Ceramic rod screening device for wafer resistor and using method

Abstract

The ceramic rod screening device for the wafer resistor comprises a rack, a control module, a driving component, a screening component and a removing component are arranged on the rack, a feeding platform is arranged on the rack, the screening component comprises a fixing chuck fixedly arranged on the feeding platform, a mounting groove is formed in the fixing chuck, and the mounting groove is communicated with the feeding platform. A mounting groove is formed in the fixed chuck, a lower fluted disc is fixed in the mounting groove, an upper fluted disc connected with a driving part is arranged on the lower fluted disc, a feeding port is formed in the fixed chuck, a first outlet for discharging wafer resistors with small diameters is formed in one end, close to the feeding port, of the lower fluted disc, and a second outlet for discharging qualified wafer resistors is formed in the other end of the lower fluted disc; v-shaped grooves which are evenly distributed in the circumferential direction are formed in the edge of the upper fluted disc, a third outlet is formed in the center of the upper fluted disc, and the V-shaped grooves are used for removing wafer resistors with large diameters to the third outlet for discharging.

Description

Technical Field

[0001] The invention relates to a ceramic rod screening device for wafer resistors and a use method thereof, belonging to the field of wafer resistor accessories. Background Art

[0002] In recent years, with the rapid development of electronic products, communication equipment, new energy vehicles and other fields, the demand for wafer resistors has been growing. Through independent research and development and the introduction of advanced manufacturing technology, my country's wafer resistor automatic production line has formed a multifunctional and efficient production capacity.

[0003] In the existing wafer resistor production process, the resistor surface must be coated and sealed. During the manufacturing process, ceramic rods, which are raw materials, are easily damaged by collisions during transportation and storage, causing product quality problems. Currently, manual screening is mostly used, resulting in the following problems.

[0004] (1) Inefficiency: Manual screening is usually slower than automated screening, especially when processing large amounts of data. The speed of manual screening cannot keep up with automated tools.

[0005] (2) High cost: When hiring personnel for long-term screening, the labor costs such as wages and benefits will continue to accumulate, which is a considerable expense for the company.

[0006] (3) Subjective errors: Manual screening relies on personal judgment, which may lead to subjective errors. Different people may have different judgments on the same information, affecting the accuracy of the screening results.

[0007] (4) Fatigue and repetitive strain injuries: Long-term repetitive screening work may cause fatigue to workers, which not only reduces work efficiency, but may also cause a decline in work quality and even cause health problems such as repetitive strain injuries. Summary of the invention

[0008] The purpose of the present invention is to overcome the shortcomings and deficiencies of the prior art and to provide a ceramic rod screening device for wafer resistors.

[0009] A ceramic rod screening device for wafer resistors includes a frame, a control module, a driving component, a screening component and a rejecting component are arranged on the frame, a loading platform is arranged on the frame, and the screening component includes a fixed chuck fixedly arranged on the loading platform, a mounting groove is arranged in the fixed chuck, a lower toothed disc is fixed in the mounting groove, an upper toothed disc connected to the driving component is arranged on the lower toothed disc, a loading port is arranged on the fixed chuck, a first outlet for discharging wafer resistors with smaller diameters is arranged at one end of the lower toothed disc close to the loading port, and a second outlet is arranged at the other end for discharging qualified wafer resistors; V-shaped grooves are arranged evenly distributed along the circumference at the edge of the upper toothed disc, and a third outlet is arranged at the center of the upper toothed disc, and the V-shaped groove is used for the rejecting component to reject wafer resistors with larger diameters to be discharged into the third outlet. By setting a combination of components such as a loading platform, a fixed chuck, a lower toothed disc, an upper toothed disc and a V-shaped groove, an automatic screening process of wafer resistors is realized. The cooperation between the fixed chuck and the lower toothed disc can ensure that the wafer resistor is stably placed in the installation slot, and the upper toothed disc is driven to rotate by the driving component to achieve efficient transmission and screening of the wafer resistor. The V-groove design on the upper toothed disc is specifically used to remove wafer resistors with larger diameters, ensuring that only wafer resistors with the required size are discharged normally through the second outlet, while wafers with smaller or larger diameters are effectively removed, avoiding unqualified products from flowing into subsequent processes, improving the accuracy of screening, and realizing the automatic screening and discharge process of wafer resistors, greatly reducing labor costs and improving production efficiency.

[0010] Preferably, the upper toothed disc edge is provided with a plurality of spaced protrusions, and inclined surfaces are provided on both sides of the protrusions, and the inclined surfaces between the two protrusions form a V-shaped groove for screening wafer resistors with larger diameters. The design of the V-shaped groove enables the upper toothed disc to effectively push the wafer resistors with larger diameters to the third outlet during rotation, while the qualified wafer resistors are discharged through the second outlet. This mechanical screening method improves the screening efficiency, reduces the need for manual operation, and is suitable for high-speed automated production environments. Through the inclined surfaces on both sides of the protrusions, the wafers with larger diameters can be accurately guided to move to the third outlet, while the wafers with appropriate diameters continue to flow along another path. This design makes the screening process more accurate and reduces the possibility of misscreening and missed screening. V-shaped grooves of different sizes can be set according to the requirements of the wafer diameter, so that the screening device can adapt to wafers of different specifications, increasing the versatility of the equipment. The structure of the V-shaped groove is relatively simple and easy to clean and maintain. After long-term use, if the screening effect needs to be adjusted, it can be achieved by cleaning or adjusting the position of the protrusions, so that the maintenance cost of the equipment is reduced.

[0011] Furthermore, a discharge trough is provided in front of the V-shaped groove, and the discharge trough is used to accommodate qualified wafer resistors. When the discharge trough corresponds to the third outlet, qualified wafer resistors are discharged from the third outlet through the discharge trough. The design of the discharge trough and the third outlet allows qualified wafer resistors to be effectively guided to the discharge trough, thereby forming a clear and efficient material flow channel, reducing collisions and friction during the screening process, and reducing the risk of damage to wafer resistors during transportation, thereby reducing material losses. This design can adjust the position and size of the discharge trough according to wafer resistors of different sizes, so that the equipment has good adaptability and flexibility, and can be used for the screening of wafer resistors of various specifications.

[0012] Preferably, the number of the third outlets is at least two, which are evenly distributed on the outer periphery of the rotation center of the upper toothed disc, and a third hopper for collecting wafer resistors is provided below the third outlet. The third outlets are evenly distributed on the outer periphery of the upper toothed disc, which ensures that the rotational force to which the wafer resistors are subjected is evenly distributed when passing through the screening process, helps to reduce wear and damage during the screening process, and protects the integrity of the wafer resistors. The design of multiple third outlets helps to avoid congestion at a single outlet caused by the accumulation of a large number of wafer resistors, improves the stability of the screening process, and reduces the risk of material blockage. By adjusting the number and position of the third outlets, it can be flexibly adjusted according to specific needs (such as wafer resistor size, output, etc.), providing higher flexibility and adaptability.

[0013] Preferably, the driving component includes a motor fixed on the frame, the motor is rotatably connected to a rotating shaft, and the end of the rotating shaft extends to the upper gear plate and is rotatably connected thereto. The motor serves as a power source, and directly drives the upper gear plate to rotate through the rotating shaft. The power transmission process is simple and direct, which reduces energy loss during the transmission process and improves the overall efficiency of the screening process. The automatic control capability of the motor enables the equipment to achieve continuous and stable operation, reduces manual intervention, improves the automation level of the production process, and saves labor costs.

[0014] Preferably, the frame is provided with a first discharge chamber and a second discharge chamber located below the loading platform, the first discharge chamber is connected to the first outlet, the second discharge chamber is connected to the second outlet, the first discharge chamber is provided with a first discharge port at the bottom, and the second discharge chamber is provided with a second discharge port at the bottom. By guiding qualified wafer resistors and unqualified wafer resistors to the first discharge port and the second discharge port, respectively, the independent design of the first discharge chamber and the second discharge chamber reduces the mixing between qualified wafer resistors and unqualified wafer resistors, ensuring the purity and quality consistency of the output wafer resistors. , the third outlet realizes the efficient sorting and output of wafer resistors, and improves production efficiency and screening accuracy.

[0015] Preferably, the rejection component includes an electromagnet fixed on one side of the fixed chuck and electrically connected to the control module, the electromagnet is connected to a robotic arm, and a sensing switch is provided in front of the robotic arm, the sensing switch is used to sense the wafer resistor and send an electrical signal to the electromagnet, so that the electromagnet drives the robotic arm to extend and push the wafer resistor in the V-groove to the third outlet for discharge. The use of the sensing switch ensures that only wafer resistors with larger diameters are accurately identified and rejected, reducing the risk of mistakenly rejecting qualified wafer resistors and improving the accuracy of screening. The entire rejection process is controlled by the control module to achieve automated operation. The structure of the electromagnet and the robotic arm is relatively simple and easy to maintain and clean, which shortens the time of equipment downtime for maintenance and improves the availability of the equipment.

[0016] Furthermore, a rejection component is arranged between the first outlet and the second outlet, and an air valve is also provided on the fixed chuck, and the air valve is used to blow the wafer resistor to the third outlet for discharge. Placing the rejection component between the first outlet and the second outlet can more effectively distinguish and reject unqualified wafer resistors, while ensuring that qualified wafer resistors smoothly enter the screening process, thereby improving screening efficiency and accuracy. Through precise rejection, the mistaken exclusion of qualified wafer resistors is avoided, and material losses are reduced, especially for expensive or scarce wafer resistors, with significant economic benefits. The integrated design of the air valve and the rejection component makes the entire screening process more automated, reduces human intervention, and improves the continuity and stability of the production process. By adjusting the pressure and blowing speed of the air valve, it can adapt to wafer resistors of different materials and sizes, thereby improving the versatility and adaptability of the equipment.

[0017] The present invention also provides a method for using a ceramic rod screening device for wafer resistors, wherein any of the above ceramic rod screening devices for wafer resistors is used for screening, and the method comprises the following steps:

[0018] (1) Loading: Load the wafer resistor to be screened from the loading port of the fixed chuck, and start the driving component to drive the upper gear disk to rotate;

[0019] (2) Primary screening: When the discharge slot corresponds to the first outlet, the wafer resistor with a smaller diameter falls from the first outlet into the first discharge cavity;

[0020] (3) Rescreening: Wafer resistors with larger diameters are placed in the V-shaped grooves. When the upper toothed disc rotates to the position where the components are removed, the induction switch senses the wafer resistors in the V-shaped grooves, controls the electromagnet to drive the mechanical arm to extend, and pushes the wafer resistors in the V-shaped grooves to the third outlet and falls into the third hopper.

[0021] (4) Final screening: When the discharge trough corresponds to the second outlet, the wafer resistors with qualified diameters fall from the second outlet into the second discharge chamber for collection, and are finally discharged through the second discharge port as qualified products.

[0022] The beneficial effects of the present invention are as follows: by setting a combination of components such as a loading platform, a fixed chuck, a lower toothed disc, an upper toothed disc, and a V-groove, an automatic screening process of wafer resistors is realized. The cooperation of the fixed chuck and the lower toothed disc can ensure that the wafer resistor is stably placed in the installation groove, and the upper toothed disc is driven to rotate by the driving component to achieve efficient transmission and screening of the wafer resistors. The V-groove design on the upper toothed disc is specifically used to remove wafer resistors with larger diameters, ensuring that only wafer resistors with sizes that meet the requirements are discharged normally through the second outlet, while wafers with smaller or larger diameters are effectively removed, avoiding unqualified products from flowing into subsequent processes, improving the accuracy of screening, and realizing the automatic screening and discharge process of wafer resistors, greatly reducing labor costs and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, without paying creative labor, other drawings obtained based on these drawings still belong to the scope of the present invention.

[0024] Figure 1 It is a schematic diagram of the main structure of the present invention;

[0025] Figure 2 It is a structural schematic diagram of another perspective of the present invention;

[0026] Figure 3 It is a structural schematic diagram of the parts on the loading platform of the present invention;

[0027] Figure 4 for Figure 3 The schematic diagram of the structure in which the upper gear disc is removed;

[0028] Figure 5 This is a schematic diagram of the structure of the present invention without the protective shell;

[0029] Figure 6 for Figure 5 A magnified detail of the center point A;

[0030] Figure 7 It is a schematic diagram of the structure of the anti-rotation component;

[0031] Figure 8 A schematic diagram of the structure of the anti-rotation component from another perspective;

[0032] In the figure, 1, frame; 11, loading platform; 12, first discharge chamber; 121, first discharge port; 13, second discharge chamber; 131, second discharge port; 2, control module; 3, driving component; 31, motor; 32, rotating shaft; 4, screening component; 41, fixed chuck; 411, mounting groove; 412, loading port; 42, lower toothed disc; 421, first outlet; 422, second outlet; 43, upper toothed disc; 431, V-shaped groove; 432, protrusion; 433, inclined surface; 434, discharge slot; 435, the third outlet; 436, the third hopper; 5, the rejecting component; 51, the electromagnet; 52, the mechanical arm; 53, the induction switch; 54, the air valve; 6, the anti-rotation component; 61, the bottom plate; 62, the protective shell; 63, the ratchet; 64, the first limit plate; 641, the ratchet; 642, the roller; 643, the first snap-in pin; 65, the second limit plate; 651, the groove; 652, the second snap-in pin; 66, the third limit plate; 661, the torsion spring; 662, the shift block; 67, the fourth limit plate. DETAILED DESCRIPTION

[0033] In order to make the objectives, technical solutions and advantages of the present invention more clear, the present invention will be further described in detail below with reference to the accompanying drawings.

[0034] It should be noted that all expressions using "first" and "second" in the embodiments of the present invention are for distinguishing two non-identical entities with the same name or non-identical parameters. It can be seen that "first" and "second" are only for the convenience of expression and should not be understood as limitations on the embodiments of the present invention. The subsequent embodiments will not explain this one by one.

[0035] The directions and positions mentioned in the present invention, such as "upper", "lower", "front", "back", "left", "right", "inside", "outside", "top", "bottom", "side", etc., are only for reference to the directions or positions of the drawings. Therefore, the directions and positions used are for explaining and understanding the present invention, but not for limiting the scope of protection of the present invention.

[0036] like Figure 1-8As shown, an embodiment of a ceramic rod screening device for wafer resistors of the present invention comprises a frame 1, on which a control module 2, a driving component 3, a screening component 4 and a rejecting component 5 are arranged, and a loading platform 11 is arranged on the frame 1, and the screening component 4 comprises a fixed chuck 41 fixedly arranged on the loading platform 11, and a mounting groove 411 is arranged in the fixed chuck 41, and a lower toothed disc 42 is fixed in the mounting groove 411, and an upper toothed disc 43 connected to the driving component 3 is arranged on the lower toothed disc 42. The fixed chuck 41 is provided with a loading port 412, and one end of the lower toothed disc 42 close to the loading port 412 is provided with a first outlet 421 for discharging wafer resistors with smaller diameters, and the other end is provided with a second outlet 422 for discharging qualified wafer resistors; the edge of the upper toothed disc 43 is provided with V-grooves 431 evenly distributed along the circumference, and the center of the upper toothed disc 43 is provided with a third outlet 435, and the V-groove 431 is used by the removal component 5 to remove the wafer resistors with larger diameters and discharge them into the third outlet 435. By setting a combination of the loading platform 11, the fixed chuck 41, the lower toothed disc 42, the upper toothed disc 43, and the V-groove 431, the automatic screening process of the wafer resistors is realized. The cooperation of the fixed chuck 41 and the lower toothed disc 42 can ensure that the wafer resistors are stably placed in the mounting groove 411, and the upper toothed disc 43 is driven to rotate by the driving component 3 to realize the efficient transmission and screening of the wafer resistors. The V-groove 431 on the upper toothed disc 43 is specially designed to remove wafer resistors with larger diameters, ensuring that only wafer resistors with sizes that meet the requirements are discharged normally through the second outlet 422, while wafers with smaller or larger diameters are effectively removed, preventing unqualified products from flowing into subsequent processes, improving the accuracy of screening, and realizing the automatic screening and discharge process of wafer resistors, which greatly reduces labor costs and improves production efficiency.

[0037] The edge of the upper toothed disc 43 is provided with a plurality of spaced protrusions 432, and inclined surfaces 433 are provided on both sides of the protrusions 432, and the inclined surfaces 433 between the two protrusions 432 form a V-groove 431 for screening wafer resistors with larger diameters. The design of the V-groove 431 enables the upper toothed disc 43 to effectively push the wafer resistors with larger diameters to the third outlet 435 during rotation, while the qualified wafer resistors are discharged through the second outlet 422. This mechanical screening method improves the screening efficiency, reduces the need for manual operation, and is suitable for high-speed automated production environments. Through the inclined surfaces 433 on both sides of the protrusions 432, the wafers with larger diameters can be accurately guided to move to the third outlet 435, while the wafers with appropriate diameters continue to flow along another path. This design makes the screening process more accurate and reduces the possibility of misscreening and missed screening. V-grooves 431 of different sizes can be set according to the requirements of the wafer diameter, so that the screening device can adapt to wafers of different specifications, increasing the versatility of the equipment. The structure of the V-groove 431 is relatively simple and easy to clean and maintain. After long-term use, if the screening effect needs to be adjusted, it can be achieved by cleaning or adjusting the position of the protrusion 432, thereby reducing the maintenance cost of the equipment.

[0038] A discharge trough 434 is provided in front of the V-shaped groove 431, and the discharge trough 434 is used to accommodate qualified wafer resistors. When the discharge trough 434 corresponds to the third outlet 435, the qualified wafer resistor is discharged from the third outlet 435 through the discharge trough 434. The design of the discharge trough 434 and the third outlet 435 allows the qualified wafer resistors to be effectively guided to the discharge trough 434, thereby forming a clear and efficient material flow channel, reducing collisions and frictions during the screening process, reducing the risk of damage to the wafer resistors during transportation, and thus reducing material losses. This design can adjust the position and size of the discharge trough 434 according to wafer resistors of different sizes, so that the equipment has good adaptability and flexibility, and can be used for the screening of wafer resistors of various specifications.

[0039] The number of the third outlets 435 is at least two, which are evenly distributed on the outer periphery of the rotation center of the upper toothed disc 43, and a third hopper 436 for collecting wafer resistors is provided below the third outlet 435. The third outlets 435 are evenly distributed on the outer periphery of the upper toothed disc 43, which ensures that the rotational force on the wafer resistors is evenly distributed when passing through the screening process, helps to reduce wear and damage during the screening process, and protects the integrity of the wafer resistors. The design of multiple third outlets 435 helps to avoid congestion caused by the accumulation of a large number of wafer resistors at a single outlet, improves the stability of the screening process, and reduces the risk of material blockage. By adjusting the number and position of the third outlets 435, it can be flexibly adjusted according to specific needs (such as wafer resistor size, output, etc.), providing higher flexibility and adaptability.

[0040] The driving component 3 includes a motor 31 fixed to the frame 1, and a rotating shaft 32 is rotatably connected to the motor 31. The end of the rotating shaft 32 extends to the upper gear plate 43 and is rotatably connected thereto. The motor 31 serves as a power source, and directly drives the upper gear plate 43 to rotate through the rotating shaft 32. The power transmission process is simple and direct, which reduces energy loss during the transmission process and improves the overall efficiency of the screening process. The automatic control capability of the motor 31 enables the equipment to achieve continuous and stable operation, reduces manual intervention, improves the automation level of the production process, and saves labor costs.

[0041] The frame 1 is provided with a first discharge chamber 12 and a second discharge chamber 13 located below the loading platform 11. The first discharge chamber 12 is communicated with the first outlet 421, and the second discharge chamber 13 is communicated with the second outlet 422. The first discharge chamber 12 is provided with a first discharge port 121 at the bottom, and the second discharge chamber 13 is provided with a second discharge port 131 at the bottom. By guiding qualified wafer resistors and unqualified wafer resistors to the first discharge port 121 and the second discharge port 131, respectively, the independent design of the first discharge chamber 12 and the second discharge chamber 13 reduces the mixing between qualified wafer resistors and unqualified wafer resistors, and ensures the purity and quality consistency of the output wafer resistors. , the third outlet 435 realizes the efficient sorting and output of wafer resistors, and improves production efficiency and screening accuracy.

[0042] The rejection component 5 includes an electromagnet 51 fixed on one side of the fixed chuck 41 and electrically connected to the control module 2, the electromagnet 51 is connected to a mechanical arm 52, and a sensing switch 53 is provided in front of the mechanical arm 52, the sensing switch 53 is used to sense the wafer resistor and send an electrical signal to the electromagnet 51, so that the electromagnet 51 drives the mechanical arm 52 to extend and push the wafer resistor in the V-groove 431 to the third outlet 435 for discharge. The use of the sensing switch 53 ensures that only wafer resistors with larger diameters are accurately identified and rejected, reducing the risk of mistakenly rejecting qualified wafer resistors and improving the accuracy of screening. The entire rejection process is controlled by the control module 2 to achieve automated operation. The structure of the electromagnet 51 and the mechanical arm 52 is relatively simple, easy to maintain and clean, shortening the time of equipment downtime maintenance and improving the availability of the equipment.

[0043] The rejection component 5 is arranged between the first outlet 421 and the second outlet 422, and the fixed chuck 41 is also provided with an air valve 54, and the air valve 54 is used to blow the wafer resistor to the third outlet 435 for discharge. Placing the rejection component 5 between the first outlet 421 and the second outlet 422 can more effectively distinguish and reject unqualified wafer resistors, while ensuring that qualified wafer resistors smoothly enter the screening process, thereby improving screening efficiency and accuracy. Through precise rejection, the mistaken exclusion of qualified wafer resistors is avoided, and material losses are reduced, especially for expensive or scarce wafer resistors, with significant economic benefits. The integrated design of the air valve 54 and the rejection component 5 makes the entire screening process more automated, reduces human intervention, and improves the continuity and stability of the production process. By adjusting the pressure and blowing speed of the air valve 54, it can adapt to wafer resistors of different materials and sizes, thereby improving the versatility and adaptability of the equipment.

[0044] The difference between this embodiment and the above embodiment is that Figure 2 , 5 -8, the driving component 3 is provided with an anti-rotation component 6 located in the frame 1, and the anti-rotation component 6 is detachably provided with a protective shell 62, and the anti-rotation component 6 includes a ratchet 63 fixedly sleeved on the rotating shaft 32, and the ratchet 63 is externally linked with a first limit plate 64, and the first limit plate 64 is connected to the ratchet 63 in a one-way rotation through a ratchet tooth 641, and the frame 1 is provided with a bottom plate 61, and a second limit plate 65 linked with the first limit plate 64 is rotatably provided on the bottom plate 61, and a groove 651 is provided on the second limit plate 65, and one end of the first limit plate 64 is connected through a roller 642 It can selectively abut against the groove 651, and the first limiting plate 64 is also provided with a first locking pin 643, and the first locking pin 643 can selectively be locked with a third limiting plate 66 rotatably installed on the base plate 61, and the third limiting plate 66 is provided with a torsion spring 661, and the third limiting plate 66 is also provided with a protruding shift block 662. A fourth limiting plate 67 is also rotatably provided on the base plate 61, and a second locking pin 652 is provided on the second limiting plate 65, one end of the fourth limiting plate 67 is locked with the second locking pin 652, and the other end is locked with the shift block 662, and the abutment position of the fourth limiting plate 67 and the second locking pin 652 is inclined.

[0045] When the second limiting plate 65 is against the inner wall of the protective shell 62, the roller 642 is engaged with the groove 651, the first engaging pin 643 is engaged with the end of the third limiting plate 66, the second positioning pin is engaged with the end of the fourth limiting plate 67, and the shift block 662 is in contact with the fourth limiting plate 67. At this time, both ends of the first limiting plate 64 are limited, and under the action of the torsion spring 661 of the third limiting plate 66, the first adjusting arm cannot rotate, thereby preventing the rotating shaft 32 from rotating.

[0046] When the protective shell 62 is removed, the second limit plate 65 is released from the limit, thereby releasing the abutment limit state between the roller 642 and the groove 651, and the second locking pin 652 pushes the fourth limit plate 67 to rotate, and moves the shift block 662 on the third limit plate 66. When the shifting force is greater than the elastic force of the torsion spring 661, the fourth limit plate 67 moves the third limit plate 66, releasing the abutment limit state between the first positioning pin and the third limit plate 66, and the first limit plate 64 can rotate.

[0047] The present invention also provides a method for using a ceramic rod screening device for wafer resistors, wherein any of the above ceramic rod screening devices for wafer resistors is used for screening, and the method comprises the following steps:

[0048] (1) Loading: Load the wafer resistor to be screened from the loading port 412 of the fixed chuck 41, and start the driving component 3 to drive the upper gear plate 43 to rotate;

[0049] (2) Preliminary screening: When the discharge slot 434 corresponds to the first outlet 421 , the resistor wafers with smaller diameters fall from the first outlet 421 into the first discharge chamber 12 ;

[0050] (3) Rescreening: The wafer resistors with larger diameters are placed in the V-shaped grooves 431. When the upper toothed disc 43 rotates to the position of the rejecting component 5, the induction switch 53 senses the wafer resistors in the V-shaped grooves 431, controls the electromagnet 51 to drive the mechanical arm 52 to extend and push the wafer resistors in the V-shaped grooves 431 to the third outlet 435 and drop into the third hopper 436.

[0051] (4) Final screening: When the discharge slot 434 corresponds to the second outlet 422 , the wafer resistors with qualified diameters fall from the second outlet 422 into the second discharge chamber 13 for collection, and are finally discharged through the second discharge port 131 as qualified products.

[0052] The above disclosure is only the preferred embodiment of the present invention, which certainly cannot be used to limit the scope of the present invention. Therefore, equivalent changes made according to the claims of the present invention are still within the scope of the present invention.

[0053] Although the invention has been described with reference to several specific embodiments, it should be understood that the invention is not limited to the specific embodiments disclosed. The invention is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.

Claims

1. A ceramic rod screening device for wafer resistors, characterized in that: It comprises a frame, on which a control module, a driving component, a screening component and a rejecting component are arranged, a loading platform is arranged on the frame, the screening component comprises a fixed chuck fixedly arranged on the loading platform, a mounting groove is arranged in the fixed chuck, a lower toothed disc is fixed in the mounting groove, an upper toothed disc connected with the driving component is arranged on the lower toothed disc, a loading port is arranged on the fixed chuck, a first outlet for discharging wafer resistors with smaller diameters is arranged at one end of the lower toothed disc close to the loading port, and a second outlet for discharging qualified wafer resistors is arranged at the other end; V-shaped grooves are evenly distributed along the circumferential direction on the edge of the upper toothed disc, a third outlet is arranged in the center of the upper toothed disc, and the V-shaped groove is used by the rejecting component to reject wafer resistors with larger diameters and discharge them into the third outlet.

2. The ceramic rod screening device for wafer resistors according to claim 1, characterized in that: The edge of the upper toothed disc is provided with a plurality of spaced protrusions, and both sides of the protrusions are provided with inclined surfaces, and the inclined surface between the two protrusions forms a V-shaped groove for screening wafer resistors with larger diameters.

3. The ceramic rod screening device for wafer resistors according to claim 2, characterized in that: A discharge trough is provided in front of the V-shaped groove, and the discharge trough is used to accommodate qualified wafer resistors. When the discharge trough corresponds to the third outlet, the qualified wafer resistors are discharged from the third outlet through the discharge trough.

4. The ceramic rod screening device for wafer resistors according to claim 1, characterized in that: The number of the third outlets is at least two, which are evenly distributed on the outer periphery of the rotation center of the upper gear disk, and a third hopper for collecting wafer resistors is provided below the third outlet.

5. The ceramic rod screening device for wafer resistors according to claim 1, characterized in that: The driving component comprises a motor fixed on a frame, a rotating shaft is rotatably connected to the motor, and an end of the rotating shaft extends to an upper gear disc and is rotatably connected thereto.

6. The ceramic rod screening device for wafer resistors according to claim 1, characterized in that: The frame is provided with a first discharge chamber and a second discharge chamber located below the loading platform, the first discharge chamber is connected to the first outlet, the second discharge chamber is connected to the second outlet, a first discharge port is provided at the bottom of the first discharge chamber, and a second discharge port is provided at the bottom of the second discharge chamber.

7. The ceramic rod screening device for wafer resistors according to claim 1, characterized in that: The removal component includes an electromagnet fixed on one side of the fixed chuck and electrically connected to the control module, the electromagnet is connected to a robotic arm, and an induction switch is provided in front of the robotic arm. The induction switch is used to sense the wafer resistor and send an electrical signal to the electromagnet, so that the electromagnet drives the robotic arm to extend and push the wafer resistor in the V-groove to the third outlet for discharge.

8. The ceramic rod screening device for wafer resistors according to claim 7, characterized in that: The rejecting component is arranged between the first outlet and the second outlet, and the fixed chuck is also provided with an air valve, which is used to blow the wafer resistor to the third outlet for discharge.

9. A method for using a ceramic rod screening device for wafer resistors, characterized in that: The method of screening using a ceramic rod screening device for wafer resistors according to any one of claims 1 to 8 comprises the following steps: (1) Loading: Load the wafer resistor to be screened from the loading port of the fixed chuck, and start the driving component to drive the upper gear disk to rotate; (2) Primary screening: When the discharge slot corresponds to the first outlet, the wafer resistor with a smaller diameter falls from the first outlet into the first discharge cavity; (3) Rescreening: Wafer resistors with larger diameters are placed in the V-shaped grooves. When the upper toothed disc rotates to the position where the components are removed, the induction switch senses the wafer resistors in the V-shaped grooves, controls the electromagnet to drive the mechanical arm to extend, and pushes the wafer resistors in the V-shaped grooves to the third outlet and falls into the third hopper. (4) Final screening: When the discharge trough corresponds to the second outlet, the wafer resistors with qualified diameters fall from the second outlet into the second discharge chamber for collection, and are finally discharged through the second discharge port as qualified products.

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