Display panel, preparation method thereof and display module

Abstract

The invention provides a display panel, a preparation method thereof and a display module, and relates to the technical field of display. The display panel comprises a display area, an open hole and a surrounding area arranged between the display area and the open hole, the display panel further comprises a substrate, a light-emitting structure layer, a first inorganic packaging layer and a second inorganic packaging layer, the substrate is located in the display area and the surrounding area, and the substrate comprises an inorganic layer; the light-emitting structure layer is arranged on the substrate and located in the display area. The first inorganic packaging layer is arranged on the side, away from the substrate, of the light-emitting structure layer and located in the display area; the second inorganic packaging layer is arranged on the side, away from the substrate, of the first inorganic packaging layer and located in the display area and the surrounding area, and the second inorganic packaging layer makes contact with the inorganic layer. According to the display panel, the surrounding area is arranged between the open hole and the display area, and the light-emitting structure layer of the surrounding area is omitted, so that the problems of poor display and the like caused by external water and oxygen entering the display area through the light-emitting structure layer are avoided.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a preparation method thereof, and a display module. Background Art

[0002] With the advancement of terminal display technology such as mobile phones, organic light emitting diode (OLED) display has gradually become mainstream. When OLED display panels are used in mobile terminal products, it is necessary to open mounting holes in the display area to reserve hardware installation locations such as the front camera, receiver or Home button on the mobile terminal device.

[0003] However, the sealing effect of the mounting holes of the existing display panels is poor. Summary of the invention

[0004] In view of this, the embodiments of the present application provide a display panel and a method for manufacturing the same, and a display module to solve the problem of poor sealing effect of the mounting holes of the existing display panels.

[0005] In a first aspect, the present application provides a display panel, comprising a display area, an opening, and a surrounding area arranged in sequence between the display area and the opening. The display panel also includes a substrate, a light-emitting structure layer, a first inorganic encapsulation layer, and a second inorganic encapsulation layer. The substrate is located in the display area and the surrounding area, and the substrate includes an inorganic layer; the light-emitting structure layer is arranged on the substrate and is located in the display area; the first inorganic encapsulation layer is arranged on a side of the light-emitting structure layer away from the substrate and is located in the display area; the second inorganic encapsulation layer is arranged on a side of the first inorganic encapsulation layer away from the substrate and is located in the display area and the surrounding area, and the second inorganic encapsulation layer is in contact with the inorganic layer.

[0006] In one embodiment, the surrounding area includes an encapsulation area and a crack area, and the crack area is located between the opening and the encapsulation area; the display panel also includes an organic encapsulation layer, and the organic encapsulation layer is located between the first inorganic encapsulation layer and the second inorganic encapsulation layer and in the crack area; preferably, the substrate located in the crack area has a plurality of grooves arranged at intervals, and the organic encapsulation layer is filled in the grooves; preferably, in a direction perpendicular to the display panel, the height of the organic encapsulation layer is less than or equal to the depth of the grooves; preferably, the second inorganic encapsulation layer located in the encapsulation area is in contact with the inorganic layer.

[0007] In one embodiment, the outer sidewall of the fracture zone includes a cutting edge.

[0008] In one embodiment, the surrounding area further includes a cutting area, and the cutting area is located between the crack area and the opening.

[0009] In one embodiment, the display panel further includes a dam area, the dam area is located between the display area and the surrounding area, and the light emitting structure layer, the first inorganic encapsulation layer and the second inorganic encapsulation layer all cover the dam area.

[0010] In one embodiment, the substrate further includes a substrate and an insulating layer stacked in sequence, and the inorganic layer is located on the insulating layer; preferably, the surrounding area includes a crack area, and the substrate located in the crack area has a plurality of spaced grooves, and the bottom walls of the grooves are located on the substrate; preferably, the insulating layer includes a buffer layer, a gate insulating layer and a capacitor insulating layer stacked in sequence; preferably, the inorganic layer is an interlayer dielectric layer.

[0011] The second aspect of the present application provides a method for preparing a display module, wherein the display panel includes a display area, an opening, and a surrounding area arranged in sequence between the display area and the opening. The method includes: preparing a light-emitting structure layer and a first inorganic encapsulation layer on a substrate and patterning the light-emitting structure layer and the first inorganic encapsulation layer so that the light-emitting structure layer and the first inorganic encapsulation layer are located in the display area; preparing a second inorganic encapsulation layer on the first inorganic encapsulation layer, the second inorganic encapsulation layer being located in the display area and the surrounding area and in contact with the inorganic layer of the substrate.

[0012] In one embodiment, the surrounding area includes a crack area. After preparing a light-emitting structure layer and a first inorganic encapsulation layer on the substrate and patterning the light-emitting structure layer and the first inorganic encapsulation layer, before preparing a second inorganic encapsulation layer on the first inorganic encapsulation layer, the method further includes: filling the crack area with an organic encapsulation layer; preferably, the surrounding area also includes an encapsulation area, and the encapsulation area is located on a side of the crack area away from the hole; after preparing a light-emitting structure layer and a first inorganic encapsulation layer on the substrate and patterning the light-emitting structure layer and the first inorganic encapsulation layer, before preparing a second inorganic encapsulation layer on the first inorganic encapsulation layer, the method further includes: plasma treating a side of the substrate in the encapsulation area facing the second inorganic encapsulation layer.

[0013] In one embodiment, patterning the light emitting structure layer and the first inorganic encapsulation layer includes: removing the light emitting structure layer and the first inorganic encapsulation layer in the surrounding area by developing and etching.

[0014] A third aspect of the present application provides a display module, comprising the above-mentioned display panel.

[0015] According to the display panel and its preparation method and display module provided by the embodiments of the present application, by setting a surrounding area between the opening and the display area, and by omitting the light-emitting structure layer of the surrounding area, it is prevented that external water and oxygen enter the display area through the light-emitting structure layer to cause poor display and other problems. Furthermore, the second inorganic encapsulation layer in the surrounding area is in direct contact with the inorganic layer of the substrate, which can have an encapsulation effect, so there is no need to set an additional encapsulation area, thereby narrowing the surrounding area and reducing the frame of the opening. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] By describing the embodiments of the present application in more detail in conjunction with the accompanying drawings, the above and other purposes, features and advantages of the present application will become more apparent. The accompanying drawings are used to provide a further understanding of the embodiments of the present application and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation of the present application. In the accompanying drawings, the same reference numerals generally represent the same components or steps.

[0017] Figure 1 It is a top view of the display panel provided in the first embodiment of the present application.

[0018] Figure 2 yes Figure 1 The cross-sectional structure diagram of the display panel along the AA' direction is shown.

[0019] Figure 3 yes Figure 2 A schematic diagram of a partial cross-sectional structure of a display panel is shown.

[0020] Figure 4 It is a schematic diagram of a partial cross-sectional structure of a display panel provided in the second embodiment of the present application.

[0021] Figure 5 It is a schematic diagram of a partial cross-sectional structure of a display panel provided in the third embodiment of the present application.

[0022] Figure 6 yes Figure 5 The schematic diagram of the exploded cross-sectional structure of the substrate and the organic layer in the crack area of ​​the display panel is shown.

[0023] Figure 7 It is a schematic diagram of a partial cross-sectional structure of a display panel provided in the fourth embodiment of the present application.

[0024] Figure 8 It is a schematic diagram of the structure of a display device provided in one embodiment of the present application.

[0025] Fig. 9 It is a flow chart of a method for preparing a display panel provided in the first embodiment of the present application.

[0026] Fig.10 It is a flow chart of a method for preparing a display panel provided in the second embodiment of the present application.

[0027] Fig.11 This is a flow chart of a method for preparing a display panel provided in the third embodiment of the present application. DETAILED DESCRIPTION

[0028] With the advancement of terminal display technology such as mobile phones, Organic Light Emitting Diode (OLED) display has gradually become mainstream. When OLED display panels are used in mobile terminal products, it is necessary to open mounting holes in the display area to reserve hardware installation locations such as the front camera, receiver or Home button on the mobile terminal device. However, the sealing effect of the mounting holes of existing display panels is not good. In the related art, the light-emitting structure layer is usually disconnected near the mounting hole of the display panel to block external water and oxygen from entering the display area through the light-emitting structure layer. However, this structure is relatively complicated and is prone to failure of the sealing of the mounting hole due to unstable factors in the production process.

[0029] In view of this, the embodiments of the present application provide a display panel and a method for manufacturing the same, and a display module, which prevents external water and oxygen from entering the display area through the light-emitting structure layer to cause poor display and other problems by setting a surrounding area between the opening and the display area and omitting the light-emitting structure layer of the surrounding area. Furthermore, the second inorganic encapsulation layer of the surrounding area is in direct contact with the inorganic layer of the substrate, which can have an encapsulation effect, so there is no need to set an additional encapsulation area, thereby narrowing the surrounding area and reducing the frame of the opening.

[0030] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0031] In addition, in order to better illustrate the present application, numerous specific details are given in the following specific embodiments. It should be understood by those skilled in the art that the present application can also be implemented without certain specific details. In some examples, methods and means well known to those skilled in the art are not described in detail in order to highlight the subject matter of the present application.

[0032] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0033] In addition, the terms “first”, “second”, etc., if used, are merely used to distinguish between the descriptions and should not be understood as indicating or implying relative importance.

[0034] Figure 1 is a top view of a display panel provided in the first embodiment of the present application, Figure 2 yes Figure 1 The cross-sectional structure diagram of the display panel along the AA' direction is shown in FIG. Figure 3 yes Figure 2 The partial cross-sectional structure diagram of the display panel is shown in FIG. Figures 1 to 3 As shown, the display panel 100 includes a display area 101, an opening 102, and a surrounding area 103 arranged between the display area 101 and the opening 102. The opening 102 can be a photosensitive hole, a fingerprint recognition hole, etc., which is not limited in this application. The display panel 100 also includes a substrate 10, a light-emitting structure layer 20, a first inorganic encapsulation layer 30, and a second inorganic encapsulation layer 40. The substrate 10 is located in the display area 101 and the surrounding area 103. The substrate 10 includes an inorganic layer 11. The light-emitting structure layer 20 is arranged on the substrate 10 and is located in the display area 101. The first inorganic encapsulation layer 30 is arranged on the side of the light-emitting structure layer 20 away from the substrate 10 and is located in the display area 101. The second inorganic encapsulation layer 40 is arranged on the side of the first inorganic encapsulation layer 30 away from the substrate 10, and is located in the display area 101 and the surrounding area 103. The second inorganic encapsulation layer 40 is in contact with the inorganic layer 11. The display panel 100 is provided with a surrounding area 103 between the opening 102 and the display area 101, and the light emitting structure layer 20 of the surrounding area 103 is omitted, thereby preventing the external water and oxygen from entering the display area 101 through the light emitting structure layer 20 to cause poor display and other problems. Furthermore, the second inorganic encapsulation layer 40 of the surrounding area 103 is in direct contact with the inorganic layer 11 of the substrate 10, and can have an encapsulation effect, so that there is no need to set up an additional encapsulation area, thereby narrowing the surrounding area 103 and reducing the frame of the opening 102.

[0035] Optionally, in one embodiment, the substrate 10 is used to carry structures such as a display layer and an array layer in the display panel 100. The substrate 10 may be a flexible substrate. The flexible substrate may be formed of a polymer material such as polyimide (PI), polycarbonate (PC), polyethersulfone (PES), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyarylate (PAR) or fiberglass reinforced plastic (FRP). The flexible substrate may be transparent, translucent or opaque.

[0036] Furthermore, in one embodiment, the substrate 10 may have a driving circuit, which is used to drive multiple light-emitting devices 20 to emit light of corresponding colors. For example, the substrate 10 may include a substrate layer, a barrier layer (Barrier), a buffer layer (Buffer), a gate insulating layer (Gate Insulator, GI), a capacitor insulating layer (Capacitance Insulator, CI), a gate, a source and drain, an interlayer dielectric layer (Interlayer Dielectric, ILD), a planarization layer (Planarization Layer, PLN), etc.

[0037] See also Figure 4 , Figure 4 FIG. 2 is a schematic diagram of a partial cross-sectional structure of a display panel provided in the second embodiment of the present application. Figure 4 As shown, in this embodiment, the substrate 10 includes a substrate 12 and an insulating layer 13 which are stacked in sequence, and the inorganic layer 11 is located on the insulating layer 13 .

[0038] Optionally, in one embodiment, the insulating layer 13 includes a buffer layer 131 , a gate insulating layer 132 , and a capacitor insulating layer 133 which are sequentially stacked on the substrate 12 .

[0039] Optionally, in one embodiment, the inorganic layer 11 may be an interlayer dielectric layer.

[0040] See also Figures 2 to 4 In one embodiment, the display panel 100 further includes a dam area 104 , which is located between the display area 101 and the surrounding area 103 . The dam area 104 is used to prevent the organic encapsulation layer of the display area 101 from overflowing into the surrounding area 103 .

[0041] Optionally, in one embodiment, the substrate 10 further includes an organic layer 15 , and the organic layer 15 is located in the dam area 104 . The organic layer 15 is used to raise the substrate 10 to form the dam area 104 .

[0042] Optionally, in one embodiment, the organic layer 15 may be a single layer, a multi-layer, a composite layer, etc.

[0043] Optionally, in one embodiment, the organic layer 15 may be a planar layer.

[0044] Optionally, in one embodiment, the light emitting structure layer 20 includes an anode layer, a cathode layer and a light emitting unit, the anode layer is disposed on the substrate 10, and the anode layer is disposed on the side of the light emitting unit facing the substrate 10, and the anode layer can be separated by a pixel defining layer of the display panel 100. The cathode layer is disposed on the side of the light emitting unit facing away from the substrate 10, and the cathode layers can be connected as a whole so as to have an equal potential.

[0045] According to the display panel provided by the embodiment of the present application, by setting a surrounding area between the opening and the display area, and by omitting the light-emitting structure layer of the surrounding area, it is prevented that external water and oxygen enter the display area through the light-emitting structure layer to cause poor display and other problems. Furthermore, the second inorganic encapsulation layer of the surrounding area is in direct contact with the inorganic layer of the substrate, which can have an encapsulation effect, so there is no need to set up an additional encapsulation area, thereby narrowing the surrounding area and reducing the frame of the opening.

[0046] Figure 5 is a schematic diagram of a partial cross-sectional structure of a display panel provided in the third embodiment of the present application, Figure 6 yes Figure 5The schematic diagram of the exploded cross-sectional structure of the substrate and the organic layer in the crack area of ​​the display panel is shown. Figure 5 and Figure 6 As shown, Figure 5 The display panel and Figure 2 The difference of the display panel shown is that the surrounding area 103 includes a packaging area 1031 and a crack area 1032 .

[0047] Optionally, in one embodiment, the surrounding area 103 may include a packaging area 1031 and a crack area 1032, and the crack area is located between the opening 102 and the packaging area 1031. The packaging area 1031 can further block external water and oxygen from entering the display area 101 to avoid problems such as poor display of the display panel 100. The crack area 1032 can prevent cutting cracks that occur when the display panel 100 is cut from being transmitted to the display area 101.

[0048] Optionally, in one embodiment, part of the second inorganic encapsulation layer 40 contacts the inorganic layer 11 to form an encapsulation area 1031 for blocking external water and oxygen from entering the display area 101 , thereby eliminating the need for an additional encapsulation area and narrowing the surrounding area 103 .

[0049] Optionally, in one embodiment, the substrate 10 located in the crack area 1032 has a plurality of grooves 14 disposed at intervals.

[0050] Optionally, in one embodiment, the bottom wall 141 of the groove 14 is located on the substrate 12 .

[0051] Optionally, in one embodiment, the crack area 1032 includes a cutting edge L, so that there is no need to set up an additional cutting area, and the surrounding area 103 is further reduced.

[0052] Optionally, in one embodiment, the display panel 100 further includes an organic encapsulation layer 50 , and the organic encapsulation layer 50 is located between the first inorganic encapsulation layer 30 and the second inorganic encapsulation layer 40 and is located in the crack region 1032 .

[0053] Optionally, in one embodiment, the organic encapsulation layer 50 is filled in the groove 14 , which can improve the strength of the display panel 100 at the crack area 1032 , and avoid problems such as cracking caused by the crack area 1032 being too thin when the display panel 100 is cut.

[0054] Optionally, in one embodiment, in order to prevent the organic encapsulation layer 50 from overflowing, in a direction perpendicular to the display panel 100 , a height H of the organic encapsulation layer 50 is smaller than a depth D of the groove 14 .

[0055] Optionally, in one embodiment, the material of the first inorganic encapsulation layer 30 and the second inorganic encapsulation layer 40 is silicon oxide, silicon oxynitride or silicon nitride, etc. The first inorganic encapsulation layer 30 and the second inorganic encapsulation layer 40 can be a single layer, a multi-layer, a composite layer, etc.

[0056] Optionally, in one embodiment, the material of the organic encapsulation layer 50 is a fiber material, a resin material, or a material for a laminated multilayer board, etc. The organic encapsulation layer 50 can be a single layer, a multilayer, a composite layer, etc.

[0057] According to the display panel provided in the embodiment of the present application, a surrounding area is set between the opening and the display area, and the light-emitting structure layer of the surrounding area is omitted, so as to avoid the external water and oxygen from entering the display area through the light-emitting structure layer to cause poor display and other problems. Furthermore, the second inorganic encapsulation layer in the surrounding area is in direct contact with the inorganic layer of the substrate, which can have an encapsulation effect, so that there is no need to set up an additional encapsulation area, thereby narrowing the surrounding area and reducing the frame of the opening. Furthermore, the crack area can prevent the cutting cracks that appear when the display panel 100 is cut from being transmitted to the display area. Furthermore, the organic encapsulation layer is filled in the crack area, which can improve the strength of the display panel at the crack area, and avoid problems such as cracking caused by the crack area being too thin when the display panel is cut.

[0058] Figure 7 FIG. 4 is a schematic diagram of a partial cross-sectional structure of a display panel provided in the fourth embodiment of the present application. Figure 7 As shown, Figure 7 The display panel and Figure 4 The difference of the display panel shown is that the display panel further includes a cutting area.

[0059] Optionally, in one embodiment, the surrounding area 103 also includes a cutting area 1033, which is located between the crack area 1032 and the opening 102. The cutting edge L can be located in the cutting area 1033. The cutting area 1033 has a certain width, which can reduce the influence of cutting accuracy on the cutting effect, that is, the requirements for the cutting process accuracy of the display panel 100 can be reduced.

[0060] According to the display panel provided in the embodiment of the present application, a surrounding area is provided between the opening and the display area, and the light-emitting structure layer of the surrounding area is omitted, thereby preventing external water and oxygen from entering the display area through the light-emitting structure layer to cause poor display and other problems. Furthermore, the second inorganic encapsulation layer in the surrounding area is in direct contact with the inorganic layer of the substrate, which can have an encapsulation effect, so there is no need to set up an additional encapsulation area, thereby narrowing the surrounding area and reducing the frame of the opening. Furthermore, the surrounding area 103 also includes a cutting area, and the cutting area has a certain width, which can reduce the influence of cutting accuracy on the cutting effect, that is, it can reduce the requirements for the cutting process accuracy of the display panel.

[0061] An embodiment of the present application further provides a display module, which includes the display panel provided in the above embodiment. Its technical principles and effects are similar and will not be described in detail here.

[0062] An embodiment of the present application further provides a display device, Figure 8 is a schematic diagram of the structure of the display device provided in the embodiment of the present application. Figure 8 As shown, the display device 200 includes the display module provided in the above embodiment or the display panel 100 provided in the above embodiment. The display device 200 is a product with an image display function. For example, the display device can be used to display static images, such as pictures or photos. The display device can also be used to display dynamic images, such as videos.

[0063] In addition, the display device 200 may also have functions such as taking pictures, recording videos, fingerprint recognition, face recognition, etc. Accordingly, the display device 200 also includes at least one functional module for implementing the above functions, such as an under-screen camera, an under-screen fingerprint recognition sensor, etc.

[0064] The display device 200 provided according to any embodiment of the present application and the display panel 100 provided in the embodiment of the present application belong to the same inventive concept, and have corresponding film layer structures and beneficial effects. Details not fully described in the embodiment of the display device 200 can be found in the embodiment of the display panel 100, and will not be repeated here.

[0065] The present application also provides a method for preparing a display panel. Fig. 9 Flow chart of the method for manufacturing a display panel provided in the first embodiment of the present application. Fig. 9 As shown, the display panel 100 includes a display area 101, an opening 102, and a surrounding area 103 arranged between the display area 101 and the opening 102. The manufacturing method of the display panel includes:

[0066] Step S100: preparing a light emitting structure layer and a first inorganic encapsulation layer on a substrate and performing patterning on the light emitting structure layer and the first inorganic encapsulation layer.

[0067] Optionally, in one embodiment, the light emitting structure layer 20 and the first inorganic encapsulation layer 30 are prepared on the substrate 10 and patterned so that the light emitting structure layer 20 and the first inorganic encapsulation layer 30 are located in the display area 101 .

[0068] Optionally, in one embodiment, the light emitting structure layer 20 includes an anode layer, a cathode layer and a light emitting unit, the anode layer is disposed on the substrate 10, and the anode layer is disposed on the side of the light emitting unit facing the substrate 10, and the anode layer can be separated by a pixel defining layer of the display panel 100. The cathode layer is disposed on the side of the light emitting unit facing away from the substrate 10, and the cathode layers can be connected as a whole so as to have an equal potential.

[0069] Optionally, in one embodiment, the material of the first inorganic encapsulation layer 30 is silicon oxide, silicon oxynitride or silicon nitride, etc. The first inorganic encapsulation layer 30 can be a single layer, a multi-layer, a composite layer, etc.

[0070] Optionally, in one embodiment, patterning the light emitting structure layer 30 and the first inorganic encapsulation layer 40 includes: removing the light emitting structure layer 20 and the first inorganic encapsulation layer 30 in the surrounding area 103 by developing and etching.

[0071] Step S200: preparing a second inorganic encapsulation layer on the first inorganic encapsulation layer.

[0072] Optionally, in one embodiment, the second inorganic encapsulation layer 40 is located in the display area 101 and the surrounding area 103 , and the second inorganic encapsulation layer 40 is in contact with the inorganic layer 11 of the display panel 100 .

[0073] Optionally, in one embodiment, the material of the first inorganic encapsulation layer 30 is silicon oxide, silicon oxynitride or silicon nitride, etc. The first inorganic encapsulation layer 30 can be a single layer, a multi-layer, a composite layer, etc.

[0074] According to the method for preparing a display panel provided in an embodiment of the present application, a light-emitting structure layer and a first inorganic encapsulation layer are first prepared on a substrate and the light-emitting structure layer and the first inorganic encapsulation layer are patterned so that the light-emitting structure layer and the first inorganic encapsulation layer are located in the display area, and then a second inorganic encapsulation layer is prepared on the first inorganic encapsulation layer, and the second inorganic encapsulation layer is located in the display area and the surrounding area and in contact with the inorganic layer of the substrate. By omitting the light-emitting structure layer in the surrounding area, it is avoided that external water and oxygen enter the display area through the light-emitting structure layer to cause poor display and other problems. Furthermore, the second inorganic encapsulation layer in the surrounding area is in direct contact with the inorganic layer of the substrate, which can have a packaging effect, so there is no need to set up an additional packaging area, thereby narrowing the surrounding area and reducing the frame of the opening.

[0075] Fig.10 This is a flow chart of a method for manufacturing a display panel provided in the second embodiment of the present application. Fig. 9As shown, the surrounding area 103 includes a crack area 1032. After preparing a light-emitting structure layer and a first inorganic encapsulation layer on the substrate and patterning the light-emitting structure layer and the first inorganic encapsulation layer, and before preparing a second inorganic encapsulation layer on the first inorganic encapsulation layer, the method further includes: step S110: filling the crack area with an organic encapsulation layer.

[0076] Optionally, in one embodiment, the substrate 10 includes a substrate 12 and an insulating layer 13 which are stacked in sequence, and the inorganic layer 11 is located on the insulating layer 13 .

[0077] Optionally, in one embodiment, the substrate 10 located in the crack area 1032 has a plurality of grooves 14 disposed at intervals.

[0078] Optionally, in one embodiment, the bottom wall 141 of the groove 14 is located on the substrate 12 .

[0079] Optionally, in one embodiment, the organic encapsulation layer 50 is filled in the groove 14 , which can improve the strength of the display panel 100 at the crack area 1032 , and avoid problems such as cracking caused by the crack area 1032 being too thin when the display panel 100 is cut.

[0080] Optionally, in one embodiment, in order to prevent the organic encapsulation layer 50 from overflowing, in a direction perpendicular to the display panel 100 , a height H of the organic encapsulation layer 50 is smaller than a depth D of the groove 14 .

[0081] Optionally, in one embodiment, the material of the organic encapsulation layer 50 is a fiber material, a resin material, or a material for a laminated multilayer board, etc. The organic encapsulation layer 50 can be a single layer, a multilayer, a composite layer, etc.

[0082] According to the method for preparing a display panel provided in an embodiment of the present application, the organic encapsulation layer is filled in the crack area, which can improve the strength of the display panel in the crack area and avoid problems such as cracking caused by the crack area being too thin when the display panel is cut.

[0083] Fig.11 This is a flow chart of a method for manufacturing a display panel provided in the third embodiment of the present application. Fig.10 As shown, the surrounding area 103 also includes a packaging area 1031, and the packaging area 1031 is located on the side of the crack area 1032 away from the hole 102. After preparing the light-emitting structure layer and the first inorganic packaging layer on the substrate and patterning the light-emitting structure layer and the first inorganic packaging layer, before preparing the second inorganic packaging layer on the first inorganic packaging layer, the method also includes: Step S120: plasma treatment of the side of the substrate in the packaging area facing the second inorganic packaging layer.

[0084] Optionally, in one embodiment, performing plasma treatment on the side of the substrate 10 in the encapsulation area 1031 facing the second inorganic encapsulation layer 40 includes: performing plasma treatment on the side of the inorganic layer 11 in the encapsulation area 1031 facing the second inorganic encapsulation layer 40 .

[0085] Optionally, in one embodiment, the inorganic layer 11 may be an interlayer dielectric layer.

[0086] Optionally, in one embodiment, plasma treatment is performed on the side of the inorganic layer 11 of the encapsulation area 1031 facing the second inorganic encapsulation layer 40 , which can improve the adhesion between the inorganic layer 11 and the second inorganic encapsulation layer 40 and improve the encapsulation effect of the encapsulation area 1031 .

[0087] According to the method for preparing a display panel provided in an embodiment of the present application, plasma treatment is performed on the side of the substrate in the encapsulation area facing the second inorganic encapsulation layer, which can improve the adhesion between the substrate and the second inorganic encapsulation layer and improve the encapsulation effect of the encapsulation area.

[0088] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0089] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A display panel, characterized in that: The display panel comprises a display area, an opening, and a surrounding area arranged in sequence; the display panel further comprises: A substrate, located in the display area and the surrounding area, wherein the substrate includes an inorganic layer; A light emitting structure layer is disposed on the substrate and located in the display area; A first inorganic encapsulation layer is disposed on a side of the light emitting structure layer away from the substrate and located in the display area; and The second inorganic encapsulation layer is disposed on a side of the first inorganic encapsulation layer away from the substrate and is located in the display area and the surrounding area. The second inorganic encapsulation layer is in contact with the inorganic layer.

2. The display panel according to claim 1, characterized in that: The surrounding area includes a packaging area and a crack area, and the crack area is located between the opening and the packaging area; the display panel also includes an organic packaging layer, and the organic packaging layer is located between the first inorganic packaging layer and the second inorganic packaging layer and is located in the crack area; Preferably, the substrate located in the crack area has a plurality of grooves arranged at intervals, and the organic encapsulation layer is filled in the grooves; Preferably, in a direction perpendicular to the display panel, the height of the organic encapsulation layer is less than or equal to the depth of the groove; Preferably, the second inorganic encapsulation layer located in the encapsulation region is in contact with the inorganic layer.

3. The display panel according to claim 2, characterized in that: The outer sidewall of the fracture zone includes a cutting edge.

4. The display panel according to claim 2, characterized in that: The surrounding area also includes a cutting area, and the cutting area is located between the crack area and the opening.

5. The display panel according to claim 1, characterized in that: The display panel further includes a dam area, the dam area is located between the display area and the surrounding area, and the light emitting structure layer, the first inorganic encapsulation layer and the second inorganic encapsulation layer all cover the dam area.

6. The display panel according to claim 1, characterized in that: The substrate further comprises a substrate and an insulating layer stacked in sequence, and the inorganic layer is located on the insulating layer; Preferably, the surrounding area includes a crack area, the substrate located in the crack area has a plurality of grooves arranged at intervals, and the bottom walls of the grooves are located on the substrate; Preferably, the insulating layer comprises a buffer layer, a gate insulating layer and a capacitor insulating layer stacked in sequence; Preferably, the inorganic layer is an interlayer dielectric layer.

7. A method for preparing a display panel, characterized in that: The display panel comprises a display area, an opening, and a surrounding area arranged in sequence; the method comprises: Preparing a light-emitting structure layer and a first inorganic encapsulation layer on a substrate and patterning the light-emitting structure layer and the first inorganic encapsulation layer so that the light-emitting structure layer and the first inorganic encapsulation layer are located in the display area; A second inorganic encapsulation layer is prepared on the first inorganic encapsulation layer, wherein the second inorganic encapsulation layer is located in the display area and the surrounding area and contacts the inorganic layer of the substrate.

8. The preparation method according to claim 7, characterized in that: The surrounding area includes a crack area. After preparing a light emitting structure layer and a first inorganic encapsulation layer on the substrate and patterning the light emitting structure layer and the first inorganic encapsulation layer, and before preparing a second inorganic encapsulation layer on the first inorganic encapsulation layer, the method further includes: Filling the crack region with an organic encapsulation layer; Preferably, the surrounding area further includes an encapsulation area, and the encapsulation area is located on a side of the crack area away from the opening; after preparing the light-emitting structure layer and the first inorganic encapsulation layer on the substrate and patterning the light-emitting structure layer and the first inorganic encapsulation layer, and before preparing the second inorganic encapsulation layer on the first inorganic encapsulation layer, the method further includes: Plasma treatment is performed on a side of the substrate in the encapsulation area facing the second inorganic encapsulation layer.

9. The preparation method according to claim 7, characterized in that: The patterning of the light emitting structure layer and the first inorganic encapsulation layer includes: removing the light emitting structure layer and the first inorganic encapsulation layer in the surrounding area by developing and etching.

10. A display module, characterized in that: The invention comprises a display panel and the display panel according to any one of claims 1 to 6.

Images