Semiconductor metal cooling ring and processing method

Abstract

The application discloses a semiconductor metal cooling ring and a processing method, and aims at solving the problem of poor cooling effect of the existing semiconductor metal cooling ring. The application comprises a main body and a thin-wall interface piece, the thin-wall interface piece is welded with the main body, the inner cooling pipeline is arranged in the main body, and the outer cooling pipeline is arranged on the thin-wall interface piece close to the connecting end of the main body. The main body and the interface piece of the cooling ring have good cooling effect; the interface piece can be processed into any shape, is suitable for various designs and changes in the interior, has an ultrathin structure and low cost, and the welding quality of the main body and the interface piece is high.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor cooling rings, and more particularly to a semiconductor metal cooling ring and a processing method thereof. Background Art

[0002] The semiconductor metal cooling ring mainly includes a main body, an interface part and a cooling water channel. The main body is processed as a whole. The interface part is usually a forging with a hole cut in the middle or four plates welded together. The interface part is welded to the main body after being formed. The cooling water channel is welded to the main body, and the cooling effect is achieved by circulating water inside. However, the cooling water channel is an external welded cooling structure. Due to the limitation of the main body structure, too many cooling water channels cannot be arranged, and the cooling effect is poor. The interface part is a welded or integrally processed structure with high cost. Due to structural limitations, the interface part cannot be directly cooled, which affects the overall cooling effect. Since the interface part is an integrally processed part or welded, its shape is single and can only be round or square, which reduces the scope of use and limits the internal design structure. Since the main body and the interface part are both thin, the welding quality is poor. Summary of the Invention

[0003] In order to overcome the above-mentioned shortcomings, the present invention provides a semiconductor metal cooling ring and a processing method, in which the cooling effect of the main body and the interface parts of the cooling ring is good; the interface parts can be processed into any shape and are suitable for various internal designs and changes; the interface parts are ultra-thin structures with low cost; and the welding quality of the main body and the interface parts is high.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solution: a semiconductor metal cooling ring, including a main body and a thin-walled interface part, the thin-walled interface part is welded to the main body, an internal cooling pipe is arranged in the main body, and a circle of external cooling pipe is arranged on the thin-walled interface part near the connection end with the main body.

[0005] In this patent application, internal cooling pipes are installed directly within the main body, improving cooling efficiency. Furthermore, an external cooling pipe is placed around the thin-walled interface near the connection end with the main body. This allows the medium to be cooled through the external cooling pipes before being discharged from the thin-walled interface, ensuring that the discharge temperature meets the required requirements. The ultra-thin structure of the thin-walled interface saves material and helps reduce costs. This structure of the semiconductor metal cooling ring provides excellent cooling efficiency for both the main body and the thin-walled interface.

[0006] Preferably, a sunken groove is provided on the end face of the main body, the internal cooling pipe is arranged in the sunken groove, a flow port connected to the sunken groove is provided on the side wall of the main body, and a thin-walled interface part is connected to the periphery of the flow port on the side wall of the main body.

[0007] The internal cooling pipe is arranged in the sunken groove, directly cooling the main body, with good cooling effect. The thin-walled interface is connected to the flow port to facilitate the discharge of the medium.

[0008] Preferably, an auxiliary cooling pipe capable of moving and adjusting its position is arranged on the periphery of the main body, the auxiliary cooling pipe is in an arc-shaped structure and is close to the outer wall of the main body.

[0009] The auxiliary cooling pipe is close to the outer wall of the main body, which improves the cooling effect of the main body. Moreover, the auxiliary cooling pipe can be moved and adjusted. The auxiliary cooling pipe can be installed at the corresponding position of the main body where cooling is needed, ensuring the cooling effect of the main body.

[0010] Preferably, a water inlet and a water outlet are respectively provided at both ends of the auxiliary cooling pipe, and the water inlet and the water outlet of the inner cooling pipe are respectively communicated with the water inlet and the water outlet.

[0011] This structural arrangement facilitates the entry and discharge of cooling water.

[0012] Preferably, the thin-walled interface part is a stamped part.

[0013] The thin-walled interface parts adopt a stamping process, and their shapes can be set arbitrarily according to needs. After setting, they are stamped and formed by a mold to process thin-walled interface parts of arbitrary shapes. The processing is convenient and the cost is low.

[0014] Preferably, the thin-walled interface member gradually converges from the end connected to the main body to the other end.

[0015] This structural arrangement facilitates the discharge of the medium.

[0016] Preferably, the external cooling pipe includes several adjusting tubes, which are spliced ​​end to end to form a circle, a universal ball head is provided at one end of the adjusting tube, and a rotating groove adapted to the universal ball head is provided at the other end of the adjusting tube. The two adjacent adjusting tubes are sealed and connected through the cooperation of the universal ball head and the rotating groove, and the end of the rotating groove is fastened to a limiting ring, which is adapted to be assembled with the universal ball head.

[0017] The external cooling pipe of this structural arrangement can be bent like a chain, so that the installation position of the external cooling pipe can be adjusted. The external cooling pipe can be moved to the position where cooling is needed, which is flexible and convenient. In particular, when the external cooling pipe needs to be adjusted away from the main body, since the thin-walled interface part gradually converges from the end connected to the main body to the other end, the length of the external cooling pipe is too long relative to the thin-walled interface part. At this time, the external cooling pipe is bent and then tightly connected to the outer wall of the thin-walled interface part through a pressing block or directly welded to the outer wall of the thin-walled interface part to achieve positioning. This structural arrangement achieves the versatility of the external cooling pipe, and the external cooling pipe itself can be bent, and there is no need to bend it to match the outer wall of the thin-walled interface part before installation, which reduces the difficulty of installation.

[0018] Preferably, a plurality of heat-conducting sleeves are mounted on the inner cooling pipe, and heat-conducting fins are hinged on both sides of the heat-conducting sleeves. The heat-conducting sleeves are slid along the inner cooling pipe to adjust their positions, and the heat-conducting fins are rotated to adjust their positions.

[0019] Thermal fins installed on the thermal sleeve improve heat transfer, allowing heat to be quickly removed by the coolant in the internal cooling channel. The thermal sleeve can be slid along the internal cooling channel to adjust its position, and the thermal fins can be rotated to adjust their position, preventing interference with other components installed on the main body.

[0020] A method for processing a semiconductor metal cooling ring is disclosed, which realizes the processing of the semiconductor metal cooling ring, comprising the following steps: S1, completing the processing of the main body and the thin-walled interface component; S2, overlapping one end of the thin-walled interface component with the side wall of the main body, and welding the overlapping position using tungsten inert gas arc welding; S3, installing an external cooling pipe to the thin-walled interface component, installing an internal cooling pipe to the main body, and installing an auxiliary cooling pipe on the outer wall of the main body.

[0021] The processed main body and thin-walled interface parts are welded by tungsten inert gas welding. The external part is welded and the internal part is directly formed. The thickness of the entire thin-walled interface part can be welded through, which solves the internal gap problem and stress concentration problem and prolongs the product life.

[0022] Preferably, the thin-walled interface part in S1 is formed by stamping.

[0023] The processing of thin-walled interface parts is achieved by stamping. The thin-walled interface parts can be designed into any shape to suit various internal designs and changes.

[0024] Compared with the prior art, the beneficial effects of the present invention are: the cooling effect of the cooling ring body and the interface parts is good; the interface parts can be processed into any shape, suitable for various internal designs and changes; the interface parts are ultra-thin structures with low costs; the welding quality of the main body and the interface parts is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural diagram of embodiment 1 of the present invention.

[0026] Figure 2 It is a top view of Example 1 of the present invention.

[0027] Figure 3 Schematic diagram of the regulating tube connection structure of Example 2 of the present invention.

[0028] Figure 4 This is a structural diagram of the inner cooling pipe of Example 3 of the present invention.

[0029] In the figure: 1. Main body, 2. Thin-walled interface part, 3. Inner cooling pipe, 4. Outer cooling pipe, 5. Sunken groove, 6. Flow port, 7. Auxiliary cooling pipe, 8. Adjusting pipe, 9. Universal ball head, 10. Rotating groove, 11. Limiting ring, 12. Heat-conducting sleeve, 13. Heat-conducting fin. DETAILED DESCRIPTION

[0030] The technical solution of the present invention is further described in detail below through specific embodiments and in conjunction with the accompanying drawings:

[0031] Example 1: A semiconductor metal cooling ring (see attached Figure 1 , Attachment Figure 2 ), including a main body 1 and a thin-walled interface part 2, the thin-walled interface part 2 is welded to the main body 1, the main body 1 is a circular ring structure, an internal cooling pipe 3 is arranged in the main body 1, and a circle of external cooling pipe 4 is arranged on the thin-walled interface part 2 near the connection end with the main body 1.

[0032] A C-shaped recessed groove 5 is provided on the end surface of the main body 1. The internal cooling pipe 3 is routed within the recessed groove 5. A flow port 6 is provided on the sidewall of the main body 1, communicating with the recessed groove 5. A thin-walled interface component 2 is attached to the outer periphery of the flow port 6 on the sidewall of the main body 1. The internal cooling pipe 3 is routed within the recessed groove 5, directly cooling the main body 1 and achieving effective cooling. The thin-walled interface component 2 interfaces with the flow port 6 to facilitate the discharge of the medium.

[0033] An auxiliary cooling pipe 7 that can be moved and adjusted in position is arranged on the periphery of the main body 1. The auxiliary cooling pipe 7 has an arc-shaped structure and is close to the outer wall of the main body 1. An arc-shaped flow channel is set in the auxiliary cooling flow channel, and coolant is passed through the flow channel. The coolant flows and takes away the heat, thereby cooling the cooling ring. The auxiliary cooling pipe 7 is close to the outer wall of the main body 1, which improves the cooling effect on the main body 1. Moreover, the auxiliary cooling pipe 7 can be moved and adjusted in position. Wherever the main body 1 needs cooling, the auxiliary cooling pipe 7 can be installed at the corresponding position of the main body 1, thereby ensuring the cooling effect of the main body 1. A water inlet and a water outlet are respectively set at both ends of the auxiliary cooling pipe 7, and the water inlet and water outlet of the internal cooling pipe 3 are connected to the water inlet and water outlet respectively.

[0034] In this embodiment, two arcuate internal cooling pipes 3 are arranged within the sunken groove 5. A transition channel is provided on the auxiliary cooling pipe 7, with insertion holes at both ends. The auxiliary cooling pipes 7 are arranged correspondingly to the internal cooling channels, and the water inlet of one internal cooling channel and the water outlet of the other internal cooling channel are sealed and plugged into the two insertion holes. Cooling water is delivered by a water pump. The water inlet at one end of the auxiliary cooling pipe 7 is connected to the water inlet of one internal cooling channel through a pipe in parallel with the water outlet of the water pump. The water outlet at the other end of the auxiliary cooling pipe 7 is connected to the water outlet of the other internal cooling channel through a pipe in parallel with the water outlet of the other internal cooling channel to a return pipe, through which the cooling water returns to the water reservoir.

[0035] The thin-walled interface member 2 is a stamped part. It tapers gradually from the end connected to the main body 1 toward the other end. The outer end of the thin-walled interface member 2 can be shaped in a variety of ways, such as circular, rectangular, or oval. In this embodiment, the outer end of the thin-walled interface member 2 is circular. The thin-walled interface member 2 is stamped using a stamping process, allowing its shape to be customized. After the shape is configured, it is stamped and formed using a mold, resulting in a thin-walled interface member 2 of any shape. This facilitates processing and is cost-effective.

[0036] A method for processing a semiconductor metal cooling ring, which realizes the processing of a semiconductor metal cooling ring, includes the following steps: S1, completing the processing of a main body 1 and a thin-walled interface part 2, the thin-walled interface part 2 is formed by stamping, and the main body 1 is formed by machining; S2, overlapping one end of the thin-walled interface part 2 on the side wall of the main body 1, and welding the overlapping position by tungsten inert gas arc welding; S3, installing an external cooling pipe 4 on the thin-walled interface part 2, directly welding the external cooling pipe 4 to the thin-walled interface part 2 to position it, and installing an internal cooling pipe 3 in a sunken groove 5 on the main body 1. In this embodiment, two internal cooling pipes 3 are installed, and an auxiliary cooling pipe 7 is installed on the outer wall of the main body 1. In this embodiment, the auxiliary cooling pipe 7 is installed corresponding to the internal cooling pipe 3.

[0037] In this patent application, the internal cooling pipe 3 is directly arranged in the main body 1, which is beneficial to improving the cooling effect of the main body 1. On the thin-walled interface part 2, a circle of external cooling pipes 4 is arranged near the connection end with the main body 1. The medium is cooled through the external cooling pipe 4 before being discharged from the thin-walled interface part 2 to ensure that the discharge temperature meets the requirements. The ultra-thin structure of the thin-walled interface part 2 saves materials and helps to reduce costs. The processed main body 1 and the thin-walled interface part 2 are welded by tungsten inert gas welding. The external welding and the internal direct forming can penetrate the entire thickness of the thin-walled interface part 2, solve the internal gap problem and stress concentration problem, and extend the product life.

[0038] Example 2: A semiconductor metal cooling ring (see attached Figure 3 ), including a main body 1 and a thin-walled interface part 2, the thin-walled interface part 2 is welded to the main body 1, the main body 1 is a circular ring structure, an internal cooling pipe 3 is arranged in the main body 1, and a circle of external cooling pipe 4 is arranged on the thin-walled interface part 2 near the connection end with the main body 1.

[0039] A C-shaped recessed groove 5 is provided on the end surface of the main body 1. The internal cooling pipe 3 is routed within the recessed groove 5. A flow port 6 is provided on the sidewall of the main body 1, communicating with the recessed groove 5. A thin-walled interface component 2 is attached to the outer periphery of the flow port 6 on the sidewall of the main body 1. The internal cooling pipe 3 is routed within the recessed groove 5, directly cooling the main body 1 and achieving effective cooling. The thin-walled interface component 2 interfaces with the flow port 6 to facilitate the discharge of the medium.

[0040] An auxiliary cooling pipe 7 that can be moved and adjusted in position is arranged on the periphery of the main body 1. The auxiliary cooling pipe 7 has an arc-shaped structure and is close to the outer wall of the main body 1. An arc-shaped flow channel is set in the auxiliary cooling flow channel, and coolant is passed through the flow channel. The coolant flows and takes away the heat, thereby cooling the cooling ring. The auxiliary cooling pipe 7 is close to the outer wall of the main body 1, which improves the cooling effect on the main body 1. Moreover, the auxiliary cooling pipe 7 can be moved and adjusted in position. Wherever the main body 1 needs cooling, the auxiliary cooling pipe 7 can be installed at the corresponding position of the main body 1, thereby ensuring the cooling effect of the main body 1. A water inlet and a water outlet are respectively set at both ends of the auxiliary cooling pipe 7, and the water inlet and water outlet of the internal cooling pipe 3 are connected to the water inlet and water outlet respectively.

[0041] In this embodiment, two arcuate internal cooling pipes 3 are arranged within the sunken groove 5. A transition channel is provided on the auxiliary cooling pipe 7, with insertion holes at both ends. The auxiliary cooling pipes 7 are arranged correspondingly to the internal cooling channels, and the water inlet of one internal cooling channel and the water outlet of the other internal cooling channel are sealed and plugged into the two insertion holes. Cooling water is delivered by a water pump. The water inlet at one end of the auxiliary cooling pipe 7 is connected to the water inlet of one internal cooling channel through a pipe in parallel with the water outlet of the water pump. The water outlet at the other end of the auxiliary cooling pipe 7 is connected to the water outlet of the other internal cooling channel through a pipe in parallel with the water outlet of the other internal cooling channel to a return pipe, through which the cooling water returns to the water reservoir.

[0042] The thin-walled interface member 2 is a stamped part. It tapers gradually from the end connected to the main body 1 toward the other end. The outer end of the thin-walled interface member 2 can be shaped in a variety of ways, such as circular, rectangular, or oval. In this embodiment, the outer end of the thin-walled interface member 2 is circular. The thin-walled interface member 2 is stamped using a stamping process, allowing its shape to be customized. After the shape is configured, it is stamped and formed using a mold, resulting in a thin-walled interface member 2 of any shape. This facilitates processing and is cost-effective.

[0043] The external cooling pipe 4 includes several regulating tubes 8, which are connected end to end to form a circle. A universal ball joint 9 is provided at one end of the regulating tube 8, and a rotating groove 10 that matches the universal ball joint 9 is provided at the other end of the regulating tube 8. Adjacent regulating tubes 8 are sealed together through the cooperation of the universal ball joint 9 and the rotating groove 10. The end of the rotating groove 10 is tightly connected to a limiting ring 11, which is matched with the universal ball joint 9. The universal ball joint 9 and the regulating tube 8 are threadedly connected and tightened. The inner diameter of the small-diameter end of the limiting ring 11 is smaller than the diameter of the universal ball joint 9, while the inner diameter of the large-diameter end of the limiting ring 11 and the inner diameter of the open end of the rotating groove 10 are both compatible with the diameter of the universal ball joint 9. Two adjacent regulating tubes 8 are selected as the water inlet and water outlet sections, and the space between the two regulating tubes 8 is blocked. The regulating tube 8 serving as the water inlet section is provided with a water inlet, and the regulating tube 8 serving as the water outlet section is provided with a water outlet.

[0044] The external cooling pipe 4 of this structural arrangement can be bent like a chain, so that the installation position of the external cooling pipe 4 can be adjusted. The external cooling pipe 4 can be moved to the position where cooling is needed, which is flexible and convenient. In particular, when the external cooling pipe 4 needs to be adjusted in the direction away from the main body 1, since the thin-walled interface part 2 gradually converges from the end connected to the main body 1 to the other end, the length of the external cooling pipe 4 is too long relative to the thin-walled interface part 2. At this time, the external cooling pipe 4 is bent and then tightly connected to the outer wall of the thin-walled interface part 2 by a pressing block or directly welded to the outer wall of the thin-walled interface part 2 to achieve positioning. This structural arrangement achieves the versatility of the external cooling pipe 4, and the external cooling pipe 4 can be bent by itself, without having to be bent to match the outer wall of the thin-walled interface part 2 before installation, which reduces the difficulty of installation.

[0045] The internal cooling pipe 3 includes a plurality of regulating tubes 8, which are spliced ​​end to end. A universal ball joint 9 is provided at one end of the regulating tube 8, and a rotating groove 10 adapted to the universal ball joint 9 is provided at the other end of the regulating tube 8. The two adjacent regulating tubes 8 are sealed by the cooperation between the universal ball joint 9 and the rotating groove 10. The end of the rotating groove 10 is fastened to a limiting ring 11, which is adapted to be assembled with the universal ball joint 9. The universal ball joint 9 and the regulating tube 8 are threadedly connected and fastened. The inner diameter of the small-diameter end of the limiting ring 11 is smaller than the diameter of the universal ball joint 9, and the inner diameter of the large-diameter end of the limiting ring 11 and the inner diameter of the open end of the rotating groove 10 are both adapted to the diameter of the universal ball joint 9. The two regulating tubes 8 at the head and tail serve as the water inlet and outlet, respectively.

[0046] This structure allows the inner cooling pipe 3 to bend like a chain, allowing for adjustable installation positions. If the inner cooling pipe 3 interferes with other components, it can be bent to avoid interference. Furthermore, in areas with higher cooling requirements, the inner cooling pipe 3 can be bent and circuited to increase the heat exchange area and thus improve cooling efficiency.

[0047] A method for processing a semiconductor metal cooling ring, which realizes the processing of a semiconductor metal cooling ring, includes the following steps: S1, completing the processing of a main body 1 and a thin-walled interface part 2, the thin-walled interface part 2 is formed by stamping, and the main body 1 is formed by machining; S2, overlapping one end of the thin-walled interface part 2 on the side wall of the main body 1, and welding the overlapping position by tungsten inert gas arc welding; S3, installing an external cooling pipe 4 on the thin-walled interface part 2, directly welding the external cooling pipe 4 to the thin-walled interface part 2 to position it, and installing an internal cooling pipe 3 in a sunken groove 5 on the main body 1. In this embodiment, two internal cooling pipes 3 are installed, and an auxiliary cooling pipe 7 is installed on the outer wall of the main body 1. In this embodiment, the auxiliary cooling pipe 7 is installed corresponding to the internal cooling pipe 3.

[0048] In this patent application, the internal cooling pipe 3 is directly arranged in the main body 1, which is beneficial to improving the cooling effect of the main body 1. On the thin-walled interface part 2, a circle of external cooling pipes 4 is arranged near the connection end with the main body 1. The medium is cooled through the external cooling pipe 4 before being discharged from the thin-walled interface part 2 to ensure that the discharge temperature meets the requirements. The ultra-thin structure of the thin-walled interface part 2 saves materials and helps to reduce costs. The processed main body 1 and the thin-walled interface part 2 are welded by tungsten inert gas welding. The external welding and the internal direct forming can penetrate the entire thickness of the thin-walled interface part 2, solve the internal gap problem and stress concentration problem, and extend the product life.

[0049] Example 3: A semiconductor metal cooling ring (see attached Figure 4 ), including a main body 1 and a thin-walled interface part 2, the thin-walled interface part 2 is welded to the main body 1, the main body 1 is a circular ring structure, an internal cooling pipe 3 is arranged in the main body 1, and a circle of external cooling pipe 4 is arranged on the thin-walled interface part 2 near the connection end with the main body 1.

[0050] A C-shaped recessed groove 5 is provided on the end surface of the main body 1. The internal cooling pipe 3 is routed within the recessed groove 5. A flow port 6 is provided on the sidewall of the main body 1, communicating with the recessed groove 5. A thin-walled interface component 2 is attached to the outer periphery of the flow port 6 on the sidewall of the main body 1. The internal cooling pipe 3 is routed within the recessed groove 5, directly cooling the main body 1 and achieving effective cooling. The thin-walled interface component 2 interfaces with the flow port 6 to facilitate the discharge of the medium.

[0051] An auxiliary cooling pipe 7 that can be moved and adjusted in position is arranged on the periphery of the main body 1. The auxiliary cooling pipe 7 has an arc-shaped structure and is close to the outer wall of the main body 1. An arc-shaped flow channel is set in the auxiliary cooling flow channel, and coolant is passed through the flow channel. The coolant flows and takes away the heat, thereby cooling the cooling ring. The auxiliary cooling pipe 7 is close to the outer wall of the main body 1, which improves the cooling effect on the main body 1. Moreover, the auxiliary cooling pipe 7 can be moved and adjusted in position. Wherever the main body 1 needs cooling, the auxiliary cooling pipe 7 can be installed at the corresponding position of the main body 1, thereby ensuring the cooling effect of the main body 1. A water inlet and a water outlet are respectively set at both ends of the auxiliary cooling pipe 7, and the water inlet and water outlet of the internal cooling pipe 3 are connected to the water inlet and water outlet respectively.

[0052] In this embodiment, two arcuate internal cooling pipes 3 are arranged within the sunken groove 5. A transition channel is provided on the auxiliary cooling pipe 7, with insertion holes at both ends. The auxiliary cooling pipes 7 are arranged correspondingly to the internal cooling channels, and the water inlet of one internal cooling channel and the water outlet of the other internal cooling channel are sealed and plugged into the two insertion holes. Cooling water is delivered by a water pump. The water inlet at one end of the auxiliary cooling pipe 7 is connected to the water inlet of one internal cooling channel through a pipe in parallel with the water outlet of the water pump. The water outlet at the other end of the auxiliary cooling pipe 7 is connected to the water outlet of the other internal cooling channel through a pipe in parallel with the water outlet of the other internal cooling channel to a return pipe, through which the cooling water returns to the water reservoir.

[0053] The thin-walled interface member 2 is a stamped part. It tapers gradually from the end connected to the main body 1 toward the other end. The outer end of the thin-walled interface member 2 can be shaped in a variety of ways, such as circular, rectangular, or oval. In this embodiment, the outer end of the thin-walled interface member 2 is circular. The thin-walled interface member 2 is stamped using a stamping process, allowing its shape to be customized. After the shape is configured, it is stamped and formed using a mold, resulting in a thin-walled interface member 2 of any shape. This facilitates processing and is cost-effective.

[0054] The external cooling pipe 4 includes several regulating tubes 8, which are connected end to end to form a circle. A universal ball joint 9 is provided at one end of the regulating tube 8, and a rotating groove 10 that matches the universal ball joint 9 is provided at the other end of the regulating tube 8. Adjacent regulating tubes 8 are sealed together through the cooperation of the universal ball joint 9 and the rotating groove 10. The end of the rotating groove 10 is tightly connected to a limiting ring 11, which is matched with the universal ball joint 9. The universal ball joint 9 and the regulating tube 8 are threadedly connected and tightened. The inner diameter of the small-diameter end of the limiting ring 11 is smaller than the diameter of the universal ball joint 9, while the inner diameter of the large-diameter end of the limiting ring 11 and the inner diameter of the open end of the rotating groove 10 are both compatible with the diameter of the universal ball joint 9. Two adjacent regulating tubes 8 are selected as the water inlet and water outlet sections, and the space between the two regulating tubes 8 is blocked. The regulating tube 8 serving as the water inlet section is provided with a water inlet, and the regulating tube 8 serving as the water outlet section is provided with a water outlet.

[0055] The external cooling pipe 4 of this structural arrangement can be bent like a chain, so that the installation position of the external cooling pipe 4 can be adjusted. The external cooling pipe 4 can be moved to the position where cooling is needed, which is flexible and convenient. In particular, when the external cooling pipe 4 needs to be adjusted in the direction away from the main body 1, since the thin-walled interface part 2 gradually converges from the end connected to the main body 1 to the other end, the length of the external cooling pipe 4 is too long relative to the thin-walled interface part 2. At this time, the external cooling pipe 4 is bent and then tightly connected to the outer wall of the thin-walled interface part 2 by a pressing block or directly welded to the outer wall of the thin-walled interface part 2 to achieve positioning. This structural arrangement achieves the versatility of the external cooling pipe 4, and the external cooling pipe 4 can be bent by itself, without having to be bent to match the outer wall of the thin-walled interface part 2 before installation, which reduces the difficulty of installation.

[0056] Several thermally conductive sleeves 12 are mounted on the inner cooling pipe 3. Heat-conducting fins 13 are hingedly connected to each side of the sleeves 12. The sleeves 12 slide along the inner cooling pipe 3 to adjust their position, while the fins 13 rotate to adjust their position. The installation of the fins 13 on the sleeves 12 improves heat exchange, allowing heat to be quickly removed by the coolant within the inner cooling pipe 3. The sleeves 12 can slide along the inner cooling pipe 3 to adjust their position, while the fins 13 rotate to adjust their position, preventing interference with other components mounted on the main body 1.

[0057] A method for processing a semiconductor metal cooling ring, which realizes the processing of a semiconductor metal cooling ring, includes the following steps: S1, completing the processing of a main body 1 and a thin-walled interface part 2, the thin-walled interface part 2 is formed by stamping, and the main body 1 is formed by machining; S2, overlapping one end of the thin-walled interface part 2 on the side wall of the main body 1, and welding the overlapping position by tungsten inert gas arc welding; S3, installing an external cooling pipe 4 on the thin-walled interface part 2, directly welding the external cooling pipe 4 to the thin-walled interface part 2 to position it, and installing an internal cooling pipe 3 in a sunken groove 5 on the main body 1. In this embodiment, two internal cooling pipes 3 are installed, and an auxiliary cooling pipe 7 is installed on the outer wall of the main body 1. In this embodiment, the auxiliary cooling pipe 7 is installed corresponding to the internal cooling pipe 3.

[0058] In this patent application, the internal cooling pipe 3 is directly arranged in the main body 1, which is beneficial to improving the cooling effect of the main body 1. On the thin-walled interface part 2, a circle of external cooling pipes 4 is arranged near the connection end with the main body 1. The medium is cooled through the external cooling pipe 4 before being discharged from the thin-walled interface part 2 to ensure that the discharge temperature meets the requirements. The ultra-thin structure of the thin-walled interface part 2 saves materials and helps to reduce costs. The processed main body 1 and the thin-walled interface part 2 are welded by tungsten inert gas welding. The external welding and the internal direct forming can penetrate the entire thickness of the thin-walled interface part 2, solve the internal gap problem and stress concentration problem, and extend the product life.

[0059] The above-described embodiments are only preferred solutions of the present invention and are not intended to limit the present invention in any form. Other variations and modifications are possible without exceeding the technical solutions described in the claims.

Claims

1. A semiconductor metal cooling ring, characterized in that: It includes a main body and a thin-walled interface part, which is welded to the main body. An internal cooling pipe is arranged in the main body, and a circle of external cooling pipes is arranged on the thin-walled interface part near the connection end with the main body; an auxiliary cooling pipe that can be moved and adjusted is arranged on the periphery of the main body, and the auxiliary cooling pipe has an arc-shaped structure and is close to the outer wall of the main body; the external cooling pipe includes several adjusting pipes, which are spliced ​​end to end to form a circle, a universal ball head is provided at one end of the adjusting pipe, and a rotating groove adapted to the universal ball head is provided at the other end of the adjusting pipe, and the adjacent two adjusting pipes are sealed by the cooperation of the universal ball head and the rotating groove, and the end of the rotating groove is fastened to a limit ring, and the limit ring is adapted to be assembled with the universal ball head.

2. A semiconductor metal cooling ring according to claim 1, characterized in that: A sunken groove is arranged on the end surface of the main body, the internal cooling pipe is arranged in the sunken groove, a flow port connected to the sunken groove is arranged on the side wall of the main body, and a thin-walled interface part is connected to the periphery of the flow port on the side wall of the main body.

3. The semiconductor metal cooling ring according to claim 1, characterized in that: A water inlet and a water outlet are respectively arranged at both ends of the auxiliary cooling pipe, and the water inlet end and the water outlet end of the internal cooling pipe are respectively communicated with the water inlet and the water outlet.

4. The semiconductor metal cooling ring according to claim 1, characterized in that: The thin-walled interface parts are stamped parts.

5. The semiconductor metal cooling ring according to claim 1, characterized in that: The thin-walled interface piece gradually converges from the end connected with the main body to the other end.

6. A semiconductor metal cooling ring according to any one of claims 1 to 5, characterized in that: A plurality of heat-conducting sleeves are mounted on the inner cooling pipe, and heat-conducting fins are hinged on both sides of the heat-conducting sleeves. The heat-conducting sleeves slide along the inner cooling pipe to adjust their positions, and the heat-conducting fins rotate to adjust their positions.

7. A method for processing a semiconductor metal cooling ring, characterized in that: The processing of the semiconductor metal cooling ring according to any one of claims 1 to 6 comprises the following steps: S1, completing the processing of the main body and the thin-walled interface part; S2, overlapping one end of the thin-walled interface part on the side wall of the main body, and welding the overlapping position by tungsten inert gas arc welding; S3, installing the external cooling pipe on the thin-walled interface part, installing the internal cooling pipe on the main body, and installing the auxiliary cooling pipe on the outer wall of the main body.

8. The method for processing a semiconductor metal cooling ring according to claim 7, wherein: The thin-walled interface parts in S1 are made by stamping.

Images