An electromagnetic microwave-assisted polishing system

Abstract

This invention discloses an electromagnetic microwave-assisted polishing system, relating to the technical field of polishing. It includes an upper polishing head, a polishing spindle, a conductive slip ring, a worktable, a microwave emitting device, a lower polishing plate, and a controller. The polishing spindle is located at the bottom of the upper polishing head, and the conductive slip ring is located at the bottom of the spindle. The controller is electrically connected to the conductive slip ring via a wire. The conductive slip ring is electrically connected to the microwave emitting device. The polishing spindle is fixedly mounted to the worktable via a spindle connector. The lower polishing plate is located at the bottom of the worktable. The microwave emitting device is located within the inner cavity of the worktable and is used to increase the temperature of water molecules in the processing area through friction. A worktable groove is formed at the bottom of the worktable, and multiple worktable groove openings are formed on the groove, which can achieve frictional vibration of water molecules in the processing area, change the temperature of the processing area, and improve the dispersion of the abrasive.

Description

Technical Field

[0001] This invention relates to the field of polishing technology, and more specifically, to an electromagnetic microwave-assisted polishing system. Background Technology

[0002] In the polishing of hard and brittle materials, temperature is a crucial factor affecting the final polishing effect, and temperature variations influence the polishing process performance. Polishing temperature has a significant impact on the processing efficiency and surface quality of sapphire. During polishing, increased temperature accelerates the chemical reaction between the chemical components in the polishing solution and the processed material, improving the removal rate and achieving a better surface quality. Both excessively high and low temperatures negatively affect the processing effect. Low temperatures in the processing area reduce the chemical reaction rate, resulting in mechanical removal exceeding chemical removal and causing damage to the polished workpiece surface. Conversely, excessively high temperatures cause the chemical reaction rate to exceed mechanical removal, leading to surface corrosion, residue buildup, and reduced surface quality. A suitable temperature maintains a balance between chemical and mechanical processes, resulting in a better polishing outcome.

[0003] The abrasive in the polishing slurry is also a major factor affecting the processing effect. During processing, the abrasive in the polishing slurry may agglomerate, causing scratches on the workpiece surface. Workpiece fixation during polishing is usually achieved by using paraffin wax to adhere the workpiece to the carrier plate. However, when the processing temperature is too high, the polishing pad is prone to deformation, and the paraffin wax softens, reducing its fixing effect and causing the workpiece to fall off, resulting in surface damage or even cracking.

[0004] To address the aforementioned issues, we provide an electromagnetic microwave-assisted polishing system.

[0005] The information disclosed above in this background section is only for enhancing the understanding of the background section of this invention, and therefore may include prior art that is not known to those skilled in the art. Summary of the Invention

[0006] To address the problems mentioned in the background section, the present invention provides an electromagnetic microwave-assisted polishing system.

[0007] The present invention provides an electromagnetic microwave-assisted polishing system with the following technical solution:

[0008] An electromagnetic microwave-assisted polishing system includes an upper polishing head, a polishing spindle, a conductive slip ring, a worktable, a microwave emitting device, a lower polishing plate, and a controller. The polishing spindle is located at the bottom of the upper polishing head, and the conductive slip ring is located at the bottom of the polishing spindle. The controller is electrically connected to the conductive slip ring via a wire. The conductive slip ring is electrically connected to the microwave emitting device. The polishing spindle is fixedly mounted to the worktable via a spindle connector. The lower polishing plate is located at the bottom of the worktable. The microwave emitting device is located in the inner cavity of the worktable and is used to increase the temperature of water molecules in the processing area through friction. A worktable groove is formed at the bottom of the worktable, and multiple worktable groove openings are formed on the worktable groove.

[0009] Preferably, the microwave transmitting device includes a magnetron, a magnetron transmitting port, and a magnetron output terminal; the interior of the carrying tray has an inner wire groove, and the magnetron output terminal is assembled at the outlet of the inner wire groove; the magnetron is assembled in the inner cavity of the carrying tray, the magnetron output terminal is electrically connected to the magnetron through a magnetron power line, the magnetron transmitting port is assembled at the bottom of the magnetron; and the magnetron output terminal is electrically connected to the conductive slip ring.

[0010] Preferably, the outer surface of the magnetron is wrapped with a waterproof and heat-insulating material.

[0011] Preferably, a waveguide is provided at the bottom of the magnetron, and the magnetron transmitting port is arranged inside the waveguide.

[0012] Preferably, the inner cavity of the loading tray is also equipped with a microwave-resistant infrared temperature sensor, which is electrically connected to the conductive slip ring through an infrared temperature sensor signal line.

[0013] Preferably, the detection end of the microwave-resistant infrared temperature sensor is arranged inside the waveguide.

[0014] Preferably, a heat insulation ring is fitted between the spindle joint and the loading tray.

[0015] Preferably, the spindle connector and the loading tray are assembled and connected by a plurality of M6 screws.

[0016] Preferably, the tray includes two connecting trays, and the two connecting trays are assembled and connected by a plurality of M10 screws.

[0017] Preferably, the controller is equipped with a temperature display, a running indicator light, a power adjustment knob, and a controller switch button.

[0018] In summary, the present invention has the following beneficial technical effects:

[0019] 1. By placing hard and brittle materials (such as sapphire) on the lower platen of the polishing machine and covering them with the loading groove at the bottom of the loading plate, and then controlling the microwave power of the microwave transmitter (the power signal is transmitted by the conductive slip ring and the wire) through the controller, the controller controls the microwave transmitter to raise the temperature of the water molecules in the processing area through friction. Through this structural design, it is possible to change the temperature of the processing area by causing the water molecules in the processing area to vibrate through friction, which improves the dispersion of abrasive to a certain extent. This solves the problems of slow heating and low heating rate in the existing grinding and polishing process that relies on the friction between the workpiece and the polishing pad, and solves the problems of poor processing quality and low material removal rate.

[0020] 2. It provides a more efficient polishing method, solving problems such as instability at high temperatures when using traditional paraffin wax to fix workpieces.

[0021] 3. It meets the high-speed rotation processing requirements of polished workpieces, and can effectively improve the surface quality and material removal rate of polished workpieces.

[0022] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the invention will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of a polishing system based on electromagnetic microwave assisted polishing in an embodiment of the present invention;

[0024] Figure 2 This is a schematic diagram of the structure of the carrier in an embodiment of the present invention.

[0025] Explanation of reference numerals in the attached diagram: 1. Polishing machine upper head; 2. Polishing machine spindle; 3. Conductive slip ring; 4. Spindle connector; 5. Loading tray; 6. Polishing machine lower tray; 7. Wire; 8. Controller; 9. M6 screw; 10. Magnetron output terminal; 11. Infrared temperature sensor signal line; 12. Heat insulation ring; 13. M10 screw; 14. Loading groove opening; 15. Loading groove; 16. Loading tray inner wire groove; 17. Magnetron power cord; 18. Microwave-resistant infrared temperature sensor; 19. Waveguide; 20. Magnetron; 21. Magnetron transmitter port. Detailed Implementation

[0026] The following is in conjunction with the appendix Figures 1 to 2 The present invention will be described in further detail below.

[0027] It should be noted that the accompanying drawings are schematic and not to scale. For clarity and convenience, the relative dimensions and proportions of the parts shown are exaggerated or reduced in size; all dimensions are merely illustrative and not limiting. Furthermore, the same reference numerals are used for the same structures, elements, or fittings appearing in more than two drawings to indicate similar features.

[0028] This invention discloses an electromagnetic microwave-assisted polishing system. (Refer to...) Figures 1 to 2 An electromagnetic microwave-assisted polishing system includes an upper polishing head 1, a polishing spindle 2, a conductive slip ring 3, a worktable 5, a microwave emitting device, a lower polishing plate 6, and a controller 8. The polishing spindle 2 is located at the bottom of the upper polishing head 1, and the conductive slip ring 3 is located at the bottom of the polishing spindle 2. The controller 8 is electrically connected to the conductive slip ring 3 via a wire 7. The conductive slip ring 3 is electrically connected to the microwave emitting device. The polishing spindle 2 is fixedly mounted to the worktable 5 via a spindle connector 4. The lower polishing plate 6 is located at the bottom of the worktable 5. The microwave emitting device is located in the inner cavity of the worktable 5 and is used to increase the temperature of the processing area by friction of water molecules. The bottom of the worktable 5 has a worktable groove 15, and the worktable groove 15 has multiple worktable groove openings 14. The worktable 5 is made of high-hardness steel.

[0029] Specifically, a hard and brittle material (such as sapphire) is placed on the lower platen 6 of the polishing machine and covered by the loading groove 15 at the bottom of the loading plate 5. Then, the microwave power of the microwave emitting device is adjusted by the controller 8 (the power signal is transmitted by the conductive slip ring 3 and the wire 7). The controller 8 controls the microwave emitting device to raise the temperature of the processing area by friction of water molecules. Through this structural design, the temperature of the processing area can be changed by friction vibration of water molecules, which improves the dispersion of abrasive. This solves the problems of slow heating and low heating rate in the existing grinding and polishing process that relies on friction between the workpiece and the polishing pad, and solves the problems of poor processing quality and low material removal rate.

[0030] It provides a more efficient polishing method, solving problems such as instability at high temperatures when using traditional paraffin wax to fix workpieces;

[0031] Meeting the high-speed rotation processing requirements of polished workpieces can effectively improve the surface quality and material removal rate of polished workpieces.

[0032] like Figure 2As shown, in one embodiment of the present invention, the microwave transmitting device includes a magnetron 20, a magnetron transmitting port 21, and a magnetron output terminal 10; the interior of the tray 5 is provided with an inner tray groove 16, and the magnetron output terminal 10 is assembled at the outlet of the inner tray groove 16; the magnetron 20 is assembled in the inner cavity of the tray 5, the magnetron output terminal 10 is electrically connected to the magnetron 20 through a magnetron power line 17, the magnetron transmitting port 21 is assembled at the bottom of the magnetron 20; the magnetron output terminal 10 is electrically connected to a conductive slip ring 3.

[0033] Specifically, the magnetron 20 generates microwaves and sends them to the loading groove 15 through the magnetron emission port 21, thereby increasing the temperature of the processing area due to friction of water molecules.

[0034] like Figure 2 As shown, in one embodiment of the present invention, the outer surface of the magnetron 20 is wrapped with a waterproof and heat-insulating material.

[0035] like Figure 2 As shown, in one embodiment of the present invention, a waveguide 19 is provided at the bottom of the magnetron 20, and the magnetron transmitting port 21 is arranged inside the waveguide 19. The waveguide 19 can ensure that the microwave is well conducted to the loading groove 15.

[0036] like Figure 2 As shown, in one embodiment of the present invention, an anti-microwave infrared temperature sensor 18 is also installed in the inner cavity of the tray 5. The anti-microwave infrared temperature sensor 18 is electrically connected to the conductive slip ring 3 through the infrared temperature sensor signal line 11. By setting the anti-microwave infrared temperature sensor 18, the temperature of the processing area can be detected in real time, and the microwave power can be adjusted by the controller 8 in a timely manner according to the displayed temperature.

[0037] like Figure 2 As shown, in one embodiment of the present invention, the detection end of the microwave-resistant infrared temperature sensor 18 is arranged inside the waveguide 19.

[0038] like Figure 2 As shown, in one embodiment of the present invention, a heat insulation ring 12 is assembled between the spindle connector 4 and the loading disk 5.

[0039] like Figure 2 As shown, in one embodiment of the present invention, the spindle connector 4 and the loading tray 5 are assembled and connected by a plurality of M6 screws 9.

[0040] like Figure 2 As shown, in one embodiment of the present invention, the tray 5 includes two connecting trays, and the two connecting trays are assembled and connected by a plurality of M10 screws 13.

[0041] like Figure 1As shown, in one embodiment of the present invention, the controller 8 is provided with a temperature display, a running indicator light, a power adjustment knob, and a controller switch button.

[0042] All standard parts used in this invention can be purchased from the market, and irregular parts can be customized according to the description and drawings. The specific connection methods of each part adopt conventional methods such as bolts, rivets, and welding that are mature in the prior art. The machinery, parts and equipment adopt conventional models in the prior art, and the circuit connection adopts conventional connection methods in the prior art, which will not be described in detail here.

[0043] The implementation principle of an electromagnetic microwave-assisted polishing system according to an embodiment of the present invention is as follows: a hard and brittle material (such as sapphire) is placed on the lower plate 6 of the polishing machine and covered by the loading groove 15 at the bottom of the loading plate 5. Then, the microwave power of the microwave emitting device is adjusted by the controller 8 (the power signal is transmitted by the conductive slip ring 3 and the wire 7). The controller 8 controls the microwave emitting device to increase the temperature of the water molecules in the processing area through friction. Through this structural design, the water molecules in the processing area can be vibrated by friction, which changes the temperature of the processing area and improves the dispersion of the abrasive to a certain extent.

[0044] The microwave transmitting device is used by generating microwaves through the operation of the magnetron 20 and sending them to the loading groove 15 through the magnetron transmitting port 21, thereby increasing the temperature of the processing area due to the friction of water molecules.

[0045] By setting up an anti-microwave infrared temperature sensor 18, the temperature of the processing area can be detected in real time, and the microwave power can be adjusted by the controller 8 in a timely manner according to the displayed temperature.

[0046] In the description of this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. "A plurality of" means two or more, unless otherwise explicitly specified.

[0047] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0048] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0049] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0050] The accompanying drawings of the embodiments disclosed in this invention only involve structures relevant to the embodiments disclosed in this invention. Other structures can be referred to with common designs. Unless otherwise specified, the same embodiment and different embodiments of this invention can be combined with each other.

[0051] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An electromagnetic microwave based assisted polishing system, characterized in that, The utility model relates to a polishing machine microwave heating device, including: The polishing machine upper head (1), polishing machine main shaft (2), conductive slip ring (3), object table (5), microwave emission device, polishing machine lower disc (6) and controller (8); The polishing machine main shaft (2) is arranged at the bottom of the polishing machine upper head (1), and the conductive slip ring (3) is arranged at the bottom of the polishing machine main shaft (2); The controller (8) is electrically connected with the conductive slip ring (3) through a wire (7); The conductive slip ring (3) is electrically connected with the microwave emission device; The polishing machine main shaft (2) is fixedly arranged with the object table (5) through a main shaft joint (4); The polishing machine lower disc (6) is arranged at the bottom of the object table (5); The microwave emission device is arranged in the inner cavity of the object table (5) and is used for frictionally increasing the temperature of water molecules in a processing area; A plurality of object table recess groove openings (14) are arranged on the object table recess groove (15) at the bottom of the object table (5); The microwave emission device comprises a magnetron (20), a magnetron emission port (21) and a magnetron outlet terminal (10); An object table inner wire groove (16) is arranged in the object table (5), and the magnetron outlet terminal (10) is arranged at the outlet of the object table inner wire groove (16); The magnetron (20) is arranged in the inner cavity of the object table (5), the magnetron outlet terminal (10) is electrically connected with the magnetron (20) through a magnetron power line (17), and the magnetron emission port (21) is arranged at the bottom of the magnetron (20); The magnetron outlet terminal (10) is electrically connected with the conductive slip ring (3).

2. The electromagnetic microwave-assisted polishing system of claim 1, wherein: The magnetron (20) is wrapped with a waterproof heat insulation material on the outer side.

3. The electromagnetic microwave assisted polishing system of claim 2, wherein: A waveguide tube (19) is arranged at the bottom of the magnetron (20), and the magnetron emission port (21) is arranged in the waveguide tube (19).

4. The electromagnetic microwave-assisted polishing system of claim 3, wherein: An anti-microwave infrared temperature sensor (18) is further arranged in the inner cavity of the object table (5), and the anti-microwave infrared temperature sensor (18) is electrically connected with the conductive slip ring (3) through an infrared temperature sensor signal line (11).

5. The electromagnetic microwave assisted polishing system of claim 4, wherein: The detection end of the anti-microwave infrared temperature sensor (18) is arranged in the waveguide tube (19).

6. The electromagnetic microwave assisted polishing system of claim 1, wherein: A heat insulation ring (12) is arranged between the main shaft joint (4) and the object table (5).

7. The electromagnetic microwave assisted polishing system of claim 6, wherein: The main shaft joint (4) and the object table (5) are assembled and connected through a plurality of M6 screws (9).

8. The electromagnetic microwave assisted polishing system of claim 1, wherein: The object table (5) comprises two connecting discs, and the two connecting discs are assembled and connected through a plurality of M10 screws (13).

9. The electromagnetic microwave assisted polishing system of claim 1, wherein: A temperature display, an operation indicating lamp, a power adjusting knob and a controller switch button are arranged on the controller (8).

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