Silicon wafer drying furnace with automatic conveying mechanism

Abstract

The invention discloses a silicon wafer drying furnace with an automatic conveying mechanism, the silicon wafer drying furnace comprises a furnace body, support columns are welded around the bottom end face of the furnace body, a support is arranged below the bottom of the furnace body, two sides of the support are respectively welded and fixed with the two support columns, a plurality of rolling shafts are installed in the support at equal intervals, and the rolling shafts are connected with the furnace body. A conveyor body is connected to the support in a threaded mode, the other end of the conveyor body is fixedly connected with the other two supporting columns in a threaded mode, driving frames are connected to the outer walls of the two supporting columns in a threaded mode, driving devices are arranged on the driving frames, a plurality of supporting plates are connected to the driving devices in a threaded mode at equal intervals, and first belt wheels are arranged at the bottoms of the driving frames. According to the silicon wafer drying furnace with the automatic conveying mechanism, a worker does not need to make contact with the furnace body in the using process, the phenomenon that the worker touches the furnace body and scalds when placing the tray manually is avoided, safety is improved, and meanwhile the working efficiency of equipment is improved through automatic conveying.

Description

Technical Field

[0001] The invention relates to the technical field of silicon wafer processing, and more specifically, to a silicon wafer drying furnace with an automatic conveying mechanism. Background Art

[0002] Silicon wafers are thin sheets or sheet substrates made of high-purity silicon materials. Silicon wafers are the core material of photovoltaic cells. With the rapid development of the photovoltaic industry, the demand for photovoltaic silicon wafers continues to grow. At the same time, silicon wafers are important materials for making integrated circuits and various semiconductor devices. They are widely used in aviation, aerospace, industry, agriculture and other fields. As the basic material of the modern electronics industry, silicon wafers play a vital role in the photovoltaic and semiconductor fields. Drying furnaces are usually used in the processing and cleaning of silicon wafers. The use of drying furnaces can effectively remove residual moisture during the cleaning process to avoid its negative impact on subsequent processes and product quality.

[0003] The prior art with application number CN201810042520.7 discloses a circulating heating drying furnace, which states that "it includes a drying furnace body, a circulating inner wall, a temperature sensor, a circulating air inlet, a dust filter, a heating layer, a circulating air outlet, a lower placement layer, a pressure-resistant layer, an upper placement layer, a humidity sensor, a display screen and an air volume controller, wherein the outer ring of the drying furnace body is provided with a circulating inner wall, the upper left side of the drying furnace body is provided with a circulating air inlet, the lower part of the circulating air inlet is provided with a dust filter, the lower part of the drying furnace body is provided with a heating layer, and the A circulating air outlet is arranged on the right side of the heating layer, a lower placement layer is arranged above the heating layer, a pressure-resistant layer is arranged above the lower placement layer, an upper placement layer is arranged above the pressure-resistant layer, a display screen is arranged on the right side of the drying furnace body, and an air volume controller is arranged below the display screen. The invention adopts a structural design in which the airflow can circulate inside, so that the heat flow can circulate to dry and heat the mold accessories, thereby saving energy. The double-layer design enables more mold accessories to be dried at one time, and the double-layer space is large, and the drying efficiency is high. The invention has the characteristics of simple structure, energy saving, labor saving, etc.

[0004] However, in the prior art, during the drying process, it is necessary to manually place the tray containing silicon wafers into the furnace body. In order to improve the drying effect of the furnace body, it is usually necessary to preheat it before use. When placing the tray manually, it is easy to touch the furnace body and cause burns, which is dangerous. Therefore, it is necessary to design a silicon wafer drying furnace with an automatic conveying mechanism. Summary of the invention

[0005] In view of the deficiencies in the prior art, the present invention aims to provide a silicon wafer drying furnace with an automatic conveying mechanism.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A silicon wafer drying furnace with an automatic conveying mechanism comprises a furnace body, pillars are welded around the bottom end surface of the furnace body, a bracket is arranged below the bottom of the furnace body, and the two sides of the bracket are respectively welded and fixed to two pillars, a plurality of rollers are equidistantly installed inside the bracket, a conveyor body is screwed on the bracket, and the other end of the conveyor body is screwed and fixed to the other two pillars, a driving frame is screwed on the outer walls of the two pillars, and a driving device is arranged on the driving frame, a plurality of supporting plates are screwed on the driving device at equal intervals, a first pulley is arranged at the bottom of the driving frame, a motor frame is screwed on one of the driving frames, and a reduction motor is screwed on the motor frame, a cross plate is welded between the two driving frames, and two rollers are mounted on the cross plate through a rotating shaft. The second pulley is provided with a driving belt, and the other end of the driving belt is provided on the second pulley on the same side, a spur gear is welded on the outer wall of the second pulley, and the two spur gears are meshed with each other, a support plate is welded between the two driving frames, a first bevel gear is welded on the outer wall of one of the spur gears, a transmission rod is inserted in the center of the support plate, and a second bevel gear is welded at one end of the bottom of the transmission rod, the second bevel gear and the first bevel gear are meshed with each other, a pair of limit plates are welded on the transmission rod, and the two limit plates are respectively located at the top and bottom of the support plate, a push plate is welded at one end of the top of the transmission rod, and a plastic strip is glued to the periphery of the push plate, a pair of moving grooves are opened at the bottom of the inner wall of the furnace body, and an electric wheel is arranged in the moving groove

[0008] Furthermore, the driving device is composed of a conveyor belt, a driving roller and a driven roller, the output end of the reduction motor is fixedly connected to one of the driving rollers through a coupling, one of the first pulleys is welded to the output end of the reduction motor, the other first pulley is welded and fixed to one end of the driving roller, and the support plate is fixed on the conveyor belt.

[0009] Furthermore, the electric wheel is a wheel driven by a motor, the movable groove is semicircular, and the bottom of the electric wheel is hidden in the movable groove, the push plate is fan-shaped, and both sides of the push plate are rounded.

[0010] Furthermore, a guide plate is welded to the bottom of one end of the furnace body, and a plurality of through holes are equidistantly provided on the guide plate. The guide plate is inclined, and the lower side of the guide plate is flush with the top of the support plate.

[0011] Furthermore, a heating rack is screwed on the top of the inner wall of the furnace body, and an electric heating tube is screwed inside the heating rack, an electric box is screwed on the bottom end face of the furnace body, and a controller is screwed on one side of the outer wall of the furnace body.

[0012] Furthermore, a door is hinged at the top of one end of the furnace body, and an observation window is provided on the door. A handle is welded on the door, and an electronic thermometer is screwed on the door, and the temperature sensing end of the electronic thermometer is located on the inner side of the door.

[0013] Furthermore, an exhaust fan is screwed on the other end of the furnace body, and a cooling box is screwed on the bottom of the exhaust fan, a delivery pipe is plugged on the output end of the exhaust fan, a serpentine pipe is screwed on the interior of the cooling box, and the other end of the delivery pipe passes through the cooling box and is plugged and connected with one end of the serpentine pipe, a radiator is screwed on the interior of the cooling box, and a heat conducting plate is glued on the radiator, the heat conducting plate is fitted with the outer wall of the serpentine pipe, a heat dissipation fan is screwed on the cooling box, an exhaust pipe is plugged on the bottom of the cooling box, and one end of the exhaust pipe is plugged and connected with the other end of the serpentine pipe, a dehumidification box is screwed on the bottom end face of the furnace body, and the other end of the exhaust pipe extends into the dehumidification box, a number of absorbent cloths are screwed on the interior of the dehumidification box at equal intervals, an air outlet rack is screwed on the bottom end face of the furnace body, and the air inlet end of the air outlet rack is plugged and connected with the dehumidification box.

[0014] Furthermore, the serpentine tube is made of metal material, and a plurality of heat dissipation holes are provided on the outer walls on both sides of the cooling box, and the heat dissipation holes are located outside the radiator.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. The present invention places the trays with silicon wafers on the conveyor body in sequence, uses the conveyor body to transport the trays to the rollers, drives a first pulley to rotate through a reduction motor, and the first pulley drives the second pulley to rotate through a driving belt. When the second pulley rotates, it drives the spur gear to rotate synchronously. By utilizing the meshing effect of the two spur gears, another second pulley can be rotated. Under the action of another driving belt, another first belt can be rotated synchronously. When the first pulley rotates, it drives the driving device to operate, so that the pallet is lifted from the bottom of both sides of the tray with silicon wafers and transported to the drive frame. At the top, a second pulley rotates to drive the first bevel gear to rotate. The meshing effect of the first bevel gear and the second bevel gear can be used to make the transmission rod drive the push plate to rotate. When the tray rises to the top, one side of the push plate will fit with the tray. As the push plate rotates, the tray will be pushed into the furnace body, and the tray can be guided into the furnace body by the guide plate. The tray can be transported into the furnace body by rotating the electric wheel. During this process, there is no need for workers to contact the furnace body, which avoids manual contact with the furnace body when placing the tray and causing burns, thereby improving safety. At the same time, automated transportation improves the working efficiency of the equipment.

[0017] 2. The state of the silicon wafer can be observed through the observation window during the drying period. The electronic thermometer can be used to monitor the problems in the furnace in real time for easy adjustment. After the drying is completed, the hot air in the furnace can be extracted through the exhaust fan to prevent scalding caused by hot air when the door is opened. The hot air is discharged into the serpentine tube through the conveying pipe. The heat conduction plate and the radiator can be used to absorb heat and exchange heat for cooling. The heat in the cooling box can be quickly extracted through the heat dissipation fan, which is beneficial to improve the cooling effect. The cooled air will enter the dehumidification box through the exhaust pipe. The moisture generated after cooling can be absorbed by the absorbent cloth. The gas will be discharged to the outside through the air outlet rack, and the tray can be cooled when the silicon wafer is taken out. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is an overall isometric view of a silicon wafer drying furnace with an automatic conveying mechanism;

[0019] Figure 2 It is a schematic diagram of the overall structure of a silicon wafer drying furnace with an automatic conveying mechanism;

[0020] Figure 3 It is a schematic diagram of the bottom structure of a silicon wafer drying furnace with an automatic conveying mechanism;

[0021] Figure 4 for Figure 3 A magnified view of the structure;

[0022] Figure 5 It is a schematic diagram of the back structure of a silicon wafer drying furnace with an automatic conveying mechanism;

[0023] Figure 6 The figure is an overall cross-sectional view of a silicon wafer drying furnace with an automatic conveying mechanism.

[0024] 1. Furnace body; 2. Pillar; 3. Bracket; 4. Roller; 5. Conveyor body; 6. Drive frame; 7. Drive device; 8. Support plate; 9. First pulley; 10. Motor frame; 11. Speed ​​reducer motor; 12. Horizontal plate; 13. Second pulley; 14. Driving belt; 15. Spur gear; 16. Support plate; 17. First bevel gear; 18. Transmission rod; 19. Limit plate; 20. Second bevel gear; 21. Push plate; 22. Plastic strip; 23. Moving groove; 2 4. Electric wheel; 25. Guide plate; 26. Through hole; 27. Heating rack; 28. Electric heating tube; 29. ​​Electric box; 30. Controller; 31. Box door; 32. Observation window; 33. Handle; 34. Electronic thermometer; 35. Exhaust fan; 36. Cooling box; 37. Delivery pipe; 38. Serpentine pipe; 39. Radiator; 40. Heat conduction plate; 41. Cooling fan; 42. Exhaust pipe; 43. Dehumidification box; 44. Absorbent cloth; 45. Air outlet rack; 46. Heat dissipation hole. DETAILED DESCRIPTION

[0025] Embodiment 1:

[0026] See also Figure 1-6 A silicon wafer drying furnace with an automatic conveying mechanism comprises a furnace body 1, pillars 2 are welded around the bottom end surface of the furnace body 1, a bracket 3 is arranged below the bottom of the furnace body 1, and the two sides of the bracket 3 are respectively welded and fixed to two pillars 2, a plurality of rollers 4 are equidistantly installed inside the bracket 3, a conveyor body 5 is screwed on the bracket 3, and the other end of the conveyor body 5 is screwed and fixed to the other two pillars 2, a driving frame 6 is screwed on the outer walls of the two pillars 2, and a driving device 7 is arranged on the driving frame 6, a plurality of support plates 8 are screwed on the driving device 7 at equal intervals, a first pulley 9 is arranged at the bottom of the driving frame 6, and a A motor frame 10 is screwed onto the drive frame 6, and a reduction motor 11 is screwed onto the motor frame 10. A horizontal plate 12 is welded between the two drive frames 6, and two second pulleys 13 are installed on the horizontal plate 12 through a rotating shaft. A driving belt 14 is sleeved on the first pulley 9, and the other end of the driving belt 14 is sleeved on the second pulley 13 on the same side. A spur gear 15 is welded to the outer wall of the second pulley 13, and the two spur gears 15 are meshed with each other. A support plate 16 is welded between the two drive frames 6, and a first bevel gear 17 is welded to the outer wall of a spur gear 15. A transmission is plugged into the center of the support plate 16. The transmission rod 18 is welded with a second bevel gear 20 at one end of the bottom of the transmission rod 18, and the second bevel gear 20 and the first bevel gear 17 are meshed with each other. A pair of limit plates 19 are welded on the transmission rod 18, and the two limit plates 19 are respectively located at the top and bottom of the support plate 16. A push plate 21 is welded at one end of the top of the transmission rod 18, and a plastic strip 22 is glued to the periphery of the push plate 21. A pair of moving grooves 23 are opened at the bottom of the inner wall of the furnace body 1, and an electric wheel 24 is arranged in the moving groove 23. The driving device 7 is composed of a conveyor belt, a driving roller and a driven roller. The output end of the reduction motor 11 is connected to one of the The active roller is fixedly connected through a coupling, a first pulley 9 is welded to the output end of the reduction motor 11, and another first pulley 9 is welded and fixed to one end of the active roller. The support plate 8 is fixed to the conveyor belt, the electric wheel 24 is a wheel driven by the motor, the moving groove 23 is semicircular, and the bottom of the electric wheel 24 is hidden in the moving groove 23, the push plate 21 is fan-shaped, and both sides of the push plate 21 are rounded. A guide plate 25 is welded to the bottom of one end of the furnace body 1, and a plurality of through holes 26 are equidistantly opened on the guide plate 25, the guide plate 25 is inclined, and the lower side of the guide plate 25 is flush with the top of the support plate 16;

[0027] The trays with silicon wafers are placed on the conveyor body 5 in sequence, and the conveyor body 5 is used to transport the trays to the roller 4. The first pulley 9 is driven to rotate by the reduction motor 11. The first pulley 9 drives the second pulley 13 to rotate through the driving belt 14. When the second pulley 13 rotates, it drives the spur gear 15 to rotate synchronously. The meshing effect of the two spur gears 15 can make the other second pulley 13 rotate. Under the action of another driving belt 14, the other first pulley 9 can be rotated synchronously. When the first pulley 9 rotates, it drives the driving device 7 to operate, so that the pallet 8 lifts the tray with silicon wafers from the bottom of both sides and transports it to At the top of the driving frame 6, a second pulley 13 rotates to drive the first bevel gear 17 to rotate. The meshing effect of the first bevel gear 17 and the second bevel gear 20 can be used to make the transmission rod 18 drive the push plate 21 to rotate. The first bevel gear 17 and the second bevel gear 20 have different numbers of teeth. When the tray rises to the top, one side of the push plate 21 will fit with the tray. As the push plate 21 rotates, the tray will be pushed into the furnace body 1, and through the guidance of the guide plate 25, the tray can enter the furnace body 1. By rotating the electric wheel 24, the tray can be transported into the furnace body 1. The limit plate 19 is used to limit the position of the transmission rod 18, and the plastic strip 22 can protect the corner of the push plate 21.

[0028] Embodiment 2:

[0029] See also Figure 1-6, which is different from Example 1, is that a heating frame 27 is screwed on the top of the inner wall of the furnace body 1, and an electric heating tube 28 is screwed inside the heating frame 27, an electric box 29 is screwed on the bottom end face of the furnace body 1, a controller 30 is screwed on the outer wall of one side of the furnace body 1, a box door 31 is hinged on the top of one end of the furnace body 1, and an observation window 32 is provided on the box door 31, a handle 33 is welded on the box door 31, an electronic thermometer 34 is screwed on the box door 31, and the temperature sensing end of the electronic thermometer 34 is located on the inner side of the box door 31, an exhaust fan 35 is screwed on the other end of the furnace body 1, and a cooling box 36 is screwed on the bottom of the exhaust fan 35, a delivery pipe 37 is plugged into the output end of the exhaust fan 35, a serpentine pipe 38 is screwed inside the cooling box 36, and the other end of the delivery pipe 37 passes through the cooling box 36 and is connected to one end of the serpentine pipe 38 The ends are connected by plugging, a radiator 39 is screwed inside the cooling box 36, and a heat conducting plate 40 is glued on the radiator 39, and the heat conducting plate 40 is fitted with the outer wall of the serpentine tube 38, a heat dissipation fan 41 is screwed on the cooling box 36, an exhaust pipe 42 is plugged at the bottom of the cooling box 36, and one end of the exhaust pipe 42 is plugged and connected with the other end of the serpentine tube 38, a dehumidification box 43 is screwed on the bottom end face of the furnace body 1, and the other end of the exhaust pipe 42 extends into the dehumidification box 43, a number of absorbent cloths 44 are screwed equidistantly inside the dehumidification box 43, an air outlet frame 45 is screwed on the bottom end face of the furnace body 1, and the air inlet end of the air outlet frame 45 is plugged and connected with the dehumidification box 43, the serpentine tube 38 is made of metal material, and a number of heat dissipation holes 46 are opened on the outer walls of both sides of the cooling box 36, and the heat dissipation holes 46 are located outside the radiator 39;

[0030] The controller 30 is used to control the electrical equipment on the furnace body 1, and the electrical box 29 is used to supply power to the electrical equipment on the furnace body 1. By closing the box door 31, the silicon wafer can be dried by the electric heating tube 28. The state of the silicon wafer can be observed during the drying period through the observation window 32. The problem in the furnace body 1 can be monitored in real time by the electronic thermometer 34 for easy adjustment. After the drying is completed, the hot air in the furnace body 1 can be extracted by the exhaust fan 35, and the hot air can be discharged into the serpentine tube 38 by the conveying pipe 37. The heat can be absorbed and cooled by heat exchange by the heat conducting plate 40 and the radiator 39. The heat in the cooling box 36 can be quickly extracted by the heat dissipation fan 41, which is beneficial to improve the cooling effect. The cooled air will enter the dehumidification box 43 through the exhaust pipe 42, and the moisture generated after cooling can be absorbed by the absorbent cloth 44. The gas will be discharged to the outside through the air outlet rack 45. The tray can be cooled when the silicon wafer is taken out, and the heat dissipation hole 46 is used to dissipate heat from the radiator 39.

[0031] Working principle: The conveyor body 5, the reduction motor 11, the electric heating pipe 28, the controller 30, the electronic thermometer 34, the exhaust fan 35, the radiator 39 and the cooling fan 41 used in the present invention are all existing mature technologies, so they are not described in detail below. When in use, the trays with silicon wafers are placed on the conveyor body 5 in sequence, and the conveyor body 5 is used to transport the trays to the roller 4. The reduction motor 11 drives a first pulley 9 to rotate, and the first pulley 9 drives the second pulley 13 to rotate through the driving belt 14. When the second pulley 13 rotates, it drives the spur gear 15 synchronously. The meshing effect of the two spur gears 15 can make the other second pulley 13 rotate. Under the action of another driving belt 14, the other first pulley 9 can be rotated synchronously. When the first pulley 9 rotates, it will drive the driving device 7 to operate, so that the pallet 8 can lift the tray with silicon wafers from the bottom of both sides and transport it to the top of the driving frame 6. When the second pulley 13 rotates, it will drive the first bevel gear 17 to rotate. The meshing effect of the first bevel gear 17 and the second bevel gear 20 can make the transmission rod 18 drive the push plate 21 to rotate. The number of teeth of the first bevel gear 17 and the second bevel gear 20 are different. When the tray rises to the top, one side of the push plate 21 will fit with the tray. As the push plate 21 rotates, the tray will be pushed into the furnace body 1, and the tray can enter the furnace body 1 through the guidance of the guide plate 25. The tray can be transported into the furnace body 1 by rotating the electric wheel 24. The limit plate 19 is used to limit the position of the transmission rod 18. The plastic strip 22 can protect the corner of the push plate 21. By closing the box door 31, the electric heating tube 28 can be used to dry the silicon wafer. The state of the silicon wafer can be observed during the drying process through the observation window 32. The problem in the furnace body 1 can be monitored in real time by using the electronic thermometer 34, which is convenient for After adjustment and drying is completed, the hot air in the furnace body 1 can be extracted through the exhaust fan 35, and the hot air can be discharged into the serpentine tube 38 through the conveying pipe 37. The heat can be absorbed and cooled by heat conduction plate 40 and radiator 39. The heat in the cooling box 36 can be quickly extracted through the heat dissipation fan 41, which is beneficial to improve the cooling effect. The cooled air will enter the dehumidification box 43 through the exhaust pipe 42, and the moisture generated after cooling can be absorbed by the absorbent cloth 44. The gas will be discharged to the outside through the air outlet rack 45, and the tray can be cooled when the silicon wafer is taken out. The heat dissipation hole 46 is used to dissipate heat for the radiator 39.

[0032] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A silicon wafer drying furnace with an automatic conveying mechanism, comprising a furnace body (1), characterized in that: The bottom end surface of the furnace body (1) is welded with pillars (2) all around, a bracket (3) is provided below the bottom of the furnace body (1), and the two sides of the bracket (3) are respectively welded and fixed to the two pillars (2), a plurality of rollers (4) are equidistantly installed inside the bracket (3), a conveyor body (5) is screwed on the bracket (3), and the other end of the conveyor body (5) is screwed and fixed to the other two pillars (2), the outer walls of the two pillars (2) are screwed with drive frames (6), and the drive frames (6) are screwed to the outer walls of the two pillars (2). ) is provided with a driving device (7), a plurality of supporting plates (8) are equidistantly screwed on the driving device (7), a first belt pulley (9) is provided at the bottom of the driving frame (6), a motor frame (10) is screwed on one of the driving frames (6), and a reduction motor (11) is screwed on the motor frame (10), a transverse plate (12) is welded between the two driving frames (6), and two second belt pulleys (13) are installed on the transverse plate (12) through a rotating shaft, and a driving belt pulley (9) is sleeved on the first belt pulley (9). A belt (14) is provided, and the other end of the driving belt (14) is sleeved on a second pulley (13) on the same side, a spur gear (15) is welded on the outer wall of the second pulley (13), and the two spur gears (15) are meshed with each other, a support plate (16) is welded between the two driving frames (6), a first bevel gear (17) is welded on the outer wall of one of the spur gears (15), a transmission rod (18) is inserted in the center of the support plate (16), and a second bevel gear is welded at one end of the bottom of the transmission rod (18). (20), the second bevel gear (20) and the first bevel gear (17) are meshed with each other, a pair of limit plates (19) are welded on the transmission rod (18), and the two limit plates (19) are respectively located at the top and bottom of the support plate (16), a push plate (21) is welded at one end of the top of the transmission rod (18), and a plastic strip (22) is glued to the periphery of the push plate (21), and a pair of movable grooves (23) are opened at the bottom of the inner wall of the furnace body (1), and an electric wheel (24) is arranged in the movable groove (23).

2. The silicon wafer drying furnace with an automatic conveying mechanism according to claim 1, characterized in that: The driving device (7) is composed of a conveyor belt, a driving roller and a driven roller. The output end of the reduction motor (11) is fixedly connected to one of the driving rollers through a coupling. One of the first pulleys (9) is welded to the output end of the reduction motor (11), and the other first pulley (9) is welded and fixed to one end of the driving roller. The support plate (8) is fixed to the conveyor belt.

3. The silicon wafer drying furnace with an automatic conveying mechanism according to claim 1, characterized in that: The electric wheel (24) is a wheel driven by a motor, the moving groove (23) is semicircular, and the bottom of the electric wheel (24) is hidden in the moving groove (23), the push plate (21) is fan-shaped, and both sides of the push plate (21) are rounded.

4. The silicon wafer drying furnace with an automatic conveying mechanism according to claim 1, characterized in that: A guide plate (25) is welded to the bottom of one end of the furnace body (1), and a plurality of through holes (26) are equidistantly provided on the guide plate (25). The guide plate (25) is inclined, and the lower side of the guide plate (25) is flush with the top of the support plate (16).

5. The silicon wafer drying furnace with an automatic conveying mechanism according to claim 1, characterized in that: A heating frame (27) is screwed to the top of the inner wall of the furnace body (1), and an electric heating tube (28) is screwed inside the heating frame (27); an electric box (29) is screwed to the bottom end surface of the furnace body (1); and a controller (30) is screwed to the outer wall of one side of the furnace body (1).

6. The silicon wafer drying furnace with an automatic conveying mechanism according to claim 1, characterized in that: A door (31) is hingedly connected to the top of one end of the furnace body (1), and an observation window (32) is provided on the door (31). A handle (33) is welded to the door (31), and an electronic thermometer (34) is screwed to the door (31), and a temperature sensing end of the electronic thermometer (34) is located on the inner side of the door (31).

7. The silicon wafer drying furnace with an automatic conveying mechanism according to claim 1, characterized in that: The other end of the furnace body (1) is screwed with an exhaust fan (35), and a cooling box (36) is screwed below the bottom of the exhaust fan (35), a delivery pipe (37) is plugged into the output end of the exhaust fan (35), a serpentine pipe (38) is screwed inside the cooling box (36), and the other end of the delivery pipe (37) passes through the cooling box (36) and is plugged and connected to one end of the serpentine pipe (38), a radiator (39) is screwed inside the cooling box (36), and a heat conduction plate (40) is glued to the radiator (39), and the heat conduction plate (40) is in contact with the outer wall of the serpentine pipe (38). A heat dissipation fan (41) is screwed onto the cooling box (36), an exhaust pipe (42) is plugged into the bottom of the cooling box (36), and one end of the exhaust pipe (42) is plugged into and connected to the other end of the serpentine pipe (38), a dehumidification box (43) is screwed onto the bottom end face of the furnace body (1), and the other end of the exhaust pipe (42) extends into the dehumidification box (43), a plurality of absorbent cloths (44) are screwed into the interior of the dehumidification box (43) at equal intervals, an air outlet frame (45) is screwed onto the bottom end face of the furnace body (1), and the air inlet end of the air outlet frame (45) is plugged into and connected to the dehumidification box (43).

8. The silicon wafer drying furnace with an automatic conveying mechanism according to claim 7, characterized in that: The serpentine tube (38) is made of metal material. The outer walls on both sides of the cooling box (36) are provided with a plurality of heat dissipation holes (46), and the heat dissipation holes (46) are located outside the radiator (39).

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