Wafer drying device

Abstract

The invention discloses a wafer drying device, and relates to the technical field of wafer drying, and the wafer drying device comprises a base, the top of which is provided with a drying tank; the drying assembly is arranged at the top of the base, and the drying assembly communicates with the drying tank; the rotating shaft is rotationally arranged on the inner wall of the bottom of the drying tank; the second connecting plate is fixed at the top of the rotating shaft; the motor is fixed to the bottom of the drying tank, and an output shaft of the motor is fixed to the rotating shaft. In the using process, wafers can be stacked at certain intervals through staggered placement of the placement assemblies, then dehydration work of the wafers is achieved through cooperation with work of the motor, then drying of water stains on the surfaces of the wafers is achieved through work of the drying assembly, finally, gas in the drying tank is pumped out through cooperation of the sealing assembly and the drying assembly, and the drying efficiency is improved. The evaporation temperature of moisture on the wafer is reduced, and the drying effect of the wafer is ensured.

Description

Technical Field

[0001] The invention relates to the technical field of wafer drying, and in particular to a wafer drying device. Background Art

[0002] A wafer refers to a silicon chip used to make silicon semiconductor circuits. During the wafer production process, it needs to go through multiple steps such as chemical cleaning and chemical etching, which will cause a lot of substances to remain on the surface of the wafer. Therefore, the wafer needs to be cleaned after production, and after cleaning, the wafer needs to be dried.

[0003] In the prior art, wafers are generally dried by spin drying. Although this drying method can quickly remove most of the moisture on the surface of the wafer, it cannot achieve the final drying effect. Subsequent drying and other treatments are required, which results in the wafer being transported multiple times during the entire drying process, resulting in low drying efficiency. Since the wafer is brittle, the wafer may be damaged during the transportation process. Summary of the invention

[0004] The purpose of the present invention is to provide a wafer drying device to solve the technical problems in the prior art.

[0005] The present invention provides a wafer drying device, comprising: A base, wherein a drying tank is arranged on the top of the base; A drying component, the drying component is arranged on the top of the base, and the drying component is connected to the drying tank; A rotating shaft, the rotating shaft is rotatably arranged on the inner wall of the bottom of the drying tank; A second connecting plate, wherein the second connecting plate is fixed to the top of the rotating shaft; A motor, wherein the motor is fixed to the bottom of the drying tank, and the output shaft and the rotating shaft of the motor are fixed; A plurality of placement components, wherein the plurality of placement components are stacked above the second connecting plate; Two support plates, both of which are arranged on the top of the base; An electric slide, wherein the electric slide is fixed between two support plates; A sealing assembly, wherein the sealing assembly is fixed to the moving end of the electric slide, and the sealing assembly is used to seal the drying tank; Two pick-up components, both of which are fixed to the moving end of the electric slide, and the two pick-up components are located on both sides of the sealing component, one of which is used to pick up the wafer, and the other is used to pick up the placement component; Storage components are arranged on the top of the base, and are used to store the placement components.

[0006] Preferably, the drying component comprises: An air pump box, the air pump box is fixed to the top of the base, and an air pump is arranged in the air pump box; Two connection boxes, both of which are fixed on the side wall of the drying tank, and the side wall of the drying tank is provided with a plurality of through holes near the connection boxes; A first tube body and a third tube body, wherein the first tube body and the third tube body are respectively connected to two connection boxes, and the first tube body is connected to an input port of an air pump, and a heating wire is arranged in the connection box close to the first tube body; A drying box, the drying box is fixed on the side wall of the drying tank, and the drying box is filled with water-absorbing resin; A second tube body, wherein the second tube body is arranged on the output port of the air pump and is connected to the drying box; The first solenoid valve and the second solenoid valve are both arranged through the top of the drying box, and the third tube body is connected to the first solenoid valve.

[0007] Preferably, the placement component comprises: A support plate, wherein the side wall of the support plate is provided with a plurality of first ear plates and second ear plates distributed at equal distances, and the plurality of first ear plates and the plurality of second ear plates are distributed in a staggered manner, a positioning rod is provided at the bottom of each of the first ear plates, a limiting ring is fixedly sleeved on the side wall of each of the positioning rods, and a positioning hole is penetrated through the top of each of the second ear plates, and the positioning rods and the positioning holes are adapted; A connecting seat, the connecting seat is fixed at the bottom of the supporting plate; A plurality of second suction cups, wherein the plurality of second suction cups are all fixed on the top of the support plate, and each of the second suction cups is connected to the connecting seat; A connecting pipe is provided through the side wall of the connecting seat.

[0008] Preferably, a door-shaped frame is fixed to the side wall of the drying tank, a cylinder is penetrated through the side wall of the door-shaped frame, a connecting plate is provided at the telescopic end of the cylinder, a plurality of rods are slidably inserted into the side wall of the drying tank, and each rod is fixed to the connecting plate, and a plug is provided at the end of each rod, and the plug is adapted to the connecting pipe.

[0009] Preferably, the storage assembly comprises: A plurality of first support rods, wherein the plurality of first support rods are fixed on the top of the base in a circular shape with equal distances; A plurality of second support rods are fixed in a circular shape at equal distances on the top of the base, and the first support rod and the second support rod are both adapted to the positioning holes.

[0010] Preferably, the sealing assembly comprises: A first fixed plate, the first fixed plate and the moving end of the electric slide are fixed; An electric push rod, which is fixed on the top of the first fixing plate and passes through the bottom of the first fixing plate; The cover body is fixed on the telescopic end of the electric push rod, the cover body is used to seal the drying tank, and a first connecting plate is rotatably provided at the bottom of the cover body. The specifications of the first connecting plate and the second connecting plate are the same as those of the support plate.

[0011] Preferably, the pickup assembly comprises: a second fixing plate, wherein the second fixing plate is fixed to the moving end of the electric slide; A multi-stage electric telescopic rod is arranged through the top of the second fixed plate, a tube body is arranged on the telescopic end of the multi-stage electric telescopic rod, a first suction cup is connected and fixed to the end of the tube body, and a third solenoid valve is arranged through the side wall of the tube body.

[0012] Compared with the prior art, the beneficial effects of the present invention are: The present invention, through the motor, placement component, drying component and sealing component, can achieve stacking of wafers at a certain distance by staggered placement of the placement components during use, dehydration of the wafers in cooperation with the motor, and then drying of water stains on the wafer surface through the operation of the drying component. Finally, the sealing component cooperates with the drying component to extract the gas in the drying tank, reduce the evaporation temperature of the water on the wafer, and ensure the drying effect of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0014] Figure 1 It is a three-dimensional structural schematic diagram of the present invention; Figure 2 It is a schematic diagram of the structure of the portal frame and the cylinder of the present invention; Figure 3 It is a schematic diagram of the structure of the connecting seat and the connecting pipe of the present invention; Figure 4 It is a schematic diagram of the support plate structure of the present invention; Figure 5 It is a schematic diagram of the structure of the second fixing plate and the multi-stage electric telescopic rod of the present invention; Figure 6 It is a schematic diagram of the structure of the second tube body and the drying box of the present invention; Figure 7 The present invention Figure 6 A schematic diagram of the partially enlarged structure at center A; Figure 8 It is a schematic diagram of the cross-sectional front view of the drying tank of the present invention.

[0015] Reference numerals: 1. Base; 2. First support rod; 3. Second support rod; 4. Support plate; 5. Electric slide; 6. First fixed plate; 7. Electric push rod; 8. Cover; 9. Drying tank; 10. Second fixed plate; 11. Multi-stage electric telescopic rod; 12. First suction cup; 13. Connection box; 14. Air pump box; 15. First tube body; 16. Second tube body; 17. Third tube body; 18. First solenoid valve; 19. Second solenoid valve; 20. Door Frame; 21. Cylinder; 22. Connecting plate; 23. Drying box; 24. Support plate; 25. First ear plate; 26. Positioning rod; 27. Limiting ring; 28. Second ear plate; 29. ​​Positioning hole; 30. Connecting seat; 31. Connecting pipe; 32. Second suction cup; 33. Third solenoid valve; 34. Rod body; 35. Plug; 36. Through hole; 37. First connecting plate; 38. Second connecting plate; 39. Motor; 40. Rotating shaft. DETAILED DESCRIPTION

[0016] The technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0017] The components of the embodiments of the present invention generally described and shown in the drawings herein may be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention.

[0018] Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without making any creative work shall fall within the scope of protection of the present invention.

[0019] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0020] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0021] Combine the following Figures 1 to 8 As shown, an embodiment of the present invention provides a wafer drying device, comprising: A base 1, with a drying tank 9 disposed on the top of the base 1; A drying component, which is arranged on the top of the base 1 and is connected to the drying tank 9; A rotating shaft 40, the rotating shaft 40 is rotatably disposed on the inner wall of the bottom of the drying tank 9; A second connecting plate 38, the second connecting plate 38 is fixed on the top of the rotating shaft 40; Motor 39, the motor 39 is fixed to the bottom of the drying tank 9, and the output shaft of the motor 39 is fixed to the rotating shaft 40; A plurality of placement components, wherein the plurality of placement components are stacked above the second connecting plate 38; Two support plates 4, both of which are arranged on the top of the base 1; An electric slide 5, which is fixed between two support plates 4; A sealing assembly, the sealing assembly and the moving end of the electric slide 5 are fixed, and the sealing assembly is used to seal the drying tank 9; Two pick-up components, both of which are fixed to the moving end of the electric slide 5, and the two pick-up components are located on both sides of the sealing component, one of which is used to pick up the wafer, and the other is used to pick up the placement component; Storage components, which are arranged on the top of the base 1, are used to store the placement components.

[0022] Further, the drying component includes: An air pump box 14, which is fixed to the top of the base 1, and an air pump is arranged in the air pump box 14; Two connection boxes 13, both of which are fixed on the side wall of the drying tank 9, and a plurality of through holes 36 are opened on the side wall of the drying tank 9 near the connection boxes 13; The first tube body 15 and the third tube body 17 are connected to the two connection boxes 13 respectively, and the first tube body 15 is connected to the input port of the air pump. A heating wire is arranged in the connection box 13 near the first tube body 15; A drying box 23, the drying box 23 is fixed to the side wall of the drying tank 9, and the drying box 23 is filled with a water-absorbing resin; A second tube body 16, which is disposed on the outlet of the air pump and is connected to the drying box 23; The first solenoid valve 18 and the second solenoid valve 19 are both disposed through the top of the drying box 23 , and the third tube 17 is connected to the first solenoid valve 18 .

[0023] When performing the drying process, the switch of the motor 39 is turned on, and the motor 39 drives the rotating shaft 40 to rotate, thereby driving the second connecting plate 38 to rotate. Through the cooperation of the positioning rod 26 and the positioning hole 29, each support plate 24 starts to rotate, and the water droplets on the surface of the wafer are thrown out to quickly remove a large amount of moisture. After the dehydration is completed, the speed of the motor 39 can be reduced, and the valve at the bottom of the drying tank 9 can be opened to drain the water.

[0024] Furthermore, the placement component includes: A support plate 24, the side wall of the support plate 24 is provided with a plurality of first ear plates 25 and second ear plates 28 distributed at equal distances, and the plurality of first ear plates 25 and the plurality of second ear plates 28 are staggered, a positioning rod 26 is provided at the bottom of each first ear plate 25, a limiting ring 27 is fixedly sleeved on the side wall of each positioning rod 26, and a positioning hole 29 is penetrated through the top of each second ear plate 28, and the positioning rod 26 and the positioning hole 29 are adapted; A connecting seat 30, the connecting seat 30 is fixed to the bottom of the supporting plate 24; A plurality of second suction cups 32, wherein the plurality of second suction cups 32 are all fixed on the top of the support plate 24, and each second suction cup 32 is connected to the connecting seat 30; The connecting pipe 31 is provided through the side wall of the connecting seat 30 .

[0025] Furthermore, a door frame 20 is fixed to the side wall of the drying tank 9, a cylinder 21 is provided through the side wall of the door frame 20, a connecting plate 22 is provided at the telescopic end of the cylinder 21, a plurality of rods 34 are slidably inserted into the side wall of the drying tank 9, and each rod 34 is fixed to the connecting plate 22, and a plug 35 is provided at the end of each rod 34, and the plug 35 is adapted to the connecting pipe 31.

[0026] Through the action of the positioning rod 26 and the positioning hole 29, each 24 can be quickly connected to facilitate the dehydration work. Through the action of the limiting ring 27, it is ensured that there is a gap between every two 24 to ensure that the wafer will not be squeezed and damaged.

[0027] Further, the storage component includes: A plurality of first support rods 2, wherein the plurality of first support rods 2 are fixed on the top of the base 1 in a circular shape with equal distances; A plurality of second support rods 3 are fixed in a circular shape at equal distances on the top of the base 1 , and both the first support rod 2 and the second support rod 3 are adapted to the positioning holes 29 .

[0028] Through the different distribution of the first support rods 2 and the second support rods 3, it is not necessary to adjust the positions of every two adjacent support plates 24 during placement, so as to ensure work efficiency, and the connecting pipes 31 on all the support plates 24 face the same direction.

[0029] Further, the sealing assembly comprises: A first fixed plate 6, the first fixed plate 6 and the moving end of the electric slide 5 are fixed; An electric push rod 7, which is fixed on the top of the first fixing plate 6 and passes through the bottom of the first fixing plate 6; The cover body 8 is fixed on the telescopic end of the electric push rod 7. The cover body 8 is used to seal the drying tank 9. A first connecting plate 37 is rotatably provided at the bottom of the cover body 8. The specifications of the first connecting plate 37 and the second connecting plate 38 are the same as those of the support plate 24.

[0030] Further, the pickup assembly comprises: A second fixed plate 10, the second fixed plate 10 is fixed on the moving end of the electric slide 5; The multi-stage electric telescopic rod 11 is arranged through the top of the second fixed plate 10, a tube body is arranged on the telescopic end of the multi-stage electric telescopic rod 11, a first suction cup 12 is connected and fixed to the end of the tube body, and a third solenoid valve 33 is arranged through the side wall of the tube body.

[0031] The specific working method is: when in use, the wafer feeding device is placed on one side of the drying tank 9, and the switch of the electric slide 5 is turned on. When the electric slide 5 is working, the two second fixed plates 10 are driven to move back and forth, and one of the second fixed plates 10 is moved between the plurality of second support rods 3, and then the multi-stage electric telescopic rod 11 on the second fixed plate 10 is turned on. During the working process of the multi-stage electric telescopic rod 11, the first suction cup 12 is driven to contact the support plate 24 on the second support rod 3, and as the multi-stage electric telescopic rod 11 works, the gas in the first suction cup 12 is discharged to achieve the grasping of the support plate 24, and then the electric slide 5 is used to move the first suction cup 12 to the support plate 24. , the second fixed plate 10, the multi-stage electric telescopic rod 11 and the first suction cup 12 drive the support plate 24 to move to the top of the drying tank 9, and finally the support plate 24 is placed on the second connecting plate 38 through the operation of the multi-stage electric telescopic rod 11, and the positioning rod 26 on the support plate 24 passes through the positioning hole 29 on the second connecting plate 38, and the support plate 24 is placed under the action of the limit ring 27, and then the switch of the third solenoid valve 33 is turned on, so that the outside air can enter the first suction cup 12, so as to realize the separation of the first suction cup 12 and the support plate 24, and finally the first suction cup 12 is driven to rise by the multi-stage electric telescopic rod 11; Then the electric slide 5 drives another second fixed plate 10 to move to the wafer feeding device, and grabs the wafer through the corresponding second fixed plate 10, the multi-stage electric telescopic rod 11 and the first suction cup 12, and then the electric slide 5 works together with the multi-stage electric telescopic rod 11 to place the wafer on the support plate 24 in the drying tank 9, and then the electric slide 5 drives the first suction cup 12 to move to the first support rod 2, and the support plate 24 on the first support rod 2 is placed above the support plate 24 in the drying tank 9, and the above operation is repeated to achieve the sequential placement of multiple support plates 24, and a wafer is placed on each support plate 24; Through the different distribution of the first support rod 2 and the second support rod 3, it is not necessary to adjust the position of every two adjacent support plates 24 during placement, so as to ensure work efficiency, and the connecting pipes 31 on all the support plates 24 face the same direction; The electric slide 5 drives the first fixing plate 6 to move to the top of the drying tank 9, and the electric push rod 7 works to make the cover 8 seal the drying tank 9. In this process, the first connecting plate 37 on the cover 8 is close to the uppermost support plate 24, and the positioning rod 26 on the first connecting plate 37 enters the positioning hole 29 of the support plate 24 to achieve the fixing of each support plate 24. The air pump is switched on, and the first solenoid valve 18 is closed and the second solenoid valve 19 is opened. At this time, the gas in the drying tank 9 is extracted through the first tube 15 and the connecting box 13 corresponding to the first tube 15, and is transported to the drying box 23 through the second tube 16, and finally discharged through the second solenoid valve 19, so that all parts of the drying tank 9 are in a vacuum environment; The switch of the cylinder 21 is turned on. When the cylinder 21 is working, it drives each rod body 34 to move through the connecting plate 22, so that the plug 35 on the rod body 34 seals the connecting pipe 31. Since the second suction cup 32 is in a negative pressure environment at this time, the second suction cup 32 can fix the wafer. Then, the switch of the first solenoid valve 18 is turned on, so that the external air can enter the drying box 23 through the second solenoid valve 19, and then enter the drying tank 9 through the first solenoid valve 18, the third tube body 17 and the connecting box 13 corresponding to the third tube body 17; When drying, the switch of the motor 39 is turned on, and the motor 39 drives the rotating shaft 40 to rotate, thereby driving the second connecting plate 38 to rotate. Through the cooperation of the positioning rod 26 and the positioning hole 29, each support plate 24 starts to rotate, and the water droplets on the surface of the wafer are thrown out to quickly remove a large amount of water. After the dehydration is completed, the speed of the motor 39 can be reduced, and the valve at the bottom of the drying tank 9 can be opened to discharge the water; Then, the second solenoid valve 19 is closed, and the first solenoid valve 18 is turned on. When the air pump is working, the gas in the drying tank 9 is pumped into the second tube body 16 through the first tube body 15 and the connection box 13 corresponding to the first tube body 15, and then enters the drying box 23, and then passes through the first solenoid valve 18, the third tube body 17 and the connection box 13 corresponding to the third tube body 17, and finally returns to the drying tank 9, so that the gas circulation in the drying tank 9 is realized. In this process, the switch of the electric heating wire is turned on to dry the wafers in the drying tank 9 through the hot air flow, and the water vapor in the gas is adsorbed by the water-absorbing resin in the drying box 23 to achieve drying; When the wafer reaches a certain temperature, the second solenoid valve 19 is opened and the first solenoid valve 18 is closed, and the air pressure in the drying tank 9 is reduced again in cooperation with the air pump. The low-pressure environment can effectively reduce the boiling point of water, thereby facilitating the evaporation of water on the wafer to achieve the final drying effect; When the activity of the water-absorbing resin in the drying box 23 needs to be restored, the cover 8 is moved away from the drying tank 9, the switch of the heating wire is turned on, and the first solenoid valve 18 is closed and the second solenoid valve 19 is opened, so that the high-temperature gas continuously passes through the drying box 23, thereby effectively realizing the recovery of the activity of the water-absorbing resin.

[0032] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer drying device, characterized in that: include: A base (1), wherein a drying tank (9) is arranged on the top of the base (1); A drying component, the drying component being arranged on the top of the base (1), the drying component being connected to the drying tank (9); A rotating shaft (40), the rotating shaft (40) being rotatably disposed on the inner wall of the bottom of the drying tank (9); A second connecting plate (38), the second connecting plate (38) being fixed on the top of the rotating shaft (40); A motor (39), wherein the motor (39) is fixed to the bottom of the drying tank (9), and an output shaft of the motor (39) and a rotating shaft (40) are fixed; A plurality of placement components, wherein the plurality of placement components are stacked on top of the second connecting plate (38); Two support plates (4), both of which are arranged on the top of the base (1); An electric slide (5), wherein the electric slide (5) is fixed between two support plates (4); A sealing component, the sealing component and the moving end of the electric slide (5) are fixed, and the sealing component is used to seal the drying tank (9); Two pick-up components, both of which are fixed to the moving end of the electric slide (5), and the two pick-up components are located on both sides of the sealing component, one of the pick-up components is used to pick up the wafer, and the other pick-up component is used to pick up the placement component; Storage components, each of which is arranged on the top of the base (1), and is used to store the placement components.

2. A wafer drying device according to claim 1, characterized in that: The drying component comprises: An air pump box (14), the air pump box (14) being fixed to the top of the base (1), and an air pump being arranged in the air pump box (14); Two connection boxes (13), both of which are fixed on the side wall of the drying tank (9), and a plurality of through holes (36) are formed on the side wall of the drying tank (9) near the connection boxes (13); A first tube body (15) and a third tube body (17), wherein the first tube body (15) and the third tube body (17) are respectively connected to two connection boxes (13), and the first tube body (15) is connected to an input port of an air pump, and a heating wire is arranged in the connection box (13) near the first tube body (15); A drying box (23), the drying box (23) being fixed on a side wall of the drying tank (9), and the drying box (23) being filled with a water-absorbing resin; A second tube body (16), wherein the second tube body (16) is arranged on the output port of the air pump, and the second tube body (16) is connected to the drying box (23); A first solenoid valve (18) and a second solenoid valve (19), wherein the first solenoid valve (18) and the second solenoid valve (19) are both arranged through the top of the drying box (23), and the third tube (17) is in communication with the first solenoid valve (18).

3. A wafer drying device according to claim 2, characterized in that: The placement component comprises: A support plate (24), wherein a side wall of the support plate (24) is provided with a plurality of first ear plates (25) and second ear plates (28) which are distributed at equal distances, and the plurality of first ear plates (25) and the plurality of second ear plates (28) are distributed in a staggered manner, a positioning rod (26) is provided at the bottom of each first ear plate (25), a limiting ring (27) is fixedly sleeved on the side wall of each positioning rod (26), and a positioning hole (29) is penetrated through the top of each second ear plate (28), and the positioning rod (26) and the positioning hole (29) are adapted to each other; A connecting seat (30), wherein the connecting seat (30) is fixed to the bottom of the supporting plate (24); A plurality of second suction cups (32), wherein the plurality of second suction cups (32) are all fixed on the top of the support plate (24), and each second suction cup (32) is connected to the connecting seat (30); A connecting pipe (31), wherein the connecting pipe (31) is arranged to penetrate the side wall of the connecting seat (30).

4. A wafer drying device according to claim 3, characterized in that: A door frame (20) is fixed to the side wall of the drying tank (9), a cylinder (21) is provided through the side wall of the door frame (20), a connecting plate (22) is provided at the telescopic end of the cylinder (21), a plurality of rod bodies (34) are slidably inserted into the side wall of the drying tank (9), each rod body (34) is fixed to the connecting plate (22), a plug (35) is provided at the end of each rod body (34), and the plug (35) is adapted to fit the connecting pipe (31).

5. The wafer drying device according to claim 4, characterized in that: The storage component comprises: A plurality of first support rods (2), wherein the plurality of first support rods (2) are distributed in a circular shape at equal distances and are fixed on the top of the base (1); A plurality of second support rods (3) are fixed on the top of the base (1) at equal distances and in a circular distribution, and the first support rod (2) and the second support rod (3) are both adapted to the positioning hole (29).

6. The wafer drying device according to claim 1, characterized in that: The sealing assembly comprises: A first fixed plate (6), the first fixed plate (6) and the moving end of the electric slide (5) being fixed; An electric push rod (7), wherein the electric push rod (7) is fixed to the top of the first fixed plate (6), and the electric push rod (7) passes through the bottom of the first fixed plate (6); A cover body (8), the cover body (8) being fixed on the telescopic end of the electric push rod (7), the cover body (8) being used to seal the drying tank (9), a first connecting plate (37) being rotatably provided at the bottom of the cover body (8), the specifications of the first connecting plate (37) and the second connecting plate (38) being the same as those of the support plate (24).

7. The wafer drying device according to claim 1, characterized in that: The pickup assembly comprises: A second fixed plate (10), the second fixed plate (10) being fixed to the moving end of the electric slide (5); A multi-stage electric telescopic rod (11), the multi-stage electric telescopic rod (11) being arranged through the top of the second fixed plate (10), a tube body being arranged on the telescopic end of the multi-stage electric telescopic rod (11), a first suction cup (12) being connected and fixed to the end of the tube body, and a third solenoid valve (33) being arranged through the side wall of the tube body.

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