piezoelectric pump cooling device

Abstract

This invention relates to the field of electronic equipment technology and discloses a piezoelectric pump cooling device, comprising: a piezoelectric fluid pump and a heat conductor. The piezoelectric fluid pump has a piezoelectric drive assembly and an air inlet and an air outlet connected to each other. The heat conductor has an air inlet and a heat dissipation channel. The heat conductor is connected to the piezoelectric fluid pump, and the air inlet, heat dissipation channel, air inlet, and air outlet are sequentially connected. The piezoelectric drive assembly can drive fluid to flow from the air inlet to the air outlet. The outer wall of the heat conductor has a heat-conducting part for connecting to a heat source. This invention can prevent the discharged heat from returning to the piezoelectric pump cooling device, ensuring good heat exchange and significant cooling effect on the equipment.

Description

Technical Field

[0001] This invention relates to the field of electronic equipment technology, and in particular to a piezoelectric pump cooling device. Background Art

[0002] As the operating speed and computing power of electronic devices and integrated circuit chips continue to increase, the associated heat generation problem has become increasingly serious. To solve this problem, the industry has proposed a variety of heat dissipation mechanisms, among which mechanical fans are one of the most common solutions. However, as electronic devices become smaller and more integrated, the heat dissipation effect and applicability of traditional mechanical fans are gradually being limited.

[0003] In recent years, piezoelectric fluid pumps have been proposed as an emerging heat dissipation technology, aiming to provide an effective heat dissipation solution for small electronic devices. However, current piezoelectric fluid pumps are usually integrated with electronic devices or integrated circuit chips, blowing air directly onto heat sources such as electronic devices or integrated circuit chips. During long-term use, dust and moisture in the outside air can easily be brought into the equipment, causing air inlet blockage. In severe cases, it may even damage the internal components of the equipment and affect the normal operation of the equipment. Summary of the Invention

[0004] The purpose of this invention is to design a piezoelectric pump cooling device with better heat dissipation and simpler maintenance.

[0005] To achieve the above objectives, the present invention provides a piezoelectric pump cooling device, comprising: a piezoelectric fluid pump and a heat conductor, wherein the piezoelectric fluid pump has a piezoelectric drive assembly and an air inlet and an air outlet connected to each other, the heat conductor has an air inlet and a heat dissipation channel, the heat conductor is connected to the piezoelectric fluid pump, the air inlet, the heat dissipation channel, the air inlet and the air outlet are sequentially connected, and the piezoelectric drive assembly is capable of driving fluid to flow from the air inlet to the air outlet, and the outer wall of the heat conductor is provided with a heat-conducting part for connecting to a heat source.

[0006] Furthermore, the air outlet is located on one side of the piezoelectric fluid pump in the first direction, and the extension direction of the air inlet is perpendicular to the extension direction of the air outlet.

[0007] Furthermore, the piezoelectric fluid pump is disposed within the heat conductor, and the heat conductor has an air outlet on the side facing the air outlet in the first direction, and the air outlet is connected to the air outlet.

[0008] Furthermore, the heat conductor is wound around the piezoelectric pump, and the inner wall of the heat conductor and part of the outer wall of the piezoelectric pump enclose and define the heat dissipation channel.

[0009] Furthermore, the piezoelectric fluid pump has a first side plate and a second side plate arranged opposite to each other along a second direction, the air inlet is opened on the first side plate, the air inlet is arranged facing the second side plate, and the heat dissipation channel is arranged around the piezoelectric fluid pump;

[0010] The second direction is perpendicular to the first direction.

[0011] Furthermore, the heat dissipation channel is provided with multiple partition walls, which are arranged sequentially at intervals to divide the heat dissipation channel into multiple air ducts, and each air duct is connected to the air inlet and the air intake.

[0012] Furthermore, the partition wall has an air inlet end located near the air inlet, the air inlet end being arranged parallel to the axial direction of the air inlet, or the air inlet end being arranged perpendicular to the circumferential direction of the air inlet.

[0013] Furthermore, the air outlet is located on one side of the piezoelectric pump in the second direction, and the piezoelectric pump also has two side walls arranged opposite to each other in the third direction. The air inlet includes a first sub-air inlet and a second sub-air inlet, which are respectively arranged facing the two side walls. The heat dissipation channel includes a first sub-channel and a second sub-channel. The first sub-air inlet is connected to the air inlet through the first sub-channel, and the second sub-air inlet is connected to the air inlet through the second sub-channel.

[0014] Wherein, any two of the first direction, the second direction, and the third direction are perpendicular to each other.

[0015] Furthermore, the first sub-channel is provided with a plurality of first partition walls, each of which is arranged sequentially at intervals to divide the first sub-channel into a plurality of first air ducts, each of which is connected to the first sub-air inlet and the air inlet; and / or

[0016] The second sub-channel is provided with a plurality of second partition walls, which are arranged sequentially at intervals to divide the second sub-channel into a plurality of second air ducts. Each second air duct is respectively connected to the second sub-air inlet and the air inlet.

[0017] Furthermore, the heat conductor has a heat-conducting plate disposed on one side in the first direction, the heat-conducting plate being defined as a portion of the peripheral wall forming the heat dissipation channel, the heat-conducting part being disposed on the side of the heat-conducting plate opposite to the heat dissipation channel, and the heat-conducting part being fitted to the heat dissipation channel through the heat-conducting plate.

[0018] Compared with the prior art, the piezoelectric pump cooling device of this invention has the following advantages:

[0019] The piezoelectric pump cooling device of this invention allows the heat source to be directly attached to the heat-conducting part. Heat is transferred to the heat dissipation channel through the heat conductor. The piezoelectric pump extracts heat from the heat dissipation channel while simultaneously drawing in cool air from outside through the air inlet for heat exchange with the gas inside the channel. Finally, the heat is discharged outside the device through the air outlet. This design prevents the discharged heat from re-passing through the heat dissipation channel, resulting in better heat exchange and significant cooling. Furthermore, the piezoelectric pump cooling device is separated from heat sources such as electronic devices or integrated circuit chips, ensuring dust and moisture protection inside these heat sources and reducing the risk of damage to internal components. Attached Figure Description

[0020] Figure 1 The isometric view of the piezoelectric pump cooling device according to the first embodiment of the present invention Figure 1 ;

[0021] Figure 2 The isometric view of the piezoelectric pump cooling device according to the first embodiment of the present invention Figure 2 ;

[0022] Figure 3 This is a schematic diagram of the structure of the piezoelectric pump cooling device according to the second embodiment of the present invention;

[0023] Figure 4 This is a schematic diagram of the structure of the piezoelectric pump cooling device according to the third embodiment of the present invention;

[0024] Figure 5 This is a schematic diagram of the structure of the piezoelectric pump cooling device according to the fourth embodiment of the present invention;

[0025] Figure 6 This is a schematic diagram of the structure of the piezoelectric pump cooling device according to the fifth embodiment of the present invention;

[0026] Figure 7 This is a schematic diagram of the structure of the piezoelectric pump cooling device according to the sixth embodiment of the present invention.

[0027] In the diagram, 1 is the piezoelectric fluid pump; 111 is the air outlet; 121 is the air inlet; 122 is the first side plate; 123 is the second side plate; and 124 is the side wall.

[0028] 9. Heat conductor; 90. Heat dissipation channel; 901. First sub-channel; 902. Second sub-channel; 900. Air duct; 9001. First air duct; 9002. Second air duct; 91. Air inlet; 911. First sub-air outlet; 912. Second sub-air outlet; 92. Heat-conducting part; 93. Air outlet; 94. Partition wall; 941. Air inlet end; 942. First partition wall; 943. Second partition wall; 95. Heat-conducting plate;

[0029] x, first direction; y, second direction; z, third direction. Detailed Implementation

[0030] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings and examples. The following examples are for illustrative purposes only and are not intended to limit the scope of the invention.

[0031] In the description of this invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer" used to indicate orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention.

[0032] In the description of this invention, it should be understood that the terms "connected," "linked," and "fixed," etc., used in this invention should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or a welded connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly defined. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0033] In this invention, the terms "first," "second," etc., are used to describe various types of information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from each other. For example, without departing from the scope of this invention, "first" information can also be referred to as "second" information, and similarly, "second" information can also be referred to as "first" information.

[0034] In the description of this invention, any two of the first direction, the second direction, and the third direction are perpendicular or approximately perpendicular to each other.

[0035] Reference Figure 1 and Figure 2 An embodiment of the present invention provides a piezoelectric pump cooling device, comprising:

[0036] The piezoelectric fluid pump 1 and the heat conductor 9 are provided. The piezoelectric fluid pump 1 has a piezoelectric drive assembly and an air inlet 121 and an air outlet 111 that are connected to each other. The heat conductor 9 has an air inlet 91 and a heat dissipation channel 90. The heat conductor 9 is connected to the piezoelectric fluid pump 1. The air inlet 91, the heat dissipation channel 90, the air inlet 121 and the air outlet 111 are connected in sequence. The piezoelectric drive assembly can drive fluid to flow from the air inlet 91 to the air outlet 111. The outer wall of the heat conductor 9 is provided with a heat-conducting part 92 for connecting with a heat source.

[0037] The heat source is directly bonded to the heat-conducting part 92, allowing the heat from the heat source to be transferred to the heat dissipation channel 90 via the heat conductor 9. At this time, the temperature of the area in the heat dissipation channel 90 is higher, while the temperature of the area in the piezoelectric pump 1 is lower, creating a temperature difference between the two areas. Heat is transferred from the heat dissipation channel 90 to the air inlet 121 of the piezoelectric pump 1. Since one end of the heat dissipation channel 90 is connected to the air inlet 91, when the heat from the heat source is transferred to the heat dissipation channel 90, the heat inside the heat dissipation channel 90 can be drawn in by the piezoelectric pump 1. Cold air from outside the air inlet 91 is also drawn into the heat dissipation channel 90. Some of the cold air first exchanges heat with the heat inside the heat dissipation channel 90, and finally, the air that has undergone heat exchange and the air that has not undergone heat exchange are carried to the outside through the air outlet 111 of the piezoelectric pump 1. Through this heat exchange process, the heat transferred from the heat source to the heat dissipation channel 90 is continuously carried away by the piezoelectric pump 1, thereby cooling the heat source.

[0038] The working principle of the piezoelectric pump 1 is as follows: When a driving voltage is applied to the piezoelectric element inside the piezoelectric pump 1, the piezoelectric element can continuously switch between expanding or compressing the volume of the pump chamber with high-frequency vibration: when expanding the pump chamber, outside air flows into the pump chamber through the air inlet 121 in sequence; when compressing the pump chamber, the air entering the pump chamber is discharged through the air outlet 111, thus driving the fluid to flow from the air inlet 121 to the air outlet 111.

[0039] The technical solution of this application involves attaching a heat source to a heat conductor 9, using a piezoelectric fluid pump 1 to draw heat from the inside of the heat conductor 9, and finally dissipating the heat to the outside of the device. Compared with the prior art of directly blowing air onto the heat source, this method removes the heat from the heat source, that is, dissipates the heat inside the device to the outside. The piezoelectric fluid pump cooling device is separated from heat sources such as electronic devices or integrated circuit chips, which can ensure dust and moisture protection inside the heat sources such as electronic devices, reducing the risk of damage to their internal components.

[0040] Secondly, the area where the heat source is located is the hot end, and the area where the piezoelectric pump 1 is located is the cold end. The heat from the hot end is transferred to the heat dissipation channel 90 through the heat conductor 9, and finally the heat is drawn away by the piezoelectric pump 1 at the cold end to form a cooling effect. The heat drawn away is directly discharged to the outside of the electronic device or integrated circuit chip and will not flow into the inside of the electronic device or integrated circuit chip again. This can further prevent the discharged heat from passing through the heat dissipation channel 90 again, and the setting of hot and cold ends can enhance the heat exchange effect and make the cooling effect more significant.

[0041] In some embodiments of this application, the air outlet 111 is located on one side of the piezoelectric pump (1) in the first direction x, and the extension direction of the air inlet 121 is perpendicular to the extension direction of the air outlet 111. The air inlet 121 and the air outlet 111 are located on opposite sides of the piezoelectric pump 1 and are arranged perpendicularly to each other, which can prevent the heat drawn away from flowing back into the heat dissipation device and ensure the heat dissipation effect.

[0042] In some embodiments of this application, the piezoelectric fluid pump 1 is disposed within the heat conductor 9, and the heat conductor 9 has an air outlet 93 on the side facing the air outlet 111 in the first direction x, and the air outlet 93 is connected to the air outlet 111. By directly integrating the piezoelectric fluid pump 1 into the heat conductor 9, the resistance of the fluid during transmission can be reduced, the flow efficiency of the airflow can be improved, and the overall heat dissipation device can be made more compact, saving internal space and facilitating integration and installation. The air outlet 93 is provided to ensure that the air outlet 111 can output airflow quickly and evenly. Specifically, the inner diameter of the air outlet 93 can be set to be larger than the inner diameter of the air outlet 111, and it is coaxially arranged with the air outlet 111.

[0043] In some embodiments of this application, the heat conductor 9 is arranged around the piezoelectric pump 1, and the inner wall of the heat conductor 9 and part of the outer peripheral wall of the piezoelectric pump 1 enclose and define the heat dissipation channel 90, so that the inner wall of the heat conductor 9 and the piezoelectric pump 1 fit more tightly, which facilitates the full utilization of the heat conductor 9 and can more effectively transfer heat from the heat source to the heat dissipation channel 90.

[0044] Reference Figure 3 In some embodiments of this application, the piezoelectric fluid pump 1 has a first side plate 122 and a second side plate 123 disposed opposite to each other along a second direction y. The air inlet 121 is opened on the first side plate 122, and the air inlet 91 is disposed facing the second side plate 123. The heat dissipation channel 90 is arranged around the piezoelectric fluid pump 1. By arranging the heat dissipation channel 90 around the piezoelectric fluid pump 1, the contact area between the heat source and the heat dissipation channel 90, and between the fluid and the heat dissipation channel 90, can be maximized, thereby improving the heat dissipation effect.

[0045] In scenarios requiring significant heat dissipation, the existing piezoelectric fluid pump 1 still falls short of the required cooling performance, failing to meet the heat dissipation needs of high-power electronic devices and integrated circuit chips. Therefore, referring to... Figure 4 In some embodiments of this application, a plurality of partition walls 94 are provided in the heat dissipation channel 90, and each partition wall 94 is arranged sequentially at intervals to divide the heat dissipation channel 90 into a plurality of air ducts 900, and each air duct 900 is connected to the air inlet 91 and the air inlet 121 respectively.

[0046] Multiple air ducts 900 are partitioned inside the heat dissipation channel 90 by partition walls 94 to form a labyrinthine heat dissipation channel 90. During the process of heat transfer from the heat source on the heat conductor 9 to the air ducts 900 of the heat dissipation channel 90, and then from the air ducts 900 to the air inlet 121 of the piezoelectric pump 1, the incoming cold air can fully and evenly exchange heat with the heat within the air ducts 900. By setting up the air ducts 900, the contact area and contact time between the external cold air and heat within the heat dissipation channel 90 are increased, thereby increasing the heat transfer area without changing the volume, resulting in more complete heat exchange and higher heat dissipation efficiency.

[0047] Reference Figure 5 In some embodiments of this application, the partition wall 94 has an air inlet end 941 located near the air inlet 91. The air inlet end 941 is arranged parallel to the axial direction of the air inlet 91, or the air inlet end 941 is arranged perpendicular to the circumferential direction of the air inlet 91. A well-designed partition wall 94 can optimize the airflow path and reduce airflow turbulence, making the heat dissipation device more efficient during operation. It can also reduce operating noise and improve the user experience, offering significant advantages in applications with strict noise requirements.

[0048] Reference Figure 6 In some embodiments of this application, the air outlet 111 is located on one side of the piezoelectric pump 1 in the second direction y. The piezoelectric pump 1 also has two side walls 124 arranged opposite each other in the third direction z. The air inlet 91 includes a first sub-air inlet 911 and a second sub-air inlet 912, which are respectively arranged facing the two side walls 124. The heat dissipation channel 90 includes a first sub-channel 901 and a second sub-channel 902. The first sub-air inlet 911 is connected to the air inlet 121 through the first sub-channel 901, and the second sub-air inlet 912 is connected to the air inlet 121 through the second sub-channel 902.

[0049] The heat source is directly bonded to the heat-conducting part 92 on the heat conductor 9. The heat from the heat source is transferred to the heat dissipation channel 90 through the heat conductor 9. At this time, the temperature of the area of ​​the heat dissipation channel 90 is higher, and the temperature of the area of ​​the piezoelectric pump 1 is lower, forming a temperature difference between the two areas. Heat is transferred from the heat dissipation channel 90 to the air inlet 121 of the piezoelectric pump 1. Since the first sub-air inlet 911 of the heat dissipation channel 90 is connected to the air inlet 121 through the first sub-channel 901, and the second sub-air inlet 912 is connected to the air inlet 121 through the second sub-channel 902, the heat from the heat source is transferred to the heat dissipation channel 90. When the heat dissipation channel 90 is in the hot channel, the heat in the heat dissipation channel 90 can be drawn in by the piezoelectric fluid pump 1. The cold air outside the first sub-air vent 911 and the second sub-air vent 912 is also drawn into the heat dissipation channel 90. Some of the cold air first exchanges heat with the heat in the heat dissipation channel 90. Finally, the air that has undergone heat exchange, together with the air that has not undergone heat exchange, is carried to the outside through the air outlet 111 of the piezoelectric fluid pump 1. Through this exchange of hot and cold, the heat transferred from the heat source to the heat dissipation channel 90 is continuously carried away by the piezoelectric fluid pump 1, thereby cooling the heat source.

[0050] Reference Figure 7 In some embodiments of this application, the first sub-channel 901 is provided with a plurality of first partition walls 942, each of the first partition walls 942 being arranged at intervals to divide the first sub-channel 901 into a plurality of first air ducts 9001, each of the first air ducts 9001 being connected to the first sub-air outlet 911 and the air inlet 121 respectively; the second sub-channel 902 is provided with a plurality of second partition walls 943, each of the second partition walls 943 being arranged at intervals to divide the second sub-channel 902 into a plurality of second air ducts 9002, each of the second air ducts 9002 being connected to the second sub-air outlet 912 and the air inlet 121 respectively.

[0051] By setting up multiple first air ducts 9001 and multiple second air ducts 9002, the contact area and contact time between heat and cold air in the first sub-channels 901 and the second sub-channels 902 are increased, so that the heat from the heat source can be fully exchanged inside the first air ducts 9001 and the second air ducts 9002, which greatly improves the heat dissipation efficiency and enables this heat dissipation device to maintain good heat dissipation effect even in environments with extremely high heat dissipation requirements.

[0052] In some embodiments of this application, the heat conductor 9 has a heat-conducting plate 95 disposed on one side in the first direction x. The heat-conducting plate 95 is defined to form a portion of the peripheral wall of the heat dissipation channel 90. The heat-conducting part 92 is disposed on the side of the heat-conducting plate 95 opposite to the heat dissipation channel 90, and the heat-conducting part 92 is attached to the heat dissipation channel 90 through the heat-conducting plate 95, ensuring that heat can be quickly conducted from the heat-conducting part 92 to the heat dissipation channel 90, significantly improving the overall heat dissipation efficiency. Specifically, the heat-conducting plate 95 can be made of a material with high thermal conductivity, such as copper, aluminum, or graphite.

[0053] In summary, the embodiments of the present invention provide a piezoelectric pump cooling device, which has the following advantages:

[0054] 1. The heat source can be directly attached to the heat-conducting part 92, transferring heat to the heat dissipation channel 90 through the heat conductor 9. The piezoelectric fluid pump 1 extracts heat from the heat dissipation channel 90 while simultaneously drawing in cool air from outside through the air inlet 91 to exchange heat with the air inside the heat dissipation channel 90. Finally, the heat is discharged to the outside of the equipment through the air outlet 111. This design avoids the discharged heat passing through the heat dissipation channel 90 again, resulting in better heat exchange and a significant cooling effect.

[0055] 2. The piezoelectric pump cooling device of this application is separated from heat sources such as electronic equipment or integrated circuit chips, which can ensure dust and moisture protection inside the heat sources such as electronic equipment and reduce the risk of damage to their internal components.

[0056] 3. By setting multiple air ducts 900 within the heat dissipation channel 90, the heat from the heat source can be fully exchanged within the air ducts 900, greatly improving the heat dissipation efficiency and maintaining good heat dissipation effect even under high heat dissipation requirements.

[0057] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and substitutions can be made without departing from the technical principles of the present invention, and these improvements and substitutions should also be considered within the scope of protection of the present invention.

Claims

1. A piezoelectric pump cooling device, characterized in that, include: A piezoelectric fluid pump (1) and a heat conductor (9) are provided. The piezoelectric fluid pump (1) has a piezoelectric drive assembly and an air inlet (121) and an air outlet (111) that are connected to each other. The heat conductor (9) has an air inlet (91) and a heat dissipation channel (90). The heat conductor (9) is connected to the piezoelectric fluid pump (1). The air inlet (91), the heat dissipation channel (90), the air inlet (121) and the air outlet (111) are connected in sequence. The piezoelectric drive assembly can drive fluid to flow from the air inlet (91) to the air outlet (111). The outer wall of the heat conductor (9) is provided with a heat-conducting part (92) for connecting with a heat source. The piezoelectric fluid pump (1) has a first side plate (122) and a second side plate (123) arranged opposite to each other along the second direction (y). The air inlet (121) is opened on the first side plate (122), the air inlet (91) is arranged facing the second side plate (123), and the heat dissipation channel (90) is arranged around the piezoelectric fluid pump (1). The second direction (y) is perpendicular to the first direction (x).

2. The piezoelectric pump cooling device as described in claim 1, characterized in that, The air outlet (111) is located on one side of the piezoelectric fluid pump (1) in the first direction (x), and the extension direction of the air inlet (121) is perpendicular to the extension direction of the air outlet (111).

3. The piezoelectric pump cooling device as described in claim 2, characterized in that, The piezoelectric fluid pump (1) is located inside the heat conductor (9). The heat conductor (9) has an air outlet (93) on the side facing the air outlet (111) in the first direction (x), and the air outlet (93) is connected to the air outlet (111).

4. The piezoelectric pump cooling device as described in claim 1, characterized in that, The heat dissipation channel (90) is provided with multiple partition walls (94), and each partition wall (94) is arranged in sequence at intervals to divide the heat dissipation channel (90) into multiple air ducts (900), and each air duct (900) is connected to the air inlet (91) and the air inlet (121).

5. The piezoelectric pump cooling device as described in claim 4, characterized in that, The partition wall (94) has an air inlet end (941) located near the air inlet (91), the air inlet end (941) being arranged axially parallel to the air inlet (91), or the air inlet end (941) being arranged circumferentially perpendicular to the air inlet (91).

6. The piezoelectric pump cooling device as described in any one of claims 2 to 3, characterized in that, The heat conductor (9) has a heat-conducting plate (95) disposed on one side of the first direction (x), the heat-conducting plate (95) is defined to form a portion of the peripheral wall of the heat dissipation channel (90), the heat-conducting part (92) is disposed on the side of the heat-conducting plate (95) away from the heat dissipation channel (90), and the heat-conducting part (92) is attached to the heat dissipation channel (90) through the heat-conducting plate (95).

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