Ejection device for die casting

Abstract

The present disclosure relates to an ejection device for die casting for ejecting a molded product molded by a fixed mold and a movable mold, the ejection device comprising: an ejection plate provided on a movable holder on which the movable mold is mounted so as to be movable forward and backward in a moving direction of the movable mold; a plurality of main ejector pins provided on the ejector plate in a moving direction of the movable mold so as to penetrate the movable mold; and a plurality of sub-ejection units disposed on the ejection plate to penetrate the movable mold and disposed to eject the molded product in a plurality of directions within a range of ejection angles set based on an arrangement direction of the main ejection pins.

Description

[0001] Cross-reference to related applications

[0002] This application claims the benefit of Korean Patent Application No. 10-2023-0119484, filed on September 8, 2023, which is incorporated herein by reference. Technical Field

[0003] Exemplary embodiments of the present disclosure are directed to a die casting system. Background Art

[0004] In general, the die casting method is a method of injecting molten metal into a mold under high pressure to solidify the molten metal into a solid state and manufacture a product having a shaped form.

[0005] A mold used in such a high pressure die casting method includes a fixed mold and a movable mold which can be coupled and released.

[0006] When molten metal is injected into a cavity formed between the fixed mold and the movable mold that are combined together, the molten metal is solidified in the cavity and can be molded into a product having a desired shape.

[0007] Furthermore, the movable mold includes an ejection device for ejecting the molded product.

[0008] The ejection device includes: an ejection plate movably mounted on the movable mold in a moving direction of the movable mold; and a plurality of ejection pins mounted on the ejection plate.

[0009] Here, the number and installation positions of the ejector pins can be determined by the operating force of the ejector plate and the pressing force (or compression force) applied by the ejector pins to the molded product. These ejector pins are arranged on the ejector plate parallel to each other in the moving direction of the movable mold.

[0010] Therefore, in a state in which the fixed mold and the movable mold are released, when the ejector plate moves in the moving direction of the movable mold, the molded product can be ejected from the movable mold by the operation of the ejector pin.

[0011] However, the ejector pin may be bent or damaged due to buckling. Therefore, the unavailability of the mold may increase, and the incidence of defects in molded products may increase.

[0012] The above information disclosed in this Background section is only for enhancement of understanding of the background of the present disclosure and therefore it may contain information that does not form known prior art. Summary of the invention

[0013] Exemplary embodiments of the present disclosure relate to a die casting system. Specific embodiments relate to an ejector device for die casting, the ejector device being configured to eject a product molded by a high pressure die casting method from a mold.

[0014] Embodiments of the present disclosure provide an ejector device for die casting that can prevent damage and breakage of an ejector pin due to buckling.

[0015] According to an exemplary embodiment of the present disclosure, an ejector device for die casting is configured to eject a molded product molded by a fixed mold and a movable mold, and includes: i) an ejector plate provided on a movable holder on which the movable mold is installed so as to be movable forward and backward in a moving direction of the movable mold; ii) a plurality of main ejector pins installed on the ejector plate in the moving direction of the movable mold so as to penetrate the movable mold; and iii) a plurality of sub-ejector units installed on the ejector plate so as to penetrate the movable mold and arranged to eject the molded product in a plurality of directions within a range of ejection angles set based on an arrangement direction of the main ejector pins.

[0016] In the ejector device for die casting according to the exemplary embodiment of the present disclosure, at least one of the plurality of sub-ejector units may be disposed at an ejection angle based on an arrangement direction of the main ejector pins.

[0017] In the ejector device for die casting according to the exemplary embodiment of the present disclosure, at least another sub-ejector unit among the plurality of sub-ejector units may be disposed obliquely in a diagonal direction at an ejection angle relative to an arrangement direction of the main ejector pins.

[0018] In addition, according to an exemplary embodiment of the present disclosure, an ejector device for die casting, which is configured to eject a molded product molded by a fixed mold and a movable mold, includes: i) an ejector plate, which is provided on a movable holder on which the movable mold is installed so as to be movable forward and backward in a moving direction of the movable mold; ii) a plurality of main ejector pins, which are installed on the ejector plate in the moving direction of the movable mold so as to penetrate the movable mold; iii) at least one first sub-ejector unit, which is installed on the ejector plate so as to penetrate the movable mold and is arranged at an ejection angle based on an arrangement direction of the main ejector pins; iv) at least one second sub-ejector unit, which is installed on the ejector plate so as to penetrate the movable mold and is arranged to be inclined at a set ejection angle based on an arrangement direction of the main ejector pins; and v) a coupling module, which is installed on the ejector plate and connected to the at least one second sub-ejector unit so that the at least one second sub-ejector unit can swing and move linearly according to the movement of the ejector plate.

[0019] Furthermore, in the ejection device for die casting according to an exemplary embodiment of the present disclosure, at least one first sub-ejection unit may include: a first sub-ejection rod connected to the ejection plate by tapping and arranged to be parallel to the main ejection pin in the moving direction of the ejection plate; and a first sub-ejection block connected to the first sub-ejection rod.

[0020] Furthermore, in the ejector device for die casting according to the exemplary embodiment of the present disclosure, the first sub-ejector rod may be provided as a rod having a cross-sectional area greater than that of the plurality of main ejector pins.

[0021] Furthermore, in the ejector device for die casting according to the exemplary embodiment, the first sub-ejector block may be provided as a block having a cross-sectional area greater than a cross-sectional area of ​​the first sub-ejector rod.

[0022] Furthermore, in the ejector device for die casting according to the exemplary embodiment of the present disclosure, the first sub-ejector rod may be coupled to the ejector plate by tapping through the coupling end portion having the tapping thread.

[0023] Furthermore, in the ejector device for die casting according to the exemplary embodiment of the present disclosure, the first sub-ejector block may be coupled to the free end portion of the first sub-ejector rod by a first positioning pin.

[0024] Furthermore, in the ejector device for die casting according to the exemplary embodiment of the present disclosure, the first auxiliary ejector block may include: a first ejection surface supporting the molded product; and a first gradient portion having a cross-sectional area on a plane parallel to the first ejection surface gradually decreasing at a set gradient angle along a longitudinal direction of the first auxiliary ejector rod.

[0025] Furthermore, in the ejector device for die casting according to the exemplary embodiment of the present disclosure, at least one first sub-ejector unit may further include a first guide bushing fixed to the movable holder to guide the first sub-ejector rod.

[0026] Furthermore, in the ejection device for die casting according to the exemplary embodiment of the present disclosure, at least one second sub-ejection unit may include: a second sub-ejection rod connected to the engagement module through a through hole formed in the ejection plate and arranged to be inclined in an oblique direction relative to a moving direction of the ejection plate; and a second sub-ejection block coupled to the second sub-ejection rod.

[0027] Furthermore, in the ejector device for die casting according to the exemplary embodiment of the present disclosure, a cross-sectional area of ​​the second auxiliary ejector rod may be greater than a cross-sectional area of ​​the plurality of main ejector pins.

[0028] Furthermore, in the ejector device for die casting according to the exemplary embodiment of the present disclosure, a cross-sectional area of ​​the second auxiliary ejector block may be greater than a cross-sectional area of ​​the second auxiliary ejector rod.

[0029] Furthermore, in the ejector device for die casting according to the exemplary embodiment of the present disclosure, the second sub-ejector rod may be coupled to the engaging module through the coupling end portion to be swingable and linearly movable.

[0030] Furthermore, in the ejector device for die casting according to the exemplary embodiment of the present disclosure, the second auxiliary ejector block may be coupled to the free end portion of the second auxiliary ejector rod by a second positioning pin.

[0031] Furthermore, in the ejection device for die casting according to the exemplary embodiment of the present disclosure, the second auxiliary ejector block may include: a second ejection surface supporting the molded product; and a second inclined portion having a cross-sectional area on a plane parallel to the second ejection surface gradually decreasing at a set inclination angle along a longitudinal direction of the second auxiliary ejector rod.

[0032] Furthermore, in the ejector device for die casting according to the exemplary embodiment of the present disclosure, the second sub ejector block may be disposed on an undercut portion molded in the molded product, and the second sub ejector block may be disposed to leave the undercut portion through the second ejector surface.

[0033] Furthermore, in the ejector device for die casting according to the exemplary embodiment of the present disclosure, the at least one second sub-ejector unit may further include a second guide bushing obliquely fixed to the movable holder to guide the second sub-ejector rod.

[0034] In addition, in the ejection device for die casting according to the exemplary embodiment of the present disclosure, the engaging module may include: a fixed block fixed to the ejection plate at a position corresponding to the through hole; and a sliding member connected to the fixed block so as to be able to slide in a linear direction and connected so that the second auxiliary ejection rod swings within a set ejection angle range.

[0035] Furthermore, in the ejector device for die casting according to the exemplary embodiment of the present disclosure, the second sub-ejector rod may be swingably coupled to the slide member by a hinge pin.

[0036] According to the ejector device for die casting according to the exemplary embodiment of the present disclosure, unavailability of a die casting system may be reduced and the occurrence rate of defects in a molded product may be minimized by preventing damage and breakage of a main ejector pin due to buckling.

[0037] Furthermore, according to the ejector device for die casting according to the exemplary embodiment of the present disclosure, the shape of the undercut portion may be realized in the molded product, thereby improving the degree of freedom in designing the molded product.

[0038] In addition, in the detailed description of the present disclosure, the effects that can be obtained or expected due to the exemplary embodiments of the present disclosure will be disclosed directly or implicitly. That is, various effects predicted according to the present disclosure will be disclosed in the detailed description to be described below. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The accompanying drawings are used for reference in describing exemplary embodiments of the present disclosure, and thus, the technical concept of the present disclosure should not limit the present disclosure to the accompanying drawings.

[0040] Figure 1 is a schematic diagram schematically showing a mold system according to an exemplary embodiment of the present disclosure, to which an ejection device for die casting is applied.

[0041] Figure 2 is a perspective view showing an ejector device for die casting according to an exemplary embodiment of the present disclosure.

[0042] Figure 3 is a side view showing an ejector device for die casting according to an exemplary embodiment of the present disclosure.

[0043] Figure 4 is a perspective view illustrating a first sub-ejector unit applied to an ejector device for die casting according to an exemplary embodiment of the present disclosure.

[0044] Figure 5 is a cross-sectional view showing a first sub-ejector unit applied to an ejector device for die casting according to an exemplary embodiment of the present disclosure.

[0045] FIG. 6A to FIG. 6C is a schematic diagram illustrating a shape of a first sub-ejector unit applied to an ejector device for die casting according to an exemplary embodiment of the present disclosure.

[0046] Figure 7 is a perspective view illustrating a second sub-ejector unit applied to an ejector device for die casting according to an exemplary embodiment of the present disclosure.

[0047] Figure 8 is a cross-sectional view illustrating a second sub-ejector unit applied to an ejector device for die casting according to an exemplary embodiment of the present disclosure.

[0048] 9A to 9C is a schematic diagram illustrating a shape of a second sub-ejector unit applied to an ejector device for die casting according to an exemplary embodiment of the present disclosure.

[0049] Fig.10 is a schematic diagram schematically illustrating a joining module applied to an ejection device for die casting according to an exemplary embodiment of the present disclosure.

[0050] It should be understood that the drawings referred to above are not necessarily drawn to scale, but rather present a rather simplified representation of a number of preferred features illustrating the basic principles of the embodiments of the present disclosure. Certain design features of the embodiments of the present disclosure (for example, including specific dimensions, orientations, positions, and shapes) will be determined in part by the specific intended application and use environment. DETAILED DESCRIPTION

[0051] Embodiments of the present disclosure will be described more fully below with reference to the accompanying drawings, in which exemplary embodiments of the present disclosure are shown. As will be appreciated by those skilled in the art, the exemplary embodiments described may be modified in a variety of different ways, all of which do not depart from the essence or scope of the present disclosure.

[0052] In order to clarify the present disclosure, parts irrelevant to the description will be omitted, and like reference numerals are used for like parts throughout the specification.

[0053] The size and thickness of each element are arbitrarily shown in the drawings, and the present disclosure is not necessarily limited thereto. In the drawings, the thickness of layers, films, panels, regions, etc. are exaggerated for clarity.

[0054] Also, the terms “unit,” “part,” and “member” described in the specification refer to units of integrated components that perform at least one function and operation.

[0055] The terms used herein are for the purpose of describing particular exemplary embodiments and are not intended to limit the present disclosure.As used herein, unless the context clearly dictates otherwise, the singular form is intended to include the plural form as well.

[0056] As used herein, it should be understood that the terms “include” and / or “comprising” refer to the presence of features, integers, steps, operations, elements and / or parts, but they do not exclude the presence or addition of one or more other features, integers, steps, operations, parts and / or combinations thereof.

[0057] As used herein, the term "coupled" refers to a physical relationship between two components either directly connected to each other or indirectly connected through one or more intermediate components.

[0058] Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0059] Figure 1is a schematic diagram schematically showing a die casting system according to an exemplary embodiment of the present disclosure, to which an ejection device for die casting is applied.

[0060] refer to Figure 1 , the ejector device 100 for die casting according to an exemplary embodiment of the present disclosure may be applied to a die casting system 200 for manufacturing a molded product 1 having a desired shape by injecting molten aluminum alloy metal into a mold.

[0061] In an example, the die casting system 200 may be applied to a process of molding automotive engine parts such as a cylinder block and a cylinder head using a high pressure die casting method.

[0062] In this specification, reference directions for describing the following components may be set to a vertical direction and a lateral direction (eg, a front-rear direction and a left-right direction).

[0063] Moreover, in this specification, the “upper end portion”, “upper part”, “top” or “upper surface” of a component refers to the end portion, part, end or surface of the component relatively existing on the upper side in the drawing, and the “lower end portion”, “lower part”, “bottom” or “lower surface” of a component refers to the end portion, part, end or surface of the component relatively existing on the lower side in the drawing.

[0064] In addition, in this specification, an end of a component (e.g., one end or the other end, etc.) refers to the end of the component in any one direction, and an end portion of a component (e.g., one end portion or the other end portion, etc.) refers to a specific portion of the component including the end.

[0065] Meanwhile, the die casting system 200 as described above basically includes the fixed mold 110 and the movable mold 210 .

[0066] The fixed mold 110 is fixed on a base installed in a die-casting workshop. The fixed mold 110 includes a fixed holder 111 and a fixed mold 121 .

[0067] In an example, the fixing holder 111 may be uprightly installed on the upper surface of the base in a vertical direction.

[0068] The fixed mold 121 is installed on the fixed holder 111. The fixed mold 121 is configured to mold a part of the molded product 1 through a molding section.

[0069] In addition, the movable mold 210 is installed to be movable forward and backward in the forward and backward direction on the base to correspond to the fixed mold 110. The movable mold 210 includes a movable holder 211 and a movable mold 221.

[0070] The movable holder 211 may be installed to be slidable in the front-rear direction on the upper surface of the base by driving a die driving source (not shown) known to those skilled in the art.

[0071] The movable mold 221 is installed on the movable holder 211. The movable mold 221 is configured to mold other parts of the molded product 1 through the molding section. The movable mold 221 may be combined with the fixed mold 121 or may be released from the fixed mold 121.

[0072] In the die casting system 200 configured as described above, the fixed mold 121 and the movable mold 221 are combined with each other, and molten metal is injected into the cavity formed between the molding section of the fixed mold 121 and the molding section of the movable mold 221. Then, the die casting system 200 can solidify the molten metal in the cavity and can mold the molded product 1 having a desired shape.

[0073] Meanwhile, the ejection device 100 for die casting according to the exemplary embodiment of the present disclosure ejects the molded product 1 from the movable mold 221 in a state in which the fixed mold 121 and the movable mold 221 are released.

[0074] Figure 2 is a perspective view showing an ejection device for die casting according to an exemplary embodiment of the present disclosure, and Figure 3 is a side view showing an ejector device for die casting according to an exemplary embodiment of the present disclosure.

[0075] refer to Figure 2 and Figure 3 , an ejector device 100 for die casting according to an exemplary embodiment of the present disclosure basically includes an ejector plate 10 and a plurality of main ejector pins 20 .

[0076] The ejector plate 10 is mounted on the movable holder 211 so as to be able to move forward and backward in the moving direction (e.g., the front-rear direction) of the movable mold 221. The ejector plate 10 may move forward and backward by driving the ejector driving source 11. In an embodiment, the ejector driving source 11 may include a hydraulic cylinder known to those skilled in the art.

[0077] In addition, the main ejector pin 20 is configured to push the molded product 1 in the moving direction of the movable mold 221 with a set ejection force (e.g., compression force). The main ejector pin 20 is installed on the ejector plate 10 in the moving direction of the movable mold 221 to penetrate the movable mold 221 through the movable holder 211.

[0078] The ejector device 100 for die casting according to the exemplary embodiment of the present disclosure has a structure that can prevent damage and breakage of the main ejector pin 20 due to buckling.

[0079] Furthermore, exemplary embodiments of the present disclosure provide an ejector device 100 for die casting that can realize the shape of the undercut portion 3 in the molded product 1 .

[0080] To this end, the ejector device 100 for die casting according to the exemplary embodiment of the present disclosure further includes a plurality of sub-ejector units 30 and 50 and a joining module 70 .

[0081] In the exemplary embodiment of the present disclosure, the sub-ejection units 30 and 50 eject the molded product 1 in multiple directions and can realize the shape of the undercut portion 3 on the molded product 1. In addition, the sub-ejection units 30 and 50 can increase the ejection force of the molded product 1 and disperse the compressive force concentrated on the main ejection pin 20.

[0082] The sub-ejection units 30 and 50 are installed on the ejection plate 10 to penetrate the movable mold 221 via the movable holder 211. The sub-ejection units 30 and 50 may be configured to eject the molded product 1 in a plurality of directions within a range of ejection angles (θ1 to θ2) set based on the arrangement direction of the main ejection pins 20 (see Figure 5 and Figure 8 )Inside.

[0083] Hereinafter, among the sub-ejection units 30 and 50 , at least one is referred to as a “first sub-ejection unit 30 ”, and at least the other is referred to as a “second sub-ejection unit 50 ”.

[0084] The first sub-ejection unit 30 may be arranged at an ejection angle θ1 (hereinafter, see Figure 5 )set up.

[0085] Figure 4 is a perspective view showing a first sub-ejection unit applied to an ejection device for die casting according to an exemplary embodiment of the present disclosure, Figure 5 is a cross-sectional view showing a first sub-ejector unit applied to an ejector device for die casting according to an exemplary embodiment of the present disclosure.

[0086] refer to Figures 2 to 5 The first sub-ejection unit 30 according to the exemplary embodiment of the present disclosure includes a first sub-ejection rod 31 , a first sub-ejection block 33 , and a first guide bushing 35 .

[0087] The first auxiliary ejector rod 31 is connected to the ejector plate 10 by tapping. The first auxiliary ejector rod 31 is arranged to be parallel to the main ejector pin 20 in the moving direction of the ejector plate 10.

[0088] Here, the first auxiliary ejector rod 31 may be coupled to the ejector plate 10 by tapping through the coupling end portion 31a formed with the tapping thread 37. Fig. 6A As shown, the first auxiliary ejector rod 31 may be provided as a rod having a cross-sectional area A1 greater than a cross-sectional area a1 of the main ejector pin 20 .

[0089] The first sub-ejector block 33 is configured to support the molded product 1 in the movable mold 221. The first sub-ejector block 33 is coupled to the free end portion 31b of the first sub-ejector rod 31.

[0090] Here, the first auxiliary ejection block 33 may be coupled to the free end portion 31b of the first auxiliary ejection rod 31 by means of the first positioning pin 39. Figure 6B As shown, the first auxiliary ejector block 33 may be provided as a block having a cross-sectional area A2 that is greater than a cross-sectional area A1 of the first auxiliary ejector rod 31 .

[0091] In addition, the first auxiliary ejection block 33 includes a first ejection surface 41 and a first inclined portion 43, as shown in FIG. Figure 6C shown.

[0092] The first ejection surface 41 is configured to support a set portion of the molded product 1 .

[0093] The first inclined portion 43 is configured to prevent the first sub-eject block 33 from being caught in a set portion of the molded product 1 .

[0094] The first inclined portion 43 may be formed such that a cross-sectional area on a plane parallel to the first ejection surface 41 gradually decreases at a set inclination angle θ3 in the longitudinal direction of the first sub-ejection rod 31 .

[0095] Here, the set inclination angle θ3 may be, for example, 1° in consideration of thermal expansion of the first sub-eject block 33 when the first sub-eject block 33 is heated to about 200° C. to 300° C.

[0096] Also, the first guide bushing 35 is configured to guide the first sub-ejector rod 31. The first guide bushing 35 is provided in a cylindrical shape and fixed to the movable holder 211. The first guide bushing 35 may be fixed to the movable holder 211 in the moving direction of the ejector plate 10.

[0097] refer to Figure 2 and Figure 3 In an exemplary embodiment of the present disclosure, the second auxiliary ejection unit 50 may be provided at an ejection angle θ2 (reference Figure 8 ) is tilted, and the ejection angle is set based on the arrangement direction of the main ejection pin 20.

[0098] The second sub-ejection unit 50 may be arranged obliquely along an oblique line at an ejection angle θ2 (eg, −7° to +7°) with respect to the arrangement direction of the main ejection pins 20 .

[0099] Figure 7is a perspective view showing a second sub-ejector unit applied to an ejector device for die casting according to an exemplary embodiment of the present disclosure, and Figure 8 is a cross-sectional view illustrating a second sub-ejector unit applied to an ejector device for die casting according to an exemplary embodiment of the present disclosure.

[0100] refer to Figure 7 and Figure 8 as well as Figure 2 and Figure 3 The second sub-ejection unit 50 according to the exemplary embodiment of the present disclosure includes a second sub-ejection rod 51 , a second sub-ejection block 53 , and a second guide bushing 55 .

[0101] The second sub-ejector rod 51 may pass through the through hole 13 formed in the ejector plate 10 and be connected to the engaging module 70 to be described below. The second sub-ejector rod 51 is disposed to be inclined along an oblique line based on the moving direction of the ejector plate 10.

[0102] Here, the through hole 13 may be formed as a hole having a cross-sectional area larger than that of the second auxiliary ejection rod 51. The second auxiliary ejection rod 51 may be coupled to the engagement module 70 by the coupling end portion 51a passing through the through hole 13 so as to be swingable and linearly movable. Fig. 9A As shown, the second auxiliary ejector rod 51 may be provided as a rod having a cross-sectional area A3 that is larger than the cross-sectional area a1 of the main ejector pin 20 .

[0103] The second sub-ejector block 53 is configured to support the molded product 1 in the movable mold 221. The second sub-ejector block 53 is coupled to the free end portion 51b of the second sub-ejector rod 51.

[0104] Here, the second auxiliary ejection block 53 may be coupled to the free end portion 51b of the second auxiliary ejection rod 51 by means of a second positioning pin 59. Fig. 9B As shown, the second auxiliary ejector block 53 may be provided as a block having a cross-sectional area A4 that is greater than a cross-sectional area A3 of the second auxiliary ejector rod 51 .

[0105] In addition, the second auxiliary ejection block 53 includes a second ejection surface 61 and a second inclined portion 63, as shown in FIG. Fig. 9C shown.

[0106] The second ejection surface 61 is configured to support a set portion of the molded product 1 .

[0107] The second inclined portion 63 is configured to prevent the second sub-eject block 53 from being caught in a set portion of the molded product 1 .

[0108] The second inclined portion 63 may be formed such that a cross-sectional area on a plane parallel to the second ejection surface 61 gradually decreases at a set inclination angle θ4 in the longitudinal direction of the second sub-ejection rod 51 .

[0109] The set inclination angle θ4 may be set to, for example, 1° in consideration of thermal expansion of the second sub-eject block 53 when the second sub-eject block 53 is heated to approximately 200° C. to 300° C.

[0110] Here, the second secondary ejector block 53 may be provided on the undercut portion 3 (see Figure 3 and Figure 8 That is, the second secondary ejector block 53 may realize the shape of the undercut portion 3 in the molding section of the movable mold 221. The second secondary ejector block 53 may be disposed to leave the undercut portion 3 through the second ejection surface 61.

[0111] In addition, the second guide bushing 55 is configured to guide the second sub-ejection rod 51. The second guide bushing 55 is provided in a cylindrical shape and is fixed to the movable holder 211 obliquely.

[0112] The second guide bushing 55 may be fixed to the movable holder 211 obliquely at an angle corresponding to an inclination angle of the second sub-ejection rod 51 .

[0113] refer to Figure 3 and Figure 8 In the exemplary embodiment of the present disclosure, the engaging module 70 enables the second sub-ejection rod 51 of the second sub-ejection unit 50 to swing and linearly move.

[0114] That is, since the second sub-ejector rod 51 of the second sub-ejector unit 50 is disposed obliquely, the engaging module 70 can give the second sub-ejector rod 51 the freedom of swinging and linear movement according to the movement displacement of the ejector plate 10 .

[0115] The engaging module 70 is mounted on the ejector plate 10. The engaging module 70 is connected to the coupling end portion 51a of the second sub-ejector rod 51 so that the second sub-ejector rod 51 can swing and linearly move according to the movement of the ejector plate 10.

[0116] Fig.10 is a schematic diagram schematically illustrating a joining module applied to an ejection device for die casting according to an exemplary embodiment of the present disclosure.

[0117] refer to Fig.10 , the joining module 70 according to the exemplary embodiment of the present disclosure includes a fixing block 71 and a sliding member 73 .

[0118] The fixing block 71 is fixed to the ejector plate 10 in a position corresponding to the through hole 13 of the ejector plate 10 .

[0119] The slide member 73 is coupled to the fixed block 71 to be slidable in the linear direction. The coupling end portion 51a of the second sub-ejection rod 51 is coupled to the slide member 73 to be swingable within a set ejection angle range θ2.

[0120] Here, the coupling end portion 51 a of the second sub-ejection rod 51 may be rotatably coupled to the slider 73 by a hinge pin 75 .

[0121] In the following, reference will be made to Figures 1 to 10 The operation of the ejector device 100 for die casting according to the exemplary embodiment of the present disclosure configured as described above is described in detail.

[0122] First, in an exemplary embodiment of the present disclosure, the movable mold 210 is spaced apart from the fixed mold 110 on the base in the front-rear direction.

[0123] The fixed mold 110 includes a fixed holder 111 and a fixed mold 121, and the movable mold 210 includes a movable holder 211 and a movable mold 221. The ejector device 100 for die casting according to an exemplary embodiment of the present disclosure is installed in the movable mold 210 as described above.

[0124] An ejector device 100 for die casting according to an exemplary embodiment of the present disclosure includes an ejector plate 10 , a main ejector pin 20 , a first sub-ejector unit 30 , a second sub-ejector unit 50 , and a joining module 70 .

[0125] The ejector plate 10 moves backward according to the driving of the ejector driving source 11. The main ejector pin 20 is mounted on the ejector plate 10 to penetrate the movable die 221 via the movable holder 211 and is arranged in the moving direction of the movable die 221.

[0126] The first and second sub-ejection units 30 and 50 are installed on the ejection plate 10 to penetrate the movable mold 221 through the movable holder 211 .

[0127] The first sub-ejection unit 30 includes a first sub-ejection rod 31 , a first sub-ejection block 33 , and a first guide bushing 35 . In addition, the second sub-ejection unit 50 includes a second sub-ejection rod 51 , a second sub-ejection block 53 , and a second guide bushing 55 .

[0128] Furthermore, the first sub-ejector rod 31 is disposed at an ejection angle θ1 based on the arrangement direction of the main ejector pin 20 by the first guide bushing 35. The first sub-ejector block 33 is coupled to the first sub-ejector rod 31 and is located in the molding section of the movable mold 221.

[0129] In addition, the second secondary ejector rod 51 is arranged to be inclined at a set ejection angle θ2 based on the arrangement direction of the primary ejector pin 20 through the second guide bushing 55 and the engaging module 70. The second secondary ejector block 53 is coupled to the second secondary ejector rod 51 and is located in the molding section of the movable mold 221.

[0130] Here, the second sub-ejection rod 51 is swingably coupled to the slider 73 of the engagement module 70 through the hinge pin 75. In addition, the slider 73 is coupled to the fixing block 71. In addition, the slider 73 is coupled to the fixing block 71 to be able to slide in a straight direction.

[0131] In this state, the movable mold 210 is moved toward the fixed mold 110 by a mold driving source (not shown) and combined with the fixed mold 110 .

[0132] Then, a cavity may be formed between the molding section of the fixed mold 121 and the molding section of the movable mold 221 , molten metal may be injected into the cavity, and the molten metal is solidified to be molded into a molded product 1 having a set shape.

[0133] At this time, the molded product 1 includes the undercut portion 3 molded in the set portion. The shape of the undercut portion 3 can be realized by the second sub-ejection block 53 of the second sub-ejection unit 50 in the molding section of the movable mold 221. The second sub-ejection block 53 supports the undercut portion 3.

[0134] When the molding of the molded product 1 is completed as described above, the movable mold 210 is separated from the fixed mold 110 by a mold driving source (not shown). At this time, the molded product 1 is located in the movable mold 221 of the movable mold 210.

[0135] Thereafter, the ejector plate 10 moves forward according to the driving of the ejector driving source 11. Accordingly, the main ejector pin 20 moves in the moving direction of the movable mold 221 and pushes the molded product 1 with a set compression force (eg, pressing force).

[0136] In this process, the first sub-ejection rod 31 of the first sub-ejection unit 30 moves in the moving direction of the movable mold 221 through the first guide bushing 35 , and pushes the molded product 1 with a set compression force through the first sub-ejection block 33 .

[0137] Meanwhile, the second sub ejector rod 51 of the second sub ejector unit 50 moves along an oblique line based on the moving direction of the ejector plate 10 through the second guide bushing 55 , and pushes the molded product 1 with a set compression force through the second sub ejector block 53 .

[0138] Here, since the second sub-ejector rod 51 is connected to the engagement module 70 to be swingable and linearly movable, the second sub-ejector rod 51 can move in the oblique direction by the second guide bushing 55. At this time, when the second sub-ejector rod 51 moves in the oblique direction, the second sub-ejector block 53 is disengaged from the undercut portion 3.

[0139] As described above, when the main ejector pin 20, the first sub-ejector unit 30 and the second sub-ejector unit 50 push the molded product 1, the molded product 1 is gripped by a robot gripper (not shown). Then, the molded product 1 can be separated from the first sub-ejector block 33 and the second sub-ejector block 53 by the robot gripper.

[0140] Here, the first inclined portion 43 is provided in the first sub-ejector block 33, and the second inclined portion 63 is provided in the second sub-ejector block 53. Thus, the first sub-ejector block 33 and the second sub-ejector block 53 can be easily separated from the molded product 1 even if thermal expansion occurs.

[0141] Therefore, the ejection device 100 for die casting according to the exemplary embodiment of the present disclosure may eject the molded product 1 through the sequential processes as described above.

[0142] According to the ejector device 100 for die casting according to the exemplary embodiment of the present disclosure described so far, the molded product 1 may be ejected in a plurality of directions within a set ejection angle by the main ejector pin 20 , the first sub-ejector unit 30 , and the second sub-ejector unit 50 .

[0143] Therefore, the ejector device 100 for die casting according to the exemplary embodiment of the present disclosure may disperse the compressive force concentrated on the main ejector pin 20 through the first and second sub-ejector units 30 and 50 .

[0144] Therefore, the ejector device 100 for die casting according to the exemplary embodiment of the present disclosure can prevent damage and breakage of the main ejector pin 20 due to buckling. In addition, the ejector device 100 for die casting according to the exemplary embodiment of the present disclosure can reduce the unavailability of the die casting system 200 and minimize the occurrence of defects in the molded product 1.

[0145] Meanwhile, the ejection device 100 for die casting according to the exemplary embodiment of the present disclosure may eject the molded product 1 in multiple directions so that the shape of the undercut portion 3 may be realized in the molded product 1 .

[0146] Therefore, the ejector device 100 for die casting according to the exemplary embodiment of the present disclosure may improve the degree of freedom in designing the molded product 1 .

[0147] Although exemplary embodiments of the present disclosure have been described above, the present disclosure is not limited thereto, and various modifications may be performed within the scope of the claims, the description of the present disclosure, and the drawings, and such modifications also fall within the scope of the present disclosure.

[0148] The following reference numerals may be used in conjunction with the drawings to describe various features of embodiments of the present disclosure.

[0149] List of reference numerals:

[0150] 1: Molded products

[0151] 3: Undercut part

[0152] 10: Ejector plate

[0153] 11: Ejector drive source

[0154] 13: Through hole

[0155] 20: Main ejector pin

[0156] 30: The first auxiliary ejector unit

[0157] 31: The first ejector rod

[0158] 31a, 51a: Connecting end portion

[0159] 31b, 51b: Free end portion

[0160] 33: The first top block

[0161] 35: First guide bushing

[0162] 37: Tapping thread

[0163] 39: First positioning pin

[0164] 41: First ejection surface

[0165] 43: First inclined section

[0166] 50: Second auxiliary ejector unit

[0167] 51: Second ejector rod

[0168] 53: Second deputy top block

[0169] 55: Second guide bushing

[0170] 59: Second positioning pin

[0171] 61: Second ejection surface

[0172] 63: Second inclined section

[0173] 70: Joint module

[0174] 71: Fixed block

[0175] 73: Sliding parts

[0176] 75: Hinge pin

[0177] 100: Ejector device for die casting

[0178] 110: Fixed mold

[0179] 111: Fixed retainer

[0180] 121: Fixed mold

[0181] 200: Die casting system

[0182] 210: Removable mold

[0183] 211: Removable retainer

[0184] 221: Movable mold

Claims

1. An ejector device for die casting, the ejector device is used to eject a molded product molded by a fixed mold and a movable mold, the ejector device comprising: an ejector plate, disposed on a movable holder on which the movable die is mounted, so as to be movable forward and backward in a moving direction of the movable die; a plurality of main ejector pins, arranged on the ejector plate along the moving direction of the movable mold so as to penetrate the movable mold; as well as A plurality of sub-ejection units are provided on the ejection plate to penetrate the movable mold, and the plurality of sub-ejection units are provided to eject the molded product in a plurality of directions within a range of ejection angles set based on an arrangement direction of the main ejection pins.

2. The ejection device according to claim 1, wherein: At least one first sub-ejection unit among the plurality of sub-ejection units is arranged at a first ejection angle based on an arrangement direction of the main ejection pins.

3. The ejection device according to claim 2, wherein: At least one second sub-ejection unit among the plurality of sub-ejection units is disposed at a second ejection angle, and the second ejection angle is inclined relative to an arrangement direction of the main ejection pins.

4. An ejector device for die casting, the ejector device being configured to eject a molded product molded by a fixed mold and a movable mold, the ejector device comprising: an ejector plate, disposed on a movable holder on which the movable die is mounted, so as to be movable forward and backward in a moving direction of the movable die; a plurality of main ejector pins, arranged on the ejector plate along the moving direction of the movable mold so as to penetrate the movable mold; at least one first sub-ejection unit, which is disposed on the ejection plate to penetrate the movable mold, and the at least one first sub-ejection unit is disposed at a first ejection angle based on an arrangement direction of the main ejection pins; at least one second sub-ejection unit, which is disposed on the ejection plate to penetrate the movable mold, and the at least one second sub-ejection unit is disposed to be inclined at a set second ejection angle based on an arrangement direction of the main ejection pins; as well as A coupling module is disposed on the ejector plate and connected to the at least one second sub-ejector unit so that the at least one second sub-ejector unit can swing and linearly move according to the movement of the ejector plate.

5. The ejection device according to claim 4, wherein: The at least one first auxiliary ejection unit comprises: a first secondary ejector rod connected to the ejector plate by tapping and arranged to be parallel to the main ejector pin in the moving direction of the ejector plate; and A first secondary ejection block is connected to the first secondary ejection rod.

6. The ejection device according to claim 5, wherein: The cross-sectional area of ​​the first secondary ejector rod is greater than the cross-sectional area of ​​the plurality of main ejector pins; and A cross-sectional area of ​​the first auxiliary ejection block is greater than a cross-sectional area of ​​the first auxiliary ejection rod.

7. The ejection device according to claim 5, wherein: The first auxiliary ejector rod is coupled to the ejector plate by tapping through a coupling end portion having a tapping thread; and The first secondary ejector block is coupled to a free end portion of the first secondary ejector rod by a first locating pin.

8. The ejection device according to claim 5, wherein: The first secondary ejection block comprises: a first ejection surface supporting the molded product; and A first inclined portion, wherein a cross-sectional area of ​​the first inclined portion on a plane parallel to the first ejection surface gradually decreases at a set inclination angle along a longitudinal direction of the first auxiliary ejection rod.

9. The ejection device according to claim 5, wherein: The at least one first sub-ejection unit further includes a first guide bushing fixed to the movable holder to guide the first sub-ejection rod.

10. The ejection device according to claim 4, wherein: The at least one second auxiliary ejection unit comprises: a second auxiliary ejector rod connected to the engagement module via a through hole provided in the ejector plate, and the second auxiliary ejector rod is arranged to be inclined relative to a moving direction of the ejector plate; and The second auxiliary ejection block is connected to the second auxiliary ejection rod.

11. The ejection device according to claim 10, wherein: The cross-sectional area of ​​the second secondary ejector rod is greater than the cross-sectional area of ​​the plurality of main ejector pins; and A cross-sectional area of ​​the second auxiliary ejector block is greater than a cross-sectional area of ​​the second auxiliary ejector rod.

12. The ejection device according to claim 10, wherein: The second auxiliary ejector rod is coupled to the engagement module through a coupling end portion so as to be linearly movable and swingable; and The second secondary ejector block is coupled to a free end portion of the second secondary ejector rod by a second locating pin.

13. The ejection device according to claim 10, wherein: The second secondary ejector block comprises: a second ejection surface supporting the molded product; and A second inclined portion, wherein a cross-sectional area of ​​the second inclined portion on a plane parallel to the second ejection surface gradually decreases at a set inclination angle along a longitudinal direction of the second auxiliary ejection rod.

14. The ejection device according to claim 13, wherein: The second sub-eject block is disposed on an undercut portion molded in the molded product, and the second sub-eject block is disposed to leave the undercut portion through the second ejection surface.

15. The ejection device according to claim 10, wherein: The at least one second sub-ejection unit further includes a second guide bushing obliquely fixed to the movable holder to guide the second sub-ejection rod.

16. The ejection device according to claim 10, wherein: The joining module comprises: a fixing block fixed to the ejection plate at a position corresponding to the through hole; and A sliding member is connected to the fixed block so as to be able to slide in a straight line direction and is connected so as to allow the second auxiliary ejection rod to swing within a set ejection angle range.

17. The ejection device according to claim 16, wherein: The second auxiliary ejector rod is swingably coupled to the slide member via a hinge pin.

18. A die casting system comprising: A fixed mold is arranged on a base, and the fixed mold comprises a fixed holder and a fixed mold installed on the fixed holder; a movable mold disposed on the base so as to be movable in a front-rear direction, the movable mold comprising a movable holder and a movable mold mounted on the movable holder; an ejector plate, disposed on the movable holder so as to be movable forward and backward in the moving direction of the movable mold; a plurality of main ejector pins disposed on the ejector plate along a moving direction of the movable mold so as to penetrate the movable mold through the movable retainer; as well as A plurality of sub-ejection units are provided on the ejection plate to penetrate the movable mold via the movable holder, and the plurality of sub-ejection units are provided to eject the molded product in a plurality of directions within a range of ejection angles set based on an arrangement direction of the main ejection pins.

19. The die casting system according to claim 18, wherein: At least one first sub-ejection unit among the plurality of sub-ejection units is arranged at a first ejection angle based on an arrangement direction of the main ejection pins.

20. The die casting system of claim 19, wherein: At least one second sub-ejection unit among the plurality of sub-ejection units is disposed at a second ejection angle inclined with respect to an arrangement direction of the main ejection pins.

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