A packaging method for laminated solar cells and applications thereof

Abstract

The application discloses a packaging method of a laminated solar cell and application. The application is characterized in that glass powder is laid around the effective area of the cell between the front plate glass and the back plate glass, laser pulse irradiation is used to make the glass powder melt and solidify to form a packaging structure with a reserved inflation hole, inert gas is filled in the inflation hole after air is extracted, secondary laser irradiation is carried out, water vapor is prevented from entering, and a completed packaging structure is formed, so that the water and oxygen blocking property is improved, optical loss is reduced, the edge dead zone area is reduced, and the stability and photoelectric conversion efficiency of the laminated cell are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of solar cell packaging, in particular to a packaging method of laminated solar cell and application. BACKGROUND

[0002] At present, in the packaging technology of laminated solar cell, organic polymer material is mainly used for packaging or inorganic thin film layer is deposited on the surface of the cell for packaging. When the organic polymer material is used for packaging, high temperature lamination, ultraviolet light and the like used in the process can damage the performance of the cell, causing optical loss. When the inorganic thin film layer is deposited on the surface of the cell for packaging, the packaging speed is slow and the cost is high. Therefore, it is necessary to propose a packaging method of laminated solar cell to reduce optical loss. SUMMARY

[0003] The present application aims to at least solve one of the technical problems in the related art to some extent.

[0004] To this end, an embodiment of the present application proposes a packaging method of laminated solar cell and application.

[0005] In a first aspect, the present application proposes a packaging method of laminated solar cell, as shown in the accompanying drawings, comprising the following steps: Figure 1

[0006] (a) laying a top cell on a front plate glass and installing bus bars on both sides of the top cell;

[0007] (b) laying a bottom cell on a back plate glass after installing bus bars on the bottom cell, and laying a glue film and a non-stick film on the surface of the bottom cell in sequence, and then removing the non-stick film after lamination;

[0008] (c) printing and laying glass powder liquid around the effective area of the top cell, the glass powder liquid being printed on the surface and both sides of the bus bar in the part with the bus bar, and being printed on the front plate glass in the part without the bus bar;

[0009] (d) leading out the bus bars of the top cell from the wiring holes of the bottom cell, then stacking the top cell and the bottom cell, reserving an inflation hole, and using laser pulse scanning;

[0010] (e) inflating inert gas through the inflation hole after pumping out air, keeping the pressure at one atmosphere, and using laser pulse scanning on the inflation hole to achieve complete sealing.

[0011] Wherein, the front plate glass is a light receiving surface, the back plate glass is a back light surface, and the effective area of the top cell refers to the power generation area.

[0012] ​Further, the printing width of the glass powder liquid is greater than the width of the bus bar, and the sum of the thickness of the bus bar and the glass powder liquid printed on the surface of the bus bar is equal to the thickness of the glass powder liquid printed on the front plate glass.

[0013] In the present application, the printing width of the glass powder liquid is greater than the width of the bus bar, so that the glass powder liquid completely covers the bus bar in the place where the bus bar is present, avoiding incomplete sealing at the bus bar and preventing water vapor from entering. The sum of the thickness of the bus bar and the glass powder liquid printed on the surface of the bus bar is equal to the thickness of the glass powder liquid printed on the front plate glass, so that the overall thickness of the glass powder remains consistent, thereby avoiding poor sealing caused by uneven thickness of the glass powder.

[0014] Further, the thickness of the glass powder liquid printed and laid is 0.7-3.2 mm. In the actual printing process, the printing thickness of the glass powder liquid is designed according to the specific working conditions.

[0015] Further, the glass powder liquid is obtained by dispersing glass powder in diethylene glycol butyl ether acetate, the median particle size of the glass powder is 10-30 μm, and the melting point of the glass powder is 400-500 ℃.

[0016] The glass powder is uniformly dispersed in diethylene glycol butyl ether acetate to form a glass powder liquid, the main component of the glass powder is silicon oxide, the median particle size of the glass powder is 10-30 μm, and the particle size of the glass powder is too large or too small, which is not conducive to packaging.

[0017] Further, the wavelength of the laser pulse is one of 355 nm, 532 nm and 1064 nm, the pulse width of the laser pulse is 10 -10 ~ 10 -15 s, the single pulse energy is 1-500 μJ, and the scanning speed is 1-500 mm / s.

[0018] Compared with continuous laser, the light-heat effect of pulsed laser is weaker, which can avoid damage to the component film layer and the welding part of the bus bar.

[0019] Further, the width of the inflation hole is 5-10 mm.

[0020] Further, the top cell is a perovskite cell, and the bottom cell is one of a crystalline silicon cell, a perovskite cell and an organic cell.

[0021] Further, the inert gas is high-purity nitrogen or argon.

[0022] Further, the wiring hole is formed in the back plate glass.

[0023] In the second aspect, the application provides an application of the packaging method of the first aspect in the packaging of a laminated solar cell.

[0024] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0025] This invention lays glass powder around the effective area of ​​the battery between the front and back glass panels. The glass powder is then melted and solidified by laser pulse irradiation to form an encapsulation structure with pre-reserved air filling holes. After evacuating the air through the air filling holes, inert gas is filled and a second laser irradiation is performed to prevent moisture from entering, thus forming a complete encapsulation structure. This improves water and oxygen barrier properties, reduces optical loss, reduces the dead area at the edges, and enhances the stability and photoelectric conversion efficiency of the stacked battery. Attached Figure Description

[0026] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments taken in conjunction with the accompanying drawings, wherein:

[0027] Figure 1 This is a flowchart of the encapsulation method for the stacked solar cell of the present invention;

[0028] Figure 2 This is a schematic diagram of the encapsulation structure of the stacked solar cell in Embodiment 1 of the present invention;

[0029] Figure 3 The efficiency decay curves of Example 1, Comparative Example 1, and Comparative Example 2 are shown below.

[0030] Explanation of reference numerals in the attached figures:

[0031] 1 Wiring hole; 21 Front panel glass, 22 Back panel glass; 3 Complete encapsulation structure; 4 Busbar; 5 Glass powder solution; 61 Top battery, 62 Bottom battery; 7 Air filling hole. Detailed Implementation

[0032] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0033] The present invention will now be described in detail with reference to specific embodiments.

[0034] Example 1

[0035] (1) As Figure 2 As shown, the top cell 61 is laid on the front glass 21. The top cell 61 is a perovskite cell with a glass size of 400mm×400mm, an effective area size of 366mm×366mm, and a band gap of about 1.65eV. Busbars 4 are welded on both sides of the cell. The width of the busbar is 3mm and the thickness is 0.5mm.

[0036] (2) The bottom cell 62 is a crystalline silicon cell composed of 4 pieces of 182perc cells. After being series-welded and having bus bars 4 welded, it is laid on the back glass 22, and a glue film and a non-stick film are laid on its surface in sequence. After being laminated in a laminator, the non-stick film is removed. The width of the bus bar is 3 mm, and the thickness is 0.5 mm.

[0037] (3) The glass powder liquid 5 is printed around the effective area of the top cell 61. In the part with the bus bar, it is printed on the surface and both sides of the bus bar. The width of the glass powder liquid at the part with the bus bar is 3.2 mm, and the thickness is 2 mm. In the part without the bus bar, it is printed on the surface of the front glass 21. The width of the glass powder liquid is 3.2 mm, and the thickness is 2.5 mm. The melting point of the glass powder is about 450℃. The median particle size of the glass powder is 15 μm. The main component of the glass powder is silicon oxide.

[0038] (4) After the bus bar of the top cell 61 is led out from the wiring hole 1 of the bottom cell 62, the top cell 61 and the bottom cell 62 are stacked. A 355 nm laser (pulse width: 10 -10 seconds; single pulse energy: 200 μJ; scanning speed: 20 mm / s) is used to scan from the left side of the reserved inflation hole 7 to the right side clockwise, so that the glass powder is melted and solidified to form a packaging structure with a reserved inflation hole. The width of the reserved inflation hole is 8 mm.

[0039] (5) After the inflation hole 7 is exhausted, high-purity nitrogen is introduced, and the pressure is kept at one atmosphere. A 355 nm laser (pulse width: 10 -10 seconds; single pulse energy: 200 μJ; scanning speed: 20 mm / s) is used to scan the inflation hole, so that the glass powder at the inflation hole is melted and solidified to form a complete packaging structure 3.

[0040] Example 2

[0041] (1) The top cell 61 is laid on the front glass 21. The top cell 61 is a perovskite cell. The glass size is 400 mm x 400 mm, and the effective area size is 366 mm x 366 mm. The band gap is about 1.65 eV. Bus bars 4 are welded on both sides of the cell. The width of the bus bar is 3 mm, and the thickness is 0.5 mm.

[0042] (2) The bottom cell 62 is a crystalline silicon cell composed of 4 pieces of 182perc cells. After being series-welded and having bus bars 4 welded, it is laid on the back glass 22, and a glue film and a non-stick film are laid on its surface in sequence. After being laminated in a laminator, the non-stick film is removed. The width of the bus bar is 3 mm, and the thickness is 0.5 mm.

[0043] (3) Print and lay the glass powder liquid 5 around the effective area of the top cell 61. In the part with the bus bar, print on the surface and both sides of the bus bar. The width of the glass powder liquid at the part with the bus bar is 3.4 mm, and the thickness is 2 mm. In the part without the bus bar, print on the surface of the front plate glass 21. The width of the glass powder liquid is 3.4 mm, and the thickness is 2.5 mm. The melting point of the glass powder is about 450°C. The median particle size of the glass powder is 15 μm. The main component of the glass powder is silicon oxide.

[0044] (4) After leading out the bus bar of the top cell 61 from the wiring hole 1 of the bottom cell 62, stack the top cell 61 and the bottom cell 62. Use the 355 nm laser (pulse width: 10 -10 seconds; single pulse energy: 200 μJ; scanning speed: 20 mm / s) to scan from the left side of the reserved inflation hole 7 to the right side clockwise to make the glass powder melt, and form the packaging structure with the reserved inflation hole after solidification. The width of the reserved inflation hole is 8 mm.

[0045] Example 3

[0046] (1) The top cell 61 is laid on the front plate glass 21. The top cell 61 is a perovskite cell. The glass size is 400 mm x 400 mm. The effective area size is 366 mm x 366 mm. The band gap is about 1.65 eV. The bus bar 4 is welded on both sides of the cell. The width of the bus bar is 3 mm, and the thickness is 0.5 mm.

[0047] (2) The bottom cell 62 is a crystalline silicon cell composed of 4 pieces of 182 perc cells. After being series-welded and welded with the bus bar 4, the bottom cell 62 is laid on the back plate glass 22. The adhesive film and the non-stick film are laid on the surface of the bottom cell 62 in sequence. After being laminated in the laminator, the non-stick film is removed. The width of the bus bar is 3 mm, and the thickness is 0.5 mm.

[0048] (3) Print and lay the glass powder liquid 5 around the effective area of the top cell 61. In the part with the bus bar, print on the surface and both sides of the bus bar. The width of the glass powder liquid at the part with the bus bar is 3.6 mm, and the thickness is 2.5 mm. In the part without the bus bar, print on the surface of the front plate glass 21. The width of the glass powder liquid is 3.6 mm, and the thickness is 3 mm. The melting point of the glass powder is about 450°C. The median particle size of the glass powder is 15 μm. The main component of the glass powder is silicon oxide.

[0049] (4) After leading out the bus bar of the top cell 61 from the wiring hole 1 of the bottom cell 62, stack the top cell 61 and the bottom cell 62. Use the 355 nm laser (pulse width: 10 -10The glass powder was melted and solidified to form an encapsulation structure with the reserved inflation hole, and the width of the reserved inflation hole was 8 mm.

[0050] Comparative Example 1

[0051] (1) The top cell was a perovskite cell, the glass size was 400 mm x 400 mm, the effective area size was 366 mm x 366 mm, the band gap was about 1.65 eV, and bus bars were welded on both sides of the cell, wherein the width of the bus bar was 3 mm and the thickness was 0.5 mm.

[0052] (2) The bottom cell was a crystalline silicon cell, which was composed of 4 pieces of 182perc cells, and was laid on the back plate glass after being series-welded and bus bars were welded, wherein the width of the bus bar was 3 mm and the thickness was 0.5 mm.

[0053] (3) After the bus bar of the top cell was led out from the wiring hole of the bottom cell, the top cell and the bottom cell were superimposed, and laminated packaging was performed.

[0054] Comparative Example 2

[0055] (1) The top cell was a perovskite cell, the glass size was 400 mm x 400 mm, the effective area size was 366 mm x 366 mm, the band gap was about 1.65 eV, and bus bars were welded on both sides of the cell, wherein the width of the bus bar was 3 mm and the thickness was 0.5 mm.

[0056] (2) The bottom cell was a crystalline silicon cell, which was composed of 4 pieces of 182perc cells, and was laid on the back plate glass after being series-welded and bus bars were welded, wherein the width of the bus bar was 3 mm and the thickness was 0.5 mm.

[0057] (3) Glass powder liquid was printed around the effective area of the top cell, wherein in the part with the bus bar, the glass powder liquid was printed on the surface and both sides of the bus bar, the width of the glass powder liquid at the part with the bus bar was 3.2 mm and the thickness was 2 mm, and in the part without the bus bar, the glass powder liquid was printed on the surface of the front plate glass, the width of the glass powder liquid was 3.2 mm and the thickness was 2.5 mm. The melting point of the glass powder was about 450 ℃, the median particle size of the glass powder was 15 μm, and the main component of the glass powder was silicon oxide.

[0058] (4) After the bus bar of the top cell was led out from the wiring hole of the bottom cell, the top cell and the bottom cell were superimposed, and 355 nm laser (pulse width: 10 -10The laser beam (wavelength: 1064 nm; pulse duration: 10 ns; pulse energy: 200 μJ; scanning speed: 20 mm / s) is scanned along the glass powder laying area in a clockwise direction for one round to form the encapsulation structure with the inflation hole reserved.

[0059] Test Example 1

[0060] The efficiency decay test of the module prepared in Example 1 and Comparative Examples 1 and 2 is carried out under the double eight five condition, and the efficiency decay curve is shown in Figure 2 .

[0061] It can be seen from Figure 2 that the efficiency retention rate of Example 1 is better than that of Comparative Examples 1 and 2, the efficiency of Example 1 decays by 3% after 1000h test; Comparative Example 1 adopts the traditional edge sealing method of adhesive film plus butyl glue, and the efficiency decays by 12% after 1000h test; Comparative Example 2 is only laser encapsulated once, and the efficiency decays by 70% after 500h test, because the water vapor enters the module, which leads to the faster efficiency decay of the module.

[0062] Test Example 2

[0063] The photoelectric conversion efficiency electrical performance test of Example 1, Comparative Example 1 and Comparative Example 2 is carried out, and the test results are shown in Table 1.

[0064]

[0065]

[0066] It can be seen from Table 1 that the photoelectric conversion efficiency of Examples 1-3 of the present application is better than that of Comparative Examples 1 and 2.

[0067] According to the above, the present application lays the glass powder around the effective area of the battery between the front plate glass and the back plate glass, melts and solidifies the glass powder by laser pulse irradiation to form the encapsulation structure with the inflation hole reserved, fills the inert gas through the inflation hole after pumping, and carries out the secondary laser irradiation to prevent the water vapor from entering, thereby forming the completed encapsulation structure, improving the water and oxygen barrier property, reducing the optical loss, reducing the edge dead zone area, and improving the stability and photoelectric conversion efficiency of the stacked battery.

[0068] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the description of the specification, the illustrative description of the above terms can be directed to different embodiments or examples. Moreover, the specific features, structures, materials or characteristics described can be combined in any suitable manner in any one or more embodiments or examples. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the specification and the features of the different embodiments or examples without contradiction.

[0069] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, for example, two, three, etc., unless otherwise specifically limited.

[0070] Although embodiments of the present application have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A packaging method of a stacked solar cell, characterized by, The method comprises the following steps: (a) laying a top cell on a front glass plate and installing bus bars on both sides of the top cell; (b) laying a bottom cell on a back glass plate after installing bus bars on the bottom cell, laying a glue film and a non-stick film on the surface of the bottom cell in sequence, and removing the non-stick film after lamination; (c) printing and laying a glass powder liquid around the effective area of the top cell, wherein the glass powder liquid is printed on the surface and both sides of the bus bar in the part with the bus bar, and is printed on the front glass plate in the part without the bus bar; (d) leading out the bus bar of the top cell from the wiring hole of the bottom cell, stacking the top cell and the bottom cell, reserving an inflation hole, and scanning by laser pulse; (e) inflating an inert gas through the inflation hole, keeping the pressure of the inert gas at one atmosphere, scanning the inflation hole by laser pulse, and achieving complete sealing.

2. The packaging method of claim 1, wherein, The printing width of the glass powder liquid is greater than the width of the bus bar, and the sum of the thickness of the bus bar and the thickness of the glass powder liquid printed on the surface of the bus bar is equal to the thickness of the glass powder liquid printed on the front glass plate.

3. The packaging method of claim 2, wherein, The thickness of the glass powder liquid printed and laid is 0.7-3.2 mm.

4. The packaging method of claim 2, wherein, The glass powder liquid is obtained by dispersing glass powder in diethylene glycol butyl ether acetate, the median particle size of the glass powder is 10-30 μm, and the melting point of the glass powder is 400-500 ℃.

5. The packaging method of claim 1, wherein, The wavelength of the laser pulse is one of 355 nm, 532 nm, and 1064 nm, the pulse width of the laser pulse is 10 -10 ~ 10 -15 s, the single pulse energy is 1 ~ 500 μJ, and the scanning speed is 1 ~ 500 mm / s.

6. The packaging method of claim 1, wherein, The width of the inflation hole is 5-10 mm.

7. The packaging method of claim 1, wherein, The top cell is a perovskite cell, and the bottom cell is one of a crystalline silicon cell, a perovskite cell, and an organic cell.

8. The packaging method of claim 1, wherein, The inert gas is high-purity nitrogen or argon.

9. The packaging method of claim 1, wherein, The wiring hole is formed on the back glass plate.

10. Application of the packaging method according to any one of claims 1-9 in laminated solar cell packaging.

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