800g optical module and high-precision packaging equipment and method thereof

Abstract

The application relates to the field of optical module production, and discloses an 800G optical module, and a high-precision packaging equipment and method thereof. The 800G optical module comprises a first shell provided with a buckle for connecting a second shell, the cross section of the first shell is in the shape of U; the second shell is used for connecting the first shell to form an outer shell of the 800G optical module; a working unit comprises a first intermediate plate, a second intermediate plate, a PCB plate and an MPO connector, a plurality of emitting units are arranged on the first intermediate plate, a plurality of receiving units are arranged on the second intermediate plate, the PCB plate is coupled with the first intermediate plate and the second intermediate plate respectively, and the plurality of receiving units, the plurality of emitting units and the MPO connector are connected through optical fibers; a heat sink unit is used for being connected with the second shell to respectively install and position the first intermediate plate, the second intermediate plate and the working unit, and the heat sink unit can be installed in the first shell for positioning. The 800G optical module can guarantee the assembly precision of the 800G optical module.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of optical module production, in particular to an 800G optical module and a high-precision packaging equipment and method thereof. BACKGROUND

[0002] The 800G optical module is an optical communication device for high-speed data transmission, which has excellent characteristics such as high bandwidth, high speed and high density. The 800G optical module is widely used in data centers, high-performance computing (HPC), cloud computing and 5G communication fields to meet the urgent needs of modern information society for high bandwidth and low delay data transmission. The 800G optical module not only supports traditional optical fiber communication technology, but also combines the latest optoelectronic devices and signal processing technology to ensure the efficiency and reliability of data transmission. The modular design of the 800G optical module makes installation and maintenance more convenient, which adapts to the rapidly changing data transmission needs.

[0003] Due to the high-speed data transmission characteristics of the 800G optical module, it is necessary to ensure the assembly precision and quality of the 800G optical module to avoid affecting the communication quality of the 800G optical module during assembly. Patent CN114515963B (application number: CN202210159418.1) provides a full-automatic optical module multi-process assembly equipment. The middle part of the processing table is provided with a driving tooth belt, the outer surface of the driving tooth belt is provided with a processing carrier plate, an automatic hydraulic push rod is fixedly installed on the upper surface of the processing table and located on both sides of the driving tooth belt, the output end of the automatic hydraulic push rod is fixedly installed with a triangular push block, the bottom of the processing carrier plate is provided with a rectangular groove matched with the triangular push block, and the bottom of the processing carrier plate is fixedly connected with a transmission rack. The transmission rack is engaged with the driving tooth belt. The optical module multi-process assembly equipment in patent CN114515963B can automatically assemble the optical module, but it is difficult to ensure the assembly precision of the working unit and the shell of the 800G optical module. SUMMARY

[0004] The purpose of the present application is to provide an 800G optical module and a high-precision packaging equipment and method thereof, which solves the technical problem of being unable to ensure the assembly precision of the 800G optical module, and achieves the technical effect of ensuring the assembly precision of the 800G optical module.

[0005] The embodiment of the application provides an 800G optical module, which comprises: a first shell provided with a buckle for connecting with a second shell, the cross section of the first shell is U-shaped; the second shell is used for connecting with the first shell to form an outer shell of the 800G optical module; a working unit comprising a first intermediate plate, a second intermediate plate, a PCB plate and an MPO connector, a plurality of emitting units are arranged on the first intermediate plate, a plurality of receiving units are arranged on the second intermediate plate, the PCB plate is coupled with the first intermediate plate and the second intermediate plate respectively, and the plurality of receiving units, the plurality of emitting units and the MPO connector are connected through optical fibers; a heat sink unit is used for being connected with the second shell to respectively mount and position the first intermediate plate, the second intermediate plate and the working unit, and the heat sink unit can be positioned in the first shell.

[0006] In a possible implementation, the heat sink unit is provided with a first positioning groove, a second positioning groove and a third positioning groove, the first positioning groove is used for positioning the first intermediate plate, the second positioning groove is used for positioning the second intermediate plate, and the third positioning groove is used for positioning the PCB plate, and the second shell can be connected to the heat sink unit to press and position the first intermediate plate, the second intermediate plate and the PCB plate; the heat sink unit and the second shell are respectively provided with a plurality of mounting holes corresponding to the length direction on the two sides, and the plurality of mounting holes are used for connecting the heat sink unit and the second shell through screws.

[0007] In another possible implementation, the first positioning groove is provided with a first positioning hole for passing through the plurality of emitting units, the side of the first shell close to the heat sink unit is provided with a TEC heat dissipation fin for dissipating heat of the heat sink unit, and the TEC heat dissipation fin is electrically connected to the PCB plate through a cable.

[0008] In another possible implementation, the side of the TEC heat dissipation fin close to the first positioning hole is provided with a first heat-conducting silica gel sheet.

[0009] In another possible implementation, the first positioning groove is provided with a second heat-conducting silica gel sheet for dissipating heat of the first intermediate plate, the second heat-conducting silica gel sheet is provided with an opening corresponding to the first positioning hole, the second positioning groove is provided with a third heat-conducting silica gel sheet for dissipating heat of the second intermediate plate, and the third positioning groove is provided with a fourth heat-conducting silica gel sheet for dissipating heat of the PCB plate.

[0010] In another possible implementation, the second shell is provided with a fifth heat-conducting silica gel sheet, the fifth heat-conducting silica gel sheet is used for heat conduction between the second shell and the PCB plate, and the side of the second shell away from the fifth heat-conducting silica gel sheet is provided with a heat dissipation fin.

[0011] In another possible implementation, the first heat-conductive silica gel sheet has a thickness of 0.5 mm to 1 mm, and the second heat-conductive silica gel sheet, the third heat-conductive silica gel sheet, and the fourth heat-conductive silica gel sheet have a thickness of 1 mm to 2 mm, and the compression rate of the second heat-conductive silica gel sheet, the third heat-conductive silica gel sheet, and the fourth heat-conductive silica gel sheet is greater than the compression rate of the first heat-conductive silica gel sheet.

[0012] The embodiment of the present application also provides a high-precision packaging device for an 800G optical module, which is used for packaging the 800G optical module in any of the above embodiments, and comprises: a fixing assembly used for mounting and fixing a heat sink unit; a moving assembly used for adsorbing and placing a working unit on the heat sink unit; and an assembling assembly used for connecting a second shell to the heat sink unit to mount and position a first intermediate plate, a second intermediate plate, and the working unit, respectively.

[0013] In another possible implementation, the fixing assembly is provided with a positioning column capable of extending into the mounting hole of the heat sink unit, the positioning column is provided with a spring capable of supporting the positioning column, and the positioning column can compress the spring when the heat sink unit and the second shell are connected by a screw, so that the positioning column is out of the mounting hole.

[0014] In another possible implementation, the high-precision packaging device further comprises a height detection assembly and a control assembly, the control assembly is electrically connected to the moving assembly, the assembling assembly, and the height detection assembly, respectively, the height detection assembly is used for checking the height of the heat sink unit placed on the fixing assembly, the height of the working unit mounted on the heat sink unit in sequence, and the height of the second shell mounted on the heat sink unit, the control assembly controls the moving assembly to stop and sends an artificial processing reminder when the height of the heat sink unit placed on the fixing assembly is greater than a first height, the control assembly controls the assembling assembly to stop and sends an artificial processing reminder when the height of the heat sink unit mounted with the working unit is greater than a second height, and an artificial processing reminder is sent when the height of the heat sink unit mounted with the second shell is greater than a third height.

[0015] In another possible implementation, the number of the height detection assemblies is multiple, and the multiple height detection assemblies correspond to the positions of the multiple mounting holes, respectively.

[0016] The embodiment of the present application also provides a high-precision packaging method for an 800G optical module, which adopts the high-precision packaging device for the 800G optical module, and the method comprises the following steps: mounting and fixing the heat sink unit by the fixing assembly; adsorbing and placing the working unit on the heat sink unit by the moving assembly; connecting the second shell to the heat sink unit by the assembling assembly to mount and position the first intermediate plate, the second intermediate plate, and the working unit, respectively; positioning the heat sink unit in the first shell, and connecting the first shell and the second shell by a buckle.

[0017] Compared with the prior art, the embodiment of the present application has the following beneficial effects:

[0018] The embodiment of the present application provides a kind of 800G optical module, including first shell, second shell, working unit and heat sink unit, the cross section of first shell is U-shaped;First shell is equipped with buckle for and the connection of second shell;Second shell is used to and first shell is connected to form the shell of 800G optical module;Working unit includes first intermediate plate, second intermediate plate, PCB board and MPO connector, a plurality of emitting units are provided on the first intermediate plate, a plurality of receiving units are provided on the second intermediate plate, PCB board is coupled with first intermediate plate, second intermediate plate respectively, a plurality of receiving units, a plurality of emitting units and MPO connector are connected by optical fiber;Heat sink unit is used to be connected with second shell to be positioned respectively to first intermediate plate, second intermediate plate and PCB board, heat sink unit can be positioned into first shell.This kind of 800G optical module in the embodiment of the present application can be positioned to working unit by second shell and heat sink unit, avoid the problem that working unit is difficult to accurately position in the shell with U-shaped cross section in the structure of existing optical module, improve the installation convenience and assembly precision of 800G optical module, improve the production efficiency of 800G optical module. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0020] Figure 1 A front view of the 800G optical module provided in the embodiment of the present application is shown in the exploded structure diagram.

[0021] Figure 2 The structure diagram of the first shell and heat sink unit cooperation of the 800G optical module provided in the embodiment of the present application is shown.

[0022] Figure 3 The A place local structure diagram of the first shell and heat sink unit cooperation in Figure 2

[0023] Figure 4 The three-dimensional exploded structure diagram of the 800G optical module provided in the embodiment of the present application is shown.

[0024] Figure 5 The right view exploded structure diagram of the 800G optical module provided in the embodiment of the present application is shown.

[0025] Figure 6 The front view structure diagram of the heat sink unit provided in the embodiment of the present application is shown. ​

[0026] Figure 7 A schematic diagram of the exploded structure of a high-precision packaging device for an 800G optical module provided in an embodiment of the present application from the right side;

[0027] Figure 8 for Figure 7 A schematic diagram of the local structure of a high-precision packaging device for an 800G optical module provided in an embodiment of the present application;

[0028] Figure 9 A schematic diagram of the main exploded structure of a high-precision packaging device for an 800G optical module provided in an embodiment of the present application;

[0029] Figure 10 A schematic diagram of the control structure of a high-precision packaging device for an 800G optical module provided in an embodiment of the present application;

[0030] Figure 11 A schematic diagram of a process for a high-precision packaging method for an 800G optical module provided in an embodiment of the present application;

[0031] In the figure, 1. first shell; 11. TEC heat sink; 12. first thermally conductive silicone sheet; 2. second shell; 21. fifth thermally conductive silicone sheet; 22. heat dissipation fin; 3. working unit; 31. first middle plate; 311. transmitting unit; 32. second middle plate; 321. receiving unit; 33. PCB board; 34. MPO connector; 4. heat sink unit; 41. first positioning groove; 411. first positioning hole; 412. second thermally conductive silicone sheet; 42. second positioning groove; 421. third thermally conductive silicone sheet; 43. third positioning groove; 431. fourth thermally conductive silicone sheet; 44. mounting hole; 5. fixing component; 51. positioning column; 52. spring; 6. moving component; 7. assembling component; 8. height detection component; 9. control component. DETAILED DESCRIPTION

[0032] In order to make the technical problems, technical solutions and beneficial effects to be solved by this application more clearly understood, this application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0033] It should be noted that when a component or structure is referred to as being “fixed to” or “disposed on” another component or structure, it may be directly on the other component or structure or indirectly on the other component or structure. When a component or structure is referred to as being “connected to” another component or structure, it may be directly connected to the other component or structure or indirectly connected to the other component or structure.

[0034] It should be understood that the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or a component or structure referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0035] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise specifically limited.

[0036] The optical module assembly equipment in the prior art can automatically assemble the optical module, but it is difficult to ensure the assembly precision of the working unit and the shell during the assembly of the 800G optical module.

[0037] Based on the above reasons, the embodiments of the present application provide a kind of 800G optical module, including first shell, second shell, working unit and heat sink unit, the cross section of first shell is U-shaped;First shell is equipped with buckle for connecting with second shell;Second shell is used to and first shell is connected to form the shell of 800G optical module;Working unit includes first intermediate plate, second intermediate plate, PCB board and MPO connector, a plurality of emitting units are provided on the first intermediate plate, a plurality of receiving units are provided on the second intermediate plate, the PCB board is coupled with the first intermediate plate and the second intermediate plate respectively, a plurality of receiving units, a plurality of emitting units and MPO connector are connected by optical fiber;Heat sink unit is used to be connected with second shell to be positioned respectively to first intermediate plate, second intermediate plate and PCB board, heat sink unit can be positioned into first shell.This kind of 800G optical module in the embodiments of the present application can be positioned by second shell and heat sink unit to working unit, avoid the problem that it is difficult to accurately position in the shell with U-shaped cross section in the existing optical module structure to install working unit, improve the installation convenience and assembly precision of 800G optical module, improve the production efficiency of 800G optical module.

[0038] In some scenarios, the 800G optical module of the embodiments of the present application can be applied to 800G optical communication, and the production and assembly precision and production efficiency of the 800G optical module in the embodiments of the present application are higher, which can reduce the use cost of 800G optical module.

[0039] The 800G optical module provided by the embodiment of the present application will be described in detail below with specific examples.

[0040] Figure 1 The exploded structure diagram of the front view of the 800G optical module provided by the embodiment of the present application is shown in Figure 1 The 800G optical module includes a first shell 1, a second shell 2, a working unit 3 and a heat sink unit 4, which cooperate with each other to form the 800G optical module.

[0041] As shown in Figure 1 The cross section of the first shell is U-shaped, and the first shell 1 is provided with a buckle for connecting with the second shell 2.

[0042] Exemplarily, the first shell 1 can be provided with an elastic buckle for connecting with the second shell 2, and the first shell 1 and the second shell 2 can cooperate with each other to form the shell of the 800G optical module.

[0043] As shown in Figure 1 The second shell 2 is used to connect with the first shell 1 to form the shell of the 800G optical module.

[0044] Exemplarily, the second shell 2 can be a plate structure.

[0045] As shown in Figure 1 The second shell 2 can be connected with the first shell 1, so that the second shell 2 can be connected with the first shell 1 to form the shell of the 800G optical module.

[0046] As shown in Figure 1 The working unit 3 includes a first intermediate plate 31, a second intermediate plate 32, a PCB plate 33 and an MPO connector 34, the first intermediate plate 31 is provided with a plurality of transmitting units 311, the second intermediate plate 32 is provided with a plurality of receiving units 321, the PCB plate 33 is coupled with the first intermediate plate 31 and the second intermediate plate 32 respectively, and the plurality of transmitting units 311, the plurality of receiving units 321 and the MPO connector 34 are connected through optical fibers.

[0047] In structure, the working unit 3 includes the first intermediate plate 31, the second intermediate plate 32, the PCB plate 33 and the MPO connector 34, which cooperate with each other to form the working unit 3.

[0048] In structure, the first intermediate plate 31 is provided with a plurality of transmitting units 311, the transmitting unit 311 includes a transmitting laser, a coupling lens and a transmitting end optical fiber array, the coupling lens is used to match the transmitting laser, and the transmitting end optical fiber array is coupled with the coupling lens. The transmitting laser can be an eight-way laser, and the coupling lens is eight groups of coupling lenses.

[0049] Structurally, a plurality of receiving units 321 are provided on the second intermediate board 32. The receiving units 321 include a transimpedance amplifier, a detector and a receiving end optical fiber array. The receiving units 321 transmit the externally transmitted optical signal to the receiving end optical fiber array. The receiving end optical fiber array reflects and transmits the optical signal to the photosensitive surface of the detector. Then the detector converts the multiple optical signals into electrical signals, which can be transmitted to the PCB board 33 through the second intermediate board 32.

[0050] like Figure 1 As shown, the PCB board 33 is coupled to the first intermediate board 31 and the second intermediate board 32 respectively, so that the electrical signal generated by the PCB board 33 can be transmitted to the first intermediate board 31, and then the electrical signal can be transmitted to the first intermediate board 31, and at the same time the electrical signal of the second intermediate board 32 can be transmitted to the PCB board 33.

[0051] Structurally, silicon photonic chips for processing optical signals can be respectively set on the first intermediate plate 31, the second intermediate plate 32, and the PCB board 33. The silicon photonic chips are highly sensitive to temperature. By independently setting the first intermediate plate 31, the second intermediate plate 32, and the PCB board 33, the silicon photonic chips on the first intermediate plate 31, the second intermediate plate 32, and the PCB board 33 can be prevented from being affected.

[0052] like Figure 1 As shown, the multiple transmitting units 311, the multiple receiving units 321 and the MPO connector 34 are connected via optical fibers, so that the MPO connector 34 can transmit light between the multiple transmitting units 311 and the multiple receiving units 321 via optical fibers.

[0053] like Figure 1 As shown, the heat sink unit 4 is used to connect with the second shell 2 to respectively install and position the first middle plate 31 , the second middle plate 32 and the working unit 3 . The heat sink unit 4 can be installed in the first shell 1 for positioning.

[0054] like Figure 1 As shown, the heat sink unit 4 is used to connect with the second shell 2 to respectively install and position the first intermediate plate 31, the second intermediate plate 32 and the working unit 3, so that the working unit 3 can be fixed by the heat sink unit 4 and the second shell 2 to form an assembly unit, and then the assembly unit can be installed on the first shell 1 for fixation.

[0055] like Figure 1 As shown, the cross section of the first shell 1 is U-shaped, so that the housing of the 800G optical module is formed by the first shell 1 and the second shell 2.

[0056] In structure, due to the U-shaped cross section of the first shell 1, the conventional 800G optical module is inconvenient to assemble the working unit to the first shell 1. In the embodiment of the application, the 800G optical module can be assembled by first installing and fixing the working unit 3 and then assembling the working unit 3 and the first shell 1 to form the 800G optical module, which can avoid the direct assembly of the working unit 3 and the first shell 1 to form the 800G optical module.

[0057] In assembly, after the heat sink unit 4 and the second shell 2 are fixed to the working unit 3 to form an assembly unit, the heat sink unit 4 can be positioned in the first shell 1, so that the second shell 2 can be connected to the first shell 1 to form the housing of the 800G optical module, and the assembly of the 800G optical module is completed.

[0058] The above-mentioned implementation manner has the beneficial effects that the working unit is fixed by the heat sink unit and the second shell, which can improve the stability and precision of the fixation of the working unit and improve the precision and convenience of the assembly of the 800G optical module.

[0059] The above-mentioned implementation manner also has the beneficial effects that after the working unit is fixed by the heat sink unit and the second shell to form an assembly unit, the working unit can be protected by the heat sink unit and the second shell, which improves the safety of the fixation of the working unit and improves the assembly quality of the 800G optical module.

[0060] The above-mentioned implementation manner also has the beneficial effects that the cross section of the first shell is U-shaped, and the working unit is installed and fixed after the heat sink unit and the second shell are fixed to the working unit to form an assembly unit, so that the heat sink unit and the second shell can protect the working unit and avoid scratching the working unit by the first shell, which improves the assembly quality of the 800G optical module.

[0061] The above-mentioned implementation manner also has the beneficial effects that the first intermediate plate, the second intermediate plate and the PCB plate of the working unit are independently arranged, so that the PCB plate, the first intermediate plate and the second intermediate plate are less affected by the deformation caused by heat, which reduces the influence of the deformation of the PCB plate, the first intermediate plate and the second intermediate plate caused by heat on the performance of the chips and improves the performance of the 800G optical module.

[0062] In some implementations, the heat sink unit 4 is provided with a first positioning groove 41, a second positioning groove 42 and a third positioning groove 43. The first positioning groove 41 is used for positioning the first intermediate plate 31. The second positioning groove 42 is used for positioning the second intermediate plate 32. The third positioning groove 43 is used for positioning the PCB plate 33. The second shell 2 can be connected to the heat sink unit 4 to extrude and position the first intermediate plate 31, the second intermediate plate 32 and the PCB plate 33.

[0063] Figure 2 A structure diagram of cooperation between the first shell and the heat sink unit of the 800G optical module provided in the embodiment of the present application is provided, Figure 3 A structure diagram of cooperation between the first shell and the heat sink unit of the 800G optical module provided in the embodiment of the present application is provided, Figure 2 A structure diagram of cooperation between the first shell and the heat sink unit of the 800G optical module provided in the embodiment of the present application is provided, Figures 1 to 3 As shown in the structure, the heat sink unit 4 is provided with a first positioning groove 41, a second positioning groove 42 and a third positioning groove 43. The first positioning groove 41, the second positioning groove 42 and the third positioning groove 43 are used for positioning the working unit 3, so as to improve the stability of positioning the working unit 3.

[0064] In the structure, the first positioning groove 41 is used for positioning the first intermediate plate 31, so as to improve the stability of positioning the first intermediate plate 31.

[0065] In the structure, the second positioning groove 42 is used for positioning the second intermediate plate 32, so as to improve the stability of positioning the second intermediate plate 32.

[0066] In the structure, the third positioning groove 43 is used for positioning the PCB plate 33, so as to improve the stability of positioning the PCB plate 33.

[0067] In the structure, the second shell 2 can be connected to the heat sink unit 4 to extrude and position the first intermediate plate 31, the second intermediate plate 32 and the PCB plate 33, so that the second shell 2 and the heat sink unit 4 can cooperate with each other to position the first intermediate plate 31, the second intermediate plate 32 and the PCB plate 33.

[0068] In some implementations, the heat sink unit 4 and the second shell 2 are respectively provided with a plurality of mounting holes 44 on both sides along the length direction. The plurality of mounting holes 44 are used for connecting the heat sink unit 4 and the second shell 2 through screws.

[0069] Figure 4 A perspective exploded structure diagram of the 800G optical module provided in the embodiment of the present application is provided, Figure 5 A right view exploded structure diagram of the 800G optical module provided in the embodiment of the present application is provided, Figure 4 A right view exploded structure diagram of the 800G optical module provided in the embodiment of the present application is provided, Figure 5As shown, the heat sink unit 4 and the second shell 2 are respectively provided with a plurality of mounting holes 44 corresponding to the length direction of the two side edges, which are used to connect the heat sink unit 4 and the second shell 2 by screws, so as to realize the stable connection of the heat sink unit 4 and the second shell 2 by screws.

[0070] Exemplarily, three screws can be arranged on one side edge of the heat sink unit 4 and the second shell 2.

[0071] The above-mentioned implementation manner has the beneficial effects that the first positioning groove positions the first intermediate plate, the second positioning groove positions the second intermediate plate, and the third positioning groove positions the PCB plate, so as to improve the stability of the positioning of the working unit, ensure the stability of the positioning of each component of the working unit, and further improve the positioning effect of the working unit.

[0072] The above-mentioned implementation manner also has the beneficial effects that the heat sink unit and the second shell are respectively provided with a plurality of mounting holes corresponding to the length direction of the two side edges, which are used to connect by screws, so as to improve the stability of the connection of the heat sink unit and the second shell, ensure the stability of the installation of the working unit, and improve the precision and packaging quality of the 800G optical module.

[0073] In some implementation manners, the first positioning groove 41 is provided with a first positioning hole 411 for passing through the plurality of emitting units 311, and the first shell 1 is provided with a TEC heat sink 11 for dissipating heat of the heat sink unit 4 on the side close to the heat sink unit 4, and the TEC heat sink 11 is electrically connected to the PCB 33 through a cable.

[0074] Figure 6 A front view structural schematic diagram of a heat sink unit provided by the embodiment of the present application is shown in FIG. 1. Figure 6 As shown, the first positioning groove 41 is provided with a first positioning hole 411 for passing through the plurality of emitting units 311, so that the first positioning hole 411 can give way to the plurality of emitting units 311, facilitate the positioning of the plurality of emitting units 311, and increase the space for the structural design of the plurality of emitting units 311.

[0075] As shown in FIG. 2, Figure 3 The first shell 1 is provided with a TEC heat sink 11 for dissipating heat of the heat sink unit 4 on the side close to the heat sink unit 4, and the TEC heat sink 11 is electrically connected to the PCB 33 through a cable, so that the TEC heat sink 11 can improve the heat dissipation efficiency of the heat sink unit 4.

[0076] In structure, the first positioning hole can accommodate the plurality of emitting units, and facilitate positioning of the plurality of emitting units, and increase the space for structural design of the plurality of emitting units.

[0077] The implementation manner has the beneficial effects that the first positioning hole can accommodate the plurality of emitting units, and facilitate positioning of the plurality of emitting units, and increase the space for structural design of the plurality of emitting units.

[0078] The implementation manner has the beneficial effects that the first positioning hole can accommodate the plurality of emitting units, and facilitate positioning of the plurality of emitting units, and increase the space for structural design of the plurality of emitting units.

[0079] In some implementation manners, the TEC heat sink 11 is provided with a first heat-conducting silica gel sheet 12 on a side close to the first positioning hole 411.

[0080] As shown in Figure 2 and Figure 3 In structure, the TEC heat sink 11 is provided with the first heat-conducting silica gel sheet 12 on a side close to the first positioning hole 411, and the first heat-conducting silica gel sheet 12 can improve the heat dissipation efficiency between the TEC heat sink 11 and the heat sink unit 4.

[0081] In structure, the first heat-conducting silica gel sheet 12 can buffer between the plurality of emitting units 311 and the TEC heat sink 11 passing through the first positioning hole 411, protect the plurality of emitting units 311, and ensure the heat dissipation effect of the plurality of emitting units 311.

[0082] The implementation manner has the beneficial effects that the first heat-conducting silica gel sheet can improve the heat dissipation efficiency between the TEC heat sink and the heat sink unit.

[0083] The implementation manner has the beneficial effects that the first heat-conducting silica gel sheet can improve the heat dissipation efficiency between the TEC heat sink and the heat sink unit.

[0084] In some implementation manners, the first positioning slot 41 is provided with a second heat-conducting silica gel sheet 412 for heat dissipation of the first intermediate plate 31, the second heat-conducting silica gel sheet 412 is provided with an opening hole corresponding to the first positioning hole 411, the second positioning slot 42 is provided with a third heat-conducting silica gel sheet 421 for heat dissipation of the second intermediate plate 32, and the third positioning slot 43 is provided with a fourth heat-conducting silica gel sheet 431 for heat dissipation of the PCB plate 33.

[0085] In structure, the first positioning slot 41 is provided with a second heat-conducting silica gel sheet 412 for heat dissipation of the first intermediate plate 31, so that the second heat-conducting silica gel sheet 412 can buffer protect the first intermediate plate 31.

[0086] In structure, the second heat-conducting silica gel sheet 412 is provided with an opening corresponding to the first positioning hole 411, so that the first positioning hole 411 can accommodate the emitting unit 311.

[0087] In structure, the second positioning slot 42 is provided with a third heat-conducting silica gel sheet 421 for heat dissipation of the second intermediate plate 32, so that the third heat-conducting silica gel sheet 421 can heat conduct and heat dissipate the second intermediate plate 32 while buffering protecting.

[0088] In structure, the third positioning slot 43 is provided with a fourth heat-conducting silica gel sheet 431 for heat dissipation of the PCB plate 33, so that the fourth heat-conducting silica gel sheet 431 can heat conduct and heat dissipate the PCB plate 33 while buffering protecting.

[0089] The above-mentioned implementation manner has the beneficial effect that the second heat-conducting silica gel sheet can heat conduct and heat dissipate the first intermediate plate while buffering protecting.

[0090] The above-mentioned implementation manner also has the beneficial effect that the third heat-conducting silica gel sheet can heat conduct and heat dissipate the second intermediate plate while buffering protecting, and the fourth heat-conducting silica gel sheet can heat conduct and heat dissipate the PCB plate while buffering protecting.

[0091] In some implementation manners, the second shell 2 is provided with a fifth heat-conducting silica gel sheet 21 for heat conduction between the second shell 2 and the PCB plate 33, and the second shell 2 is provided with a heat dissipation fin 22 away from the fifth heat-conducting silica gel sheet 21.

[0092] In structure, the second shell 2 is provided with a fifth heat-conducting silica gel sheet 21 for heat conduction between the second shell 2 and the PCB plate 33, so that the heat on the PCB plate 33 can be efficiently conducted to the second shell 2.

[0093] In structure, the second shell 2 is provided with a heat dissipation fin 22 away from the fifth heat-conducting silica gel sheet 21, and the heat dissipation fin 22 can improve the heat dissipation efficiency of the PCB plate 33 and the working unit 3.

[0094] The above-mentioned implementation manner has the beneficial effect that the heat on the PCB plate can be efficiently conducted to the second shell through the fifth heat-conducting silica gel sheet, which facilitates heat dissipation of the PCB plate.

[0095] The beneficial effects brought by the above implementation manner also lie in that the second shell can fix the working unit in advance, and the heat dissipation fins on the second shell can improve the heat dissipation efficiency of the PCB and the working unit.

[0096] In some implementations, the thickness of the first heat-conductive silica gel sheet 12 is 0.5-1 mm, and the thickness of the second heat-conductive silica gel sheet 412, the third heat-conductive silica gel sheet 421 and the fourth heat-conductive silica gel sheet 431 is 1-2 mm. The compression rate of the second heat-conductive silica gel sheet 412, the third heat-conductive silica gel sheet 421 and the fourth heat-conductive silica gel sheet 431 is greater than that of the first heat-conductive silica gel sheet 12.

[0097] In terms of structure, as shown in the drawings, the thickness D1 of the first heat-conductive silica gel sheet 12 is 0.5-1 mm. The thickness of the first heat-conductive silica gel sheet 12 is small, so that the first heat-conductive silica gel sheet 12 can reduce the occupation of the internal space of the optical module while conducting heat, thereby improving the layout space of the electronic components in the optical module. Figure 3

[0098] In terms of structure, the thickness D2 of the second heat-conductive silica gel sheet 412, the third heat-conductive silica gel sheet 421 and the fourth heat-conductive silica gel sheet 431 is 1-2 mm, so that the second heat-conductive silica gel sheet 412, the third heat-conductive silica gel sheet 421 and the fourth heat-conductive silica gel sheet 431 and each part of the working unit 3 have a large space for cooperation, which can ensure the heat dissipation efficiency while ensuring the buffering protection effect of the working unit 3.

[0099] In terms of material, the compression rate of the second heat-conductive silica gel sheet 412, the third heat-conductive silica gel sheet 421 and the fourth heat-conductive silica gel sheet 431 is greater than that of the first heat-conductive silica gel sheet 12. The compression rate refers to the deformation degree of the material under pressure, so that the second heat-conductive silica gel sheet 412, the third heat-conductive silica gel sheet 421 and the fourth heat-conductive silica gel sheet 431 can provide a larger buffering space for the working unit 3, thereby further improving the protection effect of the working unit 3.

[0100] In terms of material, the compression rate of the first heat-conductive silica gel sheet 12 is less than that of the second heat-conductive silica gel sheet 412, the third heat-conductive silica gel sheet 421 and the fourth heat-conductive silica gel sheet 431, so that the first heat-conductive silica gel sheet 12 is not easily compressed and flattened, thereby improving the support effect of the heat sink unit 4 and ensuring the structural stability of the optical module as a whole.

[0101] The beneficial effects brought by the above implementation manner lie in that the thickness and compression rate of the second heat-conductive silica gel sheet, the third heat-conductive silica gel sheet and the fourth heat-conductive silica gel sheet are large, which can ensure the heat dissipation efficiency while ensuring the buffering protection effect of the working unit.

[0102] ​The beneficial effects brought by the above implementation manner also lie in that the first heat-conductive silica gel sheet has a small thickness, which can provide a larger design space for the structure of the optical module, and the first heat-conductive silica gel sheet has a small compression rate and is not easy to be compressed and flattened, thereby improving the supporting effect on the heat sink unit and ensuring the structural stability of the optical module as a whole.

[0103] The embodiment of the present application also provides a high-precision packaging equipment for an 800G optical module, Figure 7 A right view exploded structure schematic diagram of the high-precision packaging equipment for the 800G optical module provided by the embodiment of the present application is shown in the figure, Figure 7 for packaging the 800G optical module, which comprises a fixing assembly 5, a moving assembly 6 and an assembling assembly 7, and the fixing assembly 5, the moving assembly 6 and the assembling assembly cooperate with each other to package the 800G optical module.

[0104] As shown in the figure, Figure 7 the fixing assembly 5 is used for mounting and fixing the heat sink unit 4.

[0105] In terms of structure, the fixing assembly 5 is used for mounting and fixing the heat sink unit 4, so that the heat sink unit 4 is positioned under the fixing action of the fixing assembly 5, so as to facilitate the assembly of other structures of the optical module on the heat sink unit 4.

[0106] As shown in the figure, Figure 7 the moving assembly 6 is used for adsorbing and placing the working unit 3 on the heat sink unit 4.

[0107] In terms of structure, the moving assembly 6 is used for adsorbing and placing the working unit 3 on the heat sink unit 4, so that the working unit 3 can be transferred to the heat sink unit 4, thereby facilitating the subsequent assembly of the working unit 3.

[0108] For example, the moving assembly 6 can adsorb and place the working unit 3 through a suction cup.

[0109] As shown in the figure, Figure 7 the assembling assembly 7 is used for connecting the second shell 2 to the heat sink unit 4 to respectively mount and position the first intermediate plate 31, the second intermediate plate 32 and the PCB plate 33.

[0110] In terms of structure, the assembling assembly 7 is used for connecting the second shell 2 to the heat sink unit 4 to respectively mount and position the first intermediate plate 31, the second intermediate plate 32 and the PCB plate 33, and the second shell 2 can be connected to the heat sink unit 4 through the assembling assembly 7 to respectively mount and position the first intermediate plate 31, the second intermediate plate 32 and the PCB plate 33, so as to realize the mounting and fixing of the first intermediate plate 31, the second intermediate plate 32 and the PCB plate 33.

[0111] After connecting the second shell 2 to the heat sink unit 4 to form an assembled unit, the assembled unit formed by the second shell 2, the working unit 3 and the heat sink unit 4 can be connected with the first shell 1 to complete the assembly of the optical module.

[0112] Exemplarily, the assembly component 7 can be a mobile mechanical arm with a screw automatic installation function, and the connection of the second shell 2 and the heat sink unit 4 can be automatically completed by the assembly component 7.

[0113] After connecting the first shell 1 and the second shell 2, the optical module accessories such as the pull ring can also be installed.

[0114] Exemplarily, when connecting the first shell 1 and the second shell 2, the first shell 1 and the second shell 2 can be connected manually. Since the assembly of the working unit has been completed in advance, the connection of the first shell 1 and the second shell 2 will not affect the structure of the working unit or cause damage to the working unit, thereby improving the protection effect of the 800G optical module.

[0115] The above-mentioned implementation manner has the beneficial effects that the heat sink unit is positioned under the fixing effect of the fixing component, the moving component can adsorb and place the working unit on the heat sink unit for the feeding of the working unit, and the subsequent connection of the second shell to the heat sink unit facilitates the assembly of the working unit by the second shell and the heat sink unit. Subsequently, the assembly of the 800G optical module can be completed only by connecting the first shell and the second shell, thereby improving the assembly efficiency and assembly precision of the 800G optical module.

[0116] The above-mentioned implementation manner also has the beneficial effects that the assembly process of the second shell, the working unit and the heat sink unit is automatically completed by the equipment, thereby improving the assembly precision and assembly efficiency of the 800G optical module.

[0117] The above-mentioned implementation manner also has the beneficial effects that the connection of the first shell and the second shell will not affect the structure of the working unit or cause damage to the working unit, thereby improving the protection effect of the 800G optical module.

[0118] In some implementation manners, the fixing component 5 is provided with a positioning column 51 capable of extending into the mounting hole 44 of the heat sink unit 4, and the positioning column 51 is provided with a spring 52 supporting the positioning column 51. The positioning column 51 can compress the spring 52 when connecting the heat sink unit 4 and the second shell 2 by a screw, so that the positioning column 51 is out of the mounting hole.

[0119] Figure 8 For Figure 7 A B partial structure schematic diagram of a high-precision packaging device for an 800G optical module provided by the embodiment of the application in the above-mentioned implementation manner is shown in FIG. 6. Figure 9A front view exploded structure schematic diagram of a high-precision packaging equipment for an 800G optical module is provided for the embodiment of the present application, as shown in Figure 8 and Figure 9 The fixing assembly 5 is provided with a positioning column 51 capable of extending into the mounting hole 44 of the heat sink unit 4. The mounting hole 44 can be positioned by the positioning column 51, so as to facilitate the installation and fixation of the heat sink unit 4.

[0120] In structure, the positioning column 51 is provided with a spring 52 supporting the positioning column 51. The positioning column 51 can be supported and reset by the spring 52. When the heat sink unit 4 and the second shell 2 are installed and fixed, the positioning column 51 can be supported by the screw when the heat sink unit 4 and the second shell 2 are connected by the screw, so as to compress the spring 52 by the positioning column 51, so that the positioning column 51 is out of the mounting hole, so as to facilitate the subsequent unloading of the heat sink unit 4.

[0121] The implementation manner has the beneficial effects that the mounting hole can be positioned by the positioning column, and the heat sink unit can be positioned.

[0122] The implementation manner also has the beneficial effects that after the spring is compressed when the heat sink unit and the second shell are connected by the screw, the positioning column is out of the mounting hole, so as to facilitate the unloading of the heat sink unit and the assembly of the 800G optical module.

[0123] In some implementation manners, the high-precision packaging equipment for the 800G optical module further includes a height detection assembly 8 and a control assembly 9. The control assembly 9 is electrically connected with the moving assembly 6, the assembly assembly 7, and the height detection assembly 8. The height detection assembly 8 is used to check the height of the heat sink unit 4 placed on the fixing assembly 5, and the working unit 3 and the second shell 2 sequentially installed on the heat sink unit 4.

[0124] Figure 10 A control structure schematic diagram of a high-precision packaging equipment for an 800G optical module is provided for the embodiment of the present application, Figure 11 A flowchart of a high-precision packaging method for an 800G optical module is provided for the embodiment of the present application, as shown in Figures 7 to 11 The high-precision packaging equipment for the 800G optical module further includes a height detection assembly 8 and a control assembly 9. The control assembly 9 is electrically connected with the moving assembly 6, the assembly assembly 7, and the height detection assembly 8, so that the control assembly 9 can centrally control the moving assembly 6, the assembly assembly 7, and the height detection assembly 8.

[0125] In operation, the height detection assembly 8 is used to check the height of the fixing assembly 5 after placing the heat sink unit 4, the working unit 3, and the second shell 2 on the heat sink unit 4 in sequence, so as to control the assembly process of the 800G optical module.

[0126] Exemplarily, the height detection assembly 8 can be an optical-electricity sensor.

[0127] In some implementations, when the height of the fixing assembly 5 after placing the heat sink unit 4 is greater than the first height, the control assembly 9 controls the moving assembly 6 to stop and sends an artificial processing reminder. When the height of the heat sink unit 4 after installing the working unit 3 is greater than the second height, the control assembly 9 controls the assembling assembly 7 to stop and sends an artificial processing reminder. When the height of the heat sink unit 4 after installing the second shell 2 is greater than the third height, an artificial processing reminder is sent.

[0128] In packaging, when the height of the fixing assembly 5 after placing the heat sink unit 4 is greater than the first height, it indicates that the placement position of the heat sink unit 4 is poor, and the moving assembly 6 can be controlled to stop by the control assembly 9 and an artificial processing reminder can be sent.

[0129] In packaging, when the height of the heat sink unit 4 after installing the working unit 3 is greater than the second height, it indicates that the position of the working unit 3 after assembling the working unit 3 and the heat sink unit 4 is poor, and the assembling assembly 7 can be controlled to stop by the control assembly 9 and an artificial processing reminder can be sent.

[0130] In packaging, when the height of the heat sink unit 4 after installing the second shell 2 is greater than the third height, it indicates that the installation height of the heat sink unit 4 is poor, and an artificial processing reminder can be sent.

[0131] The implementation manner has the beneficial effects that the height of the fixing assembly after placing the heat sink unit, the height of the heat sink unit after installing the working unit and the second shell in sequence, and the height of the 800G optical module after assembling are controlled, the control effect of the packaging process of the 800G optical module is improved, and packaging failure is avoided.

[0132] In some implementations, the number of the height detection assemblies 8 in the high-precision packaging equipment for the 800G optical module is multiple, and the multiple height detection assemblies 8 correspond to the positions of the multiple mounting holes 44 respectively.

[0133] In structure, the number of the height detection assemblies 8 in the high-precision packaging equipment for the 800G optical module is multiple, the multiple height detection assemblies 8 are respectively arranged at the positions of the multiple mounting holes 44, and then the installation state of the multiple mounting holes 44 can be detected, so that the packaging process at each mounting hole 44 is prevented from being poor, and the packaging control effect on the 800G optical module is improved.

[0134] The implementation manner has the beneficial effects that the packaging process at each mounting hole is prevented from being poor, and the packaging control effect on the 800G optical module is improved.

[0135] The embodiment of the application further provides a high-precision packaging method for an 800G optical module, which adopts the high-precision packaging equipment for the 800G optical module as any one of the above, and the method comprises S110 to S140, which are specifically described below.

[0136] S110, the heat sink unit 4 is installed and fixed by the fixing assembly 5.

[0137] When the high-precision packaging of the 800G optical module is performed, the heat sink unit 4 can be first installed and fixed by the fixing assembly 5.

[0138] Exemplarily, when the heat sink unit 4 is installed and fixed, the heat sink unit 4 can be fed onto the fixing assembly 5 by a mechanical arm, so as to be fixed and positioned by the fixing assembly 5.

[0139] S120, the working unit 3 is placed on the heat sink unit 4 by the moving assembly 6.

[0140] When the high-precision packaging of the 800G optical module is performed, the working unit 3 can be placed on the heat sink unit 4 by the moving assembly 6, so as to be effectively fed.

[0141] S130, the second shell 2 is connected to the heat sink unit 4 by the assembling assembly 7, so as to install and position the first intermediate plate 31, the second intermediate plate 32 and the PCB plate 33 respectively.

[0142] When the high-precision packaging of the 800G optical module is performed, the second shell 2 can be connected to the heat sink unit 4 by the assembling assembly 7, so as to install and position the first intermediate plate 31, the second intermediate plate 32 and the PCB plate 33 respectively, so as to fix the first intermediate plate 31, the second intermediate plate 32 and the PCB plate 33, complete the assembly of the second shell 2, the heat sink unit 4 and the working unit 3, and form an assembled unit obtained by assembling the second shell 2, the heat sink unit 4 and the working unit 3.

[0143] S140, the heat sink unit 4 is positioned in the first shell 1, and the first shell 1 and the second shell 2 are connected by buckling.

[0144] After obtaining the assembled unit assembled by the second shell 2, the heat sink unit 4 and the working unit 3, the heat sink unit 4 can be positioned in the first shell 1, and the first shell 1 and the second shell 2 are connected by buckling, and then the first shell 1 and the second shell 2 can form the shell structure of the 800G optical module.

[0145] The above-mentioned implementation manner has the beneficial effect that the assembled unit assembled by the second shell, the heat sink unit and the working unit can protect the working unit and avoid damage to the working unit during packaging.

[0146] The above-mentioned implementation manner also has the beneficial effect that the cross section of the first shell is U-shaped, the heat sink unit and the second shell can protect the working unit after fixing the working unit to form the assembled unit, and can avoid scratching the working unit by the first shell, thereby improving the assembly quality of the 800G optical module.

[0147] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. An 800G optical module, characterized in that: include: The first shell is provided with a buckle for connecting with the second shell, and the cross section of the first shell is U-shaped; The second housing is used to connect with the first housing to form the housing of the 800G optical module; The working unit includes a first middle board, a second middle board, a PCB board, and an MPO connector. The first middle board is provided with multiple transmitting units, the second middle board is provided with multiple receiving units, the PCB board is coupled to the first middle board and the second middle board respectively, and the multiple receiving units, the multiple transmitting units, and the MPO connector are connected via optical fibers. A heat sink unit is used to be connected to the second housing to respectively install and position the first intermediate plate, the second intermediate plate and the PCB board, and the heat sink unit can be installed in the first housing for positioning; The heat sink unit is provided with a first positioning groove, a second positioning groove and a third positioning groove. The first positioning groove is used to position the first intermediate plate, the second positioning groove is used to position the second intermediate plate, and the third positioning groove is used to position the PCB board. The second housing can be connected to the heat sink unit to squeeze and position the first intermediate plate, the second intermediate plate and the PCB board. The heat sink unit and the second shell are respectively provided with a plurality of mounting holes along the length direction on both sides thereof, and the plurality of mounting holes are used to connect the heat sink unit and the second shell by screws.

2. The 800G optical module according to claim 1, wherein: The first positioning groove is provided with a first positioning hole for passing multiple emission units. A TEC heat sink is provided on one side of the first shell close to the heat sink unit for dissipating heat from the heat sink unit. The TEC heat sink is electrically connected to the PCB board through a cable.

3. The 800G optical module according to claim 2, wherein: A first heat-conducting silicone sheet is provided on one side of the TEC heat sink close to the first positioning hole.

4. The 800G optical module according to claim 3, wherein: A second thermally conductive silicone sheet for dissipating heat to the first intermediate plate is provided in the first positioning groove, an opening is provided on the second thermally conductive silicone sheet corresponding to the first positioning hole, a third thermally conductive silicone sheet for dissipating heat to the second intermediate plate is provided in the second positioning groove, and a fourth thermally conductive silicone sheet for dissipating heat to the PCB board is provided in the third positioning groove.

5. The 800G optical module according to claim 4, wherein: A fifth thermally conductive silicone sheet is provided on the second shell, and is used to conduct heat between the second shell and the PCB board. A heat dissipation fin is provided on a side of the second shell away from the fifth thermally conductive silicone sheet.

6. The 800G optical module according to claim 5, wherein: The thickness of the first thermally conductive silicone sheet is 0.5mm to 1mm, the thickness of the second thermally conductive silicone sheet, the third thermally conductive silicone sheet and the fourth thermally conductive silicone sheet is 1mm to 2mm, and the compression rate of the second thermally conductive silicone sheet, the third thermally conductive silicone sheet and the fourth thermally conductive silicone sheet is greater than the compression rate of the first thermally conductive silicone sheet.

7. A high-precision packaging device for 800G optical modules, characterized in that: Used to package the 800G optical module according to any one of claims 1 to 6, comprising: A fixing assembly, used for installing and fixing the heat sink unit; A moving component, used for adsorbing and placing the working unit onto the heat sink unit; The assembly component is used to connect the second shell to the heat sink unit to respectively install and position the first middle plate, the second middle plate and the PCB board.

8. The high-precision packaging device for an 800G optical module according to claim 7, wherein: The fixing assembly is provided with a positioning column that can extend into the mounting hole of the heat sink unit. A spring is provided in the positioning column to support the positioning column. The positioning column can compress the spring when the heat sink unit and the second shell are connected by screws, so that the positioning column falls out of the mounting hole.

9. A high-precision packaging method for an 800G optical module, characterized in that: Using the high-precision packaging device for an 800G optical module according to claim 7 or 8, the method includes: Installing and fixing the heat sink unit through the fixing assembly; The working unit is adsorbed and placed on the heat sink unit by moving the component; Connecting the second housing to the heat sink unit through an assembly component to respectively install and position the first middle plate, the second middle plate and the PCB board; The heat sink unit is installed in the first shell for positioning, and the first shell and the second shell are connected by snap fasteners.

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