Pier type wire welding structure and wire welding method thereof

Abstract

The invention discloses a bridge pier type bonding wire structure and a bonding wire method thereof, and relates to the technical field of chip packaging. The key points of the technical scheme are that the structure comprises a frame chip seat, a plurality of pins are arranged on the surface of the frame chip seat along the circumferential side, a chip is arranged on the surface of the frame chip seat, a plurality of welding pad electrodes are arranged on the surface of the chip, a plurality of bridge pier welding pads are arranged on the surface of the chip, and welding wires are arranged between the pins and the welding pad electrodes. The two ends of the bonding wire are connected to the pin, the bridge pier bonding pad and the bonding pad electrode through welding. The invention aims to provide a bridge pier type wire welding structure and a wire welding method thereof.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and more particularly to a bridge-type wire bonding structure and a wire bonding method thereof. Background Art

[0002] With the rapid development of wireless communications, automotive electronics and other consumer electronic products, microelectronic packaging technology is developing towards multi-function, high speed, low power consumption and high reliability.

[0003] The size of packaged products is getting bigger and bigger. In the process of package wire bonding, the distance between the pin and the chip increases, as shown in the figure, causing the length of the wire to increase. After the package molding flow is punched, the swing distance of the wire increases, causing the wire to form a larger offset arc, which can easily cause a short circuit. Therefore, the size of the package product cannot be further increased.

[0004] Therefore, a new technical solution is urgently needed to solve the above technical problems. Summary of the invention

[0005] In view of the deficiencies in the prior art, an object of the present invention is to provide a pier type welding wire structure and a welding wire method thereof.

[0006] The above technical objectives of the present invention are achieved through the following technical solutions: a pier type wire bonding structure, including a frame chip seat, a surface of the frame chip seat is provided with a plurality of pins along its circumference, a surface of the frame chip seat is provided with a chip, a plurality of pad electrodes are provided on the surface of the chip, a plurality of pier pads are provided on the surface of the chip, a welding wire is provided between the pins and the pad electrodes, and two ends of the welding wire are connected to the pins, the pier pads and the pad electrodes by welding.

[0007] By adopting the above technical solution, a bridge pier pad is set between the pin and the pad electrode. After the welding wire is connected to the pin and the pad electrode, the middle part of the welding wire is connected to the bridge pier pad. After the molding and die flow punching, the welding wire forms two arc-shaped wire offsets. Compared with one-section wire offset, the offset amplitude of the welding wire can be effectively reduced, thereby reducing the possibility of short circuit, achieving a smaller integrated circuit design, and optimizing the cost structure of the product.

[0008] The present invention is further configured as follows: the bridge pier pad includes a conductive bridge pier pad and a non-conductive bridge pier pad, and a conductive electrode electrically connected to an electronic circuit inside a chip is disposed at the bottom of the conductive bridge pier pad.

[0009] The present invention is further configured as follows: the bonding wire is specifically a gold wire, a copper wire or a silver wire, and its diameter is 15um-100um.

[0010] The present invention is further configured as follows: the welding wires are connected in parallel using a plurality of gold wires, silver wires or copper wires, and are connected to the pins, the bridge pier welding pads and the welding pad electrodes.

[0011] The present invention is further configured as follows: a bridge pier pad is provided between a corresponding group of the pins and the pad electrodes.

[0012] The present invention is further configured such that: a plurality of bridge pads are arranged between a corresponding group of the pins and the pad electrodes.

[0013] A pier type wire welding method comprises the following steps:

[0014] S1. According to chip specifications, several bridge pier welding points are set on the chip surface;

[0015] S2. Preset the bonding path and put the chip into the bonding machine;

[0016] S3, the wire bonding machine connects the corresponding pins, bridge pier pads and pad electrodes with welding wires.

[0017] The present invention has the following beneficial effects: a bridge pier pad is arranged between the pin and the pad electrode, and after the welding wire is connected to the pin and the pad electrode, the middle part of the welding wire is connected to the bridge pier pad, and after the wire is pressed by molding and die flow, the welding wire forms two sections of arc-shaped wire offset. Compared with one section of wire offset, the offset amplitude of the welding wire can be effectively reduced, thereby reducing the possibility of short circuit, achieving a smaller integrated circuit design, and optimizing the cost structure of the product. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a structural schematic diagram of specific embodiment 1;

[0019] Figure 2 It is a structural schematic diagram of specific embodiment 2;

[0020] Figure 3 It is a structural schematic diagram of the prior art.

[0021] Description of the drawings: 1. Frame chip holder; 2. Pins; 3. Chip; 4. Solder pad electrode; 5. Bridge pier solder pad; 6. Solder wire. DETAILED DESCRIPTION

[0022] The present invention is further described in detail below in conjunction with the accompanying drawings.

[0023] The same parts are denoted by the same reference numerals. It should be noted that the words "front", "rear", "left", "right", "upper" and "lower" used in the following description refer to directions in the drawings, and the words "bottom" and "top", "inner" and "outer" refer to directions toward or away from the geometric center of a specific component, respectively. Specific embodiment 1:

[0025] As shown in the figure, a pier type welding wire structure includes a frame chip seat 1, a plurality of pins 2 are arranged on the surface of the frame chip seat 1 along its circumference, a chip 3 is arranged on the surface of the frame chip seat 1, a plurality of welding pad electrodes 4 are arranged on the surface of the chip 3, a plurality of pier welding pads 5 are arranged on the surface of the chip 3, welding wires 6 are arranged between the pins 2 and the welding pad electrodes 4, two ends of the welding wires 6 are connected to the pins 2 and the welding pad electrodes 4 by welding, a corresponding group of pins 2 and the welding pad electrodes 4 are provided with a pier welding pad 5, and the welding wires 6 are connected to the pier welding pad 5.

[0026] By setting a pier welding pad 5 between the pin 2 and the welding pad electrode 4, after the welding wire 6 is connected to the pin 2 and the welding pad electrode 4, the middle part of the welding wire 6 is connected to the pier welding pad 5, and after the molding and die flow punching, the welding wire 6 forms two arc-shaped wire offsets. Compared with one section of wire offset, the offset amplitude of the welding wire 6 can be effectively reduced, thereby reducing the possibility of short circuit, achieving a smaller integrated circuit design, and also optimizing the cost structure of the product.

[0027] The pier pads 5 include conductive pier pads 5 and non-conductive pier pads 5. The bottom of the conductive pier pads 5 is provided with conductive electrodes electrically connected to the internal electronic circuit of the chip 3. Therefore, according to actual product requirements, the conductive pier pads 5 and the non-conductive pier pads 5 are arranged at designated positions, which can selectively connect the three major types of circuit groups (I / O signal terminal / power terminal / ground terminal) in the integrated circuit, making it convenient for users to use a single chip 3 to meet the functional requirements of various products.

[0028] The welding wire 6 is specifically a gold wire, a copper wire or a silver wire with a diameter of 15um-100um. The welding wire 6 is made of multiple gold wires, silver wires or copper wires connected in parallel and connected to the pin 2, the bridge pier pad 5 and the pad electrode 4 to meet the application requirements of micro-current to high-current integrated circuits. Specific embodiment 2:

[0030] Different from the specific embodiment 1, two bridge pier pads 5 are arranged between a corresponding group of pins 2 and the pad electrodes 4, and the welding wires 6 are connected to the bridge pier pads 5. Multiple bridge pier pads 5 can also be arranged according to actual needs and the size of the chip 3. The welding wires 6 are connected to each bridge pier pad 5 in turn to prevent the welding wires 6 from forming multiple sections of wire deviation after the molding and die flow punching, thereby preventing the wire deviation of each section formed by the welding wire 6 from being too large, thereby ensuring the quality of the finished chip 3. Specific embodiment 3:

[0032] A bridge-type wire welding method 6 comprises the following steps:

[0033] S1. According to the specifications of the chip 3, a plurality of bridge pier solder points are arranged on the surface of the chip 3, so that a bridge pier solder pad 5 is arranged between the corresponding pin 2 and the solder pad electrode 4;

[0034] S2. Preset the bonding path and put the chip into the bonding machine;

[0035] S3 , the wire bonding machine connects the corresponding pins 2 , the bridge pier pads 5 and the pad electrodes 4 with the welding wires 6 .

[0036] The specific embodiments are merely explanations of the present invention and are not limitations of the present invention. After reading this specification, those skilled in the art may make modifications to the embodiments without any creative contribution as needed. However, such modifications are protected by the patent law as long as they are within the scope of the claims of the present invention.

Claims

1. A pier type welding wire structure, characterized in that: The invention comprises a frame chip seat (1), wherein a plurality of pins (2) are arranged on the surface of the frame chip seat (1) along its circumference, a chip (3) is arranged on the surface of the frame chip seat (1), a plurality of welding pad electrodes (4) are arranged on the surface of the chip (3), a plurality of bridge pads (5) are arranged on the surface of the chip (3), a welding wire (6) is arranged between the pin (2) and the welding pad electrode (4), and two ends of the welding wire (6) are connected to the pin (2), the bridge pad (5) and the welding pad electrode (4) by welding.

2. A pier type welding wire structure according to claim 1, characterized in that: The bridge pier welding pad (5) comprises a conductive bridge pier welding pad (5) and a non-conductive bridge pier welding pad (5), and a conductive electrode electrically connected to an internal electronic circuit of the chip (3) is arranged at the bottom of the conductive bridge pier welding pad (5).

3. A pier type welding wire structure according to claim 2, characterized in that: The welding wire (6) is specifically a gold wire, a copper wire or a silver wire, and its diameter is 15um-100um.

4. A pier type welding wire (6) structure according to claim 3, characterized in that: The welding wire (6) is made of a plurality of gold wires, silver wires or copper wires connected in parallel, and is connected to the pin (2), the bridge pier welding pad (5) and the welding pad electrode (4).

5. The pier type welding wire structure according to claim 4, characterized in that: A bridge pier welding pad (5) is provided between a corresponding group of pins (2) and the welding pad electrode (4).

6. The bridge-type welding wire structure according to claim 4, characterized in that: A plurality of bridge pier welding pads (5) are arranged between a corresponding group of the pins (2) and the welding pad electrodes (4).

7. A pier type wire welding method, characterized in that: The steps include: S1. According to the specifications of the chip (3), a plurality of bridge pier welding points are arranged on the surface of the chip (3); S2, preset the bonding path and put the chip (3) into the bonding machine; S3, a wire bonding machine uses a welding wire (6) to connect the corresponding pin (2), the bridge pier welding pad (5) and the welding pad electrode (4).

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