Chip packaging mechanism and chip packaging machine

Abstract

The present invention discloses a chip packaging mechanism and a chip packaging machine with the chip packaging mechanism, wherein the chip packaging mechanism comprises a frame, a support seat and a moving module. The support seat is arranged on the frame, a support portion and an escape opening are arranged on the support seat, the support seat is arranged on the frame, a support portion is arranged on the support seat, the support portion is provided with an escape opening, a heating module is arranged in the support seat, the heating module is used to heat the support portion, the support portion and the escape opening are configured to cover a first adhesive tape, the first adhesive tape is used to load a chip, and the chip is arranged corresponding to the escape opening; the moving module is arranged on the frame, a pressing wheel is rotatably connected to the moving module, the lower part of the pressing wheel is used to pass a second adhesive tape, the moving module is configured to drive the pressing wheel to press the second adhesive tape onto the first adhesive tape, and the moving module is configured to drive the pressing wheel to roll back and forth along the conveying direction of the first adhesive tape, so that the first adhesive tape and the second adhesive tape package the chip into a chip tape.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a chip packaging mechanism and a chip packaging machine. Background Art

[0002] After the chip is produced, it needs to be packaged. The chip is first grabbed by a robot and placed on the first tape. The first tape is driven forward, and the second tape is set above the first tape. The first tape and the second tape are mainly hot-pressed against each other so that the chip is encapsulated between the first tape and the second tape.

[0003] In the past, packaging mechanisms mainly relied on upper and lower hot pressing blocks to directly press the first tape and the second tape to package the chip to form a chip tape. After the pressing was completed, the chip tape was pulled and rolled up, and the first tape and the second tape were also pulled forward, so that the unpressed first tape and the second tape were placed between the upper and lower hot pressing blocks. This hot pressing method causes the first tape and the second tape to be heated too large, which will cause thermal deformation of the first tape and the second tape, resulting in the first tape and the second tape being misaligned and overlapped during pressing, and ultimately causing the chip packaging bag to have creases or gaps, and the chip cannot be sealed. Summary of the invention

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. To this end, the present invention proposes a chip packaging mechanism that can reduce the heating area of ​​the first tape and the second tape, reduce the thermal deformation of the first tape and the second tape, and has a gradual squeezing effect to ensure that the chip packaging bag is sealed after hot pressing.

[0005] The present invention also provides a chip packaging machine having the chip packaging mechanism.

[0006] According to a first aspect of the present invention, a chip packaging mechanism includes a frame, a support seat and a moving module. The support seat is arranged on the frame, the support seat is provided with a support portion, the support portion is provided with an escape port, a heating module is arranged in the support seat, the heating module is used to heat the support portion, the support portion and the escape port are configured to cover a first tape, the first tape is used to load a chip, and the chip is arranged corresponding to the escape port; the moving module is arranged on the frame, a pressing wheel is rotatably connected to the moving module, the lower part of the pressing wheel is used to pass a second tape, the moving module is configured to drive the pressing wheel to press the second tape onto the first tape, and the moving module is configured to drive the pressing wheel to roll back and forth along the conveying direction of the first tape, so that the chip enters the escape port under the load of the first tape, and the air between the second tape and the first tape is discharged, and the first tape and the second tape are hot-pressed to package the chip.

[0007] At least the following beneficial effects are provided: the support seat is divided into the support part and the avoidance opening, the support part is heated, and the avoidance opening corresponds to the accommodating chip, so as to avoid that the first tape where the chip is located is affected by more heat, thereby ensuring the quality of chip packaging; the movable module is arranged to drive the pressing wheel to press the second tape, so that the second tape can be gradually squeezed onto the first tape, and the rolling characteristics of the pressing wheel are utilized to discharge the air between the second tape and the first tape, thereby ensuring the squeezing effect, so that the chip is sealed, thereby improving the chip packaging quality, while also improving the efficiency; the pressing wheel rolls back and forth to further improve the effect of hot pressing sealing.

[0008] According to some embodiments of the present invention, the outer peripheral wall of the pressing wheel is provided with a contact portion and an avoidance groove, the contact portion is arranged on the periphery of the avoidance groove, the contact portion is used to cooperate with the support portion, and the avoidance groove is used to cooperate with the corresponding avoidance port. The pressing wheel is provided with the contact portion and the avoidance groove to ensure the accuracy of hot pressing, avoid hot pressing of parts that do not require hot pressing, increase the contact pressure between the contact portion and the support portion, reduce the contact pressure between the avoidance port and the avoidance groove, and ensure that the chip is packaged.

[0009] According to some embodiments of the present invention, a plurality of convex portions are provided on the supporting portion and / or the contact portion, and the provided convex portions make the thermal compression bonding more stable.

[0010] According to some embodiments of the present invention, the support part is made of metal, the support part is embedded in the support seat, the support part is protruded on the support seat, the support seat is made of heat insulating material, the heating module includes an electromagnetic induction coil, the electromagnetic induction coil is arranged in the support seat, the electromagnetic induction coil is used to heat the support part, the support seat and the support part are made of different materials, and the electromagnetic induction principle of the heating module is used to heat the support part, ensuring that there is heat on the support part while the heat on the support seat is not high, thereby ensuring the sealing of the chip and preventing the chip from sticking to hot glue.

[0011] According to some embodiments of the present invention, a heat insulation film is bonded between the support seat and the support portion, and the heat insulation film is provided to further reduce heat conduction between the support seat and the support portion.

[0012] According to some embodiments of the present invention, the moving module includes a direct-acting cylinder and a first electric cylinder, the direct-acting cylinder is arranged on the frame, the first electric cylinder is connected to the direct-acting cylinder, the pressure wheel is rotatably connected to the slide of the first electric cylinder, the direct-acting cylinder is used to drive the first electric cylinder to rise and fall so that the pressure wheel presses the second tape, and the first electric cylinder is used to drive the pressure wheel to roll along the extension direction of the first tape. The direct-acting cylinder and the first electric cylinder are cooperated to realize the movement of the pressure wheel in two-axis directions, which ensures the pressure of the pressure wheel on the second tape and can roll the second tape.

[0013] According to some embodiments of the present invention, the mobile module includes a second electric cylinder and a swing cylinder, the second electric cylinder is connected to the frame, the swing cylinder is connected to the slide of the second electric cylinder, the pressure wheel is connected to the swing cylinder through a swing arm, the pressure wheel is rotatably connected to the swing arm, the swing cylinder is used to drive the pressure wheel to crimp the second tape, and the second electric cylinder is used to drive the swing cylinder to roll along the extension direction of the first tape. The swing cylinder is set so that the pressure wheel can press the second tape under the action of its own gravity, so that the second electric cylinder also has a vertical component force to press the second tape when pushing the pressure wheel, thereby ensuring the stability of hot pressing and pasting.

[0014] According to some embodiments of the present invention, a rounded structure is provided at the edge of the avoidance opening, and the rounded structure is used to guide the chip to fall into the avoidance opening. The rounded structure is provided to facilitate the chip to enter and prevent the chip from being rolled by the pressing wheel.

[0015] A chip packaging machine according to an embodiment of the second aspect of the present invention comprises a chip packaging mechanism according to the embodiment of the first aspect of the present invention, and further comprises a winding roller, wherein the winding roller is rotatably connected to the frame and is used to wind up the chip tape. The winding roller is arranged to wind up the chip tape to ensure the continuous execution of the hot pressing packaging process.

[0016] At least the following beneficial effects are achieved: This chip packaging machine has all the beneficial effects brought by the above-mentioned chip packaging mechanism, which will not be described repeatedly here.

[0017] According to some embodiments of the present invention, it also includes a first unwinding roller and a second unwinding roller, both of which are arranged on the frame, the first unwinding roller is used to wind the first adhesive tape, and the second unwinding roller is used to wind the second adhesive tape, the first adhesive tape extends in a horizontal direction and is arranged at the upper end of the support seat, the second adhesive tape bypasses the tensioning roller group and is arranged above the first adhesive tape, the pressure wheel is used to roll the second adhesive tape so that the second adhesive tape adheres to the first adhesive tape, and the first unwinding roller and the second unwinding roller ensure the continuous progress of the hot pressure packaging process.

[0018] Additional aspects and advantages of the present invention will be given in part in the following description and in part will be obvious from the following description, or will be learned through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0020] Figure 1 This is a schematic diagram of the structure of a chip packaging mechanism using a direct-acting cylinder according to an embodiment of the present invention;

[0021] Figure 2 for Figure 1 The enlarged view of point A in the middle;

[0022] Figure 3 This is a schematic diagram of the structure of a chip packaging mechanism using a swing cylinder according to an embodiment of the present invention;

[0023] Figure 4 This is a schematic diagram of the structure of a support base according to an embodiment of the present invention;

[0024] Figure 5 It is a side sectional view of a pressure wheel according to an embodiment of the present invention;

[0025] Figure 6 It is a front schematic diagram of the pressure wheel according to an embodiment of the present invention.

[0026] Reference numerals:

[0027] Rack 100;

[0028] Support base 200, support portion 210, avoidance opening 220, heating module 230;

[0029] The movable module 300, the pressing wheel 310, the contact portion 311, and the avoidance groove 312;

[0030] Direct-acting cylinder 320, first electric cylinder 330, second electric cylinder 340, swing cylinder 350, swing arm 360;

[0031] Winding roller 400;

[0032] The first unwinding roller 500 , the first adhesive tape 510 , the second unwinding roller 600 , and the second adhesive tape 610 . DETAILED DESCRIPTION

[0033] In the description of the present invention, it should be understood that descriptions involving orientations, such as up, down, front, back, left, right, etc., and orientations or positional relationships indicated are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0034] In the description of the present invention, if there is a description of first and second, it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0035] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0036] It should be noted that in the past, chip packaging was mainly performed by heat pressing the first tape 510 and the second tape 610 through an upper heat pressing head and a lower heat pressing head. Before the heat pressing, the chip was already supported on the first tape 510, and the upper heat pressing head heat pressed the second tape 610 directly onto the first tape 510, thereby encapsulating the chip.

[0037] Reference Figures 1 to 6The present invention discloses a chip packaging mechanism, including a frame 100, a support seat 200 and a moving module 300. The support seat 200 is arranged on the frame 100, and a support portion 210 and an escape opening 220 are arranged on the support seat 200. The support seat 200 is arranged on the frame 100, and a support portion 210 is arranged on the support seat 200. The escape opening 220 is opened on the support portion 210. A heating module 230 is arranged in the support seat 200, and the heating module 230 is used to heat the support portion 210. The support portion 210 and the escape opening 220 are configured to cover a first tape 510, and the first tape 510 is used to load the chip, and the chip is arranged corresponding to the escape opening 220; the moving module 300 is arranged on the frame 100, and a pressing wheel 310 is rotatably connected to the moving module 300, and the lower part of the pressing wheel 310 is used to pass through the first The second tape 610, the movable module 300 is configured to drive the pressing wheel 310 to press the second tape 610 onto the first tape 510, and the movable module 300 is configured to drive the pressing wheel 310 to roll back and forth along the conveying direction of the first tape 510, so that the chip enters the avoidance port 220 under the support of the first tape 510, and the air between the second tape 610 and the first tape 510 is discharged, and the first tape 510 and the second tape 610 are hot-pressed and bonded to encapsulate the chip. It can be understood that the so-called chip tape is actually a package of packaged chips, which has become a strip because the first tape 510 and the second tape 610 have not been cut.

[0038] It should be understood that the support seat 200 is divided into a support portion 210 and an avoidance opening 220. The support portion 210 is heated, and the avoidance opening 220 corresponds to the chip accommodating portion, so as to prevent the first tape 510 where the chip is located from being affected by more heat, thereby ensuring the quality of chip packaging. The movable module 300 is arranged to drive the pressing wheel 310 to press the second tape 610, so that the second tape 610 can be gradually squeezed onto the first tape 510. The rolling characteristics of the pressing wheel 310 are utilized to discharge the air between the second tape 610 and the first tape 510, thereby ensuring the squeezing effect, so that the chip is sealed, thereby improving the chip packaging quality, and also improving the efficiency. The pressing wheel 310 rolls back and forth to further improve the effect of hot pressing sealing. It should be noted that, compared with direct pressing, this rolling and squeezing method can better eliminate the air between the first tape 510 and the second tape 610, thereby ensuring the quality of extrusion bonding and the final packaging quality of the chip.

[0039] Reference Figure 5 and Figure 6The outer wall of the pressing wheel 310 is provided with a contact portion 311 and an avoidance groove 312. The contact portion 311 is arranged on the periphery of the avoidance groove 312. The contact portion 311 is used to cooperate with the contact support portion 210, and the avoidance groove 312 is used to cooperate with the corresponding avoidance port 220. The pressing wheel 310 is provided with the contact portion 311 and the avoidance groove 312 to ensure the accuracy of hot pressing, avoid hot pressing of parts that do not require hot pressing, increase the contact pressure between the contact portion 311 and the support portion 210, reduce the contact pressure between the avoidance port 220 and the avoidance groove 312, and ensure that the chip is packaged. It should be noted that the contact portion 311 of the pressing wheel 310 can be made of metal, while other parts can be made of plastic or ceramic. A plurality of avoidance grooves 312 can also be provided on the outer wall of the pressing wheel 310 to ensure that the pressing wheel 310 rolls one circle and can hot-press and package a plurality of chips.

[0040] In some embodiments, a plurality of convex portions are disposed on the support portion 210 and / or the contact portion 311 , and the disposed convex portions make the thermal compression bonding more stable, wherein the convex portions may also be replaced by anti-slip pattern portions.

[0041] Reference Figures 1 to 4 The support part 210 is made of metal, the support part 210 is embedded in the support base 200, the support part 210 is protruded on the support base 200, the support base 200 is made of heat-insulating material, the heating module 230 includes an electromagnetic induction coil, the electromagnetic induction coil is arranged in the support base 200, the electromagnetic induction coil is used to heat the support part 210, the support base 200 and the support part 210 are made of different materials, and the electromagnetic induction principle of the heating module is used to heat the support part 210 to ensure that there is heat on the support part, while the heat on the support base 200 is not high, to ensure the sealing of the chip and prevent the chip from sticking to the hot glue. It can be understood that the support part 210 is made of copper or stainless steel, and the heat-insulating material is such as ceramics, glass fiber, etc.

[0042] In some embodiments, a heat insulation film is bonded between the support seat 200 and the support portion 210 , and the heat insulation film further reduces heat conduction between the support seat 200 and the support portion 210 .

[0043] Reference Figure 1 The moving module 300 includes a direct-acting cylinder 320 and a first electric cylinder 330. The direct-acting cylinder 320 is arranged on the frame 100. The first electric cylinder 330 is connected to the direct-acting cylinder 320. The pressure wheel 310 is rotatably connected to the slide of the first electric cylinder 330. The direct-acting cylinder 320 is used to drive the first electric cylinder 330 to move up and down so that the pressure wheel 310 presses the second adhesive tape 610. The first electric cylinder 330 is used to drive the pressure wheel 310 to roll along the extension direction of the first adhesive tape 510. The direct-acting cylinder 320 and the first electric cylinder 330 are used to cooperate to realize the movement of the pressure wheel 310 in two-axis directions, that is, to ensure the pressure of the pressure wheel 310 on the second adhesive tape 610, and to roll the second adhesive tape 610.

[0044] Reference Figure 3 The moving module 300 includes a second electric cylinder 340 and a swing cylinder 350. The second electric cylinder 340 is connected to the frame 100. The swing cylinder 350 is connected to the slide of the second electric cylinder 340. The pressing wheel 310 is connected to the swing cylinder 350 through the swing arm 360. The pressing wheel 310 is rotatably connected to the swing arm 360. The swing cylinder 350 is used to drive the pressing wheel 310 to press the second adhesive tape 610. The second electric cylinder 340 is used to drive the swing cylinder 350 to press the second adhesive tape 510 along the first adhesive tape 51 0 rolls in the extension direction, and the swing cylinder 350 is set so that the pressure wheel 310 can press the second tape 610 under the action of its own weight, so that the second electric cylinder 340 also has a vertical component force to press the second tape 610 when pushing the pressure wheel 310, thereby ensuring the stability of hot pressing and pasting. It can be understood that the swing arm 360 is connected to the frame 100 or the swing cylinder 350 through a spring, and the spring gives a pre-tightening force to keep the pressure wheel 310 pressed against the second tape 610.

[0045] In some embodiments, the edge of the avoidance opening 220 is provided with a rounded structure, and the rounded structure is used to guide the chip to fall into the avoidance opening 220 . The rounded structure is provided to facilitate the chip to enter and prevent the chip from being rolled by the pressing wheel 310 .

[0046] A chip packaging machine according to an embodiment of the second aspect of the present invention comprises a chip packaging mechanism according to the embodiment of the first aspect of the present invention, and further comprises a winding roller 400, wherein the winding roller 400 is rotatably connected to the frame 100, and the winding roller 400 is used to wind up the chip tape. The winding roller 400 is arranged to wind up the chip tape to ensure the continuous hot pressing packaging process. This chip packaging machine has all the beneficial effects brought by the above-mentioned chip packaging mechanism, which will not be repeated here.

[0047] In some embodiments, it also includes a first unwinding roller 500 and a second unwinding roller 600. The first unwinding roller 500 and the second unwinding roller 600 are both arranged on the frame 100. The first unwinding roller 500 is used to wind the first adhesive tape 510, and the second unwinding roller 600 is used to wind the second adhesive tape 610. The first adhesive tape 510 extends in a horizontal direction and is arranged at the upper end of the support seat 200. The second adhesive tape 610 bypasses the tensioning roller group and is arranged above the first adhesive tape 510. The pressure wheel 310 is used to roll the second adhesive tape 610 so that the second adhesive tape 610 adheres to the first adhesive tape 510. The first unwinding roller 500 and the second unwinding roller 600 ensure the continuous progress of the hot pressure packaging process.

[0048] It should be noted that the second unwinding roller 600 and the tensioning roller group can be set on the same bracket panel, which can be adjustably mounted on the frame 100. The second unwinding roller 600 and the tensioning roller group can be adjusted and moved as a whole to adjust the angle between the second tape 610 and the first tape 510 to facilitate hot pressing packaging of different chips. In addition, each roller in the tensioning roller group can be adjusted vertically to adjust the tension of the second tape 610, which is suitable for packaging production.

[0049] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0050] Of course, the present invention is not limited to the above-mentioned embodiments, and those skilled in the art may make equivalent modifications or substitutions without violating the spirit of the present invention, and these equivalent modifications or substitutions are all included in the scope defined by the claims of this application.

Claims

1. A chip packaging mechanism, characterized in that: include: Rack(100); A support seat (200) is arranged on the frame (100), a support portion (210) is arranged on the support seat (200), a avoidance opening (220) is opened on the support seat (200), a heating module (230) is arranged in the support seat (200), the heating module (230) is used to heat the support portion (210), the support portion (210) and the avoidance opening (220) are configured to cover a first adhesive tape (510), the first adhesive tape (510) is used to load a chip, and the chip is arranged corresponding to the avoidance opening (220); A movable module (300) is arranged on the frame (100), a pressing wheel (310) is rotatably connected to the movable module (300), a second adhesive tape (610) is passed through the lower portion of the pressing wheel (310), the movable module (300) is configured to drive the pressing wheel (310) to press the second adhesive tape (610) onto the first adhesive tape (510), and the movable module (300) is configured to drive the pressing wheel (310) to roll back and forth along the conveying direction of the first adhesive tape (510), so that the chip enters the avoidance opening (220) under the support of the first adhesive tape (510), and the air between the second adhesive tape (610) and the first adhesive tape (510) is exhausted, and the first adhesive tape (510) and the second adhesive tape (610) are hot-pressed to package the chip; The outer peripheral wall of the pressure wheel (310) is provided with a contact portion (311) and an avoidance groove (312), the contact portion (311) is arranged at the periphery of the avoidance groove (312), the contact portion (311) is used to cooperate with the support portion (210), and the avoidance groove (312) is used to cooperate with the avoidance opening (220); The support portion (210) is made of metal, the support portion (210) is embedded in the support base (200), the support portion (210) is convexly arranged on the support base (200), the support base (200) is made of a heat-insulating material, the heating module (230) comprises an electromagnetic induction coil, the electromagnetic induction coil is arranged in the support base (200), and the electromagnetic induction coil is used to heat the support portion (210); The moving module (300) comprises a second electric cylinder (340) and a swing cylinder (350); the second electric cylinder (340) is connected to the frame (100); the swing cylinder (350) is connected to a slide table of the second electric cylinder (340); the pressing wheel (310) is connected to the swing cylinder (350) via a swing arm (360); the pressing wheel (310) is rotatably connected to the swing arm (360); the swing cylinder (350) is used to drive the pressing wheel (310) to press the second adhesive tape (610); and the second electric cylinder (340) is used to drive the swing cylinder (350) to roll along the extension direction of the first adhesive tape (510).

2. The chip packaging mechanism according to claim 1, characterized in that: A plurality of protruding portions are provided on the supporting portion (210) and / or the contact portion (311).

3. The chip packaging mechanism according to claim 1, characterized in that: A heat insulation film is bonded between the support seat (200) and the metal (250).

4. The chip packaging mechanism according to claim 1, characterized in that: The edge of the avoidance opening (220) is provided with a rounded corner structure, and the rounded corner structure is used to guide the chip to fall into the avoidance opening (220).

5. A chip packaging machine, characterized in that: The chip packaging mechanism comprises the chip packaging mechanism according to any one of claims 1 to 4, and further comprises a winding roller (400), wherein the winding roller (400) is rotatably connected to the frame (100), and the winding roller (400) is used for winding the chip tape.

6. The chip packaging machine according to claim 5, characterized in that: The invention also comprises a first unwinding roller (500) and a second unwinding roller (600), wherein the first unwinding roller (500) and the second unwinding roller (600) are both arranged on the frame (100), the first unwinding roller (500) is used to wind the first adhesive tape (510), and the second unwinding roller (600) is used to wind the second adhesive tape (610), the first adhesive tape (510) extends in a horizontal direction and is arranged at the upper end of the support seat (200), the second adhesive tape (610) bypasses a tensioning roller group and is arranged above the first adhesive tape (510), and the pressure wheel (310) is used to roll the second adhesive tape (610) so that the second adhesive tape (610) is bonded to the first adhesive tape (510).

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