Wafer coating apparatus and process

Abstract

The application provides a wafer coating equipment and process, wherein the wafer coating equipment comprises a rack, a driving assembly, a stop lever, a rotating seat and a wafer clamp; the rack is provided with a limiting block, the limiting block is provided with a first limiting groove and a second limiting groove; the driving assembly comprises a driving device and a transmission shaft; the stop lever is connected to the transmission shaft, the two ends of the stop lever are respectively provided with a first limiting protrusion and a second limiting protrusion, the first limiting protrusion is provided with a first limiting surface for abutting against the first limiting groove, the second limiting protrusion is provided with a second limiting surface for abutting against the second limiting groove after the transmission shaft rotates 180 degrees, the second limiting surface and the first limiting surface are coplanar, and the axis of the transmission shaft is located in the second limiting surface; the rotating seat is connected with the transmission shaft and the wafer clamp; and the wafer clamp is used for placing a wafer. The wafer coating equipment is limited by a mechanical structure, is convenient to adjust, has high positioning precision and high structural rigidity, and the reliability is improved.

Description

Technical Field

[0001] This invention relates to the field of wafer coating technology, and more particularly to a wafer coating equipment and process. Background Technology

[0002] During wafer processing, the cleaned wafers need to be vacuum electroplated to evaporate a thin film of conductive metal of a certain thickness. Before plating, the wafers need to be inspected on both sides and adjusted for front and back entry. Some wafers require double-sided plating, so the wafers need to be accurately rotated 180 degrees.

[0003] In existing wafer coating equipment, there are two main approaches to wafer flipping: one is manual wafer flipping without corresponding limiting structures, which makes it impossible to accurately control the wafer flipping angle and results in low efficiency; the other is automatic wafer flipping with the help of sensors to control the wafer flipping angle. However, if the sensors malfunction or the data transmission is not timely, the flipping angle control may not be achieved or the control accuracy may be low, resulting in low reliability. Summary of the Invention

[0004] In view of this, the present invention proposes a wafer coating equipment and process to solve the technical problem mentioned in the background art that, if the sensor is used to control the wafer flip angle, but the sensor fails or the data transmission is not timely, the flip angle control may not be realized or the control accuracy may be low, resulting in low reliability.

[0005] The technical solution of this invention is implemented as follows:

[0006] In a first aspect, the present invention provides a wafer coating apparatus, comprising a frame, a drive assembly, a stop bar, a rotating base, and a wafer clamp, wherein:

[0007] The frame is provided with a limiting block, and the limiting block is provided with a first limiting groove and a second limiting groove;

[0008] The drive assembly includes a drive device and a transmission shaft, wherein the drive device is mounted on the frame and is drivenly connected to the transmission shaft;

[0009] The stop lever is connected to the drive shaft. The two ends of the stop lever are symmetrical about the axis of the drive shaft. The two ends of the stop lever are respectively provided with a first limiting protrusion and a second limiting protrusion. The first limiting protrusion has a first limiting surface, which is used to abut against the first limiting groove. The second limiting protrusion has a second limiting surface, which is used to abut against the second limiting groove after the drive shaft is rotated 180 degrees. The second limiting surface and the first limiting surface are coplanar, and the axis of the drive shaft is located within the second limiting surface.

[0010] The rotating base is connected to the drive shaft and the wafer clamp respectively;

[0011] The wafer fixture is used to place wafers.

[0012] Based on the above technical solutions, preferably, the cross-section of the limiting block is provided with a first center line and a second center line. The first center line is parallel to the axial direction of the transmission shaft. The first center line and the axis of the transmission shaft are located in the same vertical plane. The first limiting groove and the second limiting groove are respectively formed by extending from the first center line to both sides to the edge. The first limiting groove and the second limiting groove are located on both sides of the second center line.

[0013] Based on the above technical solutions, preferably, the wafer fixture includes an intermediate disk, a first pressing plate, a second pressing plate, and a pressing plate moving assembly. The intermediate disk is connected to the rotating base, and the intermediate disk is provided with placement holes. The first pressing plate and the second pressing plate are slidably connected to both sides of the intermediate disk, respectively. The pressing plate moving assembly is used to drive the first pressing plate and the second pressing plate to move.

[0014] In the initial state, the first pressure plate is located inside the placement hole and forms a placement area for placing the wafer with the placement hole, while the second pressure plate is located outside the placement hole;

[0015] During the rotation of the rotating seat driven by the drive shaft, the pressing plate moving assembly is used to move the first pressing plate away from the placement hole and move the second pressing plate closer to the placement hole, until the rotating seat rotates 180 degrees, at which point the second pressing plate is located inside the placement hole and the first pressing plate is located outside the placement hole.

[0016] Based on the above technical solutions, preferably, the intermediate disk is provided with a first guide groove and a second guide groove that are parallel to each other;

[0017] The first pressing plate includes a first pressing part and a first connecting piece. The first pressing part is an arc-shaped ring. The outer diameter of the wafer is between the inner diameter of the first pressing part and the diameter of the placement hole. The first connecting piece is provided with a first sliding post, which is slidably disposed in the first guide groove.

[0018] The second pressing plate includes a second pressing part and a second connecting piece. The second pressing part is an arc-shaped ring. The outer diameter of the wafer is between the inner diameter of the second pressing part and the diameter of the placement hole. The first connecting piece is provided with a second sliding post, which is slidably disposed in the second guide groove.

[0019] The tablet pressing moving assembly is connected to the first connecting piece and the second connecting piece, respectively.

[0020] Based on the above technical solutions, preferably, the tablet pressing moving assembly includes a guide rail block, a first slider, a second slider, a connecting rope, a first driving component, and a second driving component;

[0021] The guide rail block is mounted on the rotating seat. The bottom and top surfaces of the guide rail block are respectively provided with a first guide rail and a second guide rail. A hanging post is provided on the side of the guide rail block at the end away from the placement hole.

[0022] The first slider is slidably mounted on the first guide rail and connected to the first connecting piece;

[0023] The second slider is slidably mounted on the second guide rail and connected to the second connecting piece;

[0024] The connecting rope is wound around the hanging post, and its two ends are respectively connected to the first slider and the second slider;

[0025] The first driving component is mounted on the rotating base and is used to push the first slider to move closer to the placement hole, and to drive the second slider to move away from the placement hole via the connecting rope;

[0026] The second driving component is mounted on the rotating base and is used to push the second slider to move closer to the placement hole, and to drive the first slider to move away from the placement hole via the connecting rope;

[0027] In the initial state, the second driving member is in contact with the second slider, and the first driving member and the first slider are spaced apart.

[0028] Based on the above technical solutions, preferably, the bottom and top surfaces of the guide block are respectively provided with a first stop block and a second stop block at the end near the placement hole.

[0029] Based on the above technical solutions, preferably, the first slider is provided with a first contact portion for contacting the first driving member, and the second slider is provided with a second contact portion for contacting the second driving member.

[0030] Based on the above technical solutions, preferably, the tablet pressing moving assembly further includes a first connecting rod and a second connecting rod; one end of the first connecting rod is connected to the first abutting part, and the other end is connected to the first connecting piece; one end of the second connecting rod is connected to the second abutting part, and the other end is connected to the second connecting piece.

[0031] Based on the above technical solutions, preferably, the drive assembly further includes a transmission mechanism, which includes a driving gear and a driven gear. The driving gear is connected to the drive device, and the driven gear is mounted on the transmission shaft and meshes with the driving gear.

[0032] In a second aspect, the present invention provides a wafer coating process using the wafer coating equipment described in the first aspect, comprising:

[0033] Place the wafer on the wafer jig;

[0034] The drive device drives the transmission shaft to rotate 180 degrees forward, which in turn drives the rotating seat and wafer clamp to rotate 180 degrees forward, and the second limiting protrusion abuts against the second limiting groove.

[0035] The drive device drives the transmission shaft to reverse 180 degrees to reset it, which in turn drives the rotating seat and the wafer clamp to rotate 180 degrees in the opposite direction, and the first limiting protrusion abuts against the first limiting groove.

[0036] The wafer coating equipment of the present invention has the following advantages over the prior art:

[0037] (1) The stop bar is connected to the drive shaft. The second limiting surface and the first limiting surface are coplanar, and the axis of the drive shaft is located in the second limiting surface. In the initial state, the first limiting surface abuts against the first limiting groove. After the drive shaft rotates 180 degrees, the second limiting surface abuts against the second limiting groove. This wafer coating equipment uses the principle that a straight line will coincide with the original straight line after rotating 180 degrees around any point on it. It limits the position through a mechanical structure, which is convenient to adjust, has high positioning accuracy, high structural rigidity, and improves reliability.

[0038] (2) A first center line and a second center line are provided through the cross-section of the limiting block. The first center line is parallel to the axial direction of the transmission shaft. The first center line and the axis of the transmission shaft are located in the same vertical plane. The first limiting groove and the second limiting groove are respectively formed by extending from the first center line to the edges on both sides. This ensures that the stop bar rotates precisely 180 degrees during the process of switching from the first limiting surface abutting against the first limiting groove to the second limiting surface abutting against the second limiting groove. Since the first limiting groove and the second limiting groove are located on both sides of the second center line, it can ensure that there is a certain separation thickness between the first limiting groove and the second limiting groove, thereby improving the strength and the reliability and stability of the device.

[0039] (3) The intermediate disk is connected to the rotating seat. The intermediate disk has a placement hole. The first pressure plate and the second pressure plate are slidably connected to both sides of the intermediate disk. In the initial state, the first pressure plate is located inside the placement hole and forms a placement area for placing the wafer with the placement hole. The second pressure plate is located outside the placement hole. During the rotation of the rotating seat driven by the transmission shaft, the pressure plate moving assembly drives the first pressure plate to move away from the placement hole and drives the second pressure plate to move closer to the placement hole. When the rotating seat rotates 180 degrees, the second pressure plate is located inside the placement hole and the first pressure plate is located outside the placement hole. This structure can ensure that the wafer is always supported by the first or second pressure plate under the wafer during the flipping process. After the wafer is flipped into place, the top surface of the wafer is unobstructed, which facilitates the coating operation and improves the coating quality.

[0040] (4) In the initial state, the second driving member is in contact with the second slider, and the first driving member and the first slider are spaced apart. During the rotation of the rotating shaft by 180 degrees, the second driving member pushes the second slider to move closer to the placement hole, and drives the first slider to move away from the placement hole through the connecting rope until it rotates 180 degrees to the position. The first slider then contacts the first driving member, thereby causing the first pressing plate to move to the first pressing part located outside the placement hole, and the second pressing plate to move to the second pressing part located inside the placement hole. This achieves the linkage between the first pressing plate and the second pressing plate, ensuring that the wafer is always supported by the first pressing plate or the second pressing plate during the flipping process, thus improving stability. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 This is a perspective view of the wafer coating equipment in an embodiment of the present invention;

[0043] Figure 2 This is an exploded view of the wafer coating equipment in an embodiment of the present invention;

[0044] Figure 3 This is a schematic diagram of the structure of the rack and drive assembly in an embodiment of the present invention;

[0045] Figure 4 This is a schematic diagram of the drive shaft, limiting block, and stop lever in an embodiment of the present invention.

[0046] Figure 5 This is a schematic diagram of the structure of the limiting block in an embodiment of the present invention;

[0047] Figure 6 The three-dimensional representation of the stop lever in the embodiment of the present invention Figure 1 ;

[0048] Figure 7 The three-dimensional representation of the stop lever in the embodiment of the present invention Figure 2 ;

[0049] Figure 8 This is a schematic diagram of the structure of the rotary table and wafer clamp in an embodiment of the present invention;

[0050] Figure 9 This is a schematic diagram of the structure of the rotating seat in an embodiment of the present invention;

[0051] Figure 10 This is a schematic diagram of the wafer clamp structure in an embodiment of the present invention;

[0052] Figure 11 This is a schematic diagram of the tablet pressing and moving assembly in an embodiment of the present invention;

[0053] Figure 12 This is a perspective view of the intermediate disc, the first pressing plate, and the second pressing plate in an embodiment of the present invention, viewed from the top.

[0054] Figure 13 This is a perspective view of the intermediate disc, the first pressing plate, and the second pressing plate in an embodiment of the present invention, viewed from the bottom.

[0055] Figure 14 This is a schematic diagram of the structure of the first connecting rod in an embodiment of the present invention;

[0056] Figure 15 This is a schematic diagram of the wafer coating process in an embodiment of the present invention.

[0057] Explanation of reference numerals in the attached drawings: 1-frame, 2-drive assembly, 3-stop lever, 4-rotor seat, 5-wafer clamp;

[0058] 100-chip;

[0059] 11-Limiting block, 111-First limiting groove, 112-Second limiting groove, X-First center line, Y-Second center line;

[0060] 21-Drive device, 22-Transmission shaft, 221-Mounting hole, 23-Bearing, 24-Transmission mechanism, 241-Driving gear, 242-Driven gear;

[0061] 31-First limiting protrusion, 311-First limiting surface, 32-Second limiting protrusion, 321-Second limiting surface;

[0062] 41-Mounting slot, 42-Threaded hole;

[0063] 51-Intermediate disc, 511-Placement hole, 512-First guide groove, 513-Second guide groove, 52-First pressing plate, 521-First pressing part, 522-First connecting piece, 523-First sliding column, 53-Second pressing plate, 531-First pressing part, 532-First connecting piece, 533-Second sliding column, 54-Plate pressing moving assembly, 541-Guide block, 5411-First guide rail, 5412-Second guide rail, 5413 - Hanging post, 5414- First stop block, 5415- Second stop block, 542- First slider, 5421- First contact part, 543- Second slider, 5431- Second contact part, 544- Connecting rope, 545- First driving component, 546- Second driving component, 547- First connecting rod, 5471- First horizontal bar, 5472- First vertical bar, 5473- First connecting part, 5474- First mounting part, 548- Second connecting rod. Detailed Implementation

[0064] The technical solutions of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0065] Reference Figure 1-14 As shown, a first aspect of the present invention provides a wafer coating apparatus, comprising a frame 1, a drive assembly 2, a stop bar 3, a rotating base 4, and a wafer clamp 5, wherein:

[0066] The frame 1 is provided with a limiting block 11, and the limiting block 11 is provided with a first limiting groove 111 and a second limiting groove 112; the limiting block 11 is located on the top surface of the frame 1, the center line of the limiting block 11 and the center line of the stop bar 3 are located in the same vertical plane, and the lengths of the two along the diameter direction of the transmission shaft 22 are the same.

[0067] The drive assembly 2 includes a drive device 21 and a drive shaft 22. The drive device 21 is mounted on the frame 1 and is drivenly connected to the drive shaft 22. The drive shaft 22 is provided with a mounting hole 221 in the radial direction. The drive shaft 22 is rotatably mounted on a bearing 23, and the bearing 23 is fixed on the frame 1, so that the drive shaft 22 can be rotatably mounted on the frame 1.

[0068] The stop lever 3 is connected to the drive shaft 22. The stop lever 3 passes through the mounting hole 221 and is fixedly connected to the connecting shaft. The two ends of the stop lever 3 are symmetrical about the axis of the drive shaft 22. The two ends of the stop lever 3 are respectively provided with a first limiting protrusion 31 and a second limiting protrusion 32. The first limiting protrusion 31 and the second limiting protrusion 32 are located on the same side of the axis of the drive shaft 22 and on both sides of the diameter direction of the drive shaft 22. The first limiting protrusion 31 is provided with a first limiting surface 311, which is used to abut against the first limiting groove 111. The second limiting protrusion 32 is provided with a second limiting surface 321, which is used to abut against the second limiting groove 112 after the drive shaft 22 is rotated 180 degrees. The second limiting surface 321 and the first limiting surface 311 are coplanar, and the axis of the drive shaft 22 is located within the second limiting surface 321.

[0069] The rotating base 4 is connected to the drive shaft 22 and the wafer clamp 5 respectively;

[0070] The wafer clamp 5 is used to place the wafer 100.

[0071] It should be noted that the coating equipment should also include parts for performing the coating process. These parts are standard features in existing technologies and are present in every coating equipment, so they will not be described in detail here.

[0072] The wafer coating equipment proposed in this embodiment is connected to the transmission shaft 22 via the stop bar 3. The second limiting surface 321 and the first limiting surface 311 are coplanar, and the axis of the transmission shaft 22 is located within the second limiting surface 321. In the initial state, the first limiting surface 311 abuts against the first limiting groove 111. After the transmission shaft 22 rotates 180 degrees, the second limiting surface 321 abuts against the second limiting groove 112. This wafer coating equipment utilizes the principle that a straight line rotates 180 degrees around any point on it and then coincides with the original straight line. It uses a mechanical structure for limiting, which is convenient to adjust, has high positioning accuracy, high structural rigidity, and improves reliability.

[0073] In some embodiments, the cross-section of the limiting block 11 is provided with a first center line X and a second center line Y. The first center line X is parallel to the axial direction of the transmission shaft 22, and the second center line Y is perpendicular to the first center line X. The first center line X and the axis of the transmission shaft 22 are located in the same vertical plane. The first limiting groove 111 and the second limiting groove 112 are respectively formed by extending from the first center line X to the edges on both sides. The first limiting groove 111 and the second limiting groove 112 are located on both sides of the second center line Y. The first limiting groove 111 and the second limiting groove 112 are formed by extending from the first center line X to both sides to the edge, respectively. This ensures that the stop lever 3 rotates precisely 180 degrees during the process of switching from the contact between the first limiting surface 311 and the first limiting groove 111 to the contact between the second limiting surface 321 and the second limiting groove 112, thereby improving the precision and accuracy of rotation control. Since the first limiting groove 111 and the second limiting groove 112 are located on both sides of the second center line Y, a certain separation thickness can be ensured between the first limiting groove 111 and the second limiting groove 112, thereby improving strength and enhancing the reliability and stability of the device.

[0074] In some embodiments, the wafer jig 5 includes an intermediate disk 51, a first pressing plate 52, a second pressing plate 53, and a pressing plate moving assembly 54. The intermediate disk 51 is connected to the rotating base 4, and the intermediate disk 51 is provided with a placement hole 511. The first pressing plate 52 and the second pressing plate 53 are slidably connected to both sides of the intermediate disk 51, respectively. The pressing plate moving assembly 54 is used to drive the first pressing plate 52 and the second pressing plate 53 to move.

[0075] The rotating base 4 is provided with a mounting groove 41, and the rotating base 4 is provided with a threaded hole 42 at the position corresponding to the mounting groove 41. The intermediate plate 51 is placed in the mounting groove 41, and the two sides of the intermediate plate 51 are abutted and fixed by the set bolts passing through the threaded hole 42 respectively. There is a gap between the top surface and the bottom surface of the intermediate plate 51 and the mounting groove 41 to allow the first pressure plate 52 and the second pressure plate 53 to pass through.

[0076] In the initial state, the first pressing sheet 52 is located inside the placement hole 511 and forms a placement area for placing the wafer 100 with the placement hole 511, and the second pressing sheet 53 is located outside the placement hole 511;

[0077] During the process of the drive shaft 22 driving the rotating seat 4 to rotate, the pressing plate moving assembly 54 is used to drive the first pressing plate 52 to move away from the placement hole 511 and drive the second pressing plate 53 to move closer to the placement hole 511, until the rotating seat 4 rotates 180 degrees, the second pressing plate 53 is located inside the placement hole 511 and the first pressing plate 52 is located outside the placement hole 511.

[0078] The structure described in this embodiment ensures that during the flipping process, the wafer 100 is always supported by a first pressure plate 52 or a second pressure plate 53, and that the top surface of the wafer 100 is unobstructed after flipping, which facilitates the coating operation and improves the coating quality.

[0079] In some embodiments, the intermediate disk 51 is provided with a first guide groove 512 and a second guide groove 513 that are parallel to each other. The first guide groove 512 and the second guide groove 513 have the same length and are both oblong holes.

[0080] The first pressing plate 52 includes a first pressing part 531521 and a first connecting piece 532522. The first pressing part 531521 is an arc-shaped ring with a central angle greater than 180 degrees. The outer diameter of the wafer 100 is between the inner diameter of the first pressing part 531521 and the diameter of the placement hole 511. A first sliding post 523 is provided on the first connecting piece 532522. The first sliding post 523 is slidably disposed in the first guide groove 512. In the initial state, the first sliding post 523 is inserted into the first guide groove 512 from below the intermediate disk 51. The height of the first sliding post 523 is less than or equal to the depth of the first guide groove 512, which does not affect the movement of the second pressing plate 53.

[0081] The second pressing plate 53 includes a second pressing part and a second connecting piece. The second pressing part is an arc-shaped ring with a central angle greater than 180 degrees. The outer diameter of the wafer 100 is between the inner diameter of the second pressing part and the diameter of the placement hole 511. A second sliding post 533 is provided on the first connecting piece 532. The second sliding post 533 is slidably disposed in the second guide groove 513. In the initial state, the second sliding post 533 is inserted into the second guide groove 513 from above the intermediate disk 51. The height of the second sliding post 533 is less than or equal to the depth of the second guide groove 513, and does not affect the movement of the first pressing plate 52.

[0082] The tablet pressing moving assembly 54 is connected to the first connecting piece 532522 and the second connecting piece, respectively.

[0083] The length of the first guide groove 512 can be set as follows: In the initial state, the first sliding post 523 is located at the leftmost end of the first guide groove 512, while the second sliding post 533 is located at the rightmost end of the second guide groove 513. The pressing plate moving assembly 54 drives the first pressing plate 52 to move away from the placement hole 511, and drives the second pressing plate 53 to move closer to the placement hole 511, until the rotating seat 4 rotates 180 degrees. At this time, the second pressing plate 53 is located inside the placement hole 511, and the first pressing plate 52 is located outside the placement hole 511. At this time, the first sliding post 523 is located at the rightmost end of the first guide groove 512, and the second sliding post 533 is located at the leftmost end of the second guide groove 513. Through the above settings, the first guide groove 512 can limit the sliding of the first sliding post 523, and the second guide groove 513 can limit the sliding of the second sliding post 533, thereby improving the reliability and stability of the device.

[0084] In some embodiments, the tablet pressing moving assembly 54 includes a guide block 541, a first slider 542, a second slider 543, a connecting rope 544, a first driving member 545, and a second driving member 546, wherein both the first driving member 545 and the second driving member 546 are cylinders.

[0085] The guide block 541 is mounted on the rotating seat 4. The bottom and top surfaces of the guide block 541 are respectively provided with a first guide rail 5411 and a second guide rail 5412. A hanging post 5413 is provided on the side of the guide block 541 at the end away from the placement hole 511.

[0086] The first slider 542 is slidably mounted on the first guide rail 5411 and is connected to the first connecting piece 532522;

[0087] The second slider 543 is slidably mounted on the second guide rail 5412 and connected to the second connecting piece;

[0088] The connecting rope 544 is wound around the hanging post 5413, and its two ends are respectively connected to the first slider 542 and the second slider 543;

[0089] The first driving member 545 is mounted on the rotating base 4 and is used to push the first slider 542 to move closer to the placement hole 511, and drive the second slider 543 to move away from the placement hole 511 through the connecting rope 544.

[0090] The second driving member 546 is mounted on the rotating base 4 and is used to push the second slider 543 to move closer to the placement hole 511, and drive the first slider 542 to move away from the placement hole 511 through the connecting rope 544.

[0091] In the initial state, the second driving member 546 is in contact with the second slider 543, and the first driving member 545 and the first slider 542 are spaced apart;

[0092] During the rotation of the rotating shaft 180 degrees in the forward direction, the second driving member 546 pushes the second slider 543 to move closer to the placement hole 511, and drives the first slider 542 to move away from the placement hole 511 through the connecting rope 544, until the rotation is completed 180 degrees. The first slider 542 abuts against the first driving member 545, thereby causing the first pressing plate 52 to move to the first pressing part 531521 located outside the placement hole 511, and the second pressing plate 53 to move to the second pressing part located inside the placement hole 511.

[0093] During the process of rotating the shaft 180 degrees in the opposite direction (i.e., resetting), the second drive member 546 retracts and resets. At this time, the first slider 542 only abuts against the second drive member 546 and will not retract with the second drive member 546. The first drive member 545 pushes the first slider 542 to move closer to the placement hole 511, and drives the second slider 543 to move away from the placement hole 511 through the connecting rope 544, until it rotates 180 degrees to the position and returns to the initial state. The second drive member 546 and the second slider 543 then abut against each other.

[0094] The structure proposed in this embodiment uses a connecting rope 544 to achieve the linkage between the first pressure plate 52 and the second pressure plate 53, ensuring that the wafer 100 is always supported by the first pressure plate 52 or the second pressure plate 53 during the flipping process of the wafer jig 5, thereby improving stability.

[0095] In some embodiments, the bottom and top surfaces of the guide block 541 are respectively provided with a first stop 5414 and a second stop 5415 at the end near the placement hole 511. The first stop 5414, located on the bottom surface of the guide block 541 near the placement hole 511, limits the sliding of the first slider 542. When the first stop 5414 abuts against the first slider 542, the first sliding post 523 moves to the leftmost end. Similarly, the second stop 5415, located on the top surface of the guide block 541 near the placement hole 511, limits the sliding of the second slider 543. When the second stop 5415 abuts against the second slider 543, the second sliding post 533 moves to the leftmost end. The limiting action of the first stop 5414 and the second stop 5415 improves the reliability and stability of the device.

[0096] In some embodiments, the first slider 542 is provided with a first abutting portion 5421 for abutting against the first driving member 545, and the second slider 543 is provided with a second abutting portion 5431 for abutting against the second driving member 546. The first abutting portion 5421 is a square protruding from the first slider 542 in a direction away from the first guide rail 5411. By protruding upward by a certain distance, it can fill the longitudinal distance between the first slider 542 and the first driving member 545, avoiding installation interference. At the same time, it can make the contact area between the first driving member 545 and the first abutting portion 5421 larger and the force direction parallel to the first guide rail 5411, which can make the sliding of the first slider 542 smoother. The second abutting portion 5431 is a square protruding from the second slider 543 in a direction away from the second guide rail 5412, and its function and effect are the same as the first abutting portion 5421.

[0097] In some embodiments, the tablet pressing moving assembly 54 further includes a first connecting rod 547 and a second connecting rod 548; one end of the first connecting rod 547 is connected to the first abutment portion 5421, and the other end is connected to the first connecting piece 532522; one end of the second connecting rod 548 is connected to the second abutment portion 5431, and the other end is connected to the second connecting piece. The first connecting rod 547 includes a first horizontal rod 5471 and a first vertical rod 5472. The first horizontal rod 5471 is provided with a first connecting portion 5473, which is a directional hole. The first connecting portion 5473 is sleeved on the first abutment portion 5421 for connection. The side end of the first vertical rod 5472 is provided with a first mounting portion 5474, which is a slot. The first mounting portion 5474 is engaged on the first connecting piece 532522. The second connecting rod 548 has the same structure as the first connecting rod 547, and the two are interchangeable. They can be replaced during maintenance to reduce costs.

[0098] In some embodiments, the drive assembly 2 further includes a transmission mechanism 24, which includes a drive gear 241 and a driven gear 242. The drive gear 241 is connected to the drive device 21, and the driven gear 242 is mounted on the transmission shaft 22 and meshes with the drive gear 241. The drive device 21 drives the drive gear 241 to rotate, which in turn drives the meshing driven gear 242 to rotate, thereby driving the driven shaft to rotate. The drive device 21 is a motor, and the forward and reverse rotation of the motor enables the driven shaft to rotate 180 degrees forward and 180 degrees reverse. Through the buffering and intermediate rotation of the transmission mechanism 24, the impact force on the stop lever 3 caused by a sudden stop when the motor directly drives the driven shaft can be avoided, thus improving the service life of the device.

[0099] Of course, the transmission mechanism 24 can also be other transmission structures such as gear and rack transmission, worm gear transmission, chain transmission, etc.

[0100] Based on the same concept, a second aspect of the present invention, combined with... Figure 15 As shown, a wafer coating process is provided, using the wafer coating equipment described in the first aspect embodiment, comprising:

[0101] Step S1: Place the wafer 100 on the wafer jig 5;

[0102] Step S2: Drive the transmission shaft 22 to rotate 180 degrees forward by the drive device 21, thereby causing the rotating seat 4 and the wafer clamp 5 to rotate 180 degrees forward, and the second limiting protrusion 32 abuts against the second limiting groove 112.

[0103] Step S3: Drive the transmission shaft 22 to reverse 180 degrees by the drive device 21 to reset, and drive the rotating seat 4 and the wafer clamp 5 to rotate 180 degrees in the opposite direction, so that the first limiting protrusion 31 abuts against the first limiting groove 111.

[0104] Steps S2 and S3 also include: inspecting the surface of wafer 100.

[0105] Between step S2 and step S3, a coating operation is also performed on the surface of wafer 100.

[0106] In some embodiments, for a wafer 100 that requires double-sided coating, after step S3, a coating operation is further performed on the other side of the wafer 100.

[0107] The wafer coating process proposed in this embodiment utilizes the principle that a straight line will coincide with the original straight line after rotating 180 degrees around any point on it. The mechanical structure provides positioning, which is convenient to adjust, has high positioning accuracy, high structural rigidity, and improves reliability.

[0108] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A wafer coating apparatus, characterized in that, Includes a rack, drive assembly, lever, rotary table, and wafer clamp, wherein: The frame is provided with a limiting block, and the limiting block is provided with a first limiting groove and a second limiting groove; The drive assembly includes a drive device and a transmission shaft, wherein the drive device is mounted on the frame and is drivenly connected to the transmission shaft; The stop lever is connected to the drive shaft. The two ends of the stop lever are symmetrical about the axis of the drive shaft. The two ends of the stop lever are respectively provided with a first limiting protrusion and a second limiting protrusion. The first limiting protrusion has a first limiting surface, which is used to abut against the first limiting groove. The second limiting protrusion has a second limiting surface, which is used to abut against the second limiting groove after the drive shaft is rotated 180 degrees. The second limiting surface and the first limiting surface are coplanar, and the axis of the drive shaft is located within the second limiting surface. The rotating base is connected to the drive shaft and the wafer clamp respectively; The wafer fixture is used to place wafers.

2. The wafer coating equipment as described in claim 1, characterized in that, The cross-section of the limiting block has a first center line and a second center line. The first center line is parallel to the axial direction of the transmission shaft. The first center line and the axial direction of the transmission shaft are located in the same vertical plane. The first limiting groove and the second limiting groove are respectively formed by extending from the first center line to both sides to the edge. The first limiting groove and the second limiting groove are located on both sides of the second center line.

3. The wafer coating equipment as described in claim 1, characterized in that, The wafer fixture includes an intermediate disk, a first pressing plate, a second pressing plate, and a pressing plate moving assembly. The intermediate disk is connected to the rotating base and has placement holes. The first pressing plate and the second pressing plate are slidably connected to both sides of the intermediate disk. The pressing plate moving assembly is used to drive the first pressing plate and the second pressing plate to move. In the initial state, the first pressure plate is located inside the placement hole and forms a placement area for placing the wafer with the placement hole, while the second pressure plate is located outside the placement hole; During the rotation of the rotating seat driven by the drive shaft, the pressing plate moving assembly is used to move the first pressing plate away from the placement hole and move the second pressing plate closer to the placement hole, until the rotating seat rotates 180 degrees, at which point the second pressing plate is located inside the placement hole and the first pressing plate is located outside the placement hole.

4. The wafer coating equipment as described in claim 3, characterized in that, The intermediate disk is provided with a first guide groove and a second guide groove that are parallel to each other. The first pressing plate includes a first pressing part and a first connecting piece. The first pressing part is an arc-shaped ring. The outer diameter of the wafer is between the inner diameter of the first pressing part and the diameter of the placement hole. The first connecting piece is provided with a first sliding post, which is slidably disposed in the first guide groove. The second pressing plate includes a second pressing part and a second connecting piece. The second pressing part is an arc-shaped ring. The outer diameter of the wafer is between the inner diameter of the second pressing part and the diameter of the placement hole. The first connecting piece is provided with a second sliding post, which is slidably disposed in the second guide groove. The tablet pressing moving assembly is connected to the first connecting piece and the second connecting piece, respectively.

5. The wafer coating equipment as described in claim 4, characterized in that, The tablet pressing moving assembly includes a guide rail block, a first slider, a second slider, a connecting rope, a first driving component, and a second driving component; The guide rail block is mounted on the rotating seat. The bottom and top surfaces of the guide rail block are respectively provided with a first guide rail and a second guide rail. A hanging post is provided on the side of the guide rail block at the end away from the placement hole. The first slider is slidably mounted on the first guide rail and connected to the first connecting piece; The second slider is slidably mounted on the second guide rail and connected to the second connecting piece; The connecting rope is wound around the hanging post, and its two ends are respectively connected to the first slider and the second slider; The first driving component is mounted on the rotating base and is used to push the first slider to move closer to the placement hole, and to drive the second slider to move away from the placement hole via the connecting rope; The second driving component is mounted on the rotating base and is used to push the second slider to move closer to the placement hole, and to drive the first slider to move away from the placement hole via the connecting rope; In the initial state, the second driving member is in contact with the second slider, and the first driving member and the first slider are spaced apart.

6. The wafer coating equipment as described in claim 5, characterized in that, The bottom and top surfaces of the guide block are respectively provided with a first stop and a second stop at the end near the placement hole.

7. The wafer coating equipment as described in claim 5, characterized in that, The first slider is provided with a first contact portion for abutting against the first driving member, and the second slider is provided with a second contact portion for abutting against the second driving member.

8. The wafer coating equipment as described in claim 7, characterized in that, The tablet pressing and moving assembly further includes a first connecting rod and a second connecting rod; one end of the first connecting rod is connected to the first abutting part, and the other end is connected to the first connecting piece; one end of the second connecting rod is connected to the second abutting part, and the other end is connected to the second connecting piece.

9. The wafer coating apparatus according to any one of claims 1-8, characterized in that, The drive assembly further includes a transmission mechanism, which includes a drive gear and a driven gear. The drive gear is connected to the drive device, and the driven gear is mounted on the transmission shaft and meshes with the drive gear.

10. A wafer coating process, using the wafer coating equipment according to any one of claims 1-9, characterized in that, include: Place the wafer on the wafer jig; The drive device drives the transmission shaft to rotate 180 degrees forward, which in turn drives the rotating seat and wafer clamp to rotate 180 degrees forward, and the second limiting protrusion abuts against the second limiting groove. The drive device drives the transmission shaft to reverse 180 degrees to reset it, which in turn drives the rotating seat and the wafer clamp to rotate 180 degrees in the opposite direction, and the first limiting protrusion abuts against the first limiting groove.

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