Another way of fixing the heat source assembly 100 on the top plate of the chassis of the server 10 is shown in FIG. Figure 5 In the embodiment, the heat source assembly 100 is connected to the chassis top plate of the server 10 through the third fixing member 320 .

[0091] The present application does not limit the type of the third fixing member 320. For example, the third fixing member 320 may be a screw. An insulating hole is provided on the PCB 110, and an insulating hole is also provided on the chassis top plate. The screw passes through the PCB 110 and the chassis top plate, so that the PCB 110 is fixed to the chassis top plate. For another example, the first fixing member 300 is a strap. An insulating hole is provided on the PCB 110. The strap passes through the insulating hole to bind the PCB 110 to the chassis top plate (a hole is provided on the chassis top plate, and the strap is bound to the hole). For another example, the third fixing member 320 may be two L-shaped or U-shaped connecting rods. One end of the third fixing member 320 is fixed to the chassis top plate. The third fixing member 320 can hook the PCB 110 and fix it to the chassis top plate of the server 10.

[0092] like Figure 6 As shown, based on Figure 5The heat source assembly 100 shown is fixed on the chassis top plate of the server 10, in order to strengthen the fixing strength between the heat source assembly 100 and the chassis top plate of the server 10. A beam structure 400 parallel to the PCB 110 is provided between the chassis top plate of the server 10 and the PCB 110, and both ends of the beam structure 400 are fixed to the side walls of the chassis of the server 10. When the heat source assembly 100 is connected to the chassis top plate of the server 10 through the third fixing member 320, the third fixing member 320 passes through the beam structure 400.

[0093] The arrangement of the crossbeam structure 400 can support the heat source assembly 100 together with the chassis top plate. The crossbeam structure 400 shares a portion of the gravity of the heat source assembly 100, and can prevent the chassis top plate from deforming in order to support the heat source assembly 100. The crossbeam structure 400 can be made of a material with greater strength, such as metal, ceramic, polymer material, or composite material. The present application does not limit the specific shape of the crossbeam structure 400, for example, the crossbeam structure 400 is plate-shaped, columnar (such as a cylinder), or grooved.

[0094] Optionally, a supporting structure 410 may be provided between the heat source assembly 100 and the chassis bottom plate of the server 10. Figure 7 As shown, a supporting structure 410 is provided between the PCB 110 in the heat source assembly 100 and the chassis bottom plate of the server 10. That is, one end of the supporting structure 410 contacts the PCB 110, and the other end contacts the chassis bottom plate of the server.

[0095] The support structure 410 can provide support for the PCB 110 from the side of the PCB 110 where the heat source device 120 is provided, so as to prevent the PCB 110 from being deformed or falling due to gravity. The heat source assembly 100 can be further fixed on the top plate of the chassis of the server 10. The support structure 410 can be made of a material with relatively high strength, such as metal, ceramic, polymer material, or composite material. The present application does not limit the specific shape of the support structure 410, for example, the support structure 410 is columnar.

[0096] In the foregoing description, in order to fix the heat source assembly 100 on the chassis top plate of the server 10, auxiliary structures such as the crossbeam structure 400 and the supporting structure 410 can be added to improve the stability of the fixed connection between the heat source assembly 100 and the chassis top plate of the server 10. In addition, the self-strength of the heat source assembly 100 can also be strengthened. For example, PCB110 can adopt a multi-layer structure, that is, the PCB110 can be prepared by a multi-layer stacked structure. For another example, the thickness of PCB110 is increased, such as using a PCB110 with a thickness greater than 4 mm. For another example, a metal layer is attached to PCB110, and the metal layer can adopt a metal material with higher strength, such as a metal material (such as aluminum, iron) with a strength greater than copper.

[0097] When the server 10 is actually used, usually multiple servers 10 are stacked and placed in a cabinet. If a server 10 leaks, the leaked liquid is likely to flow to other servers 10 nearby, causing damage to the heat source components 100 inside other servers 10. In order to avoid this situation, a waterproof layer is laid on the outside of the chassis of the server 10. The waterproof layer is arranged on the outside of the server 10 to prevent external liquid from flowing into the inside of the chassis of the server 10. The waterproof layer is made of waterproof material, such as polyvinyl chloride (PVC).

[0098] After introducing the heat source assembly 100 and the liquid cooling assembly 200, the drainage method of the liquid inside the server 10 in the embodiment of the present application is described below.

[0099] Inside the server 10, the chilled water pipe 220 can transport cooling water to the liquid cooling plate 210. The cooling water flows in the liquid cooling plate 210, taking away the heat on the liquid cooling plate 210, and the cooling water flows out through the cooling water pipe 230. The chilled water pipe 220, the cooling water pipe 230, the connection between the liquid cooling plate 210 and the chilled water pipe 220 (i.e., the water inlet), and the connection between the liquid cooling plate 210 and the cooling water pipe 230 (i.e., the water outlet) are locations where liquid leakage is prone to occur. Therefore, in the embodiment of the present application, a guide groove 240 is provided on the outside of the chilled water pipe 220 and the cooling water pipe 230.

[0100] For the chilled water pipe 220, the guide groove 240 is attached to the chilled water pipe 220 and extends to the connection between the chilled water pipe 220 and the liquid cooling buckle plate 210. For the cooling water pipe 230, the guide groove 240 is attached to the cooling water pipe 230 and extends to the connection between the cooling water pipe 230 and the liquid cooling buckle plate 210.

[0101] Taking the chilled water pipe 220 as an example, the guide groove 240 arranged on the outside of the chilled water pipe 220 is explained below. The manner of setting the guide groove 240 on the outside of the cooling water pipe 230 and the structure of the guide groove 240 are similar to the manner of setting the guide groove 240 on the outside of the chilled water pipe 220 and the structure of the guide groove 240, and will not be repeated here.

[0102] like Figure 8 , which is a side view of the chilled water pipe 220 and the guide groove 240 provided in the embodiment of the present application. The chilled water pipe 220 can be a corrugated pipe, so when viewed from the side of the corrugated pipe, the chilled water pipe 220 is sawtooth-shaped. The chilled water pipe 220 formed by the corrugated pipe is more flexible and can be bent in any direction without affecting the water flow inside the chilled water pipe 220.

[0103] A guide groove 240 is provided below the freezing water pipe 220 . The guide groove 240 is attached to the outside of the freezing water pipe 220 and is used to receive liquid leakage from the freezing water pipe 220 or the connection between the freezing water pipe 220 and the liquid cooling buckle plate 210 .

[0104] The guide groove 240 can be arranged on the side of the freezing water pipe 220 facing the bottom of the chassis, so that the guide groove 240 can receive the leakage of the freezing water pipe 220 or the connection between the freezing water pipe 220 and the liquid cooling buckle plate 210.

[0105] like Fig. 9 As shown in FIG. 1 , a cross-sectional view of the chilled water pipe 220 and the guide groove 240 provided in the embodiment of the present application is shown. The circular hollow structure is a cross-sectional view of the chilled water pipe 220, and the cooling water flows in the hollow part. The part below the hollow structure is the guide groove 240. The specific structure of the guide groove 240 is not limited in the present application. For example, the guide groove 240 can adopt a groove structure with an arc edge, or it can be as shown in FIG. Fig. 9 As shown, the edge is a serrated groove structure. The serrated edge makes it easier to gather liquid cooling at the bottom of the groove. The groove structure can increase the adsorption force of water, avoid dripping, and enable cooling water to gather.

[0106] A guide groove 240 is provided outside the chilled water pipe 220, so that the leakage of the chilled water pipe 220 or the leakage of the connection between the chilled water pipe 220 and the liquid cooling buckle plate 210 can be timely gathered in the guide groove 240. In this way, the leakage of the chilled water pipe 220 or the leakage of the connection between the chilled water pipe 220 and the liquid cooling buckle plate 210 will not drip into the server 10 in large quantities.

[0107] Outside the server 10, the guide groove 240 needs to be connected to an external drainage pipe. The liquid gathered in the guide groove 240 can flow to the drainage pipe in time, and the liquid is discharged through the drainage pipe. The liquid gathered in the guide groove 240 will not stay inside the server 10 for a long time, so as to avoid the situation where the liquid gathered in the guide groove 240 overflows to the bottom plate of the server 10 chassis due to excessive liquid.

[0108] like Fig.10 , which is a schematic diagram of the connection between the guide groove 240 arranged on the outside of the freezing water pipe 220 and the drain pipe. Fig.10 Three servers 10 are shown as examples. For any server 10, the chilled water pipe 220 and the guide groove 240 of the server 10 can pass through the same hole on the chassis of the server 10, and the chilled water pipe 220 is connected to an external cooling water supply device. The guide groove 240 is connected to the drain pipe, which is a pipe for uniformly discharging liquid.

[0109] The chilled water pipe 220 and the guide trough 240 pass through the same hole, so there is no need to set a dedicated hole for the guide trough 240 in the server 10 chassis. It is only necessary to use the existing hole set for the chilled water pipe 220 on the server 10 chassis, which makes the implementation method simpler.

[0110] like Fig.11A FIG. 2 is a schematic diagram of a hole position where the chilled water pipe 220 and the guide groove 240 of the server 10 pass through the server 10, and a diverter device 500 is provided at the hole position to separate the chilled water pipe 220 from the guide groove 240, and the diverter device 500 can have a one-way diverter function to prevent the liquid from flowing back into the server 10. The guide groove 240 can be connected to the drain pipe through the diverter device 500.

[0111] The present application embodiment does not limit the specific structure of the diversion device 500 and the method of realizing the unidirectional diversion function. Fig. 11B , a schematic diagram of the structure of a diverter device provided in an embodiment of the present application. The structure of the diverter device 500 is similar to a dustpan, one end of which is connected to the guide groove 240 and can collect the liquid (i.e., cooling water) in the guide groove 240, and the other end is connected to a pipe connected to an external drain pipe. The diverter device 500 uses a potential difference to achieve non-return, that is, the end connected to the guide groove 240 is in a high position, and the end connected to the pipe is in a low position. In this way, the liquid collected by the diverter device 500 will flow from a high position to a low position due to gravity. Fig. 11B The diversion device 500 is merely an example, and any device with a unidirectional diversion function can be used as the diversion device 500.

[0112] The provision of the diversion device 500 can ensure a stable connection between the guide groove 240 and the drain pipe, so that the water in the guide groove 240 can flow smoothly from the teaching office to the drain pipe.

[0113] It has been mentioned in the foregoing description that the chilled water pipe 220, the cooling water pipe 230, the connection between the liquid cooling buckle plate 210 and the chilled water pipe 220 (i.e., the water inlet), and the connection between the liquid cooling buckle plate 210 and the cooling water pipe 230 (i.e., the water outlet) are locations where liquid leakage is prone to occur. In order to promptly detect leakage at the chilled water pipe 220, the cooling water pipe 230, the connection between the liquid cooling buckle plate 210 and the chilled water pipe 220, and the connection between the liquid cooling buckle plate 210 and the cooling water pipe 230, in an embodiment of the present application, a water immersion rope 250 can be laid along the chilled water pipe 220 and the cooling water pipe 230.

[0114] The water-immersed rope 250 is a coil used to detect liquid leakage. The water-immersed rope 250 will present two different resistances when it is in contact with liquid and when it is not in contact with liquid, and thus the voltage on the water-immersed rope 250 is also different. The detection device determines whether the water-immersed rope 250 is in contact with liquid by detecting the voltage on the water-immersed rope 250, and then determines whether there is a liquid leakage.

[0115] For the chilled water pipe 220, the water rope 250 is attached to the chilled water pipe 220 and extends to the connection between the chilled water pipe 220 and the liquid cooling buckle plate 210. The water rope 250 is arranged at a position on the chilled water pipe 220 where liquid is easy to gather, such as at a position close to the chilled water pipe 220 and the guide groove 250, or at a side of the chilled water pipe 220 facing the bottom of the chassis.

[0116] Similarly, for the cooling water pipe 230, the water rope 250 is attached to the cooling water pipe 230 and extends to the connection between the cooling water pipe 230 and the liquid cooling buckle plate 210. The water rope 250 is arranged at a position on the cooling water pipe 230 where liquid is easy to gather, such as at a position close to the cooling water pipe 230 and the guide groove 240, or at a side of the cooling water pipe 230 facing the bottom of the chassis.

[0117] The detection device is connected to the water immersion rope 250 laid on the freezing water pipe 220 and the cooling water pipe 230 respectively to detect the voltage on the water immersion rope 250. The present application does not limit the deployment position and specific structure of the detection device, and any device that can detect voltage for leakage alarm is applicable to the embodiments of the present application.

[0118] In the embodiment of the present application, the PCB 110 may include a plurality of heat source devices 120, and each heat source device 120 may correspond to a liquid cooling assembly 200, such as each heat source device 120 is connected to a liquid cooling assembly 200. In this case, the liquid cooling buckle plate 210 in each liquid cooling assembly 200 is connected to a chilled water pipe 220 and a cooling water pipe 230.

[0119] like Fig.12 As shown, taking the PCB 110 including two heat source devices 120 as an example, the PCB 110 is inverted on the top plate of the chassis of the server 10, and the heat source devices 120 face the chassis bottom plate of the server 10. Each heat source device 120 contacts a liquid cooling component 200. In each liquid cooling component 200, the liquid cooling buckle plate 210 is connected to a chilled water pipe 220 and a cooling water pipe 230.

[0120] A water-immersed rope 250 is laid on each liquid-cooling buckle plate 210 connected to a chilled water pipe 220 and a cooling water pipe 230, and the detection device is connected to the water-immersed ropes 250 laid on the chilled water pipe 220 and the cooling water pipe 230, respectively, to detect the voltage on the water-immersed ropes 250. In this way, the detection device can locate the liquid-cooling component 200 where liquid leakage occurs by detecting the voltage on each water-immersed rope 250, and issue a liquid leakage alarm. The use of such a setting method of the water-immersed rope 250 can improve the accuracy of liquid leakage detection and accurately realize the location of liquid leakage.

[0121] like Fig.13 As shown, a server cabinet provided in an embodiment of the present application, the server cabinet 20 includes a plurality of servers 10, and for any server 10, a liquid cooling assembly 200 is provided in the chassis of the server 10, and the liquid cooling assembly 200 includes a liquid cooling buckle plate 210, a chilled water pipe 220, and a guide groove 240 provided outside the chilled water pipe 220;

[0122] The chilled water pipe 220 is connected to a cooling water supply device outside the server and is used to deliver cooling water to the liquid cooling buckle plate;

[0123] The guide groove 240 is connected to a drain pipe outside the server and is used to guide the cooling water leaking from the freezing water pipe 220 to the drain pipe.

[0124] The structure and configuration of the liquid cooling assembly 200 inside the server 10 can be found in the above description and will not be described again here.

[0125] In addition, a heat source component 100 is also disposed inside the chassis of the server 10. The structure and arrangement of the heat source component 100 can be found in the above description and will not be described again here.

[0126] It should be noted that the embodiments provided in this application are merely illustrative. Those skilled in the art can clearly understand that, for the convenience and brevity of description, in the above embodiments, the descriptions of each embodiment have their own emphasis, and for parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments. The features disclosed in the embodiments, claims, and drawings of the present invention may exist independently or in combination. The features described in the embodiment of the present invention in the form of hardware may be executed by software, and vice versa. This is not limited here.

Claims

1. A server, characterized in that: A heat source component and a liquid cooling component are arranged inside the chassis of the server, and the heat source component includes a circuit printed board PCB and a heat source device arranged on the front of the PCB; The heat source assembly is fixed on the chassis top plate of the server, and the back side of the PCB faces the chassis top plate; The liquid cooling component is in contact with the heat source device in the heat source component and is used for dissipating heat from the heat source component.

2. The server according to claim 1, characterized in that The liquid cooling component includes a liquid cooling buckle plate, and the liquid cooling component is in contact with the heat source device in the heat source component, including: The liquid cooling buckle plate is connected to the PCB via a first fixing member.

3. The server according to claim 2, characterized in that The liquid cooling assembly also includes a chilled water pipe and a cooling water pipe. The chilled water pipe is used to transport cooling water to the liquid cooling buckle plate; the cooling water pipe is used to discharge the cooling water in the liquid cooling buckle plate; the chilled water pipe and the cooling water pipe are connected to the PCB or the chassis top plate through a second fixing member.

4. The server according to any one of claims 1 to 3, characterized in that: A beam structure parallel to the PCB is provided between the chassis top plate of the server and the PCB, both ends of the beam structure are fixed to the side walls of the chassis of the server, and the heat source component is fixed to the chassis top plate of the server, including: The PCB is fixed to the chassis top plate of the server through the third fixing member, and the third fixing member passes through the crossbeam structure.

5. The server according to any one of claims 1 to 4, characterized in that: A supporting structure is arranged between the PCB and the chassis bottom plate of the server, and the supporting structure is used to support the PCB.

6. The method according to claim 3, characterized in that The outer sides of the freezing water pipe and the cooling water pipe are provided with guide grooves.

7. The server according to claim 3, characterized in that: Water-immersed ropes are laid along the freezing water pipe and the cooling water pipe.

8. The server according to any one of claims 1 to 7, characterized in that: The PCB is a multi-layer structure.

9. The server according to any one of claims 1 to 8, characterized in that: A metal material is attached to the bottom of the PCB, and the metal strength of the metal material is greater than that of copper.

10. The server according to any one of claims 2 to 9, characterized in that: The liquid cooling assembly includes a thermal pad, and the thermal pad is located between the liquid cooling buckle plate and the heat source device.

11. A server cabinet, characterized in that: The server cabinet includes a plurality of servers; For any server among the multiple servers, a liquid cooling component is arranged in a chassis of the server, and the liquid cooling component includes a liquid cooling buckle plate, a freezing water pipe, and a guide groove arranged outside the freezing water pipe; The chilled water pipe is connected to a cooling water supply device outside the server and is used to deliver cooling water to the liquid cooling buckle plate; The guide groove is connected to a leakage pipe outside the server and is used to guide the cooling water leaking from the freezing water pipe to the leakage pipe.

12. The server cabinet according to claim 11, characterized in that: The chilled water pipe and the guide groove arranged on the outside of the chilled water pipe pass through the same hole on the chassis of the server. A diverter device is arranged at the hole, and the diverter device is used to separate the chilled water pipe and the guide groove and connect the guide groove to the drain pipe.

13. The server cabinet according to claim 11 or 12, characterized in that: A heat source assembly is also provided inside the chassis of the server, and the heat source assembly includes a PCB and a heat source device disposed on the front of the PCB; The heat source assembly is fixed on the chassis top plate of the server, and the back side of the PCB faces the chassis top plate; The liquid cooling component is in contact with the heat source device in the heat source component and is used for dissipating heat from the heat source component.

14. The server cabinet according to claim 13, characterized in that: The liquid cooling component is in contact with the heat source device in the heat source component, including: The liquid cooling buckle plate is connected to the PCB via a first fixing member.

15. The server cabinet according to any one of claims 11 to 14, characterized in that: The liquid cooling assembly also includes a cooling water pipe, which is used to discharge the cooling water in the liquid cooling buckle plate; inside the chassis of the server, the freezing water pipe and the cooling water pipe are connected to the PCB or the chassis top plate through a second fixing member.

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