Selective coarsening method for different parts of electroplated part

Abstract

The invention relates to the technical field of surface treatment of electroplated parts, and particularly discloses a selective coarsening method for different parts of an electroplated part. The selective coarsening method for the different parts of the electroplated part comprises the following steps that when the roughness Ra is required to be smaller than 0.4 micron, adopted coarsening liquid 1 comprises the following components of 2-4 parts of an activating agent, 8-10 parts of an inhibitor and 8-10 parts of a brightening agent; when the roughness Ra is required to be 0.4-1.0 mu m, the adopted roughening liquid (2) comprises the following components in parts by weight: 5-7 parts of an activating agent, 5-7 parts of an inhibitor and 5-7 parts of a brightening agent; and when the roughness Ra is required to be greater than 1.0 mu m, the adopted roughening liquid (3) comprises the following components in parts by weight: 8-10 parts of an activating agent, 2-4 parts of an inhibitor and 2-4 parts of a brightening agent. According to the selective coarsening method for different parts of the electroplated part, accurate control over different coarsening degrees of the surface of the electroplated part can be achieved, and the production efficiency and the product quality of the electroplated part are improved.

Description

Technical Field

[0001] The present application relates to the technical field of surface treatment of electroplated parts, and in particular to a method for selectively roughening different parts of an electroplated part. Background Art

[0002] Electroplated parts are widely used in electronics, aerospace, mechanical manufacturing and other fields, which can improve the surface performance and aesthetics of products. With the development of precision manufacturing technology, higher requirements are placed on the surface treatment of electroplated parts, especially the increasing number of application scenarios requiring different roughness for different parts, which poses new challenges to electroplated parts processing technology. Therefore, it is of great significance to develop an efficient and selective roughening method that can meet different roughness requirements.

[0003] At present, in the process of electroplating parts processing, in order to meet the different roughness requirements of different parts, the commonly used methods include but are not limited to using different types of roughening liquids, adjusting the current density or applying different pretreatment processes. For example, different formulations of roughening liquids can be used with different current densities to achieve different roughness requirements, or different degrees of pretreatment can be used for different areas to achieve selective roughening effects. This type of method can achieve roughening treatment of different parts of electroplated parts to a certain extent, but there are still deficiencies in the accuracy of roughening effect control and the stability of the process.

[0004] When dealing with different roughness requirements, the existing selective roughening methods find it difficult to achieve precise control of various roughnesses in the same scheme, especially when dealing with situations where the roughness Ra requirements vary widely from submicron to micron levels. This makes it difficult for the surface quality of the final product to meet high standards. Summary of the invention

[0005] In order to achieve precise control of the roughness of different parts of an electroplated part, the present application provides a method for selectively roughening different parts of an electroplated part.

[0006] The present application provides a method for selectively roughening different parts of an electroplated part, using the following technical solution: A method for selectively roughening different parts of an electroplated part comprises the following steps: Pre-treat the electroplated parts and use mask materials to cover the parts that do not need to be roughened; then, according to the roughness requirements of different parts of the electroplated parts, perform selective roughening on the electroplated parts; When the roughness Ra requirement is less than 0.4 μm, the roughening solution ① used includes the following components: 2-4 parts of activator, 8-10 parts of inhibitor and 8-10 parts of brightener; and the current density ① during the roughening process is controlled to be 5-8A / cm 2 ; When the roughness Ra is required to be 0.4-1.0μm, the roughening solution ② used includes the following components: 5-7 parts of activator, 5-7 parts of inhibitor and 5-7 parts of brightener; and the current density ② during the roughening process is controlled to be 10-15A / cm 2 ; When the roughness Ra requirement is greater than 1.0 μm, the roughening solution ③ used includes the following components: 8-10 parts of activator, 2-4 parts of inhibitor and 2-4 parts of brightener; and the current density ③ during the roughening process is controlled to be 18-20A / cm 2 .

[0007] The present application provides an effective method for selectively roughening different parts of electroplated parts according to different roughness requirements. By pretreating the surface of the electroplated parts and using a mask material to cover the parts that do not need to be roughened, it can be ensured that the parts that need to be roughened are effectively treated without affecting other parts. Furthermore, the present application adopts roughening solutions of different formulations and sets the corresponding current density range according to the specific roughness requirements of different parts of the electroplated parts. Specifically: when the roughness Ra requirement is <0.4μm, the content of the activator is reduced, and the proportion of the inhibitor and the brightener is increased, so that the electroplated layer in this area is smoother, while maintaining a low current density to slow down the growth rate of the electroplated layer and reduce the surface roughness; when the roughness Ra requirement is >1.0μm, the content of the activator should be increased, so that the metal ions in this area are more easily deposited and form a rough surface, and the current density is increased. The faster the growth rate of the electroplated layer, the greater the surface roughness. The present application adjusts the ratio of the roughening solution and the current density at the same time, so that each part of the electroplated part can achieve the expected roughness requirements under precise control. This not only improves the overall quality of the electroplated parts, but also, due to the use of targeted process parameter control, can effectively improve processing efficiency and material utilization, reduce production costs, meet the diverse needs of electroplated parts surface quality in practical applications, and improve the economic benefits of processing.

[0008] In some embodiments, the weight parts of the activator may be 2-3 parts or 3-4 parts.

[0009] In a specific embodiment, the weight portion of the activator can also be 2 parts, 3 parts or 4 parts.

[0010] In some embodiments, the weight portion of the inhibitor may be 8-9 parts or 9-10 parts.

[0011] In a specific embodiment, the weight portion of the inhibitor may also be 8 parts, 9 parts or 10 parts.

[0012] In some embodiments, the weight parts of the activator may be 8-9 parts or 9-10 parts.

[0013] In a specific embodiment, the weight portion of the activator can also be 8 parts, 9 parts or 10 parts.

[0014] In some embodiments, the current density during the roughening process may be 5-7 A / cm 2 or 7-8A / cm 2 .

[0015] In a specific embodiment, the current density ① during the roughening process can be 5A / cm 2 , 7A / cm 2 or 8A / cm 2 .

[0016] In some embodiments, the current density ② during the roughening process may be 10-13 A / cm 2 or 13-15A / cm 2 .

[0017] In a specific embodiment, the current density ② during the roughening process can be 10A / cm 2 , 13A / cm 2 or 15A / cm 2 .

[0018] In some embodiments, the current density ③ during the roughening process can be 18-19A / cm 2 or 19-20A / cm 2 .

[0019] In a specific embodiment, the current density ③ during the roughening process can be 18A / cm 2 、19A / cm 2 or 20A / cm 2 .

[0020] Optionally, the roughening liquid ① comprises the following components: 3 parts of activator, 9 parts of inhibitor and 9 parts of brightener; the roughening liquid ② comprises the following components: 6 parts of activator, 6 parts of inhibitor and 6 parts of brightener; the roughening liquid ③ comprises the following components: 9 parts of activator, 3 parts of inhibitor and 3 parts of brightener.

[0021] Optionally, the activator is selected from one or more of palladium activator, sodium hypophosphite, chromic acid and potassium permanganate; the inhibitor is selected from one or more of polyethylene glycol, polyether, polypropyl, polyacetal; the brightener is selected from one or more of sodium benzene sulfinate, dodecanol, polyoxyethylene ether alcohol and dibenzylidene acetone.

[0022] Optionally, the activator is sodium hypophosphite; the inhibitor is polyethylene glycol; and the brightener is sodium benzenesulfinate.

[0023] Optionally, the mask material is a polyimide film or a polystyrene board.

[0024] Optionally, the pretreatment includes cleaning, pickling and neutralization treatment.

[0025] The present application first removes impurities such as oil, oxides, etc. on the surface of the electroplated parts by cleaning, ensuring that the surface of the electroplated parts is clean and free of any impurities; then, the oxide layer on the surface of the electroplated parts is effectively removed by pickling, the metal surface is activated, and the roughening effect is improved; then, a neutralization treatment is performed to effectively prevent the acid remaining on the surface of the electroplated parts after pickling from affecting the subsequent roughening treatment.

[0026] Optionally, the pickling solution used in the pickling is selected from one or more of sulfuric acid, hydrochloric acid and nitric acid.

[0027] Optionally, the alkaline solution used in the neutralization treatment is selected from one or more of sodium hydroxide, potassium hydroxide and sodium bicarbonate.

[0028] In summary, this application has the following beneficial effects: The present application provides a method for selectively roughening different parts of an electroplated part. The method can achieve different degrees of roughness requirements for the electroplated part by adjusting the ratio of the roughening solution and the current density during the roughening process. DETAILED DESCRIPTION

[0029] The present application provides a method for selectively roughening different parts of an electroplated part, comprising the following steps: The electroplated parts are pre-treated by cleaning, pickling and neutralization, and then the parts that do not need to be roughened are covered with mask materials; then, the electroplated parts are selectively roughened according to the roughness requirements of different parts of the electroplated parts; When the roughness Ra requirement is less than 0.4 μm, the roughening solution ① used includes the following components: 2-4 parts of activator, 8-10 parts of inhibitor and 8-10 parts of brightener; and the current density ① during the roughening process is controlled to be 5-8A / cm 2 ; When the roughness Ra is required to be 0.4-1.0μm, the roughening solution ② used includes the following components: 5-7 parts of activator, 5-7 parts of inhibitor and 5-7 parts of brightener; and the current density ② during the roughening process is controlled to be 10-15A / cm 2 ; When the roughness Ra requirement is greater than 1.0 μm, the roughening solution ③ used includes the following components: 8-10 parts of activator, 2-4 parts of inhibitor and 2-4 parts of brightener; and the current density ③ during the roughening process is controlled to be 18-20A / cm 2 .

[0030] Wherein, the mask material is a polyimide film or a polystyrene plate. The pickling solution used in the pickling is selected from one or more of sulfuric acid, hydrochloric acid and nitric acid. The alkaline solution used in the neutralization treatment is selected from one or more of sodium hydroxide, potassium hydroxide and sodium bicarbonate. The activator is selected from one or more of palladium activator, sodium hypophosphite, chromic acid and potassium permanganate; the inhibitor is selected from one or more of polyethylene glycol, polyether, polypropyl, polyacetal; the brightener is selected from one or more of sodium benzene sulfinate, dodecanol, polyoxyethylene ether alcohol and dibenzylidene acetone The raw materials, reagents, solvents, etc. used in the examples of this application can all be obtained commercially.

[0031] The present application is further described in detail below in combination with preparation examples, embodiments, and performance testing experiments.

[0032] Preparation Example 1-15 Preparation Examples 1-15 each provide a roughening solution.

[0033] The preparation method of the roughening liquid is as follows: the components of the roughening liquid are mixed according to the weight parts shown in Table 1 and stirred evenly to obtain the roughening liquid.

[0034] The difference between the above preparation examples is that the added amounts of the activator, inhibitor and brightener are shown in Table 1 below.

[0035] Table 1 provides the addition amount of each component in the roughening solution of Preparation Examples 1-15.

[0036] Example 1 Embodiment 1 provides a method for selectively roughening different parts of an electroplated part.

[0037] The selective roughening method for different parts of the electroplated part provided in Example 1 specifically comprises the following steps: (1) First, spray clean the electroplated parts.

[0038] (2) Use hydrochloric acid to pickle the electroplated parts after cleaning.

[0039] (3) Use sodium hydroxide solution to neutralize the electroplated parts after pickling.

[0040] (4) Then, 21 areas (modules 1-21) were divided on the electroplated part, and then the boundaries of each area were covered with a polyimide film. Modules 1-21 were roughened separately. The type of roughening solution and the current density of the roughening treatment in modules 1-21 are shown in Table 2.

[0041] (5) After the roughening is completed, the electroplated parts are cleaned to remove surface impurities and attachments generated during the roughening process.

[0042] The surface roughness of each module of the electroplated part was tested, and the results are shown in Table 2 below.

[0043] Table 2 Roughening solution, current density and roughness test results used in modules 1-21 According to the test results in Table 2, it can be seen that the use of the roughening solution provided in Preparation Examples 1-15 to roughen the surface of the electroplated parts can achieve precise control of different roughening degrees.

[0044] The test results of modules 1-5 and 16-17 show that by using the following components: 2-4 parts of activator, 8-10 parts of inhibitor and 8-10 parts of brightener as the roughening liquid, and controlling the current density ① during the roughening process to 5-8A / cm 2 After roughening treatment, the roughness of the electroplated parts can reach 0.32-0.39μm (<0.4μm).

[0045] The test results of modules 6-10 and 18-19 show that by using the following components: 5-7 parts of activator, 5-7 parts of inhibitor and 5-7 parts of brightener as the roughening liquid, and controlling the current density ① during the roughening process to 10-15A / cm 2 The roughness of the electroplated parts after roughening treatment is 0.48-0.93μm (0.4-1.0μm).

[0046] The test results of modules 11-15 and modules 20-22 show that by using the following components: 8-10 parts of activator, 2-4 parts of inhibitor and 2-4 parts of brightener as the roughening liquid, and controlling the current density ① during the roughening process to 18-20A / cm 2 The roughness of the electroplated parts after roughening treatment is 1.06-1.30μm (>1.0μm).

[0047] In summary, the present application provides a method for selectively roughening different parts of an electroplated part. The method can achieve different degrees of roughness requirements for the electroplated part by adjusting the ratio of the roughening solution and the current density during the roughening process.

[0048] Although the present invention has been described in detail above with general descriptions and specific embodiments, it is obvious to those skilled in the art that some modifications or improvements may be made thereto based on the present invention. Therefore, these modifications or improvements made without departing from the spirit of the present invention all fall within the scope of protection claimed by the present invention.

Claims

1. A method for selectively roughening different parts of an electroplated part, characterized in that: The following steps are involved: Pre-treat the electroplated parts and use mask materials to cover the parts that do not need to be roughened; then, according to the roughness requirements of different parts of the electroplated parts, perform selective roughening on the electroplated parts; When the roughness Ra requirement is less than 0.4 μm, the roughening solution ① used includes the following components: 2-4 parts of activator, 8-10 parts of inhibitor and 8-10 parts of brightener; and the current density ① during the roughening process is controlled to be 5-8A / cm 2 ; When the roughness Ra is required to be 0.4-1.0μm, the roughening solution ② used includes the following components: 5-7 parts of activator, 5-7 parts of inhibitor and 5-7 parts of brightener; and the current density ② during the roughening process is controlled to be 10-15A / cm 2 ; When the roughness Ra requirement is greater than 1.0 μm, the roughening solution ③ used includes the following components: 8-10 parts of activator, 2-4 parts of inhibitor and 2-4 parts of brightener; and the current density ③ during the roughening process is controlled to be 18-20A / cm 2 .

2. The selective roughening method for different parts of an electroplated part according to claim 1, characterized in that: The roughening solution ① comprises the following components: 3 parts of activator, 9 parts of inhibitor and 9 parts of brightener; The roughening solution ② includes the following components: 6 parts of activator, 6 parts of inhibitor and 6 parts of brightener; The roughening solution ③ includes the following components: 9 parts of activator, 3 parts of inhibitor and 3 parts of brightener.

3. The selective roughening method for different parts of an electroplated part according to claim 1, characterized in that: The activator is selected from one or more of palladium activator, sodium hypophosphite, chromic acid and potassium permanganate; the inhibitor is selected from one or more of polyethylene glycol, polyether, polypropyl and polyacetal; the brightener is selected from one or more of sodium benzene sulfinate, dodecanol, polyoxyethylene ether alcohol and dibenzylidene acetone.

4. The selective roughening method for different parts of an electroplated part according to claim 1, characterized in that: The activator is sodium hypophosphite; the inhibitor is polyethylene glycol; and the brightener is sodium benzenesulfinate.

5. The selective roughening method for different parts of an electroplated part according to claim 1, characterized in that: The mask material is a polyimide film or a polystyrene plate.

6. The selective roughening method for different parts of an electroplated part according to claim 1, characterized in that: The pretreatment includes cleaning, pickling and neutralization.

7. The selective roughening method for different parts of an electroplated part according to claim 1, characterized in that: The pickling solution used in the pickling is selected from one or more of sulfuric acid, hydrochloric acid and nitric acid.

8. The selective roughening method for different parts of an electroplated part according to claim 1, characterized in that: The alkaline solution used in the neutralization treatment is selected from one or more of sodium hydroxide, potassium hydroxide and sodium bicarbonate.

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