Display panel
By introducing through-holes in the padding layer of the display panel and filling them with connecting electrodes, the problem of improving the resolution of micro-LED display panels was solved, achieving higher sub-pixel density and higher resolution.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2023-09-07
- Publication Date
- 2026-04-14
AI Technical Summary
Currently, it is difficult to improve the resolution of micro LED display panels. Traditional manufacturing methods cannot achieve high resolution, and the manufacturing process lacks stability and reliability.
By introducing through-holes through the padding layer in the display panel and filling them with connecting electrodes, electrical connections are achieved, saving layout space and increasing the number of sub-pixels.
By saving layout space, the resolution of the display panel is significantly improved, achieving a higher subpixel density.
Smart Images

Figure CN119604105B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of displays, specifically to a display panel. Background Technology
[0002] With the maturation and development of wearable consumer electronics technologies such as AR (Augmented Reality) and VR (Virtual Reality), the requirements for displays are becoming increasingly stringent, especially in terms of display lifespan, resolution, and brightness. For example, the required resolution (PPI) is greater than 2000 PPI, the required brightness is greater than 3000 nits, and the longer the lifespan, the better. Traditional LCD or OLED displays cannot meet the requirements of AR and VR products. Micro-LEDs (uLEDs, micro-LEDs) are considered the best display solution for AR and VR products. Currently, the most mainstream manufacturing method for micro-LED display panels is to mass transfer R, G, and B monochrome micro-LEDs onto a driving substrate to assemble a full-color display. However, integrating millions or even tens of millions of micro-LEDs with pixel driving circuit arrays is very challenging. Ensuring the stability and efficiency of the manufacturing process and the reliability of the transfer becomes very difficult, and this method is difficult to achieve high-resolution micro-LED displays.
[0003] Therefore, current micro LED display panels face the problem of difficulty in improving resolution. Summary of the Invention
[0004] This application provides a display panel that can solve the problem of difficulty in improving the resolution of current micro LED display panels.
[0005] This application provides a display panel, including:
[0006] Base;
[0007] A first conductive layer is disposed on the substrate, and the first conductive layer includes a first electrode and a second electrode.
[0008] A first light-emitting stack layer is disposed on the first conductive layer. The first light-emitting stack layer includes a first color light-emitting portion stacked with the first electrode and a first pad portion stacked with the second electrode.
[0009] A second conductive layer is disposed on the first light-emitting stacked layer, and the second conductive layer includes a third electrode stacked with the first pad layer portion;
[0010] A second light-emitting stack layer is disposed on the second conductive layer, and the second light-emitting stack layer includes a second color light-emitting part that is stacked with the third electrode;
[0011] A common electrode is disposed on the second light-emitting stack layer and is electrically connected to the first color light-emitting part and the second color light-emitting part;
[0012] The display panel further includes a first through hole penetrating the first pad layer and a first connecting electrode filling the first through hole, wherein the third electrode is electrically connected to the second electrode through the first connecting electrode.
[0013] Optionally, in some embodiments of this application, the first conductive layer further includes a fourth electrode, the first light-emitting stacked layer further includes a second pad layer, the second conductive layer further includes a fifth electrode, the second light-emitting stacked layer further includes a third pad layer, and the display panel further includes:
[0014] A third conductive layer is disposed between the second light-emitting stacked layer and the common electrode, and the third conductive layer includes a sixth electrode;
[0015] A third light-emitting stack layer is disposed between the third conductive layer and the common electrode layer, and the third light-emitting stack layer includes a third color light-emitting part;
[0016] The fourth electrode, the second pad layer, the fifth electrode, the third pad layer, the sixth electrode, and the third color light-emitting part are stacked, and the common electrode is also electrically connected to the third color light-emitting part;
[0017] The display panel further includes a second through hole penetrating the second pad layer and the third pad layer, and a second connecting electrode filling the second through hole. The sixth electrode is electrically connected to the fourth electrode through the second connecting electrode.
[0018] Optionally, in some embodiments of this application, the second through hole includes a first sub-through hole penetrating the second padding portion and a second sub-through hole penetrating the third padding portion, and the second connecting electrode includes a first sub-connecting electrode filling the first sub-through hole and a second sub-connecting electrode filling the second sub-through hole. The first sub-connecting electrode is connected between the fifth electrode and the fourth electrode, and the second sub-connecting electrode is connected between the sixth electrode and the fifth electrode.
[0019] Optionally, in some embodiments of this application, it further includes:
[0020] A protective layer is disposed between the first color light-emitting part, the second color light-emitting part, the third color light-emitting part and the common electrode. The protective layer includes a first opening exposing the top of the first color light-emitting part, a second opening exposing the top of the second color light-emitting part and a third opening exposing the top of the third color light-emitting part.
[0021] The common electrode is connected to the first color light-emitting part, the second color light-emitting part, and the third color light-emitting part through the first opening, the second opening, and the third opening, respectively.
[0022] Optionally, in some embodiments of this application, the second conductive layer further includes a seventh electrode, the second light-emitting stack layer further includes a fourth pad layer, the third conductive layer further includes an eighth electrode and a ninth electrode, and the third light-emitting stack layer further includes a fifth pad layer and a sixth pad layer.
[0023] The seventh electrode, the fourth pad layer, the eighth electrode, and the fifth pad layer are stacked with the first color light-emitting part, and the ninth electrode and the sixth pad layer are stacked with the second color light-emitting part;
[0024] The common electrode covers the fifth pad layer, the sixth pad layer, and the third color light-emitting part.
[0025] Optionally, in some embodiments of this application, the display panel further includes a protective layer disposed between the fifth pad layer, the sixth pad layer, the third color light-emitting portion, and the common electrode;
[0026] On the plane of the display panel, one end of the first color light-emitting part extends out relative to the seventh electrode to form a first step, and one end of the second color light-emitting part extends out relative to the ninth electrode to form a second step;
[0027] The protective layer includes a fourth opening at the top of the first color light-emitting part exposed on the first step, a fifth opening at the top of the second color light-emitting part exposed on the second step, and a sixth opening at the top of the third color light-emitting part exposed.
[0028] The common electrode is connected to the first color light-emitting part, the second color light-emitting part, and the third color light-emitting part through the fourth opening, the fifth opening, and the sixth opening, respectively.
[0029] Optionally, in some embodiments of this application, the film structure of the first light-emitting stacked layer includes a first epitaxial layer, a first light-emitting layer, and a second epitaxial layer sequentially stacked on the first conductive layer;
[0030] The film structure of the second light-emitting stacked layer includes a third epitaxial layer, a second light-emitting layer, and a fourth epitaxial layer sequentially stacked on the second conductive layer;
[0031] The film structure of the third light-emitting stacked layer includes a fifth epitaxial layer, a third light-emitting stacked layer, and a sixth epitaxial layer sequentially stacked on the third conductive layer.
[0032] Optionally, in some embodiments of this application, it further includes:
[0033] A second color filter layer is disposed between the first light-emitting stacked layer and the second conductive layer;
[0034] A first bonding layer is disposed between the first light-emitting stacked layer and the second color filter layer;
[0035] A third color filter layer is disposed between the second light-emitting stacked layer and the third conductive layer;
[0036] The second bonding layer is disposed between the second light-emitting stacked layer and the third color filter layer;
[0037] The second color filter layer and the first bonding layer have the same pattern as the second light-emitting stacked layer, and the third color filter layer and the second bonding layer have the same pattern as the third light-emitting stacked layer.
[0038] Optionally, in some embodiments of this application, the light emitted by the first color light-emitting part, the second color light-emitting part, and the third color light-emitting part is emitted to the side of the common electrode away from the substrate.
[0039] Optionally, in some embodiments of this application, the first color light-emitting part emits red light, the second color light-emitting part emits green light, and the third color light-emitting part emits blue light.
[0040] In this embodiment of the application, a display panel is provided, comprising: a substrate; a first conductive layer disposed on the substrate, the first conductive layer including a first electrode and a second electrode; a first light-emitting stack layer disposed on the first conductive layer, the first light-emitting stack layer including a first color light-emitting portion stacked with the first electrode and a first pad portion stacked with the second electrode; a second conductive layer disposed on the first light-emitting stack layer, the second conductive layer including a third electrode stacked with the first pad portion; a second light-emitting stack layer disposed on the second conductive layer, the second light-emitting stack layer including a second color light-emitting portion stacked with the third electrode; and a common electrode disposed on the second light-emitting stack layer and electrically connected to the first color light-emitting portion and the second color light-emitting portion; wherein the display panel further includes a first through-hole penetrating the first pad portion and a first connecting electrode filling the first through-hole, and the third electrode being electrically connected to the second electrode through the first connecting electrode. In this application, by providing a first through hole in the first pad layer and filling the first through hole with a first connecting electrode, the third electrode is electrically connected to the second electrode through the first connecting electrode. The second electrode can be connected to the driving circuit on the substrate, thereby making the third electrode electrically connected to the driving circuit. Since the first through hole penetrates through the first pad layer, that is, the first through hole is provided inside the first pad layer, the first through hole and the first connecting electrode do not occupy the layout space of the display panel separately, saving layout space and allowing more sub-pixels to be set. Therefore, the resolution of the display panel is greatly improved. Attached Figure Description
[0041] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0042] Figure 1 This is a schematic diagram of a first cross-sectional structure of a display panel provided in Embodiment 1 of this application;
[0043] Figure 2 This is a schematic diagram of a second cross-sectional structure of a display panel provided in Embodiment 1 of this application;
[0044] Figure 3 This is a schematic diagram of a first cross-sectional structure of a display panel provided in Embodiment 2 of this application;
[0045] Figure 4 This is a schematic diagram of a second cross-sectional structure of a display panel provided in Embodiment 2 of this application;
[0046] Figure 5This is a schematic diagram of the first intermediate process of a method for manufacturing a display panel according to Embodiments 3 / 4 of this application;
[0047] Figure 6 This is a schematic diagram of the second intermediate process of a method for manufacturing a display panel according to Embodiments 3 / 4 of this application;
[0048] Figure 7 A schematic diagram of the third intermediate process of a method for manufacturing a display panel according to Embodiments 3 / 4 of this application;
[0049] Figure 8 A schematic diagram of the fourth intermediate process of a method for manufacturing a display panel according to Embodiments 3 / 4 of this application;
[0050] Figure 9 This is a schematic diagram of the fifth intermediate process of a method for manufacturing a display panel according to Embodiment 3 of this application;
[0051] Figure 10 This is a schematic diagram of the sixth intermediate process of a method for manufacturing a display panel according to Embodiment 3 of this application;
[0052] Figure 11 This is a schematic diagram of the seventh intermediate process of a method for manufacturing a display panel according to Embodiment 3 of this application;
[0053] Figure 12 This is a schematic diagram of the fifth intermediate process of a method for manufacturing a display panel according to Embodiment 4 of this application;
[0054] Figure 13 This is a schematic diagram of the sixth intermediate process of a method for manufacturing a display panel according to Embodiment 4 of this application. Detailed Implementation
[0055] The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application. In addition, it should be understood that the specific embodiments described herein are only for illustration and explanation of this application and are not intended to limit this application. In this application, unless otherwise stated, directional terms such as "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, specifically the drawing directions in the accompanying drawings; while "inner" and "outer" refer to the outline of the device.
[0056] This application provides a display panel, comprising: a substrate; a first conductive layer disposed on the substrate, the first conductive layer including a first electrode and a second electrode; a first light-emitting stack layer disposed on the first conductive layer, the first light-emitting stack layer including a first color light-emitting portion stacked with the first electrode and a first pad portion stacked with the second electrode; a second conductive layer disposed on the first light-emitting stack layer, the second conductive layer including a third electrode stacked with the first pad portion; a second light-emitting stack layer disposed on the second conductive layer, the second light-emitting stack layer including a second color light-emitting portion stacked with the third electrode; and a common electrode disposed on the second light-emitting stack layer and electrically connected to the first color light-emitting portion and the second color light-emitting portion; wherein the display panel further includes a first through-hole penetrating the first pad portion and a first connecting electrode filling the first through-hole, and the third electrode being electrically connected to the second electrode through the first connecting electrode.
[0057] The following sections provide detailed descriptions of each example. It should be noted that the order in which the embodiments are described is not intended to limit the preferred order of the embodiments.
[0058] Example 1
[0059] Please see Figure 1 and Figure 2 , Figure 1 This is a schematic diagram of a first cross-sectional structure of a display panel provided in Embodiment 1 of this application; Figure 2 This is a schematic diagram of a second cross-sectional structure of a display panel provided in Embodiment 1 of this application.
[0060] This application provides a display panel 100, which includes: a substrate 10, a first conductive layer 11, a first light-emitting stacked layer 12, a second conductive layer 15, a second light-emitting stacked layer 16, and a common electrode 22. The first conductive layer 11 is disposed on the substrate 10 and includes a first electrode 11-1 and a second electrode 11-2; the first light-emitting stacked layer 12 is disposed on the first conductive layer 11 and includes a first color-emitting portion 12A1 stacked with the first electrode 11-1 and a first pad portion 12B1 stacked with the second electrode 11-2; the second conductive layer 15 is disposed on the first light-emitting stacked layer 12 and includes a third electrode 15-3 stacked with the first pad portion 12B1; the second light-emitting stacked layer 22... The stacked layer 16 is disposed on the second conductive layer 15. The second light-emitting stacked layer 16 includes a second color light-emitting part 16A2 stacked with the third electrode 15-3. The common electrode 22 is disposed on the second light-emitting stacked layer 16 and is electrically connected to the first color light-emitting part 12A1 and the second color light-emitting part 16A2. The display panel 100 also includes a first through hole 31 penetrating the first pad layer 12B1 and a first connecting electrode 41 filling the first through hole 31. The third electrode 15-3 is electrically connected to the second electrode 11-2 through the first connecting electrode 41.
[0061] Specifically, the substrate 10 may include, but is not limited to, glass, quartz, silicon, organic polymers, or organic-inorganic composite materials. In some exemplary embodiments, various drive traces and drive circuits may also be provided on the substrate 10 to drive the corresponding color light-emitting parts to emit light. Driving devices including thin-film transistors may also be provided on the substrate 10 to drive each epitaxial stack in an active matrix manner. For this purpose, the substrate 10 may be configured as a printed circuit board or a composite substrate, which can be formed by forming circuit portions and / or driving devices on glass, quartz, silicon, organic polymers, or organic-inorganic composite materials.
[0062] Specifically, the first conductive layer 11 may include a first sub-conductive layer 111 and a second sub-conductive layer 112. The first sub-conductive layer 111 may be a conductive layer formed on the substrate 10, and the second sub-conductive layer 112 may be a conductive layer bonded to the first sub-conductive layer 111. When the first sub-conductive layer 111 and the second sub-conductive layer 112 are bonded, the first sub-conductive layer 111 and the second sub-conductive layer 112 may be considered as the same conductive layer.
[0063] Specifically, the film structure of the first conductive layer 11 may include a first sub-conductive layer 111 and a second sub-conductive layer 112. After the first conductive layer 11 is patterned on the substrate 10, it may include a first electrode 11-1, a second electrode 11-2, and a fourth electrode 11-4, etc., distributed in different locations.
[0064] Specifically, in this embodiment, by providing a first through hole 31 in the first pad layer 12B1 and filling the first through hole 31 with a first connecting electrode 41, the third electrode 15-3 is electrically connected to the second electrode 11-2 through the first connecting electrode 41. The second electrode 11-2 can be connected to the driving circuit on the substrate 10, thereby making the third electrode 15-3 electrically connected to the driving circuit. Since the first through hole 31 penetrates the first pad layer 12B1, that is, the first through hole 31 is provided inside the first pad layer 12B1, the first through hole 31 and the first connecting electrode 41 will not occupy the layout space of the display panel separately, saving layout space and allowing more sub-pixels to be set. Therefore, the resolution of the display panel is greatly improved.
[0065] In some embodiments, the first conductive layer 11 further includes a fourth electrode 11-4, the first light-emitting stacked layer 12 further includes a second pad layer 12B2, the second conductive layer 15 further includes a fifth electrode 15-5, and the second light-emitting stacked layer 16 further includes a third pad layer 16B3; the display panel 100 further includes a third conductive layer 19 and a third light-emitting stacked layer 20; the third conductive layer 19 is disposed between the second light-emitting stacked layer 16 and the common electrode 22, and the third conductive layer 19 includes a sixth electrode 19-6; the third light-emitting stacked layer 20 is disposed between the third conductive layer 19 and the common electrode 22 layer, and the third light-emitting stacked layer 20 ... fourth electrode 11-4, the first light-emitting stacked layer 12 further includes a second pad layer 12B2, the second conductive layer 15 further includes a fifth electrode 15-5, and the second light-emitting stacked layer 16 further includes a third pad layer 16B3; the display panel 100 further includes a third conductive layer 19 and a third light-emitting stacked layer 20; the third conductive layer 19 is disposed between the third conductive layer 19 and the common electrode 22 layer, and the third light-emitting stacked layer 20 includes a sixth electrode 19-6; the third light-emitting stacked layer 20 is disposed between the third conductive layer 19 and the common electrode 22 layer, and the third light-emitting stacked layer 20 is disposed between the third conductive layer 19 and the common electrode 22 layer, and the third light-emitting stacked layer 20 is disposed between the third conductive layer 19 and the common electrode 22 layer, and the third light-emitting stacked layer The stack 20 includes a third color light-emitting part 20A3; wherein, the fourth electrode 11-4, the second padding part 12B2, the fifth electrode 15-5, the third padding part 16B3, the sixth electrode 19-6 and the third color light-emitting part 20A3 are stacked, and the common electrode 22 is also electrically connected to the third color light-emitting part 20A3; wherein, the display panel 100 also includes a second through hole 32 penetrating the second padding part 12B2 and the third padding part 16B3, and a second connecting electrode 42 filling the second through hole 32, and the sixth electrode 19-6 is electrically connected to the fourth electrode 11-4 through the second connecting electrode 42.
[0066] Specifically, the display panel includes a first light-emitting stacked layer 12, a second light-emitting stacked layer 16, and a third light-emitting stacked layer 20; the first light-emitting stacked layer 12 includes a first color light-emitting portion 12A1, a first cushion portion 12B1, and a second cushion portion 12B2; the second light-emitting stacked layer 16 includes a second color light-emitting portion 16A2 and a third cushion portion 16B3; and the third light-emitting stacked layer 20 includes a third color light-emitting portion 20A3.
[0067] Specifically, the second color light-emitting part 16A2 is stacked on the first padding part 12B1; the third padding part 16B3 is stacked on the second padding part 12B2, and the third color light-emitting part 20A3 is stacked on the third padding part 16B3.
[0068] Specifically, the first color light-emitting part 12A1 can be any one of red light-emitting part, green light-emitting part, and blue light-emitting part; the second color light-emitting part 16A2 can be any one of red light-emitting part, green light-emitting part, and blue light-emitting part; and the third color light-emitting part 20A3 can be any one of red light-emitting part, green light-emitting part, and blue light-emitting part. Moreover, the first color light-emitting part 12A1, the second color light-emitting part 16A2, and the third color light-emitting part 20A3 are light-emitting parts that emit different colors of light, that is, the first color light-emitting part 12A1, the second color light-emitting part 16A2, and the third color light-emitting part 20A3 emit light of different colors.
[0069] Specifically, the sixth electrode 19-6 is electrically connected to the fourth electrode 11-4 through the second connecting electrode 42, and the fourth electrode 11-4 is then connected to the driving circuit on the substrate 10, thereby making the sixth electrode 19-6 electrically connected to the driving circuit on the substrate 10. Since the second through hole 32 penetrates the second pad portion 12B2 and the third pad portion 16B3, that is, the second through hole 32 is disposed inside the second pad portion 12B2 and the third pad portion 16B3, the second through hole 32 and the second connecting electrode 42 do not occupy the layout space of the display panel separately, saving layout space and allowing more sub-pixels to be set. Therefore, the resolution of the display panel is greatly improved.
[0070] In some embodiments, such as Figure 2 As shown, the second through hole 32 includes a first sub-through hole 321 penetrating the second padding portion 12B2 and a second sub-through hole 322 penetrating the third padding portion 16B3. The second connecting electrode 42 includes a first sub-connecting electrode 421 filling the first sub-through hole 321 and a second sub-connecting electrode 422 filling the second sub-through hole 322. The first sub-connecting electrode 421 is connected between the fifth electrode 15-5 and the fourth electrode 11-4, and the second sub-connecting electrode 422 is connected between the sixth electrode 19-6 and the fifth electrode 15-5.
[0071] Specifically, such as Figure 2 As shown, the sixth electrode 19-6 is electrically connected to the fourth electrode 11-4 through the second connecting electrode 42. The second connecting electrode 42 includes a first sub-connecting electrode 421 filling the first sub-through hole 321 and a second sub-connecting electrode 422 filling the second sub-through hole 322. The first sub-connecting electrode 421 is connected between the fifth electrode 15-5 and the fourth electrode 11-4, and the second connecting electrode 422 is connected between the sixth electrode 19-6 and the fifth electrode 15-5.
[0072] Specifically, in comparison Figure 1 and Figure 2 As shown, in Figure 1In this process, the second through hole 32 is an integral through hole that penetrates the second pad layer 12B2, the third pad layer 16B3 and the fifth electrode 15-5, which is equivalent to the first sub-through hole 321 and the second sub-through hole 322 being an integral second sub-through hole 322 that are interconnected.
[0073] Specifically, in comparison Figure 1 and Figure 2 As shown, in Figure 2 In the middle, the second through hole 32 does not penetrate the fifth electrode 15-5, which is equivalent to the first sub-through hole 321 and the second sub-through hole 322 not being interconnected as a whole.
[0074] Specifically, Figure 1 and Figure 2 The difference in the second through hole 32 is due to the different manufacturing processes of the display panel, but they can all achieve the beneficial effects in the above embodiments.
[0075] In some embodiments, the display panel 100 further includes a protective layer 21, which is disposed between the first color light-emitting part 12A1, the second color light-emitting part 16A2 and the third color light-emitting part 20A3 and the common electrode 22. The protective layer 21 includes a first opening 51 exposing the top of the first color light-emitting part 12A1, a second opening 52 exposing the top of the second color light-emitting part 16A2 and a third opening 53 exposing the top of the third color light-emitting part 20A3. The common electrode 22 is connected to the first color light-emitting part 12A1, the second color light-emitting part 16A2 and the third color light-emitting part 20A3 through the first opening 51, the second opening 52 and the third opening 53 respectively.
[0076] Specifically, the top of the first color light-emitting part 12A1, the top of the second color light-emitting part 16A2, and the top of the third color light-emitting part 20A3 refer to the surfaces of the first color light-emitting part 12A1, the second color light-emitting part 16A2, and the third color light-emitting part 20A3 that are away from the substrate 10, respectively.
[0077] Specifically, the protective layer 21 may be an insulating layer comprising one layer, two layers, or multiple layers. For example, the protective layer 21 may include a first sub-insulating layer and a second sub-insulating layer. The first sub-insulating layer may be atomic layer deposition, and the material of the first sub-insulating layer may include an Al2O3 / SiO2 / TiO2 stack. The second sub-insulating layer may be a dielectric protective layer, and the material of the second insulating layer may include silicon dioxide.
[0078] Specifically, the first light-emitting stacked layer 12 is patterned to include a first color light-emitting part 12A1, a first padding part 12B1 and a second padding part 12B2. The first color light-emitting part 12A1, the first padding part 12B1 and the second padding part 12B2 are spaced apart. A partition structure 71 or a partition gap may be provided between the first color light-emitting part 12A1, the first padding part 12B1 and the second padding part 12B2. The protective layer 21 may fill the partition structure 71 or the partition gap between the first color light-emitting part 12A1, the first padding part 12B1 and the second padding part 12B2.
[0079] Specifically, the common electrode 22 is connected to the first color light-emitting part 12A1, the second color light-emitting part 16A2, and the third color light-emitting part 20A3 through the first opening 51, the second opening 52, and the third opening 53, respectively. This allows the first color light-emitting part 12A1 to emit light under the voltage between the first electrode 11-1 and the common electrode 22, the second color light-emitting part 16A2 to emit light under the voltage between the third electrode 15-3 and the common electrode 22, and the third color light-emitting part 20A3 to emit light under the voltage between the sixth electrode 19-6 and the common electrode 22.
[0080] In some embodiments, the film structure of the first light-emitting stacked layer 12 includes a first epitaxial layer 121, a first light-emitting layer 122, and a second epitaxial layer 123 sequentially stacked on the first conductive layer 11; the film structure of the second light-emitting stacked layer 16 includes a third epitaxial layer 161, a second light-emitting layer 162, and a fourth epitaxial layer 163 sequentially stacked on the second conductive layer 15; and the film structure of the third light-emitting stacked layer 20 includes a fifth epitaxial layer 201, a third light-emitting layer 202, and a sixth epitaxial layer 203 sequentially stacked on the third conductive layer 19.
[0081] Specifically, the first epitaxial layer 121, the third epitaxial layer 161, and the fifth epitaxial layer 201 can be epitaxial layers of P-type material; the second epitaxial layer 123, the fourth epitaxial layer 163, and the sixth epitaxial layer 203 can be epitaxial layers of N-type material.
[0082] Specifically, the first light-emitting layer 122, the second light-emitting layer 162, and the third light-emitting layer 202 can be quantum well light-emitting layers of corresponding colors.
[0083] Specifically, in some implementations, when only a second conductive layer 15 is provided between the first light-emitting stacked layer 12 and the second light-emitting stacked layer 16, the second conductive layer 15 can be a film layer that serves as a bonding layer; when only a third conductive layer 19 is provided between the second light-emitting stacked layer 16 and the third light-emitting stacked layer 20, the third conductive layer 19 can be a film layer that serves as a bonding layer.
[0084] In some embodiments, the display panel 100 further includes a second color filter layer 14G, a first bonding layer 13, a third color filter layer 18B, and a second bonding layer 17; the second color filter layer 14G is disposed between the first light-emitting stacked layer 12 and the second conductive layer 15; the first bonding layer 13 is disposed between the first light-emitting stacked layer 12 and the second color filter layer 14G; the third color filter layer 18B is disposed between the second light-emitting stacked layer 16 and the third conductive layer 19; the second bonding layer 17 is disposed between the second light-emitting stacked layer 16 and the third color filter layer 18B, wherein the second color filter layer 14G and the first bonding layer 13 have the same pattern as the second light-emitting stacked layer 16, and the third color filter layer 18B and the second bonding layer 17 have the same pattern as the third light-emitting stacked layer 20.
[0085] Specifically, the second color filter layer 14G can absorb or reflect the light emitted by the second color light-emitting part 16A2 toward the substrate 10, and the third color filter layer 18B can absorb or reflect the light emitted by the third color light-emitting part 20A3 toward the substrate 10, thereby improving the light emission efficiency of the second color light-emitting part 16A2 and the third color light-emitting part 20A3.
[0086] Specifically, when the second color light-emitting part 16A2 emits green light, the second color filter layer 14G can absorb or reflect the green light; when the third color light-emitting part 20A3 emits blue light, the third color filter layer 18B can absorb or reflect the blue light.
[0087] Specifically, since the second color filter layer 14G and the first bonding layer 13 are patterned with the second light-emitting stacked layer 16 through the same process in the manufacturing process, the second color filter layer 14G and the first bonding layer 13 have the same pattern as the second light-emitting stacked layer 16, which can simplify the manufacturing process.
[0088] Specifically, since the third color filter layer 18B and the second bonding layer 17 are patterned with the third light-emitting stacked layer 20 through the same process in the manufacturing process, the third color filter layer 18B and the second bonding layer 17 have the same pattern as the third light-emitting stacked layer 20, which can simplify the manufacturing process.
[0089] Specifically, in this implementation, the first bonding layer 13 and the second bonding layer 17 serve as bonding layers. Both the first bonding layer 13 and the second bonding layer 17 can include two sublayers, which are bonded together.
[0090] In some embodiments, the light emitted by the first color light-emitting part 12A1, the second color light-emitting part 16A2, and the third color light-emitting part 20A3 is emitted to the side of the common electrode 22 away from the substrate 10.
[0091] Specifically, the light emission direction of the display panel 100 is the side of the common electrode 22 away from the substrate 10.
[0092] Specifically, the function of the first color light-emitting part 12A1, the second color light-emitting part 16A2, and the third color light-emitting part 20A3 is to emit display light. The function of the first padding part 12B1 is to support and carry the second color light-emitting part 16A2 above it, and the function of the second padding part 12B2 and the third padding part 16B3 is to support and carry the third color light-emitting part 20A3 above it.
[0093] Specifically, the first cushion layer 12B1, the second cushion layer 12B2, and the third cushion layer 16B3 do not emit light.
[0094] In some embodiments, the first color light-emitting unit 12A1 emits red light, the second color light-emitting unit 16A2 emits green light, and the third color light-emitting unit 20A3 emits blue light.
[0095] Example 2
[0096] This embodiment is the same as or similar to the display panel of any of the above embodiments. The similarities will not be repeated here, and only the differences will be introduced.
[0097] Please see Figure 3 and Figure 4 , Figure 3 This is a schematic diagram of a first cross-sectional structure of a display panel provided in Embodiment 2 of this application; Figure 4 This is a schematic diagram of a second cross-sectional structure of a display panel provided in Embodiment 2 of this application.
[0098] In some embodiments, the second conductive layer 15 further includes a seventh electrode 15-7, the second light-emitting stacked layer 16 further includes a fourth padding layer 16B4, the third conductive layer 19 further includes an eighth electrode 19-8 and a ninth electrode 19-9, and the third light-emitting stacked layer 20 further includes a fifth padding layer 20B5 and a sixth padding layer 20B6; the seventh electrode 15-7, the fourth padding layer 16B4, the eighth electrode 19-8 and the fifth padding layer 20B5 are stacked with the first color light-emitting part 12A1, and the ninth electrode 19-9 and the sixth padding layer 20B6 are stacked with the second color light-emitting part 16A2; the common electrode 22 covers the fifth padding layer 20B5, the sixth padding layer 20B6 and the third color light-emitting part 20A3.
[0099] Specifically, in comparison Figure 1 and Figure 3 ,contrast Figure 2 and Figure 4 It can be found Figure 3 and Figure 4In this configuration, the seventh electrode 15-7, the fourth padding layer 16B4, the eighth electrode 19-8, and the fifth padding layer 20B5 are stacked with the first color emitting part 12A1, and the ninth electrode 19-9 and the sixth padding layer 20B6 are stacked with the second color emitting part 16A2; the common electrode 22 covers the fifth padding layer 20B5, the sixth padding layer 20B6, and the third color emitting part 20A3. This difference is due to the difference in manufacturing process, and Figure 3 and Figure 4 The display panel 100 has the beneficial effects of any of the display panels 100 in the above embodiments.
[0100] Specifically, the fourth cushion layer 16B4, the fifth cushion layer 20B5, and the sixth cushion layer 20B6 do not emit display light.
[0101] In some embodiments, the display panel 100 further includes a protective layer 21 disposed between the fifth cushion portion 20B5, the sixth cushion portion 20B6, the third color emitting portion 20A3, and the common electrode 22. On the plane of the display panel 100, one end of the first color emitting portion 12A1 extends relative to the seventh electrode 15-7 to form a first step JT1, and one end of the second color emitting portion 16A2 extends relative to the ninth electrode 19-9 to form a second step JT2. The protective layer 21 includes a fourth opening 54 that exposes the top of the first color emitting portion 12A1 in the first step JT1, a fifth opening 55 that exposes the top of the second color emitting portion 16A2 in the second step JT2, and a sixth opening 56 that exposes the top of the third color emitting portion 20A3. The common electrode 22 is connected to the first color emitting portion 12A1, the second color emitting portion 16A2, and the third color emitting portion 20A3 through the fourth opening 54, the fifth opening 55, and the sixth opening 56, respectively.
[0102] Specifically, the first color light-emitting part 12A1 and the film structure above it form a first step JT1, and the second color light-emitting part 16A2 and the film structure above it form a second step JT2. The common electrode 22 covers the fifth pad 20B5, the sixth pad 20B6, the third color light-emitting part 20A3, the first step JT1 and the second step JT2.
[0103] Example 3
[0104] This embodiment provides a method for manufacturing the display panel 100 according to any one of the above embodiments.
[0105] Please refer to Figure 5-8 , Figures 9-11 , Figure 5 This is a schematic diagram of the first intermediate process of a method for manufacturing a display panel according to Embodiments 3 / 4 of this application; Figure 6This is a schematic diagram of the second intermediate process of a method for manufacturing a display panel according to Embodiments 3 / 4 of this application; Figure 7 A schematic diagram of the third intermediate process of a method for manufacturing a display panel according to Embodiments 3 / 4 of this application; Figure 8 A schematic diagram of the fourth intermediate process of a method for manufacturing a display panel according to Embodiments 3 / 4 of this application; Figure 9 This is a schematic diagram of the fifth intermediate process of a method for manufacturing a display panel according to Embodiment 3 of this application; Figure 10 This is a schematic diagram of the sixth intermediate process of a method for manufacturing a display panel according to Embodiment 3 of this application; Figure 11 This is a schematic diagram of the seventh intermediate process of a method for manufacturing a display panel according to Embodiment 3 of this application. Figure 6 Figure a illustrates the process of forming a first light-emitting stacked layer 12 on a substrate, and forming a portion of a first through-hole 31 and a portion of a second through-hole 32 (first sub-through-hole 321) on the first light-emitting stacked layer 12. Figure 6 Figure b illustrates the process of forming a second light-emitting stacked layer 16 on the backplane of an epitaxial substrate, and forming a portion of a first via 31 and a portion of a second via 32 (first sub-via 321) on the second light-emitting stacked layer 16.
[0106] S100, First step: Deposit a bonding metal layer on the surface of substrate 10, form a first light-emitting stacked layer 12 on the epitaxial substrate backplane, deposit a bonding metal layer on the surface of the first light-emitting stacked layer 12, and bond the bonding metal layer on the first light-emitting stacked layer 12 and the bonding metal layer on the substrate 10 together by full-surface metal bonding to obtain a first conductive layer 11. Transfer the first light-emitting stacked layer 12 from the epitaxial substrate backplane to the substrate 10, and then remove the epitaxial substrate backplane to obtain the following... Figure 5 The structure shown.
[0107] S200, Step 2, as follows Figure 6 As shown in Figure a, a transparent bonding layer (a sublayer of the first bonding layer 13) is deposited on the already bonded first light-emitting stacked layer 12; as... Figure 6 As shown in Figure b, a second light-emitting stacked layer 16 is formed on the epitaxial substrate backplane. A conductive layer (second conductive layer 15), a second color filter layer 14G, and a transparent bonding layer (a sublayer of the first bonding layer 13) are deposited on the second light-emitting stacked layer 16. Through-holes are etched on the first light-emitting stacked layer 12 and the second light-emitting stacked layer 16 (partial portions of the first through-hole 31 and the second through-hole 32 (or the first sub-through-hole 321) are etched, and conductive metal is filled into the through-holes. The metal in other areas except for the through-holes is removed by grinding. The first light-emitting stacked layer 12 and the second light-emitting stacked layer 16 are bonded together by alignment dielectric bonding. Finally, the epitaxial substrate backplane of the second light-emitting stacked layer 16 is peeled off to obtain the result shown in Figure b. Figure 7The structure shown.
[0108] S300, third step: Deposit a transparent bonding layer on the surface of the completed second light-emitting stacked layer 16; form a third light-emitting stacked layer 20 on the epitaxial substrate backplane; deposit a conductive layer, a third color filter layer 18B, and a transparent bonding layer on the third light-emitting stacked layer 20; etch vias (partial portions of the second via 32 or the second sub-via 322) on the second light-emitting stacked layer 16 and the third light-emitting stacked layer 20 respectively; fill the vias with conductive metal; grind away the metal in areas other than the vias; bond the second light-emitting stacked layer 16 and the third light-emitting stacked layer 20 together using alignment dielectric bonding; finally, peel off and remove the epitaxial substrate backplane of the third light-emitting stacked layer 20 to obtain... Figure 8 The structure shown.
[0109] S400, fourth step: The vertically bonded multilayer LED epitaxial layer is patterned into a single LED pixel unit using a patterning etching process. Specifically, the entire pixel area of the second light-emitting stack 16 and the third light-emitting stack 20 on top of the first color light-emitting part 12A1 is etched away, with the etching stopping at the surface of the second epitaxial layer 123 of the first color light-emitting part 12A1. The entire pixel area of the third light-emitting stack 20 on top of the second color light-emitting part 16A2 is etched away, with the etching stopping at the surface of the fourth epitaxial layer 163 of the second color light-emitting part 16A2. The third color light-emitting part 20A3 does not need to be etched, resulting in... Figure 9 The structure shown.
[0110] S500, fifth step: The epitaxial etching between the three types of pixels—the first color light-emitting part 12A1, the second color light-emitting part 16A2, and the third color light-emitting part 20A3—is removed to form independent pixel units, resulting in... Figure 10 The structure shown is as follows: the first sub-insulating layer (e.g., dielectric protective layer, ALD) is deposited on the sidewall of the patterned LED pixel unit after etching. The bonding metal layer (first conductive layer 11) between the LED pixel units is etched away by ion beam etching (IBE) to form independent channels.
[0111] S600, Step 6: Fill the bonding metal etching channel with a second sub-insulating layer (e.g., a dielectric protective layer). The first and second sub-insulating layers form a protective layer 21. The protective layer 21 above the first color light-emitting part 12A1, the second color light-emitting part 16A2, and the third color light-emitting part 20A3 is etched away to obtain the first opening 51, the second opening 52, and the third opening 53, respectively. Figure 11 The structure shown.
[0112] S700, Step 7: A common electrode 22 is deposited over the first color light-emitting part 12A1, the second color light-emitting part 16A2, and the third color light-emitting part 20A3. Areas where the common electrode 22 is not needed are etched away, causing the common electrodes of the first color light-emitting part 12A1, the second color light-emitting part 16A2, and the third color light-emitting part 20A3 to be interconnected and conductive, resulting in... Figure 1 Or the display panel 100 with the structure shown in Figure 2.
[0113] Example 4
[0114] This embodiment provides a method for manufacturing the display panel 100 according to any one of the above embodiments 2.
[0115] Please refer to Figure 5-8 , Figures 12-13 , Figure 5 This is a schematic diagram of the first intermediate process of a method for manufacturing a display panel according to Embodiments 3 / 4 of this application; Figure 6 This is a schematic diagram of the second intermediate process of a method for manufacturing a display panel according to Embodiments 3 / 4 of this application; Figure 7 A schematic diagram of the third intermediate process of a method for manufacturing a display panel according to Embodiments 3 / 4 of this application; Figure 8 A schematic diagram of the fourth intermediate process of a method for manufacturing a display panel according to Embodiments 3 / 4 of this application; Figure 12 This is a schematic diagram of the fifth intermediate process of a method for manufacturing a display panel according to Embodiment 4 of this application; Figure 13 This is a schematic diagram of the sixth intermediate process of a method for manufacturing a display panel according to Embodiment 4 of this application.
[0116] S10, the first step, is the same as step S100 in Example 3.
[0117] S20, the second step, is the same as step S200 in Example 3.
[0118] S30, the third step, is the same as step S300 in Example 3.
[0119] S40, fourth step: pattern the vertically bonded multilayer LED epitaxial layer into a single LED pixel unit through a patterning etching process. Specifically, the channel between the pixels is etched to the position of the bottom bonding metal layer. The etching of the first color light-emitting part 12A1 is stopped on the surface of the second epitaxial layer 123 and the surface of the sixth epitaxial layer 203 of the first color light-emitting part 12A1 to form the first step JT1; the etching of the second color light-emitting part 16A2 is stopped on the surface of the fourth epitaxial layer 163 and the surface of the sixth epitaxial layer 203 of the second color light-emitting part 16A2 to form the second step JT2. The B pixel unit does not need to be etched.
[0120] S50, fifth step: Etch the sidewalls of the patterned LED pixel units to deposit the first sub-insulating layer (e.g., dielectric protective layer, ALD). Then, remove the bonding metal layer (first conductive layer 11) between the LED pixel units using ion beam etching (IBE) to form independent channels, as shown in the structure. Figure 12 The structure shown.
[0121] S60, sixth step, fill the bonding metal etching channel with a second sub-insulating layer (e.g., a dielectric protective layer). The first and second sub-insulating layers form a protective layer 21. The protective layer 21 above the first color light-emitting part 12A1, the second color light-emitting part 16A2, and the third color light-emitting part 20A3 is etched away to obtain a fourth opening 54, a fifth opening 55, and a sixth opening 56, as shown below. Figure 13 The structure shown.
[0122] S70, Step 7: Deposit a common electrode 22 over the fifth pad layer 20B5, the fifth pad layer 20B6, and the third color light-emitting part 20A3, and etch away the areas where the common electrode 22 is not needed, so that the common electrodes of the first color light-emitting part 12A1, the second color light-emitting part 16A2, and the third color light-emitting part 20A3 are interconnected and conductive, resulting in... Figure 3 Or the display panel 100 with the structure shown in Figure 4.
[0123] It should be noted that this application provides a method for manufacturing a high PPI color micro LED display panel. It does not require mass transfer and integrates the R, G, and B LED epitaxial layers on a silicon-based driving substrate by vertical stacking. Then, through patterning, the vertically stacked LED epitaxial wafers are formed into a micro LED display device structure in which R, G, and B can be driven and controlled individually. This solves the problem that traditional methods cannot manufacture high PPI color micro LED displays.
[0124] It should be noted that this application uses a silicon (Si) substrate as the driving circuit. Silicon-based semiconductor technology is relatively mature, with good process stability and high yield. Integrating LEDs onto a silicon-based backplane can achieve higher pixel density and lower power consumption. By vertically stacking the R, G, and B LEDs onto the silicon-based driving backplane, a high PPI micro-color LED display can be achieved without mass transfer. Using internal vias (first via 31 and second via 32) can increase the effective light-emitting area of a single pixel and improve the brightness of the LED micro-display device. Using internal vias (first via 31 and second via 32) can improve the conductivity of the P-type electrode and reduce the conductivity resistance of the P-type electrode, thereby improving the performance and manufacturing yield of the LED micro-display device.
[0125] It should be noted that this application pertains to the technology of silicon-based LED microdisplays, capable of achieving resolutions exceeding 2000 PPI. This technology involves first fabricating a driving circuit on a silicon substrate, then vertically bonding and integrating R, G, and B LED epitaxial wafers onto a silicon backplane. The integrated LEDs are then used in a patterning process to fabricate a microdisplay. Figures 1 to 4 The image shown is a cross-sectional view of the RGB pixels of an LED microdisplay after the patterning process has been completed.
[0126] The above provides a detailed description of a display panel 100 provided in the embodiments of this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.
Claims
1. A display panel, characterized in that, include: Base; A first conductive layer is disposed on the substrate, and the first conductive layer includes a first electrode and a second electrode. A first light-emitting stack layer is disposed on the first conductive layer. The first light-emitting stack layer includes a first color light-emitting portion stacked with the first electrode and a first pad portion stacked with the second electrode. A second conductive layer is disposed on the first light-emitting stacked layer, and the second conductive layer includes a third electrode stacked with the first pad layer portion; A second light-emitting stack layer is disposed on the second conductive layer, and the second light-emitting stack layer includes a second color light-emitting part that is stacked with the third electrode; A common electrode is disposed on the second light-emitting stack layer and is electrically connected to the first color light-emitting part and the second color light-emitting part; The display panel further includes a first through hole penetrating the first pad layer and a first connecting electrode filling the first through hole, wherein the third electrode is electrically connected to the second electrode through the first connecting electrode; The first pad layer is used to support and carry the second color emitting part, and the first pad layer does not emit light.
2. The display panel as described in claim 1, characterized in that, The first conductive layer further includes a fourth electrode, the first light-emitting stacked layer further includes a second pad layer, the second conductive layer further includes a fifth electrode, the second light-emitting stacked layer further includes a third pad layer, and the display panel further includes: A third conductive layer is disposed between the second light-emitting stacked layer and the common electrode, and the third conductive layer includes a sixth electrode; A third light-emitting stack layer is disposed between the third conductive layer and the common electrode layer, and the third light-emitting stack layer includes a third color light-emitting part; The fourth electrode, the second pad layer, the fifth electrode, the third pad layer, the sixth electrode, and the third color light-emitting part are stacked, and the common electrode is also electrically connected to the third color light-emitting part; The display panel further includes a second through hole penetrating the second pad layer and the third pad layer, and a second connecting electrode filling the second through hole. The sixth electrode is electrically connected to the fourth electrode through the second connecting electrode.
3. The display panel as described in claim 2, characterized in that, The second through hole includes a first sub-through hole penetrating the second padding portion and a second sub-through hole penetrating the third padding portion. The second connecting electrode includes a first sub-connecting electrode filling the first sub-through hole and a second connecting electrode filling the second sub-through hole. The first sub-connecting electrode is connected between the fifth electrode and the fourth electrode, and the second sub-connecting electrode is connected between the sixth electrode and the fifth electrode.
4. The display panel as described in claim 2, characterized in that, Also includes: A protective layer is disposed between the first color light-emitting part, the second color light-emitting part, the third color light-emitting part and the common electrode. The protective layer includes a first opening exposing the top of the first color light-emitting part, a second opening exposing the top of the second color light-emitting part and a third opening exposing the top of the third color light-emitting part. The common electrode is connected to the first color light-emitting part, the second color light-emitting part, and the third color light-emitting part through the first opening, the second opening, and the third opening, respectively.
5. The display panel as described in claim 2, characterized in that, The second conductive layer further includes a seventh electrode, the second light-emitting stack layer further includes a fourth pad layer, the third conductive layer further includes an eighth electrode and a ninth electrode, and the third light-emitting stack layer further includes a fifth pad layer and a sixth pad layer; The seventh electrode, the fourth pad layer, the eighth electrode, and the fifth pad layer are stacked with the first color light-emitting part, and the ninth electrode and the sixth pad layer are stacked with the second color light-emitting part; The common electrode covers the fifth pad layer, the sixth pad layer, and the third color light-emitting part.
6. The display panel as described in claim 5, characterized in that, The display panel further includes a protective layer disposed between the fifth pad layer, the sixth pad layer, the third color light-emitting part, and the common electrode; On the plane of the display panel, one end of the first color light-emitting part extends out relative to the seventh electrode to form a first step, and one end of the second color light-emitting part extends out relative to the ninth electrode to form a second step; The protective layer includes a fourth opening at the top of the first color light-emitting part exposed on the first step, a fifth opening at the top of the second color light-emitting part exposed on the second step, and a sixth opening at the top of the third color light-emitting part exposed. The common electrode is connected to the first color light-emitting part, the second color light-emitting part, and the third color light-emitting part through the fourth opening, the fifth opening, and the sixth opening, respectively.
7. The display panel as described in any one of claims 2 to 6, characterized in that, The film structure of the first light-emitting stacked layer includes a first epitaxial layer, a first light-emitting layer and a second epitaxial layer sequentially stacked on the first conductive layer; The film structure of the second light-emitting stacked layer includes a third epitaxial layer, a second light-emitting layer, and a fourth epitaxial layer sequentially stacked on the second conductive layer; The film structure of the third light-emitting stacked layer includes a fifth epitaxial layer, a third light-emitting stacked layer, and a sixth epitaxial layer sequentially stacked on the third conductive layer.
8. The display panel as described in claim 7, characterized in that, Also includes: A second color filter layer is disposed between the first light-emitting stacked layer and the second conductive layer; A first bonding layer is disposed between the first light-emitting stacked layer and the second color filter layer; A third color filter layer is disposed between the second light-emitting stacked layer and the third conductive layer; The second bonding layer is disposed between the second light-emitting stacked layer and the third color filter layer; The second color filter layer and the first bonding layer have the same pattern as the second light-emitting stacked layer, and the third color filter layer and the second bonding layer have the same pattern as the third light-emitting stacked layer.
9. The display panel as described in claim 2, characterized in that, The light emitted by the first color light-emitting part, the second color light-emitting part, and the third color light-emitting part is all emitted to the side of the common electrode away from the substrate.
10. The display panel as claimed in claim 9, characterized in that, The first color light-emitting part emits red light, the second color light-emitting part emits green light, and the third color light-emitting part emits blue light.
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