Test warehousing and packaging adjusting and selecting method and system for memory chips Die

Abstract

The invention relates to the field of memory chip production and manufacturing, and discloses a memory chip Die test warehousing and packaging adjustment and selection method and system, and the system comprises a test classification system, a storage system, and a control system. The test classification system comprises a test module used for testing performance and a test information acquisition module used for acquiring Die test performance and corresponding physical positions. The storage system comprises a Die storage module for storing tested Die in a classified mode, a physical position indicating module for indicating the physical position of the Die in the in-out and in-out process and an in-out and in-out information collecting module for collecting the in-out and in-out information of the Die, and the control system comprises a control module, an analysis module and at least two data storage modules. The warehouse-in system method with indication and the scheduling and warehouse-out system method for performing specific indication in sequence can be operated integrally or partially, testing storage warehouse-in and packaging scheduling and warehouse-out data interconnection are realized, scheduling and warehouse-out of the storage chip Die are simple and convenient, and the efficiency and the overall utilization rate are improved.

Description

Technical Field

[0001] The present invention relates to the field of memory chip production and manufacturing, and in particular to a memory chip Die testing warehousing and packaging selection method and system. Background Art

[0002] In the manufacturing process of integrated circuits, each produced wafer is cut into small pieces, called dies (bare chips). Each die (bare chip) is an independent electronic component with its own circuits and functions.

[0003] Existing finished memory chips are all packaged by a single or several dies (bare chips). In order to ensure the quality and performance of memory chips, batches of dies (bare chips) cut from round wafers need to be tested to detect and eliminate possible defects or faults. The tested dies (bare chips) are usually divided into multiple levels according to the test performance and stored in the warehouse. When memory chips with target performance need to be packaged, the dies (bare chips) need to be packaged and designed, and then the corresponding dies (bare chips) are selected from the warehouse for packaging. Since the individual dies (bare chips) are small and inconvenient to mark on them, they are difficult to identify, and the warehousing and outbound operations are cumbersome and inconvenient, with low efficiency. Especially in the process of packaging memory chips by combining dies (bare chips) of multiple models and different levels, the storage selection is cumbersome and inefficient, and the selection of inventory dies (bare chips) is not intuitive, which easily leads to some being left behind, resulting in waste. Summary of the invention

[0004] The present invention provides a method and system for testing, warehousing and packaging selection of memory chip Die, which solves the problems that in the current process of packaging memory chips by combining multiple dies (bare wafers), the storage selection is cumbersome and inefficient, the selection of inventory dies (bare wafers) is not intuitive, and some are easily left over, resulting in waste.

[0005] The technical solution adopted by the present invention to solve the technical problem is: a method for testing, warehousing and packaging and selecting a memory chip Die, comprising the following steps:

[0006] S01. Establish a Die model classification database and storage warehouse: Die models of various types are classified into multiple levels according to performance based on the company's existing data and market demand data, and a model classification database is established for storage and backup. According to the Die model classification database, a classification storage unit corresponding to the model classification is established in the Die storage warehouse;

[0007] S02. Establish a combined packaging database for storage chips: Design various combined packaging for different models and levels of Die based on the company's existing storage chip performance requirements and the storage chip performance requirements on the market, and establish a combined packaging database for storage and backup;

[0008] S03. Input of Die Information: Before testing the Dies that need to be tested, input the model information of the Dies to be tested.

[0009] S04, Die test classification matching: compare the model information of the Die to be tested with the Die model information in the model classification database to determine whether there is a Die of the corresponding model in the model classification database. If there is a Die of the corresponding model, directly execute step S06; if there is no corresponding model, execute step S05;

[0010] S05. Addition of new Die model classification data into the database and establishment of corresponding definition of storage location: After analyzing the new Dies to be tested according to customer and market needs, the new Dies are classified into multiple levels by performance, and the corresponding data is added to the model classification database for storage and backup. In the Die storage warehouse, corresponding definition is established for the classification storage unit corresponding to the new Die model classification;

[0011] S06. Die performance test classification: define and classify the unloading and storage locations of the test equipment according to the classification data in the model classification database, unload and store the tested dies in the corresponding categories, and collect and store the test performance information of each die and the physical storage location information after the test during the test;

[0012] S07, Die transfer and storage: Dies are assigned to different storage locations in the storage warehouse according to their model and classification information. During the storage process, the performance information of each die and the physical storage information in the storage warehouse are collected and stored;

[0013] S08. Memory chip performance requirement input: input the required memory chip performance requirements;

[0014] S09, package matching: comparing the performance requirements of the memory chip with the performance of the memory chip in the combination package database, and determining whether there is memory chip combination package information of corresponding performance in the combination package database; if there is memory chip combination package information of corresponding performance, directly executing step S16; if there is no memory chip combination package information of corresponding performance, executing step S10;

[0015] S10, new combination package analysis and design: Analyze whether the Dies in the company's existing model classification database can be combined and packaged into a memory chip that meets the performance requirements. If so, execute step S11; if not, execute step S13;

[0016] S11. New combination package design based on existing dies: According to the performance requirements of memory chips, analyze and design the dies of different levels of various models in the existing model classification database, and design a combination package solution that meets the performance requirements of memory chips;

[0017] S12, storing the new combination package design data based on the existing Die: adding the newly designed combination matching package data to the combination package database and storing and backing it up, and then executing in sequence from step S08;

[0018] S13. New combination package design based on newly added dies: According to the performance requirements of the memory chip, analyze and design the various models of different levels of dies in the existing model classification database and the various models of different levels of dies available on the market, and design a combination package solution that meets the performance requirements of the memory chip;

[0019] S14, storing new combination package design data based on newly added Dies: adding the newly designed combination matching package data to the combination package database and storing and backing it up;

[0020] S15, adding new dies as needed: preparing new dies of new models according to the performance of the dies that are missing from the combination matching package, and then executing from step S05 in sequence;

[0021] S16, combined package selection display: according to the performance requirements of the memory chip and the combined package database, the selection options of the combined package design and the number of corresponding combined package memory chips are displayed;

[0022] S17, select packaging combination options: select one or more required combination packaging design options and the number of dies to be shipped out of the warehouse according to performance and quantity requirements. If the number of dies in the warehouse is sufficient, execute step S19; if the number of dies in the warehouse is insufficient, execute step S18;

[0023] S18, increase the number of Dies in the warehouse: increase the number of Dies in batches according to demand, and then start from step S03 step by step;

[0024] S19, Die selection and outbound delivery: According to the selected combined packaging selection option, the matching Dies in the Die storage warehouse are physically stored in the outbound order, and the stored Dies are outbound in sequence according to the instructions of the storage warehouse.

[0025] The storage and selection system of the entire memory chip Die can be operated in whole or in part according to the above method, so as to achieve the interconnection of the test storage warehousing and the packaging and selection and retrieval data of the Die. The retrieval and selection of the memory chip Die is simple and convenient, which improves the efficiency and overall utilization of the Die retrieval and selection.

[0026] Furthermore, the newly added Die model classification data storage and storage location corresponding definition establishment in step S05 include:

[0027] S0501. Analyze the new models of Die to be tested according to customer and market needs and classify them into multiple levels by performance. Add the corresponding data into the model classification database and store and back up them.

[0028] S0502, determine whether there is an idle undefined classification storage unit, if yes, execute step S0504, if not, execute step S0503;

[0029] S0503, add a new idle classification storage unit;

[0030] S0504. Define and establish a storage location in a free classified storage unit according to the classification of the newly added model Die.

[0031] Informatization makes full use of storage and outbound space to avoid wasting space and can add and supplement it in time according to demand.

[0032] Furthermore, the Die performance test classification in step S06 includes:

[0033] S0601. Define and classify the unloading units of the testing equipment according to the classification data of the corresponding Die model in the model classification database, and place storage and loading units for matching and storing the Dies after the test at the unloading units of each category;

[0034] S0602. During the test, the performance information collection unit collects and stores the Die of the test;

[0035] S0603. After the test, the Die is transplanted to the storage and loading unit at the corresponding unloading unit according to the performance. The storage and loading unit information is collected during the unloading process, and the specific position of the Die in the storage and loading unit is recorded according to the storage and loading sequence.

[0036] Furthermore, the Die transfer into storage in step S07 includes:

[0037] S0701, collect information of storage loading units carrying Die that are put into storage;

[0038] S0702, matching the Die model classification loaded by the storage loading unit with the classification storage unit;

[0039] S0703. According to the matching results, the storage locations are checked one by one in order, and the storage loading units are placed at the corresponding positions according to the instructions to complete the warehousing.

[0040] Furthermore, the Die selection and extraction of the library in step S19 includes:

[0041] S1901, the storage loading unit generates a delivery sequence according to the order of delivering Dies of the same model level first from the outside and then from the inside;

[0042] S1902. According to the generated outbound order, the storage locations are processed one by one in order, and the storage loading units are correspondingly outbound according to the instructions, and the storage loading unit information is collected during the outbound process.

[0043] A storage chip Die test warehousing and packaging and selection system is used to implement the storage chip Die test warehousing and packaging and selection method. The system includes a test classification system, a storage system and a control system. The test classification system includes a Die test module for measuring Die performance and a test information collection module for collecting Die performance after testing and corresponding physical locations. The storage system includes a Die storage module for classifying and storing Dies after testing, a physical location indication module for indicating the physical location of Dies during the warehousing and storage process, and an in-and-out information collection module for collecting Die in-and-out information. The control system includes a control module that serves as the system's main control end to issue execution commands and control the operation of the entire system, an analysis module for analyzing and processing data, a data storage module for storing information, and a data storage backup module for storing information in a backup data storage module.

[0044] Furthermore, the Die test module includes a test loading unit for batch loading of Dies to be tested, a test unit for testing Die performance, and a storage loading unit for batch loading of Dies after the test is completed and provided with independent information coding. The test information collection module includes a performance information collection unit for collecting Die test performance and a loading information collection unit for collecting independent information coding information on the storage loading unit loaded with the Die and the physical location information of the Die on the storage loading unit. The test performance information of the Die in each storage loading unit and the physical storage location information after the test are stored and recorded to facilitate the corresponding warehousing and selection at a later stage.

[0045] Furthermore, the Die storage module includes a storage loading unit for batch loading Dies after the test is completed and provided with independent information coding and a classification storage unit for classifying and placing the storage loading unit, the physical position indication module includes a classification indication unit corresponding to the position of the classification storage unit and a specific indication unit corresponding to the storage position of the storage loading unit, and the in-and-out information collection module includes a storage information collection unit corresponding to the independent information coding on the in-and-out storage loading unit. Die out-and-out is convenient and accurate, and it is easy to retrieve and find Dies with corresponding performance.

[0046] Furthermore, the test unit comprises at least two detection units for detecting dies, at least one loading unit for placing a test loading unit, a plurality of unloading units for placing storage loading units, and at least one transplanting unit for transferring dies between the detection unit, the loading unit, and the unloading unit. Multiple stations can operate simultaneously with high efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 A flowchart of a method for selecting a memory chip Die;

[0048] Figure 2 A flowchart for defining the corresponding storage location for newly added Die model classification data;

[0049] Figure 3 Flow diagram for Die performance test classification;

[0050] Figure 4 This is a flowchart of Die transfer into storage;

[0051] Figure 5 A schematic diagram of the process of selecting a library for Die;

[0052] Figure 6 A schematic block diagram of the composition of a storage selection system for a storage chip Die;

[0053] Figure 7 A schematic block diagram related to the test classification system;

[0054] Figure 8 A schematic block diagram of an embodiment of a storage system in which a Die storage module has two classified storage units, and one classified storage unit can load four storage loading units. DETAILED DESCRIPTION

[0055] The present invention is further described below in conjunction with the accompanying drawings and specific embodiments.

[0056] like Figure 1 A method for testing, warehousing and packaging and selecting a memory chip Die is shown, comprising the following steps:

[0057] S01. Establish a Die model classification database and storage warehouse: Die models of various types are classified into multiple levels according to performance based on the company's existing data and market demand data, and a model classification database is established for storage and backup. According to the Die model classification database, a classification storage unit corresponding to the model classification is established in the Die storage warehouse;

[0058] S02. Establish a combined packaging database for storage chips: Design various combined packaging for different models and levels of Die based on the company's existing storage chip performance requirements and the storage chip performance requirements on the market, and establish a combined packaging database for storage and backup;

[0059] S03. Input of Die Information: Before testing the Dies that need to be tested, input the model information of the Dies to be tested.

[0060] S04, Die test classification matching: compare the model information of the Die to be tested with the Die model information in the model classification database to determine whether there is a Die of the corresponding model in the model classification database. If there is a Die of the corresponding model, directly execute step S06; if there is no corresponding model, execute step S05;

[0061] S05. Addition of new Die model classification data into the database and establishment of corresponding definition of storage location: After analyzing the new Dies to be tested according to customer and market needs, the new Dies are classified into multiple levels by performance, and the corresponding data is added to the model classification database for storage and backup. In the Die storage warehouse, corresponding definition is established for the classification storage unit corresponding to the new Die model classification;

[0062] S06. Die performance test classification: define and classify the unloading and storage locations of the test equipment according to the classification data in the model classification database, unload and store the tested dies in the corresponding categories, and collect and store the test performance information of each die and the physical storage location information after the test during the test;

[0063] S07, Die transfer and storage: Dies are assigned to different storage locations in the storage warehouse according to their model and classification information. During the storage process, the performance information of each die and the physical storage information in the storage warehouse are collected and stored;

[0064] S08. Memory chip performance requirement input: input the required memory chip performance requirements;

[0065] S09, package matching: comparing the performance requirements of the memory chip with the performance of the memory chip in the combination package database, and determining whether there is memory chip combination package information of corresponding performance in the combination package database; if there is memory chip combination package information of corresponding performance, directly executing step S16; if there is no memory chip combination package information of corresponding performance, executing step S10;

[0066] S10, new combination package analysis and design: Analyze whether the Dies in the company's existing model classification database can be combined and packaged into a memory chip that meets the performance requirements. If so, execute step S11; if not, execute step S13;

[0067] S11. New combination package design based on existing dies: According to the performance requirements of memory chips, analyze and design the dies of different levels of various models in the existing model classification database, and design a combination package solution that meets the performance requirements of memory chips;

[0068] S12, storing the new combination package design data based on the existing Die: adding the newly designed combination matching package data to the combination package database and storing and backing it up, and then executing in sequence from step S08;

[0069] S13. New combination package design based on newly added dies: According to the performance requirements of the memory chip, analyze and design the various models of different levels of dies in the existing model classification database and the various models of different levels of dies available on the market, and design a combination package solution that meets the performance requirements of the memory chip;

[0070] S14, storing new combination package design data based on newly added Dies: adding the newly designed combination matching package data to the combination package database and storing and backing it up;

[0071] S15, adding new dies as needed: preparing new dies of new models according to the performance of the dies that are missing from the combination matching package, and then executing from step S05 in sequence;

[0072] S16, combined package selection display: according to the performance requirements of the memory chip and the combined package database, the selection options of the combined package design and the number of corresponding combined package memory chips are displayed;

[0073] S17, select packaging combination options: select one or more required combination packaging design options and the number of dies to be shipped out of the warehouse according to performance and quantity requirements. If the number of dies in the warehouse is sufficient, execute step S19; if the number of dies in the warehouse is insufficient, execute step S18;

[0074] S18, increase the number of Dies in the warehouse: increase the number of Dies in batches according to demand, and then start from step S03 step by step;

[0075] S19, Die selection and outbound delivery: According to the selected combined packaging selection option, the matching Dies in the Die storage warehouse are physically stored in the outbound order, and the stored Dies are outbound in sequence according to the instructions of the storage warehouse.

[0076] In this specific embodiment, the model classification database is stored in the data storage module and the data storage backup module. The data stored in the data storage module and the data storage backup module change synchronously and do not interfere with each other. As the combination packaging design of various products proceeds, the data in the model classification database will become more and more. A data storage backup module is configured to avoid data loss and damage during subsequent system operation; the model classification database includes the model information of the input Die, the corresponding level classification information, the physical storage location information corresponding to each category, and the corresponding quantity information. The existing ones are based on the actual input quantity, and zero is entered when there is no information; a model of Die is divided into multiple levels according to the company's actual needs and the needs collected from the market, and each level corresponds to a performance range of the Die; the storage warehouse is established according to the model classification data of the Die, including storage locations of multiple classification levels of each model Die, and also includes some free locations to facilitate later definition and allocation; the model classification database and the storage warehouse can represent the corresponding virtual storage warehouse and the actual storage warehouse, and the Die model classification quantity and position changes in the model classification database and the storage warehouse are associated and corresponding.

[0077] In this specific embodiment, when the entire system is operating normally, the process of replenishing Dies to the Die storage warehouse is as follows:

[0078] First, execute step S03 of inputting the Die information to be stored, and input the model information of the Die to be tested and classified to be supplemented from the control interface of the control module;

[0079] Then execute the Die test classification matching of step S04, the analysis module compares the model information of the Die to be tested with the Die model information in the model classification database in the data storage module for matching judgment, and executes step S06 when there is a matching model in the model classification database, and executes step S05 when there is a matching model in the model classification database;

[0080] When executing step S05 of storing the newly added Die model classification data and establishing the corresponding definition of the storage location, the newly added Die models to be tested are analyzed according to customer and market needs and divided into multiple levels by performance, and the corresponding data is added to the model classification database in the data storage module, and a Die storage module corresponding to the newly added Die model classification is established in the Die storage warehouse;

[0081] When performing the Die performance test classification of step S06, the material storage location of the Die test module is defined and classified according to the classification data in the model classification database, and a material storage location corresponding to the performance level is defined for each performance level of the Die, and the tested Die is stored in the material storage location defined according to the performance level according to the performance test results;

[0082] During the test process, the test performance information of each Die and the physical storage location information after the test are collected and stored, and stored in the data storage module and the data storage backup module;

[0083] Finally, S07 is executed to transfer the Dies into the warehouse. According to the Die model and classification information, the Dies are divided into models and levels and allocated to different storage locations in the storage warehouse. During the warehousing process, the performance information of each Die and the physical storage information in the storage warehouse are collected and stored. After the collected warehousing information is processed by the control module, the corresponding quantity information of the Dies of the corresponding model classification in the model classification database in the data storage module and the data storage backup module changes accordingly.

[0084] In this specific embodiment, the combined packaging database is stored in the data storage module and the data storage backup module. The data stored in the data storage module and the data storage backup module change synchronously and do not interfere with each other. As the combined packaging design of various products proceeds, the data in the combined packaging database will increase. A data storage backup module is configured to avoid data loss and damage during subsequent system operation. The data information in the combined packaging database includes the model, classification level and quantity of the Die required in the design of the combined packaging storage chip of each performance. When the entire system is operating normally, the process of selecting Die from the Die storage warehouse:

[0085] First, the memory chip performance requirement input of step S08 is executed, and the performance information of the memory chip to be packaged is input from the control interface of the control module;

[0086] Then execute the package matching of step S09, the analysis module compares the performance requirements of the memory chip with the performance of the memory chip in the combination package database, and determines whether there is memory chip combination package information of corresponding performance in the combination package database, if there is memory chip combination package information of corresponding performance, directly execute step S16, if there is no memory chip combination package information of corresponding performance, execute step S10;

[0087] When performing the new combination package analysis and design of step S10, analyze whether the Die in the company's existing model classification database can be combined and packaged into a memory chip that meets the performance requirements. If it can be combined and packaged into a memory chip that meets the performance requirements, execute step S11; if it cannot be combined and packaged into a memory chip that meets the performance requirements, execute step S13;

[0088] When performing the new combined package design based on the existing Die in step S11, the Dies of different levels of various models in the existing model classification database are analyzed and combined according to the performance requirements of the memory chip, and a combined package solution that meets the performance requirements of the memory chip is designed;

[0089] When executing step 12 to store the new combination package design data based on the existing Die, the newly designed combination matching package data is added to the combination package database, and then the steps are executed in sequence from step S08;

[0090] When executing the new combined package design based on the newly added Die in step S13, the Dies of different levels of various models in the existing model classification database and the Dies of different levels of various models available on the market are analyzed and combined according to the performance requirements of the memory chip, and a combined package solution that meets the performance requirements of the memory chip is designed;

[0091] When the new combination package design data based on the newly added Die is stored in the database in step S14, the combination matching package data of the new design is added to the combination package database;

[0092] When a new Die is added in step S15, the Die of the new model is prepared according to the performance of the missing Die by combining and matching the package, and then the steps from step S05 are executed in sequence to add the Die of the new model to the Die storage warehouse for subsequent orderly retrieval;

[0093] When executing the combined package selection display of step S16, the analysis module compares and matches the combined package database according to the performance requirements of the memory chip, and displays the selection options of the combined package design and the number of the corresponding combined package memory chips, that is, displays the model, level, and quantity of one or several dies used in each combined package solution, as well as the number of corresponding packaged memory chips;

[0094] When executing step S17 to select the packaging combination option, select one or more required combined packaging design options and the number of dies to be shipped out of the warehouse according to the performance and quantity requirements. If the number of dies in the warehouse is sufficient, execute step S19; if the number of dies in the warehouse is insufficient, execute step S18;

[0095] When executing step S18 to increase the number of Dies in the warehouse, increase the Dies in batches according to demand, and then execute step by step from step S03;

[0096] When executing the Die selection and dispatching in step S19, the matching Dies in the Die storage warehouse are physically stored in the dispatching order according to the selected combination packaging selection option, and the stored Dies are dispatched in sequence according to the instructions of the storage warehouse.

[0097] The storage and selection system of the entire memory chip Die can be operated in whole or in part according to the above method, so as to achieve the interconnection of the test storage warehousing and the packaging and selection and retrieval data of the Die. The retrieval and selection of the memory chip Die is simple and convenient, which improves the efficiency and overall utilization of the Die retrieval and selection.

[0098] On the basis of the above, if Figure 1 and Figure 2 As shown, the newly added Die model classification data storage and storage location corresponding definition establishment in step S05 include:

[0099] S0501. Analyze the new models of Die to be tested according to customer and market needs and classify them into multiple levels by performance. Add the corresponding data into the model classification database and store and back up them.

[0100] S0502, determine whether there is an idle undefined classification storage unit, if yes, execute step S0504, if not, execute step S0503;

[0101] S0503, add a new idle classification storage unit;

[0102] S0504. Define and establish a storage location in a free classified storage unit according to the classification of the newly added model Die.

[0103] In the specific implementation, when executing step S0501, the newly added model of Die to be tested is analyzed according to customer and market needs and divided into multiple levels by performance, and the corresponding data is added to the model classification database of the data storage module and the backup data storage module; when executing step S0502, the analysis module determines whether there is an idle and undefined classification storage unit in the storage warehouse corresponding to the model classification database in the data storage module, if yes, then execute step S0504, if not, then execute step S0503; when executing step S0503, add an idle classification storage unit in the Die storage warehouse; when executing step S0504, define and establish a storage position in the idle classification storage unit according to the classification of the newly added model Die in the model classification database. Informatization utilizes the storage outbound space to avoid space waste and can be added and supplemented in time according to demand.

[0104] On the basis of the above, if Figure 1 and Figure 3 As shown, the Die performance test categories in step S06 include:

[0105] S0601. Define and classify the unloading units of the testing equipment according to the classification data of the corresponding Die model in the model classification database, and place storage and loading units for matching and storing the Dies after the test at the unloading units of each category;

[0106] S0602. During the test, the performance information collection unit collects and stores the Die of the test;

[0107] S0603. After the test, the Die is transplanted to the storage and loading unit at the corresponding unloading unit according to the performance. The storage and loading unit information is collected during the unloading process, and the specific position of the Die in the storage and loading unit is recorded according to the storage and loading sequence.

[0108] On the basis of the above, if Figure 1 and Figure 4 As shown, the Die transfer into storage in step S07 includes:

[0109] S0701, collect information of storage loading units carrying Die that are put into storage;

[0110] S0702, matching the Die model classification loaded by the storage loading unit with the classification storage unit;

[0111] S0703. According to the matching results, the storage locations are checked one by one in order, and the storage loading units are placed at the corresponding positions according to the instructions to complete the warehousing.

[0112] On the basis of the above, if Figure 1 and Figure 2As shown, the Die selection library in step S19 includes:

[0113] S1901, the storage loading unit generates a delivery sequence according to the order of delivering Dies of the same model level first from the outside and then from the inside;

[0114] S1902. According to the generated outbound order, the storage locations are processed one by one in order, and the storage loading units are correspondingly outbound according to the instructions, and the storage loading unit information is collected during the outbound process.

[0115] On the basis of the above, if Figure 6 As shown, a storage chip Die test warehousing and packaging and selection system is used to implement the storage chip Die test warehousing and packaging and selection method. The system includes a test classification system, a storage system and a control system. The test classification system includes a Die test module for measuring Die performance and a test information collection module for collecting Die performance after testing and corresponding physical locations. The storage system includes a Die storage module for classifying and storing Dies after testing, a physical location indication module for indicating the physical location of Dies during the warehousing and storage process, and an in-and-out information collection module for collecting Die in-and-out information. The control system includes a control module that serves as the system's main control end to issue execution commands and control the operation of the entire system, an analysis module for analyzing and processing data, a data storage module for storing information, and a data storage backup module for storing information in the backup data storage module.

[0116] On the basis of the above, if Figure 6 to Figure 7 As shown, the Die test module includes a test loading unit for batch loading Dies to be tested, a test unit for testing Die performance, and a storage loading unit for batch loading Dies after the test is completed and provided with independent information coding. The test information acquisition module includes a performance information acquisition unit for collecting Die test performance and a loading information acquisition unit for collecting independent information coding information on the storage loading unit for loading the Die and the physical location information of the Die on the storage loading unit.

[0117] In this specific embodiment, the test loading unit and the storage loading unit are both storage trays for loading Die, the independent information on the storage loading unit is encoded as a two-dimensional code, the performance information acquisition unit is an information transmission component that is arranged on the test unit and connected to the test unit and transmits information to the control module, the loading information acquisition unit is a wireless scanner that can accurately and quickly scan and identify the two-dimensional code on the storage loading unit, and the wireless scanner and the control module are matched with a wireless interconnection communication module. When the scan information is successfully transmitted to the control module, the wireless scanner flashes a green light, and when the scan information is not successfully transmitted to the control module, the wireless scanner flashes a red light; during implementation, the model information of the Die to be tested and classified is input from the control interface of the control module, the analysis module compares and matches the model information of the Die to be tested with the model information of the Die in the model classification database in the data storage module, and defines the unloading storage position of the test unit according to the grading data in the model classification database. Classification, define a material unloading storage position corresponding to the performance level for each performance level of the Die, and each material unloading storage position is placed with several storage loading units. The storage loading unit loaded with the Die is transferred to the test unit, and the test unit tests the Die. After the test is completed, the performance information acquisition unit transmits the performance information of the Die to the control module, and the analysis module compares and matches the performance classification of this model of Die in the data storage module. The test unit unloads and stores the tested Die in the material unloading storage position defined according to the performance level according to the matching result; the loading information acquisition unit collects and stores the information coding on the storage loading unit between the Die unloading storage loading unit, and the storage sequence of the Die can determine which storage loading unit each Die is stored in. The test performance information of each Die collected during the test and the physical storage position information after the test are stored in the data storage module and the data storage backup module.

[0118] The storage records the test performance information of the Die in each storage loading unit and the physical storage location information after the test, which is convenient for the corresponding warehousing and selection in the later stage.

[0119] On the basis of the above, if Figures 6 to 8 As shown, the Die storage module includes a storage loading unit which is used for Die after the batch loading test is completed and is provided with an independent information code, and a classification storage unit which classifies and stores the storage loading units. The physical position indication module includes a classification indication unit which corresponds to the position of the classification storage unit and a specific indication unit which corresponds to the storage position of the storage loading unit. The in-warehouse and out-of-warehouse information collection module includes a storage information collection unit which corresponds to the independent information code collected on the in-warehouse and out-of-warehouse storage loading units.

[0120] In this specific embodiment, the Die storage is provided with several storage brackets for limiting the placement of storage loading units, one or several storage brackets are divided into a classification storage unit, each storage bracket is provided with a classification indicator light, i.e., a classification indication unit, controlled by the control module, and each storage bracket is provided with a specific indicator light, i.e., a specific indication unit, corresponding to the layered placement of the storage loading units. The storage information acquisition unit is a wireless scanner that can accurately and quickly scan and identify the QR code on the storage loading unit. The wireless scanner and the control module are matched with a wireless interconnection communication module. When the scanning information is successfully transmitted to the control module, the green light on the wireless scanner flashes, and when the scanning information is not successfully transmitted to the control module, the red light on the wireless scanner flashes.

[0121] When implementing warehousing:

[0122] During the warehousing process, the physical location indication module is turned on, and the first storage loading unit is scanned by the storage information acquisition unit. The storage information acquisition unit transmits the scanned information to the control module. After the analysis module matches the corresponding classification storage unit according to the model classification information of the Die loaded on the first storage loading unit and stores the storage information in the model classification database, the control module controls the corresponding classification indication unit to indicate and place the first storage loading unit on the classification storage unit accordingly.

[0123] The second storage loading unit is scanned by the storage information acquisition unit, and the storage information acquisition unit transmits the scanned information to the control module. After the analysis module matches the corresponding classification storage unit according to the model classification information of the Die loaded on the second storage loading unit and stores the storage information into the model classification database, the control module controls the corresponding classification indication unit to indicate and place the second storage loading unit on the classification storage unit accordingly;

[0124] Repeat the above storage steps until all storage loading units are stored, turn off the physical location indication module, and the storage process is completed.

[0125] When implementing warehousing:

[0126] According to the order of outbound storage, the control module controls the classification indication unit where the storage and loading unit sorted in the first outbound storage is located to indicate, and the specific indication unit corresponding to the storage and loading unit sorted in the first outbound storage is indicated, and the storage and loading unit sorted in the first outbound storage is taken out according to the indication, and the storage and loading unit sorted in the first outbound storage is scanned at the storage information acquisition unit. After receiving the scanning information, the control module controls the classification indication unit and the specific indication unit corresponding to the storage and loading unit of the first outbound storage to stop prompting;

[0127] Then, the control module controls the classification indication unit where the storage and loading unit sorted in the second outbound delivery is located to indicate, and the specific indication unit corresponding to the storage and loading unit sorted in the second outbound delivery is indicated, and the storage and loading unit sorted in the second outbound delivery is taken out according to the indication, and the storage and loading unit sorted in the second outbound delivery is scanned at the storage information acquisition unit. After receiving the scanning information, the control module controls the classification indication unit and the specific indication unit corresponding to the storage and loading unit sorted in the second outbound delivery to stop prompting;

[0128] Repeat the above outbound steps to take out all the matched storage and loading units that need to be taken out.

[0129] Die storage and retrieval are convenient and accurate, making it easy to retrieve and find Dies with corresponding performance.

[0130] On the basis of the above, if Figure 7 As shown, the test unit includes at least two detection units for detecting dies, at least one loading unit for placing a test loading unit, a plurality of unloading units for placing a storage loading unit, and at least one transplantation unit for transferring dies between the detection unit, the loading unit, and the unloading unit. In this specific embodiment, there are eight detection units, the storage loading unit is the same as the test loading unit, the loading unit is the same as the unloading unit and there are a total of thirty-six, and the transplantation unit includes four pick-and-place suction head units that can be used to independently pick up and place dies. The number of each component unit can be increased or decreased according to demand, and multiple stations can operate simultaneously, which is highly efficient.

[0131] The specific embodiments described above further illustrate the objectives, technical solutions and beneficial effects of the present invention in detail. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for testing, warehousing and packaging of memory chip Die, characterized in that: The following steps are involved: S01. Establish a Die model classification database and storage warehouse: Die models of various types are classified into multiple levels according to performance based on the company's existing data and market demand data, and a model classification database is established for storage and backup. According to the Die model classification database, a classification storage unit corresponding to the model classification is established in the Die storage warehouse; S02. Establish a combined packaging database for storage chips: Design various combined packaging for different models and levels of Die based on the company's existing storage chip performance requirements and the storage chip performance requirements on the market, and establish a combined packaging database for storage and backup; S03. Input of Die Information: Before testing the Dies that need to be tested, input the model information of the Dies to be tested. S04, Die test classification matching: compare the model information of the Die to be tested with the Die model information in the model classification database to determine whether there is a Die of the corresponding model in the model classification database. If there is a Die of the corresponding model, directly execute step S06; if there is no corresponding model, execute step S05; S05. Addition of new Die model classification data into the database and establishment of corresponding definition of storage location: After analyzing the new Dies to be tested according to customer and market needs, the new Dies are classified into multiple levels by performance, and the corresponding data is added to the model classification database for storage and backup. In the Die storage warehouse, corresponding definition is established for the classification storage unit corresponding to the new Die model classification; S06. Die performance test classification: define and classify the unloading and storage locations of the test equipment according to the classification data in the model classification database, unload and store the tested dies in the corresponding categories, and collect and store the test performance information of each die and the physical storage location information after the test during the test; S07, Die transfer and storage: Dies are assigned to different storage locations in the storage warehouse according to their model and classification information. During the storage process, the performance information of each die and the physical storage information in the storage warehouse are collected and stored; S08. Memory chip performance requirement input: input the required memory chip performance requirements; S09, package matching: comparing the performance requirements of the memory chip with the performance of the memory chip in the combination package database, and determining whether there is memory chip combination package information of corresponding performance in the combination package database; if there is memory chip combination package information of corresponding performance, directly executing step S16; if there is no memory chip combination package information of corresponding performance, executing step S10; S10, new combination package analysis and design: Analyze whether the Dies in the company's existing model classification database can be combined and packaged into a memory chip that meets the performance requirements. If so, execute step S11; if not, execute step S13; S11. New combination package design based on existing dies: According to the performance requirements of memory chips, analyze and design the dies of different levels of various models in the existing model classification database, and design a combination package solution that meets the performance requirements of memory chips; S12, storing the new combination package design data based on the existing Die: adding the newly designed combination matching package data to the combination package database and storing and backing it up, and then executing in sequence from step S08; S13. New combination package design based on newly added dies: According to the performance requirements of the memory chip, analyze and design the various models of different levels of dies in the existing model classification database and the various models of different levels of dies available on the market, and design a combination package solution that meets the performance requirements of the memory chip; S14, storing new combination package design data based on newly added Dies: adding the newly designed combination matching package data to the combination package database and storing and backing it up; S15, adding new dies as needed: preparing new dies of new models according to the performance of the dies that are missing from the combination matching package, and then executing from step S05 in sequence; S16, combined package selection display: according to the performance requirements of the memory chip and the combined package database, the selection options of the combined package design and the number of corresponding combined package memory chips are displayed; S17, select packaging combination options: select one or more required combination packaging design options and the number of dies to be shipped out of the warehouse according to performance and quantity requirements. If the number of dies in the warehouse is sufficient, execute step S19; if the number of dies in the warehouse is insufficient, execute step S18; S18, increase the number of Dies in the warehouse: increase the number of Dies in batches according to demand, and then start from step S03 step by step; S19, Die selection and outbound delivery: According to the selected combined packaging selection option, the matching Dies in the Die storage warehouse are physically stored in the outbound order, and the stored Dies are outbound in sequence according to the instructions of the storage warehouse.

2. A method for testing, warehousing and packaging and selecting a memory chip Die according to claim 1, characterized in that: The step S05 of adding Die model classification data into the database and establishing the corresponding definition of the storage location includes: S0501. Analyze the new models of Die to be tested according to customer and market needs and classify them into multiple levels by performance. Add the corresponding data into the model classification database and store and back up them. S0502, determine whether there is an idle undefined classification storage unit, if yes, execute step S0504, if not, execute step S0503; S0503, add a new idle classification storage unit; S0504. Define and establish a storage location in a free classified storage unit according to the classification of the newly added model Die.

3. A method for testing, warehousing and packaging and selecting a memory chip Die according to claim 2, characterized in that: The Die performance test categories in step S06 include: S0601. Define and classify the unloading units of the testing equipment according to the classification data of the corresponding Die model in the model classification database, and place storage and loading units for matching and storing the Dies after the test at the unloading units of each category; S0602. During the test, the performance information collection unit collects and stores the Die of the test; S0603. After the test, the Die is transplanted to the storage and loading unit at the corresponding unloading unit according to the performance. The storage and loading unit information is collected during the unloading process, and the specific position of the Die in the storage and loading unit is recorded according to the storage and loading sequence.

4. A method for testing, warehousing and packaging and selecting a memory chip Die according to claim 3, characterized in that: The Die transfer into storage in step S07 includes: S0701, collect information of storage loading units carrying Dies that are put into storage; S0702, matching the Die model classification loaded by the storage loading unit with the classification storage unit; S0703. According to the matching results, the storage locations are checked one by one in order, and the storage loading units are placed at the corresponding positions according to the instructions to complete the warehousing.

5. A method for testing, warehousing and packaging and selecting a memory chip Die according to claim 4, characterized in that: In step S19, the Die selection library includes: S1901, the storage loading unit generates a delivery sequence according to the order of delivering Dies of the same model level first from the outside and then from the inside; S1902. According to the generated outbound order, the storage locations are processed one by one in order, and the storage loading units are correspondingly outbound according to the instructions, and the storage loading unit information is collected during the outbound process.

6. A memory chip Die test warehousing and packaging selection system, used to implement a memory chip Die test warehousing and packaging selection method as claimed in any one of claims 1 to 5, characterized in that: The system includes a test classification system, a storage system and a control system. The test classification system includes a Die test module for measuring Die performance and a test information collection module for collecting Die performance after testing and corresponding physical locations. The storage system includes a Die storage module for classifying and storing Dies after testing, a physical location indication module for indicating the physical location of Dies during the entry and exit process, and an entry and exit information collection module for collecting Die entry and exit information. The control system includes a control module that serves as the system's main control end to issue execution commands and control the operation of the entire system, an analysis module for analyzing and processing data, a data storage module for storing information, and a data storage backup module for storing information in the backup data storage module.

7. The memory chip Die test storage and packaging selection system according to claim 6, characterized in that: The Die test module includes a test loading unit for batch loading Dies to be tested, a test unit for testing Die performance, and a storage loading unit for batch loading Dies after the test is completed and provided with independent information coding. The test information collection module includes a performance information collection unit for collecting Die test performance and a loading information collection unit for collecting independent information coding information on the storage loading unit loaded with the Die and the physical location information of the Die on the storage loading unit.

8. The memory chip Die test storage and packaging selection system according to claim 7, characterized in that: The Die storage module includes a storage loading unit which is used for Die after the batch loading test is completed and is provided with an independent information code, and a classification storage unit which classifies and stores the storage loading units. The physical position indication module includes a classification indication unit which corresponds to the position of the classification storage unit and a specific indication unit which corresponds to the storage position of the storage loading unit. The in-warehouse and out-of-warehouse information collection module includes a storage information collection unit which corresponds to the independent information codes collected on the in-warehouse and out-of-warehouse storage loading units.

9. The memory chip Die test storage and packaging selection system according to claim 8, characterized in that: The testing unit comprises at least two detection units for detecting Die, at least one loading unit for accommodating a test loading unit, a plurality of unloading units for accommodating storage loading units and at least one transplantation unit for transferring Die between the detection unit, the loading unit and the unloading unit.

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