Wafer pushing device

Abstract

The invention provides a wafer pushing device. The wafer pushing device comprises a first lifting mechanism, a mounting bracket, a magnetic attraction base, a second lifting mechanism and a pushing assembly, the first lifting mechanism is used for driving the mounting bracket to lift. The magnetic attraction base is arranged on the mounting bracket, and a first pushing channel is arranged on the magnetic attraction base; the second lifting mechanism is arranged in the mounting bracket; the pushing assembly comprises a pushing seat, a needle cap and a pushing piece, the pushing seat is fixed to the magnetic attraction base in a magnetic attraction mode, a second pushing channel is formed in the pushing seat, the needle cap is connected to the pushing seat, the pushing piece is arranged in the needle cap, and a pushing hole is formed in the top of the needle cap; the lower end of the pushing piece sequentially penetrates through the second pushing channel and the first pushing channel and then abuts against a movable component of the second lifting mechanism. According to the wafer pushing device provided by the invention, the pushing assembly is magnetically attracted and fixed on the magnetic attraction base, and the pushing piece of the pushing assembly abuts against the second lifting mechanism. When the pushing piece needs to be replaced, only the pushing assembly needs to be removed from the magnetic attraction base, and a new pushing assembly is installed.

Description

Technical Field

[0001] The present application relates to the field of chip packaging equipment, and in particular to a wafer pushing device. Background Art

[0002] During the chip packaging process, the wafer on the blue film needs to be transferred and fixed on a predetermined substrate. In order to ensure the material picking accuracy, the wafer at the corresponding position on the blue film needs to be lifted up by a wafer pushing device. In the existing wafer pushing device, the pushing member (generally a push pin assembly) is fixedly connected to the driving end of the pushing drive mechanism. Therefore, when the pushing member is damaged or the current pushing member specifications cannot meet the pushing requirements of the wafer, the pushing drive mechanism and the pushing member need to be replaced as a whole. The overall replacement workload is large, and the time and equipment cost of the replacement are high. Summary of the invention

[0003] In order to solve the above technical problems, the present application provides a wafer pushing device, which adopts the following technical solutions:

[0004] A wafer pushing device comprises a first lifting mechanism, a mounting bracket, a magnetic base, a second lifting mechanism and a pushing assembly, wherein:

[0005] The mounting bracket is connected to the movable component of the first lifting mechanism, and the first lifting mechanism is used to drive the mounting bracket to rise and fall;

[0006] The magnetic base is arranged on the top of the mounting bracket, and a first pushing channel penetrating the magnetic base is arranged on the magnetic base;

[0007] The second lifting mechanism is arranged in the mounting bracket;

[0008] The pushing assembly includes a pushing seat, a needle cap and a pushing piece, wherein the pushing seat is magnetically fixed on the magnetic base, the pushing seat is provided with a second pushing channel which passes through the first pushing channel up and down, the needle cap is connected to the pushing seat, the pushing piece is arranged in the needle cap, and the top of the needle cap is provided with a pushing hole for the pushing piece to pass upward, and the lower end of the pushing piece passes through the second pushing channel and the first pushing channel in sequence and then abuts against the movable part of the second lifting mechanism.

[0009] The wafer pushing device provided by the present application has a pushing assembly that is magnetically fixed on the magnetic base, and a pushing piece of the pushing assembly abuts against the second lifting mechanism. Therefore, when the pushing piece needs to be replaced, it is only necessary to remove the pushing assembly from the magnetic base and replace it with a new one, without having to replace other components such as the second lifting mechanism, thereby improving replacement efficiency and reducing replacement costs.

[0010] In some embodiments, the upper surface of the magnetic base is provided with three support grooves surrounding the circumference of the first pushing channel; the pushing seat is provided with three support pins corresponding to the support grooves one by one, and the support pins are all supported in the corresponding support grooves, and a gap is retained between the lower surface of the pushing seat and the upper surface of the magnetic base.

[0011] The three support pins at the bottom of the push seat are supported in the three support grooves on the magnetic base in a one-to-one correspondence, which can ensure that the push seat can be magnetically fixed on the magnetic base stably. Under the cooperation and limitation of the support grooves and the support pins, the push seat is prevented from accidentally sliding during the lifting process. Since a gap is retained between the lower surface of the push seat and the upper surface of the magnetic base, it can be ensured that the lower ends of the three support pins are in contact with the corresponding support grooves, ensuring that the support surface of the push seat is the plane established by the three points where the lower ends of the three support pins abut against the corresponding support grooves. The push seat will not tilt due to other fulcrums, which can ensure that the push seat is more stably supported on the magnetic base.

[0012] In some embodiments, the support groove is a V-shaped structure, and the support groove includes a first support bevel and a second support bevel arranged opposite to each other; the support pin is inserted into the push seat, and the lower end of the support pin forms a hemispherical support portion, which abuts against the first support bevel and the second support bevel.

[0013] The hemispherical support portion at the lower end of the support pin is supported on the first support slope and the second support slope of the support groove at the same time, which reduces the friction between the support pin and the support groove, and can ensure the support stability of the support groove to the support pin and prevent the support pin from shaking.

[0014] In some embodiments, a plurality of first magnets are provided on the magnetic base, and a plurality of second magnets with opposite polarities to the first magnets are provided on the push seat; or, a magnet is provided on one of the magnetic base and the push seat, and the other of the magnetic base and the push seat is an iron structure.

[0015] By arranging the magnetic base and the push seat, the push seat can be fixed on the magnetic base by magnetic attraction.

[0016] In some embodiments, the upper surface of the magnetic base is provided with positioning pins on at least two adjacent side edges, and a gap is reserved between the positioning pins and the side edges of the push seat.

[0017] The positioning of the push seat is achieved to ensure that when the push seat is placed, the second push channel on the push seat is aligned with the first push channel on the magnetic base. At the same time, since a gap is retained between the positioning pin and the side of the push seat, the positioning pin will not interfere with the installation position of the push seat.

[0018] In some embodiments, the mounting bracket includes a base plate, a first connecting plate, a second connecting plate and a support frame, wherein: the base plate is connected to the movable part of the first lifting mechanism; the first connecting plate is adjustably connected to the base plate along a first horizontal direction; the second connecting plate is adjustably connected to the first connecting plate along a second horizontal direction, and the second horizontal direction is perpendicular to the first horizontal direction; the support frame is connected to the second connecting plate, the magnetic base is arranged on the top of the support frame, and the second lifting mechanism is located inside the support frame.

[0019] By setting the mounting bracket, the mounting bracket can adjust the position of the magnetic base on the horizontal plane, and finally ensure that the pushing member is at a predetermined pushing position.

[0020] In some embodiments, the second lifting mechanism includes a voice coil motor and a push block, the stator assembly of the voice coil motor is fixedly mounted on the mounting bracket, the movable assembly of the voice coil motor is liftable and slidably connected to the stator assembly, and the push block is fixedly arranged on the top of the movable assembly; the lower end of the push member abuts against the push block.

[0021] The voice coil motor has a fast response speed, which can improve the pushing efficiency of the pushing member on the chip.

[0022] In some embodiments, the second lifting mechanism further comprises a blowing block disposed on the mounting bracket, wherein an air cavity connected to a compressed air source is disposed in the blowing block, and a blowing hole communicating with the air cavity is disposed on one side of the blowing block facing the mover assembly of the voice coil motor.

[0023] By setting the air blowing block, the voice coil motor can be cooled by air blowing, thereby extending the service life of the voice coil motor.

[0024] In some embodiments, the second lifting mechanism also includes a grating scale for measuring the lifting stroke of the movable subassembly of the voice coil motor. The grating scale includes a grating and a reading head. The reading head is fixedly mounted on the mounting bracket. The grating is fixedly mounted on the side of the movable subassembly. The sensing end of the reading head is arranged opposite to the grating.

[0025] By setting the grating ruler, the lifting stroke of the moving subassembly is accurately measured, and finally the pushing stroke of the pushing member is accurately controlled to ensure that the pushing member pushes the wafer to a predetermined height.

[0026] In some embodiments, an adsorption hole is also provided on the top of the needle cap; an air suction interface for connecting the air suction device is provided on the magnetic base; an air suction hole for connecting the air suction interface with the inner cavity of the needle cap is provided on the push seat, and a sealing ring is provided at the connection between the air suction hole and the air suction interface. The air suction device draws air from the inner cavity of the needle cap through the air suction interface and the air suction hole, so that the adsorption hole generates adsorption force.

[0027] Before the wafer is pushed, the needle cap can absorb the blue film, thereby ensuring that the relative positions of the pushing member and the wafer remain relatively stable, preventing the wafer from deviating from the pushing member during the pushing process.

[0028] In some embodiments, the needle cap is detachably locked on the ejection seat by a locking ring.

[0029] Ensure that the needle cap is firmly locked on the push seat and facilitate the removal of the needle cap.

[0030] In some embodiments, the ejection member includes a clamp, an ejection rod, an ejector pin mounting seat and a plurality of ejectors, wherein: the clamp is detachably mounted on the lower end of the ejector rod; the lower end of the ejector rod passes through the second ejection channel and the first ejection channel in sequence and then abuts against the movable component of the second lifting mechanism, and the clamp is used to clamp the limited ejector rod in the first ejection channel; the ejector pin mounting seat is mounted on the upper end of the ejector rod; a plurality of ejectors are mounted on the ejector pin mounting seat, and the top of the needle cap is provided with ejector holes corresponding to the ejector pins one by one.

[0031] The arrangement of the push member facilitates the disassembly, assembly and maintenance of the push member. In addition, the push rod is clamped and limited by the clamp located in the first push channel to ensure that the lower end of the push rod can abut against the movable part of the second lifting mechanism. The lifting of the wafer by the cooperation of multiple ejectors can improve the lifting stability of the wafer.

[0032] In some embodiments, the pushing member also includes a pushing guide assembly, which includes a first guide wheel, a second guide wheel and a guide column, wherein: the first guide wheel and the second guide wheel are arranged side by side on the clamp; the upper end of the guide column is fixedly connected to the pushing seat, and the second end of the guide column passes between the first guide wheel and the second guide wheel, and the first guide wheel and the second guide wheel are both against the guide column.

[0033] The ejector guide assembly realizes the lifting and lowering guidance of the clamp and the ejector rod, ultimately improving the lifting and lowering stability of the ejector pin and ensuring that the ejector pin can accurately pass through the corresponding ejector hole upward to implement the ejection of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 Schematic diagram of the structure of the wafer pushing device in the embodiment of the present application;

[0035] Figure 2 It is a structural schematic diagram of the wafer pushing device in one viewing angle after the first lifting mechanism is omitted in the embodiment of the present application;

[0036] Figure 3 It is a schematic structural diagram of the wafer pushing device in another perspective after the first lifting mechanism is omitted in the embodiment of the present application;

[0037] Figure 4This is a schematic diagram of the structure of the magnetic base in the embodiment of the present application;

[0038] Figure 5 This is a schematic diagram of the structure of the second lifting mechanism in the embodiment of the present application;

[0039] Figure 6 It is a structural schematic diagram of the mounting bracket in the embodiment of the present application;

[0040] Figure 7 This is a schematic diagram of the structure of the first connecting plate in an embodiment of the present application;

[0041] Figure 8 It is a schematic diagram of the three-dimensional structure of the push assembly in the embodiment of the present application;

[0042] Fig. 9 It is a schematic diagram of the disassembled structure of the push assembly in the embodiment of the present application;

[0043] Fig.10 It is a schematic diagram of the top view of the push assembly in the embodiment of the present application.

[0044] Figures 1 to 10 Included:

[0045] The first lifting mechanism 1;

[0046] Mounting bracket 2: bottom plate 21, first connecting plate 22, second connecting plate 23, support frame 24, first guide groove 25, first waist hole 26, second guide groove 27, second waist hole 28, first protrusion 221, third magnet 222, first magnetic attraction plate 211;

[0047] Magnetic base 3: first push channel 31, support groove 32, first support inclined surface 321, second support inclined surface 322, slot 323, air extraction interface 33, first magnet 34, positioning pin 35;

[0048] The second lifting mechanism 4 includes a voice coil motor 41, a push block 42, a stator 411, a mover 412, a connecting plate 413, an air blowing block 43, and a grating ruler 44;

[0049] The push assembly 5 includes a push seat 51, a needle cap 52, a push member 53, a second push channel 54, a push hole 55, a support pin 56, an adsorption hole 57, an exhaust hole 58, a locking ring 59, a clamp 531, a push rod 532, a first guide wheel 533, a second guide wheel 534, a guide column 535, and a support portion 561. DETAILED DESCRIPTION

[0050] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0051] As described in the background technology section, the push piece of the existing wafer pushing device is fixedly connected to the driving end of the push drive mechanism. Therefore, when the push piece is damaged, or the current specifications of the push piece cannot meet the wafer pushing requirements, the push drive mechanism and the push piece need to be replaced as a whole. The overall replacement workload is large, and the time and equipment costs for the replacement are high. If the plug-in method is used, the push piece is inserted into the positioning pin on the push drive mechanism. When the push piece is replaced, it needs to be pulled out upwards, and due to the processing accuracy of the push piece or the positioning pin, the installation accuracy of the push piece may be poor or the push piece may be stuck and difficult to pull out.

[0052] In order to solve this problem, the present application provides a wafer pushing device. Figures 1 to 10 As shown, the wafer pushing device in the embodiment of the present application includes a first lifting mechanism 1, a mounting bracket 2, a magnetic base 3, a second lifting mechanism 4 and a pushing assembly 5, wherein:

[0053] The mounting bracket 2 is connected to the movable component of the first lifting mechanism 1 , and the first lifting mechanism 1 is used to drive the mounting bracket 2 to move up and down.

[0054] The magnetic base 3 is arranged on the top of the mounting bracket 2 , and a first pushing channel 31 penetrating the magnetic base 3 is arranged on the magnetic base 3 .

[0055] The second lifting mechanism 3 is arranged in the mounting bracket 2 .

[0056] The pushing assembly 5 includes a pushing seat 51, a needle cap 52 and a pushing piece 53, wherein the pushing seat 51 is magnetically fixed on the magnetic base 3, the pushing seat 51 is provided with a second pushing channel 54 which passes through the first pushing channel 31 from top to bottom, the needle cap 52 is connected to the pushing seat 51, the pushing piece 53 is arranged in the needle cap 52, and the top of the needle cap 52 is provided with a pushing hole 55 for the pushing piece 53 to pass upward, and the lower end of the pushing piece 53 passes through the second pushing channel 54 and the first pushing channel 31 in sequence and then abuts against the movable part of the second lifting mechanism 4.

[0057] The wafer pushing process of the wafer pushing device in the embodiment of the present application is as follows:

[0058] In the initial state, the pushing assembly 5 is located below the blue film and away from the blue film.

[0059] When the wafer needs to be pushed, the first lifting mechanism 1 drives the mounting bracket 2 to rise to a predetermined position, so that the top of the needle cap 52 of the pushing assembly 5 abuts against a predetermined position of the blue film.

[0060] Subsequently, the second lifting mechanism 4 drives the upper end of the pushing member 53 to pass upward through the pushing hole 55, thereby pushing the wafer located at a predetermined position of the blue film.

[0061] In the wafer pushing device in the embodiment of the present application, the pushing assembly 5 is fixed on the magnetic base 3 by magnetic attraction, and the lower end of the pushing member 53 of the pushing assembly 5 abuts against the second lifting mechanism. Therefore, when the pushing member 53 needs to be replaced, it is only necessary to remove the pushing assembly 5 from the magnetic base and replace it with a new one, without having to replace other components such as the second lifting mechanism 4, thereby improving the replacement efficiency and reducing the replacement cost.

[0062] In the embodiment of the present application, the first lifting mechanism 1 can adopt various existing linear drive modules that can drive the installation bracket 1 to rise and fall, such as a cylinder drive module, a screw drive module, etc.

[0063] Optionally, the lower surface of the push seat 51 contacts the upper surface of the magnetic base 3, and the push seat 51 is magnetically fixed only by the magnetic attraction between the push seat 51 and the magnetic base 3. The problem caused by such a setting is that the push seat 51 is prone to sliding and deflecting relative to the magnetic base 3 during the lifting and pushing process, which eventually causes the push member 53 to interfere with the magnetic base 3, thereby hindering the lifting and lowering of the push member 53.

[0064] To this end, another optional magnetic fixing method is proposed in the embodiment of the present application, such as Figure 4 , Figure 8 and Fig. 9 As shown, optionally, the upper surface of the magnetic base 3 is provided with three support grooves 32 surrounding the first push channel 31. The push seat 51 is provided with three support pins 56 corresponding to the support grooves 32 one by one, each support pin 56 is supported in the corresponding support groove 32, and a gap is reserved between the lower surface of the push seat 51 and the upper surface of the magnetic base 3.

[0065] The three support pins 56 at the bottom of the push seat 51 are supported in the three support grooves 32 on the magnetic base 3 in a one-to-one correspondence, which can ensure that the push seat 51 can be stably fixed on the magnetic base 3 by magnetic attraction. Under the cooperation and limitation of the support grooves 32 and the support pins 56, the push seat 51 can be prevented from sliding relative to the magnetic base 3 during the lifting process.

[0066] In addition, since a gap is retained between the lower surface of the push seat 51 and the upper surface of the magnetic base 3, it can be ensured that the lower ends of the three support pins 56 are in contact with the corresponding support grooves 32, thereby ensuring that the support surface of the push seat 51 is the plane established by the three points where the lower ends of the three support pins 56 abut the corresponding support grooves 32. The push seat 51 will not be tilted due to other fulcrums, which can ensure that the push seat 51 is more stably supported on the magnetic base 3.

[0067] Optionally, the three supporting grooves 32 on the magnetic base 3 are in the shape of a regular triangle and surround the first pushing channel 31 .

[0068] Optionally, the support groove 32 is a V-shaped structure, and the support groove 32 includes a first support slope 321 and a second support slope 322 that are arranged opposite to each other. The support pin 56 is inserted into the push seat 51, and the lower end of the support pin 56 forms a hemispherical support portion 561, and the support portion 561 abuts against the first support slope 321 and the second support slope 322. The hemispherical support portion 561 at the lower end of the support pin 56 is supported on the first support slope 321 and the second support slope 322 of the support groove 32 at the same time, which reduces the friction between the support pin 56 and the support groove 32, and can ensure the support stability of the support groove 32 on the support pin 56, and prevent the support pin 56 from shaking.

[0069] like Figure 4 As shown, optionally, in order to facilitate the preparation of the support groove 32 , a notch 323 is provided between the lower ends of the first support slope 321 and the second support slope 322 .

[0070] In order to enable the push seat 51 to be magnetically fixed on the magnetic base 3, as shown in FIG. Figure 4 As shown, optionally, a plurality of first magnets 34 are provided on the magnetic base 3, and a plurality of second magnets with opposite polarities to the first magnets 34 are provided on the push seat 51. Of course, a magnet may be provided on only one of the magnetic base 3 and the push seat 51, while the other is provided as an iron structure that can be attracted by a magnet, or an iron magnetic plate is embedded in the other.

[0071] like Figure 4 As shown, optionally, positioning pins 35 are provided on two adjacent side edges of the upper surface of the magnetic base 3 , and a gap is reserved between the positioning pins 35 and the side edge of the push seat 51 .

[0072] By setting positioning pins 35 on two adjacent side edges of the upper surface of the magnetic base 3, the positioning of the push seat 51 can be achieved, and finally it is ensured that after the push seat 51 is magnetically attracted to the magnetic base 3, the second push channel 54 on the push seat 51 is aligned with the first push channel 31 on the magnetic base 3. At the same time, since a gap is retained between the positioning pin 35 and the side of the push seat 51, the positioning pin 35 will not interfere with the installation position of the push seat 51.

[0073] Of course, positioning pins 35 may also be provided on other side edges of the upper surface of the magnetic base 3 .

[0074] like Figure 2 , Figure 3 and Figure 6As shown, optionally, the mounting bracket 2 includes a bottom plate 21, a first connecting plate 22, a second connecting plate 23 and a support frame 24, wherein: the bottom plate 21 is connected to the movable part of the first lifting mechanism 1. The first connecting plate 22 is adjustably connected to the bottom plate 21 along a first horizontal direction (such as the X direction). The second connecting plate 23 is adjustably connected to the first connecting plate 22 along a second horizontal direction (such as the Y direction), and the second horizontal direction is perpendicular to the first horizontal direction. The support frame 24 is connected to the second connecting plate 23, the magnetic base 3 is arranged on the top of the support frame 24, and the second lifting mechanism 4 is located in the support frame 24.

[0075] Before implementing the pushing operation on the wafer, according to the position of the wafer to be pushed, adjust the position of the first connecting plate 22 on the bottom plate 21, and adjust the position of the second connecting plate 23 on the first connecting plate 22. In this way, the positions of the pushing member 53 in the first horizontal direction and the second horizontal direction are adjusted, and finally ensure that the pushing member 53 is at the predetermined pushing position. During the wafer retrieval process, the wafer to be pushed is moved to the top of the pushing position in sequence, so that the pushing member 53 can accurately push the wafer to be pushed when it rises.

[0076] In order to achieve the sliding guidance of the first connecting plate 22, the first connecting plate 22 is prevented from deviating when the position is adjusted along the first horizontal direction. Figure 6 and Figure 7 As shown, the upper surface of the bottom plate 21 is provided with a first guide groove 25 extending along the first horizontal direction, and correspondingly, the lower surface of the first connecting plate 22 is provided with a first protrusion 221 extending along the first direction, and the first protrusion 221 is slidably installed in the first guide groove 25. When the first connecting plate 22 is pushed to slide relative to the bottom plate 21 along the first horizontal direction, the first protrusion 221 cooperates with the first guide groove 25 to implement sliding guidance of the first connecting plate 22.

[0077] Optionally, the first connecting plate 22 is provided with a first waist hole 26 extending along the first horizontal direction, and the bottom plate 21 is provided with a first screw hole penetrating the first waist hole 26. After the first connecting plate 22 slides into place along the first horizontal direction, the fixing screws can be installed into the first waist hole 26 on the first connecting plate 22 and the first screw hole of the bottom plate 21, so that the first connecting plate 22 can be fixed to the bottom plate 21.

[0078] Optionally, a third magnet 222 is disposed at the bottom of the first connecting plate 22, and correspondingly, a first magnetic attraction plate 211 is embedded on the bottom plate 21. In this way, after the first connecting plate 22 slides into place along the first horizontal direction, the first connecting plate 22 can be magnetically attached to the bottom plate 21, thereby improving the stability of the first connecting plate 22 and preventing the first connecting plate 22 from shaking.

[0079] Similarly, in order to achieve the sliding guidance of the second connecting plate 23 and prevent the second connecting plate 23 from deviating when adjusting its position along the second horizontal direction, the upper surface of the first connecting plate 22 is optionally provided with a second guide groove 27 extending along the second horizontal direction, and correspondingly, the lower surface of the second connecting plate 23 is provided with a second protrusion extending along the second direction, and the second protrusion is slidably installed in the second guide groove 27. When the second connecting plate 23 is pushed to slide on the first connecting plate 22 along the second horizontal direction, the second protrusion cooperates with the second guide groove 27 to implement the sliding guidance of the second connecting plate 23.

[0080] Optionally, the second connecting plate 23 is provided with a second waist hole 28 extending along the second horizontal direction, and the first connecting plate 22 is provided with a second screw hole penetrating the second waist hole 28. After the second connecting plate 23 slides into place along the second horizontal direction, the fixing screws can be installed into the second waist hole 28 on the second connecting plate 23 and the second screw hole on the first connecting plate 22, so that the second connecting plate 23 can be fixed to the first connecting plate 22.

[0081] Optionally, a fourth magnet is disposed at the bottom of the second connecting plate 23, and correspondingly, a second magnetic plate is embedded on the first connecting plate 22. In this way, after the second connecting plate 23 slides into place along the second horizontal direction, the second connecting plate 23 can be magnetically attached to the first connecting plate 22, thereby improving the stability of the second connecting plate 23 and preventing the second connecting plate 23 from shaking.

[0082] like Figure 5 As shown, optionally, the second lifting mechanism 4 includes a voice coil motor 41 and a push block 42, the stator assembly 411 of the voice coil motor 41 is fixedly mounted on the mounting bracket 2, the mover assembly 412 of the voice coil motor 41 is connected to the stator assembly 411 in a lifting and sliding manner, and the push block 42 is fixedly arranged on the top of the mover assembly 412. The lower end of the push member 53 abuts against the push block 42.

[0083] When the moving subassembly 412 of the voice coil motor 41 rises, it drives the pushing block 42 to push the pushing member 53 upward, and the upper end of the pushing member 53 passes through the pushing hole 55 upward to push the wafer located at the predetermined position of the blue film.

[0084] The voice coil motor 41 has the advantages of high speed and fast response. The voice coil motor 41 is used to drive the pushing member 53 to move, thereby improving the pushing efficiency of the pushing member 53.

[0085] Optionally, a vertical slide rail is provided on the stator assembly 411 , and the mover assembly 412 is slidably connected to the slide rail via a sliding connection plate 413 .

[0086] like Figure 5As shown, optionally, the second lifting mechanism 4 also includes a blowing block 43 arranged on the mounting bracket 2, and an air cavity connected to the compressed air source is arranged in the blowing block 43, and a blowing hole connected to the air cavity is arranged on one side of the blowing block 43 facing the mover assembly 412 of the voice coil motor 41.

[0087] The air blowing block 43 blows air toward the moving subassembly 412 of the voice coil motor 41 through the air blowing hole, thereby implementing air blowing cooling on the voice coil motor 41 and extending the service life of the voice coil motor.

[0088] Optionally, the second lifting mechanism 4 further includes a grating ruler 44 for measuring the lifting stroke of the moving subassembly 412 of the voice coil motor 41, the grating ruler 44 includes a grating and a reading head, wherein the reading head is fixedly mounted on the mounting bracket 2, the grating is fixedly mounted on the side of the moving subassembly 412, and the sensing end of the reading head is arranged opposite to the grating. By setting the grating ruler 44, the lifting stroke of the moving subassembly 412 of the voice coil motor 41 is accurately measured, and finally the pushing stroke of the pushing member 53 is accurately controlled, ensuring that the pushing member 53 pushes the wafer to a predetermined height.

[0089] like Fig.10 As shown, optionally, a suction hole 57 is also provided on the top of the needle cap 52. Figure 4 and Figure 8 As shown, the magnetic base 3 is provided with an exhaust interface 33 for connecting the exhaust device, and the push seat 51 is provided with an exhaust hole 58 for connecting the exhaust interface 33 and the inner cavity of the needle cap 52. A sealing ring is provided at the connection between the exhaust hole 58 and the exhaust interface 33. The exhaust device exhausts air from the inner cavity of the needle cap 52 through the exhaust interface 33 and the exhaust hole 58, so that the adsorption hole 57 at the top of the needle cap 52 generates adsorption force.

[0090] Before controlling the pushing member 53 to push the chip, the needle cap 52 in contact with the blue film first absorbs the blue film through the absorption hole 57, thereby ensuring that the relative position of the pushing member 53 and the chip remains relatively stable and preventing the chip from deviating from the pushing member 53 during the pushing process.

[0091] In order to ensure that the needle cap 52 is firmly locked on the push seat 51 and facilitate the disassembly and assembly of the needle cap 52, as shown in FIG. Figures 8 to 9 As shown, optionally, the needle cap 52 is detachably locked on the ejection seat 51 by a locking ring 59 .

[0092] like Fig. 9As shown, the ejection member 53 includes a clamp 531, an ejection rod 532, an ejector pin mounting seat and a plurality of ejectors, wherein: the clamp 531 is detachably mounted on the lower end of the ejection rod 532. The lower end of the ejection rod 532 passes through the second ejection channel 54 and the first ejection channel 31 in sequence and then abuts against the movable part of the second lifting mechanism 4, and the clamp 531 is used to clamp the limited ejection rod 532 in the first ejection channel 31. The ejector pin mounting seat is mounted on the upper end of the ejection rod 532. A plurality of ejectors are mounted on the ejector pin mounting seat, and the top of the needle cap 52 is provided with an ejection hole 55 corresponding to each ejector pin.

[0093] By setting the push member 53, it is convenient to disassemble and maintain the push member 53, for example, it is convenient to replace the ejector pin. In addition, the push rod 532 is clamped and limited by the clamp 531 located in the first push channel 31, ensuring that the lower end of the push rod 532 can abut against the movable part of the second lifting mechanism 4. By cooperating with multiple ejectors to lift the wafer, the lifting stability of the wafer can be improved.

[0094] Optionally, the push member 53 further includes a push guide assembly, which includes a first guide wheel 533, a second guide wheel 534 and a guide post 535, wherein the first guide wheel 533 and the second guide wheel 534 are arranged side by side on the clamp 531. The upper end of the guide post 535 is fixedly connected to the push seat 51, and the second end of the guide post 535 passes between the first guide wheel 533 and the second guide wheel 534, and the first guide wheel 533 and the second guide wheel 534 both abut against the guide post 535.

[0095] The ejection guide assembly realizes the lifting and lowering guidance of the clamp 531 and the ejection rod 532, and finally improves the lifting and lowering stability of the ejector pin, ensuring that the ejector pin can accurately pass through the corresponding ejection hole 55 upward to implement the ejection of the wafer.

[0096] The present application is described in sufficient detail above with certain particularity. It should be understood by those skilled in the art that the description in the embodiments is merely exemplary, and all changes made without departing from the true spirit and scope of the present application should fall within the scope of protection of the present application. The scope of protection claimed in the present application is defined by the claims, rather than by the above description in the embodiments.

Claims

1. A wafer pushing device, characterized in that: The wafer pushing device comprises a first lifting mechanism, a mounting bracket, a magnetic base, a second lifting mechanism and a pushing assembly, wherein: The mounting bracket is connected to the movable component of the first lifting mechanism, and the first lifting mechanism is used to drive the mounting bracket to rise and fall; The magnetic base is arranged on the top of the mounting bracket, and the magnetic base is provided with a first pushing channel which penetrates the magnetic base; The second lifting mechanism is arranged in the mounting bracket; The pushing assembly includes a pushing seat, a needle cap and a pushing piece, wherein the pushing seat is magnetically fixed to the magnetic base, the pushing seat is provided with a second pushing channel that passes through the first pushing channel up and down, the needle cap is connected to the pushing seat, the pushing piece is arranged in the needle cap, the top of the needle cap is provided with a pushing hole for the pushing piece to pass upward, and the lower end of the pushing piece passes through the second pushing channel and the first pushing channel in sequence and then abuts against the movable part of the second lifting mechanism.

2. The wafer pushing device according to claim 1, characterized in that: The upper surface of the magnetic base is provided with three supporting grooves surrounding the first pushing channel; The push seat is provided with three support pins corresponding to the support grooves one by one, and the support pins are all supported in the corresponding support grooves. A gap is retained between the lower surface of the push seat and the upper surface of the magnetic base.

3. The wafer push device according to claim 2, characterized in that: The support groove is a V-shaped structure, and the support groove includes a first support inclined surface and a second support inclined surface arranged opposite to each other; The support pin is inserted into the push seat, and the lower end of the support pin forms a hemispherical support portion, which abuts against the first support inclined surface and the second support inclined surface.

4. The wafer pushing device according to claim 1, characterized in that: The magnetic base is provided with a plurality of first magnets, and the push seat is provided with a plurality of second magnets with polarities opposite to those of the first magnets; Alternatively, one of the magnetic base and the push seat is provided with a magnet, and the other of the magnetic base and the push seat is an iron structure.

5. The wafer pushing device according to claim 1, characterized in that: The upper surface of the magnetic base is provided with positioning pins on at least two adjacent side edges, and a gap is reserved between the positioning pins and the side edges of the push seat.

6. The wafer pushing device according to claim 1, characterized in that: The mounting bracket includes a bottom plate, a first connecting plate, a second connecting plate and a supporting frame, wherein: The bottom plate is connected to the movable component of the first lifting mechanism; The first connecting plate is adjustably connected to the bottom plate along a first horizontal direction; The second connecting plate is adjustably connected to the first connecting plate along a second horizontal direction, and the second horizontal direction is perpendicular to the first horizontal direction; The support frame is connected to the second connecting plate, the magnetic base is arranged on the top of the support frame, and the second lifting mechanism is located in the support frame.

7. The wafer pushing device according to claim 1, characterized in that: The second lifting mechanism comprises a voice coil motor and a push block, the stator assembly of the voice coil motor is fixedly mounted on the mounting bracket, the mover assembly of the voice coil motor is liftably and slidably connected to the stator assembly, and the push block is fixedly arranged on the top of the mover assembly; The lower end of the pushing member abuts against the pushing block.

8. The wafer push device according to claim 7, characterized in that: The second lifting mechanism also includes a blowing block arranged on the mounting bracket, wherein an air cavity connected to a compressed air source is arranged in the blowing block, and a blowing hole communicating with the air cavity is arranged on a side of the blowing block facing the mover assembly of the voice coil motor.

9. The wafer pushing device according to claim 7, characterized in that: The second lifting mechanism also includes a grating scale for measuring the lifting stroke of the movable subassembly of the voice coil motor, the grating scale includes a grating and a reading head, the reading head is fixedly mounted on the mounting bracket, the grating is fixedly mounted on the side of the movable subassembly, and the sensing end of the reading head is arranged opposite to the grating.

10. The wafer pushing device according to claim 1, characterized in that: The top of the needle cap is also provided with an adsorption hole; The magnetic base is provided with an air extraction interface for connecting to an air extraction device; The push seat is provided with an exhaust hole for connecting the exhaust interface with the inner cavity of the needle cap, and a sealing ring is provided at the joint between the exhaust hole and the exhaust interface. The exhaust device exhausts air from the inner cavity of the needle cap through the exhaust interface and the exhaust hole, so that the adsorption hole generates adsorption force.

11. The wafer pushing device according to claim 1, characterized in that: The needle cap is detachably locked on the push seat through a locking ring.

12. The wafer pushing device according to claim 1, wherein: The ejector member includes a clamp, an ejector rod, an ejector mounting seat and a plurality of ejectors, wherein: The clamp is detachably mounted on the lower end of the push rod; The lower end of the push rod passes through the second push channel and the first push channel in sequence and then abuts against the movable component of the second lifting mechanism, and the clamp is used to clamp and limit the push rod in the first push channel; The ejector pin mounting seat is mounted on the upper end of the ejector rod; A plurality of ejector pins are mounted on the ejector pin mounting seat, and the top of the needle cap is provided with ejection holes corresponding one to one with the ejector pins.

13. The wafer pushing device according to claim 12, wherein: The push member further includes a push guide assembly, and the push guide assembly includes a first guide wheel, a second guide wheel and a guide column, wherein: The first guide wheel and the second guide wheel are arranged side by side on the clamp; The upper end of the guide column is fixedly connected to the push seat, and the second end of the guide column passes between the first guide wheel and the second guide wheel, and the first guide wheel and the second guide wheel both abut against the guide column.

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