Thermoelectric refrigerating unit self-adaptive temperature control system and method based on transient supercooling

Abstract

The invention discloses a thermoelectric refrigerating unit self-adaptive temperature control system and method based on transient supercooling. In the system, a temperature detection unit is used for acquiring cold end temperature information of a thermoelectric refrigerating unit; the thermal load monitoring unit is used for monitoring thermal load information of the thermoelectric refrigerating unit; the PID controller is used for controlling the cold end temperature of the thermoelectric refrigerating unit at the target temperature as an optimization target, and regulating and outputting a first current by utilizing the cold end temperature information; the transient pulse controller regulates and controls the amplitude limiting current based on the thermal load information; the feedforward controller adjusts the advanced regulation and control current based on the thermal load information and outputs a second current; the amplitude limiting output unit is used for outputting and limiting the total current of the first current and the second current to be within an amplitude limiting current according to the amplitude limiting current generated by the transient pulse controller; the power output unit drives the thermoelectric refrigerating unit based on the current generated by the amplitude limiting output unit. The thermal load resistance of the thermoelectric refrigerating unit can be remarkably improved, and the temperature control precision and stability are improved.

Description

Technical Field

[0001] The present invention relates to the field of equipment control technology, and more specifically, to a thermoelectric refrigerator adaptive temperature control system and method based on transient undercooling. Background Art

[0002] As the integration and miniaturization of electronic devices continue to increase, the heat dissipation problem becomes more prominent, which seriously restricts the performance and reliability of electronic devices. In recent years, thermoelectric coolers (TECs) have shown great potential in the field of active thermal management. TEC is an active heat dissipation and temperature control device based on the Peltier effect, which can achieve directional heat transport and active cooling. TEC has the advantages of miniaturized structure, high temperature control accuracy, fast response speed, high cooling power density, and no moving parts. It has been widely used in the fields of refrigeration and precise temperature control.

[0003] At present, the maximum zT value of thermoelectric materials working near room temperature has long been stagnant at 1.0, causing the maximum temperature difference of single-stage TEC in commercial applications to hover around 70K near room temperature. At the same time, the maximum cooling power density of the device depends on the material properties and the structural design of the device. Due to the limitations of processing and packaging technology, the maximum steady-state cooling power density of conventional commercial devices is generally 10W / cm 2 Because the short-time pulse power of the latest laser chips and high-power chips is as high as 50W / cm 2 At the same time, the heat load of electronic devices changes dynamically, so the existing TEC steady-state cooling capacity is difficult to meet the short-term temperature control requirements of ultra-high power chips.

[0004] Compared with the steady-state cooling mode, the transient cooling mode (transient pulse supercooling) of TEC deserves more attention in practical applications. When a current pulse higher than the optimal steady-state current is applied, the high response rate of Peltier heat and the low diffusion rate of volume Joule heat will form a transient pulse supercooling effect, which can break through the limitations of material properties and obtain millisecond-level response speed, cooling density and cooling temperature difference far exceeding steady-state operation, and is expected to be widely used in dynamic and precise temperature control of electronic devices.

[0005] For a long time, people have conducted comprehensive research on the effect of current pulses on transient supercooling characteristics, but these studies usually stay at the preset fixed current. However, under actual operating conditions, the temperature and heat load change dynamically, and a complete control strategy for TEC under transient operating mode has not yet been formed, which seriously restricts the widespread practical application of the transient supercooling effect. In addition, in order to ensure the normal operation of TEC within a safe range, it is usually necessary to add a current limiting link to the controller output to prevent the device temperature from getting out of control and being damaged. The existing technology uses the optimal current corresponding to the steady-state maximum cooling capacity as the limiting value, which has shortcomings such as temperature control hysteresis and limited cooling capacity.

[0006] For example, patent application CN1453674A discloses a high-precision temperature control circuit for thermoelectric coolers. The PID controller of this solution compares the temperature setting signal with the collected temperature signal, and the differential signal is processed by PID operation to generate a TEC control signal, which is sent to the power driver to drive the TEC to control the temperature. For another example, patent applications CN105607675A and CN204832991U are based on traditional PID control, but the output of this control strategy is limited to below the steady-state optimal current, and the transient overcooling effect is not triggered, resulting in limited TEC resistance to heat load and insufficient temperature control accuracy.

[0007] In summary, thermoelectric transient supercooling can break through the limitations of material properties and obtain cooling performance far exceeding that in steady state, and has great potential in active thermal management of high-power electronic devices. At present, research on the effect of current pulses on transient supercooling characteristics remains at the preset fixed current. However, under actual operating conditions, the temperature and heat load change dynamically, and a complete control strategy for TEC under transient operation mode has not yet been formed, which seriously restricts the widespread practical application of transient supercooling effect. In addition, in order to ensure the normal operation of TEC within a safe range, it is usually necessary to add a current limiting link to the controller output to prevent the device temperature from getting out of control and being damaged. The existing optimal current corresponding to the maximum steady-state cooling capacity is used as the limiting value, which has shortcomings such as temperature control hysteresis and refrigeration capacity limitations. Therefore, there is an urgent need for a TEC transient control strategy that can withstand extremely large heat loads and has high temperature control accuracy. Summary of the invention

[0008] The object of the present invention is to overcome the above-mentioned defects of the prior art and to provide a thermoelectric refrigerator adaptive temperature control system and method based on transient undercooling.

[0009] According to a first aspect of the present invention, a thermoelectric cooler adaptive temperature control system based on transient undercooling is provided. The system comprises: a temperature detection unit, a heat load monitoring unit, a limit output unit, a power output unit, a thermoelectric cooler, a PID controller, a transient pulse controller and a feedforward controller; wherein:

[0010] The temperature detection unit is used to obtain the cold end temperature information of the thermoelectric cooler;

[0011] The heat load monitoring unit is used to monitor the heat load information of the thermoelectric cooler;

[0012] The PID controller takes controlling the cold end temperature of the thermoelectric cooler at a target temperature as an optimization goal, and uses the cold end temperature information to adjust and output a first current;

[0013] The transient pulse controller regulates the limiting current based on the thermal load information;

[0014] The feedforward controller adjusts the advance control current based on the thermal load information and outputs a second current;

[0015] The amplitude limiting output unit increases the total current output amplitude of the first current and the second current to within the amplitude limiting current according to the amplitude limiting current generated by the transient pulse controller;

[0016] The power output unit is used to drive the thermoelectric cooler based on the current generated by the limiting output unit.

[0017] According to a second aspect of the present invention, a method for adaptive temperature control of a thermoelectric refrigerator based on transient undercooling is provided. The method comprises:

[0018] Obtain cold end temperature information and heat load information of the thermoelectric cooler;

[0019] Taking controlling the cold end temperature of the thermoelectric cooler at a target temperature as an optimization goal, using the cold end temperature information to regulate the PID controller to output a first current;

[0020] Based on the thermal load information, the limiting current is adjusted to obtain the limiting current corresponding to the transient pulse controller;

[0021] Adjust the advance control current based on the thermal load information to obtain a second current output by the feedforward controller;

[0022] According to the limiting current generated by the transient pulse controller, the total current output limit of the first current and the second current is increased to within the limiting current;

[0023] The thermoelectric cooler is driven based on the current generated by the limiting output unit.

[0024] Compared with the prior art, the advantage of the present invention is that, in order to solve the problem of adaptive and precise temperature control of thermoelectric coolers (TECs) under extremely large heat loads, an adaptive temperature control strategy for thermoelectric coolers based on transient undercooling is proposed, and the control strategy consists of PID control, transient pulse control, and feedforward control. By introducing the transient undercooling effect, the ability of TEC to resist heat load can be significantly improved, and the feedforward control can be advanced to further improve the temperature control accuracy and stability. The present invention provides important reference value for the practical application of the transient undercooling effect of TEC and the precise temperature control of high-power electronic devices.

[0025] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0027] Figure 1 is a block diagram of a thermoelectric cooler adaptive temperature control system based on transient undercooling according to an embodiment of the present invention;

[0028] Figure 2 is a schematic diagram of a change curve of a maximum steady-state cooling capacity and a corresponding optimal current of a thermoelectric cooler and a real-time transient cooling capacity of the thermoelectric cooler according to an embodiment of the present invention;

[0029] Figure 3 is a schematic diagram of a high-speed parallel processing process according to an embodiment of the present invention;

[0030] Figure 4 It is a comparison chart of temperature control results of the traditional PID control strategy and the control strategy of the present invention when the ultra-large heat load width is 40ms according to an embodiment of the present invention. DETAILED DESCRIPTION

[0031] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0032] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0033] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0034] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0035] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0036] See also Figure 1 As shown, the provided thermoelectric cooler adaptive temperature control system based on transient undercooling generally includes: a temperature acquisition unit, a heat load monitoring unit, a main control digital chip (not shown), a limiting output unit, a power output unit and a TEC.

[0037] The temperature acquisition unit includes a temperature sensor and an A / D conversion module, which is used to collect the cold end temperature of the TEC and transmit the temperature signal to the main control digital chip.

[0038] The thermal load monitoring unit is used to obtain the operating frequency or excitation signal of the laser chip, high-power power chip or other high-power devices in real time, and then convert it into a thermal load signal and transmit it to the main control digital chip.

[0039] The main control digital chip mainly runs algorithms such as PID controller, transient pulse controller and feedforward controller. The calculation results are processed by limiting output and then transmitted to the power output unit. For example, the power output unit includes a D / A conversion module and a power amplifier. The power output unit receives the output digital signal from the main control digital chip, and then D / A converts it into an analog signal, which then drives the TEC to work after passing through the power amplifier.

[0040] In general, in the process of constructing the algorithm and parameters of the main control digital chip, the current parameterization scan is first performed to measure the maximum steady-state cooling capacity Q of the TEC. c，max , and get the corresponding optimal current I opt ; Then, based on the maximum steady-state cooling capacity, a pulse current P×I is applied opt (P>1) and obtain the real-time cooling capacity, and then fit the relationship between the real-time cooling capacity and current pulse of the TEC transient pulse through a polynomial equation, and import the regular equation into the transient pulse controller algorithm to limit the current output and trigger the transient overcooling effect. The PID controller adopts proportional and integral links, and its parameters can be obtained through simulation or manual setting, and the collected temperature is the feedback signal; the feedforward control adopts a proportional link, and its parameters are also determined by simulation or manual adjustment, and open-loop control is performed according to the heat load signal to achieve advanced control. Compared with traditional control strategies, the present invention can trigger transient overcooling and advanced temperature control under short-term ultra-large heat loads, thereby greatly improving the accuracy and stability of thermoelectric temperature control.

[0041] In one embodiment, the temperature acquisition unit includes a temperature sensor and an A / D conversion module. The temperature sensor can be a thermocouple, thermistor, thermopile or other sensor, placed at the cold end of the TEC to detect the temperature, and transmit the detected analog signal to the A / D conversion module. The A / D conversion module can select AD9680, ADS54J60 or other models of high-speed and high-resolution ADC chips, and the temperature analog signal is converted into a digital signal by A / D conversion and transmitted to the main control digital chip.

[0042] The thermal load monitoring unit obtains the operating frequency or excitation signal of the laser chip, high-power chip or other high-power devices in real time, and then converts it into a thermal load signal and transmits it to the main control digital chip.

[0043] The main control digital chip adopts DSP or FPGA chip which can process in parallel at high speed, and mainly runs algorithms such as PID controller, transient pulse controller and feedforward controller.

[0044] In one embodiment, the PID controller uses a position PID, whose feedback signal is connected to the temperature acquisition unit, and the target temperature and the real-time temperature are subtracted, and the current output is adjusted in real time to make the TEC cold end temperature reach the target value, ensuring high-precision temperature control in the normal operation mode. For example, the PID controller algorithm is expressed as:

[0045]

[0046] Where, e(t) is the difference between the real-time temperature and the target temperature, K p is the proportional link parameter, K i is the integral link parameter, K d is the differential link parameter, T t is the integral anti-saturation time constant. The above parameters are obtained through simulation or manual tuning, and t is the sampling time.

[0047] In order to facilitate the algorithm to run on the main control digital chip, the output of the PID controller is further discretized as:

[0048]

[0049] Among them, i is the sampling number, I PID (i) is the output value at sampling time i, e(i) is the error value at sampling time i, e(i-1) is the error value at sampling time i-1, and f is the sampling frequency of the temperature sensor.

[0050] Signal input of transient pulse controller and thermal load monitoring Q load(t) connection, when the high-power device generates a large heat load, the limit output can be adjusted to increase the current output, thereby ensuring that transient overcooling is triggered to suppress temperature rise. For example, the control algorithm of the transient pulse controller is expressed as:

[0051] I max (t) = I opt P(t) (3)

[0052] Among them, I opt is the optimal steady-state current. By current parameterization scanning, the current corresponding to the maximum steady-state cooling capacity of TEC is measured, which is the optimal current. Figure 2 (a). The pulse amplitude P(t) is the real-time heat load Q load The polynomial function corresponding to (t) is in the form of P(t) = a0 + a1 × Q load (t)+a2×Q load (t) 2 +a3×Q load (t) 3 +a4×Q load (t) 4 Based on the maximum steady-state cooling capacity, a pulse current P×I is applied. opt (P>1) and obtain the real-time cooling capacity, in terms of Q load is the maximum characteristic intersection point of cooling capacity and heat load, such as Figure 2 As shown in (b), by changing the pulse current P value, the corresponding Q load The coefficients of the above polynomial function can be obtained by performing multiple fitting.

[0053] The signal input of the feedforward controller and the thermal load monitoring Q load (t) connection, directly adjust the current in time according to the thermal load signal generated by the high-power device, realize advanced regulation, and improve the response speed of the control system. For example, the sampling ratio link of the feedforward controller, the algorithm is expressed as:

[0054] I FF (t) = K load Q load (t) (4)

[0055] Among them, K load It is a proportional link parameter, which is obtained through simulation or manual tuning, and ensures that the dynamic performance of the controller meets the requirements and eliminates the lag of system temperature control.

[0056] The limit output unit generates the I max , instantly increasing the total current output limit generated by the PID controller and the feedforward controller to I max Within.

[0057] The power output unit includes a D / A conversion module and a power amplifier. The output current should be consistent with the current output value calculated by the main control digital chip. The D / A conversion module can select AD5440YRUZ, LTC2757 or other types of current-type high-speed and high-resolution DAC chips. The D / A conversion module can convert the digital current signal generated by the main control digital chip into a continuous current analog signal and transmit it to the power amplifier. The power amplifier can use a crystal triode power module, a MOS integrated power module, etc., connected to the output of the D / A conversion module to amplify the current and drive the TEC to work.

[0058] TEC is a thermoelectric cooler. When the current is connected, it will produce the Peltier effect at the cold end and the hot end, thereby realizing directional heat transport and active cooling.

[0059] In one embodiment, the provided thermoelectric cooler adaptive temperature control strategy based on transient undercooling uses high-speed parallel processing, such as Figure 3 As shown. High-speed parallel processing is suitable for DSP or FPGA chips. After the chip is initialized, five tasks, including real-time temperature acquisition, heat load signal acquisition, PID control calculation, feedforward control calculation, and transient pulse control calculation, are processed in parallel, and the data results of each task are cached. During this period, the D / A chip is always ready to output analog signals in time according to the cached data. This program flow can increase the data sampling and calculation rate to meet the high response speed requirements of thermoelectric transient temperature control.

[0060] To further verify the effect of the present invention, the temperature control effect of the control strategy of the present invention when the maximum heat load width is 40ms is verified. Figure 4 As shown in the figure. The cold end of TEC is connected to the self-heating block, and the hot end is connected to the heat sink; the temperature of the hot end is set at 323K, and the target temperature of the cold end is set at 300K. First, the maximum cooling capacity of TEC Q is measured by steady-state current scanning. c，max 13.02W / cm 2 , the corresponding optimal current I opt is 5.2A; then apply pulse current P×I opt (P>1) and obtain the real-time cooling capacity, in terms of Q load is the maximum characteristic intersection point of cooling capacity and heat load; changing the pulse current P value, the corresponding Q load Value, polynomial fitting is performed to obtain the equation:

[0061] P(t)=24.11776-5.44262×Q load (t)+0.46947×Q load (t) 2 -0.01763×Q load (t) 3 +2.46514e-4 ×Q load (t) 4

[0062] Next, the above I opt and P(t) are substituted into the transient pulse controller formula (3); in addition, the parameters of the PID controller (formula (2)) and the feedforward controller (formula (4)) are obtained by manual parameter tuning as K p =25A / K, K i =88A / (K·s), K d =0A·s / K, T t =0.5s, f=1KHZ, K load =0.5A·cm 2 / W. It can be seen intuitively that the pulse heat load increases to 44.00W / cm in 2.0s 2 When the temperature of the traditional PID control strategy soars to 308.53K, that is, it is increased to 3.38 times of the maximum steady-state cooling capacity, the temperature of the control strategy of the present invention soars to 308.53K, while the temperature fluctuation of the control strategy of the present invention is still controlled within 0.5K; compared with the traditional PID control strategy, the peak temperature of the control strategy of the present invention is reduced by 8.13K; this shows that the control strategy of the present invention can trigger transient overcooling and advanced temperature regulation under a short-term ultra-large heat load, thereby greatly improving the thermoelectric temperature control accuracy and stability.

[0063] In summary, in view of the drawbacks of the TEC temperature control strategy in the prior art, the adaptive temperature control strategy of the thermoelectric cooler based on transient undercooling proposed in the present invention can significantly improve the TEC's ability to resist thermal load by introducing the transient undercooling effect, and further improve the temperature control accuracy and stability through feedforward control, which provides important reference value for the practical application of the TEC transient undercooling effect and the precise temperature control of high-power electronic devices.

[0064] The present invention may be a system, a method and / or a computer program product. The computer program product may include a computer-readable storage medium carrying computer-readable program instructions for causing a processor to implement various aspects of the present invention.

[0065] Computer readable storage medium can be a tangible device that can hold and store instructions used by an instruction execution device. Computer readable storage medium can be, for example, but not limited to, an electrical storage device, a magnetic storage device, an optical storage device, an electromagnetic storage device, a semiconductor storage device, or any suitable combination thereof. More specific examples (non-exhaustive list) of computer readable storage medium include: a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), a static random access memory (SRAM), a portable compact disk read-only memory (CD-ROM), a digital versatile disk (DVD), a memory stick, a floppy disk, a mechanical encoding device, for example, a punch card or a convex structure in a groove on which instructions are stored, and any suitable combination thereof. The computer readable storage medium used here is not interpreted as a transient signal itself, such as a radio wave or other freely propagating electromagnetic wave, an electromagnetic wave propagated by a waveguide or other transmission medium (for example, a light pulse by an optical fiber cable), or an electrical signal transmitted by a wire.

[0066] The computer-readable program instructions described herein can be downloaded from a computer-readable storage medium to each computing / processing device, or downloaded to an external computer or external storage device via a network, such as the Internet, a local area network, a wide area network, and / or a wireless network. The network can include copper transmission cables, optical fiber transmissions, wireless transmissions, routers, firewalls, switches, gateway computers, and / or edge servers. The network adapter card or network interface in each computing / processing device receives the computer-readable program instructions from the network and forwards the computer-readable program instructions for storage in the computer-readable storage medium in each computing / processing device.

[0067] The computer program instructions for performing the operation of the present invention may be assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-dependent instructions, microcode, firmware instructions, state setting data, or source code or object code written in any combination of one or more programming languages, including object-oriented programming languages, such as Smalltalk, C++, Python, etc., and conventional procedural programming languages, such as "C" language or similar programming languages. Computer-readable program instructions may be executed entirely on a user's computer, partially on a user's computer, as an independent software package, partially on a user's computer, partially on a remote computer, or entirely on a remote computer or server. In the case of a remote computer, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., using an Internet service provider to connect via the Internet). In some embodiments, an electronic circuit, such as a programmable logic circuit, a field programmable gate array (FPGA), or a programmable logic array (PLA), may be personalized by utilizing the state information of the computer-readable program instructions, and the electronic circuit may execute the computer-readable program instructions, thereby realizing various aspects of the present invention.

[0068] Various aspects of the present invention are described herein with reference to the flow charts and / or block diagrams of the methods, devices (systems) and computer program products according to embodiments of the present invention. It should be understood that each box of the flow chart and / or block diagram and the combination of each box in the flow chart and / or block diagram can be implemented by computer-readable program instructions.

[0069] These computer-readable program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, thereby producing a machine, so that when these instructions are executed by the processor of the computer or other programmable data processing device, a device that implements the functions / actions specified in one or more boxes in the flowchart and / or block diagram is generated. These computer-readable program instructions can also be stored in a computer-readable storage medium, and these instructions cause the computer, programmable data processing device, and / or other equipment to work in a specific manner, so that the computer-readable medium storing the instructions includes a manufactured product, which includes instructions for implementing various aspects of the functions / actions specified in one or more boxes in the flowchart and / or block diagram.

[0070] Computer-readable program instructions may also be loaded onto a computer, other programmable data processing apparatus, or other device so that a series of operating steps are performed on the computer, other programmable data processing apparatus, or other device to produce a computer-implemented process, thereby causing the instructions executed on the computer, other programmable data processing apparatus, or other device to implement the functions / actions specified in one or more boxes in the flowchart and / or block diagram.

[0071] The flowcharts and block diagrams in the accompanying drawings show the possible architecture, functions and operations of the systems, methods and computer program products according to multiple embodiments of the present invention. In this regard, each box in the flowchart or block diagram can represent a module, a program segment or a part of an instruction, and the module, a program segment or a part of an instruction contains one or more executable instructions for realizing the specified logical function. In some alternative implementations, the functions marked in the box can also occur in a different order from the order marked in the accompanying drawings. For example, two consecutive boxes can actually be executed substantially in parallel, and they can sometimes be executed in the opposite order, depending on the functions involved. It should also be noted that each box in the block diagram and / or the flowchart, and the combination of the boxes in the block diagram and / or the flowchart can be implemented by a dedicated hardware-based system that performs the specified function or action, or can be implemented by a combination of dedicated hardware and computer instructions. It is well known to those skilled in the art that it is equivalent to implement it by hardware, implement it by software, and implement it by combining software and hardware.

[0072] Embodiments of the present invention have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or technical improvements in the marketplace, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein. The scope of the present invention is defined by the appended claims.

Claims

1. A thermoelectric refrigerator adaptive temperature control system based on transient undercooling, comprising: Temperature detection unit, heat load monitoring unit, limit output unit, power output unit, thermoelectric cooler, PID controller, transient pulse controller and feedforward controller; wherein: The temperature detection unit is used to obtain the cold end temperature information of the thermoelectric cooler; The heat load monitoring unit is used to monitor the heat load information of the thermoelectric cooler; The PID controller takes controlling the cold end temperature of the thermoelectric cooler at a target temperature as an optimization goal, and uses the cold end temperature information to adjust and output a first current; The transient pulse controller regulates the limiting current based on the thermal load information; The feedforward controller adjusts the advance control current based on the thermal load information and outputs a second current; The amplitude limiting output unit increases the total current output amplitude of the first current and the second current to within the amplitude limiting current according to the amplitude limiting current generated by the transient pulse controller; The power output unit is used to drive the thermoelectric cooler based on the current generated by the limiting output unit.

2. The system according to claim 1, characterized in that The output current of the PID controller is expressed as: Among them, I PID (t) is the output current of the PID controller at time t, e(t) is the difference between the real-time temperature of the cold end of the thermoelectric cooler and the target temperature, K p is the proportional link parameter, K i K is the integral part, d is the differential link parameter, T t is the integral anti-windup time constant.

3. The system according to claim 1, characterized in that The output of the transient pulse controller is expressed as: I max (t)=I opt P(t) Among them, I opt represents the optimal steady-state current. The pulse amplitude P(t) is a polynomial function corresponding to the real-time thermal load and is set to P(t) = a0 + a1 × Q load (t)+a2×Q load (t) 2 +a3×Q load (t) 3 +a4×Q load (t) 4 , a0, a1, a2, a3 and a4 are the polynomial coefficients, Q load (t) is the heat load monitoring value at time t.

4. The system according to claim 3, characterized in that The polynomial coefficients of the pulse amplitude P(t) are obtained according to the following steps: The maximum steady-state cooling capacity Q of the thermoelectric cooler is measured by current parametric sweep c，max , and get the corresponding optimal current I opt ; At the maximum steady-state cooling capacity Q c，max Based on the pulse current P×I opt , and obtain the real-time cooling capacity, where P>1; By changing the P value of the pulse current, the relationship between the real-time cooling capacity of the transient pulse of the thermoelectric cooler and the current pulse is fitted through a polynomial equation, and then the coefficients of the polynomial function are obtained by fitting.

5. The method according to claim 1, characterized in that The output of the feedforward controller is expressed as: I FF (t)=K load Q load (t) Among them, K load is the proportional link parameter, Q load (t) is the heat load monitoring value at time t.

6. The system according to claim 1, characterized in that The PID controller, the transient pulse controller and the feedforward controller are arranged on a main control digital chip, and the main control digital chip processes multiple tasks in parallel at the same time.

7. The system according to claim 6, characterized in that The power output unit includes a D / A conversion module and a power amplifier. The D / A conversion module is used to convert the digital current signal generated by the main control digital chip into a continuous current analog signal and transmit it to the power amplifier; the temperature detection unit includes a temperature sensor and an A / D conversion module. The temperature sensor is placed at the cold end of the thermoelectric cooler to detect the temperature, and transmits the detected temperature analog signal to the A / D conversion module, which is converted into a temperature digital signal and then transmitted to the main control digital chip.

8. The system according to claim 7, characterized in that The main control digital chip is a DSP or FPGA chip; the temperature sensor is a thermocouple, a thermistor or a thermopile sensor; the power amplifier adopts a crystal triode power module or a MOS integrated power module.

9. A thermoelectric cooler adaptive temperature control method based on the system according to any one of claims 1 to 8, comprising: Obtain cold end temperature information and heat load information of the thermoelectric cooler; Taking controlling the cold end temperature of the thermoelectric cooler at a target temperature as an optimization goal, using the cold end temperature information to regulate the PID controller to output a first current; Based on the thermal load information, the limiting current is adjusted to obtain the limiting current corresponding to the transient pulse controller; Adjust the advance control current based on the thermal load information to obtain a second current output by the feedforward controller; According to the limiting current generated by the transient pulse controller, the total current output limit of the first current and the second current is increased to within the limiting current; The thermoelectric cooler is driven based on the current generated by the limiting output unit.

10. A computer-readable storage medium having a computer program stored thereon, wherein: When the computer program is executed by a processor, the steps of the method according to claim 9 are implemented.

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