Display module and temperature control method thereof

Abstract

The application discloses a display module and a temperature control method thereof, and relates to the technical field of display devices, wherein the display module comprises a display panel and a backlight assembly; the display panel comprises a substrate, a pixel layer and a driving chip arranged on the surface of the substrate; the driving chip is used for controlling the display of the pixel layer; the backlight assembly comprises a light emitting piece and a light guide assembly; the light emitting piece is attached to the surface of the substrate away from the driving chip; the light guide assembly is arranged on the light emitting side of the light emitting piece and is used for receiving the light emitted by the light emitting piece and emitting the light towards the display panel; the orthographic projection of the light emitting piece and the driving chip on the surface of the substrate at least partially overlaps; the heat generated by the light emitting piece can be conducted to the driving chip through the substrate, thereby solving the problem that the existing driving chip cannot work normally at low temperature; meanwhile, the heat for heating the driving chip is derived from the heat of the light emitting piece itself, no additional heating device is added, and the processing cost and power consumption of the display module are reduced.

Description

Technical Field

[0001] This invention relates to the field of display device technology, and in particular to a display module and its temperature control method. Background Technology

[0002] With the development of display technology, the performance of display modules is constantly improving to meet the ever-increasing display demands. One of the core components of a display module is the driver IC (Integrated Circuit), which is responsible for driving the pixel units in the display panel. The performance of the driver IC is greatly affected by the ambient temperature. In low-temperature environments, especially below -40 degrees Celsius, the driver IC may not function properly, severely affecting the display effect or causing the display panel to fail to display.

[0003] Currently, to address this issue, heating elements are typically added near the driver IC to maintain its normal operating temperature. However, these additional heating elements not only increase the manufacturing cost of the display module but also raise its power consumption. Summary of the Invention

[0004] The main objective of this invention is to propose a display module and its temperature control method, aiming to solve the problem of how to ensure the normal operation of the driver IC under low-temperature conditions without increasing cost and power consumption in existing display modules.

[0005] To achieve the above objectives, the present invention proposes a display module comprising:

[0006] The display panel includes a substrate, a pixel layer disposed on the surface of the substrate, and a driving chip. The driving chip is used to control the display of the pixel layer.

[0007] A backlight assembly, comprising a light-emitting element and a light guide assembly, wherein the light-emitting element is attached to a surface of the substrate opposite to the driving chip, and the light guide assembly is disposed on the light-emitting side of the light-emitting element and is used to receive the light emitted by the light-emitting element and emit light toward the display panel, wherein the orthographic projections of the light-emitting element and the driving chip on the surface of the substrate at least partially overlap.

[0008] In one embodiment of the present invention, the display module further includes a circuit control board and a temperature sensor, wherein the temperature sensor is disposed on the surface of the substrate on which the driving chip is disposed;

[0009] The circuit control board is provided with a control unit, a first power supply circuit and a second power supply circuit. The first power supply circuit is electrically connected to the end of the light-emitting element facing the substrate, and the second power supply circuit is electrically connected to the end of the light-emitting element away from the substrate.

[0010] The control unit controls the switching of the first power supply circuit or the second power supply circuit to the light-emitting element based on the temperature of the driving chip collected by the temperature sensor.

[0011] In one embodiment of the present invention, the display module further includes a first voltage regulating module, which is electrically connected to the first power supply circuit;

[0012] When the first power supply circuit is electrically connected to the light-emitting element, the control unit adjusts the input voltage of the light-emitting element through the first voltage regulation module according to the temperature of the driving chip collected by the temperature sensor.

[0013] In one embodiment of the present invention, the display module further includes a back plate, the back plate being disposed on the side of the light guide assembly away from the substrate, and the circuit control board being disposed on the side of the back plate away from the light guide assembly.

[0014] The display module further includes a first flexible circuit board, the two ends of which are electrically connected to the circuit control board and the substrate, respectively.

[0015] The light-emitting element is electrically connected to the first voltage regulating module through the substrate and the first flexible circuit board.

[0016] In one embodiment of the present invention, the first flexible circuit board is electrically connected to the side of the substrate on which the driving chip is located, a through hole is formed on the surface of the substrate, a conductive portion is deposited in the through hole, the conductive portion is electrically connected to the first flexible circuit board, and a wiring layer connecting the conductive portion is provided on the side of the substrate facing the light-emitting element.

[0017] The light-emitting element is electrically connected to the first flexible circuit board through the wiring layer and the conductive part.

[0018] In one embodiment of the present invention, the display module further includes a second voltage regulating module, which is electrically connected to the second power supply circuit;

[0019] When the second power supply circuit is electrically connected to the light-emitting element, the control unit adjusts the input voltage of the light-emitting element according to the temperature of the driving chip collected by the temperature sensor and through the second voltage regulation module.

[0020] In one embodiment of the present invention, the display module further includes a second flexible circuit board, the two ends of which are electrically connected to the end of the light-emitting element away from the substrate and the circuit control board, respectively.

[0021] In one embodiment of the present invention, a plurality of driving chips are provided, and the plurality of driving chips are arranged at intervals on the surface of the substrate; a plurality of temperature sensors are provided, and each temperature sensor is disposed between two adjacent driving chips; a plurality of light-emitting elements are provided and arranged at intervals on the side of the substrate away from the driving chips.

[0022] The control unit adjusts the input voltage of the light-emitting element adjacent to the driver chip by means of the first voltage regulation module or the second voltage regulation module, based on the temperature of the driver chip at different locations collected by different temperature sensors.

[0023] In one embodiment of the present invention, the light guide assembly includes an optical film and a light guide plate. The light guide plate includes an incident light section and a light guide section arranged sequentially parallel to the substrate. The incident light section is located on the light emitting side of the light-emitting element. The longitudinal cross-sectional dimension of the incident light section decreases in the direction away from the light-emitting element. The optical film is located between the light guide section and the substrate.

[0024] The present invention also proposes a temperature control method for a display module as described in any of the above descriptions, wherein the display module further includes a temperature sensor, a circuit control board, a first power supply circuit, and a second power supply circuit, and the temperature sensor is disposed on the side of the substrate facing the driver chip; the temperature control method includes the following steps:

[0025] Control the light-emitting element to turn on;

[0026] Receive the real-time temperature of the driver chip collected by the temperature sensor, and determine whether the temperature is lower than a first preset temperature;

[0027] If so, the circuit control board is controlled to input voltage to the end of the light-emitting element facing the substrate through the first power supply circuit;

[0028] If not, the control circuit board is controlled to input voltage to the end of the light-emitting element away from the substrate through the second power supply circuit.

[0029] The display module proposed in this invention includes a display panel and a backlight assembly. The display panel includes a substrate, a pixel layer, and a driving chip disposed on the surface of the substrate. Under the drive of the driving chip, the display effect of the pixel layer can be controlled and adjusted. The backlight assembly includes a back plate, a light-emitting element, and a light guide assembly. The light-emitting element is disposed on the side of the substrate away from the driving chip, that is, the light-emitting element and the driving chip are respectively disposed on opposite surfaces of the substrate. Therefore, the heat generated by the light-emitting element when emitting light can be conducted to the driving chip through the substrate, thereby heating the driving chip. This solves the problem that existing driving chips cannot work normally at low temperatures. At the same time, the heat for heating the driving chip comes from the heat of the light-emitting element itself. Therefore, compared with the existing solution of adding a preheating device, this application can reduce the processing cost of the display module and reduce the power consumption of the module. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of the internal structure of the display module provided by the present invention;

[0032] Figure 2 This is a top view of the display module provided by the present invention;

[0033] Figure 3 for Figure 2 A magnified view of a portion at point A;

[0034] Figure 4 A bottom view of the glass substrate in the display module provided by the present invention;

[0035] Figure 5 for Figure 4 A magnified view of a portion at point B;

[0036] Figure 6 A flowchart of an embodiment of the temperature control method for a display module provided by the present invention;

[0037] Figure 7 A flowchart of another embodiment of the temperature control method for a display module provided by the present invention;

[0038] Figure 8 A flowchart of yet another embodiment of the temperature control method for the display module provided by the present invention.

[0039] Explanation of icon numbers:

[0040] 10. Display panel; 11. Substrate; 12. Driver chip; 13. Conductive part; 14. Wiring layer; 15. Temperature sensor; 20. Backlight assembly; 21. Backplate; 22. Light-emitting element; 221. First pad; 222. Second pad; 23. Light guide assembly; 231. Light guide plate; 232. Optical film; 233. Mounting groove; 30. Circuit control board; 40. First flexible circuit board; 50. Second flexible circuit board.

[0041] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0042] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0043] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indications will also change accordingly.

[0044] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0045] This invention proposes a display module.

[0046] Combination Figure 1As shown, in one embodiment of the present invention, the display module includes a display panel 10 and a backlight assembly 20. The display panel 10 includes a substrate 11 and a pixel layer and a driving chip 12 disposed on the surface of the substrate 11. The driving chip 12 is used to control the display of the pixel layer. The backlight assembly 20 includes a light-emitting element 22 and a light-guiding component 23. The light-emitting element 22 is attached to a surface of the substrate 11 away from the driving chip 12. The light-guiding component 23 is disposed on the light-emitting side of the light-emitting element 22 and is used to receive the light emitted by the light-emitting element 22 and emit light toward the display panel 10. The orthographic projections of the light-emitting element 22 and the driving chip 12 on the surface of the substrate 11 at least partially overlap.

[0047] This application provides an inventive concept of using the heat of the light-emitting element 22 to heat the driving chip 12, wherein the display module can be a liquid crystal display module, an LED display module, an OLED display module, etc. Here, this application uses a liquid crystal display module as an example to illustrate the inventive concept.

[0048] In this embodiment, the display substrate 11 can be a light-transmitting substrate such as a glass substrate 11 or a plastic substrate 11, the specific choice depending on the application scenario of the display module. A pixel layer and a driving chip 12 are disposed on the display substrate 11. The pixel layer includes a thin-film transistor (TFT), an alignment layer, a liquid crystal molecule layer, a color filter layer, and a polarizer. The driving chip 12 controls the display state of the pixels in the liquid crystal display panel 10 by driving the TFT and the liquid crystal molecule layer. Specifically, the driving chip 12 controls the switching of the TFT, thereby controlling the electric field acting on the liquid crystal molecule layer. Under the action of the electric field, the liquid crystal molecules change their alignment, thereby controlling the amount of light passing through and forming an image.

[0049] The light-emitting element 22 can be an LED, an OLED, or other type of light source, depending on the brightness and color requirements of the display module. For example, high-power LEDs can be selected for high-brightness applications, while OLEDs can be selected for high color gamut applications. The light-emitting element 22 can be uniformly distributed across the entire surface of the substrate 11, or its layout can be optimized according to the pixel distribution of the display panel 10 to improve the uniformity and efficiency of the backlight. The connection between the light-emitting element 22 and the substrate 11 can be achieved through bonding, welding, or mechanical fixing. For example, bonding is suitable for applications requiring good thermal conductivity, while welding is suitable for applications requiring high connection strength.

[0050] The light guide assembly 23 includes a light guide plate 231 and may also include an optical film 232. The light guide plate 231 can be made of transparent materials such as PMMA and PC, and has good light guiding performance. The shape of the light guide plate 231 can be planar, wavy, or stepped, depending on the uniformity requirements of the backlight. The optical film 232 may include various films such as diffusion films, brightness enhancement films, and reflective films. By combining different types of films, the uniformity and brightness of the backlight can be further improved.

[0051] This application mounts the light-emitting element 22 on the side of the substrate 11 away from the driver chip 12, with the orthographic projections of the light-emitting element 22 and the driver chip 12 onto the surface of the substrate 11 at least partially overlapping. This design reduces the distance between the light-emitting element 22 and the driver chip 12, allowing the heat generated by the light-emitting element 22 during light emission to be conducted to the driver chip 12 more quickly through the substrate 11, thereby heating the driver chip 12 and ensuring that the driver chip 12 can quickly reach its normal operating temperature in low-temperature environments. This solves the problem that existing driver chips 12 cannot operate normally at low temperatures. At the same time, this design makes the display module structure more compact, reduces the use of additional heating devices, and lowers the processing cost and power consumption of the display module.

[0052] Furthermore, such as Figure 1 As shown, the light-emitting element 22 is positioned directly below the driver chip 12, which further improves the efficiency of heat conduction to the driver chip 12.

[0053] In addition, a thermal pad or thermal paste can be placed between the light-emitting element 22 and the substrate 11 to enhance heat conduction; or the light-emitting element 22 can be soldered onto the substrate 11. These optimization measures can enable the driver chip 12 to operate stably under low-temperature conditions, improving the overall performance and reliability of the display module.

[0054] Combination Figures 1 to 3 As shown, in one embodiment of the present invention, the display module further includes a circuit control board 30 and a temperature sensor 15, the temperature sensor 15 being disposed on the side of the substrate 11 where the driving chip 12 is disposed.

[0055] The control unit, the first power supply circuit and the second power supply circuit on the circuit control board 30 are electrically connected to the end of the light-emitting element 22 facing the substrate 11, and the second power supply circuit is electrically connected to the end of the light-emitting element 22 away from the substrate 11.

[0056] The control unit controls the switching of the first power supply circuit or the second power supply circuit to the light-emitting element 22 based on the temperature of the driving chip 12 collected by the temperature sensor 15.

[0057] In this embodiment, the temperature sensor 15 can be of different types, such as a thermistor, thermocouple, or infrared temperature sensor 15, depending on the requirements for measurement accuracy and response speed. For example, a thermistor is suitable for applications requiring high-precision measurement, while an infrared temperature sensor 15 is suitable for applications requiring non-contact measurement. The control unit is an MCU (Microcontroller Unit) or microprocessor, single-chip microcomputer, etc., to implement complex temperature control algorithms.

[0058] The light-emitting element 22 has a dual-input structure, meaning that power can be supplied to the light-emitting element 22 through either the end facing the substrate 11 or the end facing away from the substrate 11. Since the temperature at the pads of the light-emitting element 22 is higher during operation, the heat conducted to the driver chip 12 when the end of the light-emitting element 22 facing the substrate 11 is connected to the power supply is greater than the heat conducted to the driver chip 12 when the end of the light-emitting element 22 facing away from the substrate 11 is connected to the power supply. The temperature sensor 15 is communicatively connected to the control unit. The control unit can dynamically select to supply power to the light-emitting element 22 through either the first power supply circuit or the second power supply circuit based on the temperature data collected by the temperature sensor 15, ensuring optimal temperature control under different temperature conditions and further improving the accuracy and reliability of temperature control.

[0059] In one embodiment of the present invention, the display module further includes a first voltage regulating module, which is electrically connected to a first power supply circuit;

[0060] When the first power supply circuit is electrically connected to the light-emitting element 22, the control unit adjusts the input voltage of the light-emitting element 22 through the first voltage regulation module according to the temperature of the driving chip 12 collected by the temperature sensor 15.

[0061] In this embodiment, the first voltage regulation module can be a switching DC-DC boost circuit or a linear regulator. The switching DC-DC boost circuit is suitable for applications requiring high efficiency, while the linear regulator is suitable for applications requiring low noise. The specific choice depends on the balance between efficiency and cost.

[0062] The MCU has logic processing capabilities. After the temperature sensor 15 transmits temperature data to the MCU, the MCU outputs a PWM signal based on the temperature change. The first voltage regulation module receives the PWM signal sent by the MCU and adjusts the power supply voltage, thereby achieving precise adjustment of the input voltage of the light-emitting element 22. For example, when the temperature is lower than a preset threshold, the MCU increases the input voltage of the light-emitting element 22 through the first voltage regulation module, thereby increasing the heat of the light-emitting element 22 and raising the temperature of the driver chip 12.

[0063] The solution in this embodiment monitors the temperature of the driver chip 12 in real time and dynamically adjusts the input voltage of the light-emitting element 22 according to the temperature, ensuring that the driver chip 12 can heat up rapidly under low temperature conditions while avoiding overheating, thereby improving the temperature control accuracy and reliability of the display module.

[0064] Combination Figures 1 to 3 As shown, in one embodiment of the present invention, the display module further includes a back plate 21, which is disposed on the side of the light guide assembly 23 away from the substrate 11, and the circuit control board 30 is disposed on the side of the back plate 21 away from the light guide assembly 23.

[0065] The display module also includes a first flexible circuit board 40, the two ends of which are electrically connected to the circuit control board 30 and the substrate 11, respectively.

[0066] The light-emitting element 22 is electrically connected to the first voltage regulating module through the substrate 11 and the first flexible circuit board 40.

[0067] In this embodiment, the backplate 21 not only provides structural support but also protects the internal components. The backplate 21 can be made of metal (such as aluminum or stainless steel) or high-strength plastic, the specific choice depending on the structural strength and weight requirements of the display module. For example, a metal backplate 21 is suitable for applications requiring high structural strength and good heat dissipation, while a plastic backplate 21 is suitable for applications requiring lightweight design.

[0068] The circuit control board 30 is positioned on the side of the backplate 21 opposite to the light guide assembly 23, that is, on the outside of the display panel 10 and the backlight assembly 20. Since the interior of the display panel 10 and the backlight assembly 20, as well as the space between them, is the area for light propagation, the spacing between the various films and components needs to be strictly controlled to ensure display quality. Therefore, the circuit control board 30 is positioned on the outside of the backplate 21 to avoid occupying the internal space of the display panel 10 and the backlight assembly 20, thereby improving the integration, space utilization, and component layout convenience of the display panel 10 and the backlight assembly 20.

[0069] By providing a first flexible circuit board 40, the circuit connection between the substrate 11 and the circuit control board 30 becomes more flexible, facilitating assembly and maintenance. The first flexible circuit board 40 can be made of polyimide (PI) or polyester (PET) material, the specific choice depending on the requirements for flexibility and temperature resistance.

[0070] Combination Figure 1As shown, in one embodiment of the present invention, the first flexible circuit board 40 is electrically connected to the side of the substrate 11 where the driving chip 12 is provided. A through hole is opened on the surface of the substrate 11, and a conductive part 13 is deposited in the through hole. The conductive part 13 is electrically connected to the first flexible circuit board 40. A wiring layer 14 for connecting the conductive part 13 is provided on the side of the substrate 11 facing the light-emitting element 22.

[0071] The light-emitting element 22 is electrically connected to the first flexible circuit board 40 through the wiring layer 14 and the conductive part 13.

[0072] In this embodiment, by creating through-holes and depositing conductive portions 13 on the substrate 11, a highly efficient electrical connection between the light-emitting element 22 and the circuit control board 30 is achieved, ensuring the stability and reliability of signal transmission. The conductive portions 13 can be made of materials with good conductivity, such as copper or silver. The diameter and depth of the through-holes can be adjusted according to actual needs to ensure reliable connection of the conductive portions 13. For example, when applied to high-current transmission applications, through-holes with larger diameters are created on the surface of the substrate 11; when the current is low or applied to scenarios requiring fine wiring, the diameter of the through-holes is set to be smaller. The through-holes are created in the non-GOA area of ​​the substrate 11 to avoid damage to the driver chip 12 circuitry.

[0073] Before drilling through-holes and depositing conductive portions 13 on the surface of substrate 11, the surface of substrate 11 needs to be cleaned using deionized water or organic solvents. After cleaning, holes are drilled on both sides of substrate 11, ensuring that the holes on both sides are vertically aligned and interconnected. Using double-sided drilling reduces the depth of each drilling operation, thus minimizing damage to substrate 11 during the drilling process. Furthermore, since through-hole sizes are typically small and limited by process technology, the shape of through-holes is often inverted trapezoidal. Double-sided drilling can reduce the variation in through-hole diameter along the depth direction to some extent, thereby improving the dimensional uniformity of conductive portions 13 along the thickness direction of substrate 11. After drilling, numerous burrs may be generated on the inner walls of the through-holes, which can hinder the deposition of metal material. Therefore, before depositing the conductive portions 13, the burrs on the inner walls of the through-holes need to be removed using an etching process before depositing the conductive metal material into the through-holes.

[0074] The trace layer 14 is formed of electroplated copper or aluminum and other metal materials. The width and spacing of the trace layer 14 can be optimized according to actual needs to ensure the stability of signal transmission and anti-interference ability. For example, wider traces are suitable for applications requiring high current transmission, while narrower traces are suitable for applications requiring high-density wiring.

[0075] The end face of the light-emitting element 22 facing the substrate 11 is provided with a first pad 221. The light-emitting element 22 is electrically connected to the wiring layer 14 through the first pad 221. The first pad 221 is made of materials such as gold, silver or copper with good electrical conductivity and thermal conductivity to reduce the thermal resistance between the light-emitting element 22 and the driver chip 12 and reduce the power consumption of the light-emitting element 22.

[0076] In one embodiment of the present invention, the display module further includes a second voltage regulating module, which is electrically connected to the second power supply circuit;

[0077] When the second power supply circuit is electrically connected to the light-emitting element 22, the control unit adjusts the input voltage of the light-emitting element 22 according to the temperature of the driving chip 12 collected by the temperature sensor 15 and through the second voltage regulation module.

[0078] In this embodiment, by setting a second voltage regulation module and using the second voltage regulation module to adjust the input voltage of the light-emitting element 22 from the second power supply circuit, the accuracy of controlling the heat conducted from the light-emitting element 22 to the driver chip 12 is further improved.

[0079] Understandably, the control unit supplies power to the light-emitting element 22 by selecting either the first or second power supply circuit, thereby achieving a primary regulation of the heat conducted from the light-emitting element 22 to the driver chip 12. The control unit then adjusts the input voltage of the light-emitting element 22 via either the first or second voltage regulation module, achieving a secondary regulation of the heat conducted from the light-emitting element 22 to the driver chip 12. Through these two adjustments, the range and accuracy of the heat regulation from the light-emitting element 22 to the driver chip 12 can be improved.

[0080] The specific structure of the second voltage regulating module can be referenced from that of the first voltage regulating module, and will not be elaborated here.

[0081] Combination Figure 1 As shown, in one embodiment of the present invention, the display module further includes a second flexible circuit board 50, the two ends of which are electrically connected to the end of the light-emitting element 22 away from the substrate 11 and the circuit control board 30, respectively.

[0082] In this embodiment, a second pad 222 is provided on the end face of the light-emitting element 22 facing the back plate 21. The end of the light-emitting element 22 away from the substrate 11 is electrically connected to the circuit control board 30 through the second pad 222, thereby achieving the purpose of dual-path power supply to the light-emitting element 22. The structure and material of the second pad 222 can refer to the above description of the first pad 221, and are not further limited here.

[0083] The second flexible circuit board 50 can be made of the same material as the first flexible circuit board 40, such as polyimide (PI) or polyester (PET), depending on the requirements for flexibility and temperature resistance. Since the second pad 222 and the circuit control board 30 are located on opposite sides of the back plate 21, the second flexible circuit board 50 improves the convenience of electrical connection between the second pad 222 and the circuit control board 30.

[0084] Combination Figures 2 to 5 As shown, in one embodiment of the present invention, there are multiple driving chips 12, which are arranged at intervals on the surface of the substrate 11; there are multiple temperature sensors 15, each of which is located between two adjacent driving chips 12; and there are multiple light-emitting elements 22, which are arranged at intervals on the side of the substrate 11 away from the driving chips 12.

[0085] The control unit adjusts the input voltage of the light-emitting element 22 adjacent to the driver chip 12 by means of the first voltage regulating module or the second voltage regulating module, based on the temperature of the driver chip 12 at different locations collected by different temperature sensors 15.

[0086] In this embodiment, the driver chip 12 is disposed in the GOA (Gate on Array, integrated gate drive circuit) area of ​​the display panel 10, that is... Figure 2 The shaded area of ​​the substrate 11. Multiple driving chips 12 are used to drive different pixel areas for display, and the multiple driving chips 12 are along... Figure 2 They are arranged sequentially at intervals in a horizontal direction. Each temperature sensor 15 is placed between two adjacent driver chips 12 to comprehensively monitor the temperature distribution of the driver chips 12.

[0087] Multiple light-emitting elements 22 are also provided. The arrangement direction of the multiple light-emitting elements 22 is the same as the arrangement direction of the multiple driving chips 12. Furthermore, the orthographic projections of each light-emitting element 22 and each driving chip 12 on the substrate 11 at least partially overlap. Therefore, under the heat conduction effect of the multiple light-emitting elements 22, the temperature of the multiple driving chips 12 becomes more uniform, thereby improving the uniformity of the display effect of each display area of ​​the display panel 10.

[0088] Meanwhile, multiple first and second voltage regulation modules are also provided. Each first and second voltage regulation module is electrically connected to a light-emitting element 22 and is used to control the input voltage across the light-emitting element 22. The control unit analyzes the temperature of the driving chip 12 at different locations and adjusts the input voltage of the light-emitting element 22 accordingly through different first or second voltage regulation modules to achieve precise temperature control of each driving chip 12, thereby improving the temperature uniformity of each driving chip 12.

[0089] Combination Figure 1As shown, in one embodiment of the present invention, the light guide assembly 23 includes an optical film 232 and a light guide plate 231. The light guide plate 231 includes an incident light section and a light guide section arranged sequentially along the substrate 11. The incident light section is located on the light emitting side of the light-emitting element 22. The longitudinal cross-sectional dimension of the incident light section decreases in the direction away from the light-emitting element 22. The optical film 232 is located between the light guide section and the substrate 11.

[0090] In this embodiment, the optical film 232 may include various films such as a diffusion film, a brightness enhancement film, and a reflective film. By combining different types of films, the uniformity and brightness of the backlight can be further improved. For example, a diffusion film can be used to uniformly disperse light, a brightness enhancement film can be used to increase the brightness of light, and a reflective film can be used to reduce light loss. The thickness and number of layers of the optical film 232 can be adjusted according to actual needs to optimize the display effect. For example, a thicker optical film 232 is suitable for applications requiring higher brightness, while a thinner optical film 232 is suitable for applications requiring a lighter and thinner design.

[0091] An optical film 232 is disposed between a light guide plate 231 and a substrate 11. The light guide plate 231 is disposed on one side of the light-emitting element 22. To ensure that the light emitted by the light-emitting element 22 is transmitted to the optical film as far as possible through the light guide plate 231, one side of the light guide plate 231 is placed over the light outlet of the light-emitting element 22. Since the light-emitting element 22 is attached to the surface of the substrate 11, the light guide plate 231 is configured to include an incident light section and two ends of the light guide section. The incident light section is designed with a tapered shape so that the incident light section, the light guide section, and the substrate 11 enclose and form a mounting groove 233, providing space for the installation of the optical film and improving the integration level of the display module.

[0092] The side of the light-incident section facing the substrate 11 can be a slope, a curved surface, or a combination of both, to facilitate guiding the light emitted by the light-emitting element 22 to the light guide section. Furthermore, an emitting sheet is provided on the side of the light-incident section facing the substrate 11 to improve the efficiency of light transmission from the light-incident section to the light guide section. The light guide section is flat, meaning that both sides of the light guide section facing the back plate 21 and the substrate 11 are flat, to facilitate the installation of the optical film.

[0093] The light guide plate 231 can be made of transparent materials such as PMMA (polymethyl methacrylate) or PC (polycarbonate). The thickness and length of the light guide section can be optimized according to the size and brightness requirements of the display panel 10 to ensure uniform distribution of light within the light guide plate 231.

[0094] This invention also proposes a temperature control method for a display module, which further includes a temperature sensor 15, a circuit control board 30, a first power supply circuit, and a second power supply circuit. The temperature sensor 15 is located on the side of the substrate 11 facing the driver chip 12. The specific structure of the display module is as described in the above embodiment. In conjunction with... Figure 6 As shown, the temperature control method includes the following steps:

[0095] S10: Control the light-emitting element 22 to turn on;

[0096] S20: Receive the real-time temperature of the driver chip 12 collected by the temperature sensor 15, and determine whether the temperature is lower than the first preset temperature.

[0097] S30: If so, the control circuit control board 30 inputs the voltage to the end of the light-emitting element 22 facing the substrate 11 through the first power supply circuit;

[0098] S40: If not, the control circuit control board 30 supplies the input voltage to the end of the light-emitting element 22 away from the substrate 11 through the second power supply circuit.

[0099] In this embodiment, the temperature sensor 15 transmits the collected temperature data to the MCU (microcontroller unit) via a temperature data line. The MCU receives the temperature data collected by the temperature sensor 15 via the temperature data line and performs logical judgments. The MCU has a preset first preset temperature. The MCU compares the received temperature data with the first preset temperature and determines whether the driver chip 12 is in a low-temperature state.

[0100] Since the temperature at the pads of the light-emitting element 22 is relatively high, if the temperature of the driver chip 12 is lower than the first preset temperature, the MCU selects the first power supply circuit through the control circuit control board 30 and supplies power to the end of the light-emitting element 22 facing the substrate 11. If the temperature of the driver chip 12 is higher than the first preset temperature, the MCU selects the second power supply circuit through the control circuit control board 30 and supplies power to the end of the light-emitting element 22 away from the substrate 11.

[0101] By selecting a suitable power supply circuit to power the light-emitting element 22, the most appropriate path is dynamically selected to effectively heat the driver chip 12 under different temperature conditions. This allows the driver chip 12 to heat up rapidly at low temperatures while avoiding overheating, thus improving the temperature control accuracy and reliability of the display module. This design solves the problem of the driver chip 12 not working properly at low temperatures by utilizing the heat from the light-emitting element 22 to heat the driver chip 12, while also reducing the processing cost and power consumption of the display module.

[0102] Combination Figure 7As shown, in one embodiment of the present invention, the display module further includes a first voltage regulating module electrically connected to the first power supply circuit;

[0103] S31: Receive the real-time temperature of the driver chip 12 collected by the temperature sensor 15, and determine whether the temperature is lower than the second preset temperature;

[0104] S32: If so, control the first voltage regulating module to increase the input voltage of the light-emitting element 22;

[0105] S33: If not, control the first power supply circuit to maintain the current input voltage.

[0106] In this embodiment, the MCU compares the received temperature data with the second preset temperature. By comparing the temperature data and the second preset temperature, the MCU can further confirm whether the driver chip 12 needs higher heating power to ensure that it quickly reaches the operating temperature.

[0107] By dynamically adjusting the input voltage of the light-emitting element 22 to the first power supply circuit, the heat conducted from the light-emitting element 22 to the driver chip 12 can be further increased or decreased, ensuring that it can start up quickly under low temperature conditions, while also avoiding unnecessary energy waste and improving the energy efficiency of the system.

[0108] Combination Figure 8 As shown, in one embodiment of the present invention, the display module further includes a second voltage regulating module electrically connected to the second power supply circuit;

[0109] The step of inputting voltage to the end of the light-emitting element 22 away from the substrate 11 via the second power supply circuit to the control board 30 of the control circuit includes:

[0110] S41: Receive the real-time temperature of the driver chip 12 collected by the temperature sensor 15, and determine whether the temperature is lower than the third preset temperature.

[0111] S42: If so, control the second voltage regulating module to increase the input voltage of the light-emitting element 22;

[0112] S43: If not, control the second power supply circuit to maintain the current input voltage.

[0113] In this embodiment, the MCU compares the received temperature data with a third preset temperature. By comparing the temperature data with the third preset temperature, the MCU can further confirm whether the driver chip 12 needs higher heating power to ensure its stable operation under normal temperature conditions.

[0114] By dynamically adjusting the input voltage of the light-emitting element 22 to the second power supply circuit, the heat conducted from the light-emitting element 22 to the driver chip 12 can be further increased or decreased, ensuring that it can start up quickly under low temperature conditions, while also avoiding unnecessary energy waste and improving the energy efficiency of the system.

[0115] To facilitate understanding of the control method for the display module, the applicant also provides an embodiment of the temperature control method:

[0116] The first preset temperature is 0 degrees, the second preset temperature is -40 degrees, and the third preset temperature is 15 degrees.

[0117] First, the control unit determines whether the temperature of the current driver chip 12 is below 0 degrees Celsius. If the temperature is below 0 degrees Celsius, the control unit controls the switching of the first power supply circuit to electrically connect the end of the driver chip 12 facing the substrate 11. After the heat generated by the light-emitting element 22 is conducted to the driver chip 12 for a period of time, the control unit then determines whether the temperature of the current driver chip 12 is below -40 degrees Celsius. If the temperature is below -40 degrees Celsius, the control unit controls the first voltage regulation module to increase the input voltage of the light-emitting element 22; if the temperature is between -40 degrees Celsius and 0 degrees Celsius, the control unit controls the circuit control board 30 to maintain the current input voltage of the light-emitting element 22.

[0118] If the temperature is above 0 degrees Celsius, the control unit switches the second power supply circuit to the end of the driver chip 12 away from the substrate 11 for electrical conduction. After the heat generated by the light-emitting element 22 is conducted to the driver chip 12 for a period of time, the control unit determines whether the temperature of the driver chip 12 is between 0 and 15 degrees Celsius. If the temperature is between 0 and 15 degrees Celsius, the control unit controls the second voltage regulation module to increase the input voltage of the light-emitting element 22; if the temperature is above 15 degrees Celsius, the control unit controls the circuit control board 30 to maintain the current input voltage of the light-emitting element 22.

[0119] This invention also proposes a display device, which includes a display module. The specific structure of the display module is as described in the above embodiments. Since the display device adopts all the technical solutions of all the above embodiments of the display module, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be elaborated here. The display device can be an in-vehicle LCD screen, a mobile terminal screen, etc. By integrating the display module into the screen, the problem of reduced display effect or inability to display due to the driver chip 12 failing to work properly at low temperatures is solved. Simultaneously, this problem is solved by utilizing the heat generated by the light-emitting element 22 during operation. Therefore, compared with existing solutions that add preheating devices, this application can reduce the processing cost and power consumption of the display device.

[0120] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A display module, characterized in that, include: The display panel includes a substrate, a pixel layer disposed on the surface of the substrate, and a driving chip. The driving chip is used to control the display of the pixel layer. A backlight assembly, comprising a light-emitting element and a light guide assembly, wherein the light-emitting element is attached to a surface of the substrate away from the driving chip, and the light guide assembly is disposed on the light-emitting side of the light-emitting element and is used to receive the light emitted by the light-emitting element and emit light toward the display panel; The orthographic projections of the light-emitting element and the driving chip onto the substrate surface at least partially overlap; The display module also includes a circuit control board and a temperature sensor, wherein the temperature sensor is disposed on the surface of the substrate on which the driving chip is located; The circuit control board is provided with a control unit, a first power supply circuit and a second power supply circuit. The first power supply circuit is electrically connected to the end of the light-emitting element facing the substrate, and the second power supply circuit is electrically connected to the end of the light-emitting element away from the substrate. Specifically, the control unit controls the switching of the first power supply circuit to the light-emitting element when the temperature of the driving chip collected by the temperature sensor is lower than a first preset temperature; and controls the switching of the second power supply circuit to the light-emitting element when the temperature of the driving chip is lower than a second preset temperature.

2. The display module as described in claim 1, characterized in that, The display module further includes a first voltage regulating module, which is electrically connected to the first power supply circuit. When the first power supply circuit is electrically connected to the light-emitting element, the control unit increases or maintains the input voltage of the light-emitting element through the first voltage regulation module based on the temperature of the driving chip collected by the temperature sensor.

3. The display module as described in claim 2, characterized in that, The display module also includes a back plate, which is disposed on the side of the light guide assembly away from the substrate, and the circuit control board is disposed on the side of the back plate away from the light guide assembly. The display module further includes a first flexible circuit board, the two ends of which are electrically connected to the circuit control board and the substrate, respectively. The light-emitting element is electrically connected to the first voltage regulating module through the substrate and the first flexible circuit board.

4. The display module as described in claim 3, characterized in that, The first flexible circuit board is electrically connected to the side of the substrate where the driving chip is located. A through hole is formed on the surface of the substrate, and a conductive part is deposited in the through hole. The conductive part is electrically connected to the first flexible circuit board. A wiring layer connecting the conductive part is provided on the side of the substrate facing the light-emitting element. The light-emitting element is electrically connected to the first flexible circuit board through the wiring layer and the conductive part.

5. The display module as described in any one of claims 2 to 4, characterized in that, The display module further includes a second voltage regulating module, which is electrically connected to the second power supply circuit. When the second power supply circuit is electrically connected to the light-emitting element, the control unit increases or maintains the input voltage of the light-emitting element through the second voltage regulation module based on the temperature of the driving chip collected by the temperature sensor.

6. The display module as described in claim 5, characterized in that, The display module further includes a second flexible circuit board, the two ends of which are electrically connected to the end of the light-emitting element that is away from the substrate and the circuit control board, respectively.

7. The display module as described in claim 5, characterized in that, The driving chip is provided in multiple ways, and the multiple driving chips are arranged at intervals on the surface of the substrate. The temperature sensor is provided in multiple ways, and each temperature sensor is located between two adjacent driving chips. The light-emitting element is provided in multiple ways and is arranged at intervals on the side of the substrate away from the driving chip. The control unit adjusts the input voltage of the light-emitting element adjacent to the driver chip by means of the first voltage regulation module or the second voltage regulation module, based on the temperature of the driver chip at different locations collected by different temperature sensors.

8. The display module as described in any one of claims 1 to 4, characterized in that, The light guide assembly includes an optical film and a light guide plate. The light guide plate includes an incident light section and a light guide section arranged sequentially parallel to the substrate. The incident light section is located on the light emitting side of the light-emitting element. The longitudinal cross-sectional dimension of the incident light section decreases in the direction away from the light-emitting element. The optical film is located between the light guide section and the substrate.

9. A temperature control method for a display module as described in any one of claims 1 to 8, characterized in that, The display module further includes a temperature sensor, a circuit control board, a first power supply circuit, and a second power supply circuit. The temperature sensor is located on the side of the substrate facing the driver chip. The temperature control method includes the following steps: Control the light-emitting element to turn on; Receive the real-time temperature of the driver chip collected by the temperature sensor, and determine whether the temperature is lower than a first preset temperature; If so, the circuit control board is controlled to input voltage to the end of the light-emitting element facing the substrate through the first power supply circuit; If not, the control circuit board then supplies the input voltage to the end of the light-emitting element away from the substrate via the second power supply circuit.

Images