A high-precision circuit additive manufacturing method based on aerosol printing

Abstract

A high-precision circuit additive manufacturing method based on aerosol printing relates to the fields of intelligent manufacturing, additive manufacturing, printed electronics or inkjet printing technology. It is used to solve the problem that existing inkjet printing technology is difficult to obtain printed graphics with a specific resolution. The present invention provides accurate parameter input for CFD simulation by using a mass-weighted method to statistically calculate the aerosol particle size, thereby greatly improving the simulation accuracy. The process window of aerosol printing is determined low-cost, efficiently and accurately through CFD simulation, and printed graphics with a specific resolution are quickly obtained through a printing speed iteration method. The method proposed in the present invention is suitable for aerosol inks of various materials, supports precision additive manufacturing of graphics with a resolution within 10-300μm, and the average graphic accuracy error after five iterations is less than 2.2%.

Description

Technical Field

[0001] The present invention relates to the field of intelligent manufacturing, additive manufacturing, printed electronics or inkjet printing technology, and in particular to a high-precision circuit additive manufacturing method based on aerosol printing. Background Art

[0002] Traditional circuit fabrication techniques offer nanometer-scale resolution, but processes like photolithography and etching rely on expensive equipment and complex process flows. Furthermore, these subtractive manufacturing methods waste resources and increase manufacturing costs. In comparison, inkjet printing, as an additive manufacturing technology, offers advantages such as low cost, environmental friendliness, and high resolution, and holds broad development and application prospects in the field of circuit fabrication. Aerosol jet printing, an emerging inkjet printing technology, offers advantages such as fast printing speed, high throughput, and broad material compatibility. In particular, due to the convergence of the sheath gas, aerosol jet printing allows for a high working height, resulting in excellent conformality to complex curved surfaces. Furthermore, the solids content of the ink used for aerosol printing can reach 50–60%, ensuring excellent adhesion to the substrate. Therefore, aerosol jet printing is not only suitable for fabricating planar circuits but is also suitable for fabricating conformal electronic circuits on surfaces with tiny, complex structures. However, the difficulty in obtaining printed graphics of a specific resolution is a common problem in inkjet printing technology. Unlike technologies such as photolithography and screen printing that rely on masks, aerosol printing is highly dependent on process parameters and has a narrow process window, which is affected by the combined effects of parameters such as nozzle diameter, printing speed, carrier gas flow rate, and sheath gas flow rate. Therefore, it is very difficult to obtain circuit graphics of a specific size using aerosol printing. Uncertain printing resolution not only affects the performance of printed electronic devices, but may even cause circuit failures such as bridging and short circuits, greatly limiting the development and application of aerosol printing technology in the field of circuit precision manufacturing. Summary of the Invention

[0003] The present invention is used to solve the problem that existing inkjet printing technology is difficult to obtain printed graphics with a specific resolution, and thus proposes a high-precision circuit additive manufacturing method based on aerosol printing, which is used to achieve controllable precision printing of graphics with a specific resolution.

[0004] To achieve the above object, the present invention provides the following solutions:

[0005] The present invention provides a high-precision circuit additive manufacturing method based on aerosol printing, the method comprising the following steps:

[0006] Step S1: obtaining simulation parameters: average particle size of independent aerosol particles;

[0007] Step S2: setting the nozzle inner diameter according to the resolution of the target graphic, establishing a finite element model based on the set nozzle inner diameter, and setting boundary conditions;

[0008] Step S3: After meshing the finite element model, perform mesh adaptability analysis and use the analyzed mesh for calculation;

[0009] Step S4: Select the carrier gas flow rate and sheath gas flow rate based on the resolution of the target image. Calculate the velocity distribution contour of the discrete phase based on the average particle size of the aerosol particles under the grid of step S3. Continuously adjust the carrier gas flow rate and sheath gas flow rate until the predicted printing resolution meets the requirements, and obtain the final carrier gas flow rate and sheath gas flow rate.

[0010] Step S5: Printing is performed using the final carrier gas flow rate and sheath gas flow rate, and a pattern of a specified resolution is obtained by performing speed iteration through a dichotomy method.

[0011] Furthermore, in another preferred embodiment, the above step S1 is specifically as follows:

[0012] After selecting the printing ink, independent aerosol particles are obtained on the printing substrate at a low gas flow rate and a high printing speed, and the average particle size of the independent aerosol particles is calculated.

[0013] Furthermore, in a preferred embodiment, the small gas flow rate is specifically: carrier gas flow rate <5 sccm, sheath gas flow rate <10 sccm, and sheath gas flow rate / carrier gas flow rate <3; and the printing speed is >20 mm / s.

[0014] Furthermore, in another preferred embodiment, the calculation formula for calculating the average particle size of the aerosol particles is:

[0015]

[0016] Among them, d n is the particle size of independent aerosol particles.

[0017] Furthermore, in a preferred embodiment, the inner diameter of the nozzle is 1.5-15 times the target pattern resolution.

[0018] Furthermore, in another preferred embodiment, the above step S3 is specifically as follows:

[0019] Step S31: performing free quadrilateral mesh division on the finite element model, where the side length of the initial quadrilateral mesh at the nozzle is 1 / 5 of the nozzle inner diameter;

[0020] Step S32: Grid adaptability analysis: Calculate the velocity field of the multiphase flow under the conditions of a carrier gas flow rate of 10 sccm and a sheath gas flow rate of 20 sccm, continuously increase the grid density and obtain the maximum velocity of the multiphase flow under different grid densities until the calculated maximum velocity is within 5% of the maximum velocity before the last increase in grid density.

[0021] Furthermore, in another preferred embodiment, the above step S4 is specifically as follows:

[0022] Step S41: selecting the carrier gas flow rate and the sheath gas flow rate according to the formula: sheath gas flow rate / carrier gas flow rate=0.5×nozzle inner diameter / target image resolution;

[0023] Step S42: Calculate the velocity distribution cloud of the discrete phase according to the average particle size of the aerosol particles, and measure the aerosol beam width W1 at the nozzle outlet;

[0024] Step S43: defining the simulated predicted printing resolution W2 = 1.25 × W1;

[0025] Step S44: continuously adjusting the carrier gas flow rate and the sheath gas flow rate so that (W2-W) / W<5%, and obtaining the final carrier gas flow rate and the sheath gas flow rate.

[0026] The high-precision circuit additive manufacturing method based on aerosol printing described in the present invention can be fully implemented using computer software. Therefore, correspondingly, the present invention also provides a high-precision circuit additive manufacturing system based on aerosol printing, the system comprising:

[0027] A storage device for obtaining simulation parameters: an average particle size of independent aerosol particles;

[0028] A storage device for setting the nozzle inner diameter according to the resolution of the target graphic, establishing a finite element model according to the set nozzle inner diameter, and setting boundary conditions;

[0029] A storage device for performing mesh adaptability analysis on a finite element model after meshing, and performing calculations using the analyzed mesh;

[0030] A storage device for selecting the carrier gas flow rate and sheath gas flow rate according to the resolution of the target pattern, calculating the velocity distribution cloud of the discrete phase in combination with the average particle size of the aerosol particles under the above-mentioned grid, and continuously adjusting the carrier gas flow rate and sheath gas flow rate so that the predicted printing resolution meets the requirements, thereby obtaining the final carrier gas flow rate and sheath gas flow rate;

[0031] A storage device for printing using the final carrier gas flow rate and sheath gas flow rate and performing speed iteration by bisection to obtain a pattern of a specified resolution.

[0032] The present invention also provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the high-precision circuit additive manufacturing method based on aerosol printing as described in any one of the above preferred embodiments is executed.

[0033] The present invention also provides a computer device, which includes a memory and a processor, wherein a computer program is stored in the memory. When the processor runs the computer program stored in the memory, the processor executes a high-precision circuit additive manufacturing method based on aerosol printing as described in any one of the above preferred embodiments.

[0034] The beneficial effects of the present invention are:

[0035] This paper proposes a high-precision additive manufacturing method for circuits based on aerosol printing. By using a mass-weighted method to statistically calculate aerosol particle size, this method provides precise parameter input for CFD simulation, significantly improving simulation accuracy. CFD simulation allows for the cost-effective, efficient, and accurate determination of the aerosol printing process window, and a print speed iteration method allows for rapid generation of printed patterns at a specific resolution.

[0036] 2. The method proposed in this invention is applicable to aerosol inks of various materials and supports precision additive manufacturing of graphics with a resolution within 10-300 μm. The average graphic accuracy error after five iterations is less than 2.2%. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following is a brief introduction to the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0038] Figure 1 1 is a schematic flow chart of a high-precision circuit additive manufacturing method based on aerosol printing according to the present invention;

[0039] Figure 2 is a schematic diagram of a scanning electron microscope photograph of the independent aerosol particles of the present invention;

[0040] Figure 3 Schematic diagram of a CFD simulation model of the aerosol printing system of the present invention;

[0041] Figure 4 It is a discrete phase velocity distribution cloud diagram obtained by CFD simulation according to the present invention;

[0042] Figure 5 The ultra-high-precision printed graphics are obtained by combining the aerosol jet printing technology described in the present invention with nano-silver particle ink after four speed iterations.

[0043] Among them, 1 represents the carrier gas inlet; 2 represents the sheath gas inlet; 3 represents the gas mixing chamber; 4 represents the conical nozzle; 5 represents the nozzle outlet; 6 represents the gas outlet; 7 represents the substrate; and 8 represents the aerosol beam at the nozzle outlet. DETAILED DESCRIPTION

[0044] In the following description, specific details such as specific system structures and technologies are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application can also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to avoid unnecessary details that obscure the description of the present application.

[0045] The specific embodiments of the present invention are further described in detail below with reference to the accompanying drawings. The following embodiments will help those skilled in the art further understand the present invention, but are not intended to limit the present invention in any form. It should be noted that those skilled in the art may make various changes and improvements without departing from the scope of the present invention, and these are all within the scope of protection of the present invention.

[0046] Implementation method 1: This implementation method addresses the problem that existing inkjet printing technology is difficult to obtain printed graphics with a specific resolution, and thus proposes a high-precision circuit additive manufacturing method based on aerosol printing to achieve controllable precision printing of graphics with a specific resolution.

[0047] The method comprises the following steps:

[0048] Step S1: obtaining simulation parameters: average particle size of independent aerosol particles;

[0049] Step S2: setting the nozzle inner diameter according to the resolution of the target graphic, establishing a finite element model based on the set nozzle inner diameter, and setting boundary conditions;

[0050] Step S3: After meshing the finite element model, perform mesh adaptability analysis and use the analyzed mesh for calculation;

[0051] Step S4: Select the carrier gas flow rate and sheath gas flow rate based on the resolution of the target image. Calculate the velocity distribution contour of the discrete phase based on the average particle size of the aerosol particles under the grid of step S3. Continuously adjust the carrier gas flow rate and sheath gas flow rate until the predicted printing resolution meets the requirements, and obtain the final carrier gas flow rate and sheath gas flow rate.

[0052] Step S5: Printing is performed using the final carrier gas flow rate and sheath gas flow rate, and a pattern of a specified resolution is obtained by performing speed iteration through a dichotomy method.

[0053] Implementation method 2, see Figures 1 to 4 This embodiment is described as follows: This embodiment specifically describes the high-precision circuit additive manufacturing method based on aerosol printing described in the first embodiment;

[0054] like Figure 1 As shown:

[0055] Step S1: obtaining simulation parameters: average particle size of independent aerosol particles;

[0056] Specifically include:

[0057] Printing inks can be selected based on needs. The ink materials can be metal materials such as nanosilver, nanocopper, and nanogold for conductivity, polymer materials such as polyimide and methacrylate for insulation, sensing materials such as graphene, MXene, and PDOT:PSS for pressure, temperature, and humidity sensing, quantum dot materials such as ZnO and ZnS for luminescence, thermoelectric materials such as Bi2Te3 and PbTe for energy conversion, optoelectronic materials such as perovskite and GaP, and energy storage materials such as MnSe, MnS, and VSe2. Aerosol particle size d droplet It is a core parameter that affects the accuracy of the simulation. Here, this embodiment develops a quality weighted algorithm to calculate d droplet :Use a very small gas flow rate (carrier gas flow rate <5sccm, sheath gas flow rate <10sccm, sheath gas flow rate / carrier gas flow rate <3) and a very large printing speed (>20mm / s) to obtain independent aerosol particles on the printed substrate, such as Figure 2 As shown. The particle size dn of independent aerosol particles is calculated. For spherical aerosol particles, the particle size is the diameter of the sphere. For hemispherical aerosol particles, the particle size is the diameter of an equivalent spherical particle with the same volume as the hemisphere. Statistics are performed on n independent aerosol particles (n>200). Since large-mass aerosol particles play a decisive role in the movement of the discrete phase, the mass-weighted method is used to calculate the average particle size d of the aerosol particles. droplet As shown in formula (1).

[0058]

[0059] Among them, d n is the particle size of independent aerosol particles.

[0060] Step S2: setting the nozzle inner diameter according to the resolution of the target graphic, establishing a finite element model based on the set nozzle inner diameter, and setting boundary conditions;

[0061] Specifically: establishment of finite element model and setting of boundary conditions:

[0062] Select the appropriate size of nozzle according to the resolution of the target graphics. The inner diameter of the nozzle should be 1.5-15 times of the resolution of the target graphics. Small size nozzles are preferred to obtain higher printing accuracy and stability. According to the structure of the aerosol printing system, a finite element model is established as follows: Figure 3 The simulation is based on a discrete phase model in computational fluid dynamics (CFD), with aerosol particles as the discrete phase and carrier and sheath gas flows as the continuous phase. The model's internal walls are shear-free and reflective. The substrate is a fixed wall that traps the discrete phase. The gas outlet is set to atmospheric pressure, allowing the discrete phase to escape. The gravity acceleration value is set according to the environment.

[0063] Step S3: After meshing the finite element model, perform mesh adaptability analysis and use the analyzed mesh for calculation;

[0064] Specifically: Grid division and grid adaptability analysis:

[0065] The model was meshed freely using quadrilaterals. A denser mesh was used at the nozzle to improve computational accuracy. The initial quadrilateral mesh at the nozzle had a side length of 1 / 5 of the nozzle's inner diameter. A mesh adaptability analysis was performed, and the multiphase flow velocity field was calculated at a carrier gas flow rate of 10 sccm and a sheath gas flow rate of 20 sccm. The mesh density was continuously increased, and the maximum multiphase flow velocity was obtained at different mesh densities. The calculated maximum velocity was within 5% of the maximum velocity before the previous mesh density increase. The resulting mesh was used for subsequent calculations.

[0066] Step S4: Select the carrier gas flow rate and sheath gas flow rate based on the resolution of the target image. Calculate the velocity distribution contour of the discrete phase based on the average particle size of the aerosol particles under the grid of step S3. Continuously adjust the carrier gas flow rate and sheath gas flow rate until the predicted printing resolution meets the requirements, and obtain the final carrier gas flow rate and sheath gas flow rate.

[0067] Specifically: prediction of printing resolution and determination of process window:

[0068] According to the target image resolution W, the carrier gas flow rate and sheath gas flow rate (sheath gas flow rate / carrier gas flow rate = 0.5 × nozzle inner diameter / target image resolution) are selected for simulation calculation, and the velocity distribution cloud of the discrete phase is calculated under the corresponding gas flow rate and aerosol particle size, as shown in FIG. Figure 4 As shown, the aerosol beam width W1 at the nozzle outlet is measured. Taking into account the wetting and spreading of the ink on the substrate, the simulated printing resolution is defined as W2 = 1.25 × W1. The carrier and sheath gas flow rates are adjusted to ensure (W2 - W) / W < 5%. The carrier gas flow rate at this point is a, and the sheath gas flow rate is b.

[0069] Step S5: Perform printing using the final carrier gas flow rate and sheath gas flow rate, and obtain a pattern with a specified resolution through velocity iteration using the bisection method.

[0070] Specifically: Obtain a pattern with a specified resolution through the velocity iteration method:

[0071] Perform printing with a carrier gas flow rate of a and a sheath gas flow rate of b. First, use a relatively large printing speed v1 (> 15 mm / s) such that the printing resolution W v1 < W. Use the bisection method for velocity iteration (when W vn < W, let v n+1 = v n / 2; when W vn > W, let v n+1 = v n / 2 + v n-1 / 2;), until (W vn - W) / W is less than the acceptable manufacturing error.

[0072] In summary, the high-precision circuit additive manufacturing method based on aerosol jet printing proposed in this embodiment provides accurate parameter inputs for CFD simulation by using the mass-weighted method to statistically calculate the aerosol particle size, greatly improving the simulation accuracy. The process window of aerosol jet printing is determined cost-effectively, efficiently, and accurately through CFD simulation, and a printed pattern with a specific resolution is quickly obtained through the printing speed iteration method.

[0073] Embodiment 3. Refer to Figure 5 Describe this embodiment. In this embodiment, silver nanoparticles are used for the high-precision manufacturing of a circuit with a specific resolution to verify the high-precision circuit additive manufacturing method based on aerosol jet printing described in the above embodiment.

[0074] Specifically:

[0075] 1. Obtaining simulation parameters:

[0076] Select the most representative silver nanoparticle conductive ink as the printing material. Under the conditions of a carrier gas flow rate = 2 sccm, a sheath gas flow rate = 5 sccm, and a printing speed = 40 mm / s, independent aerosol particles are obtained on the printing substrate. Statistically calculate the particle sizes dn of 300 independent aerosol particles. For spherical aerosol particles, the particle size is the diameter of the sphere. For hemispherical aerosol particles, the particle size is the diameter of the equivalent spherical particle with the same volume as the hemisphere. Use the mass-weighted method as shown in Equation (2) to calculate the average particle size ddroplet of the aerosol particles to be 1.7 μm.

[0077]

[0078] 2. Establishment of the finite element model and setting of boundary conditions:

[0079] 50μm and 15μm were selected as the resolution of the target graphics, and a nozzle with an inner diameter of 150μm was selected. A finite element model was established according to the structure of the aerosol printing system. The simulation was based on the discrete phase model in computational fluid dynamics (CFD), with aerosol particles as the discrete phase and carrier gas and sheath gas flows as the continuous phase. The inner walls of the model are all shear conditions without sliding and have a reflective effect on the discrete type. The substrate is set as a fixed wall to capture the discrete phase. The gas outlet is set to atmospheric pressure, and the discrete phase can escape. The gravitational acceleration value is set to 9.8m / s 2 .

[0080] 3. Mesh division and mesh adaptability analysis:

[0081] The model was meshed freely using quadrilaterals. A denser mesh was used at the nozzle to improve computational accuracy. The initial quadrilateral mesh at the nozzle had a side length of 30 μm. A mesh adaptability analysis was performed, and the multiphase flow velocity field was calculated at a carrier gas flow rate of 10 sccm and a sheath gas flow rate of 20 sccm. The mesh density was continuously increased to obtain the maximum multiphase flow velocity at different mesh densities. The maximum velocity calculated with a quadrilateral mesh side length of 10 μm at the nozzle differed by 3.8% from the maximum velocity before the previous mesh density increase. This mesh was used for subsequent calculations.

[0082] 4. Prediction of printing resolution and determination of process window:

[0083] Since the methods for achieving the two target image resolutions are the same, only the manufacturing method for the 50μm target image is detailed here. Simulation calculations were performed using a carrier gas flow rate of 10sccm and a sheath gas flow rate of 15sccm based on the target image resolution. The simulated aerosol beam width W1 at the nozzle outlet was measured. Considering the wetting and spreading of the ink on the substrate, the simulated predicted printing resolution was defined as W2 = 1.25 × W1. The carrier and sheath gas flow rates were adjusted. When the carrier gas flow rate was 10sccm and the sheath gas flow rate was 18sccm, (W2 - W) / W = 4.6%.

[0084] 5. Speed ​​iteration method to obtain graphics with specified resolution

[0085] The acceptable manufacturing error is defined as 1%, and the carrier gas flow rate is 10 sccm and the sheath gas flow rate is 18 sccm for printing. First, a larger printing speed v1 = 20 mm / s is used to make the printing resolution W v1 =42.4μm<50μm, use the bisection method to iterate the speed v2=10mm / s, W v1 =54.1μm; v3=15mm / s, W v3 =47.2μm; v4=12.5mm / s. Wv4 =49.6μm. (W v4 -50) / 50=0.8%. Through the above method, a high-precision circuit with an error within 1% was obtained using only four iterations. The manufacturing method for the target pattern resolution of 15μm is the same as above, and the obtained high-precision printed circuit is as follows Figure 5 shown.

[0086] Embodiment 4: This embodiment compares and explains the existing method with the high-precision circuit additive manufacturing method based on aerosol printing proposed in the above embodiment;

[0087] Specifically:

[0088] Traditional method: Controlling the carrier gas and sheath gas flow rate to adjust the printed pattern resolution:

[0089] Traditionally, the resolution of printed patterns is often controlled by controlling the carrier and sheath gas flows. Therefore, this comparative example uses silver nanoparticle ink, selects 50 μm as the target pattern resolution, and adjusts the printed pattern resolution by controlling the gas flow rates, and compares this with the third embodiment described above.

[0090] The initial carrier gas flow rate a1 = 10 sccm, sheath gas flow rate b1 = 15 sccm, and printing speed v1 = 20 mm / s were selected for the experiment. b1 =58.7μm, keep the carrier gas flow rate and printing speed unchanged, use the dichotomy method to adjust the sheath gas flow rate b2 = 30sccm, W b2 =15.1μm; b3=22.5sccm, W b3 =26.4μm; b4=19sccm, W b4 =39.1μm. (W b4 -50) / 50=21.8%.

[0091] The circuit resolution error obtained after four iterations is 21.8%, which is much larger than the manufacturing error of 0.8% obtained after four iterations of the high-precision circuit additive manufacturing method proposed in the above embodiment. Therefore, the high-precision circuit additive manufacturing method proposed in the above embodiment has obvious advantages over the traditional method.

[0092] Implementation method 5: This implementation method compares the simulation results obtained without using aerosol particle size input with the actual results to illustrate that the mass-weighted method proposed in the above implementation method for statistically calculating aerosol particle size can significantly improve simulation accuracy.

[0093] Specifically:

[0094] To demonstrate the advanced nature of the mass-weighted method used in the above embodiment for statistically calculating aerosol particle size, this comparative example uses silver nanoparticle ink, selects 50 μm as the target pattern resolution, and uses 2 μm, commonly used in simulations, as the approximate particle size of the aerosol particles for calculation.

[0095] A nozzle with an inner diameter of 150 μm was selected. A finite element model was established based on the structure of the aerosol printing system. The simulation was based on the discrete phase model in computational fluid dynamics (CFD), with aerosol particles as the discrete phase and carrier gas and sheath gas flows as the continuous phase. The inner walls of the model are all shear conditions without sliding and have a reflective effect on the discrete type. The substrate is set as a fixed wall to capture the discrete phase. The gas outlet is set to atmospheric pressure, and the discrete phase can escape. The gravity acceleration value is set to 9.8 m / s 2 .

[0096] The model was meshed freely using quadrilaterals. A denser mesh was used at the nozzle to improve computational accuracy. The initial quadrilateral mesh at the nozzle had a side length of 30 μm. A mesh adaptability analysis was performed, and the multiphase flow velocity field was calculated at a carrier gas flow rate of 10 sccm and a sheath gas flow rate of 20 sccm. The mesh density was continuously increased to obtain the maximum multiphase flow velocity at different mesh densities. The maximum velocity calculated with a quadrilateral mesh side length of 10 μm at the nozzle differed by 3.5% from the maximum velocity before the previous mesh density increase. This mesh was used for subsequent calculations.

[0097] Based on the target image resolution, a carrier gas flow rate of 10 sccm and a sheath gas flow rate of 15 sccm were selected for simulation calculations. The simulated aerosol beam width W1 at the nozzle outlet was measured. Considering the wetting and spreading of the ink on the substrate, the predicted printing resolution was defined as W2 = 1.25 × W1. The carrier and sheath gas flow rates were adjusted. When the carrier gas flow rate was 8 sccm and the sheath gas flow rate was 18.5 sccm, (W2 - W) / W = 3.2%.

[0098] The printing was performed with a carrier gas flow rate of 8 sccm, a sheath gas flow rate of 18.5 sccm, and a printing speed of v = 20 mm / s. The initial printing resolution W v =33.9μm, (W v -50) / 50=32.2%. The initial printing resolution obtained by using the mass-weighted method to statistically calculate the aerosol particle size as the simulation parameter input method is 42.4μm, and (42.4-50) / 50=15.2%. Therefore, the mass-weighted method proposed in the above embodiment can significantly improve the simulation accuracy.

[0099] Embodiment 6: The high-precision circuit additive manufacturing method based on aerosol printing described in the above embodiment can be fully implemented using computer software. Therefore, correspondingly, this embodiment provides a high-precision circuit additive manufacturing system based on aerosol printing, the system including a storage device, the storage device being configured to perform the following steps:

[0100] Step S1: obtaining simulation parameters: average particle size of independent aerosol particles;

[0101] Step S2: setting the nozzle inner diameter according to the resolution of the target graphic, establishing a finite element model based on the set nozzle inner diameter, and setting boundary conditions;

[0102] Step S3: After meshing the finite element model, perform mesh adaptability analysis and use the analyzed mesh for calculation;

[0103] Step S4: Select the carrier gas flow rate and sheath gas flow rate based on the resolution of the target image. Calculate the velocity distribution contour of the discrete phase based on the average particle size of the aerosol particles under the grid of step S3. Continuously adjust the carrier gas flow rate and sheath gas flow rate until the predicted printing resolution meets the requirements, and obtain the final carrier gas flow rate and sheath gas flow rate.

[0104] Step S5: Printing is performed using the final carrier gas flow rate and sheath gas flow rate, and a pattern of a specified resolution is obtained by performing speed iteration through a dichotomy method.

[0105] Implementation method seven: This implementation method provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the high-precision circuit additive manufacturing method based on aerosol printing as described in any one of the above implementation methods is executed.

[0106] Embodiment 8. The present invention also provides a computer device, which includes a memory and a processor, wherein a computer program is stored in the memory. When the processor runs the computer program stored in the memory, the processor executes a high-precision circuit additive manufacturing method based on aerosol printing as described in any one of the above embodiments.

[0107] This embodiment provides a computer device, in which the hardware device of this part is a general model and is not shown in the form of a diagram. The system includes a processor and a memory, wherein the processor and the memory can be connected via a bus or other means. The memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs, non-transitory computer executable programs and modules, and corresponding program instructions / modules. The processor executes various functional applications and data processing of the processor by running the non-transitory software programs, instructions and modules stored in the memory, so as to realize the high-precision circuit additive manufacturing method and steps based on aerosol printing in the above-mentioned method embodiment.

[0108] It will be understood that when used in this specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0109] The foregoing description is merely an embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of the claims.

Claims

1. A high-precision circuit additive manufacturing method based on aerosol printing, characterized in that: The method is: S1: Get simulation parameters: average particle size of independent aerosol particles; The average particle size d of aerosol particles was calculated using a mass-weighted algorithm. drople t, specifically: Select printing ink according to needs, use a very small gas flow rate, carrier gas flow rate <5 sccm, sheath gas flow rate <10 sccm, sheath gas flow rate / carrier gas flow rate <3 and a large printing speed, >20 mm / s, to obtain independent aerosol particles on the printed substrate, and calculate the particle size dn of the independent aerosol particles. For spherical aerosol particles, the particle size is the diameter of the sphere. For hemispherical aerosol particles, the particle size is the diameter of the equivalent spherical particle with the same volume as the hemisphere. Count n independent aerosol particles, n>200. Since large-mass aerosol particles play a decisive role in the movement of the discrete phase, the mass-weighted method is used to calculate the average particle size d of the aerosol particles. droplet As shown in formula (1): （1） Wherein, dn is the particle size of independent aerosol particles; S2: setting the nozzle inner diameter according to the resolution of the target graphic, establishing a finite element model based on the set nozzle inner diameter, and setting boundary conditions; S3: After meshing the finite element model, perform mesh adaptability analysis and use the analyzed mesh for calculations; S4: Selecting the carrier gas flow rate and sheath gas flow rate according to the resolution of the target pattern, calculating the velocity distribution cloud of the discrete phase in combination with the average particle size of the aerosol particles under the grid of step S3, and continuously adjusting the carrier gas flow rate and sheath gas flow rate so that the predicted printing resolution meets the requirements, thereby obtaining the final carrier gas flow rate and sheath gas flow rate; S5: Print using the final carrier gas flow rate and sheath gas flow rate and perform speed iteration using the bisection method to obtain a pattern with a specified resolution.

2. The high-precision circuit additive manufacturing method based on aerosol printing according to claim 1, characterized in that: The inner diameter of the nozzle is 1.5-15 times the target pattern resolution.

3. The high-precision circuit additive manufacturing method based on aerosol printing according to claim 1, characterized in that: S3 specifically: S31: Freely divide the finite element model into quadrilateral meshes. The initial quadrilateral mesh side length at the nozzle is 1 / 5 of the nozzle inner diameter. S32: Grid Adaptability Analysis: Calculate the velocity field of the multiphase flow at a carrier gas flow rate of 10 sccm and a sheath gas flow rate of 20 sccm. Continuously increase the grid density and obtain the maximum multiphase flow velocity at different grid densities until the calculated maximum velocity is within 5% of the maximum velocity before the last increase in grid density.

4. The high-precision circuit additive manufacturing method based on aerosol printing according to claim 1, characterized in that: S4 is specifically: S41: Select the carrier gas flow rate and sheath gas flow rate according to the formula: sheath gas flow rate / carrier gas flow rate = 0.5 × nozzle inner diameter / target image resolution W; S42: Calculate the velocity distribution cloud of the discrete phase based on the average particle size of the aerosol particles, and measure the aerosol beam width W1 at the nozzle outlet; S43: defining the printing resolution W2=1.25×W1 predicted by simulation; S44: Continuously adjust the carrier gas flow rate and sheath gas flow rate so that (W2-W) / W<5% to obtain the final carrier gas flow rate and sheath gas flow rate.

5. A high-precision circuit additive manufacturing system based on aerosol printing, characterized in that: The system comprises a storage device configured to execute the method of claim 1 .

6. A computer-readable storage medium, characterized in that The computer-readable storage medium stores a computer program, which, when executed by a processor, executes the high-precision circuit additive manufacturing method based on aerosol printing according to any one of claims 1 to 4.

7. A computer device, characterized in that: The device includes a memory and a processor, wherein a computer program is stored in the memory. When the processor runs the computer program stored in the memory, the processor executes the high-precision circuit additive manufacturing method based on aerosol printing according to any one of claims 1 to 4.

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