LRM module mainboard dismounting device and control method thereof

Abstract

The invention relates to the technical field of computers, and particularly provides an LRM module mainboard dismounting and mounting device and a control method thereof.The LRM module mainboard dismounting and mounting device comprises a substrate, a mainboard dismounting and mounting assembly and a mainboard, the mainboard is installed on the upper portion of the substrate, and the mainboard dismounting and mounting assembly is connected to the upper portion of the mainboard. Compared with the prior art, the disassembly and assembly efficiency of the LRM module mainboard can be improved, the disassembly and assembly procedure is simplified, and the use reliability of the mainboard is guaranteed.

Description

Technical Field

[0001] The invention relates to the technical field of computers, and in particular provides an LRM module mainboard disassembly and assembly device and a control method thereof. Background Art

[0002] Due to the special nature of the fully enclosed LRM server modules, during the disassembly and assembly of the LRM module motherboard, the gap between the motherboard and the mounting base is small, the disassembly and assembly space is tight, and it is even impossible to locate each hole of the motherboard by hand. This makes it easy for inaccurate positioning to occur during the assembly process, and components to be damaged during the process of moving the motherboard.

[0003] During the process of disassembling the motherboard, due to the limited operating space and the influence of the adhesion of thermal grease of heat-generating chips such as the CPU, it is easy to make the motherboard difficult to disassemble and cause the motherboard to be damaged by force, which reduces the reliability and disassembly and assembly efficiency of the product and increases the manpower and material costs. Summary of the invention

[0004] The present invention aims at solving the above-mentioned deficiencies of the prior art and provides a highly practical LRM module mainboard disassembly and assembly device.

[0005] A further technical task of the present invention is to provide a reasonably designed, safe and applicable LRM module mainboard disassembly and assembly control method.

[0006] The technical solution adopted by the present invention to solve its technical problem is:

[0007] A LRM module mainboard disassembly and assembly device comprises a base plate, a mainboard disassembly and assembly assembly and a mainboard, wherein the mainboard is mounted on the upper part of the base plate, and the mainboard disassembly and assembly assembly is connected to the upper part of the mainboard.

[0008] Furthermore, the mainboard disassembly assembly comprises a housing frame, a case cover is provided on the upper part of the housing frame, a handle is provided on the case cover, a fixing assembly is installed on the lower part, a control panel is provided on one side of the housing frame, and control buttons are installed on one side of the control panel;

[0009] A Type-C charging and data transmission interface is provided on one side adjacent to the control panel.

[0010] Furthermore, the fixing components are installed at the four corners of the bottom of the outer frame of the casing, and each fixing component includes a universal connecting rod component, a suction cup, a distance sensor and a telescopic pressure component. One side of the universal connecting rod component is fixed to the bottom of the outer frame of the casing, and the other side is hinged with a telescopic pressure component. A suction cup is provided at the bottom of the hinge, and a distance sensor is provided on the telescopic pressure component.

[0011] Furthermore, the substrate is provided with a plurality of substrate-mainboard fixing holes, a substrate heat dissipation chip fitting boss is provided on the upper portion of the substrate, the mainboard is fixed to the substrate through the substrate-mainboard fixing holes, and the substrate heat dissipation chip fitting boss is fitted to the mainboard.

[0012] Furthermore, the telescopic pressure member is disassembled by telescoping and cooperating with the fixing hole of the substrate mainboard, and a pressure sensor is provided at the bottom of the telescopic pressure member, and the pressure sensor feeds back the pressure value to control the pressurization of the telescopic pressure member.

[0013] Furthermore, an electric motor is provided inside the outer frame of the casing, and the electric motor includes a transmission bearing, a differential motor and a control mainboard. The transmission bearing drives the differential motor to rotate, and the differential motor drives the control mainboard to control and adjust the rotation angle to achieve the fixation of LRM module mainboards of different sizes. The control mainboard is provided with a Type-C charging and data transmission interface.

[0014] A method for controlling the disassembly and assembly of an LRM module mainboard. When assembling the mainboard, the mainboard origin and the corresponding installation hole coordinates need to be set by software first. The mainboard position is adjusted by controlling a differential motor and a universal joint connecting rod component by using the software and the control mainboard to be compatible with LRM module mainboards of different specifications. The LRM module mainboard disassembly and assembly component is assembled and fixed to the mainboard by a suction cup. The centering accuracy value and coordinate value of the mainboard and the fixing hole of the substrate mainboard are set in the software by using control buttons and a control panel. The mainboard disassembly and assembly component is powered on.

[0015] Then the mainboard disassembly and assembly assembly pre-positions the mainboard, and uses the distance sensor to pre-position the fixing holes through the mainboard fixing holes of the baseboard. At this time, the positions of the remaining positioning holes are not aligned, and the differential motor begins to adjust the position of the mainboard to be assembled under the control of the software. When the centering accuracy of any fixing hole reaches the set value, the software alarm feedback, and the suction cup here adsorbs the mainboard and no longer moves. As the mainboard continues to move, the positioning accuracy of the positioning holes that have been determined in the original position no longer meets the set requirements. At this time, the suction cup and mainboard that originally stopped moving continue to move until the distance values ​​of each sensor reach the set value, and the software issues a stop command;

[0016] Finally, the software controls the universal joint connecting rod component to move downward, so that the mainboard contacts the baseboard mainboard fixing hole column to realize the mainboard assembly positioning. The software sends a stop command, removes the LRM module mainboard disassembly and assembly mechanism, tightens the fixing screws, and completes the mainboard installation.

[0017] Furthermore, when disassembling the mainboard, first, remove the mainboard fixing screws, assemble the LRM module mainboard disassembly assembly and fix it to the disassembled mainboard through the suction cup;

[0018] Then, using the software and the control mainboard, the pressure value required for the mainboard and the substrate heat-conducting boss to be separated is set in the software through the control buttons and the control panel, so as to realize the centering of the pressure sensor with the substrate fixing hole and the mainboard fixing hole, ensure the centering of the telescopic pressure component with the fixing hole position, and start adjusting the telescopic distance of the telescopic pressure component of the mainboard disassembly and assembly assembly through software control, and start to form pressure after the telescopic pressure component contacts the substrate, and feedback the pressure value through the pressure sensor, when the force on the pressure sensor at a certain corner reaches the software set value, the software alarm feedback is used, the telescopic pressure component at this position stops applying pressure, and the telescopic pressure components at the other corners continue to apply pressure, and the software synchronously displays the pressure value of each pressure sensor;

[0019] As pressure is applied to each corner, the pressure of the corners where pressure has been applied will also change. When the pressure value displayed by the software is not the nominal value, the telescopic pressure component that originally stopped applying pressure continues to increase or decrease the pressure until the pressure values ​​of each pressure sensor reach the set value. The pressure value overcomes the adhesion between the mainboard and the thermal conductive silicone grease on the mounting boss of the substrate heat dissipation chip. The software then issues a stop command, removes the LRM module mainboard disassembly and assembly components, and completes the mainboard disassembly.

[0020] Compared with the prior art, the LRM module mainboard disassembly and assembly device and the control method thereof of the present invention have the following outstanding beneficial effects:

[0021] When disassembling and assembling the LRM module mainboard, a portable disassembly and assembly structure and electrical control are used; a distance sensor is installed at the front of the suction cup to monitor and feedback the centering accuracy and installation distance value; the pressure sensor at the top of the suction cup is used to realize the control feedback of the disassembly force required for disassembling the LRM module mainboard, and the telescopic structure realizes the dynamic adjustment of the pressure; the differential motor controls the telescopic length and rotation angle of each side arm of the universal joint connecting rod installation structure, which can adapt to different disassembly and assembly environments and improve the applicability of the disassembly and assembly mechanism. Through the above structure and its control method, the disassembly and assembly efficiency of the LRM module mainboard is improved, the disassembly and assembly procedure is simplified, and the reliability of the mainboard is guaranteed. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0023] Attached Figure 1 It is a schematic diagram of the overall assembly of the LRM module mainboard disassembly and assembly device;

[0024] Attached Figure 2It is a schematic diagram of the mainboard disassembly and assembly components in the LRM module mainboard disassembly and assembly device;

[0025] Attached Figure 3 It is a schematic diagram of the overall assembly when disassembling the mainboard disassembly and assembly components in the LRM module mainboard disassembly and assembly device;

[0026] Attached Figure 4 It is a structural schematic diagram of a base plate in a device for disassembling and assembling a mainboard of an LRM module;

[0027] Attached Figure 5 It is a schematic diagram of the structure of the motor in the LRM module mainboard disassembly and assembly device;

[0028] Attached Figure 6 It is a schematic flow chart of mainboard assembly in a method for disassembling and assembling a mainboard of an LRM module;

[0029] Attached Figure 7 The present invention is a schematic flow chart of mainboard disassembly in a method for disassembling and assembling a mainboard of an LRM module. DETAILED DESCRIPTION

[0030] In order to enable those skilled in the art to better understand the solution of the present invention, the present invention is further described in detail below in conjunction with specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] A best embodiment is given below:

[0032] like Figure 1-5 As shown, an LRM module motherboard disassembly and assembly device in this embodiment includes a base plate 3, a motherboard disassembly and assembly component 1 and a motherboard 2. The motherboard 2 is installed on the upper part of the base plate 3, and the motherboard disassembly and assembly component 1 is connected to the upper part of the motherboard 2.

[0033] The motherboard disassembly assembly 1 comprises a housing frame 14, a box cover 16 is provided on the upper part of the housing frame 14, a handle 17 is provided on the box cover 16, a fixing assembly is installed on the lower part, a control panel 18 is provided on one side of the housing frame 14, and a control button 19 is installed on one side of the control panel 18;

[0034] A Type-C charging and data transmission interface 15 is provided on one side adjacent to the control panel 18 .

[0035] The fixing components are installed at the four corners of the bottom of the casing frame 14. Each fixing component includes a universal connecting rod component 13, a suction cup 12, a distance sensor 11 and a telescopic pressure component 110. One side of the universal connecting rod component 13 is fixed to the bottom of the casing frame 14, and the other side is hinged with the telescopic pressure component 110. A suction cup 12 is provided at the bottom of the hinge, and a distance sensor 11 is provided on the telescopic pressure component 110.

[0036] The substrate 3 is provided with a plurality of substrate-motherboard fixing holes 31 , and the upper portion of the substrate 3 is provided with a substrate heat dissipation chip fitting boss 32 . The motherboard 2 is fixed to the substrate 3 through the substrate-motherboard fixing holes 31 , and the substrate heat dissipation chip fitting boss 32 fits with the motherboard 2 .

[0037] The telescopic pressure member 110 is disassembled by telescoping and cooperating with the substrate mainboard fixing hole 31 , and a pressure sensor 111 is provided at the bottom of the telescopic pressure member 110 . The pressure sensor 111 feeds back the pressure value to control the pressurization of the telescopic pressure member 110 .

[0038] An electric motor is provided inside the outer casing frame 14, and the electric motor includes a transmission bearing 114, a differential motor 113 and a control main board 112. The transmission bearing 114 drives the differential motor 113 to rotate, and the differential motor 113 drives the control main board 112 to control and adjust the rotation angle to achieve the fixation of LRM module main boards of different sizes. A Type-C charging and data transmission interface 15 is provided on the control main board 112.

[0039] The mainboard disassembly and assembly component 1 and the mainboard 2 are adsorbed together by the suction cup 12 on the mainboard disassembly and assembly component 1. The four-corner distance sensor 11 is calibrated and aligned with the fixing hole 31 on the base plate 3 through the fixing hole on the mainboard 2. The universal joint connecting rod mounting component 13 and the control box are fixed by a hinge. The transmission bearing 114 is used to ensure that it can rotate in the horizontal direction and has a certain rotation space in the vertical direction. The differential motor 113 is controlled and adjusted by the control mainboard 112 to achieve the fixation of LRM module mainboards of different sizes. The control mainboard 112 has a Type-C charging and data transmission interface 15, which is used to charge the mechanism to ensure that the universal joint connecting rod mounting mechanism 13 can be used normally. At the same time, the corresponding control program can also be transmitted to an external storage device. The control panel 18 cooperates with the control button 19 to realize the setting and monitoring of the preset values ​​of pressure and distance. A distance sensor 11 is provided at the front end of the suction cup 12 to ensure the adjustment and feedback of the centering accuracy of the fixing holes 31 of the main board 2 and the substrate 3 during disassembly and assembly. A pressure sensor 111 and a telescopic pressure member 110 are installed at the bottom end of the universal joint connecting rod member 13 to ensure that the required disassembly force can be provided by the telescopic pressure member 110 during the disassembly of the main board 2. At the same time, the pressure sensor 111 can provide real-time feedback and adjust the disassembly force to ensure that the disassembly force can completely overcome the adhesion between the substrate heat dissipation chip bonding boss 32 on the substrate 3 that is bonded to the heat generating chip.

[0040] like Figure 6 As shown, based on the above device, a method for controlling the disassembly and assembly of an LRM module motherboard in this embodiment, when assembling the motherboard 2, firstly, the origin of the motherboard 2 and the corresponding mounting hole coordinates need to be set by software, and the position of the motherboard 2 is adjusted by controlling the differential motor 113 and the universal joint connecting rod member 13 by using the software and the control motherboard 112 to be compatible with LRM module motherboards 2 of different specifications, and the LRM module motherboard disassembly and assembly component 1 is assembled and fixed to the motherboard 2 by the suction cup 12, and the centering accuracy value and coordinate value of the motherboard 2 and the substrate motherboard fixing hole 31 are set in the software by using the control button 19 and the control panel 18, and the motherboard disassembly and assembly component 1 is powered on;

[0041] Then, the mainboard disassembly and assembly component 1 pre-positions the mainboard 2, and uses the distance sensor 11 to pre-position the fixing hole through the baseboard mainboard fixing hole 31. At this time, the positions of the remaining positioning holes are not aligned, and the differential motor 113 starts to adjust the position of the mainboard 2 to be assembled under the control of the software. When the centering accuracy of any fixing hole reaches the set value, the software alarm feedback, and the suction cup 12 here absorbs the mainboard 2 and no longer moves. As the mainboard 2 continues to move, the positioning accuracy of the positioning hole that has been determined in the original position no longer meets the set requirements. At this time, the suction cup 12 and the mainboard 2 that originally stopped moving continue to move until the distance values ​​of each sensor reach the set value, and the software issues a stop command;

[0042] Finally, the software controls the universal joint connecting rod component 13 to move downward, so that the mainboard 2 contacts the substrate mainboard fixing hole 31 to realize the assembly positioning of the mainboard 2. The software issues a stop command, removes the LRM module mainboard disassembly and assembly mechanism 1, tightens the fixing screws, and completes the installation of the mainboard 2.

[0043] like Figure 7 As shown, when disassembling the mainboard 2, first, remove the fixing screws of the mainboard 2, assemble the LRM module mainboard disassembly assembly 1 and fix it to the disassembled mainboard 2 through the suction cup 12;

[0044] Then, using software (complete corresponding data transmission and advance charging of the mechanism through the Type-C charging and data transmission interface 15 in advance) and the control mainboard 112, set the pressure value required for the mainboard 2 to separate from the substrate heat dissipation chip fitting boss 32 in the software through the control button 19 and the control panel 18, realize the centering of the pressure sensor 11 with the fixing hole of the substrate 3 and the fixing hole of the mainboard 2, ensure the centering of the telescopic pressure member 110 with the fixing hole position, and start adjusting the telescopic distance of the telescopic pressure member 110 of the mainboard disassembly and assembly component 1 through software control. After the telescopic pressure member 110 contacts the substrate 3, pressure begins to form, and the pressure value is fed back through the pressure sensor 111. When the force on the pressure sensor 111 at a certain corner reaches the software set value, the software alarm feedback is used, and the telescopic pressure member 110 at this position stops applying pressure, and the telescopic pressure members 110 at the other corners continue to apply pressure. The software synchronously displays the pressure value of each pressure sensor 111;

[0045] As pressure is applied to each corner, the pressure of the corners where pressure has been applied will also change. When the pressure value displayed by the software is not the nominal value, the telescopic pressure member 110 that originally stopped applying pressure continues to increase or decrease the pressure until the pressure values ​​of each pressure sensor 111 reach the set value. The pressure value overcomes the adhesion between the main board 2 and the thermal grease of the substrate heat dissipation chip bonding boss 32. The software issues a stop command, removes the LRM module main board disassembly component 1, and completes the disassembly of the main board 2.

[0046] The above-mentioned specific implementations are only specific cases of the present invention. The patent protection scope of the present invention includes but is not limited to the above-mentioned specific implementations. Any technical solutions that conform to the above-mentioned specific implementations of the present invention and any appropriate changes or substitutions made by ordinary technicians in the relevant technical field shall fall within the patent protection scope of the present invention.

[0047] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A LRM module mainboard disassembly and assembly device, characterized in that: It comprises a base plate, a mainboard disassembly assembly component and a mainboard. The mainboard is mounted on the upper part of the base plate, and the mainboard disassembly assembly component is connected to the upper part of the mainboard.

2. The LRM module mainboard disassembly and assembly device according to claim 1, characterized in that: The motherboard disassembly assembly assembly comprises a housing frame, a case cover is provided on the upper part of the housing frame, a handle is provided on the case cover, a fixing assembly is installed on the lower part, a control panel is provided on one side of the housing frame, and control buttons are installed on one side of the control panel; A Type-C charging and data transmission interface is provided on one side adjacent to the control panel.

3. The LRM module mainboard disassembly and assembly device according to claim 2, characterized in that: The fixing components are installed at the four corners of the bottom of the casing outer frame. Each fixing component includes a universal connecting rod component, a suction cup, a distance sensor and a telescopic pressure component. One side of the universal connecting rod component is fixed to the bottom of the casing outer frame, and the other side is hinged with a telescopic pressure component. A suction cup is provided at the bottom of the hinge, and a distance sensor is provided on the telescopic pressure component.

4. The LRM module mainboard disassembly and assembly device according to claim 3, characterized in that: The substrate is provided with a plurality of substrate-mainboard fixing holes, a substrate heat dissipation chip fitting boss is provided on the upper part of the substrate, the mainboard is fixed to the substrate through the substrate-mainboard fixing holes, and the substrate heat dissipation chip fitting boss is fitted to the mainboard.

5. The LRM module mainboard disassembly and assembly device according to claim 4, characterized in that: The telescopic pressure member is disassembled by telescoping and cooperating with the fixing hole of the substrate mainboard, and a pressure sensor is provided at the bottom of the telescopic pressure member, which feeds back the pressure value to control the pressurization of the telescopic pressure member.

6. The LRM module mainboard disassembly and assembly device according to claim 5, characterized in that: An electric motor is provided inside the outer frame of the casing, and the electric motor includes a transmission bearing, a differential motor and a control mainboard. The transmission bearing drives the differential motor to rotate, and the differential motor drives the control mainboard to control and adjust the rotation angle to achieve the fixation of LRM module mainboards of different sizes. The control mainboard is provided with a Type-C charging and data transmission interface.

7. A method for controlling the assembly and disassembly of a mainboard of an LRM module, characterized in that: When assembling the mainboard, firstly, the origin of the mainboard and the corresponding installation hole coordinates need to be set through the software, and the mainboard is controlled by the software and the differential motor and the universal joint connecting rod component to adjust the mainboard position to be compatible with LRM module mainboards of different specifications, assemble the LRM module mainboard disassembly assembly and fix the mechanism to the mainboard through the suction cup, and use the control buttons and the control panel to set the centering accuracy value and coordinate value of the mainboard and the substrate mainboard fixing hole in the software, and the mainboard disassembly assembly is powered on; Then the mainboard disassembly and assembly assembly pre-positions the mainboard, and uses the distance sensor to pre-position the fixing holes through the mainboard fixing holes of the baseboard. At this time, the positions of the remaining positioning holes are not aligned, and the differential motor begins to adjust the position of the mainboard to be assembled under the control of the software. When the centering accuracy of any fixing hole reaches the set value, the software alarm feedback, and the suction cup here adsorbs the mainboard and no longer moves. As the mainboard continues to move, the positioning accuracy of the positioning holes that have been determined in the original position no longer meets the set requirements. At this time, the suction cup and mainboard that originally stopped moving continue to move until the distance values ​​of each sensor reach the set value, and the software issues a stop command; Finally, the software controls the universal joint connecting rod component to move downward, so that the mainboard contacts the baseboard mainboard fixing hole column to realize the mainboard assembly positioning. The software sends a stop command, removes the LRM module mainboard disassembly and assembly mechanism, tightens the fixing screws, and completes the mainboard installation.

8. A method for controlling the assembly and disassembly of a mainboard of an LRM module according to claim 7, characterized in that: When disassembling the mainboard, first remove the mainboard fixing screws, assemble the LRM module mainboard disassembly assembly and fix it to the disassembled mainboard through the suction cup; Then, using the software and the control mainboard, the pressure value required for the mainboard and the substrate heat-conducting boss to be separated is set in the software through the control buttons and the control panel, so as to realize the centering of the pressure sensor with the substrate fixing hole and the mainboard fixing hole, ensure the centering of the telescopic pressure component with the fixing hole position, and start adjusting the telescopic distance of the telescopic pressure component of the mainboard disassembly and assembly assembly through software control, and start to form pressure after the telescopic pressure component contacts the substrate, and feedback the pressure value through the pressure sensor, when the force on the pressure sensor at a certain corner reaches the software set value, the software alarm feedback is used, the telescopic pressure component at this position stops applying pressure, and the telescopic pressure components at the other corners continue to apply pressure, and the software synchronously displays the pressure value of each pressure sensor; As pressure is applied to each corner, the pressure of the corners where pressure has been applied will also change. When the pressure value displayed by the software is not the nominal value, the telescopic pressure component that originally stopped applying pressure continues to increase or decrease the pressure until the pressure values ​​of each pressure sensor reach the set value. The pressure value overcomes the adhesion between the mainboard and the thermal conductive silicone grease on the mounting boss of the substrate heat dissipation chip. The software then issues a stop command, removes the LRM module mainboard disassembly and assembly components, and completes the mainboard disassembly.

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