Laser processing system, control method and laser

Abstract

The invention discloses a laser processing system, a control method and a laser, relates to the technical field of laser processing, and discloses a laser processing system which comprises an acquisition module, a control module and a laser emission module. The acquisition module is connected with the control module; the control module is connected with the laser emission module. The acquisition module is used for detecting working data of laser processing and transmitting the working data to the control module, and the working data comprises the temperature of a laser processing point; the control module is used for outputting a corresponding adjustment instruction to the laser emission module based on the working data after receiving the working data; and the laser emission module is used for generating a laser beam corresponding to the adjustment instruction when receiving the adjustment instruction. Through real-time online measurement of the temperature of a laser processing point, the system can guarantee the processing quality through high-precision temperature control, and the system stability is improved.

Description

Technical Field

[0001] The present application relates to the field of laser processing technology, and in particular to a laser processing system, a control method and a laser. Background Art

[0002] Laser processing technology is a processing technology that uses the characteristics of the interaction between laser beams and materials to perform cutting, welding, surface treatment, drilling and micro-processing on materials. After being focused, the laser beam can produce extremely high energy density in a very small area, causing the material to melt, vaporize or react chemically quickly, thereby achieving precise processing of the material.

[0003] Since laser processing technology relies on properties such as power and cutting path, the low precision problem that is common in traditional laser processing technology can easily lead to damage to the material to be processed or damage to the processing equipment. Summary of the invention

[0004] The main purpose of this application is to provide a laser processing system, a control method and a laser, aiming to solve the technical problems of low parameter accuracy and system instability in traditional laser processing technology.

[0005] To achieve the above-mentioned purpose, the present application proposes a laser processing system, which includes: an acquisition module, a control module and a laser emission module; the acquisition module is connected to the control module; the control module is connected to the laser emission module; the acquisition module is used to detect the working data of the laser processing and transmit the working data to the control module, the working data including the temperature of the laser processing point; the control module is used to output corresponding adjustment instructions to the laser emission module based on the working data after receiving the working data; the laser emission module is used to generate a laser beam corresponding to the adjustment instruction when receiving the adjustment instruction.

[0006] In one embodiment, the laser processing system also includes: a trajectory generation module; the acquisition module is also connected to the trajectory generation module; the trajectory generation module is connected to the control module; the working data also includes processing area information and position information of the material to be processed; the acquisition module is also used to transmit the processing data to the trajectory generation module; the trajectory generation module is also used to generate a trajectory to be processed based on the processing data, and transmit the trajectory to be processed to the control module; the control module controls the movement of the laser emission module based on the trajectory to be processed.

[0007] In one embodiment, the laser processing system also includes: a trajectory correction module; the trajectory generation module is also connected to the trajectory correction module; the trajectory correction module is connected to the control module; the trajectory generation module is also used to transmit the trajectory to be processed to the trajectory correction module; the trajectory correction module is used to simulate laser processing based on the trajectory to be processed, correct the trajectory to be processed based on the result of the simulated laser processing, and transmit the corrected trajectory to be processed to the control module; the control module is also used to control the movement of the laser emission module based on the corrected trajectory to be processed.

[0008] In one embodiment, the laser processing system also includes: a communication module and an interaction module; the communication module is connected to the control module and the interaction module respectively; the control module is also used to transmit the received working data and the trajectory to be processed to the interaction module through the communication module; the interaction module is used to generate interaction instructions based on user behavior, and transmit them to the control module to control the laser emission module.

[0009] In addition, to achieve the above objectives, the present application also proposes a laser, which uses the laser processing system as described above.

[0010] In addition, to achieve the above-mentioned purpose, the present application also proposes a laser processing control method, which uses the laser as described above, and the method includes: detecting the temperature of the laser processing point; determining whether the temperature of the laser processing point is within a preset temperature range; when the temperature of the laser processing point is outside the preset temperature range, adjusting the laser beam generated by the laser emission module so that the temperature of the laser processing point falls within the preset temperature range.

[0011] In one embodiment, before the step of adjusting the laser beam generated by the laser emitting module so that the temperature of the laser processing point falls within the preset temperature range when the temperature of the laser processing point is outside the preset temperature range, the step also includes: collecting processing area information and position information of the material to be processed; generating a trajectory to be processed based on the processing area information and the position information of the material to be processed; and controlling the movement of the laser emitting module based on the trajectory to be processed.

[0012] In one embodiment, the step of generating a trajectory to be processed based on the processing area information and the position information of the material to be processed includes: generating a simulated processing trajectory based on the processing area information and the position information of the material to be processed; performing simulated processing based on the simulated processing trajectory and obtaining simulation results; correcting the simulated processing trajectory based on the simulation results, and identifying the corrected simulated processing trajectory as the trajectory to be processed.

[0013] In addition, to achieve the above-mentioned purpose, the present application also proposes a storage medium, which is a computer-readable storage medium, and a computer program is stored on the storage medium. When the computer program is executed by a processor, the steps of the laser processing control method described above are implemented.

[0014] In addition, to achieve the above-mentioned purpose, the present application also provides a computer program product, which includes a computer program, and when the computer program is executed by a processor, the steps of the laser processing control method described above are implemented.

[0015] One or more technical solutions proposed in the present application have at least the following technical effects: by measuring the temperature of the laser processing point in real time online, it is determined whether the temperature of the laser processing point has reached the required preset target. If it has not reached the target, the laser beam power is adjusted to achieve the preset target. At this time, the system can ensure the processing quality through high-precision temperature control and improve the system stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and, together with the description, serve to explain the principles of the present application.

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0018] Figure 1 A structural block diagram of the first embodiment of the laser processing system of the present application;

[0019] Figure 2 A structural block diagram of the second embodiment of the laser processing system of the present application;

[0020] Figure 3 A flowchart of the third embodiment of the laser processing control method of the present application is provided.

[0021] The purpose, features and advantages of this application will be further described in conjunction with the embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0022] It should be understood that the specific embodiments described herein are only used to explain the technical solutions of the present application and are not used to limit the present application.

[0023] In order to better understand the technical solution of the present application, a detailed description will be given below in conjunction with the accompanying drawings and specific implementation methods.

[0024] The effect of laser processing technology is highly dependent on the precise control of laser power and the optimized design of cutting paths. In the current technological environment, if these key factors fail to reach the ideal state, especially when faced with the challenge of insufficient precision, a series of problems may arise, such as damage to the material to be processed due to over-processing, or damage to the processing equipment due to improper load, thus affecting the overall processing quality and efficiency.

[0025] Therefore, in order to solve the technical problems of low parameter accuracy and unstable system in traditional laser processing technology, this application proposes a laser processing system, please refer to Figure 1 , Figure 1 This is a structural block diagram of the first embodiment of the laser processing system of the present application.

[0026] In this embodiment, the laser processing system includes: a collection module 10, a control module 20 and a laser emission module 30. The collection module 10 is connected to the control module 20; and the control module 20 is connected to the laser emission module 30.

[0027] It should be noted that the acquisition module 10 plays a vital role in the laser processing system. It is specially designed to monitor and record key working data in the laser processing process in real time and accurately, and transmit the working data to the control module 20 to ensure processing quality and safety.

[0028] Specifically, the working data includes the temperature of the laser processing point. For the key parameter of the temperature of the laser processing point, the acquisition module 10 usually uses an integrated high-precision temperature sensor to continuously monitor the temperature of the processing area. These temperature sensors are usually placed near the laser emission module 30 or directly embedded in the processing path so that they can directly sense the temperature changes caused by the interaction between the laser and the material. These sensors use thermal elements such as thermocouples, thermistors or infrared detectors, which can respond quickly and accurately convert temperature information into electrical signals.

[0029] It can be understood that the acquisition module 10 is not only responsible for receiving the electrical signals from the temperature sensor, but also has built-in signal processing circuits and algorithms for filtering, amplifying, analog-to-digital conversion, etc. of these original signals to eliminate noise interference and improve data accuracy and reliability.

[0030] It is understandable that the processed working data, including the real-time temperature of the laser processing point and its related parameters, will be safely and stably transmitted to the control module 20 by the acquisition module through a high-speed communication interface (such as RS-485, Ethernet, USB or wireless Wi-Fi / Bluetooth, etc.). This transmission process follows strict data protocols and encryption measures to ensure the integrity and security of the data.

[0031] It is understandable that the control module 20, as a processor of the laser processing system, will immediately analyze and judge after receiving these data. The temperature information of the laser processing point in these data is the key basis for the control module 20 to evaluate the current processing status, predict future trends, and make corresponding adjustments. Therefore, after receiving the working data, the control module 20 is used to output corresponding adjustment instructions to the laser emission module 30 based on the working data.

[0032] It should be noted that the adjustment instructions are usually based on preset processing parameters and temperature thresholds, dynamically adjusting parameters such as laser power, processing speed, focal length, etc. as targets to control the properties of the laser beam.

[0033] It can be understood that when the control module 20 issues adjustment instructions for the current processing state after a series of complex data processing and analysis, the laser emission module 30 quickly enters the standby state and prepares to execute these instructions. The laser emission module 30 is used to generate a laser beam corresponding to the adjustment instruction when receiving the adjustment instruction.

[0034] It should be noted that the entire adjustment process is a closed-loop control system, and the control module 20 continuously monitors the working data from the acquisition module and makes dynamic adjustments based on real-time feedback. This flexible and intelligent control method enables the laser processing system to adaptively respond to various processing conditions and changes, ensure the stability and consistency of the processing process, and ultimately achieve the purpose of improving processing quality, efficiency and safety.

[0035] In this embodiment, the temperature of the laser processing point is measured online in real time to determine whether the temperature of the laser processing point reaches the desired preset target. If it does not reach the target, the laser beam power is adjusted to achieve the preset target. At this time, the system can ensure the processing quality through high-precision temperature control and improve system stability.

[0036] Further, based on the above embodiments, the present application proposes a laser processing system, please refer to Figure 2 , Figure 2 This is a structural block diagram of the second embodiment of the laser processing system of this application.

[0037] In this embodiment, the laser processing system further includes: a trajectory generation module 40 . The acquisition module 10 is also connected to the trajectory generation module 40 ; and the trajectory generation module 40 is connected to the control module 20 .

[0038] It should be noted that the acquisition module 10 is not only responsible for real-time detection and transmission of key working data of laser processing to the control module 20, but also bears the task of transmitting comprehensive information during the processing to other important modules. In this embodiment, the acquisition module 10 is also used to transmit the processing data to the trajectory generation module 40, wherein the processing data particularly focuses on the processing area information and the location information of the material to be processed, and is collected and transmitted to the trajectory generation module 40.

[0039] It should be noted that the processing area information includes the size, shape, boundary conditions, and possible obstacles or sensitive areas of the processing area. The collection of processing area information is crucial to ensure the accuracy and safety of the processing process. This information is usually obtained by high-precision sensors (such as laser rangefinders, infrared cameras, or machine vision systems) and preprocessed and integrated by the acquisition module 10.

[0040] It should be noted that the position information of the material to be processed involves the precise position, posture and possible slight offset of the material on the processing platform or fixture, which is also indispensable data in the processing process. In order to accurately capture this information, the acquisition module may usually integrate a variety of positioning technologies, such as mechanical encoders, photoelectric switches, RFID tag readers or high-precision GPS (in specific application scenarios). By real-time monitoring and calibration of the material position, the acquisition module 10 ensures that the trajectory generation module 40 can generate a processing path that is highly matched with the actual position of the material, thereby improving processing accuracy and efficiency.

[0041] It is understandable that the trajectory generation module 40 can generate a trajectory to be processed by an algorithm based on the processing data, and transmit the trajectory to be processed to the control module 20. The control module 20 can control the movement of the laser emission module 30 based on the trajectory to be processed.

[0042] It should be noted that the algorithm used by the trajectory generation module 40 may include objective functions such as path shortesting, energy efficiency maximization, and processing time minimization, aiming to generate a processing trajectory that meets the processing requirements and has excellent performance. Subsequently, the control module 20 will analyze these data and accurately control the actuators such as the laser emission module and the mechanical motion system according to the trajectory information to realize the automatic execution of the processing process.

[0043] In a feasible implementation manner, the laser processing system further includes: a trajectory correction module 50. The trajectory generation module 40 is further connected to the trajectory correction module 50; and the trajectory correction module 50 is connected to the control module.

[0044] It should be noted that the purpose of introducing the trajectory correction module into the laser processing system is to further ensure the processing accuracy and efficiency. Its function is that the trajectory generation module 40 outputs the trajectory to be processed to the trajectory correction module 50, and further optimizes and adjusts the initially generated trajectory to be processed. This module is used to simulate laser processing based on the trajectory to be processed, correct the trajectory to be processed based on the result of the simulated laser processing, and transmit the corrected trajectory to be processed to the control module 20.

[0045] It can be understood that by simulating the laser processing process, the feasibility, efficiency and possible challenges of the trajectory are pre-evaluated, and necessary corrections are made to the original trajectory accordingly to ensure that the final executed processing trajectory can perfectly match the processing requirements.

[0046] It should be noted that the simulated laser processing process usually uses simulation technology to build a virtual processing scene based on multi-dimensional information such as the processing trajectory, material properties, material position information, laser parameters, and processing area information. In this scene, the laser beam simulates the processing according to the preset trajectory, and the system calculates and feeds back key indicators such as temperature distribution, stress change, and material removal rate during the processing in real time.

[0047] It is understandable that after the simulation processing is completed, the trajectory correction module 50 will conduct an in-depth analysis of the simulation results, including the key indicators mentioned above, to identify possible processing defects, efficiency bottlenecks or safety risks. In response to these problems, the trajectory correction module will use intelligent algorithms and preset models to make local or global corrections to the original trajectory. The corrections may include adjusting the direction of the trajectory, optimizing the smoothness of the trajectory, adjusting parameters such as laser power or scanning speed, to ensure that the corrected trajectory can more effectively achieve the processing goals while reducing the uncertainty and risks in the processing process.

[0048] It is understandable that after completing the trajectory correction, the trajectory correction module 50 transmits the corrected trajectory to be processed to the control module in a standard format or a specific protocol. The control module 20 can control the movement of the laser emission module 30 based on the corrected trajectory to be processed.

[0049] In addition, the laser processing system further includes: a communication module 60 and an interaction module 70. The communication module 60 is connected to the control module 20 and the interaction module 70 respectively.

[0050] It should be noted that the control module 20 is also used to transmit the received working data and the trajectory to be processed to the interaction module 70 through the communication module 60; the interaction module 70 is used to generate interaction instructions based on user behavior and transmit them to the control module 20 to control the laser emission module.

[0051] It should be noted that the purpose of transmitting the working data and the trajectory to be processed to the interactive module 70 is to allow the user to fully understand the current processing status and trajectory information through the interactive module 70, and also provide rich data support for subsequent user interaction. The interactive module 70 uses this data to intuitively display the processing progress, predict the remaining time, analyze the processing quality, and even visualize the simulation of the processing effect to help users better understand the processing process.

[0052] It is understandable that the core function of the interactive module 70, as a bridge between the user and the system, is to generate corresponding interactive instructions according to the user's behavior. These instructions may come from commands input by the user through input devices such as a touch screen, keyboard, mouse or voice recognition, or they may be biometric signals such as user gestures and eyes automatically recognized by the system. The interactive module 70 can intelligently parse these instructions and convert them into a format that the control module 20 can understand, thereby realizing precise control of actuators such as the laser emission module 30.

[0053] In a feasible implementation, when the interactive module 70 receives the user's interactive instructions, it will immediately transmit these instructions back to the control module 20. After receiving the instructions, the control module 20 will make corresponding logical judgments and decisions, and then drive the laser emission module to move, adjust laser parameters or perform other processing actions according to the user's wishes. This process realizes seamless connection and instant feedback between the user and the system, greatly improving the flexibility and operability of the laser processing system.

[0054] In this embodiment, by real-time monitoring of working data, assisting the trajectory generation module and the trajectory correction module to finely characterize the processing trajectory, and accurately controlling the laser emission module, the system can ensure the high accuracy of the processing process and reduce errors. It improves processing efficiency and shortens the processing cycle. In addition, the simulation of the laser processing process, real-time monitoring of the processing status, and integrated safety protection measures effectively reduce the safety risks in the processing process. The introduction of the interactive module and the communication module enables users to intuitively understand the processing status and control the processing process through a simple interactive method, which improves the convenience of operation and user experience.

[0055] In addition, the present application also provides a laser, which uses the laser processing system in the above embodiment to solve the technical problems of low parameter accuracy and unstable system in traditional laser processing technology. Compared with the traditional laser processing system, the beneficial effects of the laser provided by the present application are the same as the beneficial effects of the laser processing system provided by the above embodiment, and the other technical features of the laser are the same as the features disclosed in the above embodiment method, which will not be repeated here.

[0056] Based on the above embodiments, the present application provides a laser processing control method, referring to Figure 3 , Figure 3 A flowchart of the third embodiment of the laser processing control method of the present application is provided.

[0057] In this embodiment, the laser processing control method includes steps S10 to S30:

[0058] Step S10, detecting the temperature of the laser processing point.

[0059] Step S20, determining whether the temperature of the laser processing point is within a preset temperature range.

[0060] It should be noted that the temperature of the laser processing point is a parameter that needs to be focused on during the laser processing process, so it is necessary to detect the temperature of the laser processing point. The temperature of the processing area can be continuously monitored through a temperature sensor. These temperature sensors are usually placed near the laser emission module or directly embedded in the processing path so that they can directly sense the temperature changes caused by the interaction between the laser and the material.

[0061] It can be understood that after obtaining accurate temperature data of the laser processing point, whether the laser beam needs to be adjusted is determined by judging whether it is in the preset temperature range. The preset temperature range is set according to the characteristics of the processing material, the performance of the laser and the required processing effect. Generally speaking, different processing materials have different corresponding ranges.

[0062] Step S30, when the temperature of the laser processing point is outside the preset temperature range, adjusting the laser beam generated by the laser emission module to make the temperature of the laser processing point fall within the preset temperature range.

[0063] It can be understood that when the temperature of the laser processing point is outside the preset temperature range, it means that the laser beam is not sufficient to cut the material or has damaged the material excessively. At this time, it is necessary to adjust the laser beam generated by the laser emission module so that the temperature of the laser processing point falls within the preset temperature range to match the working requirements.

[0064] Furthermore, before controlling the temperature of the laser processing point in real time, it is necessary to confirm the trajectory of the laser processing to control the laser processing. Therefore, in a feasible implementation, before step S10, steps S01 to S03 are also included:

[0065] Step S01, collecting processing area information and location information of materials to be processed.

[0066] It can be explained that the system needs to perform information collection tasks to obtain processing area information such as the specific size, shape, boundary conditions and possible obstacle information of the processing area, and at the same time determine the precise position and posture of the material to be processed on the processing platform or fixture, and the position information of the material waiting to be processed.

[0067] Step S02, generating a trajectory to be processed based on the processing area information and the position information of the material to be processed.

[0068] It can be understood that the system uses algorithms and models to integrate the processing area information and the position information of the material to be processed to generate an efficient processing trajectory to maximize the processing efficiency while ensuring stability and accuracy during the processing.

[0069] Step S03, controlling the movement of the laser emitting module based on the trajectory to be processed.

[0070] It is understandable that the system accurately controls the laser emission module and its supporting mechanical motion system to move along the specified path according to the generated trajectory to be processed. During the movement, the laser emission module will perform laser processing according to the preset parameters, execute steps S10 to S30, and control the temperature of the laser processing point in real time to achieve accurate processing of the material to be processed.

[0071] Furthermore, in a feasible implementation, step S02 includes: generating a simulated processing trajectory based on processing area information and position information of the material to be processed; performing simulated processing based on the simulated processing trajectory and obtaining simulation results; correcting the simulated processing trajectory based on the simulation results, and identifying the corrected simulated processing trajectory as the trajectory to be processed.

[0072] It is understandable that possible processing defects, efficiency bottlenecks or safety risks can be identified through simulation. Intelligent algorithms and preset models are used to correct the original trajectory locally or globally for these problems. The correction may include adjusting the direction of the trajectory, optimizing the smoothness of the trajectory, adjusting parameters such as laser power or scanning speed, to ensure that the corrected trajectory can achieve the processing goals more effectively while reducing the uncertainty and risk in the processing process.

[0073] In this embodiment, a laser processing control method is provided, which uses the laser in the above embodiment to solve the technical problems of low parameter accuracy and unstable system in traditional laser processing technology. Compared with the traditional laser processing system, the beneficial effects of the laser processing control method provided by this application are the same as the beneficial effects of the laser provided by the above embodiment, and other technical features in the laser processing control method are the same as the features disclosed in the above embodiment method, which will not be repeated here.

[0074] It should be noted that the above examples are only used to understand the present application and do not constitute a limitation on the laser processing control method of the present application. More simple transformations based on this technical concept are all within the scope of protection of the present application.

[0075] The present application provides a computer-readable storage medium having computer-readable program instructions (ie, computer programs) stored thereon, and the computer-readable program instructions are used to execute the laser processing control method in the above-mentioned embodiment.

[0076] The computer-readable storage medium provided in the present application may be, for example, a USB flash drive, but is not limited to electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems, systems or devices, or any combination of the above. More specific examples of computer-readable storage media may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In this embodiment, the computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in combination with an instruction execution system, system or device. The program code contained on the computer-readable storage medium may be transmitted using any appropriate medium, including but not limited to: wires, optical cables, RF (Radio Frequency), etc., or any suitable combination of the above.

[0077] Computer program code for performing the operations of the present application may be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, C++, and conventional procedural programming languages ​​such as "C" or similar programming languages. The program code may be executed entirely on the user's computer, partially on the user's computer, as a separate software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer through any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0078] The flow chart and block diagram in the accompanying drawings illustrate the possible architecture, function and operation of the system, method and computer program product according to various embodiments of the present application. In this regard, each square box in the flow chart or block diagram can represent a module, a program segment or a part of a code, and the module, the program segment or a part of the code contains one or more executable instructions for realizing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the square box can also occur in a sequence different from that marked in the accompanying drawings. For example, two square boxes represented in succession can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each square box in the block diagram and / or flow chart, and the combination of the square boxes in the block diagram and / or flow chart can be implemented with a dedicated hardware-based system that performs a specified function or operation, or can be implemented with a combination of dedicated hardware and computer instructions.

[0079] The modules involved in the embodiments described in this application may be implemented by software or hardware, wherein the name of the module does not constitute a limitation on the unit itself in some cases.

[0080] The readable storage medium provided by the present application is a computer-readable storage medium, which stores computer-readable program instructions (i.e., computer programs) for executing the above-mentioned laser processing control method, and can solve the technical problems of low precision of parameters and unstable system in traditional laser processing technology. Compared with the traditional laser processing system, the beneficial effects of the computer-readable storage medium provided by the present application are the same as the beneficial effects of the laser processing control method provided by the above-mentioned embodiment, and will not be repeated here.

[0081] The present application also provides a computer program product, including a computer program, which implements the steps of the laser processing control method as described above when executed by a processor.

[0082] The computer program product provided by this application can solve the technical problems of low parameter accuracy and unstable system in traditional laser processing technology. Compared with the traditional laser processing system, the beneficial effects of the computer program product provided by this application are the same as the beneficial effects of the laser processing control method provided by the above embodiment, which will not be repeated here.

[0083] The above descriptions are only some embodiments of the present application, and are not intended to limit the patent scope of the present application. All equivalent structural changes made using the contents of the present application specification and drawings under the technical concept of the present application, or direct / indirect applications in other related technical fields are included in the patent protection scope of the present application.

Claims

1. A laser processing system, characterized in that: The laser processing system comprises: an acquisition module, a control module, a trajectory generation module, a trajectory correction module and a laser emission module; The acquisition module is connected to the control module and the acquisition module; The control module is connected to the laser emission module; The trajectory generation module is connected to the control module and the trajectory correction module respectively; The trajectory correction module is connected to the control module; The acquisition module is used to detect the working data of the laser processing and transmit the working data to the control module, wherein the working data includes the temperature of the laser processing point; The acquisition module is further used to transmit the processing data to the trajectory generation module, and the working data also includes processing area information and location information of the material to be processed; The processing area information includes the size, shape, boundary conditions and obstacles of the processing area; The position information of the material to be processed includes the position, posture and offset deviation of the material to be processed in the processing area; The trajectory generation module is further used to generate a trajectory to be processed based on the processing data, and transmit the trajectory to be processed to the control module; The trajectory generation module is further used to transmit the trajectory to be processed to the trajectory correction module; The trajectory correction module is used to simulate laser processing based on the trajectory to be processed, correct the trajectory to be processed based on the result of the simulated laser processing, and transmit the corrected trajectory to be processed to the control module; The control module is further used to control the movement of the laser emission module based on the corrected trajectory to be processed; The control module is configured to output corresponding adjustment instructions to the laser emission module based on the working data after receiving the working data; The laser emission module is used to generate a laser beam corresponding to the adjustment instruction when receiving the adjustment instruction.

2. The laser processing system according to claim 1, characterized in that: The laser processing system further includes: a communication module and an interaction module; The communication module is connected to the control module and the interaction module respectively; The control module is further used to transmit the received working data and the to-be-processed trajectory to the interaction module through the communication module; The interaction module is used to generate interaction instructions based on user behavior and transmit them to the control module to control the laser emission module.

3. A laser, characterized in that: The laser application is the laser processing system according to any one of claims 1 to 2.

4. A laser processing control method, characterized in that: The method uses the laser as claimed in claim 3, and the method comprises: Detect the temperature of the laser processing point; Determine whether the temperature of the laser processing point is within a preset temperature range; When the temperature of the laser processing point is outside the preset temperature range, the laser beam generated by the laser emitting module is adjusted to make the temperature of the laser processing point fall within the preset temperature range.

5. The method according to claim 4, characterized in that Before the step of adjusting the laser beam generated by the laser emission module to make the temperature of the laser processing point fall within the preset temperature range when the temperature of the laser processing point is outside the preset temperature range, the method further includes: Collect processing area information and location information of materials to be processed; Generate a trajectory to be processed based on the processing area information and the position information of the material to be processed; The laser emitting module is controlled to move based on the trajectory to be processed.

6. The method according to claim 5, characterized in that The step of generating a trajectory to be processed based on the processing area information and the position information of the material to be processed comprises: Generate a simulated processing trajectory based on the processing area information and the position information of the material to be processed; Performing simulated processing based on the simulated processing trajectory and obtaining simulation results; The simulated processing trajectory is corrected based on the simulation result, and the corrected simulated processing trajectory is identified as the trajectory to be processed.

7. A storage medium, characterized in that: The storage medium is a computer-readable storage medium, and a computer program is stored on the storage medium. When the computer program is executed by a processor, the steps of the laser processing control method according to any one of claims 4 to 6 are implemented.

8. A computer program product, characterized in that The computer program product comprises a computer program, and when the computer program is executed by a processor, the steps of the laser processing control method according to any one of claims 4 to 6 are implemented.

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