Load sensor

Abstract

A load sensor (1) is provided with: a first base member (11); a second base member (12) that covers at least the first region (R1) of the first base member (11); a plurality of conductor wires (31) disposed so as to straddle a first region (R1) of the first base member (11) and a second region (R2) adjacent to the first region (R1); a plurality of conductive elastic bodies (13) that are disposed on at least one of the facing surfaces of the first base member (11) and the second base member (12), and each of the plurality of conductive elastic bodies (13) intersects the plurality of conductor wires (31); a dielectric disposed between the conductor wire (31) and the conductive elastic body (13); a substrate (20) provided on the first base member (11) in the second region (R2), the substrate (20) having an electrode (26) to which a plurality of conductor wires (31) are fixed by solder (40); and a structure (groove (25)) in which a first portion (P1) included in the first region (R1) and a second portion (P2) extending from the first portion (P1) to the second region (R2) of the plurality of conductor wires (31) are arranged substantially on the same plane.

Description

Technical Field

[0001] The present invention relates to a load sensor that detects a load applied from the outside based on a change in electrostatic capacitance. Background Art

[0002] Load sensors are widely used in the fields of industrial equipment, robots, and vehicles. In recent years, with the development of computer control technology and the improvement of design, the development of electronic devices that use free-form surfaces in a variety of ways, such as humanoid robots and automotive interiors, is progressing. In response, there is a demand for high-performance load sensors to be installed on each free-form surface.

[0003] The following patent document 1 describes a pressure-sensitive element (load sensor), which comprises: a sheet-like base member having an elastic conductive portion; a plurality of conductor wires, the plurality of conductor wires being arranged to cross the elastic conductive portion; a plurality of dielectrics, the plurality of dielectrics being respectively arranged between the plurality of conductor wires and the elastic conductive portion; a linear member, which sews the plurality of conductor wires to the base member; and a sheet-like member, which faces the elastic conductive portion via the conductor wires and the dielectrics.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: International Publication No. 2020 / 153029 Summary of the invention

[0007] Problem that the invention aims to solve

[0008] In the load sensor as described above, a substrate having a wiring pattern is provided on the surface of a base member having a conductive elastic portion formed thereon, and the end of a conductor wire is welded to an electrode arranged on the surface of the substrate. In this case, the conductor wire is bent by an amount corresponding to the thickness of the substrate in order to be placed on the surface of the substrate from the surface of the base member. Due to this bending, a gap is generated between the base member and the conductor wire and the sheet member near the boundary of the substrate, and the detection characteristics of the load become unstable in the area where the gap is generated. On the other hand, when this area is excluded from the effective area of ​​the load sensor, the effective area of ​​the load sensor is narrowed accordingly.

[0009] In view of such a problem, an object of the present invention is to provide a load sensor capable of suppressing the detection characteristics of a load from becoming unstable near the boundary of a substrate.

[0010] Solutions for solving problems

[0011] The main aspect of the present invention relates to a load sensor. The load sensor involved in this aspect comprises: a first base member; a second base member, which covers at least a first area of ​​the first base member; a plurality of conductor wires, which are arranged to span the first area of ​​the first base member and a second area adjacent to the first area; a plurality of conductive elastomers, which are arranged on at least one of the facing surfaces of the first base member and the second base member, and each of the plurality of conductive elastomers crosses the plurality of conductor wires; a dielectric, which is arranged between the conductor wires and the conductive elastomers; a substrate, which is arranged on the first base member in the second area, and the substrate has electrodes for fixing the plurality of conductor wires by solder; and a structure for arranging the first part of the plurality of conductor wires included in the first area and the second part extending from the first part to the second area in approximately the same plane.

[0012] According to the load sensor of this embodiment, the first portion of the plurality of conductor wires included in the first region and the second portion of the plurality of conductor wires extending from the first portion to the second region are arranged in substantially the same plane. Therefore, the plurality of conductor wires are prevented from bending up and down near the boundary between the first region and the second region, thereby preventing a gap from being generated between the first base member and the conductor wires and the second member near the boundary. Therefore, it is possible to prevent the detection characteristics of the load from becoming unstable near the boundary of the substrate.

[0013] Effects of the Invention

[0014] As described above, according to the present invention, it is possible to provide a load sensor capable of suppressing the detection characteristics of a load from becoming unstable near the boundary of a substrate.

[0015] The effects and significance of the present invention will become more apparent through the description of the following embodiments. However, the following embodiments are merely examples of implementing the present invention, and the present invention is not limited to the following embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 (a) is a plan view schematically showing the structure of a structure in the manufacturing process involved in the first embodiment. Figure 1 (b) is a plan view schematically showing the structure of the structure in the manufacturing process involved in Embodiment 1.

[0017] Figure 2 (a) is a plan view schematically showing the structure of a structure in the manufacturing process involved in the first embodiment. Figure 2 (b) is the embodiment 1 involved Figure 2 (a) is a cross-sectional view of the structure.

[0018] Figure 3 (a) is a plan view schematically showing the structure of a structure in the manufacturing process involved in the first embodiment. Figure 3 (b) is the embodiment 1 involved Figure 3 (a) is a cross-sectional view of the structure.

[0019] Figure 4 (a) is a plan view schematically showing the structure of the load sensor according to the first embodiment. Figure 4 (b) is the embodiment 1 involved Figure 4 (a) Cross-sectional view of the load sensor.

[0020] Figure 5 This is a plan view schematically showing the structure of the load sensor according to the first embodiment.

[0021] Figure 6 (a) and (b) schematically show a cross section near the intersection position when the load sensor according to the first embodiment is cut at the intersection position of the conductive elastic body and the wire.

[0022] Figure 7 (a) is a cross-sectional view showing the structure of the load sensor according to the first embodiment. Figure 7 (b) is a cross-sectional view showing the structure of a load sensor according to a comparative example.

[0023] Figure 8 (a) is a plan view schematically showing the structure of a structure in the manufacturing process involved in the second embodiment. Figure 8 (b) is the embodiment 2 involved Figure 8 (a) is a cross-sectional view of the structure.

[0024] Fig. 9 (a) is a plan view schematically showing the structure of a structure in the manufacturing process involved in the second embodiment. Fig. 9 (b) is the embodiment 2 involved Fig. 9 (a) is a cross-sectional view of the structure.

[0025] Fig.10 (a) is a plan view schematically showing the structure of the load sensor according to the second embodiment. Fig.10 (b) is the embodiment 2 involved Fig.10 (a) Cross-sectional view of the load sensor.

[0026] Fig.11 (a) is a plan view schematically showing the structure of a substrate according to the third embodiment. Fig.11 (b) is a plan view schematically showing the structure of the structure in the manufacturing process involved in the third embodiment.

[0027] Fig.12 (a) is a plan view schematically showing the structure of a structure in the manufacturing process involved in the third embodiment. Fig.12 (b) is the method according to Implementation 3 Fig.12 (a) is a cross-sectional view of the structure.

[0028] Fig.13 (a) is a plan view schematically showing the structure of a structure in the manufacturing process involved in the third embodiment. Fig.13 (b) is the method according to Implementation 3 Fig.13 (a) is a cross-sectional view of the structure.

[0029] Fig.14 (a) is a plan view schematically showing the structure of the load sensor according to the third embodiment. Fig.14 (b) is the method according to Implementation 3 Fig.14 (a) Cross-sectional view of the load sensor.

[0030] Fig.15 (a) is a plan view schematically showing the structure of a load sensor according to Modification 1 of Embodiment 3. Fig.15 (b) is the modification example 1 of implementation example 3. Fig.15 (a) Cross-sectional view of the load sensor.

[0031] Fig.16 (a) is a plan view schematically showing the structure of a load sensor according to Modification 2 of Embodiment 3. Fig.16 (b) is the modification example 2 of implementation example 3. Fig.16 (a) Cross-sectional view of the load sensor.

[0032] Fig.17 (a) is a plan view schematically showing the structure of a load sensor according to Modification 3 of Embodiment 3. Fig.17 (b) is the modification example 3 of implementation example 3. Fig.17 (a) Cross-sectional view of the load sensor.

[0033] Fig.18 It is a top view schematically showing the structure of a structure in the manufacturing process involved in the fourth embodiment.

[0034] Fig.19 (a) is a plan view schematically showing the structure of a structure in the manufacturing process involved in the fourth embodiment. Fig.19 (b) is the embodiment 4 involved Fig.19 (a) is a cross-sectional view of the structure.

[0035] Fig. 20 (a) is a plan view schematically showing the structure of a structure in the manufacturing process involved in the fourth embodiment. Fig. 20 (b) is the embodiment 4 involved Fig. 20 (a) is a cross-sectional view of the structure.

[0036] Fig.21 (a) is a plan view schematically showing the structure of the load sensor according to the fourth embodiment. Fig.21 (b) is the embodiment 4 involved Fig.21 (a) Cross-sectional view of the load sensor.

[0037] Fig. 22 (a) is a plan view schematically showing the structure of a structure in a manufacturing process according to a modification example of the fourth embodiment. Fig. 22 (b) is a modification example of implementation mode 4. Fig. 22 (a) is a cross-sectional view of the structure.

[0038] Fig.23 (a) is a plan view schematically showing the structure of a structure in a manufacturing process according to a modification example of the fourth embodiment. Fig.23 (b) is a modification example of implementation mode 4. Fig.23 (a) is a cross-sectional view of the structure.

[0039] Fig.24 (a) is a plan view schematically showing the structure of a load sensor according to a modification example of the fourth embodiment. Fig.24 (b) is a modification example of implementation mode 4. Fig.24 (a) Cross-sectional view of the load sensor.

[0040] Fig.25 (a) and (b) schematically show a cross section near the intersection position when the load sensor is cut at the intersection position of the conductive elastic body and the lead wire according to another modification example.

[0041] Fig.26 (a) is a cross-sectional view schematically showing the structure of a load sensor according to still another modification example. Fig.26 (b) is a diagram schematically showing a cross section near the intersection position when the load sensor is cut at the intersection position of the conductive elastic body and the lead wire according to still another modification example.

[0042] However, the drawings are mainly for illustration and do not limit the scope of the present invention. DETAILED DESCRIPTION

[0043] The load sensor according to the present invention can be applied to a management system that performs processing according to an applied load, or a load sensor of an electronic device.

[0044] Examples of the management system include an inventory management system, a driver monitoring system, an instruction management system, a safety management system, and a nursing / childcare management system.

[0045] In the inventory management system, for example, the load of the loaded inventory is detected by a load sensor installed in the inventory rack to detect the types and number of commodities present in the inventory rack. In this way, the inventory can be efficiently managed in stores, factories, warehouses, etc., and personnel can be saved. In addition, the load of the food in the refrigerator is detected by a load sensor installed in the refrigerator to detect the types, number and quantity of the food in the refrigerator. In this way, a menu using the food in the refrigerator can be automatically suggested.

[0046] In the driver monitoring system, for example, a load sensor provided on the steering device monitors the load distribution of the driver relative to the steering device (e.g., gripping force, gripping position, pedaling force). In addition, a load sensor provided on the vehicle seat monitors the load distribution of the driver relative to the vehicle seat when the driver is seated (e.g., center of gravity position). This can provide feedback on the driver's driving state (drowsiness, psychological state, etc.).

[0047] In the guidance management system, for example, a load sensor provided on the sole of the shoe monitors the load distribution on the sole of the foot, thereby correcting or guiding the user to an appropriate walking state or walking state.

[0048] In the safety management system, for example, load sensors installed on the floor detect the load distribution when a person passes by, and detect weight, stride, speed, shoe sole pattern, etc. Thus, the person passing by can be identified by comparing the detection information with the data.

[0049] In the nursing / childcare management system, for example, load sensors installed on bedding and toilet seats monitor the load distribution of the human body relative to the bedding and toilet seats, thereby estimating what actions the person should take in the position of the bedding and toilet seat to prevent falling.

[0050] Examples of electronic devices include in-vehicle devices (car navigation systems, audio equipment, etc.), home appliances (electric kettles, IH cooking heaters, etc.), smart phones, electronic paper, e-book readers, PC keyboards, game controllers, smart watches, wireless headphones, touch panels, electronic pens, penlights, luminous clothing, musical instruments, etc. In electronic devices, a load sensor is provided at an input portion for receiving input from a user.

[0051] The load sensor in the following embodiments is an electrostatic capacitance load sensor typically provided in the load sensor of the management system or electronic device as described above. Such a load sensor is sometimes also referred to as an "electrostatic capacitance pressure-sensitive sensor element", "capacitive pressure detection sensor element", "pressure-sensitive switch element", etc. In addition, the load sensor in the following embodiments is connected to a detection circuit, and the load sensor and the detection circuit constitute a load detection device. The following embodiment is one embodiment of the present invention, and the present invention is not limited by the following embodiment in any way.

[0052] Hereinafter, embodiments of the present invention will be described with reference to the drawings. For convenience, mutually orthogonal X, Y, and Z axes are shown in each drawing. The Z axis direction is the height direction of the load sensor 1.

[0053] <Implementation Method 1>

[0054] Figure 1 (a) is a plan view schematically showing the structure of the structure 1a during the manufacturing process.

[0055] The structure 1 a includes a second base member 12 , a plurality of conductive elastic bodies 13 , a plurality of conductors 14 , and a plurality of wirings 15 .

[0056] The second base member 12 is a flat plate-shaped member having elasticity. The second base member 12 has a rectangular shape when viewed from above. The thickness of the second base member 12 is constant. When the thickness of the second base member 12 is small, the second base member 12 is sometimes referred to as a sheet member or a film member. The second base member 12 is configured to overlap the first base member 11 described later.

[0057] The second base member 12 has insulating properties, and is made of, for example, a non-conductive resin material or a non-conductive rubber material. The resin material used for the second base member 12 is, for example, at least one resin material selected from the group consisting of styrene resins, silicone resins (such as polydimethylpolysiloxane (PDMS)), acrylic resins, rotaxane resins, and polyurethane resins. The rubber material used for the second base member 12 is, for example, at least one rubber material selected from the group consisting of silicone rubber, isoprene rubber, butadiene rubber, styrene-butadiene rubber, chloroprene rubber, nitrile rubber, polyisobutylene, ethylene-propylene rubber, chlorosulfonated polyethylene, acrylic rubber, fluororubber, epichlorohydrin rubber, polyurethane rubber, and natural rubber.

[0058] The conductive elastic body 13 has a rectangular and strip-like shape that is long in the Y-axis direction, and is arranged in the X-axis direction with a predetermined gap. That is, the long side of the conductive elastic body 13 is parallel to the Y-axis, and the arrangement direction of the conductive elastic body 13 is parallel to the X-axis. The conductive elastic body 13 is a conductive member having elasticity.

[0059] The conductors 14 are formed on the facing surface 12a (surface on the negative side of the Z axis) of the second base member 12. Here, the three conductors 14 are arranged on the facing surface 12a of the second base member 12 so as to extend in the X axis direction. The conductors 14 are made of a material having a lower resistance than the conductive elastic body 13. Here, the conductors 14 are elastic and conductive members. Wiring 15 is led out from the end of each conductor 14 on the positive side of the Y axis.

[0060] The conductive elastic body 13 is formed on the facing surface 12a of the second base member 12 in a manner covering the conductive body 14. The conductive body 14 and the conductive elastic body 13 formed in a manner covering the conductive body 14 are in an electrically connected state. The conductive body 14 is positioned at a substantially middle position in the X-axis direction of the conductive elastic body 13. Here, three conductive elastic bodies 13 are arranged on the facing surface 12a of the second base member 12. The width, length and thickness of the three conductive elastic bodies 13 are the same as each other.

[0061] The conductor 14 and the conductive elastic body 13 are formed on the facing surface 12a of the second base member 12 by a printing method such as screen printing, gravure printing, flexographic printing, offset printing, and gravure offset printing. After the conductor 14 is formed on the facing surface 12a, the conductive elastic body 13 is formed on the facing surface 12a in a manner overlapping the conductor 14. According to these printing methods, the conductor 14 and the conductive elastic body 13 can be formed on the facing surface 12a with a thickness of about 0.001 mm to 0.5 mm. However, the method for forming the conductor 14 and the conductive elastic body 13 is not limited to the printing method.

[0062] The conductive elastic body 13 and the conductor 14 are composed of a resin material and a conductive filler dispersed therein, or a rubber material and a conductive filler dispersed therein.

[0063] The resin material used for the conductive elastic body 13 and the conductive body 14 is, for example, at least one resin material selected from the group consisting of styrene resin, silicone resin (polydimethylpolysiloxane (PDMS) etc.), acrylic resin, rotaxane resin and polyurethane resin, as in the above-mentioned resin material used for the second base member 12. The rubber material used for the conductive body 14 and the conductive elastic body 13 is, for example, at least one rubber material selected from the group consisting of silicone rubber, isoprene rubber, butadiene rubber, styrene-butadiene rubber, chloroprene rubber, nitrile rubber, polyisobutylene, ethylene-propylene rubber, chlorosulfonated polyethylene, acrylic rubber, fluororubber, epichlorohydrin rubber, polyurethane rubber and natural rubber, as in the above-mentioned rubber material used for the second base member 12.

[0064] The conductive filler used for the conductive elastomer 13 and the conductor 14 is, for example, at least one material selected from the group consisting of metal materials such as Au (gold), Ag (silver), Cu (copper), C (carbon), ZnO (zinc oxide), In2O3 (indium (III) oxide) and SnO2 (tin (IV) oxide), conductive polymer materials such as PEDOT:PSS (i.e., a composite composed of poly(3,4-ethylenedioxythiophene) (PEDOT) and polystyrene sulfonic acid (PSS)), metal-coated organic fibers, metal wires (in fiber state) and other conductive fibers.

[0065] For example, the conductive filler used for the conductor 14 is Ag (silver), and the conductive filler constituting the conductive elastic body 13 is C (carbon).

[0066] Figure 1 (b) is a plan view schematically showing the structure of the structure 1b during the manufacturing process.

[0067] The structure 1 b includes a substrate 20 and a plurality of conductive wires 30 .

[0068] The substrate 20 is a printed circuit board for connecting the wiring 15 and the lead 30 to an external detection circuit. The substrate 20 has a rectangular shape that is long in the Y-axis direction. Three electrodes 21 and three electrodes 22 are formed on the surface on the positive side of the Z-axis of the substrate 20. In addition, three holes 24 arranged in the Y-axis direction are formed at the end on the negative side of the X-axis of the substrate 20, and a connector 23 is also provided.

[0069] The three electrodes 21 and the three electrodes 22 are respectively connected to the six terminals of the connector 23. As described later, the three electrodes 21 are respectively connected to the conductor wires 31 of the three lead wires 30, and the three electrodes 22 are respectively connected to the three wirings 15. The connector 23 is used to connect the conductor wires 31 of the lead wires 30 and the wirings 15 to an external detection circuit via the electrodes 21 and 22.

[0070] A plurality of conductors 30 are arranged to extend in the X-axis direction. Here, three conductors 30 are arranged. Each conductor 30 is arranged in a bent state on the fixture. The conductor 30 is composed of a conductor wire 31 and a dielectric 32 covering the surface thereof. With respect to the two ends on the negative side of the X-axis of each conductor 30, the dielectric 32 is omitted and the conductor wire 31 is exposed. As described later, the exposed portion of the conductor wire 31 of each conductor 30 overlaps the corresponding electrode 21 and is bonded to the electrode 21 by solder.

[0071] The conductor wire 31 is a member having electrical conductivity and a linear shape. The conductor wire 31 is made of, for example, a conductive metal material. In addition, the conductor wire 31 may be made of a core wire made of glass and a conductive layer formed on its surface, or may be made of a core wire made of resin and a conductive layer formed on its surface. For example, valve action metals such as aluminum (Al), titanium (Ti), tantalum (Ta), niobium (Nb), zirconium (Zr), and hafnium (Hf), tungsten (W), molybdenum (Mo), copper (Cu), nickel (Ni), silver (Ag), and gold (Au) are used as the conductor wire 31. In embodiment 1, the conductor wire 31 is made of copper. The conductor wire 31 may also be a twisted wire formed by twisting wires made of conductive metal materials.

[0072] The dielectric 32 has electrical insulation properties, and is made of, for example, a resin material, a ceramic material, a metal oxide material, etc. The dielectric 32 may be at least one resin material selected from the group consisting of polypropylene resin, polyester resin (e.g., polyethylene terephthalate resin), polyimide resin, polyphenylene sulfide resin, polyvinyl formal resin, polyurethane resin, polyamide-imide resin, polyamide resin, etc., or may be at least one metal oxide material selected from the group consisting of Al2O3 and Ta2O5, etc.

[0073] The diameter of the conductor wire 31 is, for example, 0.01 mm or more and 1.5 mm or less, or 0.05 mm or more and 0.8 mm or less. Such a structure of the conductor wire 31 is preferred from the viewpoint of the strength and resistance of the conductor wire 31. The thickness of the dielectric 32 is preferably 5 nm or more and 100 μm or less, and can be appropriately selected according to the design of the sensor sensitivity, etc.

[0074] Figure 2 (a) is a plan view schematically showing the structure of the structure 1c during the manufacturing process. Figure 2 (b) is Figure 2 (a) is a cross-sectional view of the structure 1c taken along C1-C2. Figure 2 In (a) of FIG. 1 , the structure of the back side of the second base member 12 is shown by a dotted line.

[0075] Figure 1 The structure 1a of (a) is turned over and then Figure 1 The structure 1b of (b) is covered. As a result, the surfaces of the three conductive elastic bodies 13 overlap with the conductive wires 30. Each conductive wire 30 crosses the three conductive elastic bodies 13 in a state of crossing the three conductive elastic bodies 13 in the X-axis direction.

[0076] Figure 3 (a) is shown in Figure 2 FIG. 1 (a) is a plan view of a structure 1 c in which a lead wire 30 is fixed by solder 40 and a wire 50 . Figure 3 (b) is in Figure 2 (a) The position of C1-C2 will be Figure 3 (a) is a cross-sectional view obtained by cutting the structure 1c.

[0077] exist Figure 2 In the states shown in (a) and (b), solder 40 is applied to the end of the wire 30 overlapping the electrode 21 to join the conductor wire 31 exposed at the end of the wire 30 to the electrode 21. In addition, solder 40 is applied to the wiring 15 overlapping the electrode 22 to join the wiring 15 to the electrode 22. Furthermore, in a plan view, the three wires 30 are sewn to the second base member 12 by wire 50 in the gap between the adjacent conductive elastic bodies 13 and in the area outside the conductive elastic bodies 13 at both ends. The three wires 30 can move in the X-axis direction in the state of being sewn by the wire 50, and the movement in the Y-axis direction is restricted by the wire 50. The wire 50 is composed of chemical fiber, natural fiber, or a mixed fiber thereof.

[0078] In this way, when the three wires 30 are bonded to the electrodes 21 of the substrate 20 by the solder 40, the portions of the wires 30 that are closer to the negative side of the X axis than the electrodes 21 are cut off. In addition, when the three wirings 15 are bonded to the electrodes 22 of the substrate 20 by the solder 40, the portions of the wirings 15 that are closer to the negative side of the X axis than the electrodes 22 are cut off.

[0079] Figure 4 (a) is a plan view schematically showing the structure of the load sensor 1. Figure 4 (b) is in Figure 2 (a) The position of C1-C2 will be Figure 4 (a) is a cross-sectional view of a load sensor 1 cut away.

[0080] Load sensor 1 has Figure 3 The structure 1c, the first base member 11 and the spacer 60 of (a) and (b).

[0081] The first base member 11 is a flat plate-shaped member. When viewed from above, the first base member 11 is in a rectangular shape. When viewed from above, the width of the first base member 11 in the Y-axis direction is the same as that of the second base member 12, and the width of the first base member 11 in the X-axis direction is greater than that of the second base member 12. The thickness of the first base member 11 is constant. When the thickness of the first base member 11 is small, the first base member 11 is sometimes referred to as a sheet member or a film member.

[0082] The first base member 11 has insulating properties and is made of, for example, a non-conductive resin material or a non-conductive rubber material. The first base member 11 can be made of, for example, a material that can be used for the above-mentioned second base member 12. The first base member 11 can also be made of a hard material that is not easily elastically deformed.

[0083] The first base member 11 is divided into a first region R1 and a second region R2 in the X-axis direction. That is, the first region R1 and the second region R2 are adjacent to each other in the X-axis direction. The second base member 12 overlaps the first region R1, and the substrate 20 is provided in the second region R2. In a plan view, the first region R1 is substantially the same shape and size as the second base member 12, and the second region R2 is substantially the same shape and size as the substrate 20.

[0084] The spacer 60 is a flat plate-shaped member. The spacer 60 is rectangular in plan view. The spacer 60 is provided in the first region R1 of the first base member 11. The shape and size of the spacer 60 in plan view are substantially the same as those of the first region R1. The thickness of the spacer 60 is substantially the same as that of the substrate 20 and is constant over the entire range.

[0085] The spacer 60 has insulating properties and is made of, for example, a non-conductive resin material or a non-conductive rubber material. The spacer 60 can be made of, for example, the same material as the first base member 11. The spacer 60 may also be made of a hard material that is not easily elastically deformed.

[0086] When the spacer 60 is arranged in the first region R1, the first base member 11 overlaps the first base member 11 from below (the negative side of the Z axis). Figure 3(a) and (b) of the structure 1c. Thus, the wire 30 is in contact with the upper surface (the surface on the positive side of the Z axis) of the spacer 60. Moreover, the outer periphery of the second base member 12 is connected to the first base member 11 through the wire 50. Thus, the second base member 12 is fixed to the first base member 11. Furthermore, the substrate 20 is connected to the first base member 11 through the wire 50 via the three holes 24 provided in the substrate 20. Thus, the substrate 20 is fixed to the first base member 11. In this way, as Figure 4 As shown in (a) and (b), the load sensor 1 is completed.

[0087] The load sensor 1 is used with the second base member 12 facing upward (Z-axis positive side) and the first base member 11 facing downward (Z-axis negative side). In this case, the upper surface 12b of the second base member 12 becomes the surface to which the load is applied, and the lower surface 11b of the first base member 11 is set on the installation surface.

[0088] Here, if Figure 5 As shown in FIG. 1 , the load sensor 1 includes a plurality of element portions A1 arranged in a matrix shape in a plan view. Figure 5 The load sensor 1 is formed with a total of nine element portions A1 arranged in the X-axis direction and the Y-axis direction. One element portion A1 corresponds to an area including a conductive elastic body 13 and an intersection of a conductive wire 30 disposed below the conductive elastic body 13. The area formed by these nine element portions A1 is an effective area for load detection in the load sensor 1.

[0089] The load sensor 1 is connected to the detection circuit via a cable 70 connected to the connector 23. The lower surface of the load sensor 1 (the lower surface of the first base member 11) is set on a predetermined installation surface, and when a load is applied to the upper surface of the load sensor 1 (the upper surface of the second base member 12) constituting the element portion A1, the electrostatic capacitance between the conductive elastic body 13 and the conductor wire 31 changes, and the load is detected based on the electrostatic capacitance.

[0090] Figure 6 (a) and (b) schematically show a cross section near the intersection position when the load sensor 1 is cut along a plane parallel to the YZ plane at the intersection position of the conductive elastic body 13 and the lead wire 30 .

[0091] Figure 6 (a) indicates the state where no load is applied. Figure 6 (b) shows the state where a load is applied. Figure 6 In (a) and (b), the lower surface 11b of the first base member 11 on the negative side in the Z axis is provided on the installation surface.

[0092] like Figure 6As shown in (a), when no load is applied to the upper surface 12b of the second base member 12, the force applied between the conductive elastic body 13 and the lead wire 30 is substantially zero. Figure 6 When a load is applied to the upper surface 12b of the second base member 12 as shown in (b), the conductive elastic body 13 is deformed by the conductive wire 30. At this time, the conductive elastic body 13 is deformed so as to surround the conductive wire 30 and approaches the spacer 60, thereby increasing the contact area between the conductive wire 30 and the conductive elastic body 13. As a result, the electrostatic capacitance between the conductor wire 31 and the conductive elastic body 13 changes. Then, the load is calculated by measuring the voltage reflecting the change in the electrostatic capacitance in the detection circuit.

[0093] like Figure 6 As shown in (b), when a load is applied to the upper surface 12b of the second base member 12, the second base member 12 is elastically deformed together with the conductive elastic body 13. Therefore, in order to smoothly increase the contact area by allowing the conductive elastic body 13 to elastically deform smoothly due to the load, the second base member 12 is preferably made of a soft material. For example, the second base member 12 can be made of a rubber material having an A hardness of about 30 to 90 degrees, such as silicone rubber, fluorine rubber, or EPDM rubber, or an elastic material having physical properties close to these materials.

[0094] On the other hand, when the hardness of the first base member 11 and the spacer 60 is low, the first base member 11 and the spacer 60 are elastically deformed when a load is applied, and the maximum values ​​of the elastic deformation and the contact area of ​​the conductive elastic body 13 are suppressed. As a result, the maximum value of the load detection decreases. Therefore, the first base member 11 and the spacer 60 are preferably made of a material having a higher hardness than the second base member 12. In addition, since the spacer 60 is in direct contact with the dielectric 32 of the conductor 30, the spacer 60 is preferably made of a material that is soft to a certain extent so as not to damage the dielectric 32 due to the load. For example, the spacer 60 can be made of an elastomer or polyurethane. In addition, the first base member 11 can also be made of the same material as the spacer 60.

[0095] <Effects of Implementation Method 1>

[0096] According to the first embodiment, the following effects are achieved.

[0097] like Figure 7As shown in (a), the load sensor 1 includes a spacer 60 as a structure for arranging the first portion P1 of the plurality of conductor lines 31 included in the first region R1 and the second portion P2 extending from the first portion P1 to the second region R2 in substantially the same plane, and the spacer 60 is used to make the height of the first portion P1 in the first region R1 consistent with the height of the upper surface of the substrate 20. Therefore, the first portion P1 and the second portion P2 of the plurality of conductor lines 31 are arranged in substantially the same plane. Therefore, the Figure 7 As in the comparative example (b), the plurality of conductor wires 31 are bent up and down near the boundary B0 between the first region R1 and the second region R2, thereby suppressing the generation of gaps between the first base member 11 and the conductor wires 31 and the second base member 12 near the boundary B0. Therefore, it is possible to suppress the load detection characteristics from becoming unstable near the boundary B0 of the substrate 20.

[0098] <Implementation Method 2>

[0099] In the first embodiment, the conductor wires 31 and the wirings 15 are bonded to the electrodes 21 and 22 on the upper surface of the substrate 20 by solder 40. In contrast, in the second embodiment, the conductor wires 31 and the wirings 15 are bonded to the electrodes 21 and 22 arranged on the lower surface of the substrate 20 by solder 40.

[0100] Figure 8 (a) is a plan view schematically showing the structure of the structure 1c during the manufacturing process. Figure 8 (b) is Figure 2 (a) is a C1-C2 cross-sectional view of the structure 1c.

[0101] like Figure 8 As shown in (a) and (b) of the embodiment 2, in the structure 1c of the embodiment 2, the electrodes 21 and 22 of the substrate 20 are arranged on the lower surface (the surface on the negative side of the Z axis) of the substrate 20. The position of the lower surface of the substrate 20 in the Z axis direction is substantially the same as the position of the lower surface of the conductive elastic body 13 in the Z axis direction. The structures of the second base member 12, the conductive elastic body 13, and the conductor 14 are the same as those of the above-mentioned embodiment 1.

[0102] Fig. 9 (a) is shown in Figure 8 FIG. 1 (a) is a plan view of a structure 1 c in which a lead wire 30 is fixed by solder 40 and a wire 50 . Fig. 9 (b) is in Figure 8 (a) The position of C1-C2 will be Fig. 9 (a) is a cross-sectional view obtained by cutting the structure 1c.

[0103] like Fig. 9As shown in (a) and (b), in the structure 1c of the second embodiment, the electrodes 21 and 22 are arranged on the lower surface of the substrate 20, so the plurality of conductor wires 31 and the plurality of wirings 15 are bonded to the electrodes 21 and 22 on the lower surface side of the substrate 20 by the solder 40. The structure of connecting the plurality of conductor wires 30 to the second base member 12 by the wire 50 is the same as that of the first embodiment. The portion of the conductor wire 30 on the negative side of the X axis than the electrode 21 and the portion of the wiring 15 on the negative side of the X axis than the electrode 22 are cut off in the same manner as in the first embodiment.

[0104] Fig.10 (a) is a plan view schematically showing the structure of the load sensor 1 according to the second embodiment. Fig.10 (b) is in Figure 8 (a) The position of C1-C2 will be Fig.10 (a) is a cross-sectional view of a load sensor 1 cut away.

[0105] Load sensor 1 has Fig. 9 The structure 1c, the first base member 11 and the spacers 61 and 62 of (a) and (b).

[0106] The first base member 11 has the same structure as that of the first embodiment. The spacers 61 and 62 are used to fill the gap between the lower surface of the substrate 20 and the upper surface of the first base member 11 due to the solder 40 that joins the second portion P2 of the wire 30 to the electrode 21, and to arrange the first portion P1 and the second portion P2 in substantially the same plane. The thickness of the spacer 62 is the same as or greater than the maximum thickness of the solder 40. The thickness of the spacer 61 is smaller than the thickness of the spacer 62 by an amount corresponding to the diameter of the wire 30.

[0107] The shape of the spacers 61 and 62 when viewed from above is rectangular. The width of the spacers 61 and 62 in the Y-axis direction is substantially the same as the width of the first base member 11 in the Y-axis direction. The width of the spacer 61 in the X-axis direction is the same as or slightly smaller than the width from the edge of the first base member 11 on the positive side of the X-axis to the edge of the electrode 21 on the positive side of the X-axis. The width of the spacer 62 in the X-axis direction is the same as or slightly smaller than the width from the edge of the first base member 11 on the negative side of the X-axis to the edge of the electrode 21 on the negative side of the X-axis. The spacers 61 and 62 can be made of the same material as the spacer 60 of the first embodiment.

[0108] Fig. 9 The structures 1c of (a) and (b) and the first base member 11 are joined by the wire 50 in the same manner as in the first embodiment. Thus, the load sensor 1 is completed.

[0109] <Effects of Implementation Method 2>

[0110] According to the second embodiment, the following effects are achieved.

[0111] like Fig.10 As shown in (a) and (b) of FIG. 1 , the load sensor 1 includes spacers 61 and 62 as a structure for arranging the first portion P1 of the plurality of conductor wires 31, which is included in the first region R1, and the second portion P2 extending from the first portion P1 to the second region R2, in approximately the same plane. The spacers 61 and 62 fill the gap between the lower surface of the substrate 20 and the upper surface of the first base member 11 caused by the solder 40 that joins the second portion P2 to the electrode 21, and arrange the first portion P1 and the second portion P2 in approximately the same plane. As a result, the first portion P1 and the second portion P2 of the plurality of conductor wires 31 are arranged in approximately the same plane. Therefore, the structure suppresses the Figure 7 As in the comparative example (b), the plurality of conductor wires 31 are bent up and down near the boundary B0 between the first region R1 and the second region R2, thereby suppressing the generation of gaps between the first base member 11 and the conductor wires 31 and the second base member 12 near the boundary B0. Therefore, it is possible to suppress the load detection characteristics from becoming unstable near the boundary B0 of the substrate 20.

[0112] In the above-mentioned first and second embodiments, the spacers 60, 61, 62 are provided on the first base member 11 by the thread 50. However, when the first base member 11 is made of a hard material that is difficult for a suture needle to penetrate, a hole for the suture needle to pass through is formed in advance in the first base member 11. In addition, the method of providing the spacers 60, 61, 62 on the first base member 11 is not limited to the method of sewing by the thread 50. For example, the spacers 60, 61, 62 may be provided on the upper surface of the first base member 11 by an adhesive.

[0113] In the above-described first and second embodiments, the spacers 60 , 61 , 62 are prepared separately from the first base member 11 , but the spacer 60 or the spacers 61 , 62 may be formed integrally with the first base member 11 .

[0114] <Implementation Method 3>

[0115] In the first and second embodiments, the structure for arranging the first portion P1 and the second portion P2 of the plurality of conductor wires 31 on substantially the same plane is the spacers 60 , 61 , 62 , but in the third embodiment, the structure is the groove formed in the substrate 20 .

[0116] Fig.11 (a) is a plan view showing the structure of the substrate 20 according to the third embodiment.

[0117] A plurality of grooves 25 extending from the boundary on the positive side of the X-axis to the inner side (negative direction of the X-axis) are formed on the substrate 20. The plurality of grooves 25 each have a rectangular shape and penetrate the substrate 20 along the Z-axis direction. An electrode 26 is arranged on the inner side of each groove 25. The two grooves 25 on the positive side of the Y-axis are electrically connected in the substrate 20 and connected to the corresponding terminals of the connector 23. The two central grooves 25 are electrically connected in the substrate 20 and connected to the corresponding terminals of the connector 23. The two grooves 25 on the negative side of the Y-axis are electrically connected in the substrate 20 and connected to the corresponding terminals of the connector 23. The other structures of the substrate 20 are the same as those in the above-mentioned embodiment 1.

[0118] Fig.11 (b) is a plan view schematically showing the structure of the structure 1b during the manufacturing process.

[0119] The three lead wires 30 are disposed on the upper surface of the substrate 20 in a state of being bent by a jig. The conductor wires 31 of the three lead wires 30 are disposed in the grooves 25, respectively.

[0120] Fig.12 (a) is a plan view schematically showing the structure of the structure 1c during the manufacturing process. Fig.12 (b) is Fig.12 (a) is a C1-C2 cross-sectional view of the structure 1c.

[0121] Implementation 1 Figure 1 The structure 1a of (a) is turned over and then Fig.11 The structure 1b of (b) is covered. As a result, the surfaces of the three conductive elastic bodies 13 overlap with the conductive wires 30. Each conductive wire 30 crosses the three conductive elastic bodies 13 in a state of crossing the three conductive elastic bodies 13 in the X-axis direction.

[0122] like Fig.12 As shown in (b), the plurality of conductors 30 are bent upwards in the grooves 25 and are placed on the upper surface of the substrate 20. This state has been shown in FIG. Fig.11 In the structure 1b of (b), a plurality of wires 30 are led to the upper surface of the substrate 20 by using a clamp. Figure 1 The structure 1a of (a) is turned over and overlapped with the structure 1b to form Fig.12 Structure 1c of (b).

[0123] Fig.13 (a) is shown in Fig.12 FIG. 1 (a) is a plan view of a structure 1 c in which a lead wire 30 is fixed by solder 40 and a wire 50 . Fig.13 (b) is in Fig.12 (a) The position of C1-C2 will be Fig.13(a) is a cross-sectional view obtained by cutting the structure 1c.

[0124] exist Fig.12 In the state shown in (a) and (b) of the embodiment, solder 40 is applied to each of the plurality of grooves 25. Thus, the conductor wire 31 of the lead wire 30 contained in the groove 25 is joined to the electrode 26 arranged on the inner side surface of the groove 25 by the solder 40. In addition, similarly to the above-mentioned embodiment 1, the wiring 15 is joined to the electrode 22 by the solder 40. And, similarly to the above-mentioned embodiment 1, the three lead wires 30 are sewn to the second base member 12 by the thread 50.

[0125] In this way, the portions of the wires 30 on the negative side of the X axis from the electrodes 26 are cut off while the three wires 30 are bonded to the electrodes 26 of the substrate 20 by the solder 40. Also, the portions of the three wirings 15 on the negative side of the X axis from the electrodes 22 are cut off.

[0126] Fig.14 (a) is a plan view schematically showing the structure of the load sensor 1. Fig.14 (b) is in Fig.12 (a) The position of C1-C2 will be Fig.14 (a) is a cross-sectional view of a load sensor 1 cut away.

[0127] Load sensor 1 has Fig.13 The structure 1c of (a) and (b) and the first base member 11. The first base member 11 has the same structure as that of the first embodiment. The first base member 11 is overlapped with the base member 1c from below (Z-axis negative side). Fig.13 The structure 1c of (a) and (b). Moreover, the outer periphery of the second base member 12 is connected to the first base member 11 by the wire 50. Thus, the second base member 12 is fixed to the first base member 11. Furthermore, the substrate 20 is connected to the first base member 11 by the wire 50 via the three holes 24 provided in the substrate 20. Thus, the substrate 20 is fixed to the first base member 11. In this way, Fig.14 As shown in (a) and (b), the load sensor 1 is completed.

[0128] like Fig.14 As shown in (b), in the completed state of the load sensor 1, the electrode 26, the solder 40, and the conductor wire 31 joined to the electrode 26 in the groove 25 are arranged within the range of the thickness T1 of the substrate 20. In addition, the height of the upper surface of the substrate 20 is substantially the same as the height of the upper surface of the second base member 12. According to such a structure, a compact load sensor 1 can be realized.

[0129] <Effects of Implementation Method 3>

[0130] like Fig.14As shown in (a) and (b), the load sensor 1 has a plurality of grooves 25 as a structure for arranging the first portion P1 of the plurality of conductor lines 31 included in the first region R1 and the second portion P2 extending from the first portion P1 to the second region R2 in approximately the same plane. The plurality of grooves 25 are formed on the substrate 20 in a manner extending inward (in the negative direction of the X-axis) from the boundary on the first region R1 side of the substrate 20, and are used to respectively arrange the second portions P2 of the plurality of conductor lines 31. As a result, the first portion P1 and the second portion P2 near the boundary B0 are arranged in approximately the same plane. Therefore, the Figure 7 As in the comparative example (b), the plurality of conductor wires 31 are bent up and down near the boundary B0 between the first region R1 and the second region R2, thereby suppressing the generation of gaps between the first base member 11 and the conductor wires 31 and the second base member 12 near the boundary B0. Therefore, it is possible to suppress the load detection characteristics from becoming unstable near the boundary B0 of the substrate 20.

[0131] Furthermore, according to the structure of the third embodiment, unlike the first and second embodiments, it is not necessary to use a spacer, but the first portion P1 and the second portion P2 of the plurality of conductor wires 31 can be arranged on a substantially same plane by a simple structure of forming the groove 25 in the substrate 20. Therefore, the structure of the load sensor 1 can be simplified.

[0132] like Fig.14 As shown in (a) and (b) of FIG. 1 , electrodes 26 are arranged around each groove 25, and the conductor wire 31 is joined to the electrode 26 by solder 40 while being accommodated in the groove 25. More specifically, the electrode 26 is arranged on the inner side surface of each groove 25, and solder 40 is applied to the groove 25 while the conductor wire 31 is accommodated in the groove 25, so that the conductor wire 31 is joined to the electrode 26 by solder. According to this structure, since the conductor wire 31 is accommodated in the groove 25, the load sensor 1 can be made thinner than when the conductor wire 31 is led to the upper surface of the substrate 20 and fixed by solder. In addition, the conductor wire 31 can be electrically joined to the electrode 26 by a simple process of applying solder 40 to the groove 25 while the conductor wire 31 is accommodated in the groove 25.

[0133] In addition, in the above structure, the electrode 26 is arranged on the inner side surface of the groove 25, but the present invention is not limited thereto, and the electrode 26 may be arranged around the groove 25 in other ways as long as the conductor wire 31 can be joined to the electrode 26 by soldering in a state where the conductor wire 31 is accommodated in the groove 25. For example, the electrode 26 may be arranged from the inner side surface of the groove 25 to the upper surface of the substrate 20, or the electrode 26 may be arranged only on the upper surface of the substrate 20 along the groove 25.

[0134] like Fig.14As shown in (b), the electrode 26, the solder 40, and the conductor wire 31 joined to the electrode 26 in the groove 25 are arranged within the thickness T1 of the substrate 20. Thus, the solder 40 and the conductor wire 31 in the groove 25 do not exceed the thickness of the substrate 20, and the load sensor 1 can be further thinned.

[0135] <Modification Example 1 of Implementation Example 3>

[0136] Fig.15 (a) is a plan view schematically showing the structure of a load sensor 1 according to Modification 1 of Embodiment 3. Fig.15 (b) is Fig.15 (a) is a C1 - C2 cross-sectional view of the load sensor 1 .

[0137] like Fig.15 As shown in (a) and (b), in this modification example 1, a plurality of electrodes 27 are arranged on the upper surface of the substrate 20 which is further inside than the plurality of grooves 25, and each conductor wire 31 is bent in a manner of being placed on the upper surface of the substrate 20 from a state of being accommodated in the groove 25, and is joined to the electrode 27 by solder 40. At this time, each conductor wire 31 is adjusted by a jig so that the second portion P2 and the first portion P1 are substantially in the same plane. The plurality of electrodes 27 are connected to the corresponding terminals of the connector 23 in the same manner as the electrodes 21 of the above-mentioned embodiment 1. The other structures of the load sensor 1 involved in the modification example 1 are the same as those of the above-mentioned embodiment 3.

[0138] According to the structure of Modification Example 1, the first portion P1 and the second portion P2 near the boundary B0 are also arranged on substantially the same plane. Figure 7 As in the comparative example (b), the plurality of conductor wires 31 are bent up and down near the boundary B0 between the first region R1 and the second region R2, thereby suppressing the generation of gaps between the first base member 11 and the conductor wires 31 and the second base member 12 near the boundary B0. Therefore, according to the first modification, it is also possible to suppress the load detection characteristics from becoming unstable near the boundary B0 of the substrate 20.

[0139] In the structure of Modification 1, the conductor wire 31 is bonded to the electrode 27 on the upper surface of the substrate 20 by the solder 40, so the thickness of the load sensor 1 increases by the height of the solder 40. Therefore, in order to reduce the thickness of the load sensor 1, the structure of Embodiment 3 is preferably used.

[0140] <Modification Example 2 of Implementation Example 3>

[0141] In the structure of the above-mentioned embodiment 3, if Fig.14As shown in (b), the solder 40 exists near the boundary on the positive side of the X axis of the groove 25. Therefore, when the load sensor 1 is bent in the vertical direction at the boundary, the conductor wire 31 fixed by the solder 40 near the boundary is damaged at the end of the solder 40, and the conductor wire 31 may be broken. In order to solve such a problem, in the second modification, a bending suppression member is provided in the load sensor 1, and the bending suppression member suppresses the load sensor 1 from bending in the vertical direction at the boundary B0 between the first region R1 and the second region R2.

[0142] Fig.16 (a) is a plan view schematically showing the structure of a load sensor 1 according to Modification 1 of Embodiment 3. Fig.16 (b) is Fig.16 (a) is a C1 - C2 cross-sectional view of the load sensor 1 .

[0143] like Fig.16 As shown in (a) and (b) of FIG. 1 , in this modification example 2, a reinforcing film 80 is arranged as a bending suppression member for suppressing the load sensor 1 from being bent in the vertical direction at the boundary B0 between the first region R1 and the second region R2 .

[0144] The reinforcing film 80 has a rectangular shape that is long in the Y-axis direction when viewed from above. The reinforcing film 80 is made of a material having high tensile strength and a certain degree of flexibility. That is, the reinforcing film 80 needs to have a tensile strength that can suppress the upper end of the substrate 20 from separating from the upper end of the second base member 12. In addition, the reinforcing film 80 is fixed to the second base member 12, so it is necessary to have a degree of flexibility that does not cause an undesirable influence on the deformation of the second base member 12 due to the load. The reinforcing film 80 is made of, for example, polyimide or PET.

[0145] The reinforcing film 80 may be an adhesive tape made of such a material. In this case, the reinforcing film 80 can be easily attached near the boundary B0.

[0146] The reinforcing film 80 is arranged on the upper surface of the second base member 12 and the upper surface of the substrate 20 in a manner that straddles the boundary B0 between the first region R1 and the second region R2. In this state, the end of the reinforcing film 80 on the positive side of the X axis is sewn to the second base member 12 and the first base member 11 by the thread 50, and the end of the reinforcing film 80 on the negative side of the X axis is sewn to the substrate 20 and the first base member 11 by the thread 50. A plurality of holes 24 for passing a sewing needle are formed at the position of the substrate 20 where the reinforcing film 80 is sewn.

[0147] In this way, the reinforcing film 80 is fixed to the load sensor 1. The structure of the load sensor 1 other than the reinforcing film 80 and the structure for fixing the reinforcing film 80 is the same as that of the above-mentioned embodiment 3. In addition, the end of the reinforcing film 80 on the positive side of the X axis can also be fixed by the thread 50 for fixing the second base member 12 and the first base member 11, that is, the thread 50 sewn along the periphery of the first region R1.

[0148] In addition, Fig.16 In the structures of (a) and (b), not only the reinforcing film 80 but also the first base member 11 constitutes a bending suppression member. That is, the first base member 11 is arranged on the lower surface of the second base member 12 and the lower surface of the substrate 20 in a manner that straddles the boundary B0 between the first region R1 and the second region R2. Therefore, when the second base member 12 and the substrate 20 are fixed to the first base member 11 by the wire 50 as described above, the lower end of the second base member 12 is suppressed from being separated from the lower end of the substrate 20 by the first base member 11.

[0149] As described above, according to the structure of Modification Example 2, even if a force is applied to the load sensor 1 so as to bend the load sensor 1 at the boundary B0 between the first region R1 and the second region R2, the bending is suppressed by the reinforcing film 80 and the first base member 11. Therefore, it is possible to suppress the conductor wire 31 fixed by the solder 40 near the boundary B0 from being damaged at the solder 40 end due to the bending.

[0150] <Modification Example 3 of Implementation Example 3>

[0151] Fig.17 (a) is a plan view schematically showing the structure of a load sensor 1 according to Modification 3 of Embodiment 3. Fig.17 (b) is Fig.17 (a) is a C1 - C2 cross-sectional view of the load sensor 1 .

[0152] like Fig.17 As shown in (a) and (b), in this modification example 3, the depth (width in the X-axis direction) of the groove 25 is Fig.14 The electrode 26 is larger than the structures of (a) and (b). Moreover, in each groove 25, the electrode 26 is not arranged in a predetermined range D1 from the boundary B0 between the first region R1 and the second region R2 to the inner side (in the depth direction of the groove), but is arranged in a range D2 further inward than the range D1. The other structures of the load sensor 1 involved in the modification example 3 are the same as those of the above-mentioned embodiment 3.

[0153] According to the structure of the modification example 3, the position of the solder 40 is separated from the boundary B0 between the first region R1 and the second region R2. Therefore, even if the load sensor 1 is bent in the vertical direction at the boundary B0, the conductor wire 31 fixed by the solder 40 will not be bent at the end of the solder 40, so the conductor wire 31 will not be damaged at the end of the solder 40. Therefore, even if a bending suppression member is not separately provided as in the above-mentioned modification example 2, the damage of the conductor wire 31 can be suppressed.

[0154] However, in this modification example 3, the bending suppression member may be arranged in the same manner as in the above-mentioned modification example 2. Thus, even if the solder 40 somehow reaches the vicinity of the boundary B0, the conductor wire 31 can be suppressed from being broken.

[0155] In the configuration of Modification 3, as in Embodiment 3, preferably, the electrode 26, the solder 40, and the conductor wire 31 joined to the electrode 26 in the groove 25 are arranged within the thickness T1 of the substrate 20. This allows the load sensor 1 to be made thinner.

[0156] <Implementation Method 4>

[0157] In the fourth embodiment, the formation positions of the grooves 25 and the electrodes 26 in the substrate 20 are different from those in the third embodiment.

[0158] Fig.18 It is a plan view schematically showing the structure of the structure 1b during the manufacturing process.

[0159] like Fig.18 As shown, in Embodiment 4, a plurality of grooves 25 are formed on the negative side of the X-axis of the substrate 20, and electrodes 26 are respectively arranged on the inner side surfaces of these grooves 25. As in Embodiment 3 above, each electrode 26 is connected to a corresponding terminal of the connector 23. The arrangement position of the connector 23 is changed relative to Embodiment 3 above. The other structures in the structure 1b are the same as those in Embodiment 3 above.

[0160] Fig.19 (a) is a plan view schematically showing the structure of the structure 1c during the manufacturing process. Fig.19 (b) is Fig.19 (a) is a C1-C2 cross-sectional view of the structure 1c.

[0161] As in the above-mentioned Embodiment 3, Figure 1 The structure 1a of (a) is turned over and then Fig.18 Thus, the surfaces of the three conductive elastic bodies 13 overlap the conductive wires 30. Each conductive wire 30 crosses the three conductive elastic bodies 13 in the X-axis direction. Fig.19As shown in (b) , the plurality of conductive wires 30 are bent upward so as to be contained in the grooves 25 .

[0162] Fig. 20 (a) is shown in Fig.19 (a) is a plan view of a structure 1c in which a lead wire 30 is fixed by solder 40 and a lead wire 50 . Fig. 20 (b) is in Fig.19 (a) The position of C1-C2 will be Fig. 20 (a) is a cross-sectional view obtained by cutting the structure 1c.

[0163] exist Fig.19 In the state shown in (a) and (b) of the embodiment, solder 40 is applied to each of the plurality of grooves 25. Thus, the conductor wire 31 of the lead wire 30 contained in the groove 25 is joined to the electrode 26 arranged on the inner side surface of the groove 25 through the solder 40. The other structure of the structure 1c is the same as the structure 1c of the above-mentioned embodiment 3. In this way, in the state where the three lead wires 30 are joined to the electrode 26 of the substrate 20 through the solder 40, the portion of the lead wire 30 on the negative side of the X axis than the electrode 26 is cut off. In addition, the portion of the three wirings 15 on the negative side of the X axis than the electrode 22 is cut off.

[0164] Fig.21 (a) is a plan view schematically showing the structure of the load sensor 1. Fig.21 (b) is in Fig.19 (a) The position of C1-C2 will be Fig.21 (a) is a cross-sectional view of a load sensor 1 cut away.

[0165] As in the third embodiment, the first base member 11 is overlapped with the Fig. 20 In the state of the structure 1c of (a) and (b), the outer periphery of the second base member 12 is connected to the first base member 11 by the wire 50, and the substrate 20 is connected to the first base member 11 by the wire 50 via the three holes 24 provided in the substrate 20. Thus, the second base member 12 and the substrate 20 are fixed to the first base member 11. By doing so, Fig.21 As shown in (a) and (b), the load sensor 1 is completed.

[0166] <Effects of Implementation Method 4>

[0167] like Fig.21As shown in (a) and (b) of FIG. 1 , the load sensor 1 includes a plurality of grooves 25 as a structure for arranging the first portion P1 of the plurality of conductor wires 31, which is included in the first region R1, and the second portion P2 extending from the first portion P1 to the second region R2, on a substantially same plane. The plurality of grooves 25 are formed on the substrate 20 in a manner extending inward (in the positive direction of the X axis) from the boundary on the side opposite to the first region R1 of the substrate 20, and are used to respectively arrange the second portion P2 of the plurality of conductor wires 31. Furthermore, an electrode 26 is arranged on the inner side surface of each groove 25, and the second portion P2 is joined to the electrode 26 by applying solder 40 to each groove 25.

[0168] Therefore, if Fig.21 As shown in (b), the first portion P1 and the second portion P2 are arranged on substantially the same plane. Figure 7 As in the comparative example (b), the plurality of conductor wires 31 are bent up and down near the boundary B0 between the first region R1 and the second region R2, thereby suppressing the generation of gaps between the first base member 11 and the conductor wires 31 and the second base member 12 near the boundary B0. Therefore, it is possible to suppress the load detection characteristics from becoming unstable near the boundary B0.

[0169] In addition, if Fig.21 As shown in (a) and (b) of the drawings, the position of the solder 40 is separated from the boundary B0 between the first region R1 and the second region R2. Therefore, even if the load sensor 1 is bent in the vertical direction at the boundary B0, the conductor wire 31 fixed by the solder 40 will not be damaged at the end of the solder 40. Therefore, even if a bending suppression member is not separately provided as in the second modification of the third embodiment, the damage of the conductor wire 31 can be suppressed.

[0170] In the structure of the fourth embodiment, as in the third embodiment, the electrode 26, the solder 40, and the conductor wire 31 joined to the electrode 26 in the groove 25 are preferably arranged within the thickness T1 of the substrate 20. This allows the load sensor 1 to be made thinner.

[0171] <Modification Example of Implementation Method 4>

[0172] In the fourth embodiment, the electrode 26 is arranged on the inner side surface of the groove 25 , but in this modification, the electrode to which the plurality of conductor lines 31 are connected is arranged on the upper surface of the substrate 20 closer to the first region R1 than the plurality of grooves 25 .

[0173] Fig. 22 (a) is a plan view schematically showing the structure of the structure 1c during the manufacturing process. Fig. 22 (b) is Fig. 22 (a) is a C1-C2 cross-sectional view of the structure 1c.

[0174] like Fig. 22 As shown in (a) and (b) of FIG. 1 , a plurality of electrodes 28 connected to a plurality of conductor wires 31 are arranged on the upper surface of the substrate 20 on the positive side of the X axis relative to the plurality of grooves 25. Fig.19 The structures 1c shown in (a) and (b) are the same.

[0175] Fig.23 (a) is shown in Fig. 22 FIG. 1 (a) is a plan view of a structure 1 c in which a lead wire 30 is fixed by solder 40 and a wire 50 . Fig.23 (b) is in Fig.23 (a) The position of C1-C2 will be Fig.23 (a) is a cross-sectional view obtained by cutting the structure 1c.

[0176] exist Fig. 22 In the states shown in (a) and (b), the conductor wire 31 of each conductor 30 is as shown in FIG. Fig.23 The structure 1c is bent in a manner so as to be placed on the upper surface of the substrate 20 from the groove 25 as shown in (a) and (b), and is joined to the electrode 28 on the upper surface of the substrate 20 by the solder 40. The other structures of the structure 1c are the same as the structure 1c of the above-mentioned embodiment 4. In this way, when the three wires 30 are joined to the electrode 26 of the substrate 20 by the solder 40, the portion of the wire 30 that is closer to the positive side of the X-axis than the electrode 26 is cut off. In addition, the portion of the three wirings 15 that is closer to the negative side of the X-axis than the electrode 22 is cut off. Thus, the structure Fig.23 Structure 1c of (a) and (b).

[0177] Fig.24 (a) is a plan view schematically showing the structure of the load sensor 1. Fig.24 (b) is in Fig. 22 (a) The position of C1-C2 will be Fig.24 (a) is a cross-sectional view of a load sensor 1 cut away.

[0178] As in the fourth embodiment, the first base member 11 is overlapped with the Fig.23 In the state of the structure 1c of (a) and (b), the outer periphery of the second base member 12 is connected to the first base member 11 by the wire 50, and the substrate 20 is connected to the first base member 11 by the wire 50 via the three holes 24 provided in the substrate 20. Thus, the second base member 12 and the substrate 20 are fixed to the first base member 11. By doing so, Fig.24 As shown in (a) and (b), the load sensor 1 is completed.

[0179] According to this modification, the first portion P1 and the second portion P2 are arranged on substantially the same plane as in the fourth embodiment. Therefore, it is possible to suppress the load detection characteristics from becoming unstable near the boundary B0 of the substrate 20 .

[0180] <Other Changes>

[0181] In the above-described first to fourth embodiments and their modified examples, the conductive elastic body 13 is disposed on the facing surface 12 a of the second base member 12 , but the conductive elastic body may be disposed on the first base member 11 side.

[0182] For example, in the structures of the above-mentioned embodiments 3, 4 and their variations, Fig.25 As shown in (a) and (b) of the present invention, the conductive elastomer 16 is arranged on the facing surface 11a of the first base member 11 in a manner that faces the plurality of conductive elastomers 13 of the second base member 12. In this case, the conductor 17 is formed on the facing surface 11a of the first base member 11 in a manner that faces the conductor 14 of the second base member 12, and the conductive elastomer 16 is formed in a manner that covers the conductor 17. It is sufficient that the conductive elastomer 16 and the conductor 17 are formed using the same material and manufacturing method as the conductive elastomer 13 and the conductor 14. In addition, in this case, the first base member 11 only needs to be formed of a material with the same hardness as the second base member 12. In the structures of the above-mentioned embodiments 1 and 2, a conductive layer similar to the conductive elastomer 13 and the conductive elastomer 14 may be formed on the upper surface of the spacer 60 and the spacer 61. Fig.25 (a) and (b) are the same multiple conductive elastomers and multiple conductors.

[0183] Alternatively, the plurality of conductive elastic bodies and the plurality of conductors may be formed only on the first base member 11. In this case, the load sensor 1 is installed upside down to apply a load to the lower surface of the first base member 11 (the surface on the negative side of the Z axis).

[0184] In the above-mentioned first and second embodiments, the spacers 60 and 61 are arranged with a width covering the area near the boundary B0 between the first region R1 and the second region R1, but the spacers 60 and 61 may be other structures as long as the first portion P1 and the second portion P2 can be placed in substantially the same plane. For example, the spacers 60 and 61 may be omitted in the area between the adjacent conductive wires 30 and three spacers 60 and 61 may be arranged so as to cover only the areas corresponding to the three conductive wires 30. Similarly, the spacer 62 may be other structures than those described above.

[0185] In the above-mentioned third embodiment and its modified example, the groove 25 penetrates along the Z-axis direction, but the groove 25 may not penetrate. Fig.26As shown in (a) of FIG. 1 , the groove 25 does not penetrate. In this case, a spacer 63 is provided on the upper surface of the first base member 11 in the first region R1 to lift the lead 30 (first portion P1) in the first region R1 to the height of the bottom surface of the groove 25. In this case, the electrode 26 can be arranged not only on the side surface of the groove 25 but also on the bottom surface.

[0186] The shape of the groove 25 does not necessarily need to be a rectangle in plan view, and may be another shape as long as the second portion P2 can be disposed. For example, the shape of the groove 25 in plan view may be a rectangular shape with rounded corners.

[0187] In the above-mentioned embodiments 1 to 4 and their variations, the wire 30 (conductor wire 31, dielectric 32) extends linearly between the first region R1 and the second region R2, but the wire 30 may meander in the first region R1 in a manner of undulating in the Y-axis direction. In addition, the direction in which the wire 30 extends may not be the X-axis direction, but may be inclined from the X-axis direction. In this case, in embodiments 3 and 4, the groove 25 may also be inclined according to the inclination of the wire 30.

[0188] In the first to fourth embodiments and their modifications, the wire 50 is used to connect the first base member 11, the second base member 12, and the substrate 20. However, other fasteners such as caulking may be used for the connection.

[0189] In the above-mentioned embodiments 1 to 4 and their variations, the dielectric 32 is disposed on the surface of the conductor line 31, but the dielectric 32 for defining the electrostatic capacitance between the conductor line 31 and the conductive elastic body 13 only needs to be disposed between the conductor line 31 and the conductive elastic body 13. Fig.26 As shown in (b), in the structure of the above-mentioned embodiment 1, the dielectric 32 may be arranged on the surface of the conductive elastic body 13. In this case, the dielectric 32 is made of an elastically deformable material so that the contact area with the conductor line 31 changes according to the load. For example, the dielectric 32 is made of a material having the same elastic modulus as the conductive elastic body 13.

[0190] In the above-mentioned embodiments 1 to 4 and their variations, three conductive wires 30 are arranged to be folded back on the positive side of the X-axis, and a portion of two conductive wires 30 is arranged in one element portion A1, but the number of conductive wires 30 and the number of conductive wires 30 included in the element portion A1 are not limited thereto. In addition, in the above-mentioned embodiments 1 to 4 and their variations, each conductive wire 30 is arranged to be folded back near the end portion on the positive side of the X-axis of the first region R1, but each conductive wire 30 may be cut at the folded position.

[0191] In the above-described first to fourth embodiments and their modifications, the method of arranging the conductive elastic body 13 on the facing surface 12 a of the second base member 12 is not necessarily limited to printing, and other methods such as a foil bonding method may be used.

[0192] In the above-mentioned embodiments 1 to 4 and their variations, the width of the conductive elastic body 13 may not necessarily be fixed, and for example, the width of the conductive elastic body 13 may be narrowed within the range between the element portions A1 in the direction (X-axis direction) in which the conductive elastic body 13 extends. In the above-mentioned embodiments 1 to 4 and their variations, the conductor 14 may be omitted and the wiring 15 may be connected to the conductive elastic body 13.

[0193] In addition, the embodiments of the present invention can be modified in various ways as appropriate within the scope of the technical concept shown in the claims.

[0194] (Note)

[0195] The following techniques are disclosed through the description of the above embodiments.

[0196] (Technology 1)

[0197] A load sensor, characterized in that it comprises:

[0198] a first base member;

[0199] a second base member covering at least a first region of the first base member;

[0200] a plurality of conductor lines configured to span across the first region of the first base member and a second region adjacent to the first region;

[0201] a plurality of conductive elastic bodies, the plurality of conductive elastic bodies being arranged on at least one of the facing surfaces of the first base member and the second base member, each of the plurality of conductive elastic bodies intersecting the plurality of conductor lines;

[0202] A dielectric disposed between the conductor wire and the conductive elastic body;

[0203] a substrate provided on the first base member in the second region, the substrate having electrodes for fixing the plurality of conductor wires by solder; and

[0204] A structure for arranging the first portion of the plurality of conductor lines included in the first region and the second portion extending from the first portion to the second region on substantially the same plane.

[0205] (Effect of Technology 1)

[0206] The first portion of the plurality of conductor lines included in the first area and the second portion of the plurality of conductor lines extending from the first portion to the second area are arranged in substantially the same plane. Therefore, the plurality of conductor lines are prevented from bending up and down near the boundary between the first area and the second area, thereby preventing a gap from being generated between the first base member and the conductor lines and the second member near the boundary. Therefore, it is possible to prevent the detection characteristics of the load from becoming unstable near the boundary of the substrate.

[0207] (Technique 2)

[0208] The load sensor according to the technique 1 is characterized in that:

[0209] The structure includes a plurality of grooves formed in the substrate so as to extend inward from a boundary on the first region side of the substrate and for arranging the second portions of the plurality of conductor lines, respectively.

[0210] (Effect of Technology 2)

[0211] The first and second portions of the plurality of conductor wires can be arranged on substantially the same plane by a simple structure in which a groove is formed in the substrate. Therefore, the structure of the load sensor can be simplified.

[0212] (Technique 3)

[0213] The load sensor according to the second technique is characterized in that:

[0214] The electrodes are arranged around each of the grooves.

[0215] The conductor wire is joined to the electrode by solder while being housed in the groove.

[0216] (Technique 4)

[0217] The load sensor according to the third aspect is characterized in that:

[0218] The electrodes are arranged on the inner side surfaces of the respective grooves.

[0219] (Effects of Techniques 3 and 4)

[0220] Since the second portion is accommodated in the groove, the load sensor can be made thinner than when the conductor wire is routed to the upper surface of the substrate and fixed by solder. In addition, the conductor wire can be electrically connected to the electrode by a simple process of applying solder to the groove while the conductor wire is accommodated in the groove.

[0221] (Technique 5)

[0222] The load sensor according to the fourth aspect is characterized in that:

[0223] The electrode, the solder, and the conductor wire joined to the electrode in the groove are arranged within the thickness range of the substrate.

[0224] (Effect of Technology 5)

[0225] Since the electrodes, solder, and the conductor wires joined to the electrodes in the grooves are arranged within the thickness of the substrate, they do not protrude from the thickness of the substrate, thereby further reducing the thickness of the load sensor.

[0226] (Technique 6)

[0227] The load sensor according to any one of techniques 3 to 5 is characterized in that:

[0228] A bending suppression member is provided, the bending suppression member suppressing the load sensor from being bent in the vertical direction at a boundary between the first region and the second region.

[0229] (Technique 7)

[0230] The load sensor according to technology 6 is characterized in that:

[0231] The curved member is a reinforcing film that overlaps an upper surface of the second base member and an upper surface of the substrate in the vicinity of the boundary.

[0232] (Effect of Techniques 6 and 7)

[0233] Even if a force is applied to the load sensor to cause it to bend at the boundary between the first region and the second region, the bending is suppressed by the reinforcing film or other bending suppressing member. Therefore, the conductor wire fixed by solder near the boundary can be suppressed from being damaged at the solder end due to the bending.

[0234] (Technology 8)

[0235] The load sensor according to any one of techniques 3 to 8 is characterized in that:

[0236] In each of the grooves, the electrode is not arranged in a predetermined range from the boundary to the inner side, but is arranged at a position further inside the range.

[0237] (Effect of Technology 8)

[0238] Since the solder is located away from the boundary between the first region and the second region, even if the load sensor is bent in the vertical direction at the boundary, the conductor wire fixed by the solder will not be damaged at the solder end. Therefore, damage to the conductor wire caused by the bending can be suppressed.

[0239] (Technique 9)

[0240] The load sensor according to the second technique is characterized in that:

[0241] A plurality of the electrodes are arranged on the upper surface of the substrate further back than the plurality of grooves.

[0242] Each of the conductor wires is bent so as to ride on the upper surface of the substrate from a state in which it is accommodated in the groove, and is joined to the electrode by solder.

[0243] (Effect of Technology 9)

[0244] The first and second parts of the plurality of conductor lines are arranged in substantially the same plane. Thus, it is possible to suppress the generation of gaps between the first base member and the conductor lines and the second member near the boundary. Therefore, it is possible to suppress the load detection characteristics from becoming unstable near the boundary of the substrate.

[0245] (Technology 10)

[0246] The load sensor according to the technique 1 is characterized in that:

[0247] The structure includes a plurality of grooves formed in the substrate so as to extend inward from a boundary on the side of the substrate opposite to the first region and for arranging the second portions of the plurality of conductor lines, respectively.

[0248] (Technology 11)

[0249] The load sensor according to technology 10 is characterized in that:

[0250] The electrodes are arranged on the inner side of each of the grooves.

[0251] The conductor wire and the electrode are joined by applying solder to each of the grooves.

[0252] (Effect of Techniques 10 and 11)

[0253] The first and second parts of the plurality of conductor wires are arranged in substantially the same plane. Therefore, the plurality of conductor wires are prevented from bending up and down near the boundary between the first region and the second region, thereby preventing a gap from being generated between the first base member and the conductor wires and the second member near the boundary. Therefore, it is possible to prevent the detection characteristics of the load from becoming unstable near the boundary of the substrate.

[0254] (Technology 12)

[0255] The load sensor according to technology 10 is characterized in that:

[0256] The plurality of electrodes are arranged on the upper surface of the substrate on the first region side relative to the plurality of grooves.

[0257] Each of the conductor wires is bent so as to extend from the groove to the upper surface of the substrate, and is joined to the electrode by solder.

[0258] (Effect of Techniques 10 and 12)

[0259] The first and second portions of the plurality of conductor lines are arranged on substantially the same plane. Therefore, it is possible to suppress the load detection characteristics from becoming unstable near the boundary of the substrate.

[0260] (Technology 13)

[0261] The load sensor according to the technique 1 is characterized in that:

[0262] The plurality of electrodes are arranged on the upper surface of the substrate.

[0263] The configuration includes a spacer for making a height of the first portion in the first region coincide with a height of an upper surface of the substrate.

[0264] (Effect of Technology 13)

[0265] Since the height of the first portion is made consistent with the height of the upper surface of the substrate by using the spacer, the first portion and the second portion of the plurality of conductor wires are arranged in substantially the same plane. As a result, the plurality of conductor wires are prevented from bending up and down near the boundary between the first region and the second region, thereby preventing a gap from being generated between the first base member and the conductor wires and the second member near the boundary. Therefore, it is possible to prevent the detection characteristics of the load from becoming unstable near the boundary of the substrate.

[0266] (Technology 14)

[0267] The load sensor according to the technique 1 is characterized in that:

[0268] The plurality of electrodes are arranged on the lower surface of the substrate.

[0269] The structure includes a spacer that fills a gap between the lower surface of the substrate and the upper surface of the first base member caused by solder joining the second portion to the electrode and arranges the first portion and the second portion on a substantially identical plane.

[0270] (Effect of Technology 14)

[0271] Since the height of the first portion is made consistent with the height of the lower surface of the substrate by using the spacer, the first portion and the second portion of the plurality of conductor lines are arranged in substantially the same plane. As a result, the plurality of conductor lines are prevented from bending up and down near the boundary between the first region and the second region, thereby preventing a gap from being generated between the first base member and the conductor lines and the second member near the boundary. Therefore, it is possible to prevent the detection characteristics of the load from becoming unstable near the boundary of the substrate.

[0272] Description of Reference Numerals

[0273] 1: load sensor; 11: first base member; 11a: facing surface; 12: second base member; 12a: facing surface; 13: conductive elastic body; 20: substrate; 21, 26, 27: electrodes; 25: groove; 31: conductor line; 32: dielectric; 40: solder; 60, 61, 62, 63: spacers.

Claims

1. A load sensor, characterized in that: have: a first base member; a second base member covering at least a first region of the first base member; a plurality of conductor lines configured to span across the first region of the first base member and a second region adjacent to the first region; a plurality of conductive elastic bodies, the plurality of conductive elastic bodies being arranged on at least one of the facing surfaces of the first base member and the second base member, each of the plurality of conductive elastic bodies intersecting the plurality of conductor lines; A dielectric disposed between the conductor wire and the conductive elastic body; a substrate provided on the first base member in the second region, the substrate having electrodes for fixing the plurality of conductor wires by solder; as well as A structure for arranging the first portion of the plurality of conductor lines included in the first region and the second portion extending from the first portion to the second region on substantially the same plane.

2. The load sensor according to claim 1, characterized in that: The structure includes a plurality of grooves formed in the substrate so as to extend inward from a boundary on the first region side of the substrate and for arranging the second portions of the plurality of conductor lines, respectively.

3. The load sensor according to claim 2, characterized in that: The electrodes are arranged around each of the grooves. The conductor wire is joined to the electrode by solder while being housed in the groove.

4. The load sensor according to claim 3, characterized in that: The electrodes are arranged on the inner side surfaces of the respective grooves.

5. The load sensor according to claim 4, characterized in that: The electrode, the solder, and the conductor wire joined to the electrode in the groove are arranged within the thickness range of the substrate.

6. The load sensor according to claim 3, characterized in that: A bending suppression member is provided, the bending suppression member suppressing the load sensor from being bent in the vertical direction at a boundary between the first region and the second region.

7. The load sensor according to claim 6, characterized in that: The curved member is a reinforcing film that overlaps an upper surface of the second base member and an upper surface of the substrate in the vicinity of the boundary.

8. The load sensor according to claim 3, characterized in that: In each of the grooves, the electrode is not arranged in a predetermined range from the boundary to the inner side, but is arranged at a position further inside the range.

9. The load sensor according to claim 2, characterized in that: A plurality of the electrodes are arranged on the upper surface of the substrate further back than the plurality of grooves. Each of the conductor wires is bent so as to ride on the upper surface of the substrate from a state in which it is accommodated in the groove, and is joined to the electrode by solder.

10. The load sensor according to claim 1, characterized in that The structure includes a plurality of grooves formed in the substrate so as to extend inward from a boundary on the side of the substrate opposite to the first region and for arranging the second portions of the plurality of conductor lines, respectively.

11. The load sensor according to claim 10, characterized in that: The electrodes are arranged on the inner side of each of the grooves. The conductor wire and the electrode are joined by applying solder to each of the grooves.

12. The load sensor according to claim 10, characterized in that: The plurality of electrodes are arranged on the upper surface of the substrate on the first region side relative to the plurality of grooves. Each of the conductor wires is bent so as to extend from the groove to the upper surface of the substrate, and is joined to the electrode by solder.

13. The load sensor according to claim 1, characterized in that The plurality of electrodes are arranged on the upper surface of the substrate. The configuration includes a spacer for making a height of the first portion in the first region coincide with a height of an upper surface of the substrate.

14. The load sensor according to claim 1, characterized in that The plurality of electrodes are arranged on the lower surface of the substrate. The structure includes a spacer that fills a gap between the lower surface of the substrate and the upper surface of the first base member caused by solder joining the second portion to the electrode and arranges the first portion and the second portion on a substantially identical plane.

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