Polishing pad and final polishing equipment

Abstract

The invention provides a polishing pad and final polishing equipment. The polishing pad comprises a base body; the polishing pad comprises a base body and a deformable unit arranged on the base body, the deformable unit can enable the polishing pad to be switched between a first shape mode and a second shape mode through deformation, in the first shape mode, grooves are formed in the polishing face of the polishing pad, and in the second shape mode, the polishing face of the polishing pad is flat.

Description

Technical Field

[0001] The present disclosure relates to the field of semiconductor wafer production, and in particular to a polishing pad and a final polishing device. Background Art

[0002] Wafer polishing is one of the key steps in the semiconductor manufacturing process. Its main purpose is to precisely polish the wafer surface to achieve the required flatness and smoothness. During the wafer polishing process, the wafer is placed on the polishing table. The friction between the polishing pad and the wafer is used in conjunction with the use of polishing liquid to remove the uneven parts of the wafer surface. As one of the core components in the polishing process, the surface structure of the polishing pad has a direct impact on the polishing effect.

[0003] In the existing polishing equipment, the design of the polishing pad is mainly divided into two types: a polishing pad with grooves and a polishing pad without grooves. The design of the polishing pad with grooves is conducive to the circulation of the polishing liquid, which can improve the polishing efficiency, so that the polishing liquid can better reach the area where the wafer contacts the polishing pad, thereby improving the polishing effect. However, this design may affect the flatness of the wafer surface, because the presence of the grooves may cause uneven wear on the wafer surface. On the other hand, the polishing pad without grooves can provide a smoother polishing effect, which is conducive to obtaining a wafer surface with high flatness. However, this design is not conducive to the circulation of the polishing liquid due to the lack of grooves, and after the polishing is completed, due to the large adsorption force between the wafer and the polishing pad, it is not easy to remove the wafer from the polishing pad, which may cause damage to the wafer or reduce production efficiency.

[0004] In summary, the existing polishing pad design has certain limitations in meeting the requirements of polishing efficiency and surface flatness. A new polishing pad design is needed to achieve a balance between the circulation of polishing liquid and the surface flatness of the wafer, while solving the problem of removing the wafer after polishing is completed. Summary of the invention

[0005] The present invention provides a polishing pad and a final polishing device, which can flexibly switch shape modes according to the requirements of the polishing stage, optimize the flow of polishing liquid, improve the surface flatness of the wafer, facilitate the removal of the wafer, and improve the efficiency and effect of the entire polishing process.

[0006] The technical solution of the present disclosure is achieved as follows: In a first aspect, an embodiment of the present disclosure provides a polishing pad, the polishing pad comprising: matrix; A deformable unit is arranged on the base, and the deformable unit can switch the polishing pad between a first shape mode and a second shape mode by deformation. In the first shape mode, grooves are formed on the polishing surface of the polishing pad, and in the second shape mode, the polishing surface of the polishing pad is flat.

[0007] In some optional examples, the polishing pad further includes a supporting layer, and the base and the deformable unit are disposed on the supporting layer.

[0008] In some optional examples, the deformable unit is an inflatable structure, and the inflatable structure expands and deforms by being filled with gas.

[0009] In some optional examples, the polishing pad further comprises: a gas pipeline, the gas pipeline being in communication with the inflatable structure; a gas source, the gas source being used to fill the inflatable structure with gas through the gas pipeline; An air valve is provided on the gas pipeline to control the expansion amount of the inflatable structure.

[0010] In some optional examples, the deformable unit is an exhaustable structure, and the exhaustable structure shrinks and deforms due to the exhaust of gas.

[0011] In some optional examples, the polishing pad further comprises: a vacuum pipeline, the vacuum pipeline being in communication with the exhaustable structure; a vacuum source for exhausting gas from the exhaustable structure through the vacuum line; A vacuum valve is provided on the vacuum pipeline to control the shrinkage amount of the exhaustable structure.

[0012] In some optional examples, the deformable unit is composed of a plurality of deformable modules, and each deformable module can be deformed independently.

[0013] In some optional examples, the groove is formed into a plurality of concentric rings.

[0014] In a second aspect, an embodiment of the present disclosure provides a final polishing device, wherein the final polishing device comprises the polishing pad according to the first aspect.

[0015] In some optional examples, the final polishing device further comprises: A rotary table, wherein the polishing pad is arranged on the rotary table and rotates together with the rotary table; A clamper is used to clamp a wafer and press the clamped wafer against the polishing pad.

[0016] The present disclosure provides a polishing pad and a final polishing device. When using a grooved mode, it helps the polishing liquid to flow, improves the polishing efficiency, makes the polishing liquid evenly distributed, and improves the polishing effect of the wafer. When switching to a grooveless mode, the surface of the polishing pad is smoothed, thereby improving the surface flatness of the wafer. When switching to a grooved mode, the adsorption force of the polishing pad on the wafer is reduced, making the wafer easier to remove, avoiding damage to the wafer, and improving production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic cross-sectional view of a polishing pad provided according to an embodiment of the present disclosure, wherein the polishing pad is in a first shape mode.

[0018] Figure 2 A schematic cross-sectional view of a polishing pad provided according to an embodiment of the present disclosure, wherein the polishing pad is in a second shape mode.

[0019] Figure 3 A schematic cross-sectional view of a polishing pad provided according to another embodiment of the present disclosure.

[0020] Figure 4 A schematic cross-sectional view of a polishing pad provided according to another embodiment of the present disclosure.

[0021] Figure 5 A schematic top view of a polishing pad provided in an embodiment of the present disclosure.

[0022] Figure 6 A three-dimensional schematic diagram of the final polishing equipment provided by the present invention. DETAILED DESCRIPTION

[0023] The technical solutions in the present disclosure will be described clearly and completely below in conjunction with the accompanying drawings in the present disclosure.

[0024] In the field of semiconductor manufacturing, the wafer polishing process plays a vital role. It directly affects the surface quality of the wafer, and then affects the chip performance and reliability in the subsequent manufacturing process. As the core component of the process, the design of the polishing pad is directly related to the distribution of the polishing liquid, the surface flatness of the wafer, and the polishing efficiency. At present, the design of the polishing pad is mainly divided into two types: grooved and non-grooved, each with its own advantages and limitations. Although the grooved polishing pad is conducive to the circulation of the polishing liquid and is easy to remove the wafer after polishing due to the small adsorption force, it may affect the surface flatness of the polished wafer. This is because the presence of the groove may cause uneven pressure distribution on the wafer surface, thereby affecting the uniformity of polishing. In the case of a non-grooved polishing pad, a better surface flatness of the polished wafer can be obtained, but due to the lack of grooves, the circulation of the polishing liquid is limited, which may reduce the polishing efficiency. In addition, after polishing is completed, it is not easy to remove the wafer due to the large adsorption force between the non-grooved polishing pad and the wafer, which not only increases the difficulty of operation, but also may cause damage to the wafer due to excessive force during removal.

[0025] In the face of these challenges in the prior art, the present disclosure proposes an innovative technical solution to solve the contradiction between polishing efficiency and surface flatness in the existing polishing pad design and optimize the wafer removal process. The technical solution of the present disclosure relates to a polishing pad having a deformable unit that can switch between two shape modes according to polishing requirements to adapt to different polishing process requirements.

[0026] Specifically, see Figure 1 and Figure 2 The present disclosure provides a polishing pad 10, which may include a base 11 and a deformable unit 12 disposed on the base 11. Figure 1 and Figure 2 The area filled with dots schematically shows the base 11, and the area filled with hatching schematically shows the deformable unit 12. Figure 1 and Figure 2 Also shown in FIG. 1 are a holder 30 above the polishing pad 10 and a wafer W held by the holder 30 .

[0027] The deformable unit 12 can deform the polishing pad 10 so that Figure 1 The first shape mode shown in Figure 2 The polishing surface 10P of the polishing pad 10 is switched between the first shape mode in which the grooves G are formed and the second shape mode in which the polishing surface 10P of the polishing pad 10 is flat. More specifically, for the polishing surface 10P of the polishing pad 10, as in Figure 1As shown in FIG. 1 , one part is composed of a base 11, and the part of the polishing surface 10P composed of the base 11 is fixed or does not change, and the other part is composed of a deformable unit 12, and the part of the polishing surface 10P composed of the deformable unit 12 will change, such as in FIG. Figure 1 In the embodiment, the fixed part and the part that changes in the polishing surface 10P together form the above-mentioned groove G, such as Figure 2 In the embodiment, the fixed portion and the portion that changes in the polishing surface 10P are in the same plane, so that the entire polishing surface 10P is flat.

[0028] For the polishing pad 10 according to the embodiment of the present disclosure, during the process of polishing the wafer W, the polishing pad 10 can be placed in a first shape mode, i.e., a mode with grooves G (see FIG. Figure 1 ), which is conducive to the circulation of the polishing liquid, can improve the polishing efficiency, and enable the polishing liquid to better reach the area where the wafer W contacts the polishing pad 10, thereby improving the polishing effect. The presence of the groove G provides a circulation path for the polishing liquid, ensuring the uniform distribution of the polishing liquid during the entire polishing process, which is crucial to improving the polishing uniformity and efficiency of the wafer W. The polishing pad 10 can also be switched to the second shape mode, that is, the mode without the groove G (see Figure 2), so that the polishing surface 10P of the polishing pad 10 is flat, which can make the surface flatness of the polished wafer W better. When the wafer W needs to be removed after polishing, the polishing pad 10 can be switched to the first shape mode, that is, the mode with grooves G, so that the adsorption force of the polishing pad 10 on the wafer W is reduced, making it easier to remove the wafer W. By reducing the adsorption force between the polishing pad 10 and the wafer W, it is possible to avoid damage to the wafer W caused by excessive force during the removal process, thereby improving production efficiency. The deformable unit 12 of the polishing pad 10 can achieve switching between the two shape modes by deformation. This flexibility enables the polishing pad 10 to adapt to different polishing requirements, whether it is a stage where grooves G are needed to improve polishing efficiency, or a stage where a flat polishing surface 10P is needed to obtain a better flatness of the wafer W, the polishing pad 10 can meet these requirements. Since the polishing pad 10 can quickly switch shape modes in different polishing stages, this greatly simplifies the operation process. The operator can easily adjust the state of the polishing pad 10 according to the different polishing stages, thereby improving the convenience and efficiency of the entire polishing process. By reducing the wafer damage caused by the excessive adsorption force between the polishing pad 10 and the wafer W, and improving the polishing efficiency and surface quality, the polishing pad 10 of the present disclosure helps to reduce the overall production cost. At the same time, due to the strong adaptability of the polishing pad 10, the additional cost caused by replacing different types of polishing pads can be reduced. In summary, the polishing pad 10 according to the embodiment of the present disclosure not only improves the polishing efficiency and the surface quality of the wafer W through its innovative design, but also simplifies the removal process of the wafer W, reduces the production cost, and improves the convenience of operation, providing an efficient and economical polishing solution for the semiconductor manufacturing field.

[0029] In some embodiments of the present disclosure, see Figure 1 and Figure 2 The polishing pad 10 may further include a support layer 13 , and the base 11 and the deformable unit 12 are disposed on the support layer 13 .

[0030] By adding a support layer 13 to the polishing pad 10, the base 11 and the deformable unit 12 are both arranged on the support layer 13, which can significantly improve the overall structural stability of the polishing pad 10. As the support of the base 11 and the deformable unit 12, the support layer 13 can evenly disperse the pressure and stress generated during the polishing process, and reduce deformation or damage caused by uneven local force. The addition of the support layer 13 makes the polishing pad 10 more durable during a long polishing process. The support layer 13 can absorb part of the impact force and reduce direct damage to the base 11 and the deformable unit 12, thereby extending the service life of the polishing pad 10 and improving the reliability of the polishing process. Since the support layer 13 enhances the structural stability of the polishing pad 10, the operator can be more assured during the operation process without worrying about safety issues caused by accidental damage to the polishing pad 10, thereby improving the safety of the operation. The addition of the support layer 13 enables the polishing pad 10 to adapt to a wider range of polishing process conditions, including different pressures, temperatures and types of polishing liquids. This adaptability enables the polishing pad 10 to be used in a variety of different polishing environments, increasing its application range. The design of the support layer 13 can also make the maintenance and replacement of the polishing pad 10 more convenient. If the base 11 or the deformable unit 12 needs to be replaced or maintained, the support layer 13 can serve as a stable platform to facilitate related operations.

[0031] In some embodiments of the present disclosure, see Figure 3 The deformable unit 12 may be an inflatable structure, which expands and deforms by being filled with gas. Figure 3 In the figure, the state of the inflatable structure before being inflated with gas is shown by the dotted line, and the state of the inflatable structure after being inflated with gas is shown by the solid line.

[0032] The inflatable structure design of the deformable unit 12 makes the deformation process simple and efficient. By controlling the amount of gas charged, the expansion degree of the deformable unit 12 can be accurately adjusted, thereby achieving precise control of the surface shape of the polishing pad 10. This deformation method has a fast response speed and can quickly adapt to different polishing requirements. The method of using gas expansion to achieve deformation avoids the risk of wear and failure that may be caused by the use of mechanical parts. Gas expansion is a gentle and controllable process that does not produce severe mechanical stress, thereby ensuring the safety and reliability of the deformation process. The inflatable structure can quickly adjust its shape according to actual polishing requirements, so that the polishing pad 10 can flexibly respond to different polishing stages. For example, in the initial polishing stage where grooves G are required to improve the fluidity of the polishing liquid, gas can be added to the inflatable structure to form grooves G; in the final polishing stage where the polishing surface 10P needs to be flattened to improve the surface flatness of the wafer W, gas can be added to the inflatable structure to obtain a flat polishing surface 10P. Since the inflatable structure avoids physical wear of mechanical parts, the service life of the polishing pad 10 can be extended, and the number of cycles of gas expansion and contraction can be very high without significantly reducing performance, which makes the polishing pad 10 more economical and durable. The design of the inflatable structure simplifies the maintenance of the polishing pad 10. Since there are no complex mechanical parts, the maintenance cost and difficulty are greatly reduced, which improves the ease of use of the polishing pad 10. The inflatable structure can automatically adjust according to changes in ambient pressure and temperature to maintain the stability of the performance of the polishing pad 10. This adaptive ability enables the polishing pad 10 to work under a wider range of process conditions and is not affected by environmental changes. By precisely controlling the amount of gas charged, the inflatable structure can achieve very fine deformation control, which is crucial to improving polishing accuracy, especially in the field of high-end semiconductor manufacturing that requires fine polishing. This precise control is particularly important.

[0033] In some embodiments of the present disclosure, see Figure 3 , the polishing pad 10 may further include: a gas pipeline 14, the gas pipeline 14 being in communication with the inflatable structure; A gas source 15, the gas source 15 is used to fill the gas into the inflatable structure through the gas pipeline 14; The air valve 16 is disposed on the gas pipeline 14 to control the expansion amount of the inflatable structure.

[0034] By precisely controlling the amount of gas that is filled into the inflatable structure from the gas source 15 through the gas valve 16, fine adjustment of the shape of the polishing surface 10P of the polishing pad 10 can be achieved. This control method allows the operator to adjust the expansion degree of the inflatable structure according to specific polishing requirements to adapt to different polishing conditions. Precise deformation control enables the polishing pad 10 to better adapt to the surface characteristics of the wafer W, especially in areas that require fine polishing. By adjusting the expansion amount of the inflatable structure, the contact pressure between the polishing pad 10 and the wafer W can be optimized, thereby improving the polishing accuracy and surface quality. By precisely controlling the amount of gas filled, the inflatable structure can achieve different degrees of expansion to adapt to different polishing stages and polishing liquid requirements. For example, in a stage where a groove G is required to improve the circulation of the polishing liquid, the inflatable structure may not expand to form a groove, such as in Figure 3 Indicated by dotted lines; at the stage where the polishing surface 10P needs to be leveled to improve the surface flatness of the wafer W, the inflatable structure can be inflated to level the polishing surface 10P. This flexibility enables the polishing pad 10 to provide optimal performance at different polishing stages. Through the coordinated use of the gas valve 16 and the gas pipeline 14, the operator can easily control the expansion state of the inflatable structure without complicated mechanical adjustments. This design simplifies the operating process and improves the convenience of operation. Since the deformation control of the inflatable structure depends on the adjustment of the gas pressure, the dependence on mechanical components is reduced, thereby reducing maintenance costs and failure rates. The process of gas filling and release is gradual and controllable, and no severe mechanical stress is generated, thereby ensuring the safety of the deformation process. Accurately controlling the amount of gas charged enables the polishing pad 10 to quickly respond to different polishing requirements, reduces the downtime caused by adjusting the state of the polishing pad 10, and improves production efficiency.

[0035] In some embodiments of the present disclosure, see Figure 4 The deformable unit 12 may be an exhaustable structure, which shrinks and deforms due to the exhaust gas. Figure 4 In the figure, the dotted line shows the state of the exhaust structure before the gas is exhausted, and the solid line shows the state of the exhaust structure after the gas is exhausted.

[0036] The exhaust structure design of the deformable unit 12 makes the deformation process simple and efficient. By controlling the exhaust amount of gas, the shape of the deformable unit 12 can be quickly adjusted to quickly respond to different polishing requirements. This rapid response capability enables the polishing pad 10 to adapt to the rapidly changing production environment and improve production efficiency. The method of using gas exhaust to achieve deformation avoids the wear and failure risks that may be caused by the use of mechanical parts. Gas exhaust is a gentle and controllable process that does not produce severe mechanical stress, thereby ensuring the safety and reliability of the deformation process. This design reduces production interruptions caused by mechanical failures and improves the stability of the entire polishing system. The deformable unit 12 can quickly adjust its shape according to actual polishing requirements. For example, in the initial polishing stage where grooves G are required to improve the flowability of the polishing liquid, the gas in the exhaust structure can be exhausted to form grooves G; in the final polishing stage where the polishing surface 10P needs to be flattened to improve the surface flatness of the wafer W, the gas in the exhaust structure can be not exhausted to obtain a flat polishing surface 10P. This flexibility enables the polishing pad 10 to flexibly respond to different polishing stages and improve the polishing effect. Since the exhaust structure avoids physical wear of mechanical parts, maintenance and operating costs can be reduced, and the number of cycles of gas exhaust and filling can be very high without significantly reducing performance, which makes the polishing pad 10 more economical and durable. The design of the exhaust structure simplifies the operation process of the polishing pad 10. The operator can easily adjust the state of the polishing pad 10 according to the different polishing stages, thereby improving the convenience and efficiency of the entire polishing process. The exhaust structure can automatically adjust according to changes in ambient pressure and temperature to maintain the stability of the performance of the polishing pad 10. This adaptive ability enables the polishing pad 10 to work under a wider range of process conditions and is not affected by environmental changes. The process of gas exhaust and filling consumes less energy than mechanical movement, which helps to reduce the energy consumption of the entire polishing system and achieve a more environmentally friendly production process.

[0037] In some embodiments of the present disclosure, see Figure 4 , the polishing pad 10 may further include: A vacuum pipeline 17, the vacuum pipeline 17 is connected to the exhaust structure; A vacuum source 18, the vacuum source 18 is used to exhaust gas from the exhaust structure through the vacuum line 17; The vacuum valve 19 is arranged on the vacuum line 17 to control the shrinkage amount of the exhaustable structure.

[0038] The vacuum valve 19 precisely controls the amount of gas exhausted from the exhaust structure by the vacuum source 18 through the vacuum line 17, so that fine adjustment of the polishing surface 10P of the polishing pad 10 can be achieved. This control method allows the operator to adjust the degree of contraction of the exhaust structure according to the specific polishing requirements to adapt to different polishing conditions. Precise deformation control enables the polishing pad 10 to better adapt to the surface characteristics of the wafer W, especially in areas that require fine polishing. By adjusting the contraction amount of the exhaust structure, the contact pressure between the polishing pad 10 and the wafer W can be optimized, thereby improving the polishing accuracy and surface quality. By precisely controlling the amount of gas exhausted, the exhaust structure can achieve different degrees of contraction to adapt to different polishing stages and polishing liquid requirements. For example, in the stage where a flat polishing surface 10P is required to improve the surface flatness of the wafer W, the exhaust structure can not exhaust gas to make the polishing surface 10P flat. This flexibility enables the polishing pad 10 to provide optimal performance in different polishing stages. By using the vacuum valve 19 and the vacuum line 17 in combination, the operator can easily control the contraction state of the exhaust structure without complicated mechanical adjustment. This design simplifies the operation process and improves the convenience of operation. The precise control of the gas exhaust volume enables the polishing pad 10 to quickly respond to different polishing requirements, reduces the downtime caused by adjusting the state of the polishing pad 10, and improves production efficiency.

[0039] In some embodiments of the present disclosure, see Figures 1 to 4 The deformable unit 12 may be composed of a plurality of deformable modules 121, and each deformable module 121 may be capable of being deformed independently.

[0040] Through multiple independent deformable modules 121, the polishing pad 10 can flexibly create groove patterns of different shapes. This design allows each deformable module 121 to be individually controlled according to specific polishing requirements to form a specific shape and distribution of the groove G to meet the needs of different polishing effects. The independent deformation ability of multiple deformable modules 121 enables the polishing pad 10 to adapt to complex polishing requirements, especially when different areas of the wafer W need to be differentiated. This flexibility makes it possible to achieve regional polishing and improves the adaptability and flexibility of the polishing process. By independently controlling each deformable module 121, the contact pressure between the polishing pad 10 and the wafer W can be optimized to achieve a more uniform polishing effect. This uniformity is crucial to improving the overall performance and quality of the wafer W. The independently controlled deformable modules 121 simplify the operating process. The operator can easily adjust the state of each deformable module 121 according to the different polishing stages, thereby improving the convenience and efficiency of the entire polishing process. The independent deformation capability of the multiple deformable modules 121 enables the polishing pad 10 to more accurately adapt to the surface characteristics of the wafer W, especially in areas that require fine polishing. This precise control is essential for improving the polishing accuracy and surface quality of the wafer W. The independently controlled deformable modules 121 enable the polishing pad 10 to quickly respond to different polishing requirements, reducing downtime caused by adjusting the state of the polishing pad 10 and improving production efficiency.

[0041] In some embodiments of the present disclosure, see Figure 5 , the groove G can be formed into a plurality of concentric ring shapes.

[0042] The multiple concentric ring structures formed by the grooves G help the polishing liquid to be evenly distributed on the surface of the wafer W, so that the polishing liquid can better reach the area where the wafer W contacts the polishing pad 10, thereby improving the polishing efficiency and effect. The concentric ring-shaped grooves G can provide a more uniform distribution of polishing pressure, especially between the edge and the center area of ​​the wafer W. This uniformity helps to reduce the uneven polishing caused by uneven pressure distribution and improve the surface flatness of the entire wafer W. The concentric ring-shaped grooves G help to reduce defects caused by uneven contact between the polishing pad 10 and the wafer W, such as edge warping or center depression. This design reduces the occurrence of these defects by evenly distributing the polishing pressure. The design of the concentric ring-shaped grooves G can reduce wear during the polishing process, because the wear of the polishing pad 10 is more evenly distributed, which helps to extend the service life of the polishing pad 10 and reduce the replacement frequency and cost. The design of the concentric ring-shaped grooves G simplifies the adjustment process of the polishing pad 10. The operator can easily adjust the activation state of the grooves G as needed to adapt to different polishing requirements.

[0043] See also Figure 6The embodiment of the present disclosure further provides a final polishing device 1, which may include a polishing pad 10 according to the aforementioned embodiments of the present disclosure.

[0044] The final polishing device 1 integrates the polishing pad 10 according to the present disclosure, so that the final polishing device 1 can achieve multiple polishing modes to meet different polishing requirements. Since the polishing pad 10 can be switched between the grooved and non-grooved modes as needed, the final polishing device 1 can adapt to different polishing stages, thereby improving the efficiency and quality of the entire polishing process.

[0045] In some embodiments of the present disclosure, see Figure 6 , the final polishing device 1 may also include: A rotary table 20, on which the polishing pad 10 is disposed and rotates together with the rotary table 20; The clamp 30 is used to clamp the wafer W and press the clamped wafer W against the polishing pad 10. Figure 6 As shown in FIG. 1 , the holder 30 holding the wafer W can also be rotated, thereby further facilitating the polishing of the wafer W.

[0046] The polishing pad 10 is arranged on the rotary table 20 and rotates with the rotary table 20, so that the contact between the wafer W and the polishing pad 10 is more uniform, thereby improving the polishing uniformity of the surface of the entire wafer W. The clamp 30 clamps the wafer W and presses the wafer W against the polishing pad 10, and the clamp 30 also rotates at the same time. This double rotation mechanism can increase the contact area between the polishing pad 10 and the wafer W and improve the polishing efficiency. By applying pressure to the wafer W by the clamp 30, the pressure distribution during the polishing process can be controlled, thereby obtaining better polishing quality. The uniform pressure distribution helps to reduce damage and scratches during the polishing process. The rotary table 20 provides a stable rotating platform, which makes the polishing process smoother and reduces the problem of uneven polishing caused by equipment vibration.

[0047] It should be noted that the technical solutions described in the present disclosure can be combined arbitrarily without conflict.

[0048] The above is only a specific embodiment of the present disclosure, but the protection scope of the present disclosure is not limited thereto. Any person skilled in the art who is familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present disclosure, which should be included in the protection scope of the present disclosure. Therefore, the protection scope of the present disclosure should be based on the protection scope of the claims.

Claims

1. A polishing pad, characterized in that: The polishing pad comprises: matrix; A deformable unit is arranged on the base, and the deformable unit can switch the polishing pad between a first shape mode and a second shape mode by deformation. In the first shape mode, grooves are formed on the polishing surface of the polishing pad, and in the second shape mode, the polishing surface of the polishing pad is flat.

2. The polishing pad according to claim 1, characterized in that The polishing pad further includes a supporting layer, and the base and the deformable unit are disposed on the supporting layer.

3. The polishing pad according to claim 1 or 2, characterized in that: The deformable unit is an inflatable structure, and the inflatable structure expands and deforms by being filled with gas.

4. The polishing pad according to claim 3, characterized in that The polishing pad also includes: a gas pipeline, the gas pipeline being in communication with the inflatable structure; a gas source, the gas source being used to fill the inflatable structure with gas through the gas pipeline; An air valve is provided on the gas pipeline to control the expansion amount of the inflatable structure.

5. The polishing pad according to claim 1 or 2, characterized in that: The deformable unit is an exhaustable structure, and the exhaustable structure contracts and deforms due to the exhaust of gas.

6. The polishing pad according to claim 5, characterized in that The polishing pad also includes: a vacuum pipeline, the vacuum pipeline being in communication with the exhaustable structure; a vacuum source for exhausting gas from the exhaustable structure through the vacuum line; A vacuum valve is provided on the vacuum pipeline to control the shrinkage amount of the exhaustable structure.

7. The polishing pad according to claim 1 or 2, characterized in that: The deformable unit is composed of a plurality of deformable modules, and each deformable module can be deformed independently.

8. The polishing pad according to claim 1 or 2, characterized in that: The grooves are formed in a plurality of concentric ring shapes.

9. A final polishing device, characterized in that: The final polishing device comprises the polishing pad according to any one of claims 1 to 8.

10. The final polishing device according to claim 9, characterized in that The final polishing equipment also includes: A rotary table, wherein the polishing pad is arranged on the rotary table and rotates together with the rotary table; A clamper is used to clamp a wafer and press the clamped wafer against the polishing pad.

Images