Camera module and manufacturing method thereof

Abstract

The invention discloses a camera shooting module. The camera shooting module comprises a wafer-level lens, a first lens and a second lens, the wafer-level lens is arranged on a light sensing path of the light sensing assembly, and the light sensing assembly comprises a light sensing chip and a protective cover plate which is arranged above the light sensing chip in a covering manner; and the packaging body is integrally formed on the peripheral side of the wafer-level lens and the peripheral side of the protective cover plate. In addition, the invention also discloses a manufacturing method of the camera module. According to the camera module and the manufacturing method, the size of the camera module can be reduced, and the manufacturing process can be simplified.

Description

Camera module and manufacturing method thereof Technical Field

[0001] The present application relates to the technical field of camera modules, and in particular to a camera module using a wafer-level lens and a manufacturing method thereof. Background Art

[0002] With the development of camera technology, camera modules are increasingly being used in a variety of electronic devices, such as mobile phones, tablets, AR / VR, etc. Some of these electronic devices have higher requirements for the size of camera modules. Therefore, it is particularly important to make camera modules smaller so that they can be used in electronic devices with smaller installation spaces.

[0003] Therefore, the present application provides a camera module using a wafer-level lens and a manufacturing method thereof, so as to reduce the size of the camera module and improve the manufacturing efficiency of the camera module.

[0004] Summary of the Invention

[0005] One purpose of the present application is to provide a camera module that overcomes the shortcomings of the prior art, reduces the size of the camera module, and simplifies the manufacturing process.

[0006] According to one aspect of the present application, a camera module is provided, comprising:

[0007] Wafer-level lens;

[0008] A photosensitive component, wherein the wafer-level lens is arranged on a light-sensing path of the photosensitive component, and the photosensitive component includes a photosensitive chip and a protective cover plate provided above the photosensitive chip;

[0009] A packaging body is integrally formed on the peripheral side of the wafer-level lens and the peripheral side of the protective cover.

[0010] In some embodiments, the lateral dimension of the protective cover is smaller than the lateral dimension of the photosensitive chip, and the package body is integrally formed on at least a portion of the front surface of the photosensitive chip.

[0011] In some embodiments, the photosensitive component also includes a side connecting portion, which is integrally formed on the peripheral side of the photosensitive chip. The lateral dimension of the side connecting portion is larger than the lateral dimension of the protective cover, and the packaging body is integrally formed on at least a portion of the front side of the side connecting portion.

[0012] In some embodiments, the camera module further includes a filter element disposed between the wafer-level lens and the photosensitive component, and the package body is integrally formed on the peripheral side of the filter element.

[0013] In some embodiments, the photosensitive chip further includes an electrical connection portion disposed on the back side of the photosensitive chip.

[0014] In some embodiments, the photosensitive component also includes a circuit board and electronic components. The circuit board is arranged on the back of the photosensitive chip. The circuit board includes a circuit board body and a bottom packaging part. The photosensitive chip is arranged on the front of the circuit board body and is electrically connected to the circuit board body through the electrical connection part. The electronic components are arranged on the back of the circuit board body. The bottom packaging part is integrally formed on the back of the circuit board body through a molding process, and the electronic components are molded inside the bottom packaging part.

[0015] According to another aspect of the present application, a method for manufacturing a camera module is provided, comprising:

[0016] Stacking and fixing a lens panel, a protective layer and a chip panel in a height direction to form a module panel;

[0017] Splitting the lens panel and the protective layer in the module panel along the height direction to form a plurality of wafer-level lenses and a plurality of protective cover plates, wherein an upper splitting groove is formed between two adjacent wafer-level lenses and two adjacent protective cover plates;

[0018] Filling the upper dividing groove with a packaging material, curing the packaging material to form a packaging body portion, wherein the packaging body portion is integrally formed on the periphery of the wafer-level lens and the protective cover plate;

[0019] The module panel is divided along the height direction, and the package joint part and the chip panel are divided to form a plurality of camera modules.

[0020] In some embodiments, after the step of curing the packaging material to form the packaging body, an electrical connection portion is provided on the back side of the plurality of photosensitive chips of the chip panel.

[0021] In some embodiments, the chip panel includes a plurality of photosensitive chips and a connecting portion disposed between the plurality of photosensitive chips.

[0022] In some embodiments, the packaging material is a molding material or glue.

[0023] According to another aspect of the present application, a camera module is provided, comprising:

[0024] Wafer-level lens;

[0025] A photosensitive chip, wherein the wafer-level lens is arranged on a photosensitive path of the photosensitive chip;

[0026] A circuit board, wherein the photosensitive chip is arranged on the circuit board;

[0027] A packaging body is integrally formed with the wafer-level lens, the photosensitive chip and the circuit board.

[0028] In some embodiments, the camera module further includes at least one lead, at least one lead is arranged between the photosensitive chip and the circuit board, and at least one lead is wrapped by the package body.

[0029] In some embodiments, the package body covers at least a portion of the front surface of the circuit board, the peripheral side and at least a portion of the front surface of the photosensitive chip, and the peripheral side of the wafer-level lens.

[0030] In some embodiments, the photosensitive chip includes a photosensitive area and a non-photosensitive area surrounding the photosensitive area, the package body extends horizontally to the non-photosensitive area of ​​the photosensitive chip, and the package body extends vertically to the top of the wafer-level lens, and the package body is integrally formed on the peripheral side of the photosensitive chip and the peripheral side of the wafer-level lens.

[0031] In some embodiments, the package body has vertical outer sides, and a lateral dimension of a top portion of the package body is equal to a lateral dimension of a bottom portion of the package body.

[0032] In some embodiments, the outer side surface of the package body is inclined, the outer diameter of the package body increases from top to bottom, and the lateral dimension of the bottom of the package body is greater than the lateral dimension of the upper portion of the package body.

[0033] According to another aspect of the present application, a method for manufacturing a camera module is provided, comprising:

[0034] Providing a circuit board panel;

[0035] Arrange a plurality of photosensitive chips on the circuit board panel, and electrically connect the plurality of photosensitive chips to the circuit board panel;

[0036] Arranging a plurality of wafer-level lenses on the plurality of photosensitive chips, wherein the plurality of wafer-level lenses are respectively located on the photosensitive paths of the plurality of photosensitive chips;

[0037] Filling packaging material between two adjacent wafer-level lenses and two adjacent photosensitive chips, curing the packaging material to form a packaging body portion, wherein the packaging body portion is integrally combined with the wafer-level lenses, the photosensitive chips and the circuit board panel to form a module panel;

[0038] The module panels are divided along the height direction to form a plurality of camera modules.

[0039] In some embodiments, the packaging material is a molding material, and the packaging body is integrally formed with the wafer-level lens, the photosensitive chip, and the circuit board panel through a molding process.

[0040] In some embodiments, the package body is cut to form a package body, and the circuit board panel is cut to form multiple circuit boards. The package body covers at least a portion of the front side of the circuit board, the peripheral side and at least a portion of the front side of the photosensitive chip, and the peripheral side of the wafer-level lens.

[0041] In some embodiments, after the step of forming the module panel, a light-shielding layer is provided on the object side of the module panel, and the light-shielding layer is provided on the top surface of the package body portion and extends toward the wafer-level lens.

[0042] According to another aspect of the present application, a camera module is provided, comprising:

[0043] Wafer-level lens;

[0044] A photosensitive component, wherein the wafer-level lens is arranged on a light-sensing path of the photosensitive component, and the photosensitive component includes a photosensitive chip and a protective cover plate provided above the photosensitive chip;

[0045] A packaging body is integrally formed on the peripheral side of the wafer-level lens, the peripheral side of the protective cover plate, and the peripheral side of the photosensitive chip.

[0046] In some embodiments, the package body includes an upper package body and a lower package body, the upper package body is integrally formed on the peripheral side of the wafer-level lens and the peripheral side of the protective cover, and the lower package body is integrally formed on the peripheral side of the photosensitive chip.

[0047] In some embodiments, the photosensitive component further includes a side connecting portion, the side connecting portion is integrally formed on the peripheral side of the photosensitive chip, and the lower packaging body is integrally formed on the peripheral side of the side connecting portion.

[0048] In some embodiments, the lateral dimension of the photosensitive chip is smaller than the lateral dimension of the protective cover.

[0049] In some embodiments, the photosensitive chip further includes an electrical connection portion disposed on the back side of the photosensitive chip.

[0050] In some embodiments, the camera module further includes a filter element disposed between the wafer-level lens and the photosensitive component, and the upper package body is integrally formed on the peripheral side of the filter element.

[0051] According to another aspect of the present application, a method for manufacturing a camera module is provided, comprising:

[0052] Stacking and fixing a lens panel, a protective layer and a chip panel in a height direction to form a module panel;

[0053] Splitting the lens panel and the protective layer in the module panel along the height direction to form a plurality of wafer-level lenses and a plurality of protective cover plates, wherein an upper splitting groove is formed between two adjacent wafer-level lenses and two adjacent protective cover plates;

[0054] Filling the upper dividing groove with a first packaging material, and curing the first packaging material to form an upper packaging connecting portion;

[0055] Splitting the chip panel in the module panel along the height direction to form a plurality of independent photosensitive chips, with a splitting groove formed between two adjacent photosensitive chips;

[0056] Filling the lower dividing groove with a second packaging material, curing the second packaging material to form a lower packaging connecting portion, wherein the lower packaging connecting portion is integrally formed with the upper packaging connecting portion to form a packaging connecting portion;

[0057] The module panels are divided along the height direction to form a plurality of camera modules.

[0058] In some embodiments, after the step of curing the first packaging material to form the upper packaging body, an electrical connection portion is provided on the back side of the plurality of photosensitive chips of the chip panel.

[0059] In some embodiments, the chip panel includes a plurality of photosensitive chips and a connecting portion disposed between the plurality of photosensitive chips.

[0060] In some embodiments, the first packaging material and the second packaging material are made of different materials.

[0061] According to another aspect of the present application, a camera module is provided, comprising:

[0062] Wafer-level lens;

[0063] A light-transmitting cover plate, wherein the light-transmitting cover plate is fixed to the top surface of the wafer-level lens;

[0064] A photosensitive component, wherein the wafer-level lens is arranged on a photosensitive path of the photosensitive component;

[0065] A packaging body is integrally formed on a portion of the bottom surface of the light-transmitting cover plate, a side surface of the wafer-level lens, and a side surface of the photosensitive component.

[0066] In some embodiments, the lateral dimensions of the light-transmitting cover plate are larger than the lateral dimensions of the wafer-level lens and the photosensitive component, and the top surface of the wafer-level lens is flat.

[0067] In some embodiments, the light-transmitting cover plate has an infrared cutoff function.

[0068] In some embodiments, the camera module further includes a light shielding portion, which is disposed between the wafer-level lens and the light-transmitting cover.

[0069] In some embodiments, the photosensitive component includes a photosensitive chip, a protective cover plate covered above the photosensitive chip, and an electrical connection portion arranged on the back side of the photosensitive chip.

[0070] According to another aspect of the present application, a method for manufacturing a camera module is provided, comprising:

[0071] Providing a cover layer, a plurality of wafer-level lenses, and a plurality of photosensitive components, stacking and fixing the plurality of wafer-level lenses and the plurality of photosensitive components on the cover layer in a height direction to form a module assembly, wherein the plurality of wafer-level lenses and the plurality of photosensitive components are inverted and spaced apart from each other on the cover layer;

[0072] Filling a packaging material between the plurality of wafer-level lenses and the plurality of photosensitive components so that the packaging material covers the image side of the cover layer, the peripheral side of the wafer-level lenses, and the peripheral side of the photosensitive components, and curing the packaging material to form a packaging joint portion;

[0073] The module panels are divided along the height direction, and the package body and the cover layer are divided to form a plurality of camera modules.

[0074] In some embodiments, the image side surface of the cover layer is a plane, and the top surface of the wafer-level lens is a plane.

[0075] In some embodiments, a light-shielding layer is provided on the cover layer by means of silk-screen printing, ink coating or glue coating, and a plurality of light-through holes are reserved on the light-shielding layer to provide a channel for the light of the wafer-level lens to be incident.

[0076] In some embodiments, the packaging material is a molding material, the module panel is set in a module molding mold, and the molding material is injected into the module molding mold to make the molding material flow between the multiple wafer-level lenses and the multiple photosensitive components, thereby covering the image side of the cover layer, the peripheral side of the wafer-level lens and the peripheral side of the photosensitive component with the molding material.

[0077] In some embodiments, the packaging material is glue, and the glue is filled between the plurality of wafer-level lenses and the plurality of photosensitive components by spraying or dotting the glue.

[0078] Compared with the prior art, this application has at least one of the following technical effects:

[0079] 1. The package body is integrally formed on the peripheral side of the wafer-level lens and the peripheral side of the protective cover, so that the package body can encapsulate and protect the peripheral side of the wafer-level lens and the protective cover.

[0080] 2. The manufacturing process is simplified by filling and encapsulating the connected parts to form module panels and then dividing them.

[0081] 3. The package body is integrally formed on the peripheral side of the wafer-level lens, the peripheral side and at least a portion of the front side of the photosensitive chip, and at least a portion of the front side of the circuit board, so that the package body can encapsulate and protect the peripheral side of the wafer-level lens and the photosensitive chip.

[0082] 4. The package body is integrally formed on the peripheral side of the wafer-level lens, the protective cover plate and the peripheral side of the photosensitive chip, so that the package body can encapsulate and protect the peripheral side of the wafer-level lens, the protective cover plate and the photosensitive chip.

[0083] 5. By using the cover layer as the assembly reference, multiple separate wafer-level lenses and photosensitive components are fixed upside down on the cover layer, which simplifies the manufacturing process and reduces the requirements of the manufacturing method on incoming materials.

[0084] 6. The wafer-level lens and the photosensitive component are encapsulated and protected by integrally molding the encapsulation body on a portion of the bottom surface of the light-transmitting cover plate, the side surface of the wafer-level lens and the side surface of the photosensitive component.

[0085] In the following description, some additional embodiments and features are set forth, and those skilled in the art will understand after reviewing the specification or learn these embodiments and features through practice of the disclosed subject matter. A further understanding of the features and advantages of the present disclosure may be achieved by reference to the remainder of the specification and drawings, which constitute a part of this application. BRIEF DESCRIPTION OF THE DRAWINGS

[0086] FIG1 is a schematic cross-sectional view of a wafer-level lens provided in accordance with the present application;

[0087] 2A and 2B are schematic diagrams of a method for manufacturing a lens panel according to the present application;

[0088] FIG3 is a schematic diagram of the structure of a lens panel provided in the present application when viewed from above;

[0089] 4A, 4B, 4C, and 4D are cross-sectional schematic diagrams of four examples of lens panels provided according to the present application;

[0090] 5A and 5B are two cross-sectional schematic diagrams of a wafer-level lens provided according to the present application;

[0091] 6A, 6B, 6C, and 6D are schematic cross-sectional views of four examples of the first embodiment of the camera module provided by the present application;

[0092] FIG6E is a schematic top view of the photosensitive component in FIG6A of the present application;

[0093] 7A and 7B are a cross-sectional schematic diagram and a top schematic diagram of a chip panel provided according to the present application;

[0094] FIG7C is a schematic top view of the photosensitive chip after the chip panel is divided according to FIG7A and FIG7B of the present application;

[0095] FIG8 is a schematic diagram of a manufacturing method of a camera module according to a first embodiment of the present application;

[0096] 9A, 9B, and 9C are schematic cross-sectional views of three examples of the second embodiment of the camera module provided by the present application;

[0097] FIG10 is a schematic diagram of a manufacturing method of a second embodiment of a camera module provided by the present application;

[0098] 11A , 11B , and 11C are schematic cross-sectional views of three examples of the third embodiment of the camera module provided by the present application;

[0099] FIG12 is a schematic diagram of a manufacturing method of a third embodiment of a camera module provided by the present application;

[0100] FIG13 is a cross-sectional schematic diagram of a fourth embodiment of a camera module provided by the present application;

[0101] FIG14 is a schematic diagram of a manufacturing method of a fourth embodiment of a camera module provided in the present application. DETAILED DESCRIPTION

[0102] Below, the present application is further described in conjunction with specific implementation methods. It should be noted that, under the premise of no conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.

[0103] The term "comprising" is open ended. As used in the appended claims, the term does not exclude additional structures or steps.

[0104] In the description of this application, it should be noted that for directional words, such as the terms "center", "horizontal", "longitudinal", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and so on, the directions and positional relationships indicated are based on the directions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as limiting the specific scope of protection of this application.

[0105] It should be noted that the terms "first", "second", etc. in the description and claims of this application are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0106] The terms "comprises" and "having" and any variations thereof in the specification and claims of this application are intended to cover non-exclusive inclusions. For example, a process, method, system, product or apparatus that includes a series of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, product or apparatus.

[0107] It should be noted that, as used in this application, the terms "substantially," "approximately," and similar terms are used as terms of approximation, not as terms of degree, and are intended to account for inherent deviations in measurements or calculations that would be recognized by a person of ordinary skill in the art.

[0108] It should also be noted that, in the description of this application, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections, contact connections, or indirect connections through an intermediate medium; and they can refer to internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0109] Various units, circuits, or other components may be described or stated as being "configured to" perform one or more tasks. In such contexts, "configured to" is used to imply a structure (e.g., a circuit) that performs the one or more tasks during operation by indicating that the unit / circuit / component includes that structure. Additionally, "configured to" may include general structures (e.g., general circuits) manipulated by software and / or firmware to operate in a manner capable of performing the one or more tasks to be addressed. "Configured to" may also include adjusting a manufacturing process (e.g., a semiconductor fabrication facility) to manufacture a device (e.g., an integrated circuit) suitable for implementing or performing the one or more tasks.

[0110] The terms used in this description are only for the purpose of describing specific embodiments and are not intended to be limiting. As used in the specification and the appended claims, the singular forms "a", "an" and "the" are intended to also encompass the plural form, unless the context clearly indicates otherwise. It will also be understood that the terms "and / or" used herein refer to and encompass any and all possible combinations of one or more items in the items listed in association. It will also be understood that the terms "comprises" and / or "comprising" when used in this specification specify the presence of stated features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or their groupings.

[0111] As used herein, the term "if" may be interpreted to mean "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrase "if it is determined that" or "if [stated condition or event] is detected" may be interpreted to mean "upon determining that" or "in response to determining that" or "upon detecting [stated condition or event]" or "in response to detecting [stated condition or event]," depending on the context.

[0112] Figures 1 to 14 show schematic diagrams of the wafer-level lens 11, lens panel 21, lens panel 2111, camera module 10 and the manufacturing method of the camera module 10 of the present application. As shown in Figure 1, the wafer-level lens 11 according to an embodiment of the present application is illustrated, which includes a wafer-level lens assembly 111, a support 112 and a light shielding portion 113. Among them, the support 112 is arranged on the image side of the wafer-level lens assembly 111, so that the support 112 supports the wafer-level lens assembly 111 from the image side; the light shielding portion 113 is arranged on the object side of the wafer-level lens assembly 111, and the light shielding portion 113 can reduce the stray light entering the wafer-level lens 11 on the side of the incident direction of the light. In some embodiments of the present application, the wafer-level lens 11 may also not include the support 112112 and / or the light shielding portion 113, so as to reduce the height or simplify the manufacturing process.

[0113] For ease of description, in this application, the side of the wafer-level lens assembly 111 or the wafer-level lens 11 facing the object is referred to as the object side, and the side opposite to the object side is referred to as the image side. In other words, the object side refers to the side on which imaging light enters the wafer-level lens assembly 111 or the wafer-level lens 11, and the image side refers to the side on which imaging light exits the wafer-level lens assembly 111 or the wafer-level lens 11, that is, the side of the wafer-level lens assembly 111 or the wafer-level lens 11 facing the image plane. From the perspective of the wafer-level lens 11 shown in FIG1 , the upper side of the wafer-level lens 11 is the image side, and the lower side of the wafer-level lens 11 is the object side.

[0114] The wafer-level lens 11 has an optical axis, and the optical axis of the wafer-level lens 11 is also the optical axis of the wafer-level lens assembly 111. Specifically, the wafer-level lens assembly 111 includes at least one wafer-level lens 1111. The number of wafer-level lenses 1111 in the wafer-level lens assembly 111 is determined according to the requirements of the optical design, and the number can be one, two, three, four or more. In one embodiment of the present application, the wafer-level lens assembly 111 includes a wafer-level lens 1111, and the support 112 and the shading portion 113 are respectively fixed to the image side and the object side of the wafer-level lens 1111; in another embodiment of the present application, the wafer-level lens assembly 111 includes at least two wafer-level lenses 1111, and the at least two wafer-level lenses 1111 are stacked along the optical axis to form a complete optical system, and the support 112 is fixed in at least two wafer-level lenses 1111. On the image side of the wafer-level lens 1111 closest to the image side, the light shielding portion 113 is fixed to the object side of the wafer-level lens 1111 closest to the object side among the at least two wafer-level lenses 1111. In a specific example, the wafer-level lens assembly 111 further includes at least one spacer 1113, which is disposed between adjacent wafer-level lenses 1111. The spacer 1113 supports adjacent wafer-level lenses 1111 and is suitable for adjusting the spacing between the wafer-level lenses 1111. It is worth mentioning that in one embodiment of the present application, the support member 112, the light shielding portion 113, and the spacer 1113 each have a light hole for light to pass through and avoid interference with the wafer-level lens 1111.

[0115] In one embodiment of the present application, at least two wafer-level lenses 1111 of the wafer-level lens assembly 111 include a first wafer-level lens 1114, a second wafer-level lens 1115 and a third wafer-level lens 1116. The first wafer-level lens 1114, the second wafer-level lens 1115 and the third wafer-level lens 1116 are stacked along the direction of incident light, the shading portion 113 is fixed to the object side of the first wafer-level lens 1114, and the support member 112 is fixed to the image side of the third wafer-level lens 1116. In a specific example, the wafer-level lens assembly 111 also includes at least one spacer layer 2112, which can be arranged between the first wafer-level lens 1114 and the second wafer-level lens 1115 and / or between the second wafer-level lens 1115 and the third wafer-level lens 1116 assembly. The spacer layer 2112 supports adjacent wafer-level lenses 1111 and is suitable for adjusting the spacing between the wafer-level lenses 1111.

[0116] In the present application, the wafer-level lens assembly 111 further includes an adhesive layer, which can be arranged between adjacent wafer-level lenses 1111 to fix the adjacent wafer-level lenses 1111; the adhesive layer can also be arranged between adjacent wafer-level lenses 1111 and spacers 1113 to fix the adjacent wafer-level lenses 1111 and spacers 1113; the adhesive layer can also be arranged between adjacent wafer-level lenses 1111 and support members 112 to fix the adjacent wafer-level lenses 1111 and support members 112; the adhesive layer can also be arranged between adjacent wafer-level lenses 1111 and light shielding portions 113 to fix the adjacent wafer-level lenses 1111 and light shielding portions 113. It should be noted that the materials of the adhesive layers arranged at different positions can be the same or different, depending on the specific requirements of the bonding, and the present application is not limited thereto. In one example, the adhesive layer can be glue. When setting the adhesive layer, the glue can be applied continuously or in dot-shaped intervals, so that when at least the second wafer-level lens 1111 and the spacer layer 2112 are fixed, the air inside can escape; in another example, the adhesive layer can also be solid glue such as double-sided tape.

[0117] In the present application, the wafer-level lens 1111 includes a light-transmitting substrate 11111 and at least one lens unit 11112. The at least one lens unit 11112 is arranged on one side or both sides of the light-transmitting substrate 11111. The at least one lens unit 11112 can converge or diverge light. The at least one lens unit 11112 can be fixed to one side or both sides of the light-transmitting substrate 11111 by, for example, bonding, insert injection molding, one-piece molding, etc. In one embodiment of the present application, a wafer-level lens 1111 includes a transparent substrate 11111 and a lens unit 11112 disposed on the object side or image side of the transparent substrate 11111. In other words, one side of the wafer-level lens 1111 is a flat surface, while the other side of the wafer-level lens 1111 is a curved surface. In another embodiment of the present application, a wafer-level lens 1111 includes a transparent substrate 11111 and two lens units 11112 disposed on the object side and image side of the transparent substrate 11111. Both sides of the wafer-level lens 1111 are curved surfaces. In the present application, the curved surface can be a spherical surface, an aspherical surface, or a free-form surface.

[0118] In the present application, wafer-level lenses 11 are formed by splitting lens panels 21, which include multiple connected wafer-level lenses 11. By splitting the lens panels 21, wafer-level lenses 11 can be manufactured in large quantities and at low cost, and the obtained wafer-level lenses 11 also have a relatively small size.

[0119] Furthermore, a method for manufacturing a lens panel 21 is provided. Referring to FIG. 2A and FIG. 2B , the method for manufacturing the lens panel 21 includes the following steps S110-S130:

[0120] Step S110 provides at least two lens panels 2111. As shown in Figures 3 to 4C, the lens panel 2111 includes a substrate layer 21111 and a plurality of lens units 11112 disposed on one or both sides of the substrate layer 21111. The plurality of lens units 11112 are distributed in an array on the substrate layer 21111, and each lens unit 11112 has an optical axis perpendicular to the substrate layer 21111.

[0121] Step S120: Align at least two lens panels 2111 along the height direction. As shown in FIG2A , at least two lens panels 2111 are aligned along the height direction by overlapping the optical axes of the lens units 11112 on adjacent lens panels 2111. The height direction refers to a direction perpendicular to the lens panels 2111 (or substrate layer 21111).

[0122] Step S130: Connect at least two lens panels 2111 to form a lens panel 21. An adhesive layer is provided to directly or indirectly fix the aligned at least two lens panels 2111 in a predetermined position to form the lens panel 21. The lens panel 21 includes a plurality of wafer-level lenses 11 distributed in an array.

[0123] In one embodiment of the present application, step S110 of the method for manufacturing the lens panel 21 may include:

[0124] In step S111, at least one spacer layer 2112 is provided. The spacer layer 2112 is disposed between adjacent lens panels 2111. The spacer layer 2112 is used to adjust the spacing between adjacent lens panels 2111. The spacer layer 2112 has multiple light holes corresponding to the lens units 11112 of adjacent lens panels 2111, so that light passes through the multiple light holes of the spacer layer 2112 without interference between the spacer layer 2112 and the lens panels 2111. In a specific example of the present application, the spacer layer 2112 is preferably made of an opaque material to reduce stray light from entering the wafer-level lens 11.

[0125] In step S112, a support layer 212 is provided. The support layer 212 is disposed on the image side of at least two lens panels 2111. The support layer 212 is used to support the at least two lens panels 2111. The support layer 212 has multiple light holes corresponding to the lens units 11112 of adjacent lens panels 2111, so that light passes through the multiple light holes of the support layer 212 without interference between the support layer 212 and the lens panels 2111. In a specific example of the present application, the support layer 212 is preferably made of an opaque material to reduce stray light from entering the wafer-level lens 11.

[0126] Step S113, providing a light-shielding layer 213, which is arranged on the object side of at least two lens panels 2111. The light-shielding layer 213 is made of an opaque material, which is used to reduce stray light entering from the incident direction of light. The light-shielding layer 213 has a plurality of light-through holes corresponding to the lens units 11112 of adjacent lens panels 2111, so that light passes through the multiple light-through holes of the light-shielding layer 213, and there is no interference between the light-shielding layer 213 and the lens panels 2111. In one embodiment of the present application, the light-shielding layer 213 can be pre-formed on the image side surface of the lens panel 2111 closest to the object side of the at least two lens panels 2111 by silk-screen printing, ink coating or glue coating; in another embodiment of the present application, the light-shielding layer 213 can also be pre-formed first and then arranged on the object side of the at least two lens panels 2111.

[0127] It should be noted that there is no order or correlation between step S111, step S112, and step S113, that is, the lens panel 21 finally formed may include only one or two of the spacer layer 2112, the support layer 212, and the shading layer 213, or it may include the spacer layer 2112, the support layer 212, and the shading layer 213 at the same time.

[0128] In one embodiment of the present application, when step S110 includes step S111, step S120 of the method for manufacturing the lens panel 21 may include:

[0129] Step S121 aligns the spacer layer 2112 with the adjacent lens panels 2111 along the height direction. The spacer layer 2112 and the adjacent lens panels 2111 are aligned so that the multiple light holes of the spacer layer 2112 can face the lens units 11112 on the adjacent lens panels 2111, thereby preventing interference between the spacer layer 2112 and the lens units 11112 on the adjacent lens panels 2111 or affecting imaging.

[0130] In one embodiment of the present application, when step S110 includes step S112, step S120 of the method for manufacturing the lens panel 21 may include:

[0131] Step S122: Align the support layer 212 with the adjacent lens panels 2111 along the height direction. The support layer 212 and the adjacent lens panels 2111 are aligned so that the multiple light holes of the support layer 212 can face the lens units 11112 on the adjacent lens panels 2111, thereby preventing interference between the support layer 212 and the lens units 11112 on the adjacent lens panels 2111 or affecting imaging.

[0132] In one embodiment of the present application, when step S110 includes step S113, step S120 of the method for manufacturing the lens panel 21 may include:

[0133] In step S123, the light shielding layer 213 is aligned in the height direction with the adjacent lens panels 2111. The light shielding layer 213 and the adjacent lens panels 2111 are aligned so that the multiple light holes of the light shielding layer 213 can be opposite the lens units 11112 on the adjacent lens panels 2111, thereby preventing interference between the light shielding layer 213 and the lens units 11112 on the adjacent lens panels 2111 or affecting imaging.

[0134] In one embodiment of the present application, in step S130 of the method for manufacturing the lens panel 21, when the lens panel 21 includes one, two, or all of the spacer layer 2112, the support layer 212, and the light shielding layer 213, step S130 may include:

[0135] Step S131 connects the spacer layer 2112, the support layer 212, or the light shielding layer 213 to the adjacent lens panels 2111. In other words, at least two lens panels 2111 are stacked and fixed to one, two, or all of the spacer layer 2112, the support layer 212, and the light shielding layer 213 in sequence. For example, these adjacent components can be fixed by providing an adhesive layer.

[0136] In one specific embodiment, through steps S110-S130, the resulting lens panel 21 includes a lens assembly panel 211, a support layer 212, and a light shielding layer 213. The lens assembly panel 211 includes at least one lens panel 2111. The support layer 212 and the light shielding layer 213 are respectively fixed to the image side and object side of the lens panel 2111. The lens assembly panel 211 may also include at least one spacer layer 2112. The at least one spacer layer 2112 is disposed between adjacent lens panels 2111 and may be fixed to the lens panel 2111 by providing an adhesive layer between the spacer layer 2112 and the lens panel 2111.

[0137] Furthermore, a method for manufacturing a wafer-level lens 11 is provided. Referring to FIG. 2B , the method for manufacturing the wafer-level lens 11 includes the following steps S210-220:

[0138] Step S210: providing a lens panel 21.

[0139] Step S220: split the lens panel 21 to obtain multiple wafer-level lenses 11. As shown in FIG2B , the solid lines are split lines, and multiple independent wafer-level lenses 11 can be obtained after splitting, wherein the area between two solid lines represents the portion to be removed.

[0140] In one embodiment of the present application, the lens panel 21 can be obtained through steps S110 - S130 of the method for manufacturing the lens panel 21 .

[0141] In one embodiment of the present application, in step S220, the lens panel 21 can be divided by at least one of sawing, laser cutting, laser grinding, water jet cutting, milling, micromachining, micro slicing, punching cutting, etc., so as to obtain a wafer-level lens 11.

[0142] In the present application, after the lens panel 21 is divided, the lens assembly panel 211 is divided into a plurality of wafer-level lens assemblies 111, wherein the lens panel 2111 is divided into a plurality of wafer-level lenses 1111, the substrate layer 21111 in the lens panel 2111 is divided into a plurality of light-transmitting substrates 11111, the spacer layer 2112 is divided into a plurality of spacers 1113; the support layer 212 is divided into a plurality of support members 112; and the light-shielding layer 213 is divided into a plurality of light-shielding portions 113. The divided wafer-level lens 11 has a rectangular parallelepiped outline, which reduces the difficulty of division. In other examples of the present application, the outline of the wafer-level lens 11 may also have other shapes, such as a hexagonal prism shape, a cylindrical shape, a cut cylindrical shape, etc., wherein the cut cylindrical shape refers to a shape in which at least a portion of the side of the cylinder is cut.

[0143] As shown in FIG3 to FIG4C , a method for manufacturing a lens panel 2111 is further provided. The method for manufacturing the lens panel 2111 includes the following steps S310-S320:

[0144] In step S310 , a substrate layer 21111 is provided.

[0145] In step S320, a plurality of lens units 11112 are formed on one side or both sides of the substrate layer 21111. The plurality of lens units 11112 are arranged in an array to facilitate subsequent cutting. The lens units 11112 are made of a light-transmitting material, such as a resin material.

[0146] The lens panel 2111 includes a substrate layer 21111 and a plurality of lens units 11112 formed on at least one side of the substrate layer 21111. In the present application, the lens panel 2111 can be manufactured in a variety of ways. Figures 4A to 4C show three lens panels 2111 of the present application.

[0147] FIG4A shows a first embodiment of a lens panel 2111 of the present application. Referring to FIG4A , the substrate layer 21111 provided in step S310 is in the form of a flat plate. In step S320, a plurality of lens units 11112 are formed on both sides of the substrate layer 21111, respectively. The optical axes of the lens units 11112 on both sides of the substrate layer 21111 overlap. It should be noted that in this embodiment, the substrate layer 21111 is made of a translucent material suitable for transmitting visible light, such as glass or resin.

[0148] FIG4B shows a second embodiment of a lens panel 2111 of the present application. Referring to FIG4B , the substrate layer 21111 provided in step S310 is in the form of a flat plate. In step S320, a plurality of lens units 11112 are formed on one side of the substrate layer 21111. It should be noted that in this embodiment, the substrate layer 21111 is made of a light-transmitting material suitable for transmitting visible light, such as glass or resin.

[0149] In the first and second embodiments of the lens panel 2111, a plurality of lens units 11112 can be arranged on one side or both sides of the substrate layer 21111 by bonding or insert molding. Specifically, in one example, a plurality of lens units 11112 can be prefabricated and then bonded to one side or both sides of the substrate layer 21111 by optical glue; in another example, the substrate layer 21111 is set in a molding cavity of a lens molding mold, and liquid lens material (such as resin) is injected from the injection port of the lens molding mold to fill the molding cavity with the lens material, and the lens material is solidified to form a plurality of lens units 11112 on one side or both sides of the substrate layer 21111 (here, one side or both sides refers to the upper surface side and / or lower surface side of the substrate layer 21111, which will not be repeated below), thereby obtaining the lens panel 2111.

[0150] FIG4C shows a third embodiment of the lens panel 2111 of the present application. Referring to FIG4C , the substrate layer 21111 provided in step S310 is in the shape of a flat plate, and the substrate layer 21111 has a plurality of through holes. In step S320, a plurality of lens units 11112 are formed on both sides of the substrate layer 21111, wherein the optical axes of the plurality of lens units 11112 on both sides of the substrate layer 21111 overlap, and the two opposite lens units 11112 are connected through the through holes of the substrate layer 21111. It should be noted that in this embodiment, the substrate layer 21111 can be made of a translucent material suitable for transmitting visible light, such as glass or resin material; or an opaque material can be used, which is beneficial for reducing stray light. In this embodiment, the plurality of lens units 11112 can be arranged on both sides of the substrate layer 21111 by insert molding.

[0151] FIG5A shows a wafer-level lens 11 manufactured by the lens panel 2111 described in FIG4A in the present application, wherein the wafer-level lens 1111 includes a light-transmitting substrate 11111 and lens units 11112 formed on both sides of the light-transmitting substrate 11111.

[0152] 4D and 5B , FIG4D illustrates a fourth embodiment of a lens panel 2111 of the present application. A lens unit 11112 formed on one or both sides of the substrate layer 21111 includes an imaging portion 111121 and a structural portion 111122. The imaging portion 111121 of the lens unit 11112 is adapted to refract incident light, while the structural portion 111122 of the lens unit 11112 is adapted to support the lens panel 2111 or adjust the distance between adjacent lens panels 2111. In some embodiments of the present application, the structural portion 111122 of the lens unit 11112 can replace the spacer 1113 or the support member 112, thereby simplifying the manufacturing process.

[0153] FIG5B shows another embodiment of the wafer-level lens 11 of the present application. As shown in FIG5B , the wafer-level lens 11 includes a first wafer-level lens 1114, a second wafer-level lens 1115, and a third wafer-level lens 1116, wherein a lens unit 11112 located on the image side of the first wafer-level lens 1114, the second wafer-level lens 1115, and the third wafer-level lens 1116 includes an imaging portion 111121 and a structural portion 111122. The first wafer-level lens 1111 The wafer-level lens 1111 is fixed to the image side of the second wafer-level lens 1115 via a structural portion 111122. The second wafer-level lens 1115 is fixed to the image side of the third wafer-level lens 1116 via a structural portion 111122. The distance between adjacent wafer-level lenses 1111 is adjusted via the structural portions 111122 of the first wafer-level lens 1114 and the second wafer-level lens 1115. The wafer-level lens 11 is supported via the structural portion 111122 of the third wafer-level lens 1116. The wafer-level lens 11 also includes a light shielding portion 113 disposed on the object side of the first wafer-level lens 1114. The light shielding portion 113 is fixed to the object side of the first wafer-level lens 1114.

[0154] Furthermore, a first embodiment of a camera module 10 of the present application is provided. As shown in Figures 6A to 6D, the camera module 10 includes a wafer-level lens 11, a package 12 and a photosensitive component 13. The wafer-level lens 11 is arranged on the photosensitive path of the photosensitive component 13, and the package 12 is arranged on the peripheral side of the wafer-level lens 11.

[0155] The photosensitive component 13 is used to convert the light signal of the subject focused by the wafer-level lens 11 into an electrical signal. The photosensitive component 13 has a front and a back, wherein the front of the photosensitive component 13 faces the wafer-level lens 11, and the back of the photosensitive component 13 is opposite to the front of the photosensitive component 13. The wafer-level lens 11 is fixed to the front of the photosensitive component 13. In a specific example of the present application, the wafer-level lens 11 is bonded to the front of the photosensitive component 13 via a support member 112, and the wafer-level lens assembly 111 is mounted on the front of the photosensitive component 13 under the action of the support member 112.

[0156] Specifically, as shown in Figures 6A to 6C, in one embodiment of the present application, the photosensitive component 13 includes a photosensitive chip 131 and an electrical connection portion 133 arranged on the photosensitive chip 131, wherein other functional elements may be integrated on the electrical connection portion 133 to further process the electrical signal converted by the photosensitive chip 131.

[0157] The photosensitive chip 131 has a front side facing the wafer-level lens 11 and a back side opposite to the front side. The front side of the photosensitive chip 131 includes a photosensitive area and a non-photosensitive area. The non-photosensitive area surrounds the photosensitive area. The photosensitive area is used for light sensing.

[0158] In a specific example of the present application, the electrical connection portion 133 is arranged on the back side of the photosensitive chip 131, wherein the electrical connection portion 133 is implemented as a plurality of solder balls, and the plurality of solder balls can be replaced by solder bumps, solder pads or other electrical connection elements; in another specific example of the present application, the electrical connection portion 133 is arranged in the non-photosensitive area of ​​the front side of the photosensitive chip 131, as shown in Figures 11A to 11C, wherein the electrical connection portion 133 is implemented as a plurality of solder pads, and the plurality of solder pads can be replaced by solder bumps, solder pads or other electrical connection elements.

[0159] More specifically, in one embodiment of the present application, the photosensitive chip 131 is packaged in a wafer-level CSP (Chip Scale Package), also known as a wafer-level chip. The photosensitive component 13 further includes a protective cover 132, which is covered on top of the photosensitive chip 131 to protect the photosensitive chip 131. In a specific example of the present application, the protective cover 132 can be made of glass, and the protective cover 132 is fixed to the non-photosensitive area on the front of the photosensitive chip 131 by bonding or other means. That is, the photosensitive chip 131 packaged in a wafer-level CSP package is arranged between the protective cover 132 and the electrical connection part 133, and the protective cover 132 and the electrical connection part 133 are relatively arranged on both sides of the photosensitive chip 131. In one embodiment of the present application, the outer side surface of the wafer-level lens 11 is flush with the outer side surface of the protective cover 132.

[0160] The photosensitive chip 131 of the wafer-level CSP package adopts a method of directly leading out the electrical connection part 133 from the bottom surface. The photosensitive chip 131 is directly electrically connected to the mainboard of the external electronic device through the electrical connection part 133 on the bottom surface, which can effectively shorten the signal transmission distance and reduce attenuation. It can also improve the anti-interference and anti-noise performance of the photosensitive chip 131, and reduce the lateral size of the photosensitive component 13, making the structure of the photosensitive component 13 more compact.

[0161] As shown in FIG6B , in one embodiment of the present application, the camera module 10 further includes a filter element 14 having an infrared cutoff function, which is used to filter the incident light entering the photosensitive chip 131 and filter out stray light such as infrared light that is not necessary for imaging. In a specific example of the present application, the filter element 14 is disposed above the protective cover 132 so that the filter element 14 is located on the light sensing path of the photosensitive chip 131. The filter element 14 is disposed between the wafer-level lens 11 and the photosensitive component 13, that is, along the height direction, the photosensitive component 13 includes the filter element 14, the protective cover 132, the photosensitive chip 131, and the electrical connection portion 133 in sequence.

[0162] In the embodiment illustrated in FIG6A , the camera module 10 does not have the filter element 14 shown in FIG6B . To provide the camera module 10 illustrated in FIG6A with an infrared cutoff function, in a specific example, the protective cover 132 has an infrared cutoff function, that is, the protective cover 132 is used as a filter element, so that the protective cover 132 can filter the imaging light entering the photosensitive chip 131. This arrangement eliminates the need for a separate filter element, which can reduce the cost of the camera module 10 on the one hand and the overall height of the camera module 10 on the other. The infrared cutoff function of the protective cover 132 can be achieved, for example, by having the material of the protective cover 132 itself have the function of absorbing infrared rays or by having an infrared cutoff film coated on the surface of the protective cover 132. In other words, it can also be considered that in the embodiment shown in FIG6A , a filter element is used as the protective cover 132, so that the filter element and the protective cover 132 are combined into one.

[0163] In another specific example, the wafer-level lens 11 has an infrared cutoff function. Specifically, the transparent substrate 11111 of one of the wafer-level lenses 1111 of the wafer-level lens 11 has an infrared cutoff function, so that the wafer-level lens 11 has an infrared cutoff function, thereby filtering the imaging light entering the photosensitive chip 131. The infrared cutoff function of the transparent substrate 11111 can be achieved, for example, by the transparent substrate 11111 material itself having the function of absorbing infrared rays or the surface of the transparent substrate 11111 is coated with an infrared cutoff film. This setting method eliminates the need for a separate filter element, which can reduce the cost of the camera module 10 on the one hand, and reduce the overall height of the camera module 10 on the other hand.

[0164] Continuing with reference to Figures 6A to 6C, the package body 12 is integrally formed on the circumference of the wafer-level lens 11. In one example, the package body 12 is arranged around the circumference of the wafer-level lens 11, and the circumference of the wafer-level lens 11 is completely covered by the package body 12 to protect the circumference of the wafer-level lens 11. The package body 12 is made of opaque material, thereby preventing stray light from entering the wafer-level optical lens.

[0165] Furthermore, the package body 12 extends toward the image side (downward) and further covers the peripheral side of the protective cover 132. The package body 12 is integrally formed on the peripheral side of the wafer-level lens 11 and the protective cover 132, so that the peripheral sides of the wafer-level lens 11 and the protective cover 132 are all covered by the package body 12, thereby protecting the peripheral sides of the wafer-level lens 11 and the protective cover 132. In this embodiment, the lateral dimension of the protective cover 132 is smaller than the lateral dimension of the photosensitive chip 131, so that at least a portion of the front surface of the photosensitive chip 131 is exposed, so that the package body 12 is integrally formed with at least a portion of the front surface of the photosensitive chip 131, and the package body 12 covers at least a portion of the front surface of the photosensitive chip 131. Specifically, the outer annular area 1311 on the front surface of the photosensitive chip 131 is not covered by the protective cover 132, so that the package body 12 is integrally formed with the peripheral side of the wafer-level lens 11, the peripheral side of the protective cover 132, and the outer annular area 1311 on the front surface of the photosensitive chip 131, and the package body 12 covers the peripheral side of the wafer-level lens 11, the peripheral side of the protective cover 132, and the outer annular area 1311 on the front surface of the photosensitive chip 131. It should be noted that, in this application, the lateral dimension refers to the dimension in the direction perpendicular to the optical axis of the wafer-level lens 11; the outer annular area 1311 refers to the outermost annular area on the front of the photosensitive chip 131, which is located in the non-photosensitive area of ​​the photosensitive chip 131, as shown in Figure 6E.

[0166] When the wafer-level lens 11 further includes a filter element 14, as shown in Figure 6B, the packaging body 12 is integrally formed on the peripheral sides of the wafer-level lens 11, the filter element 14 and the protective cover 132, so that the peripheral sides of the wafer-level lens 11, the filter element 14 and the protective cover 132 are all covered by the packaging body 12. In this embodiment, the lateral dimensions of the filter element 14 and the protective cover 132 are the same, and the lateral dimensions of the photosensitive chip 131 are larger than the lateral dimensions of the filter element 14 and the protective cover 132, so that at least a portion of the front surface of the photosensitive chip 131 is exposed, so that the package 12 covers a portion of the front surface of the photosensitive chip 131. Specifically, the outer annular area 1311 on the front surface of the photosensitive chip 131 is not covered by the protective cover 132, so that the package 12 is integrally formed on the wafer-level lens 11, the filter element 14 and the peripheral side of the protective cover 132 and the outer annular area 1311 on the front surface of the photosensitive chip 131. The package 12 covers the wafer-level lens 11, the filter element 14 and the peripheral side of the protective cover 132 and the outer annular area 1311 on the front surface of the photosensitive chip 131.

[0167] The wafer-level CSP packaged photosensitive chip 131 can be directly electrically connected to the mainboard of an external electronic device (such as a mobile phone) through the electrical connection portion 133 to achieve circuit conduction of the camera module 10, as shown in Figures 6A to 6C. In another embodiment of the present application, as shown in Figure 6D, the photosensitive component 13 further includes a circuit board 135, which is arranged on the back of the photosensitive chip 131, and the electrical connection portion 133 is electrically connected to the circuit board 135, so that the circuit conduction between the photosensitive chip 131 and the circuit board 135 is achieved through the electrical connection portion 133. Among them, the circuit board 135 includes a circuit board body 1351, a connecting tape 1352 and a connecting plate 1353. The photosensitive chip 131 is arranged on the front of the circuit board body 1351 and is electrically connected to the circuit board body 1351 through the electrical connection part 133. The connecting tape 1352 connects and electrically conducts the circuit board body 1351 and the connecting plate 1353, so that the connecting tape 1352 transmits the imaging information obtained by the circuit board body 1351 from the photosensitive chip 131 to the external electronic device through the connector, so that the photosensitive chip 131 packaged in the wafer-level CSP package can also be indirectly electrically connected to the mainboard of the external electronic device through the circuit board 135.

[0168] The photosensitive assembly 13 further includes electronic components, which can be one or more of passive electronic devices such as resistors and capacitors and active electronic devices such as driver chips and memory chips. In a specific example of the present application, the electronic components are arranged on the connecting strip 1352 and / or the connecting plate 1353 to avoid occupying the space of the circuit board body 1351, thereby providing sufficient mounting space for the photosensitive chip 131 placed on the circuit board body 1351.

[0169] 6D , in another specific example of the present application, the electronic component 134 is disposed on the back side of the circuit board body 1351, that is, the electronic component 134 and the photosensitive chip 131 are disposed on both sides of the circuit board body 1351. This can avoid the placement of the photosensitive chip 131 on the one hand, and can reduce the lateral size of the circuit board body 1351 on the other hand, making the structure of the camera module 10 more compact. The front side of the circuit board body 1351 refers to the side thereof facing the photosensitive chip 131 or the wafer-level lens 11, and the back side of the circuit board body 1351 refers to the side thereof away from the photosensitive chip 131 or the wafer-level lens 11. The back side of the circuit board body 1351 is opposite to the front side. Furthermore, circuit board 135 also includes a bottom encapsulation portion 1354, which is disposed on the back side of circuit board body 1351. Bottom encapsulation portion 1354 encapsulates electronic components 134 disposed on the back side of circuit board body 1351, thereby protecting electronic components 134 from direct exposure to air and contaminants such as dust. For example, in one embodiment of the present application, bottom encapsulation portion 1354 is integrally formed on the back side of circuit board body 1351 through a molding process, and electronic components 134 are molded within bottom encapsulation portion 1354, thereby protecting electronic components 134.

[0170] In the present application, the camera module 10 in the first embodiment is formed by splitting the module panel 20, and the module panel 20 includes a plurality of connected camera modules 10. By splitting the module panel 20, the camera module 10 can be manufactured in batches and at low cost, and the obtained camera module 10 also has a relatively small size.

[0171] The module panel 20 includes a lens panel 21, a protective layer 22 and a chip panel 24 stacked along the height direction. The chip panel 24 includes multiple photosensitive chips 131. After cutting, the chip panel 24 can form multiple photosensitive chips 131 as described above. After cutting, the lens panel 21 can form multiple wafer-level lenses 11 as described above. After cutting, the protective layer 22 can form multiple protective cover plates 132 as described above. A single wafer-level lens 11 is located on the photosensitive path of a single photosensitive chip 131, and the protective cover plate 132 is arranged between the wafer-level lens 11 and the photosensitive chip 131.

[0172] Furthermore, a method for manufacturing the camera module 10 in the first embodiment is provided. Referring to FIG. 8 , the method for manufacturing the camera module 10 includes the following steps S410 to S440:

[0173] In step S410, a lens panel 21, a protective layer 22, and a chip panel 24 are stacked and fixed in the height direction to form a module panel 20. As shown in FIG8 , the module panel 20 includes a lens panel 21, a protective layer 22, and a chip panel 24 in the height direction. The lens panel 21, the protective layer 22, and the chip panel 24 are provided. The lens panel 21, the protective layer 22, and the chip panel 24 are aligned in the height direction. An adhesive layer is provided between the lens panel 21 and the protective layer 22 to bond and fix the lens panel 21 and the protective layer 22. An adhesive layer is provided between the protective layer 22 and the chip panel 24 to bond and fix the protective layer 22 and the chip panel 24. The materials of the adhesive layers at the two locations can be the same or different, and this embodiment is not limited thereto.

[0174] In step S420, the lens panel 21 and the protective layer 22 in the module panel 20 are divided along the height direction to form a plurality of wafer-level lenses 11 and a plurality of protective cover plates 132, and an upper dividing groove 26 is formed between two adjacent wafer-level lenses 11 and two adjacent protective cover plates 132. The module panel 20 is divided along the height direction from the object side to the image side, dividing the lens panel 21 and the protective layer 22 and exposing the chip panel 24 to form a plurality of upper dividing grooves 26. The upper dividing grooves 26 are formed between two adjacent wafer-level lenses 11 and two adjacent protective cover plates 132, wherein the bottom surface of the upper dividing groove 26 is the chip panel 24, and the side surface of the upper dividing groove 26 is the wafer-level lens 11 and the protective cover plate 132.

[0175] In step S430, the upper dividing groove 26 is filled with encapsulation material, and the encapsulation material is cured to form an encapsulation body 23. The encapsulation body 23 is integrally formed around the wafer-level lens 11 and the protective cover 132. The encapsulation material fills the upper dividing groove 26 and connects two adjacent wafer-level lens 11 and two adjacent protective cover 132 to form the encapsulation body 23. The encapsulation body 23 covers the periphery of the wafer-level lens 11 and the protective cover 132.

[0176] Step S440 is to divide the module panel 20 along the height direction, and to divide the package body 23 and the chip panel 24 to form a plurality of camera modules 10. The package body 23 is divided to form the package body 12 of the camera module 10, and the chip panel 24 is divided to obtain a plurality of independent photosensitive chips 131.

[0177] The chip panel 24 includes a plurality of connected photosensitive chips 131. In one example of this embodiment, the method for manufacturing the camera module 10 further includes step S450: providing electrical connection portions 133 on the back surfaces of the plurality of photosensitive chips 131 of the chip panel 24. The electrical connection portions 133 are provided on the back surfaces of the photosensitive chips 131 so that the photosensitive chips 131 can be electrically connected to other components from the back surfaces. Step S450 can be located before step S440 or after step S440. In a specific example, when step S450 is located between step S430 and step S440, the multiple photosensitive chips 131 still remain connected in the form of a chip panel 24. The electrical connection part 133 can be set on the back of the multiple photosensitive chips 131 in the chip panel 24 in batches in the chip panel 24 state, which has higher efficiency. In another specific example, step S450 is located after step S440, and the module panel 20 is first divided along the height direction. After the division is completed, the electrical connection part 133 is set on the back of the photosensitive chip 131 of the independent camera module 10. This can avoid damage to the electrical connection part 133 caused by the division.

[0178] In one example of this embodiment, the manufacturing method of the camera module 10 further includes a step of setting a circuit board 135: further setting a circuit board 135 on the back of the photosensitive chip 131, and the photosensitive chip 131 is electrically connected to the circuit board 135 through the electrical connection portion 133. The circuit board 135 includes a circuit board body 1351, a connecting tape 1352, and a connecting plate 1353. The circuit board body 1351 is set on the back of the photosensitive chip 131 and is electrically connected to the electrical connection portion 133. The connecting tape 1352 connects and electrically conducts the circuit board body 1351 and the connecting plate 1353, so that the connecting tape 1352 transmits the imaging information obtained by the circuit board body 1351 from the photosensitive chip 131 to the external electronic device through the connector.

[0179] In one example of this embodiment, a step of setting a light shielding portion 113 is also included. In a specific example, after completing the segmentation of the module panel 20, a light shielding portion 113 is set on the object side of the wafer-level lens 11. In another example, the step of setting the light shielding portion 113 on the object side of the wafer-level lens 11 can also be performed in step S430. For example, the light shielding portion 113 is formed on the object side of the wafer-level lens 11 by packaging material, so that the light shielding portion 113 and the packaging body portion 23 can be formed as one piece, simplifying the manufacturing process. In another example of this embodiment, the light shielding portion 113 can also be directly formed during the manufacturing process of the lens panel 21, that is, the lens panel 21 provided in step S410 includes the light shielding portion 113.

[0180] In an example of this embodiment, in step S410, the protective layer 22 and the chip panel 24 can be first fixed to form the photosensitive wafer 25, and then the lens panel 21 and the photosensitive wafer 25 are aligned and fixed; or, the protective layer 22 and the chip panel 24 provided in step S410 have been pre-fixed to form the photosensitive wafer 25.

[0181] In one example of this embodiment, in step S410, a filter element 14 is further provided and disposed between the wafer-level lens 11 and the protective layer 22, thereby achieving an infrared cutoff function. Due to the provision of the filter element 14, the filter element 14 is also segmented in step S420. In step S430, the package body 23 is integrally formed around the wafer-level lens 11, the filter element 14, and the protective cover 132.

[0182] In an example of this embodiment, in step S420, the lens panel 21 and the protective layer 22 can be divided by at least one of sawing, laser cutting, laser grinding, water jet cutting, milling, micromachining, micro slicing, punching cutting and other dividing methods.

[0183] In one example of this embodiment, in step S430, the packaging material filled in the upward dividing groove 26 is a liquid packaging material, and after the liquid packaging material is cured, the packaging body portion 23 is formed. Due to the fluidity of the liquid packaging material, the packaging material can fully contact the periphery of the wafer-level lens 11 and the protective cover plate 132. After the liquid packaging material is cured, the formed packaging body portion 23 can also completely cover the periphery of the wafer-level lens 11 and the protective cover plate 132.

[0184] In a specific example, the packaging material can be glue, and the glue is filled into the upper dividing groove 26. After the glue is cured, the packaging body 23 formed can be divided to obtain a glue package, that is, the wafer-level lens 11 or the peripheral side of the protective cover 132 is packaged using a glue process. Specifically, the glue uses opaque glue, such as black glue, so that the packaging material can reduce stray light entering from the side. Furthermore, in order to completely fill the upper dividing groove 26 with glue and avoid the presence of bubbles in the upper dividing groove 26, so that the packaging body 23 formed after curing cannot completely cover the peripheral side of the wafer-level lens 11 or the protective cover 132, the glue can be filled in the upper dividing groove 26 in a spraying manner to avoid the generation of bubbles, or the glue can be filled in a dot-shaped glue painting manner.

[0185] In another specific example, the packaging material can also be a molding material. The module panel 20 is set in the module molding mold, and the molding material is injected into the module molding mold so that the molding material flows in the upper dividing groove 26, thereby filling the upper dividing groove 26 with the molding material, and then the molding material is solidified to form a packaging body 23. The packaging body 23 is divided to obtain a molded package. By encapsulating the module panel 20 with the module molding mold, the molded package formed on the side of the wafer-level lens 11 has a smoother top surface. The molding material can be solidified by cooling or heating, which is specifically determined by the properties of the molding material.

[0186] In an example of this embodiment, in step S440, the module panel 20 can be divided by at least one of sawing, laser cutting, laser grinding, water jet cutting, milling, micromachining, micro slicing, punching cutting and other dividing methods.

[0187] It is worth noting that, in this embodiment, the segmentation method in step S440 may be the same as or different from the segmentation method in step S420. When facing different cutting objects, different cutting methods and different cutting widths may be selected.

[0188] It is worth noting that there is a dividing portion between two adjacent photosensitive chips 131 in the chip panel 24. The photosensitive chips 131 are separated by cutting the dividing portion. However, in the actual manufacturing process, when using a cutting knife to cut the protective layer 22, the cutting knife has a sharp blade. After cutting the protective layer 22, the photosensitive chips 131 will be cut. When the width of the dividing portion is small, it is easy to damage the circuits in the photosensitive chips 131. Alternatively, if the cutting depth is too deep during the cutting of the protective layer 22, the circuits of the photosensitive chips 131 may be damaged. In one example, when the width of the cutting portion of the chip panel 24 is greater than or equal to the width of the cutting knife, the cutting knife only cuts the dividing portion; in another example, when the width of the dividing portion of the chip panel 24 is less than the width of the cutting knife, the cutting knife risks damaging the circuits of the photosensitive chips 131.

[0189] In order to avoid damaging the circuits of the photosensitive chip 131, the distance between adjacent photosensitive chips 131 can be increased. In a specific example, the width of the dividing portion is 80um-300um. On the one hand, it can meet the cutting requirements and avoid damaging the photosensitive chip 131 during the cutting process. On the other hand, it can allow as many photosensitive chips 131 as possible to be cut out of a chip panel 24.

[0190] However, in the method of obtaining the chip panel 24 through the conventional chip manufacturing process, the photosensitive chips 131 are formed on the silicon wafer. Increasing the distance between the photosensitive chips 131 will reduce the number of photosensitive chips 131 that can be produced on a silicon wafer, thus increasing the manufacturing cost of the photosensitive chips 131 and reducing the manufacturing efficiency. Therefore, the present application provides a new chip panel 24, as shown in Figures 7A and 7B, the chip panel 24 includes a plurality of photosensitive chips 131 and a connecting portion 241 arranged between the plurality of photosensitive chips 131. The plurality of photosensitive chips 131 are laid in the same horizontal plane, and the connecting portion 241 is arranged between two adjacent photosensitive chips 131 to connect and support the plurality of photosensitive chips 131 through the connecting portion 241. The chip panel 24 is divided by dividing the connecting portion 241, and a side connecting portion 136 is formed integrally on the circumference of the obtained single photosensitive chip 131, and the side connecting portion 136 is arranged around the photosensitive chip 131, as shown in Figure 7C.

[0191] In one embodiment of the present application, a connecting portion 241 is integrally formed between two adjacent photosensitive chips 131 through a molding process. The width of the connecting portion 241 is greater than or equal to the width of the cutting blade. The width of the connecting portion 241 adjusts the distance between adjacent photosensitive chips 131 and the width of the dividing portion. Therefore, when cutting the chip panel 24, the cutting blade only cuts the connecting portion 241 and does not cut the photosensitive chips 131, thereby preventing damage to the photosensitive chips 131 during the cutting process.

[0192] In a specific example of the present application, the height of the connecting portion 241 is lower than the height of the photosensitive chip 131, and the side connecting portion 136 formed after the connecting portion 241 is divided is lower than the height of the photosensitive chip 131. The side connecting portion 136 covers at least a portion of the peripheral side of the photosensitive chip 131 after the chip panel 24 is cut to protect the cut photosensitive chip 131. In another specific example of the present application, the height of the connecting portion 241 is equal to the height of the photosensitive chip 131, thereby providing a flatter mounting surface for the lens panel 21. The side connecting portion 136 formed after the body 241 is divided is equal to the height of the photosensitive chip 131, and the side connecting portion 136 covers the entire circumference of the photosensitive chip 131 after the chip panel 24 is cut; in another specific example of the present application, the height of the connecting portion 241 is higher than the height of the photosensitive chip 131, and the side connecting portion 136 formed after the body 241 is divided is higher than the height of the photosensitive chip 131, and the side connecting portion 136 covers the entire circumference of the photosensitive chip 131 after the chip panel 24 is cut, so as to protect the cut photosensitive chip 131. The connecting portion 241 is higher than the photosensitive chip 131, so that when the protective layer 22 is arranged above the photosensitive chip 131, the connecting portion 241 plays a supporting role, leaving a gap between the protective layer 22 and the photosensitive chip 131, that is, when the side connecting portion 136 is higher than the photosensitive chip 131, when the protective cover 132 is arranged above the photosensitive chip 131, the side connecting portion 136 plays a supporting role, leaving a gap between the protective cover 132 and the photosensitive chip 131.

[0193] The aforementioned chip panel 24 with the connecting portion 241 can also be applied to a variety of lens panels 21. For example, when the size of the wafer-level lens 11 increases, the distance between two adjacent photosensitive chips 131 opposite the two adjacent wafer-level lenses 11 also needs to increase accordingly. In the present application, a connecting portion 241 is provided between two adjacent photosensitive chips 131. By adjusting the width of the connecting portion 241 and thereby adjusting the distance between the two adjacent photosensitive chips 131, the chip panel 24 can be applied to lens panels 21 of different specifications, thereby increasing applicability and flexibility.

[0194] Furthermore, the manufacturing method of the chip panel 24 includes the following steps S510-S530:

[0195] At step S510, a plurality of photosensitive chips 131 are provided and laid out in a chip molding mold. The plurality of photosensitive chips 131 are positioned on the same horizontal plane, with a molding channel disposed between adjacent photosensitive chips 131. The plurality of photosensitive chips 131 are spaced apart, with spacing between adjacent photosensitive chips 131 to form a molding channel for the molding material to flow during the molding process.

[0196] S520 , injecting molding material into the chip molding mold so that the molding material can flow in the molding flow channel and fill the entire molding flow channel.

[0197] S530 , the molding material is cooled to form a connecting portion 241 , wherein the connecting portion 241 covers at least a portion of the peripheral side of the photosensitive chip 131 .

[0198] With further reference to FIG6C , a modified embodiment of the camera module 10 of the first embodiment is provided. The photosensitive component 13 also includes a side connecting portion 136, which is integrally formed on the peripheral side of the photosensitive chip 131 to protect the photosensitive chip 131. The lateral dimension of the side connecting portion 136 is larger than the lateral dimension of the protective cover 132, and the package body 12 is integrally formed on at least a portion of the front of the side connecting portion 136. In this embodiment, the package body 12 covers at least a portion of the front of the side connecting portion 136. In a specific example, the lateral dimension of the photosensitive chip 131 is smaller than the lateral dimension of the protective cover 132. The package body 12 is integrally formed on a portion of the front of the side connecting portion 136, and the protective cover 132 covers at least a portion of the front of the side connecting portion 136. At this time, the portion of the front of the side connecting portion 136 that is not covered by the protective cover 132 is covered by the package body 12, and a portion of the front of the side connecting portion 136 is covered by the package body 12, as shown in FIG6C Meaning; in another specific example, the lateral dimension of the photosensitive chip 131 is equal to the lateral dimension of the protective cover 132, the package body 12 is integrally formed on the front of the side connecting part 136, and the front of the side connecting part 136 is completely covered by the package body 12; in another specific example, the lateral dimension of the photosensitive chip 131 is greater than the lateral dimension of the protective cover 132, the package body 12 is integrally formed on the front of the side connecting part 136, the front of the side connecting part 136 is completely covered by the package body 12, and a part of the front of the photosensitive chip 131 is covered by the package body 12.

[0199] Figures 9A to 10 illustrate a second embodiment of the camera module 10 of the present application, which includes a wafer-level lens 11, a package 12 and a photosensitive component 13. The wafer-level lens 11 is arranged on the photosensitive path of the photosensitive component 13, and the package 12 is arranged on the peripheral sides of the wafer-level lens 11 and the photosensitive component 13 to protect the peripheral sides of the wafer-level lens 11 and the photosensitive component 13.

[0200] Unlike the first embodiment of the camera module 10 shown in Figures 6A to 6D, in the second embodiment of the camera module 10 of the present application shown in Figure 9A, the package body 12 not only covers the peripheral sides of the wafer-level lens 11 and the protective cover 132, but also covers the peripheral sides of the photosensitive chip 131. The package body 12 is integrally formed on the peripheral sides of the wafer-level lens 11 and the photosensitive component 13, so that the peripheral sides of the wafer-level lens 11 and the photosensitive component 13 are all covered by the package body 12, which can further protect the peripheral sides of the photosensitive chip 131. Among them, the lateral size of the photosensitive chip 131 can be greater than, less than or equal to the lateral size of the protective cover 132, and the specific size is determined by the cutting requirements during the cutting process of the camera module 10. In the second embodiment of the camera module 10 of the present application, the package body 12 can also be a glue package body or a molded package body formed by glue or molding material.

[0201] The package 12 includes an upper package 121 and a lower package 122. The upper package 121 is integrally formed around and covers the wafer-level lens 11 and protective cover 132, while the lower package 122 is integrally formed around and covers the photosensitive chip 131. The upper and lower packages 121 and 122 are connected and fixed to each other. Specifically, the package 12 is formed through two curing processes, with the lower package 122 integrally formed on the bottom surface of the upper package 121 to form the package 12.

[0202] In one example of this embodiment, the lateral dimension of the protective cover 132 is smaller than the lateral dimension of the photosensitive chip 131, the upper package body 121 is integrally formed on the peripheral side of the wafer-level lens, the peripheral side of the protective cover and at least a part of the front of the photosensitive chip, and the lower package body 122 is integrally formed on the bottom surface of the upper package body 121 and the peripheral side of the photosensitive chip; in another example, the lateral dimension of the protective cover 132 is equal to the lateral dimension of the photosensitive chip 131, the upper package body 121 is integrally formed on the peripheral side of the wafer-level lens and the peripheral side of the protective cover, and the lower package body 122 is integrally formed on the bottom surface of the upper package body 121 and the peripheral side of the photosensitive chip; in yet another example, the lateral dimension of the protective cover 132 is greater than the lateral dimension of the photosensitive chip 131, the upper package body 121 is integrally formed on the peripheral side of the wafer-level lens and the peripheral side of the protective cover, and the lower package body 122 is integrally formed on the bottom surface of the upper package body 121, at least a part of the bottom surface of the protective cover 132 and the peripheral side of the photosensitive chip.

[0203] Continuing with Figures 9B to 9C , the photosensitive assembly 13 further includes a side connecting portion 136 integrally formed around the periphery of the photosensitive chip 131. The lower package body 122 of the package body 12 is integrally formed around the periphery of the side connecting portion 136, thereby indirectly integrally forming the lower package body 122 around the periphery of the photosensitive chip 131. In this embodiment, the protective cover 132 covers at least a portion of the front surface of the side connecting portion 136, and the lower package body 122 wraps around the periphery of the side connecting portion 136. The lateral dimensions of the photosensitive chip 131 are smaller than those of the protective cover 132, thereby preventing damage to the photosensitive chip 131 during cutting of the protective cover.

[0204] As shown in Figure 9B, in a specific example of this embodiment, the lateral dimension of the side connecting portion 136 is equal to the lateral dimension of the protective cover 132, and the outer side surface of the side connecting portion 136 is flush with the outer side surface of the protective cover 132; in another specific example of this embodiment, the lateral dimension of the side connecting portion 136 is smaller than the lateral dimension of the protective cover 132, and the lower packaging body 122 is integrally formed with at least a portion of the bottom surface of the protective cover 132 and covers at least a portion of the bottom surface of the protective cover 132; in yet another specific example of this embodiment, as shown in Figure 9C, the lateral dimension of the side connecting portion 136 is larger than the lateral dimension of the protective cover 132, the side connecting portion 136 protrudes from the protective cover 132, and the upper packaging body 121 covers a portion of the front surface of the side connecting portion 136.

[0205] Furthermore, a method for manufacturing the camera module 10 in a second embodiment is provided. Referring to FIG. 10 , the method for manufacturing the camera module 10 includes the following steps S610 to S650:

[0206] In step S610, a lens panel 21, a protective layer 22, and a chip panel 24 are stacked and fixed in the height direction to form a module panel 20. As shown in FIG10 , the module panel 20 includes a lens panel 21, a protective layer 22, and a chip panel 24 in the height direction. The lens panel 21, the protective layer 22, and the chip panel 24 are aligned in the height direction. An adhesive layer is provided between the lens panel 21 and the protective layer 22 to bond and fix the lens panel 21 and the protective layer 22. An adhesive layer is provided between the protective layer 22 and the chip panel 24 to bond and fix the protective layer 22 and the chip panel 24. The materials of the adhesive layers at the two locations can be the same or different, and this embodiment is not limited thereto.

[0207] In step S620, the lens panel 21 and the protective layer 22 in the module panel 20 are divided along the height direction to form a plurality of wafer-level lenses 11 and a plurality of protective cover plates 132, and an upper dividing groove 26 is formed between two adjacent wafer-level lenses 11 and two adjacent protective cover plates 132. The module panel 20 is divided along the height direction from the object side to the image side, dividing the lens panel 21 and the protective layer 22 and exposing the chip panel 24 to form a plurality of upper dividing grooves 26. The upper dividing grooves 26 are formed between two adjacent wafer-level lenses 11 and two adjacent protective cover plates 132, wherein the bottom surface of the upper dividing groove 26 is the chip panel 24, and the side surface of the upper dividing groove 26 is the wafer-level lens 11 and the protective cover plate 132.

[0208] In step S630 , the upper dividing groove 26 is filled with a first packaging material, and the first packaging material is cured to form an upper packaging connecting portion 231 . The first packaging material fills the upper dividing groove 26 and connects two adjacent wafer-level lenses 11 and two adjacent protective cover plates 132 .

[0209] In step S640, the chip panel 24 in the module panel 20 is split along the height direction to form a plurality of independent photosensitive chips 131, with a lower splitting groove 27 formed between two adjacent photosensitive chips 131. The module panel 20 is split along the height direction from the image side to the object side, splitting the chip panel 24 and exposing the solidified upper package connecting portion 231 in the upper splitting groove 26 to form a plurality of lower splitting grooves 27. The lower splitting grooves 27 are formed between two adjacent photosensitive chips 131, wherein the bottom surface of the lower splitting groove 27 is the solidified upper package connecting portion 231 in the upper splitting groove 26, and the side surface of the lower splitting groove 27 is the photosensitive chip 131.

[0210] In step S650, the second packaging material is filled into the lower dividing groove 27, and the second packaging material is cured to form a lower packaging body portion (not shown in the drawings). The lower packaging body portion is integrally formed with the upper packaging body portion 231 to form a packaging body portion 23. The second packaging material fills the lower dividing groove 27 and connects the two adjacent photosensitive chips 131 and the upper packaging body portion 231 located in the upper dividing groove 26. The lower packaging body portion is integrally formed on the bottom surface of the upper packaging body portion 231 and the surrounding side of the photosensitive chip 131 to form a packaging body portion 23. In other words, in this embodiment, the packaging body portion 23 is formed by two curings. Among them, the first packaging material set in the upper dividing groove 26 and the second packaging material set in the lower dividing groove 27 can be the same or different, depending on the design requirements.

[0211] Step S660 , dividing the module panel 20 along the height direction to form a plurality of camera modules 10 . The plurality of camera modules 10 are formed by dividing the package connecting portion 23 along the height direction. The package connecting portion 23 is divided to form the package bodies 12 of the plurality of camera modules 10 .

[0212] In this embodiment, the lens panel 21 and the protective layer 22 in the split module panel 20 in step S620, the chip panel 24 in the split module panel 20 in step S640, and the split module panel 20 in step S660 can be split using three different splitting methods, two different splitting methods, or the same splitting method. The splitting widths in the three steps may also be different, and the present application is not limited to this.

[0213] Compared with the camera module 10 in the first embodiment, in this embodiment, the peripheral side of the photosensitive chip 131 of the camera module 10 obtained by the above method is also covered by the packaging body 12, thereby providing more complete protection and reducing the possibility of damage to the photosensitive chip 131 during the impact of the camera module 10.

[0214] In one example of the present embodiment, the manufacturing method of the camera module 10 in the second embodiment further includes step S670: setting an electrical connection portion 133 on the back of the photosensitive chip 131. In a specific example, step S670 can be located between step S630 and step S640, so that the electrical connection portion 133 can be set on the back of multiple photosensitive chips 131 in the chip panel 24 in batches, and at the same time, the setting of the electrical connection portion 133 is not affected by the segmentation of the chip panel 24 and the curing of the upper packaging body 231. The process of segmenting the chip panel 24 and curing the first packaging material may cause the flatness of the back of the chip to decrease; in another specific example, step S670 can be located between step S650 and step S660, and after curing the second packaging material, the electrical connection portion 133 can be set on the back of the photosensitive chip 131. 1 is provided with an electrical connection part 133 on the back side, so that the electrical connection part 133 can be provided on the back side of multiple photosensitive chips 131 in the module panel 20 in batches, which is efficient and can prevent the electrical connection part 133 from being damaged in the process of dividing the module panel 20 into multiple independent camera modules 10; in another specific example, step S670 can be located after step S660, and the module panel 20 is first divided along the height direction. After the division is completed, the electrical connection part 133 is provided on the back side of the photosensitive chip 131 of the independent camera module 10, so as to avoid damage to the electrical connection part 133 caused by the division.

[0215] Similar to the manufacturing method of the camera module 10 in the first embodiment, in one example of the present embodiment, the manufacturing method of the camera module 10 further includes a circuit board 135 setting step and a light shielding portion 113 setting step. The circuit board 135 setting step is performed after step S660, that is, after the module panel 20 is split. In a specific example, the light shielding portion 113 setting step of setting the light shielding portion 113 on the object side of the wafer-level lens 11 can be performed after step S660 is completed, that is, after the module panel 20 is split; in another specific example, the light shielding portion 113 setting step can also be performed in step 630, for example, the light shielding portion 113 is formed on the object side of the wafer-level lens 11 by packaging material; in a specific example, the light shielding portion 113 can also be directly formed during the manufacturing process of the lens panel 21.

[0216] Similar to the manufacturing method of the camera module 10 in the first embodiment, in one example of this embodiment, in step S610, a filter element 14 is further provided, so that the filter element 14 is disposed between the wafer-level lens 11 and the protective layer 22, and the infrared cutoff function is achieved by the filter element 14. Due to the provision of the filter element 14, the filter element 14 is also divided in step S620. In step S630, the first packaging material is cured, and the upper packaging body 231 is integrally formed around the wafer-level lens 11, the filter element 14, and the protective cover 132.

[0217] Similar to the manufacturing method of the camera module 10 in the first embodiment, in one example of this embodiment, in steps S630 and S650, the packaging material (first packaging material and second packaging material) filled in the upward dividing groove 26 and / or the lower dividing groove 27 is a liquid packaging material, and after the liquid packaging material is solidified, the packaging body portion 23 is finally formed. With the help of the fluidity of the liquid packaging material, the packaging material (first packaging material and second packaging material) can fully contact the peripheral sides of the wafer-level lens 11, the protective cover plate 132, and the photosensitive chip 131. After the liquid packaging material is solidified, the formed packaging body portion 23 can also completely cover the peripheral sides of the wafer-level lens 11, the protective cover plate 132, and the photosensitive chip 131.

[0218] The packaging material can be glue or molding material. The first packaging material and the second packaging material provided in the upper dividing groove 26 and the lower dividing groove 27 can be the same or different. That is, the first packaging material and the second packaging material provided in the upper dividing groove 26 and the lower dividing groove 27 can both be glue, so that the final package joint portion 23 is composed of solidified glue; or the first packaging material and the second packaging material provided in the upper dividing groove 26 and the lower dividing groove 27 can both be molding material, so that the final package joint portion 23 is composed of solidified molding material; or the first packaging material and the second packaging material provided in the upper dividing groove 26 and the lower dividing groove 27 can both be molding material, so that the final package joint portion 23 is composed of solidified molding material. The first packaging material may be a molding material, and the second packaging material provided in the lower dividing groove 27 may be glue, so that the final packaging body 23 is composed of an upper packaging body 231 formed by solidifying the molding material at the top and a lower packaging body 23 formed by solidifying the glue at the bottom; or the first packaging material provided in the upper dividing groove 26 may be glue, and the second packaging material provided in the lower dividing groove 27 may be a molding material, so that the final packaging body 23 is composed of an upper packaging body 231 formed by solidifying the glue at the top and a lower packaging body 23 formed by solidifying the molding material at the bottom. Different packaging materials may be selected based on the width and depth of the upper dividing groove 26 and the lower dividing groove 27 formed by the dividing module panel 20. For example, a packaging material with better fluidity may be selected for an upper dividing groove 26 or a lower dividing groove 27 with a deeper depth or a narrower width, while a packaging material with poorer fluidity may be used for an upper dividing groove 26 or a lower dividing groove 27 with a shallower depth or a wider width, thereby making the first packaging material and the second packaging material different materials.

[0219] Similar to the manufacturing method of the camera module 10 in the first embodiment, in an example of this embodiment, the chip panel 24 uses a chip panel 24 as shown in Figures 7A and 7b, so that the distance between the photosensitive chips 131 can be adjusted again after the chip manufacturing is completed. The chip panel 24 includes a plurality of photosensitive chips 131, and a connecting portion 241 arranged between the plurality of photosensitive chips 131, and the connecting portion 241 is integrally formed between two adjacent photosensitive chips 131. Finally, the camera module 10 manufactured using the chip panel 24 with the connecting part 241 is shown in Figures 9B and 9C. The peripheral side of the photosensitive chip 131 is covered by the side connecting part 136, and the peripheral side of the side connecting part 136 is covered by the packaging body 12. The packaging body 12 indirectly covers the peripheral side of the photosensitive chip 131 by covering the peripheral side of the side connecting part 136. Specifically, the lower packaging body in the packaging body 12 indirectly covers the peripheral side of the photosensitive chip 131 by covering the peripheral side of the side connecting part 136.

[0220] In the first embodiment or the second embodiment of the aforementioned camera module 10, the lens panel 21 and the chip panel 24 are used to manufacture the camera module 10, which requires full consideration of the coordination between the lens panel 21 and the chip panel 24 and the need for multiple cutting. The present application further provides a more convenient manufacturing method and a camera module 10 manufactured by the method. Among them, Figures 11A to 11C show the third embodiment of the camera module 10 of the present application, which adopts the COB (Chip On Board) process to manufacture the photosensitive component 13. As shown in the figure, the camera module 10 includes a wafer-level lens 11, a photosensitive component 13 and a package 12, wherein the wafer-level lens 11 is arranged on the photosensitive path of the photosensitive component 13, and the package 12 is integrally formed on the wafer-level lens 11 and the photosensitive component 13, that is, the package 12 is integrally packaged and connected to the wafer-level lens 11 and the photosensitive component 13.

[0221] The photosensitive component 13 includes a circuit board 135 and a photosensitive chip 131 electrically connected to the circuit board 135. The photosensitive chip 131 is fixed to the circuit board 135. In a specific example of the present application, the back of the photosensitive chip 131 is adhered to the front of the circuit board body 1351 so that the photosensitive chip 131 is set on the circuit board 135.

[0222] Furthermore, the photosensitive component 13 also includes at least one lead 137, which is combined between the photosensitive chip 131 and the circuit board 135 mainboard for electrically connecting the photosensitive chip 131 and the circuit board 135 mainboard. The at least one lead 137 can be implemented as but not limited to gold wire, copper wire, aluminum wire, silver wire, etc.

[0223] In this embodiment, the electrical connection portion 133 is provided in the non-photosensitive area on the front surface of the photosensitive chip 131, and the lead 137 electrically connects the circuit board body 1351 and the electrical connection portion 133 to achieve circuit conduction between the circuit board body 1351 and the photosensitive chip 131, wherein the electrical connection portion 133 can be implemented as a plurality of solder pads. Specifically, the lead 137 electrically connects the solder pads on the circuit board body 1351 and the electrical connection portion 133 of the photosensitive chip 131 to achieve electrical connection.

[0224] More specifically, the lateral dimension of the photosensitive chip 131 is not larger than the lateral dimension of the circuit board body 1351, that is, along the height direction, the projection of the photosensitive chip 131 falls within the projection of the circuit board body 1351, so that the structure of the photosensitive component 13 is more compact and the lateral dimension of the photosensitive component 13 is avoided to increase.

[0225] In a specific example of this embodiment, the lateral dimension of photosensitive chip 131 is smaller than that of circuit board body 1351. That is, photosensitive chip 131 does not completely cover the front surface of circuit board body 1351, leaving the front surface of circuit board body 1351 exposed. Alternatively, the outermost projection of photosensitive chip 131 in the height direction is located inward of the outermost projection of circuit board body 1351. One end of lead 137 is disposed on the front surface of photosensitive chip 131, and the other end of lead 137 is disposed on the front surface of circuit board body 1351. This arrangement leaves sufficient space for lead 137, preventing it from bending and being damaged.

[0226] In another specific example of this embodiment, the lateral dimension of photosensitive chip 131 is equal to the lateral dimension of circuit board body 1351. That is, photosensitive chip 131 completely covers the front surface of circuit board body 1351. Alternatively, the outermost projection of photosensitive chip 131 along the height direction overlaps with the outermost projection of circuit board body 1351. One end of lead 137 is disposed on the front surface of photosensitive chip 131, and the other end of lead 137 is disposed on the side or back surface of circuit board body 1351. This arrangement can reduce the lateral dimension of circuit board 135, thereby preventing an increase in the lateral dimension of photosensitive assembly 13.

[0227] In an example of this embodiment, the wafer-level lens 11 is arranged on the photosensitive chip 131, the lateral dimension of the wafer-level lens 11 is smaller than the lateral dimension of the photosensitive chip 131, and the wafer-level lens 11 is fixed to the front of the photosensitive chip 131 by fixing it to the non-photosensitive area of ​​the photosensitive chip 131 through the support 112. In another example of this embodiment, the camera module 10 also includes a filter element 14, which is arranged between the wafer-level lens 11 and the photosensitive component 13, and the filter element 14 is fixed to the front of the photosensitive chip 131. The wafer-level lens 11 is fixed to the object side of the filter element 14, so that the wafer-level lens 11 is indirectly fixed to the front of the photosensitive chip 131; in another embodiment of the present application, the filter element 14 is designed to be smaller, and a certain area is still reserved in the non-photosensitive area of ​​the photosensitive chip 131 for fixing the wafer-level lens 11; in another embodiment of the present application, the wafer-level lens 11 has an infrared cutoff function as mentioned above, and the camera module 10 directly omits the filter element, thereby reducing the height of the camera module 10.

[0228] Continuing with reference to Figures 11A to 11C, the package body 12 is integrally formed with the wafer-level lens 11, the photosensitive chip 131 and the circuit board body 1351. The package body 12 covers at least a portion of the circuit board body 1351, at least a portion of the photosensitive chip 131, and at least a portion of the wafer-level lens 11. In a specific example, the package body 12 covers at least a portion of the front surface of the circuit board body 1351, the peripheral side of the photosensitive chip 131 and at least a portion of the non-photosensitive area of ​​the front surface of the photosensitive chip 131, and the peripheral side of the wafer-level lens 11.

[0229] It can be understood that the package body 12, the circuit board body 1351, the photosensitive chip 131 and the wafer-level lens 11 are integrated into one body, which enhances the structural strength of the camera module 10, makes the structure of the camera module 10 more compact, and achieves miniaturization.

[0230] The package body 12 extends in the horizontal direction to the non-photosensitive area of ​​the photosensitive chip 131 and the circuit board body 1351, thereby encapsulating the photosensitive chip 131 in the circuit board body 1351. The package body 12 extends in the height direction to the peripheral side of the wafer-level lens 11, thereby encapsulating the wafer-level lens 11 in the photosensitive chip 131. On the one hand, it increases the structural strength of the camera module 10, and on the other hand, it makes the structure of the camera module 10 more compact and the lateral size smaller.

[0231] Furthermore, the package body 12 surrounds the outside of the photosensitive chip 131 and the outside of the wafer-level lens 11. In particular, the package body 12 is closed and connected as a whole, so that it has good sealing properties, thereby placing the photosensitive chip 131 in a closed space, preventing the photosensitive chip 131 from being contaminated and affecting the imaging effect.

[0232] In one example of this embodiment, the package body 12 has a vertical outer side surface, and the lateral dimension of the upper portion of the package body 12 is equal to the lateral dimension of the bottom portion of the package body 12, as shown in Figures 11A and 11B; in another example of this embodiment, as shown in Figure 11C, the outer side surface of the package body 12 is inclined, the outer diameter of the package body 12 increases from top to bottom, and the lateral dimension of the bottom portion of the package body 12 is greater than the lateral dimension of the upper portion of the package body 12, thereby providing sufficient space for the leads 137 to avoid backlog of the leads 137 during the molding process of the package body 12 and causing damage to the leads 137, while providing a smaller head portion for the camera module 10, making the camera module 10 suitable for installation in a smaller space. Among them, the bottom portion of the package body 12 refers to the portion of the package body 12 located on the side of the photosensitive chip 131, and the upper portion of the package body 12 refers to the portion located on the side of the wafer-level lens 11.

[0233] Furthermore, the electrical connection part 133 on the photosensitive chip 131, the solder pad on the circuit board body 1351 and at least one lead 137 are all wrapped by the package body 12. The lead 137 is covered by the package body 12 and embedded in the package body 12, so that the lead 137 will not be directly exposed to the outside, so that the lead 137 is not easily affected by external factors to cause deformation, damage and other problems.

[0234] Specifically, the peripheral side of the light shielding portion 113 of the wafer-level lens 11 is also covered by the package body 12 . As shown in FIG. 11A , the top surface of the package body 12 is flush with the plane of the light shielding portion 113 . In another example of this embodiment, the shading portion 113 is arranged on the wafer-level lens 11 after the package body 12 is integrally formed on the peripheral side of the wafer-level lens 11. As shown in Figures 11B and 11C, the shading portion 113 is fixed to the top surface of the package body 12, and the shading portion 113 extends toward the wafer-level lens 11, thereby playing a shading role. In a specific example, the peripheral side of the object side of the first wafer-level lens 1111 located on the object side in the wafer-level lens assembly 111 of the wafer-level lens 11 is flush with the top surface of the package body 12, so that the shading portion 113 can also be fixed to the wafer-level lens assembly 111; in another specific example, the peripheral side of the object side of the first wafer-level lens 1111 located on the object side in the wafer-level lens assembly 111 of the wafer-level lens 11 is lower than the top surface of the package body 12, so that a gap is provided between the shading portion 113 and the wafer-level lens assembly 111. In another example of this embodiment, the shading portion 113 of the wafer-level lens 11 can be formed at the same time that the package body 12 is integrally formed on the side of the wafer-level lens 11. Specifically, the package body 12 covers at least a portion of the top surface of the wafer-level lens 11 to form the shading portion 113, and the shading portion 113 and the package body 12 are integrally formed on the top surface and the surrounding side of the wafer-level lens 11.

[0235] In this embodiment, the material of the package 12 can be a molding material, thereby forming a molded package. The package 12 is integrally formed with the wafer-level lens 11, the photosensitive chip 131, and the circuit board body 1351 through a molding process. The molding process requires the use of a molding mold, which is suitable for producing a smoother surface. The photosensitive chip 131 is moldedly connected to the circuit board body 1351, and the wafer-level lens 11 is moldedly connected to the photosensitive chip 131. In particular, the package 12 is molded on the photosensitive component 13 in a molding-on-chip (MOC) manner.

[0236] In other implementations of this embodiment, the material of the packaging body 12 may also be glue, thereby forming a glue packaging body.

[0237] In one example of this embodiment, the circuit board 135 includes a circuit board body 1351, a connecting tape 1352 and a connecting plate 1353, the photosensitive chip 131 is electrically connected to the circuit board body 1351, and the connecting tape 1352 connects and electrically conducts the circuit board body 1351 and the connecting plate 1353, as shown in Figures 11A and 11C; in another example of this embodiment, the circuit board 135 includes a circuit board body 1351 and a solder pad arranged on the back side of the circuit board 135, as shown in Figure 11B, the photosensitive chip 131 is arranged on the front side of the circuit board body 1351, and the circuit board 135 is electrically connected to an external electronic device through the solder pad located on the back side of the circuit board 135, wherein the solder pad on the back side of the circuit board body 1351 can also be replaced with a solder ball or other electrical connection medium.

[0238] Furthermore, a manufacturing method of the camera module 10 in the third embodiment is provided: providing a circuit board 135, the circuit board 135 including a circuit board body 1351, setting a photosensitive chip 131 on the circuit board body 1351, and electrically connecting the photosensitive chip 131 and the circuit board body 1351 through a lead 137; setting a wafer-level lens 11 above the photosensitive chip 131; and setting a package body 12 to cover the wafer-level lens 11, the photosensitive chip 131 and the circuit board body 1351.

[0239] In one example of this embodiment, the wafer-level lens 11 may be first fixed above the photosensitive chip 131, and then the photosensitive chip 131 and the circuit board body 1351 may be electrically connected via the leads 137. This prevents damage to the leads 137 during the installation of the wafer-level lens 11. Installing the leads 137 first and then the wafer-level lens 11 can prevent problems such as interference between the device installing the leads 137 and the wafer-level lens 11, which could cause the wafer-level lens 11 to be impacted.

[0240] In an example of this embodiment, a light shielding portion 113 setting step may be further included: a light shielding portion 113 is set on the object side of the camera module 10 to prevent stray light from entering the interior of the camera module 10.

[0241] In the above method of this embodiment, the package body 12 is provided by a molding process, for example, the package body 12 is formed by a molding process (Molding) or an insert molding process (Insert Molding). Specifically, the circuit board body 1351, the photosensitive chip 131 and the wafer-level lens 11 are placed in a modular molding mold, the molding material is filled into the modular molding mold, and the molding material is solidified to form the package body 12. The package body 12 wraps the circuit board body 1351, the non-photosensitive area of ​​the photosensitive chip 131 and the peripheral side of the wafer-level lens 11, so that the lens package body 12, the circuit board body 1351, the photosensitive chip 131 and the wafer-level lens 11 are integrated. Among them, the molding material can be selected from resin, nylon, LCP (Liquid Crystal Polymer), PP (Polypropylene), etc.

[0242] It is worth mentioning that the camera module 10 in the third embodiment can also be mass-produced by using a paneling method. A method for manufacturing the camera module 10 in the third embodiment is provided. As shown in FIG. 12 , the method for manufacturing the camera module 10 includes the following steps S710-S750:

[0243] Step S710 : providing a circuit board panel 28 . The circuit board panel 28 includes a plurality of connected circuit boards 135 . The circuit boards 135 include circuit board bodies 1351 . The circuit boards 135 can be connected to each other through connections between the circuit board bodies 1351 .

[0244] In step S720, a plurality of photosensitive chips 131 are disposed on the circuit board panel 28 and electrically connected to the circuit board panel 28. The plurality of photosensitive chips 131 are electrically connected to the circuit board panel 28 via leads 137. Specifically, the plurality of photosensitive chips 131 are respectively fixed to the plurality of circuit board bodies 1351 in the circuit board panel 28, and the plurality of photosensitive chips 131 and the plurality of circuit board bodies 1351 are electrically connected via leads 137.

[0245] In step S730, the wafer-level lenses 11 are respectively disposed on the photosensitive chips 131 so that the wafer-level lenses 11 are located on the photosensitive paths of the photosensitive chips 131. In one example, the wafer-level lenses 11 are respectively fixed to the non-photosensitive areas of the photosensitive chips 131 by adhesive media.

[0246] In step S740, a packaging material is filled between two adjacent wafer-level lenses 11 and two adjacent photosensitive chips 131, and the packaging material is cured to form a packaging body 23. The packaging body 23 is integrally bonded to the wafer-level lenses 11, the photosensitive chips 131, and the circuit board panel 28 to form a module panel 20. In this embodiment, the packaging material can be a liquid packaging material, which covers the wafer-level lenses 11, the photosensitive chips 131, and the circuit board panel 28 and is integrally bonded to the wafer-level lenses 11, the photosensitive chips 131, and the circuit board panel 28 after curing.

[0247] In step S750, the module panel 20 is segmented along the height direction to form a plurality of camera modules 10. The package body 23 and the circuit board panel 28 are segmented along the height direction to obtain a plurality of independent camera modules 10. The package body 23 is segmented to form a plurality of independent package bodies 12, and the circuit board panel 28 is segmented to form a plurality of independent circuit boards 135. The dashed lines shown in FIG12 indicate the segmentation locations.

[0248] In one example of this embodiment, the packaging material is a molding material, and the packaging body portion 23 is integrally bonded to the wafer-level lens 11, the photosensitive chip 131, and the circuit board panel 28 through a molding process. Specifically, in step S740, the circuit board panel 28, the multiple photosensitive chips 131 fixed to the circuit board panel 28, and the multiple wafer-level lenses 11 respectively fixed to the multiple photosensitive chips 131 are placed in a module molding mold, and the molding material is injected into the module molding mold. The molding material is cured to form the packaging body portion 23, and the packaging body portion 23 is integrally bonded to the wafer-level lens 11, the photosensitive chip 131, and the circuit board panel 28 to form a module panel 20. The packaging body 12 obtained by curing and cutting the packaging material composed of the molding material can be referred to as a molded packaging body.

[0249] In an example of this embodiment, step S740 may further include the step of setting a light-shielding layer 213 on the object side of the module panel 20, so that after dividing the module panel 20, a camera module 10 including a light-shielding portion 113 can be obtained, wherein the light-shielding layer 213 becomes a plurality of independent light-shielding portions 113 after being divided.

[0250] In an example of this embodiment, the plurality of wafer-level lenses 11 provided in step S730 include a light shielding portion 113 , and the light shielding portion 113 is disposed on the object side of the wafer-level lens assembly 111 .

[0251] It is worth mentioning that there is no order or correlation between step S710, step S720 and step S730. For example, the wafer-level lens 11 can be first fixed to the non-photosensitive area of ​​the photosensitive chip 131, and then the photosensitive chip 131 can be fixed to the circuit board panel 28 to form a semi-finished product integrating the circuit board panel 28, the photosensitive chip 131 and the wafer-level lens 11.

[0252] Furthermore, as shown in Figures 13 and 14, a fourth embodiment of the camera module 10 of the present application is provided. In this embodiment, a cover layer 29 is further introduced as a reference for manufacturing the module panel 20, and a single wafer-level lens 11 and a single photosensitive component 13 are flip-chip mounted on the cover layer 29. The manufacturing method is different from the first, second, and third embodiments of the aforementioned camera module 10. It does not require special adjustment of the distance between the multiple wafer-level lenses 11 in the lens panel 21, nor does it require special adjustment of the distance between the multiple photosensitive chips 131 in the chip panel 24, which is suitable for reducing manufacturing costs.

[0253] Figure 13 shows a structural schematic diagram of the fourth embodiment of the camera module 10 of the present application. As shown in the figure, the camera module 10 includes a wafer-level lens 11, a photosensitive component 13, a packaging body 12 and a light-transmitting cover plate 15. The wafer-level lens 11 is arranged on the light-sensitive path of the photosensitive component 13, the light-transmitting cover plate 15 is arranged on the top surface (object side) of the wafer-level lens 11, and the packaging body 12 is integrally combined with the light-transmitting cover plate 15, the wafer-level lens 11 and the photosensitive component 13.

[0254] The photosensitive component 13 includes a photosensitive chip 131 and an electrical connection portion 133 provided on the photosensitive chip 131. The photosensitive chip 131 is electrically connected to an external electronic device via the electrical connection portion 133. In a specific example, the photosensitive component 13 also includes a protective cover 132. The electrical connection portion 133 is provided on the back of the photosensitive chip 131. The protective cover 132 is provided on the photosensitive chip 131. The protective cover 132 is provided above the photosensitive chip 131 to protect the photosensitive chip 131. That is, in this specific example, the photosensitive chip 131 adopts a wafer-level CSP package. The photosensitive chip 131 is provided between the protective cover 132 and the electrical connection portion 133. The protective cover 132 and the electrical connection portion 133 are provided on opposite sides of the photosensitive chip 131. In this specific example, the wafer-level lens 11 is fixed to the protective cover 132 of the photosensitive component 13 and is thereby disposed on the photosensitive path of the photosensitive component 13. The wafer-level lens 11 is also fixed to the photosensitive component 13. In other examples of this embodiment, the photosensitive chip 131 may also be packaged using a COB process. The photosensitive component 13 includes a circuit board 135, a photosensitive chip 131 electrically connected to the circuit board 135, an electrical connection portion 133 disposed in a non-photosensitive area on the front side of the photosensitive chip 131, and at least one lead 137 for electrically connecting the photosensitive chip 131 and the circuit board 135. The lead 137 electrically connects the circuit board 135 and the electrical connection portion 133, thereby electrically conducting the photosensitive chip 131 and the circuit board 135.

[0255] The transparent cover 15 is fixed to the top surface of the wafer-level lens 11. The transparent cover 15 is flat and the image side of the transparent cover 15 is flat. In an example of this embodiment, the top surface of the wafer-level lens 11 is flat, so that the transparent cover 15 can be stably attached to the top surface of the wafer-level lens 11. Specifically, the wafer-level lens 11 includes a first wafer-level lens 1114, a second wafer-level lens 1115 and a third wafer-level lens 1116, wherein the three wafer-level lenses 1111 of the first wafer-level lens 1114, the second wafer-level lens 1115 and the third wafer-level lens 1116 each include a light-transmitting substrate 11111 and a lens unit 11112 arranged on one side of the light-transmitting substrate 11111, wherein the lens unit 11112 of the first wafer-level lens 1114 is located on the image side of the light-transmitting substrate 11111, the lens unit 11112 of the second wafer-level lens 1115 is located on the object side of the light-transmitting substrate 11111, and the lens unit 11112 of the third wafer-level lens 1116 is located on the image side of the light-transmitting substrate 11111. The first wafer-level lens 1114 and the second wafer-level lens 1115 are fixed to each other and the lens unit 11112 of the first wafer-level lens 1114 is opposite to the lens unit 11112 of the second wafer-level lens 1115. The second wafer-level lens 1115 and the third wafer-level lens 1116 are fixed to each other and the lens unit 11112 of the second wafer-level lens 1115 is opposite to the lens unit 11112 of the third wafer-level lens 1116. The second wafer-level lens 1115 and the third wafer-level lens 1116 are fixed by bonding between the light-transmitting substrate 11111. In this embodiment, the first wafer-level lens 1114, the second wafer-level lens 1115, and the third wafer-level lens 1116 can be fixed by an adhesive layer disposed therebetween, wherein the adhesive layer 1112 disposed between the light-transmitting substrate 11111 of the second wafer-level lens 1115 and the light-transmitting substrate 11111 of the third wafer-level lens 1116 can be formed of optical glue. The first wafer-level lens 1114, the second wafer-level lens 1115, and the third wafer-level lens 1116 form the wafer-level lens assembly 111 described in this application.

[0256] The light-transmitting cover plate 15 can be made of a light-transmitting material such as glass, and the light-transmitting cover plate 15 is suitable for transmitting light. In this embodiment, the lateral dimensions of the light-transmitting cover plate 15 are greater than the lateral dimensions of the wafer-level lens 11 and the photosensitive component 13, so that along the height direction, when viewed from the image side (below) to the object side (above) of the camera module 10, the light-transmitting cover plate 15 is exposed, so that when the package body 12 is set in the camera module 10, the package body 12 is integrally formed with a portion of the bottom surface (image side) of the light-transmitting cover plate 15, the peripheral side of the wafer-level lens 11, and the peripheral side of the photosensitive component 13. The package body 12 provides protection in the peripheral direction of the wafer-level lens 11 and the photosensitive component 13.

[0257] In this embodiment, the camera module 10 may further have an infrared cutoff function. Specifically, the transparent cover 15 can be made to have an infrared cutoff function so that the transparent cover 15 can be used as a filter element of the camera module 10 to filter out stray light such as infrared light that is not necessary for imaging in the incident light; or, the transparent substrate 11111 of any wafer-level lens 1111 in the wafer-level lens 11 can be made to have an infrared cutoff function, so that the wafer-level lens 11 has an infrared cutoff function, thereby filtering the imaging light entering the photosensitive chip 131; or, the protective cover 132 in the photosensitive component 13 can be made to have an infrared cutoff function, that is, the protective cover 132 can be used as a filter element, so that the protective cover 132 can filter the imaging light entering the photosensitive chip 131; or, a filter element 14 can be further added, and the filter element 14 has an infrared cutoff function. In a specific example, the filter element 14 is arranged above the protective cover 132, so that the filter element 14 is located on the photosensitive path of the photosensitive chip 131.

[0258] Furthermore, the camera module 10 also includes a light shielding portion 113, which is used to reduce stray light incident from the object side of the wafer-level lens 11. The light shielding portion 113 is arranged between the wafer-level lens 11 and the transparent cover plate 15. The light shielding portion 113 can be pre-formed on the object side of the first wafer-level lens 1114 of the wafer-level lens 11 or the image side of the protective cover plate 132 by silk screen printing, ink coating, or glue coating. The light shielding portion 113 can also be pre-formed and then arranged between the wafer-level lens 11 and the transparent cover plate 15.

[0259] In this embodiment, the camera module 10 can be formed by stacking a single wafer-level lens 11 and a single photosensitive component 13 on a protective cover 132 and integrating the protective cover 132, the wafer-level optical lens and the photosensitive component 13 through a packaging body 12; the camera module 10 can also be mass-produced by a panelization method.

[0260] 14 , a fourth embodiment of the manufacturing method of the camera module 10 in batches using a paneling method includes the following steps S810 - S830:

[0261] In step S810, a cover layer 29, a plurality of wafer-level lenses 11, and a plurality of photosensitive components 13 are provided. The plurality of wafer-level lenses 11 and the plurality of photosensitive components 13 are stacked and fixed on the cover layer 29 in the height direction to form a module panel 20. The plurality of wafer-level lenses 11 and the plurality of photosensitive components 13 are inverted and spaced apart from each other on the cover layer 29. The plurality of wafer-level lenses 11 and the plurality of photosensitive components 13 are aligned so that the image plane of the wafer-level lens 11 overlaps or nearly overlaps with the photosensitive area of ​​the photosensitive chip 131 of the photosensitive component 13. The cover layer 29, the plurality of wafer-level lenses 11, and the plurality of photosensitive components 13 can be fixed by providing an adhesive layer. The materials of the adhesive layers at the two locations can be the same or different. Multiple wafer-level lenses 11 are spaced apart from each other, multiple photosensitive components 13 are spaced apart from each other, and multiple wafer-level lenses 11 do not contact each other, so that there is a spacing (gap) between the multiple wafer-level lenses 11. In one example, the multiple wafer-level lenses 11 are fixed to the cover layer 29 at equal intervals.

[0262] In step S820, packaging material is filled between the plurality of wafer-level lenses 11 and the plurality of photosensitive components 13 so that the packaging material covers the image side (bottom side) of the cover layer 29, the peripheral side of the wafer-level lens 11, and the peripheral side of the photosensitive component 13, and the packaging material is cured to form a packaging body 23. The cured packaging body 23 is integrally combined with the image side of the cover layer 29 and the peripheral side of the wafer-level lens 11 and the photosensitive component 13. The image side of the cover layer 29 refers to the side of the cover layer 29 facing the wafer-level lens 11, that is, the bottom side of the cover layer 29.

[0263] Step S830: Segment the module panel 20 along the height direction, segmenting the package body 23 and the cover layer 29 to form a plurality of camera modules 10. The package body 23 is segmented to form the package body 12 of the camera module 10, and the cover layer 29 is segmented to form a plurality of independent light-transmitting cover plates 15.

[0264] In step S810, in the process of stacking and fixing multiple wafer-level lenses 11 and multiple photosensitive components 13 on the cover layer 29 along the height direction, the multiple wafer-level lenses 11 can be first fixed upside down on the cover layer 29, and then the multiple photosensitive components 13 can be aligned with the multiple wafer-level lenses 11 respectively and fixed upside down on the image side of the multiple wafer-level lenses 11; or the multiple wafer-level lenses 11 and the multiple photosensitive components 13 can be first fixed respectively to form a module semi-finished product, and then the module semi-finished product can be fixed upside down on the cover layer 29, thereby reducing the difficulty of alignment between the wafer-level lenses 11 and the photosensitive components 13.

[0265] In an example of this embodiment, the top surface of the wafer-level lens 11 matches the image side surface of the cover layer 29. The cover layer 29 is flat and the image side surface of the cover layer 29 is flat. Therefore, the wafer-level lens 11 with a flat top surface can be stably attached to the image side surface of the cover layer 29.

[0266] In an example of this embodiment, the module assembly 20 also includes a light-shielding layer 213 arranged between the wafer-level lens assembly 111 of the wafer-level lens 11 and the cover layer 29. A light-shielding layer 213 is set on the cover layer 29 by silk-screen printing, ink coating or glue coating, and a plurality of light-through holes are reserved on the light-shielding layer 213 to provide a channel for light from the wafer-level lens 11 to enter.

[0267] In this embodiment, since the wafer-level lens 11 and the photosensitive component 13 are fixed to the cover layer 29 in an inverted manner, the electrical connection part 133 of the photosensitive component 13 is not easily damaged during the manufacturing process. Therefore, in one example, the photosensitive component 13 provided in step S810 includes a photosensitive chip 131 and an electrical connection part 133 arranged on the back of the photosensitive chip 131.

[0268] In an example of this embodiment, in step S810 , a plurality of filter elements 14 are further provided, so that the plurality of filter elements 14 are respectively disposed between the plurality of wafer-level lenses 11 and the protective layer 22 .

[0269] In one example of this embodiment, the packaging material filled in step S820 is a liquid packaging material, and after the liquid packaging material is cured, the packaging body portion 23 is formed. Due to the fluidity of the liquid packaging material, the liquid packaging material can fully contact the bottom surface of the cover layer 29 and the peripheral sides of the wafer-level lens 11 and the photosensitive component 13. After the liquid packaging material is cured, the formed packaging body portion 23 can also completely cover the bottom surface of the cover layer 29 and the peripheral sides of the wafer-level lens 11 and the photosensitive component 13. The packaging material is preferably a material that is black after curing, so that the packaging body 12 in the camera module 10 is black and has a good stray light shielding effect.

[0270] In a specific example, the packaging material can be glue, and glue is filled between the multiple wafer-level lenses 11 and the multiple photosensitive components 13. The packaging body 23 formed after the glue is cured can be divided to obtain a glue package, that is, the peripheral sides of the wafer-level lenses 11 and the photosensitive components 13 are packaged using a glue process. Specifically, the glue uses opaque glue, such as black glue, so that the packaging material can reduce the entry of stray light from the side. Furthermore, in order to avoid the presence of bubbles in the glue, so that the packaging body 23 formed after curing cannot completely cover the sides of the wafer-level lenses 11 and the photosensitive components 13, glue can be filled between the multiple wafer-level lenses 11 and the multiple photosensitive components 13 in a spray manner to avoid the generation of bubbles, or glue can be filled between the multiple wafer-level lenses 11 and the multiple photosensitive components 13 in a dot-shaped glue painting manner.

[0271] In another specific example, the packaging material can also be a molding material. The module panel 20 is set in a module molding mold, and the molding material is injected into the module molding mold to make the molding material flow between the multiple wafer-level lenses 11 and the multiple photosensitive components 13, so that the molding material covers the image side (bottom side) of the plate layer 29, the peripheral side of the wafer-level lens 11 and the peripheral side of the photosensitive component 13, and then the molding material is solidified to form a packaging body 23. The packaging body 23 can be divided to obtain a molded package. The molding material can be solidified by cooling or heating, which is specifically determined by the properties of the molding material.

[0272] Different packaging materials can be selected based on the depth and width of the gaps between the multiple wafer-level lenses 11 and the multiple photosensitive components 13. For example, a packaging material with better fluidity can be selected for gaps with deeper depth or narrower width, while a packaging material with poorer fluidity can be used for gaps with shallower depth or wider width.

[0273] In the present application, the third and fourth embodiments of the camera module 10 do not use the lens panel 21 or the chip panel 24 in a paneled state for direct manufacturing, so that the wafer-level lens 11 and the photosensitive chip 131 can be aligned separately, reducing the assembly tolerance, thereby improving the imaging quality of the camera module 10.

[0274] It is worth noting that in the present application, the packaging material is preferably a material that is black after curing, so that the packaging body 12 in the camera module 10 is black, which has a better anti-stray light effect.

[0275] It is worth noting that in the present application, adjacent wafer-level lenses 1111 are fixed to each other and form a space filled with air. However, since the wafer-level lens 11 or the camera module 10 using the wafer-level lens 11 must undergo a baking process, the air between the adjacent wafer-level lenses 1111 expands under high temperature, which poses a risk of causing the relative positions of the adjacent wafer-level lenses 1111 to change. In order to reduce the above-mentioned risks, the air between adjacent wafer-level lenses 1111 can be reduced. In one embodiment, the surface shapes of the opposite surfaces of adjacent wafer-level lenses 1111 are opposite. For example, in the camera module 10 shown in Figure 13, the surface shape of the image side of the first wafer-level lens 1114 is concave, and the surface shape of the object side of the second wafer-level lens 1115 is convex. The two cooperate with each other to reduce the average gap between the first wafer-level lens 1114 and the second wafer-level lens 1115, thereby reducing the air between the first wafer-level lens 1114 and the second wafer-level lens 1115, reducing the risk of degradation of imaging quality at high temperatures.

[0276] The above describes the basic principles, main features, and advantages of the present application. Those skilled in the art should understand that the present application is not limited to the above-described embodiments. The above-described embodiments and the specification merely illustrate the principles of the present application. Various changes and improvements may be made to the present application without departing from the spirit and scope of the present application. These changes and improvements fall within the scope of the present application for which protection is sought. The scope of protection claimed by the present application is defined by the appended claims and their equivalents.

Claims

1. A camera module, characterized in that: include: Wafer-level lens; A photosensitive component, wherein the wafer-level lens is arranged on a light-sensing path of the photosensitive component, and the photosensitive component includes a photosensitive chip and a protective cover plate provided above the photosensitive chip; A packaging body is integrally formed on the peripheral side of the wafer-level lens and the peripheral side of the protective cover.

2. The camera module according to claim 1, wherein: The lateral dimension of the protective cover is smaller than the lateral dimension of the photosensitive chip, and the packaging body is integrally formed on at least a portion of the front surface of the photosensitive chip.

3. The camera module according to claim 1, wherein: The photosensitive component also includes a side connecting portion, which is integrally formed on the peripheral side of the photosensitive chip. The lateral dimension of the side connecting portion is larger than the lateral dimension of the protective cover plate, and the packaging body is integrally formed on at least a portion of the front side of the side connecting portion.

4. The camera module according to any one of claims 1 to 3, wherein: The camera module also includes a filter element arranged between the wafer-level lens and the photosensitive component, and the packaging body is integrally formed on the peripheral side of the filter element.

5. The camera module according to any one of claims 1 to 3, wherein: The photosensitive chip also includes an electrical connection portion arranged on the back side of the photosensitive chip.

6. The camera module according to claim 5, wherein: The photosensitive component also includes a circuit board and electronic components. The circuit board is arranged on the back of the photosensitive chip. The circuit board includes a circuit board body and a bottom packaging part. The photosensitive chip is arranged on the front of the circuit board body and is electrically connected to the circuit board body through the electrical connection part. The electronic components are arranged on the back of the circuit board body. The bottom packaging part is integrally formed on the back of the circuit board body through a molding process, and the electronic components are molded inside the bottom packaging part.

7. A method for manufacturing a camera module, characterized in that: include: Stacking and fixing a lens panel, a protective layer and a chip panel in a height direction to form a module panel; Splitting the lens panel and the protective layer in the module panel along the height direction to form a plurality of wafer-level lenses and a plurality of protective cover plates, wherein an upper splitting groove is formed between two adjacent wafer-level lenses and two adjacent protective cover plates; Filling the upper dividing groove with a packaging material, curing the packaging material to form a packaging body portion, wherein the packaging body portion is integrally formed on the periphery of the wafer-level lens and the protective cover plate; The module panel is divided along the height direction, and the package joint part and the chip panel are divided to form a plurality of camera modules.

8. The method for manufacturing a camera module according to claim 7, wherein: After the step of curing the packaging material to form the packaging body portion, an electrical connection portion is provided on the back side of the plurality of photosensitive chips of the chip panel.

9. The method for manufacturing a camera module according to claim 7, wherein: The chip panel includes a plurality of photosensitive chips and a connecting portion arranged between the plurality of photosensitive chips.

10. The method for manufacturing a camera module according to any one of claims 7 to 9, wherein: The packaging material is a molding material or glue.

11. A camera module, characterized in that: include: Wafer-level lens; A photosensitive chip, wherein the wafer-level lens is arranged on a photosensitive path of the photosensitive chip; A circuit board, wherein the photosensitive chip is arranged on the circuit board; A packaging body is integrally formed with the wafer-level lens, the photosensitive chip and the circuit board.

12. The camera module according to claim 11, wherein: The camera module further includes at least one lead, at least one lead is arranged between the photosensitive chip and the circuit board, and at least one lead is wrapped by the packaging body.

13. The camera module according to claim 11, wherein: The package body covers at least a portion of the front surface of the circuit board, the peripheral side and at least a portion of the front surface of the photosensitive chip, and the peripheral side of the wafer-level lens.

14. The camera module according to claim 13, wherein: The photosensitive chip includes a photosensitive area and a non-photosensitive area surrounding the photosensitive area. The package body extends horizontally to the non-photosensitive area of ​​the photosensitive chip, and extends vertically to the top of the wafer-level lens. The package body is integrally formed on the peripheral side of the photosensitive chip and the peripheral side of the wafer-level lens.

15. The camera module according to claim 14, wherein: The package body has a vertical outer side surface, and a lateral dimension of a top portion of the package body is equal to a lateral dimension of a bottom portion of the package body.

16. The camera module according to claim 14, wherein: The outer side surface of the package body is inclined, the outer diameter of the package body increases from top to bottom, and the lateral dimension of the bottom of the package body is greater than the lateral dimension of the upper part of the package body.

17. A method for assembling a camera module, characterized in that: include: Providing a circuit board panel; Arrange a plurality of photosensitive chips on the circuit board panel, and electrically connect the plurality of photosensitive chips to the circuit board panel; Arranging a plurality of wafer-level lenses on the plurality of photosensitive chips, wherein the plurality of wafer-level lenses are respectively located on the photosensitive paths of the plurality of photosensitive chips; Filling packaging material between two adjacent wafer-level lenses and two adjacent photosensitive chips, curing the packaging material to form a packaging body portion, wherein the packaging body portion is integrally combined with the wafer-level lenses, the photosensitive chips and the circuit board panel to form a module panel; The module panels are divided along the height direction to form a plurality of camera modules.

18. The camera module assembly method according to claim 17, wherein: The packaging material is a molding material, and the packaging body is integrally formed with the wafer-level lens, the photosensitive chip and the circuit board panel through a molding process.

19. The method for assembling a camera module according to claim 18, wherein: The package body is formed after cutting the package body, and multiple circuit boards are formed after cutting the circuit board panel. The package body covers at least a part of the front of the circuit board, the peripheral side and at least a part of the front of the photosensitive chip, and the peripheral side of the wafer-level lens.

20. The camera module assembly method according to claim 19, wherein: After the step of forming the module panel, a light shielding layer is provided on the object side of the module panel. The light shielding layer is provided on the top surface of the package body portion and extends toward the wafer-level lens.

21. A camera module, characterized in that: include: Wafer-level lens; A photosensitive component, wherein the wafer-level lens is arranged on a light-sensing path of the photosensitive component, and the photosensitive component includes a photosensitive chip and a protective cover plate provided above the photosensitive chip; A packaging body is integrally formed on the peripheral side of the wafer-level lens, the peripheral side of the protective cover plate, and the peripheral side of the photosensitive chip.

22. The camera module according to claim 21, wherein: The package body includes an upper package body and a lower package body. The upper package body is integrally formed on the peripheral side of the wafer-level lens and the peripheral side of the protective cover plate, and the lower package body is integrally formed on the peripheral side of the photosensitive chip.

23. The camera module according to claim 22, wherein: The photosensitive component also includes a side connecting portion, which is integrally formed on the peripheral side of the photosensitive chip, and the lower packaging body is integrally formed on the peripheral side of the side connecting portion.

24. The camera module according to claim 23, wherein: The lateral dimension of the photosensitive chip is smaller than the lateral dimension of the protective cover.

25. The camera module according to any one of claims 21 to 24, wherein: The photosensitive chip also includes an electrical connection portion arranged on the back side of the photosensitive chip.

26. The camera module according to any one of claims 21 to 24, wherein: The camera module also includes a filter element arranged between the wafer-level lens and the photosensitive component, and the upper packaging body is integrally formed on the peripheral side of the filter element.

27. A method for manufacturing a camera module, characterized in that: include: Stacking and fixing a lens panel, a protective layer and a chip panel in a height direction to form a module panel; Splitting the lens panel and the protective layer in the module panel along the height direction to form a plurality of wafer-level lenses and a plurality of protective cover plates, wherein an upper splitting groove is formed between two adjacent wafer-level lenses and two adjacent protective cover plates; Filling the upper dividing groove with a first packaging material, and curing the first packaging material to form an upper packaging connecting portion; Splitting the chip panel in the module panel along the height direction to form a plurality of independent photosensitive chips, with a splitting groove formed between two adjacent photosensitive chips; Filling the lower dividing groove with a second packaging material, curing the second packaging material to form a lower packaging connecting portion, wherein the lower packaging connecting portion is integrally formed with the upper packaging connecting portion to form a packaging connecting portion; The module panels are divided along the height direction to form a plurality of camera modules.

28. The method for manufacturing a camera module according to claim 27, wherein: After the step of curing the first packaging material to form the upper packaging connecting portion, an electrical connection portion is provided on the back side of the plurality of photosensitive chips of the chip panel.

29. The method for manufacturing a camera module according to claim 27, wherein: The chip panel includes a plurality of photosensitive chips and a connecting portion arranged between the plurality of photosensitive chips.

30. The method for manufacturing a camera module according to any one of claims 27 to 29, wherein: The first packaging material and the second packaging material are made of different materials.

31. A camera module, characterized in that: include: Wafer-level lens; A light-transmitting cover plate, wherein the light-transmitting cover plate is fixed to the top surface of the wafer-level lens; A photosensitive component, wherein the wafer-level lens is arranged on a photosensitive path of the photosensitive component; A packaging body is integrally formed on a portion of the bottom surface of the light-transmitting cover plate, a side surface of the wafer-level lens, and a side surface of the photosensitive component.

32. The camera module according to claim 31, wherein: The transverse dimension of the light-transmitting cover plate is larger than the transverse dimension of the wafer-level lens and the photosensitive component, and the top surface of the wafer-level lens is a plane.

33. The camera module according to claim 31, wherein: The light-transmitting cover plate has an infrared cutoff function.

34. The camera module according to any one of claims 31 to 33, wherein: The camera module further includes a light shielding portion, which is arranged between the wafer-level lens and the transparent cover.

35. The camera module according to any one of claims 31 to 33, wherein: The photosensitive component includes a photosensitive chip, a protective cover plate covered above the photosensitive chip, and an electrical connection part arranged on the back of the photosensitive chip.

36. A method for manufacturing a camera module, characterized in that: include: Providing a cover layer, a plurality of wafer-level lenses, and a plurality of photosensitive components, stacking and fixing the plurality of wafer-level lenses and the plurality of photosensitive components on the cover layer in a height direction to form a module assembly, wherein the plurality of wafer-level lenses and the plurality of photosensitive components are inverted and spaced apart from each other on the cover layer; Filling a packaging material between the plurality of wafer-level lenses and the plurality of photosensitive components so that the packaging material covers the image side of the cover layer, the peripheral side of the wafer-level lenses, and the peripheral side of the photosensitive components, and curing the packaging material to form a packaging joint portion; The module panels are divided along the height direction, and the package body and the cover layer are divided to form a plurality of camera modules.

37. The method for manufacturing a camera module according to claim 36, wherein: The image side surface of the cover layer is a plane, and the top surface of the wafer-level lens is a plane.

38. The method for manufacturing a camera module according to claim 36, wherein: A light shielding layer is provided on the cover plate layer by means of silk screen printing, ink coating or glue coating, and a plurality of light through holes are reserved on the light shielding layer to provide a channel for the light of the wafer-level lens to be incident.

39. The method for manufacturing a camera module according to any one of claims 36 to 39, wherein: The packaging material is a molding material. The module panel is set in a module molding mold, and the molding material is injected into the module molding mold to make the molding material flow between the multiple wafer-level lenses and the multiple photosensitive components, so that the molding material covers the image side of the cover layer, the peripheral side of the wafer-level lens and the peripheral side of the photosensitive component.

40. The method for manufacturing a camera module according to any one of claims 36 to 39, wherein: The packaging material is glue, which is filled between the multiple wafer-level lenses and the multiple photosensitive components by spraying or dotting the glue.

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