Lithium battery pack protection board communication IC test system

Abstract

The invention provides a lithium battery pack protection board communication IC test system in the technical field of lithium battery test. The lithium battery pack protection board communication IC test system comprises an MCU, a digital-to-analog conversion module, a voltage regulation module, a communication module, a level switching rising edge acceleration module and a pull-up driving resistance regulation module, the MCU is respectively connected with the digital-to-analog conversion module, the communication module, the level switching rising edge acceleration module and the pull-up driving resistance adjusting module; the voltage adjusting module is connected with the digital-to-analog conversion module, the communication module and the pull-up driving resistance adjusting module. The communication module is connected with the level switching rising edge acceleration module and the pull-up driving resistance adjusting module. The method has the advantage that the compatibility of the communication IC test of the lithium battery pack protection board is greatly improved.

Description

Technical Field

[0001] The invention relates to the technical field of lithium battery testing, and in particular to a lithium battery pack protection board communication IC testing system. Background Art

[0002] As lithium battery packs have high requirements for safety precautions, protection boards have become an indispensable unit of lithium battery packs. Protection boards are used to protect the charging and discharging of lithium batteries in series and parallel. When charging, they can achieve equal charging of each single cell of the lithium battery, so that the voltage difference between each single cell is within the set value (such as ±20mV), prevent overcharging, overvoltage, and overtemperature, effectively improve the charging effect of lithium batteries in series charging mode, and ensure the energy effect of lithium batteries. When in standby and discharge mode, they simultaneously monitor the over-discharge, undervoltage, short circuit, and overtemperature of the single cell to ensure and extend the service life of the lithium battery and improve the safety level of lithium battery packs. The performance of the protection board is directly related to the quality of the lithium battery pack, and then to the quality of the supporting smart appliances, so there is a need to test the communication IC of the lithium battery pack protection board.

[0003] For the testing of protection board communication IC, traditional testing equipment is only designed for a single type of communication IC, and its communication voltage and pull-up resistor settings are fixed. However, with the rapid development of the lithium battery industry, the types of communication ICs are increasing. Each type of communication IC has unique communication voltage requirements and pull-up resistor drive test requirements during production inspection. This makes traditional testing equipment unable to adapt well to the many brands and series of communication ICs on the market, and cannot meet the diverse testing needs.

[0004] Therefore, how to provide a lithium battery pack protection board communication IC test system to improve the compatibility of lithium battery pack protection board communication IC testing has become a technical problem that needs to be solved urgently. Summary of the invention

[0005] The technical problem to be solved by the present invention is to provide a lithium battery pack protection board communication IC testing system to improve the compatibility of the lithium battery pack protection board communication IC testing.

[0006] The present invention is implemented as follows: A lithium battery pack protection board communication IC test system includes an MCU, a digital-to-analog conversion module, a voltage regulation module, a communication module, a level switching rising edge acceleration module and a pull-up drive resistance adjustment module;

[0007] The MCU is respectively connected to the digital-to-analog conversion module, the communication module, the level switching rising edge speed-up module and the pull-up drive resistance adjustment module; the voltage adjustment module is respectively connected to the digital-to-analog conversion module, the communication module and the pull-up drive resistance adjustment module; the communication module is respectively connected to the level switching rising edge speed-up module and the pull-up drive resistance adjustment module.

[0008] Further, the digital-to-analog conversion module includes a digital-to-analog conversion chip U13, a capacitor C64, a resistor R61, a resistor R715, a resistor R717, a resistor R722, a resistor R186 and a resistor R187;

[0009] Pin 2 of the digital-to-analog conversion chip U13 is connected to resistor R717, pin 3 is connected to resistor R61, pin 5 is connected to resistors R186 and R187, pin 7 is connected to resistor R722, pin 12 is connected to pin 107 of the MCU, pin 13 is connected to pin 108 of the MCU, pin 14 is connected to pin 106 of the MCU, and pin 15 is connected to pin 109 of the MCU, resistor R715, and capacitor C464;

[0010] The resistor R717 , the resistor R61 , and the resistor R722 are connected to the voltage regulating module.

[0011] Further, the voltage regulation module includes an operational amplifier U116A, an operational amplifier U116B, an operational amplifier U7A, a MOS tube Q1, a MOS tube Q71, a MOS tube Q74, a capacitor C9, a capacitor C10, a capacitor C11, a capacitor C14, a capacitor C15, a capacitor C16, a capacitor C60, a capacitor C61, a capacitor C62, a capacitor C63, a capacitor C74, a capacitor C75, a capacitor C495, a capacitor C496, a capacitor C497, a capacitor C498, a capacitor C502, a capacitor C 503, a resistor R49, a resistor R50, a resistor R67, a resistor R68, a resistor R69, a resistor R70, a resistor R71, a resistor R765, a resistor R770, a resistor R771, a resistor R773, a resistor R774, a resistor R777, a resistor R779, a resistor R784, a resistor R793, a resistor R794, a resistor R795, a resistor R797, a resistor R798, a resistor R801, a thermistor TR1, a thermistor TR2, and a thermistor TR3;

[0012] Pin 1 of the operational amplifier U116A is connected to the resistor R774 and the capacitor C495, pin 2 is connected to the resistor R773 and the resistor R765, and pin 3 is connected to the resistor R779; the resistor R765 is connected to the capacitor C495; the resistor R773 is connected to the digital-to-analog conversion module; the capacitors C60, C62, C496 and C497 are connected in parallel, one end is connected to the thermistor TR1, the resistor R770 and the communication module, and the other end is connected to the resistor R777 and the capacitor C74; the resistor R770 is connected to the resistor R777, the resistor R779 and the capacitor C74; the G pole of the MOS tube Q71 is connected to the resistor R771 and the resistor R774, the D pole is connected to the thermistor TR1, and the S pole is connected to the resistor R771;

[0013] Pin 7 of the operational amplifier U116B is connected to resistor R797 and capacitor C498, pin 6 is connected to resistor R784 and resistor R795, and pin 5 is connected to resistor R801; the resistor R784 is connected to capacitor C498; the resistor R795 is connected to the digital-to-analog conversion module; the capacitors C61, C63, C502 and C503 are connected in parallel, one end is connected to the thermistor TR2, resistor R793 and the communication module, and the other end is connected to resistor R798 and capacitor C75; the resistor R793 is connected to resistor R798, resistor R801 and capacitor C75; the G pole of the MOS tube Q74 is connected to resistor R794 and resistor R797, the D pole is connected to the thermistor TR2, and the S pole is connected to resistor R794;

[0014] Pin 1 of the operational amplifier U7A is connected to resistor R68 and capacitor C9, pin 2 is connected to resistor R49 and resistor R67, and pin 3 is connected to resistor R50; the resistor R67 is connected to capacitor C9; the resistor R49 is connected to the digital-to-analog conversion module; the capacitors C11, C14, C15 and C16 are connected in parallel with one end connected to the thermistor TR3, resistor R70 and the communication module, and the other end connected to resistor R71 and capacitor C10; the resistor R70 is connected to resistor R50, resistor R71 and capacitor C10; the G pole of the MOS tube Q1 is connected to resistor R68 and resistor R69, the D pole is connected to the thermistor TR3, and the S pole is connected to resistor R69.

[0015] Furthermore, the communication module includes a communication chip U5, a communication chip U6, a communication chip U11, a bidirectional diode D10, a bidirectional diode D11, a bidirectional diode D12, a resistor R66, a resistor R76, a resistor R77, a resistor R79, a resistor R81, a resistor R83, a resistor R164, a resistor R168, a resistor R169, a resistor R180, a resistor R181, and a resistor R183. a resistor R183, a resistor R738, a resistor R743, a resistor R750, a resistor R757, a capacitor C20, a capacitor C21, a capacitor C22, a capacitor C23, a capacitor C24, a capacitor C99, a capacitor C100, a capacitor C482, a capacitor C483, a capacitor C484, a capacitor C486, a capacitor C489, a capacitor C490, a capacitor C103 and a capacitor C104;

[0016] Pin 2 of the communication chip U5 is connected to the voltage regulating module, pins 3, 4, 5, 6, 7, 8, 9, 10 are all connected to resistor R743, capacitor C483 and pin 2 of the bidirectional diode D11, pins 11, 12, 13, 14, 15, 16, 17, 18 are all connected to resistor R180 and capacitor C103, and pins 19 and 20 are all connected to resistor R738 and capacitor C482; pin 1 of the bidirectional diode D11 is connected to capacitor C484, resistor R743 and the pull-up drive resistance regulating module; the resistor R77 is connected to resistor R738; one end of the resistor R168 is connected to resistor R164 and capacitor C100, and the other end is connected to resistor R169, pin 82 of the MCU and the level switching rising edge speed-up module;

[0017] Pin 2 of the communication chip U6 is connected to the voltage regulating module, pins 3, 4, 5, 6, 7, 8, 9, 10 are all connected to resistor R757, capacitor C490 and pin 2 of the bidirectional diode D12, pins 11, 12, 13, 14, 15, 16, 17, 18 are all connected to resistor R180 and capacitor C103, and pins 19 and 20 are all connected to resistor R770 and capacitor C486; pin 1 of the bidirectional diode D12 is connected to capacitor C489, resistor R757 and the pull-up drive resistance regulating module; one end of the resistor R181 is connected to resistor R180 and capacitor C104, and the other end is connected to resistor R183, pin 81 of the MCU and the level switching rising edge speed-up module;

[0018] Pin 2 of the communication chip U11 is connected to the voltage regulation module, pins 3, 4, 5, 6, 7, 8, 9, and 10 are all connected to resistor R66, capacitor C21, and pin 2 of the bidirectional diode D10, pins 11, 12, 13, 14, 15, 16, 17, and 18 are all connected to resistor R79 and capacitor C23, and pins 19 and 20 are all connected to resistor R76 and capacitor C22; pin 1 of the bidirectional diode D10 is connected to capacitor C20, resistor R66, and a pull-up drive resistance adjustment module; one end of the resistor R81 is connected to resistor R79 and capacitor C24, and the other end is connected to resistor R83, pin 83 of the MCU, and a level switching rising edge speed-up module.

[0019] Further, the level switching rising edge speed-up module includes a bidirectional logic level conversion chip U15, a resistor R195, a resistor R203, a resistor R204, a resistor R205, a resistor R206, a resistor R207, a resistor R208, a resistor R270, a resistor R271, a resistor R272, a resistor R273 and a capacitor C144;

[0020] Pin VL1 of the bidirectional logic level conversion chip U15 is connected to resistor R203, pin VL2 is connected to resistor R204, pin VL3 is connected to resistor R205, pin VL4 is connected to resistor R206, pin VCC1 is connected to resistor R270 and resistor R203, pin VCC2 is connected to resistor R272 and resistor R204, pin VCC3 is connected to resistor R271 and resistor R205, and pin VCC4 is connected to resistor R207;

[0021] After the resistor R208 is connected in parallel with the capacitor C144, one end is connected to the resistor R273 and the pin THR-STA of the bidirectional logic level conversion chip U15, and the other end is grounded;

[0022] The resistor R270 , the resistor R271 and the resistor R272 are all connected to the communication module; the resistor R195 is connected to the resistor R273 and the pin 95 of the MCU.

[0023] Further, the pull-up driving resistance adjustment module includes a first resistance adjustment unit, a second resistance adjustment unit and a third resistance adjustment unit;

[0024] The first resistance adjustment unit, the second resistance adjustment unit and the third resistance adjustment unit are all connected to the MCU, the voltage adjustment module and the communication module.

[0025] Further, the first resistance adjustment unit includes an analog switch U1, a resistor R1, a resistor R4, a resistor R7, a resistor R10, a resistor R13, a resistor R16, a resistor R19, a resistor R22, a resistor R25, a resistor R28, a resistor R31, a resistor R34, a resistor R37, a resistor R40, a resistor R43, a resistor R54, a resistor R166, a resistor R167, a resistor R170, a resistor R171, a resistor R172, a diode 2D26, a diode 2D27, a diode 2D28, a diode 2D29 and a diode 2D30;

[0026] Pin 24 of the analog switch U1 is connected to resistors R166, R167, R170, R171 and R172, pins 9, 8, 7, 6, 5, 4, 3, 2, 23, 22, 21, 20, 19, 18, 17 and 16 are respectively connected to resistors R54, R1, R4, R7, R10, R13, R16, R19, R22, R25, R28, R31, R34, R37, R40 and R43, and pin 1 is connected to a voltage regulation module;

[0027] The resistor R54, the resistor R1, the resistor R4, the resistor R7, the resistor R10, the resistor R13, the resistor R16, the resistor R19, the resistor R22, the resistor R25, the resistor R28, the resistor R31, the resistor R34, the resistor R37, the resistor R40 and the resistor R43 are all connected to the communication module;

[0028] The input end of the diode 2D26 is connected to the resistor R166, and the output end is connected to the pin 21 of the MCU; the input end of the diode 2D27 is connected to the resistor R167, and the output end is connected to the pin 22 of the MCU; the input end of the diode 2D28 is connected to the resistor R170, and the output end is connected to the pin 23 of the MCU; the input end of the diode 2D29 is connected to the resistor R171, and the output end is connected to the pin 24 of the MCU; the input end of the diode 2D30 is connected to the resistor R172, and the output end is connected to the pin 20 of the MCU.

[0029] Further, the second resistance adjustment unit includes an analog switch U2, a resistor R173, a resistor R174, a resistor R175, a resistor R176, a resistor R177, a resistor R57, a resistor R2, a resistor R5, a resistor R8, a resistor R11, a resistor R14, a resistor R17, a resistor R20, a resistor R23, a resistor R26, a resistor R29, a resistor R32, a resistor R35, a resistor R38, a resistor R41, a resistor R44, a diode 2D31, a diode 2D32, a diode 2D33, a diode 2D34 and a diode 2D35;

[0030] The pin 24 of the analog switch U2 is connected to the resistor R173, the resistor R174, the resistor R175, the resistor R176 and the resistor R177, the pins 9, 8, 7, 6, 5, 4, 3, 2, 23, 22, 21, 20, 19, 18, 17, 16 are respectively connected to the resistor R57, the resistor R2, the resistor R5, the resistor R8, the resistor R11, the resistor R14, the resistor R17, the resistor R20, the resistor R23, the resistor R26, the resistor R29, the resistor R32, the resistor R35, the resistor R38, the resistor R41, and the resistor R44, and the pin 1 is connected to the voltage regulation module;

[0031] The resistor R57, the resistor R2, the resistor R5, the resistor R8, the resistor R11, the resistor R14, the resistor R17, the resistor R20, the resistor R23, the resistor R26, the resistor R29, the resistor R32, the resistor R35, the resistor R38, the resistor R41 and the resistor R44 are all connected to the communication module;

[0032] The input end of the diode 2D31 is connected to the resistor R173, and the output end is connected to the pin 34 of the MCU; the input end of the diode 2D32 is connected to the resistor R174, and the output end is connected to the pin 35 of the MCU; the input end of the diode 2D33 is connected to the resistor R175, and the output end is connected to the pin 36 of the MCU; the input end of the diode 2D34 is connected to the resistor R176, and the output end is connected to the pin 37 of the MCU; the input end of the diode 2D35 is connected to the resistor R177, and the output end is connected to the pin 33 of the MCU.

[0033] Further, the third resistance adjustment unit includes an analog switch U3, a resistor R178, a resistor R179, a resistor R182, a resistor R184, a resistor R185, a resistor R59, a resistor R3, a resistor R6, a resistor R9, a resistor R12, a resistor R15, a resistor R18, a resistor R21, a resistor R24, a resistor R27, a resistor R30, a resistor R33, a resistor R36, a resistor R39, a resistor R42, a resistor R45, a diode 2D36, a diode 2D37, a diode 2D38, a diode 2D39 and a diode 2D40;

[0034] Pin 24 of the analog switch U3 is connected to resistor R178, resistor R179, resistor R182, resistor R184 and resistor R185, pins 9, 8, 7, 6, 5, 4, 3, 2, 23, 22, 21, 20, 19, 18, 17 and 16 are respectively connected to resistor R59, resistor R3, resistor R6, resistor R9, resistor R12, resistor R15, resistor R18, resistor R21, resistor R24, resistor R27, resistor R30, resistor R33, resistor R36, resistor R39, resistor R42 and resistor R45, and pin 1 is connected to the voltage regulation module;

[0035] The resistor R59, the resistor R3, the resistor R6, the resistor R9, the resistor R12, the resistor R15, the resistor R18, the resistor R21, the resistor R24, the resistor R27, the resistor R30, the resistor R33, the resistor R36, the resistor R39, the resistor R42 and the resistor R45 are all connected to the communication module;

[0036] The input end of the diode 2D36 is connected to the resistor R178, and the output end is connected to the pin 2 of the MCU; the input end of the diode 2D37 is connected to the resistor R179, and the output end is connected to the pin 3 of the MCU; the input end of the diode 2D38 is connected to the resistor R182, and the output end is connected to the pin 4 of the MCU; the input end of the diode 2D39 is connected to the resistor R184, and the output end is connected to the pin 5 of the MCU; the input end of the diode 2D40 is connected to the resistor R185, and the output end is connected to the pin 1 of the MCU.

[0037] The advantages of the present invention are:

[0038] By setting the MCU, the digital-to-analog conversion module, the voltage regulation module, the communication module, the level switching rising edge acceleration module and the pull-up drive resistance adjustment module, the level switching rising edge acceleration module, the MCU, the digital-to-analog conversion module, the voltage regulation module and the communication module are connected in sequence, one end of the pull-up drive resistance adjustment module is connected to the MCU and the voltage regulation module, and the other end is connected to the communication module, and the level switching rising edge acceleration module is connected to the communication module; the digital-to-analog conversion module outputs a corresponding voltage value to the voltage regulation module based on the signal sent by the MCU, and the voltage regulation module outputs a voltage value of low current drive capability of the digital-to-analog conversion module , converted into a voltage value with high current driving capability for use by the communication module and the pull-up drive resistance adjustment module; the MCU enables the communication level switching rising edge acceleration of the communication IC of the protection board through the level switching rising edge acceleration module, configures the required pull-up resistance value through the pull-up drive resistance adjustment module, and connects the protection board through the communication module to test the communication IC of the protection board; that is, through the level switching rising edge acceleration module and the pull-up drive resistance adjustment module, different communication voltage requirements and pull-up resistor drive test requirements can be flexibly matched, thereby greatly improving the compatibility of the communication IC test of the lithium battery pack protection board. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] The present invention will be further described below in conjunction with embodiments with reference to the accompanying drawings.

[0040] Figure 1 The invention discloses a circuit principle block diagram of a communication IC testing system for a lithium battery pack protection board.

[0041] Figure 2 It is a circuit diagram of the digital-to-analog conversion module of the present invention.

[0042] Figure 3 It is a circuit diagram of the voltage regulation module of the present invention.

[0043] Figure 4 It is a circuit diagram of the communication module of the present invention.

[0044] Figure 5 It is a circuit diagram of the level switching rising edge speed-up module of the present invention.

[0045] Figure 6 is a circuit diagram of the first resistance adjustment unit of the present invention.

[0046] Figure 7 is a circuit diagram of the second resistance adjustment unit of the present invention.

[0047] Figure 8 is a circuit diagram of the third resistance adjustment unit of the present invention.

[0048] Fig. 9 It is a circuit diagram of the MCU of the present invention. DETAILED DESCRIPTION

[0049] The technical solution in the embodiment of the present application has the following overall idea: during the communication test with the communication IC of the lithium battery pack protection board, the pull-up resistor in the communication loop is adjusted by the analog switch of the pull-up drive resistance adjustment module, and the output side voltage of the bidirectional logic level conversion chip U15 of the level switching rising edge speed-up module is adjusted to meet the different levels required by different communication ICs during the test, so as to perform flexible tests on different communication ICs.

[0050] The present invention adjusts the pull-up driving resistance on the communication link by controlling the selection link of the analog switch; converts the voltage signal of low current driving capability in the digital-to-analog conversion module into the voltage signal of high current driving capability by the PID adjustment control mode; adds an IC with a rising edge acceleration function, i.e., a bidirectional logic level conversion chip U15, to the communication link, so that the rising edge time of the waveform in the communication process is shortened, thereby enhancing the stability and anti-interference of the communication; adjusts different communication level requirements by using a digital-to-analog conversion module with multi-channel output adjustment to meet the personalized requirements of the communication level; adds a diode to the pull-up driving resistance adjustment module, pulls up the high and low level zero points in the communication process, and meets the requirements of the control signal level threshold of the analog switch; and reduces the on-impedance by connecting the multi-channel interfaces of the communication IC together in the communication module and using them in parallel, thereby reducing the influence of the on-impedance on the communication IC on the communication level.

[0051] Please refer to Figures 1 to 9 As shown, a preferred embodiment of a lithium battery pack protection board communication IC test system of the present invention includes an MCU, a digital-to-analog conversion module (DAC), a voltage regulation module, a communication module, a level switching rising edge acceleration module and a pull-up drive resistance adjustment module;

[0052] The MCU is used to exchange information with the digital-to-analog conversion module and the communication module, control the level output of the digital-to-analog conversion module, control the pull-up drive resistance adjustment module to perform different pull-up drive resistance configurations, and control the level switching rising edge speed-up module to enable speed-up control. The model can be an ARM microprocessor TM4C1294; the digital-to-analog conversion module is used to output a specific voltage value to the voltage regulation module with high precision according to the signal transmitted from the MCU; the voltage regulation module controls the output voltage value of the low current drive capability transmitted from the digital-to-analog conversion module through proportional, integral, and differential control, referred to as PID control regulation circuit. The voltage value converted into high current driving capability is provided to the communication module and the pull-up drive resistance adjustment module for use; the communication module serves as a bridge for communication between the MCU and the protection board of the lithium battery pack to be tested, and the electrical signals provided by the level switching rising edge acceleration module, the pull-up drive resistance adjustment module, and the voltage adjustment module act on the communication link between the MCU and the protection board of the lithium battery pack to be tested; the level switching rising edge acceleration module enables the communication level switching rising edge acceleration of the communication IC through the MCU; the pull-up drive resistance adjustment module is configured to the required pull-up resistance value through the MCU and acts on the communication module.

[0053] The MCU is respectively connected to the digital-to-analog conversion module, the communication module, the level switching rising edge speed-up module and the pull-up drive resistance adjustment module; the voltage adjustment module is respectively connected to the digital-to-analog conversion module, the communication module and the pull-up drive resistance adjustment module; the communication module is respectively connected to the level switching rising edge speed-up module and the pull-up drive resistance adjustment module.

[0054] The digital-to-analog conversion module includes a digital-to-analog conversion chip U13, a capacitor C64, a resistor R61, a resistor R715, a resistor R717, a resistor R722, a resistor R186 and a resistor R187;

[0055] Pin 2 of the digital-to-analog conversion chip U13 is connected to resistor R717, pin 3 is connected to resistor R61, pin 5 is connected to resistors R186 and R187, pin 7 is connected to resistor R722, pin 12 is connected to pin 107 of MCU, pin 13 is connected to pin 108 of MCU, pin 14 is connected to pin 106 of MCU, pin 15 is connected to pin 109 of MCU, resistor R715 and capacitor C464; the model of the digital-to-analog conversion chip U13 can be selected as AD5686;

[0056] The resistor R717 , the resistor R61 , and the resistor R722 are connected to the voltage regulating module.

[0057] The voltage regulation module includes an operational amplifier U116A, an operational amplifier U116B, an operational amplifier U7A, a MOS tube Q1, a MOS tube Q71, a MOS tube Q74, a capacitor C9, a capacitor C10, a capacitor C11, a capacitor C14, a capacitor C15, a capacitor C16, a capacitor C60, a capacitor C61, a capacitor C62, a capacitor C63, a capacitor C74, a capacitor C75, a capacitor C495, a capacitor C496, a capacitor C497, a capacitor C498, a capacitor C502, a capacitor C503, a resistor R49, a resistor R50, a resistor R67, a resistor R68, and a resistor R69 , a resistor R70, a resistor R71, a resistor R765, a resistor R770, a resistor R771, a resistor R773, a resistor R774, a resistor R777, a resistor R779, a resistor R784, a resistor R793, a resistor R794, a resistor R795, a resistor R797, a resistor R798, a resistor R801, a thermistor TR1, a thermistor TR2 and a thermistor TR3; the operational amplifier U116A, the operational amplifier U116B and the operational amplifier U7A can be selected as OPA2188; the MOS tube Q1, the MOS tube Q71 and the MOS tube Q74 are all PMOS tubes;

[0058] Pin 1 of the operational amplifier U116A is connected to the resistor R774 and the capacitor C495, pin 2 is connected to the resistor R773 and the resistor R765, and pin 3 is connected to the resistor R779; the resistor R765 is connected to the capacitor C495; the resistor R773 is connected to the digital-to-analog conversion module; the capacitors C60, C62, C496 and C497 are connected in parallel, one end is connected to the thermistor TR1, the resistor R770 and the communication module, and the other end is connected to the resistor R777 and the capacitor C74; the resistor R770 is connected to the resistor R777, the resistor R779 and the capacitor C74; the G pole of the MOS tube Q71 is connected to the resistor R771 and the resistor R774, the D pole is connected to the thermistor TR1, and the S pole is connected to the resistor R771;

[0059] Pin 7 of the operational amplifier U116B is connected to resistor R797 and capacitor C498, pin 6 is connected to resistor R784 and resistor R795, and pin 5 is connected to resistor R801; the resistor R784 is connected to capacitor C498; the resistor R795 is connected to the digital-to-analog conversion module; the capacitors C61, C63, C502 and C503 are connected in parallel, one end is connected to the thermistor TR2, resistor R793 and the communication module, and the other end is connected to resistor R798 and capacitor C75; the resistor R793 is connected to resistor R798, resistor R801 and capacitor C75; the G pole of the MOS tube Q74 is connected to resistor R794 and resistor R797, the D pole is connected to the thermistor TR2, and the S pole is connected to resistor R794;

[0060] Pin 1 of the operational amplifier U7A is connected to resistor R68 and capacitor C9, pin 2 is connected to resistor R49 and resistor R67, and pin 3 is connected to resistor R50; the resistor R67 is connected to capacitor C9; the resistor R49 is connected to the digital-to-analog conversion module; the capacitors C11, C14, C15 and C16 are connected in parallel with one end connected to the thermistor TR3, resistor R70 and the communication module, and the other end connected to resistor R71 and capacitor C10; the resistor R70 is connected to resistor R50, resistor R71 and capacitor C10; the G pole of the MOS tube Q1 is connected to resistor R68 and resistor R69, the D pole is connected to the thermistor TR3, and the S pole is connected to resistor R69.

[0061] The communication module includes a communication chip U5, a communication chip U6, a communication chip U11, a bidirectional diode D10, a bidirectional diode D11, a bidirectional diode D12, a resistor R66, a resistor R76, a resistor R77, a resistor R79, a resistor R81, a resistor R83, a resistor R164, a resistor R168, a resistor R169, a resistor R180, a resistor R181, a resistor R183, a resistor R738, a resistor R743, and a resistor R754. Resistor R750, resistor R757, capacitor C20, capacitor C21, capacitor C22, capacitor C23, capacitor C24, capacitor C99, capacitor C100, capacitor C482, capacitor C483, capacitor C484, capacitor C486, capacitor C489, capacitor C490, capacitor C103 and capacitor C104; the model of the communication chip U5, communication chip U6 and communication chip U11 can be selected as SN74GTL2003;

[0062] Pin 2 of the communication chip U5 is connected to the voltage regulating module, pins 3, 4, 5, 6, 7, 8, 9, 10 are all connected to resistor R743, capacitor C483 and pin 2 of the bidirectional diode D11, pins 11, 12, 13, 14, 15, 16, 17, 18 are all connected to resistor R180 and capacitor C103, and pins 19 and 20 are all connected to resistor R738 and capacitor C482; pin 1 of the bidirectional diode D11 is connected to capacitor C484, resistor R743 and the pull-up drive resistance regulating module; the resistor R77 is connected to resistor R738; one end of the resistor R168 is connected to resistor R164 and capacitor C100, and the other end is connected to resistor R169, pin 82 of the MCU and the level switching rising edge speed-up module;

[0063] Pin 2 of the communication chip U6 is connected to the voltage regulating module, pins 3, 4, 5, 6, 7, 8, 9, 10 are all connected to resistor R757, capacitor C490 and pin 2 of the bidirectional diode D12, pins 11, 12, 13, 14, 15, 16, 17, 18 are all connected to resistor R180 and capacitor C103, and pins 19 and 20 are all connected to resistor R770 and capacitor C486; pin 1 of the bidirectional diode D12 is connected to capacitor C489, resistor R757 and the pull-up drive resistance regulating module; one end of the resistor R181 is connected to resistor R180 and capacitor C104, and the other end is connected to resistor R183, pin 81 of the MCU and the level switching rising edge speed-up module;

[0064] Pin 2 of the communication chip U11 is connected to the voltage regulation module, pins 3, 4, 5, 6, 7, 8, 9, and 10 are all connected to resistor R66, capacitor C21, and pin 2 of the bidirectional diode D10, pins 11, 12, 13, 14, 15, 16, 17, and 18 are all connected to resistor R79 and capacitor C23, and pins 19 and 20 are all connected to resistor R76 and capacitor C22; pin 1 of the bidirectional diode D10 is connected to capacitor C20, resistor R66, and a pull-up drive resistance adjustment module; one end of the resistor R81 is connected to resistor R79 and capacitor C24, and the other end is connected to resistor R83, pin 83 of the MCU, and a level switching rising edge speed-up module.

[0065] The level switching rising edge speed-up module includes a bidirectional logic level conversion chip U15, a resistor R195, a resistor R203, a resistor R204, a resistor R205, a resistor R206, a resistor R207, a resistor R208, a resistor R270, a resistor R271, a resistor R272, a resistor R273 and a capacitor C144; the model of the bidirectional logic level conversion chip U15 can be selected as TXS0104E, and the bidirectional logic level conversion chip U15 has a function of accelerating the rising edge of communication level switching;

[0066] Pin VL1 of the bidirectional logic level conversion chip U15 is connected to resistor R203, pin VL2 is connected to resistor R204, pin VL3 is connected to resistor R205, pin VL4 is connected to resistor R206, pin VCC1 is connected to resistor R270 and resistor R203, pin VCC2 is connected to resistor R272 and resistor R204, pin VCC3 is connected to resistor R271 and resistor R205, and pin VCC4 is connected to resistor R207;

[0067] After the resistor R208 is connected in parallel with the capacitor C144, one end is connected to the resistor R273 and the pin THR-STA of the bidirectional logic level conversion chip U15, and the other end is grounded;

[0068] The resistor R270 , the resistor R271 and the resistor R272 are all connected to the communication module; the resistor R195 is connected to the resistor R273 and the pin 95 of the MCU.

[0069] The pull-up driving resistance adjustment module includes a first resistance adjustment unit, a second resistance adjustment unit and a third resistance adjustment unit;

[0070] The first resistance adjustment unit, the second resistance adjustment unit and the third resistance adjustment unit are all connected to the MCU, the voltage adjustment module and the communication module.

[0071] The first resistance adjustment unit includes an analog switch U1, a resistor R1, a resistor R4, a resistor R7, a resistor R10, a resistor R13, a resistor R16, a resistor R19, a resistor R22, a resistor R25, a resistor R28, a resistor R31, a resistor R34, a resistor R37, a resistor R40, a resistor R43, a resistor R54, a resistor R166, a resistor R167, a resistor R170, a resistor R171, a resistor R172, a diode 2D26, a diode 2D27, a diode 2D28, a diode 2D29 and a diode 2D30;

[0072] Pin 24 of the analog switch U1 is connected to resistors R166, R167, R170, R171 and R172, pins 9, 8, 7, 6, 5, 4, 3, 2, 23, 22, 21, 20, 19, 18, 17 and 16 are respectively connected to resistors R54, R1, R4, R7, R10, R13, R16, R19, R22, R25, R28, R31, R34, R37, R40 and R43, and pin 1 is connected to a voltage regulation module;

[0073] The resistor R54, the resistor R1, the resistor R4, the resistor R7, the resistor R10, the resistor R13, the resistor R16, the resistor R19, the resistor R22, the resistor R25, the resistor R28, the resistor R31, the resistor R34, the resistor R37, the resistor R40 and the resistor R43 are all connected to the communication module;

[0074] The input end of the diode 2D26 is connected to the resistor R166, and the output end is connected to the pin 21 of the MCU; the input end of the diode 2D27 is connected to the resistor R167, and the output end is connected to the pin 22 of the MCU; the input end of the diode 2D28 is connected to the resistor R170, and the output end is connected to the pin 23 of the MCU; the input end of the diode 2D29 is connected to the resistor R171, and the output end is connected to the pin 24 of the MCU; the input end of the diode 2D30 is connected to the resistor R172, and the output end is connected to the pin 20 of the MCU.

[0075] The second resistance adjustment unit includes an analog switch U2, a resistor R173, a resistor R174, a resistor R175, a resistor R176, a resistor R177, a resistor R57, a resistor R2, a resistor R5, a resistor R8, a resistor R11, a resistor R14, a resistor R17, a resistor R20, a resistor R23, a resistor R26, a resistor R29, a resistor R32, a resistor R35, a resistor R38, a resistor R41, a resistor R44, a diode 2D31, a diode 2D32, a diode 2D33, a diode 2D34 and a diode 2D35;

[0076] The pin 24 of the analog switch U2 is connected to the resistor R173, the resistor R174, the resistor R175, the resistor R176 and the resistor R177, the pins 9, 8, 7, 6, 5, 4, 3, 2, 23, 22, 21, 20, 19, 18, 17, 16 are respectively connected to the resistor R57, the resistor R2, the resistor R5, the resistor R8, the resistor R11, the resistor R14, the resistor R17, the resistor R20, the resistor R23, the resistor R26, the resistor R29, the resistor R32, the resistor R35, the resistor R38, the resistor R41, and the resistor R44, and the pin 1 is connected to the voltage regulation module;

[0077] The resistor R57, the resistor R2, the resistor R5, the resistor R8, the resistor R11, the resistor R14, the resistor R17, the resistor R20, the resistor R23, the resistor R26, the resistor R29, the resistor R32, the resistor R35, the resistor R38, the resistor R41 and the resistor R44 are all connected to the communication module;

[0078] The input end of the diode 2D31 is connected to the resistor R173, and the output end is connected to the pin 34 of the MCU; the input end of the diode 2D32 is connected to the resistor R174, and the output end is connected to the pin 35 of the MCU; the input end of the diode 2D33 is connected to the resistor R175, and the output end is connected to the pin 36 of the MCU; the input end of the diode 2D34 is connected to the resistor R176, and the output end is connected to the pin 37 of the MCU; the input end of the diode 2D35 is connected to the resistor R177, and the output end is connected to the pin 33 of the MCU.

[0079] The third resistance adjustment unit includes an analog switch U3, a resistor R178, a resistor R179, a resistor R182, a resistor R184, a resistor R185, a resistor R59, a resistor R3, a resistor R6, a resistor R9, a resistor R12, a resistor R15, a resistor R18, a resistor R21, a resistor R24, a resistor R27, a resistor R30, a resistor R33, a resistor R36, a resistor R39, a resistor R42, a resistor R45, a diode 2D36, a diode 2D37, a diode 2D38, a diode 2D39 and a diode 2D40; the model of the analog switch U1, the analog switch U2 and the analog switch U3 can be selected as 74HC4067;

[0080] Pin 24 of the analog switch U3 is connected to resistor R178, resistor R179, resistor R182, resistor R184 and resistor R185, pins 9, 8, 7, 6, 5, 4, 3, 2, 23, 22, 21, 20, 19, 18, 17 and 16 are respectively connected to resistor R59, resistor R3, resistor R6, resistor R9, resistor R12, resistor R15, resistor R18, resistor R21, resistor R24, resistor R27, resistor R30, resistor R33, resistor R36, resistor R39, resistor R42 and resistor R45, and pin 1 is connected to the voltage regulation module;

[0081] The resistor R59, the resistor R3, the resistor R6, the resistor R9, the resistor R12, the resistor R15, the resistor R18, the resistor R21, the resistor R24, the resistor R27, the resistor R30, the resistor R33, the resistor R36, the resistor R39, the resistor R42 and the resistor R45 are all connected to the communication module;

[0082] The input end of the diode 2D36 is connected to the resistor R178, and the output end is connected to the pin 2 of the MCU; the input end of the diode 2D37 is connected to the resistor R179, and the output end is connected to the pin 3 of the MCU; the input end of the diode 2D38 is connected to the resistor R182, and the output end is connected to the pin 4 of the MCU; the input end of the diode 2D39 is connected to the resistor R184, and the output end is connected to the pin 5 of the MCU; the input end of the diode 2D40 is connected to the resistor R185, and the output end is connected to the pin 1 of the MCU.

[0083] Working principle of the present invention:

[0084] According to the model of the communication IC of the protection board, the MCU first sets the final communication level of the HDQ (single bus) communication through pin 2 of the digital-to-analog conversion chip U13, sets the final communication level of the SCL communication line of the communication IC through pin 3, and sets the final communication level of the SDA communication line of the communication IC through pin 7.

[0085] The voltage output by the digital-to-analog conversion chip U13 acts on the voltage regulation module through the network numbers SCL_VSET, SDA_VSET, and HDQ_VSET. Under the PID regulation of the voltage regulation module, the output end of the operational amplifier controls the conduction degree of the MOS tube, and outputs the response voltage value with current driving capability at the corresponding network numbers VL_SCL, VL_SDA, and VL_HDQ. The output voltage proportional relationship is:

[0086] VL_SCL=SCL_VSET(1+R770 / R777);

[0087] VL_SDA=SDA_VSET(1+R793 / R798);

[0088] VL_HDQ=HDQ_VSET(1+R70 / R71);

[0089] The above three voltages act on pin 2 of the communication chip U5, communication chip U6 and communication chip U11 in the communication module respectively to determine the communication voltage with the communication IC, and act on pin 1 of the analog switch U1, analog switch U2 and analog switch U3 in the pull-up drive resistance adjustment module to determine the pull-up drive voltage of the pull-up resistor.

[0090] The MCU and the communication module communicate and interact through network numbers SCL_TM4, SDA_TM4, and HDQ_TM4. Under the control of the MCU, the pull-up drive resistance adjustment module selects the corresponding pull-up resistance value through the analog switch, and acts on the communication module through network numbers SCL_I N, SDA_I N, and HDQ_I N. The protection board to be tested communicates with the communication IC test system by connecting to the communication interface SCL_I N, SDA_I N, and HDQ_I N corresponding to the network number according to the communication type of the current communication IC. Under the control of the MCU, the level switching rising edge speed-up module acts on the communication module through network numbers SCL_TM4, SDA_TM4, and HDQ_TM4 to test the communication IC.

[0091] In summary, the advantages of the present invention are:

[0092] By setting the MCU, the digital-to-analog conversion module, the voltage regulation module, the communication module, the level switching rising edge acceleration module and the pull-up drive resistance adjustment module, the level switching rising edge acceleration module, the MCU, the digital-to-analog conversion module, the voltage regulation module and the communication module are connected in sequence, one end of the pull-up drive resistance adjustment module is connected to the MCU and the voltage regulation module, and the other end is connected to the communication module, and the level switching rising edge acceleration module is connected to the communication module; the digital-to-analog conversion module outputs a corresponding voltage value to the voltage regulation module based on the signal sent by the MCU, and the voltage regulation module outputs a voltage value of low current drive capability of the digital-to-analog conversion module , converted into a voltage value with high current driving capability for use by the communication module and the pull-up drive resistance adjustment module; the MCU enables the communication level switching rising edge acceleration of the communication IC of the protection board through the level switching rising edge acceleration module, configures the required pull-up resistance value through the pull-up drive resistance adjustment module, and connects the protection board through the communication module to test the communication IC of the protection board; that is, through the level switching rising edge acceleration module and the pull-up drive resistance adjustment module, different communication voltage requirements and pull-up resistor drive test requirements can be flexibly matched, thereby greatly improving the compatibility of the communication IC test of the lithium battery pack protection board.

[0093] Although the specific implementation modes of the present invention are described above, those skilled in the art should understand that the specific implementation modes described are only illustrative and are not intended to limit the scope of the present invention. Equivalent modifications and changes made by those skilled in the art in accordance with the spirit of the present invention should be included in the scope of protection of the claims of the present invention.

Claims

1. A lithium battery pack protection board communication IC test system, characterized in that: It includes an MCU, a digital-to-analog conversion module, a voltage regulation module, a communication module, a level switching rising edge acceleration module and a pull-up drive resistance adjustment module; The MCU is respectively connected to the digital-to-analog conversion module, the communication module, the level switching rising edge speed-up module and the pull-up drive resistance adjustment module; the voltage adjustment module is respectively connected to the digital-to-analog conversion module, the communication module and the pull-up drive resistance adjustment module; the communication module is respectively connected to the level switching rising edge speed-up module and the pull-up drive resistance adjustment module.

2. A lithium battery pack protection board communication IC test system as claimed in claim 1, characterized in that: The digital-to-analog conversion module includes a digital-to-analog conversion chip U13, a capacitor C64, a resistor R61, a resistor R715, a resistor R717, a resistor R722, a resistor R186 and a resistor R187; Pin 2 of the digital-to-analog conversion chip U13 is connected to resistor R717, pin 3 is connected to resistor R61, pin 5 is connected to resistors R186 and R187, pin 7 is connected to resistor R722, pin 12 is connected to pin 107 of the MCU, pin 13 is connected to pin 108 of the MCU, pin 14 is connected to pin 106 of the MCU, and pin 15 is connected to pin 109 of the MCU, resistor R715, and capacitor C464; The resistor R717 , the resistor R61 , and the resistor R722 are connected to the voltage regulating module.

3. A lithium battery pack protection board communication IC test system as claimed in claim 1, characterized in that: The voltage regulation module includes an operational amplifier U116A, an operational amplifier U116B, an operational amplifier U7A, a MOS tube Q1, a MOS tube Q71, a MOS tube Q74, a capacitor C9, a capacitor C10, a capacitor C11, a capacitor C14, a capacitor C15, a capacitor C16, a capacitor C60, a capacitor C61, a capacitor C62, a capacitor C63, a capacitor C74, a capacitor C75, a capacitor C495, a capacitor C496, a capacitor C497, a capacitor C498, a capacitor C502, and a capacitor C50 3. a resistor R49, a resistor R50, a resistor R67, a resistor R68, a resistor R69, a resistor R70, a resistor R71, a resistor R765, a resistor R770, a resistor R771, a resistor R773, a resistor R774, a resistor R777, a resistor R779, a resistor R784, a resistor R793, a resistor R794, a resistor R795, a resistor R797, a resistor R798, a resistor R801, a thermistor TR1, a thermistor TR2, and a thermistor TR3; Pin 1 of the operational amplifier U116A is connected to the resistor R774 and the capacitor C495, pin 2 is connected to the resistor R773 and the resistor R765, and pin 3 is connected to the resistor R779; the resistor R765 is connected to the capacitor C495; the resistor R773 is connected to the digital-to-analog conversion module; the capacitors C60, C62, C496 and C497 are connected in parallel, one end is connected to the thermistor TR1, the resistor R770 and the communication module, and the other end is connected to the resistor R777 and the capacitor C74; the resistor R770 is connected to the resistor R777, the resistor R779 and the capacitor C74; the G pole of the MOS tube Q71 is connected to the resistor R771 and the resistor R774, the D pole is connected to the thermistor TR1, and the S pole is connected to the resistor R771; Pin 7 of the operational amplifier U116B is connected to resistor R797 and capacitor C498, pin 6 is connected to resistor R784 and resistor R795, and pin 5 is connected to resistor R801; the resistor R784 is connected to capacitor C498; the resistor R795 is connected to the digital-to-analog conversion module; the capacitors C61, C63, C502 and C503 are connected in parallel, one end is connected to the thermistor TR2, resistor R793 and the communication module, and the other end is connected to resistor R798 and capacitor C75; the resistor R793 is connected to resistor R798, resistor R801 and capacitor C75; the G pole of the MOS tube Q74 is connected to resistor R794 and resistor R797, the D pole is connected to the thermistor TR2, and the S pole is connected to resistor R794; Pin 1 of the operational amplifier U7A is connected to resistor R68 and capacitor C9, pin 2 is connected to resistor R49 and resistor R67, and pin 3 is connected to resistor R50; the resistor R67 is connected to capacitor C9; the resistor R49 is connected to the digital-to-analog conversion module; the capacitors C11, C14, C15 and C16 are connected in parallel with one end connected to the thermistor TR3, resistor R70 and the communication module, and the other end connected to resistor R71 and capacitor C10; the resistor R70 is connected to resistor R50, resistor R71 and capacitor C10; the G pole of the MOS tube Q1 is connected to resistor R68 and resistor R69, the D pole is connected to the thermistor TR3, and the S pole is connected to resistor R69.

4. A lithium battery pack protection board communication IC test system as claimed in claim 1, characterized in that: The communication module includes a communication chip U5, a communication chip U6, a communication chip U11, a bidirectional diode D10, a bidirectional diode D11, a bidirectional diode D12, a resistor R66, a resistor R76, a resistor R77, a resistor R79, a resistor R81, a resistor R83, a resistor R164, a resistor R168, a resistor R169, a resistor R180, a resistor R181, and a resistor R182. 83, a resistor R738, a resistor R743, a resistor R750, a resistor R757, a capacitor C20, a capacitor C21, a capacitor C22, a capacitor C23, a capacitor C24, a capacitor C99, a capacitor C100, a capacitor C482, a capacitor C483, a capacitor C484, a capacitor C486, a capacitor C489, a capacitor C490, a capacitor C103 and a capacitor C104; Pin 2 of the communication chip U5 is connected to the voltage regulating module, pins 3, 4, 5, 6, 7, 8, 9, 10 are all connected to resistor R743, capacitor C483 and pin 2 of the bidirectional diode D11, pins 11, 12, 13, 14, 15, 16, 17, 18 are all connected to resistor R180 and capacitor C103, and pins 19 and 20 are all connected to resistor R738 and capacitor C482; pin 1 of the bidirectional diode D11 is connected to capacitor C484, resistor R743 and the pull-up drive resistance regulating module; the resistor R77 is connected to resistor R738; one end of the resistor R168 is connected to resistor R164 and capacitor C100, and the other end is connected to resistor R169, pin 82 of the MCU and the level switching rising edge speed-up module; Pin 2 of the communication chip U6 is connected to the voltage regulating module, pins 3, 4, 5, 6, 7, 8, 9, 10 are all connected to resistor R757, capacitor C490 and pin 2 of the bidirectional diode D12, pins 11, 12, 13, 14, 15, 16, 17, 18 are all connected to resistor R180 and capacitor C103, and pins 19 and 20 are all connected to resistor R770 and capacitor C486; pin 1 of the bidirectional diode D12 is connected to capacitor C489, resistor R757 and the pull-up drive resistance regulating module; one end of the resistor R181 is connected to resistor R180 and capacitor C104, and the other end is connected to resistor R183, pin 81 of the MCU and the level switching rising edge speed-up module; Pin 2 of the communication chip U11 is connected to the voltage regulation module, pins 3, 4, 5, 6, 7, 8, 9, and 10 are all connected to resistor R66, capacitor C21, and pin 2 of the bidirectional diode D10, pins 11, 12, 13, 14, 15, 16, 17, and 18 are all connected to resistor R79 and capacitor C23, and pins 19 and 20 are all connected to resistor R76 and capacitor C22; pin 1 of the bidirectional diode D10 is connected to capacitor C20, resistor R66, and a pull-up drive resistance adjustment module; one end of the resistor R81 is connected to resistor R79 and capacitor C24, and the other end is connected to resistor R83, pin 83 of the MCU, and a level switching rising edge speed-up module.

5. A lithium battery pack protection board communication IC test system as claimed in claim 1, characterized in that: The level switching rising edge speed-up module includes a bidirectional logic level conversion chip U15, a resistor R195, a resistor R203, a resistor R204, a resistor R205, a resistor R206, a resistor R207, a resistor R208, a resistor R270, a resistor R271, a resistor R272, a resistor R273 and a capacitor C144; Pin VL1 of the bidirectional logic level conversion chip U15 is connected to resistor R203, pin VL2 is connected to resistor R204, pin VL3 is connected to resistor R205, pin VL4 is connected to resistor R206, pin VCC1 is connected to resistor R270 and resistor R203, pin VCC2 is connected to resistor R272 and resistor R204, pin VCC3 is connected to resistor R271 and resistor R205, and pin VCC4 is connected to resistor R207; After the resistor R208 is connected in parallel with the capacitor C144, one end is connected to the resistor R273 and the pin THR-STA of the bidirectional logic level conversion chip U15, and the other end is grounded; The resistor R270 , the resistor R271 and the resistor R272 are all connected to the communication module; the resistor R195 is connected to the resistor R273 and the pin 95 of the MCU.

6. A lithium battery pack protection board communication IC test system as claimed in claim 1, characterized in that: The pull-up driving resistance adjustment module includes a first resistance adjustment unit, a second resistance adjustment unit and a third resistance adjustment unit; The first resistance adjustment unit, the second resistance adjustment unit and the third resistance adjustment unit are all connected to the MCU, the voltage adjustment module and the communication module.

7. A lithium battery pack protection board communication IC test system as claimed in claim 6, characterized in that: The first resistance adjustment unit includes an analog switch U1, a resistor R1, a resistor R4, a resistor R7, a resistor R10, a resistor R13, a resistor R16, a resistor R19, a resistor R22, a resistor R25, a resistor R28, a resistor R31, a resistor R34, a resistor R37, a resistor R40, a resistor R43, a resistor R54, a resistor R166, a resistor R167, a resistor R170, a resistor R171, a resistor R172, a diode 2D26, a diode 2D27, a diode 2D28, a diode 2D29 and a diode 2D30; Pin 24 of the analog switch U1 is connected to resistors R166, R167, R170, R171 and R172, pins 9, 8, 7, 6, 5, 4, 3, 2, 23, 22, 21, 20, 19, 18, 17 and 16 are respectively connected to resistors R54, R1, R4, R7, R10, R13, R16, R19, R22, R25, R28, R31, R34, R37, R40 and R43, and pin 1 is connected to a voltage regulation module; The resistor R54, the resistor R1, the resistor R4, the resistor R7, the resistor R10, the resistor R13, the resistor R16, the resistor R19, the resistor R22, the resistor R25, the resistor R28, the resistor R31, the resistor R34, the resistor R37, the resistor R40 and the resistor R43 are all connected to the communication module; The input end of the diode 2D26 is connected to the resistor R166, and the output end is connected to the pin 21 of the MCU; the input end of the diode 2D27 is connected to the resistor R167, and the output end is connected to the pin 22 of the MCU; the input end of the diode 2D28 is connected to the resistor R170, and the output end is connected to the pin 23 of the MCU; the input end of the diode 2D29 is connected to the resistor R171, and the output end is connected to the pin 24 of the MCU; the input end of the diode 2D30 is connected to the resistor R172, and the output end is connected to the pin 20 of the MCU.

8. A lithium battery pack protection board communication IC test system as claimed in claim 6, characterized in that: The second resistance adjustment unit includes an analog switch U2, a resistor R173, a resistor R174, a resistor R175, a resistor R176, a resistor R177, a resistor R57, a resistor R2, a resistor R5, a resistor R8, a resistor R11, a resistor R14, a resistor R17, a resistor R20, a resistor R23, a resistor R26, a resistor R29, a resistor R32, a resistor R35, a resistor R38, a resistor R41, a resistor R44, a diode 2D31, a diode 2D32, a diode 2D33, a diode 2D34 and a diode 2D35; The pin 24 of the analog switch U2 is connected to the resistor R173, the resistor R174, the resistor R175, the resistor R176 and the resistor R177, the pins 9, 8, 7, 6, 5, 4, 3, 2, 23, 22, 21, 20, 19, 18, 17, 16 are respectively connected to the resistor R57, the resistor R2, the resistor R5, the resistor R8, the resistor R11, the resistor R14, the resistor R17, the resistor R20, the resistor R23, the resistor R26, the resistor R29, the resistor R32, the resistor R35, the resistor R38, the resistor R41, and the resistor R44, and the pin 1 is connected to the voltage regulation module; The resistor R57, the resistor R2, the resistor R5, the resistor R8, the resistor R11, the resistor R14, the resistor R17, the resistor R20, the resistor R23, the resistor R26, the resistor R29, the resistor R32, the resistor R35, the resistor R38, the resistor R41 and the resistor R44 are all connected to the communication module; The input end of the diode 2D31 is connected to the resistor R173, and the output end is connected to the pin 34 of the MCU; the input end of the diode 2D32 is connected to the resistor R174, and the output end is connected to the pin 35 of the MCU; the input end of the diode 2D33 is connected to the resistor R175, and the output end is connected to the pin 36 of the MCU; the input end of the diode 2D34 is connected to the resistor R176, and the output end is connected to the pin 37 of the MCU; the input end of the diode 2D35 is connected to the resistor R177, and the output end is connected to the pin 33 of the MCU.

9. A lithium battery pack protection board communication IC test system as claimed in claim 6, characterized in that: The third resistance adjustment unit includes an analog switch U3, a resistor R178, a resistor R179, a resistor R182, a resistor R184, a resistor R185, a resistor R59, a resistor R3, a resistor R6, a resistor R9, a resistor R12, a resistor R15, a resistor R18, a resistor R21, a resistor R24, a resistor R27, a resistor R30, a resistor R33, a resistor R36, a resistor R39, a resistor R42, a resistor R45, a diode 2D36, a diode 2D37, a diode 2D38, a diode 2D39 and a diode 2D40; Pin 24 of the analog switch U3 is connected to resistor R178, resistor R179, resistor R182, resistor R184 and resistor R185, pins 9, 8, 7, 6, 5, 4, 3, 2, 23, 22, 21, 20, 19, 18, 17 and 16 are respectively connected to resistor R59, resistor R3, resistor R6, resistor R9, resistor R12, resistor R15, resistor R18, resistor R21, resistor R24, resistor R27, resistor R30, resistor R33, resistor R36, resistor R39, resistor R42 and resistor R45, and pin 1 is connected to the voltage regulation module; The resistor R59, the resistor R3, the resistor R6, the resistor R9, the resistor R12, the resistor R15, the resistor R18, the resistor R21, the resistor R24, the resistor R27, the resistor R30, the resistor R33, the resistor R36, the resistor R39, the resistor R42 and the resistor R45 are all connected to the communication module; The input end of the diode 2D36 is connected to the resistor R178, and the output end is connected to the pin 2 of the MCU; the input end of the diode 2D37 is connected to the resistor R179, and the output end is connected to the pin 3 of the MCU; the input end of the diode 2D38 is connected to the resistor R182, and the output end is connected to the pin 4 of the MCU; the input end of the diode 2D39 is connected to the resistor R184, and the output end is connected to the pin 5 of the MCU; the input end of the diode 2D40 is connected to the resistor R185, and the output end is connected to the pin 1 of the MCU.

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