A method of processing a free-space isolator

Abstract

The application relates to the technical field of optical device processing, in particular to a processing method of a free-space isolator. The processing method comprises the following steps: providing a substrate and a magnetic plate; bonding and fixing the substrate and the magnetic plate through glue to form a base structure; processing the edges of the base structure to be flush; processing the base structure into a plurality of bases, each base comprising a base plate and a magnetic block fixedly attached to the base plate, at least one channel being formed on the magnetic block; mounting at least one isolator core on each channel of the base; and assembling each base with a corresponding isolator core to form a free-space isolator. The processing method is performed on the base structure as a whole, the substrate serves as a substrate, the magnetic block is not prone to breaking or cracking when being processed or used, and the process problems of misalignment of the base plate and the magnetic block of a single free-space isolator or overflow of the glue are eliminated, so that the processing process difficulty is reduced.

Description

Technical Field

[0001] This invention relates to the field of optical device fabrication technology, and in particular to a method for fabricating a free-space isolator. Background Technology

[0002] A free space isolator is a passive optical device widely used in optical communication and laser fields. Its function is to ensure unidirectional transmission of optical signals and prevent reflected light from interfering with the system.

[0003] Free space isolators can be mainly divided into circular free space isolators and surface mount free space isolators according to their assembly method. Surface mount free space isolators are widely used because they are easy to manufacture into multi-channel arrays such as 2-channel, 3-channel, 4-channel, 8-channel, etc.

[0004] Due to space constraints in product installation, surface-mount free-space isolators require minimal size, necessitating small and thin magnetic blocks. However, thin magnetic blocks are prone to breakage or fracture during processing or use. Furthermore, in some specialized applications, the bottom surface of the magnetic block must be bonded to a substrate to achieve insulation, better adhesion, and matching of expansion coefficients. However, when assembling individual free-space isolators, misalignment or glue overflow can easily occur when bonding the magnetic block to the substrate with adhesive, making quality control difficult and increasing the complexity of the manufacturing process. Summary of the Invention

[0005] The technical problem to be solved by the embodiments of the present invention is to provide a processing method for a free space isolator, so as to solve the problems that the magnetic block is prone to breakage, misalignment between the magnetic block and the substrate or glue overflow during the processing of a single free space isolator in the prior art, and the high difficulty of the processing technology.

[0006] This invention discloses a method for manufacturing a free-space isolator, the method comprising:

[0007] Provide substrate and magnetic plate;

[0008] The substrate and the magnetic plate are bonded and fixed together with adhesive to form a base structure;

[0009] The edges of the base structure are machined to be flush;

[0010] The base structure is processed into multiple bases, each base including a base and a magnetic block that is attached and fixed to the base, and at least one channel is formed on the magnetic block;

[0011] At least one isolator core is installed on each channel of the base, and each base and the corresponding isolator core are assembled to form a free space isolator.

[0012] Optionally, the bases may have the same or different shapes.

[0013] Optionally, the step of bonding and fixing the substrate and the magnetic plate with adhesive to form a base structure includes:

[0014] Apply adhesive to one end face of the substrate, and then laminate the magnetic plate onto the adhesive-coated end face of the substrate.

[0015] Apply pressure toward the substrate to the magnetic plate;

[0016] The substrate and the magnetic plate are placed in a vacuum environment and evacuated.

[0017] The adhesive between the substrate and the magnetic plate is cured to form a base structure.

[0018] Optionally, the step of applying adhesive to one end face of the substrate includes:

[0019] Adhesive is applied at multiple locations on one end face of the substrate, and each location is coated with adhesive to form a strip-shaped adhesive layer.

[0020] Optionally, the adhesive between the substrate and the magnetic plate can be cured by heating.

[0021] Optionally, the step of processing the base structure into multiple bases includes:

[0022] Multiple grooves are machined on the magnetic plate of the base structure on one end face away from the substrate, and the multiple grooves are all arranged along a first direction;

[0023] The base structure is cut along a first direction and a second direction to divide the base structure into multiple bases. The same channel is cut into multiple identical channels, wherein the first direction and the second direction are perpendicular to each other.

[0024] Optionally, the multiple channels may have the same or different shapes.

[0025] Optionally, the step of installing the isolator core on each channel of the base includes:

[0026] Apply adhesive to the bottom end face of each channel of the base;

[0027] At least one isolator core is attached to the bottom end face of the channel that has been glued;

[0028] The adhesive between the isolator core and the bottom end face of the channel is cured.

[0029] Optionally, the adhesive between the isolator core and the bottom end face of the channel can be cured by heating.

[0030] Optionally, the substrate is made of ceramic, glass, alumina silicon, or aluminum nitride, and / or the magnetic plate is made of samarium cobalt, neodymium iron boron, or alnico magnet.

[0031] Compared with the prior art, the beneficial effects of the free space isolator processing method provided in this embodiment of the invention are as follows: by first bonding and fixing the substrate and the magnetic plate with glue to form a whole, forming a base structure, and then processing the edges of the base structure to be flush, the processed base structure is processed into multiple bases, each base including a base and a magnetic block that is attached and fixed to the base. Since the substrate serves as a substrate, the magnetic block is not easily broken or fractured during processing or use. Furthermore, by installing an isolator core on the channel of the magnetic block, each base can be assembled with the corresponding isolator core to form a free space isolator. Since the base of each free space isolator is processed based on the base structure formed after the substrate and the magnetic plate are fixed, there is no process problem of misalignment of the base and the magnetic block or glue overflow of a single free space isolator, thus reducing the difficulty of the processing process. Attached Figure Description

[0032] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. In the accompanying drawings:

[0033] Figure 1 This is a schematic flowchart of the processing method of the free space isolator provided in an embodiment of the present invention;

[0034] Figure 2 This is a schematic diagram of the process of forming a base structure from a substrate and a magnetic plate according to an embodiment of the present invention;

[0035] Figure 3 This is a schematic diagram of the process of processing a base structure into multiple bases according to an embodiment of the present invention;

[0036] Figure 4 This is a schematic diagram of the process of installing the isolator core on the base according to an embodiment of the present invention;

[0037] Figure 5 This is a schematic diagram of the structure of the substrate and the magnetic plate before bonding, provided in an embodiment of the present invention;

[0038] Figure 6 This is a schematic diagram of the base structure formed by bonding and fixing the substrate and the magnetic plate according to an embodiment of the present invention;

[0039] Figure 7This is a schematic diagram of the structure of the base structure provided in the embodiment of the present invention, which is processed to form multiple bases;

[0040] Figure 8 This is a schematic diagram of the structure of a base provided in an embodiment of the present invention;

[0041] Figure 9 yes Figure 8 A schematic diagram of the structure on which the isolator core is installed on the base shown.

[0042] The labels for the attached figures are as follows:

[0043] 110, substrate; 120, magnetic plate; 130, base structure; 130a, channel; 131, base; 1311, substrate; 1312, magnetic block; 1312a, channel; 140, isolator core. Detailed Implementation

[0044] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0045] This invention provides a method for fabricating a free-space isolator, such as... Figure 1 , Figures 5 to 9 As shown, the fabrication method of the free space isolator includes:

[0046] S101, Provide a substrate 110 and a magnetic plate 120;

[0047] S102. The substrate 110 and the magnetic plate 120 are bonded and fixed with glue to form the base structure 130.

[0048] S103. Make the edges of the base structure 130 flush;

[0049] S104. The base structure 130 is processed into multiple bases 131. Each base 131 includes a base 1311 and a magnetic block 1312 that is attached and fixed to the base 1311. At least one channel 1312a is formed on the magnetic block 1312.

[0050] S105. At least one isolator core 140 is installed on each channel 1312a of the base 131, and each base 131 and the corresponding isolator core 140 are assembled to form a free space isolator.

[0051] In this embodiment of the invention, the substrate 110 and the magnetic plate 120 are first bonded together with adhesive to form a base structure 130. The edges of the base structure 130 are then machined to be flush, and the flush-machined base structure 130 is processed into multiple bases 131. Each base 131 includes a base 1311 and a magnetic block 1312 that is attached and fixed to the base 1311. Because the substrate 110 serves as a substrate, the magnetic block 1312 is less likely to break or fracture during processing or use. In one step, by installing isolator core 140 on the channel 1312a of magnetic block 1312, each base 131 can be assembled with the corresponding isolator core 140 to form a free space isolator. Since the base 131 of each free space isolator is processed as a whole based on the base structure 130 formed after the substrate 110 and magnetic plate 120 are fixed, there is no process problem of misalignment of the base 1311 and magnetic block 1312 or glue overflow of a single free space isolator, which reduces the difficulty of the processing process.

[0052] The channel on the magnetic block 1312 is a mounting channel for placing and installing the isolator core 140, and its specific shape is not limited.

[0053] After the substrate 110 and the magnetic plate 120 are bonded and fixed with adhesive, there is a slight misalignment and adhesive overflow between the substrate 110 and the magnetic plate 120. To smooth the edges of the base structure 130, the overflowing adhesive and misalignment can be removed by scraping. Scraping is a common processing method. Scraping refers to using a scraper or similar tool to scrape away excess material or uneven surfaces such as adhesive and misaligned protrusions along the edges of the base structure 130 to make the edges smooth.

[0054] By making the edges of the base structure 130 flush, it can be ensured that the edges of each base 131 after subsequent processing and cutting are flat, eliminating the need for additional scraping of individual bases 131 and reducing the difficulty of the processing technology.

[0055] Multiple bases 131 may have the same or different shapes. When multiple bases 131 have the same shape, such as multiple bases having the same shape for both the base and the magnetic block, and the magnetic block having the same number of channels, they can be further assembled into multiple identical free-space isolators. When multiple bases 131 have different shapes, they can be further assembled into multiple different free-space isolators, such as free-space isolators with different numbers of channels 1312a.

[0056] In optional embodiments of this application, the substrate 110 is made of ceramic, glass, alumina silicon, or aluminum nitride. For example, the substrate 110 is made of ceramic. Ceramic materials typically possess excellent thermal stability, maintaining stable performance at high temperatures; they also have high hardness and excellent mechanical properties, capable of withstanding certain pressure and impact. The assembled free-space isolator exhibits high durability and stability. Furthermore, ceramics typically have a low coefficient of thermal expansion, resulting in high dimensional stability and maintaining device stability under temperature variations.

[0057] In optional embodiments of this application, the magnetic plate 120 is made of samarium cobalt, neodymium iron boron, or alnico magnet. For example, the magnetic plate 120 is made of samarium cobalt. Samarium cobalt possesses excellent magnetic properties, exhibiting high magnetization and magnetic saturation induction, providing a strong magnetic field that facilitates good optical isolation; it also has low hysteresis loss, reducing energy loss and improving the efficiency of the fabricated free-space isolator; and it has high magnetic stability, maintaining stable magnetic properties over a wide temperature range, which helps maintain the performance stability of the free-space isolator.

[0058] In an optional embodiment of this application, reference is made to Figure 2 The step of bonding and fixing the substrate 110 and the magnetic plate 120 with adhesive to form the base structure 130 includes:

[0059] S201. Apply adhesive to one end face of substrate 110 and laminate magnetic plate 120 onto the adhesive-applied end face of substrate 110.

[0060] S202, Apply pressure toward the substrate 110 to the magnetic plate 120;

[0061] S203. Place the substrate 110 and the magnetic plate 120 in a vacuum environment and perform vacuuming.

[0062] S204. The adhesive between the substrate 110 and the magnetic plate 120 is cured to form the base structure 130.

[0063] By laminating the magnetic plate 120 onto the adhesive-coated end face of the substrate 110, the contact area between the substrate 110 and the magnetic plate 120 can be increased. This allows for the fabrication of a base structure 130 with a larger area, enabling the assembly of more free-space isolators. After the magnetic plate 120 is attached to the adhesive-coated end face of the substrate 110, applying pressure towards the substrate 110 to the magnetic plate 120 causes the adhesive between the substrate 110 and the magnetic plate 120 to spread horizontally and evenly. Vacuuming the substrate 110 and the magnetic plate 120 in a vacuum environment removes air bubbles from the adhesive, increasing the adhesive density between the substrate 110 and the magnetic plate 120 and thus increasing the bonding strength between them. After the adhesive cures, the substrate 110 and the magnetic plate 120 are bonded and fixed to form a whole, forming a base structure 130. Subsequently, multiple free space isolators are formed by processing and assembling based on the base structure 130.

[0064] Optionally, a weight is placed above the magnetic plate 120. Due to gravity, the magnetic plate 120 is subjected to pressure toward the substrate 110, causing the magnetic plate 120 to fit tightly against the substrate 110.

[0065] In an optional embodiment of this application, the step of applying adhesive to one end face of the substrate 110 includes:

[0066] Adhesive is applied at multiple locations on one end face of substrate 110, and an adhesive layer is formed at each location.

[0067] By applying adhesive at multiple locations on one end face of the substrate 110 and forming a strip of adhesive layer, the coverage area of ​​the adhesive on the substrate 110 can be increased. When the magnetic plate 120 is pressed against the substrate 110, the adhesive can be squeezed out and spread out, thus forming a whole, increasing the coverage area of ​​the adhesive between the substrate 110 and the magnetic plate 120, and increasing the adhesion between the two.

[0068] Optionally, the adhesive between the substrate 110 and the magnetic plate 120 can be cured by heating. Heating can accelerate the curing process of the adhesive, allowing it to reach the required strength in a shorter time, which can save time and improve production efficiency. It can also change the viscosity of the adhesive, promoting its flow and penetration, and improving the bonding effect. The effect of bonding the substrate 110 and the magnetic plate 120 together with adhesive to form the base structure 130 is shown in the figure below. Figure 6 As shown.

[0069] In optional embodiments of this application, reference is made to Figure 3 The steps of processing the base structure 130 into multiple bases 131 include:

[0070] S301. Multiple channels 130a are processed on one end face of the magnetic plate 120 of the base structure 130 facing away from the substrate 110, and the multiple channels 130a are all arranged along the first direction.

[0071] S302. The base structure 130 is cut along the second direction to cut the base structure 130 into multiple bases 131. The same channel 130a is cut into multiple identical channels 1312a, wherein the first direction and the second direction are perpendicular to each other.

[0072] By uniformly machining grooves 130a on the magnetic plate 120 of the base structure 130, and then cutting the base structure 130 along the first and second directions to cut it into multiple bases 131, the effect is shown in the figure. Figure 7 As shown. A schematic diagram of a base 131 with four channels 1312a as an example is shown below. Figure 8 As shown. Since the channels 130a are uniformly processed on the magnetic plate 120, with the substrate 110 as a base, the magnetic blocks 1312 are less prone to breakage and fracture during processing. Furthermore, since the base 131 of each free-space isolator is formed by cutting from the base structure 130, there are no process problems such as misalignment of the base 1311 and magnetic blocks 1312 of individual free-space isolators or glue overflow, reducing the difficulty of the processing. The first direction is as follows... Figure 7 The X-axis direction is shown, and the second direction is as follows: Figure 7 The Y-axis direction is shown.

[0073] Multiple slots 130a are machined on the magnetic plate 120 of the base structure 130 on one end face away from the substrate 110. This can be done by mechanical processing methods such as wire cutting, grinding, and milling. The entire base structure 130 serves as the basis for machining the slots 130a. Compared to machining the channel 1312a for placing the isolator core 140 on a single magnetic block 1312, the machining operation is easier to control and the machining process is less difficult.

[0074] Furthermore, the multiple channels 130a may have the same or different shapes. Channels 130a of different shapes can be processed on the substrate 110, thereby processing bases 131 of different sizes and shapes, and assembling free space isolators of different sizes and shapes, such as single-channel 1312a, dual-channel 1312a, triple-channel 1312a and other multi-channel 1312a free space optical isolators, or single-level, dual-level, triple-level or triple-level free space optical isolators, which have high applicability.

[0075] When machining the channels 130a on the magnetic plate 120, channels 130a of different shapes and the number of channels 130a of the same shape can be machined according to the required free space isolators. During the cutting of the base structure 130 along the first and second directions, the base 131 of the required free space isolator can be cut at different positions on the base structure 130, thereby obtaining bases 131 of the same or different shapes, and then assembling them to obtain free space isolators of the same or different shapes. When installing the isolator core 140, one or more isolator cores 140 can be installed on the same channel 1312a according to the requirements of the optical isolation level, to assemble free space isolators with different optical isolation levels.

[0076] In an optional embodiment of this application, reference is made to Figure 4 The step of installing the isolator core 140 on each channel 1312a of the base 131 includes:

[0077] S401, Apply adhesive to the bottom end face of each channel 1312a of the base 131;

[0078] S402, attach the isolator core 140 to the bottom end face of the channel 1312a that has been glued;

[0079] S403. The adhesive between the isolator core 140 and the bottom end face of the channel 1312a is cured.

[0080] Attaching the isolator core 140 to the bottom end face of channel 1312a in the base 131 using adhesive provides good structural stability, ensuring that the isolator core 140 will not loosen or shift during use. This helps maintain the stability and performance of the free-space isolator. The method of fixing the isolator core 140 with adhesive is also simpler and easier to operate. Only an appropriate amount of adhesive and simple fixing steps are needed to complete the fixing process, resulting in lower costs. An example of a free-space isolator with the isolator core 140 installed in a base 131 with four channels 1312a is shown in the image below. Figure 9 As shown.

[0081] Optionally, the adhesive between the isolator core 140 and the bottom end face of the channel 1312a can be cured by heating. Heating can accelerate the curing process of the adhesive, allowing it to reach the required strength in a shorter time, which can save time and improve production efficiency. It can also change the viscosity of the adhesive, promoting its flow and penetration, and improving the bonding effect.

[0082] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit them. Those skilled in the art can modify the technical solutions described in the above embodiments, or make equivalent substitutions for some of the technical features; and all such modifications and substitutions should fall within the protection scope of the appended claims of the present invention.

Claims

1. A method for manufacturing a free-space isolator, characterized in that, The processing method of the free space isolator includes: Provide substrate and magnetic plate; The substrate and the magnetic plate are bonded and fixed together with adhesive to form a base structure; The edges of the base structure are machined to be flush; The base structure is processed into multiple bases, each base including a base and a magnetic block that is attached and fixed to the base, and at least one channel is formed on the magnetic block; At least one isolator core is installed on each channel of the base, and each base and the corresponding isolator core are assembled to form a free space isolator; The step of bonding and fixing the substrate and the magnetic plate with adhesive to form a base structure includes: Apply adhesive to one end face of the substrate, and then laminate the magnetic plate onto the adhesive-coated end face of the substrate. Apply pressure toward the substrate to the magnetic plate; The substrate and the magnetic plate are placed in a vacuum environment and evacuated. The adhesive between the substrate and the magnetic plate is cured to form a base structure; The step of applying adhesive to one end face of the substrate includes: Adhesive is applied at multiple locations on one end face of the substrate, and adhesive is applied at each location to form a strip-shaped adhesive layer. The step of processing the base structure into multiple bases includes: Multiple grooves are machined on the magnetic plate of the base structure on one end face away from the substrate, and the multiple grooves are all arranged along a first direction; The base structure is cut along a first direction and a second direction to divide the base structure into multiple bases. The same channel is cut into multiple identical channels, wherein the first direction and the second direction are perpendicular to each other.

2. The processing method of the free space isolator according to claim 1, characterized in that, The multiple bases may have the same or different shapes.

3. The processing method of the free space isolator according to claim 2, characterized in that, The adhesive between the substrate and the magnetic plate is cured by heating.

4. The processing method of the free space isolator according to claim 1, characterized in that, The multiple channels may have the same or different shapes.

5. The processing method of the free space isolator according to claim 1, characterized in that, The step of installing the isolator core on each channel of the base includes: Apply adhesive to the bottom end face of each channel of the base; At least one isolator core is attached to the bottom end face of the channel that has been glued; The adhesive between the isolator core and the bottom end face of the channel is cured.

6. The processing method of the free space isolator according to claim 5, characterized in that, The adhesive between the isolator core and the bottom end face of the channel is cured by heating.

7. The method for manufacturing a free-space isolator according to any one of claims 1-6, characterized in that, The substrate is made of ceramic, glass, silicon alumina or aluminum nitride, and / or the magnetic plate is made of samarium cobalt, neodymium iron boron or aluminum nickel cobalt magnet.

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