A dynamic heat dissipation regulation method, device, equipment and medium

Abstract

The application discloses a dynamic heat dissipation regulation method, device, equipment and medium, and belongs to the technical field of heat dissipation. The method comprises the following steps: determining a first pulse width modulation signal duty cycle value of a first fan according to a temperature value of each device in a first device set and a corresponding heat dissipation curve; determining a first pulse width modulation signal duty cycle change difference value of the first fan according to the type and quantity of a second device set; determining a target pulse width modulation signal duty cycle value of the first fan according to the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference value; and setting the rotating speed of the first fan through the target pulse width modulation signal duty cycle value, so as to dynamically regulate and control the heat dissipation of a system in a partitioned manner. The application can avoid over-temperature of PCIE devices, affect the performance of a server, reduce the power consumption of a fan, and solve the problem of high noise of a server.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a dynamic heat dissipation control method, device, equipment and medium. Background Technology

[0002] Currently, heat dissipation is a common problem in server operation. For some models with multiple PCIe devices, some PCIe devices (such as network cards and RAID cards) lack temperature sensors during server operation, and some network cards' optical modules do not support temperature reading. When there are devices whose temperatures cannot be obtained, or when many devices with abnormal temperatures are inserted into an adapter card, PCIe devices are prone to overheating. If this is not detected in time, it will affect the performance of these devices and the server's operating efficiency. Generally, adjusting the ambient temperature sensor can increase the overall base fan speed; however, increasing the overall base fan speed will result in high server power consumption and loud fan noise, which can easily lead to customer complaints. Summary of the Invention

[0003] To overcome the aforementioned technical deficiencies, the purpose of this application is to provide a dynamic heat dissipation control method, apparatus, device, and medium. The method includes: acquiring the location information and temperature information of a plurality of devices to be cooled; adding devices to be cooled that are in place and whose temperature information can be acquired to a first device set; adding devices to be cooled that are in place but whose temperature information cannot be acquired to a second device set; determining a first pulse width modulation (PWM) signal duty cycle value of a first fan based on the temperature value and corresponding heat dissipation curve of each device in the first device set; determining a difference in the PWM signal duty cycle variation of the first fan based on the type and quantity of the second device set; determining a target PWM signal duty cycle value of the first fan based on the first PWM signal duty cycle value and the difference in the PWM signal duty cycle variation; and setting the speed of the first fan using the target PWM signal duty cycle value to dynamically control the system's heat dissipation in zones. This application can prevent PCIe devices from overheating and affecting server performance, while also reducing fan power consumption and solving the problem of high server noise.

[0004] The specific technical solutions provided in this application are as follows:

[0005] In a first aspect, this application provides a dynamic heat dissipation control method, which is applied to a dynamic heat dissipation control system. The system includes a plurality of devices to be cooled, an expansion card, and a target fan corresponding to the expansion card. The plurality of devices to be cooled are connected to the expansion card, and the target fan includes a first fan. The method includes:

[0006] Obtain the location information and temperature information of the plurality of devices to be cooled;

[0007] Add the devices that are in place and can obtain temperature information to the first device set;

[0008] Add the devices that need to be cooled but whose temperature information cannot be obtained to the second device set;

[0009] The duty cycle value of the first pulse width modulation signal of the first fan is determined based on the temperature value of each device in the first device set and the corresponding heat dissipation curve.

[0010] The first pulse width modulation signal duty cycle change difference of the first fan is determined according to the type and quantity of the second device set; the target pulse width modulation signal duty cycle value of the first fan is determined according to the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference.

[0011] The speed of the first fan is set by the duty cycle value of the target pulse width modulation signal in order to dynamically control the heat dissipation of the system in zones.

[0012] In one embodiment, determining the duty cycle value of the first pulse width modulation signal of the first fan based on the temperature value of each device in the first device set and the corresponding heat dissipation curve includes:

[0013] The duty cycle value of the pulse width modulation signal of the first fan is determined based on the temperature value of each device in the first device set and the heat dissipation curve of the corresponding device.

[0014] The maximum value among the duty cycle values ​​of the pulse width modulation signal corresponding to the first fan of several devices is set as the duty cycle value of the first pulse width modulation signal.

[0015] In one embodiment, the target fan includes a second fan adjacent to the first fan, and the step of determining the difference in the duty cycle change of the first pulse width modulation signal of the first fan based on the type and quantity of the second device set includes:

[0016] Obtain the type and quantity of the second device set;

[0017] When the number of the second device set is a first preset value, the first fan speed duty cycle difference is set as a first threshold, and the first fan pulse width modulation signal duty cycle change difference is calculated based on the first threshold.

[0018] When the number of the second device set is greater than or equal to the second preset value, the first fan speed duty cycle difference is set as the second threshold, and the duty cycle change difference of the first fan pulse width modulation signal is calculated based on the second threshold; the second fan speed duty cycle difference is set as the first threshold, and the duty cycle change difference of the second fan pulse width modulation signal is calculated based on the first threshold.

[0019] When the number of second device sets on each expansion board is greater than or equal to the second preset value, the duty cycle variation difference of the first pulse width modulation signal of the first fan is determined according to the type of the second device set.

[0020] In one embodiment, determining the duty cycle variation difference of the first pulse width modulation signal of the first fan according to the type of the second device set includes:

[0021] When the second device set type includes network card and disk array card, the duty cycle change difference of the pulse width modulation signal of the first fan corresponding to the disk array card is calculated based on the duty cycle difference of the speed of the first fan corresponding to the disk array card, and the duty cycle change difference of the pulse width modulation signal of the first fan corresponding to the disk array card is set as the duty cycle change difference of the first pulse width modulation signal.

[0022] When one of the devices in the second set of devices includes several models, the maximum speed duty cycle difference of the first fan corresponding to the device model is set as the first speed duty cycle difference, and the first pulse width modulation signal duty cycle difference of the first fan is calculated based on the first speed duty cycle difference.

[0023] In one embodiment, determining the target pulse width modulation signal duty cycle value of the first fan based on the first pulse width modulation signal duty cycle value and the difference in the first pulse width modulation signal duty cycle includes:

[0024] Obtain the duty cycle value of the first pulse width modulation signal and the difference in the duty cycle change of the first pulse width modulation signal;

[0025] The sum of the duty cycle value of the first pulse width modulation signal and the difference in the duty cycle change of the first pulse width modulation signal is taken as the target pulse width modulation signal duty cycle value of the first fan.

[0026] In one embodiment, determining the pulse width modulation signal duty cycle value of the first fan based on the temperature value of each device in the first device set and the heat dissipation curve of the corresponding device includes:

[0027] Obtain the temperature value T(K) of one device K in the first device set at time K, the temperature value T(K-1) of device K-1 at time K-2, and the temperature value T(K-2) of device K-2 at time K-3.

[0028] Obtain the pulse width modulation signal duty cycle value of the first fan of one of the devices in the first device set at time K-1. Preset values: Tref, p-factor Kp, i-factor Ki, d-factor Kd;

[0029] Based on the formula for the first heat dissipation curve: Calculate the duty cycle value FS(K) of the pulse width modulation signal of the first fan;

[0030] The step of determining the pulse width modulation signal duty cycle value of the first fan based on the temperature value of each device in the first device set and the heat dissipation curve of the corresponding device further includes:

[0031] Obtain the duty cycle value of the first fan pulse width modulation signal and the temperature value of one of the devices in the first device set;

[0032] The linear control rate a is determined based on the duty cycle value of the first fan pulse width modulation signal and the corresponding temperature value of the equipment;

[0033] Obtain the current temperature value X of one of the devices in the first device set;

[0034] The duty cycle value Y of the pulse width modulation signal of the first fan is calculated using the second heat dissipation curve formula: Y = aX.

[0035] In one embodiment, the system further includes a temperature control device, and the method includes:

[0036] When the dynamic control of the system's heat dissipation zones fails, the weighting ratio of the duty cycle value of the pulse width modulation signal of the corresponding fan of each temperature control device is determined by the temperature of each temperature control device and the heat dissipation curve of the corresponding temperature control device.

[0037] By gradually increasing the weighting ratio of the duty cycle value of the corresponding fan pulse width modulation signal for all expansion cards, the system's heat dissipation is dynamically controlled.

[0038] Secondly, this application also provides a dynamic heat dissipation control device, the device comprising:

[0039] The acquisition module is used to acquire the location information and temperature information of the plurality of devices to be cooled.

[0040] The configuration module is used to add the devices to be cooled that are in place and can obtain temperature information to the first device set;

[0041] Add the devices that need to be cooled but whose temperature information cannot be obtained to the second device set;

[0042] The first determining module is used to determine the duty cycle value of the first pulse width modulation signal of the first fan based on the temperature value of each device in the first device set and the corresponding heat dissipation curve.

[0043] The second determining module is used to determine the difference in the duty cycle change of the first pulse width modulation signal of the first fan according to the type and quantity of the second device set; and to determine the target pulse width modulation signal duty cycle value of the first fan according to the duty cycle value of the first pulse width modulation signal and the difference in the duty cycle change of the first pulse width modulation signal.

[0044] The control module is used to set the speed of the first fan by the duty cycle value of the target pulse width modulation signal, so as to dynamically control the heat dissipation of the system by zone.

[0045] Thirdly, a dynamic heat dissipation control device is also provided, including:

[0046] One or more processors;

[0047] Storage device for storing one or more programs;

[0048] When the one or more programs are executed by the one or more processors, the one or more processors implement the dynamic heat dissipation control method as described in any of the first aspects.

[0049] Fourthly, this application also provides a computer device, the device comprising:

[0050] A memory, a processor, and a computer program stored in the memory, wherein the processor executes the computer program to implement the steps of the dynamic heat dissipation control method as described in any of the first aspects.

[0051] Fifthly, this application also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the dynamic heat dissipation control method described in any of the first aspects.

[0052] Sixthly, this application also provides a computer storage medium, the medium comprising:

[0053] It stores a computer program that, when executed by a processor, implements the steps of the dynamic heat dissipation control method described in any of the first aspects.

[0054] Compared with the prior art, the method of the technical solution provided in this application includes: acquiring the location information and temperature information of the plurality of devices to be cooled; adding the devices to be cooled that are in place and can acquire temperature information to a first device set; adding the devices to be cooled that are in place but cannot acquire temperature information to a second device set; determining the first pulse width modulation signal duty cycle value of the first fan based on the temperature value and corresponding heat dissipation curve of each device in the first device set; determining the difference in the change of the first pulse width modulation signal duty cycle of the first fan based on the type and quantity of the second device set; determining the target pulse width modulation signal duty cycle value of the first fan based on the first pulse width modulation signal duty cycle value and the difference in the change of the first pulse width modulation signal duty cycle; and setting the speed of the first fan through the target pulse width modulation signal duty cycle value to dynamically control the system heat dissipation in zones. This application can optimize the heat dissipation requirements of PCIe devices that do not support temperature acquisition or have abnormal temperatures; avoid overheating of devices that are in place and have no-reading temperatures, affecting device and server performance; compared with the previous method of increasing the base speed by modifying the heat dissipation curve of the ambient temperature sensor, this method can reduce fan power consumption and solve the problem of high server noise.

[0055] The technical solution provided in this application embodiment is based on BMC to dynamically control the heat dissipation of PCIe devices with abnormal temperatures. It can increase the fan speed corresponding to the location of different devices according to their different types, locations, quantities, and models, so as to ensure the performance of PCIe devices and servers while reducing noise and power consumption. Attached Figure Description

[0056] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0057] Figure 1 This is a first flowchart of the dynamic heat dissipation control method provided in Embodiment 1 of this application;

[0058] Figure 2 This is a second flowchart of the dynamic heat dissipation control method provided in Embodiment 2 of this application;

[0059] Figure 3 This is a detailed flowchart of the dynamic heat dissipation control provided in Embodiment 2 of this application;

[0060] Figure 4 This is a structural diagram of the dynamic heat dissipation control device provided in Embodiment 3 of this application;

[0061] Figure 5This is an exemplary system provided for Embodiment Seven of this application, which can be used to implement the various embodiments described in this application. Detailed Implementation

[0062] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0063] It should be noted that, unless the context explicitly requires it, the words "comprising," "including," and similar terms in the entire specification and claims should be interpreted as encompassing rather than being exclusive or exhaustive; that is, meaning "including but not limited to."

[0064] Furthermore, in the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0065] The related technology can adjust the heat dissipation zone by configuring fan speed weights based on the heat dissipation curves of different device sensors. As shown in Table 1, for CPU heat dissipation adjustment, when the CPU0 heat dissipation curve is adjusted, the fan speed weights of fan0 and fan1 in its corresponding area are 1 (100%). The fan speed weights of fan2 and fan3 corresponding to CPU1 are 0.8. The CPU1 heat dissipation adjustment is the opposite. However, the heat dissipation adjustment of no-reading PCIe device sensors does not participate in heat dissipation adjustment because there is no temperature. Instead, the base speed of all fans is increased to prevent overheating.

[0066] Fan0 Fan1 Fan2 Fan3 CPU0 1 1 0.8 0.8 CPU1 0.8 0.8 1 1 PCIe devices 1 1 1 1

[0067] Table 1

[0068] Existing heat dissipation zoning control can be achieved by configuring fan speed weights based on the heat dissipation curves of different device sensors. However, some devices do not support temperature acquisition; the device is in place but the temperature is 0 or ff, which is defined as a noreading device. That is, the temperature of the relevant noreading device is abnormal, and the heat dissipation curve of the corresponding device will not be adjusted. Therefore, the existing zoning heat dissipation curve control method for noreading devices cannot meet the heat dissipation requirements. On the other hand, increasing the overall base speed by adjusting the heat dissipation curve parameters of the ambient temperature sensor will result in high fan power consumption and high noise.

[0069] Example 1

[0070] This application provides a dynamic heat dissipation control method, such as... Figure 1 As shown, the method is applied to a dynamic heat dissipation control system. The system includes several devices to be cooled, an expansion card, and a target fan corresponding to the expansion card. The several devices to be cooled are connected to the expansion card, and the target fan includes a first fan. The method includes:

[0071] Obtain the location information and temperature information of the plurality of devices to be cooled;

[0072] Add the devices that are in place and can obtain temperature information to the first device set;

[0073] Add the devices that need to be cooled but whose temperature information cannot be obtained to the second device set;

[0074] The duty cycle value of the first pulse width modulation signal of the first fan is determined based on the temperature value of each device in the first device set and the corresponding heat dissipation curve.

[0075] The first pulse width modulation signal duty cycle change difference of the first fan is determined according to the type and quantity of the second device set; the target pulse width modulation signal duty cycle value of the first fan is determined according to the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference.

[0076] The speed of the first fan is set by the duty cycle value of the target pulse width modulation signal in order to dynamically control the heat dissipation of the system in zones.

[0077] Specifically, for no-reading PCIe devices, this application determines the adapter card where the device is located after the server is powered on, confirms the type, model, and quantity of no-reading devices on the adapter card, and calculates the corresponding fan speed that needs to be increased based on the type, model, and quantity. For example, if the adapter card has only one no-reading PCIe device by default, the speed is increased by 5% duty; if the adapter card has two or more no-reading PCIe devices, the speed is increased by 10% duty, or the speed of adjacent fans is increased simultaneously. In special cases, special speed control configuration is required based on the device type and model.

[0078] Here, PCIe devices refer to devices that plug into adapter cards, such as graphics processors (GPUs), RAID cards, network interface cards (NICs), and solid-state drives (SSDs), as well as fixed-position OCP network cards and RAID cards.

[0079] The beneficial effects of the technical solutions provided in this application are:

[0080] This application can optimize the heat dissipation requirements of PCIe devices that do not support temperature acquisition or have abnormal temperatures; prevent overheating of devices that are in place and have no-reading temperatures, thus affecting device and server performance; compared with the previous approach of increasing the base fan speed by modifying the thermal curve of the ambient temperature sensor, this approach can reduce fan power consumption and solve the problem of excessive server noise.

[0081] The technical solution provided in this application embodiment is based on BMC to dynamically control the heat dissipation of PCIe devices with abnormal temperatures. It can increase the fan speed corresponding to the location of different devices according to their different types, locations, quantities, and models, so as to ensure the performance of PCIe devices and servers while reducing noise and power consumption.

[0082] Example 2

[0083] This application provides a dynamic heat dissipation control method, such as... Figure 2 As shown, the method is applied to a dynamic heat dissipation control system. The system includes several devices to be cooled, an expansion card, and a target fan corresponding to the expansion card. The several devices to be cooled are connected to the expansion card, and the target fan includes a first fan. The method includes:

[0084] Step S01: Obtain the location information and temperature information of the plurality of devices to be cooled;

[0085] Add the devices that are in place and can obtain temperature information to the first device set;

[0086] Add the devices that need to be cooled but whose temperature information cannot be obtained to the second device set;

[0087] The duty cycle value of the first pulse width modulation signal of the first fan is determined based on the temperature value of each device in the first device set and the corresponding heat dissipation curve.

[0088] Specifically, the plurality of devices to be cooled are polled to detect their in-situ information;

[0089] Determine the corresponding positions of the plurality of devices to be cooled and the fans;

[0090] Determine the quantitative relationship between the plurality of devices to be cooled and their corresponding adapter cards.

[0091] Taking network cards and disk array RAID cards as examples, network cards are divided into PCIe network cards and OCP cards. Due to different interfaces, OCP network cards and RAID cards do not have PCIe interface positions, but the position of OCP network cards is fixed and is connected to the riser0 adapter card by default.

[0092] Temperature noreading device confirmation: After the server is powered on, the system BIOS sends the location information of all PCIe devices to the Baseboard Management Controller (BMC). It then polls all devices that need to be cooled and checks their location status and temperature. If a device is present and its temperature is "noreading" (unavailable), then the condition for increasing the fan speed of the device with abnormal temperature is met.

[0093] Confirm the location and number of devices with abnormal temperatures; determine the Riser card to which the device with abnormal temperature is located based on the PCIe interface location. For example, PCIe0, 1, and 2 are on Riser0; PCIe3, 4, and 5 are on Riser1; and PCIe6 and 7 are on Riser2. The locations of OCP network cards and RAID cards are fixed and are counted on Riser0 by default.

[0094] After calculating the duty cycle value of the pulse width modulation signal for each fan (first fan) in the first device set using the heat dissipation curves of all sensors, the maximum value among the duty cycle values ​​of the pulse width modulation signals for the fans of several devices is set as the first pulse width modulation signal duty cycle value.

[0095] Step S01 also includes:

[0096] Step S011: Determine the duty cycle value of the pulse width modulation signal of the first fan based on the temperature value of each device in the first device set and the heat dissipation curve of the corresponding device.

[0097] The maximum value among the duty cycle values ​​of the pulse width modulation signal corresponding to the first fan of several devices is set as the duty cycle value of the first pulse width modulation signal.

[0098] Step S011 also includes:

[0099] Step S0111: Obtain the temperature value T(K) of one of the devices in the first device set at time K, the temperature value T(K-1) of device K-1, and the temperature value T(K-2) of device K-2;

[0100] Obtain the pulse width modulation signal duty cycle value FS_act(K-1) of the first fan of one of the devices in the first device set at time K-1, with preset value Tref, p factor Kp, i factor Ki, and d factor Kd;

[0101] The duty cycle value FS(K) of the pulse width modulation signal of the first fan is calculated using the first heat dissipation curve formula: FS(K)=FS_act(K-1)+Kp*(T(K)-T(K-1))+Ki*(T(K)-Tref)+Kd*((T(K)-2*T(K-1)+T(K-2)).

[0102] The step of determining the pulse width modulation signal duty cycle value of the first fan based on the temperature value of each device in the first device set and the heat dissipation curve of the corresponding device further includes:

[0103] Obtain the duty cycle value of the first fan pulse width modulation signal and the temperature value of one of the devices in the first device set;

[0104] The linear control rate a is determined based on the duty cycle value of the first fan pulse width modulation signal and the corresponding temperature value of the equipment;

[0105] Obtain the current temperature value X of one of the devices in the first device set;

[0106] The duty cycle value Y of the pulse width modulation signal of the first fan is calculated using the second heat dissipation curve formula: Y = aX.

[0107] Specifically, PID control uses setpoint (Tref), kp, ki, and kd parameters; for example, PSU control parameters: sp: 50, kp: 5, ki: 0.5, kd: 1.

[0108] The duty cycle value FS(K) of the pulse width modulation signal of the first fan is calculated using the first heat dissipation curve formula: FS(K)=FS_act(K-1)+Kp*(T(K)-T(K-1))+Ki*(T(K)-Tref)+Kd*((T(K)-2*T(K-1)+T(K-2)).

[0109] Linear control, also known as segmented control, is used, such as inlet control, for example (15, 51)(20, 91)(25, 130)(30, 169)(37, 204)(38, 230). If the temperature is between 15 and 20 degrees Celsius, then segment control (15, 51)(20, 91) is used. The k value is calculated from historical data (temperature value, PWM value). When x = 17, it is then substituted into y = kx to calculate the duty cycle Y of the first fan pulse width modulation signal.

[0110] Step S02: Determine the duty cycle variation difference of the first pulse width modulation signal of the first fan according to the type and quantity of the second device set.

[0111] Step S02 also includes:

[0112] Step S021: Obtain the type and quantity of the second device set;

[0113] When the number of the second device set is the first preset value (1), the first fan speed duty cycle difference is set to the first threshold (5% duty), and the first fan pulse width modulation signal duty cycle change difference is calculated according to the first threshold.

[0114] When the number of the second device set is greater than or equal to the second preset value (2), the first fan speed duty cycle difference is set to the second threshold (10% duty), and the first fan pulse width modulation signal duty cycle change difference is calculated according to the second threshold; the second fan speed duty cycle difference is set to the first threshold, and the second fan pulse width modulation signal duty cycle change difference is calculated according to the first threshold;

[0115] When the number of second device sets on each expansion board is greater than or equal to the second preset value (2), the duty cycle variation difference of the first pulse width modulation signal of the first fan is determined according to the type of the second device set.

[0116] Specifically, the required fan duty cycle for the corresponding fan position on the riser card is calculated based on the type, model, and quantity of noreading devices. Noreading device types include network cards, RAID cards, GPU cards, and PCIe SSDs. Different PCIe devices exhibit different temperature variations during operation. The quantities mentioned refer to the number of noreading devices on the same riser card, as shown in Table 2. If there is only one noreading device on the riser card, the corresponding fan's duty cycle is only 5%. If there are two or more noreading devices on the riser card, the corresponding fan's duty cycle is 10%, and adjacent fans are given a 5% duty cycle. When the number of noreading devices on each adapter card is greater than 2, the maximum value is used for the corresponding fan's duty cycle. If different types or models of devices are mixed, the highest value is used. For example, if a network card requires a 5% or 10% duty cycle, and the RAID card requires a 10% or 15% duty cycle, then the final duty cycle is 10% or 15% for the RAID card.

[0117]

[0118]

[0119] Table 2

[0120] Step S022: When the second device set type includes network card and disk array card, calculate the difference in duty cycle change of pulse width modulation signal of the first fan corresponding to the disk array card based on the difference in duty cycle of the first fan speed corresponding to the disk array card, and set the difference in duty cycle change of pulse width modulation signal of the first fan corresponding to the disk array card as the difference in duty cycle change of the first pulse width modulation signal.

[0121] When one of the devices in the second set of devices includes several models, the maximum speed duty cycle difference of the first fan corresponding to the device model is set as the first speed duty cycle difference, and the first pulse width modulation signal duty cycle difference of the first fan is calculated based on the first speed duty cycle difference.

[0122] Specifically, even for devices of the same type, such as network cards, different models or manufacturers can exhibit significant differences in operating temperature. Here, we differentiate by model. PCIe device types can be configured using a unique device type, or by a unique device ID to distinguish different models of noreading devices of the same type (e.g., 100G, 200G, 300G). A list of noreading devices is created, configuring the device ID requiring special adjustment and the fan duty cycle to be increased. The system prioritizes polling; if the noreading device ID requiring special adjustment is in this list, its required fan duty cycle is used, with the largest value taken if multiple IDs are listed. If not in the list, the default duty cycle value is used based on the device type.

[0123] Here, the duty cycle that needs to be increased is a fixed value, which is used for fan PWM pulse width modulation. The 1% duty cycle (corresponding to the difference in fan speed duty cycle) is 2.55pwm (the duty cycle of the PWM signal, corresponding to the difference in the change of the fan's pulse width modulation signal duty cycle).

[0124] Riser cards are server expansion cards primarily used to provide additional expansion slots within the limited space of a server chassis, allowing for the installation of more hardware devices such as GPU cards, network adapters, and hard drive controllers. Riser cards are typically installed in the PCIe slots of the server motherboard, enabling the relocation of expansion slots from the motherboard to locations more suitable for the server chassis, thereby making full use of the server's internal space and enhancing the server's expandability and flexibility.

[0125] Step S03: Determine the target pulse width modulation signal duty cycle value of the first fan based on the duty cycle value of the first pulse width modulation signal and the difference in the duty cycle change of the first pulse width modulation signal.

[0126] Step S03 also includes:

[0127] Step S031: Obtain the duty cycle value of the first pulse width modulation signal and the difference in the duty cycle change of the first pulse width modulation signal;

[0128] The sum of the duty cycle value of the first pulse width modulation signal and the difference in the duty cycle change of the first pulse width modulation signal is taken as the target pulse width modulation signal duty cycle value of the first fan.

[0129] Specifically, the final target pulse width modulation signal duty cycle value is transmitted to the fan. After all the sensor heat dissipation curves have calculated the pulse width modulation signal duty cycle value, the maximum fan pulse width modulation signal duty cycle value in the first device set is taken. On this basis, the difference in the first pulse width modulation signal duty cycle change value of the second device set is added, and the final pulse width modulation signal duty cycle value is output to the first fan to realize the dynamic control of heat dissipation of the device to be cooled.

[0130] Duty cycle refers to the ratio of the high level to the period time in a PWM signal. When the duty cycle is 100%, the fan runs at its highest speed and outputs maximum airflow. When the duty cycle is 0%, the fan stops running and outputs zero airflow.

[0131] Step S04: The speed of the first fan is set by the duty cycle value of the target pulse width modulation signal to dynamically control the heat dissipation of the system by zone.

[0132] Step S05: When the dynamic control of the system heat dissipation zone fails, the weighting ratio of the duty cycle value of the pulse width modulation signal of the fan corresponding to each temperature control device is determined by the temperature of each temperature control device and the heat dissipation curve of the corresponding temperature control device.

[0133] By gradually increasing the weighting ratio of the duty cycle value of the corresponding fan pulse width modulation signal for all expansion cards, the system's heat dissipation is dynamically controlled.

[0134] Specifically, however, increasing the weighting ratio of the duty cycle of the basic pulse width modulation signal of the overall device by adjusting the heat dissipation curve parameters of the ambient temperature sensor will result in high power consumption and high noise.

[0135] like Figure 3As shown, this application confirms the location, type, model, and quantity of noreading devices, and calculates the corresponding fan duty cycle difference that needs to be increased based on the location, type, model, and quantity of noreading devices. Because different devices have different throttling temperatures and temperature fluctuations, the fan speed is dynamically zoned and adjusted according to the location, type, model, and quantity of noreading devices. Based on BMC, dynamic heat dissipation zoning adjustment is performed on PCIe devices with abnormal temperatures. The fan speed corresponding to the location of the device can be increased according to different device types, locations, quantities, and models, ensuring the performance of PCIe devices and servers while reducing noise and power consumption.

[0136] Furthermore, determining the difference in the duty cycle change of the first pulse width modulation signal of the first fan based on the type of the second device set further includes:

[0137] Create a second PCIe device list;

[0138] Set the PCIe device that requires special control as the first PCIe device;

[0139] Poll the list of the second PCIe devices;

[0140] Determine whether the first PCIe device is in the second PCIe device list;

[0141] If so, the duty cycle difference of the fan speed corresponding to the first PCIe device is set as the third threshold, and the duty cycle change difference of the pulse width modulation signal of the first fan corresponding to the first PCIe device is calculated according to the third threshold; when the first PCIe device includes multiple models, the maximum duty cycle difference of the first fan corresponding to the first PCIe device model is set as the second duty cycle difference, and the first pulse width modulation signal duty cycle difference of the first fan corresponding to the first PCIe device is calculated according to the second duty cycle difference.

[0142] If not, the duty cycle difference of the first fan speed corresponding to the remaining PCIe device is set as the fourth threshold, and the duty cycle change difference of the pulse width modulation signal corresponding to the first fan of the remaining PCIe device is calculated based on the fourth threshold.

[0143] This application can dynamically adjust the fan duty cycle based on the frequency reduction temperature and temperature fluctuation of different PCIe devices, and according to the location, type, model and quantity of noreading devices.

[0144] The dynamic heat dissipation control method provided in this application embodiment can be improved and optimized in several ways without departing from the technical solution of this application, and these improvements and optimizations should also be considered within the protection scope of this application.

[0145] This technical solution not only enables dynamic heat dissipation control for rear-side no-reading PCIe devices in servers, but also allows for partitioned dynamic control of SAS / SATA hard drives on the front panel that do not support direct temperature acquisition. Because SAS / SATA hard drives do not support direct temperature acquisition via BMC (Browser Control Center), BMC can only monitor temperature through the RAID card. However, due to the large amount of information polled by the RAID card, the more hard drives there are, the slower the temperature acquisition becomes, leading to greater temperature fluctuations and fan speed variations. Slow heat dissipation control can also cause hard drive overheating, affecting normal server operation. This solution allows for partitioned dynamic heat dissipation control based on the number and location of SAS / SATA hard drives on the back panel, preventing hard drive overheating issues.

[0146] The beneficial effects of the technical solutions provided in this application are:

[0147] This application can optimize the heat dissipation requirements of PCIe devices that do not support temperature acquisition or have abnormal temperatures; prevent overheating of devices that are in place and have no-reading temperatures, thus affecting device and server performance; compared with the previous approach of increasing the base fan speed by modifying the thermal curve of the ambient temperature sensor, this approach can reduce fan power consumption and solve the problem of excessive server noise.

[0148] The technical solution provided in this application embodiment is based on BMC to dynamically control the heat dissipation of PCIe devices with abnormal temperatures. It can increase the fan speed corresponding to the location of different devices according to their different types, locations, quantities, and models, so as to ensure the performance of PCIe devices and servers while reducing noise and power consumption.

[0149] Example 3

[0150] This application provides a dynamic heat dissipation control device, such as... Figure 4 As shown, the device includes: an acquisition module, a first determination module, a setting module, a second determination module, a control module, and a post-processing module.

[0151] In this embodiment, the acquisition module is used to acquire the location information and temperature information of the plurality of devices to be cooled;

[0152] The configuration module is used to add the devices to be cooled that are in place and can obtain temperature information to the first device set;

[0153] Add the devices that need to be cooled but whose temperature information cannot be obtained to the second device set;

[0154] The first determining module is used to determine the duty cycle value of the first pulse width modulation signal of the first fan based on the temperature value of each device in the first device set and the corresponding heat dissipation curve.

[0155] The second determining module is used to determine the difference in the duty cycle change of the first pulse width modulation signal of the first fan according to the type and quantity of the second device set; and to determine the target pulse width modulation signal duty cycle value of the first fan according to the duty cycle value of the first pulse width modulation signal and the difference in the duty cycle change of the first pulse width modulation signal.

[0156] The control module is used to set the speed of the first fan by the duty cycle value of the target pulse width modulation signal, so as to dynamically control the heat dissipation of the system by zone.

[0157] In one embodiment, the first determining module is configured to determine the pulse width modulation signal duty cycle value of the first fan based on the temperature value of each device in the first device set and the heat dissipation curve of the corresponding device.

[0158] The maximum value among the duty cycle values ​​of the pulse width modulation signal corresponding to the first fan of several devices is set as the duty cycle value of the first pulse width modulation signal.

[0159] In one embodiment, the first determining module is used to obtain the temperature value T(K) of one of the devices in the first device set at time K, the temperature value T(K-1) of device K-1, and the temperature value T(K-2) of device K-2.

[0160] Obtain the pulse width modulation signal duty cycle value FS_act(K-1) of the first fan of one of the devices in the first device set at time K-1, with preset value Tref, p factor Kp, i factor Ki, and d factor Kd;

[0161] The duty cycle value FS(K) of the pulse width modulation signal of the first fan is calculated using the first heat dissipation curve formula: FS(K)=FS_act(K-1)+Kp*(T(K)-T(K-1))+Ki*(T(K)-Tref)+Kd*((T(K)-2*T(K-1)+T(K-2)).

[0162] The step of determining the pulse width modulation signal duty cycle value of the first fan based on the temperature value of each device in the first device set and the heat dissipation curve of the corresponding device further includes:

[0163] Obtain the duty cycle value of the first fan pulse width modulation signal and the temperature value of one of the devices in the first device set;

[0164] The linear control rate a is determined based on the duty cycle value of the first fan pulse width modulation signal and the corresponding temperature value of the equipment;

[0165] Obtain the current temperature value X of one of the devices in the first device set;

[0166] The duty cycle value Y of the pulse width modulation signal of the first fan is calculated using the second heat dissipation curve formula: Y = aX.

[0167] In one embodiment, the second determining module is used to obtain the type and quantity of the second device set;

[0168] When the number of the second device set is a first preset value, the first fan speed duty cycle difference is set as a first threshold, and the first fan pulse width modulation signal duty cycle change difference is calculated based on the first threshold.

[0169] When the number of the second device set is greater than or equal to the second preset value, the first fan speed duty cycle difference is set as the second threshold, and the duty cycle change difference of the first fan pulse width modulation signal is calculated based on the second threshold; the second fan speed duty cycle difference is set as the first threshold, and the duty cycle change difference of the second fan pulse width modulation signal is calculated based on the first threshold.

[0170] When the number of second device sets on each expansion board is greater than or equal to the second preset value, the duty cycle variation difference of the first pulse width modulation signal of the first fan is determined according to the type of the second device set.

[0171] In one embodiment, the second determining module is used to calculate the difference in the duty cycle change of the pulse width modulation signal of the first fan corresponding to the disk array card based on the difference in the duty cycle of the rotation speed of the first fan corresponding to the disk array card when the second device set type includes a network card and a disk array card, and set the difference in the duty cycle change of the pulse width modulation signal of the first fan corresponding to the disk array card as the difference in the duty cycle change of the first pulse width modulation signal.

[0172] When one of the devices in the second set of devices includes several models, the maximum speed duty cycle difference of the first fan corresponding to the device model is set as the first speed duty cycle difference, and the first pulse width modulation signal duty cycle difference of the first fan is calculated based on the first speed duty cycle difference.

[0173] In one embodiment, the second determining module is used to obtain the duty cycle value of the first pulse width modulation signal and the difference in the duty cycle change of the first pulse width modulation signal;

[0174] The sum of the duty cycle value of the first pulse width modulation signal and the difference in the duty cycle change of the first pulse width modulation signal is taken as the target pulse width modulation signal duty cycle value of the first fan.

[0175] In one embodiment, the post-processing module is used to determine the weighting ratio of the duty cycle value of the pulse width modulation signal of the fan of each temperature control device by means of the temperature of each temperature control device and the heat dissipation curve of the corresponding temperature control device when the dynamic control of the system heat dissipation partition fails.

[0176] By gradually increasing the weighting ratio of the duty cycle value of the corresponding fan pulse width modulation signal for all expansion cards, the system's heat dissipation is dynamically controlled.

[0177] The beneficial effects of the technical solutions provided in this application are:

[0178] This application can optimize the heat dissipation requirements of PCIe devices that do not support temperature acquisition or have abnormal temperatures; prevent overheating of devices that are in place and have no-reading temperatures, thus affecting device and server performance; compared with the previous approach of increasing the base fan speed by modifying the thermal curve of the ambient temperature sensor, this approach can reduce fan power consumption and solve the problem of excessive server noise.

[0179] The technical solution provided in this application embodiment is based on BMC to dynamically control the heat dissipation of PCIe devices with abnormal temperatures. It can increase the fan speed corresponding to the location of different devices according to their different types, locations, quantities, and models, so as to ensure the performance of PCIe devices and servers while reducing noise and power consumption.

[0180] Example 4

[0181] The present invention also provides a dynamic heat dissipation control device, comprising:

[0182] One or more processors;

[0183] Storage device for storing one or more programs;

[0184] When the one or more programs are executed by the one or more processors, the one or more processors perform the following dynamic heat dissipation control method:

[0185] Obtain the location information and temperature information of the plurality of devices to be cooled;

[0186] Add the devices that are in place and can obtain temperature information to the first device set;

[0187] Add the devices that need to be cooled but whose temperature information cannot be obtained to the second device set;

[0188] The duty cycle value of the first pulse width modulation signal of the first fan is determined based on the temperature value of each device in the first device set and the corresponding heat dissipation curve.

[0189] The first pulse width modulation signal duty cycle change difference of the first fan is determined according to the type and quantity of the second device set; the target pulse width modulation signal duty cycle value of the first fan is determined according to the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference.

[0190] The speed of the first fan is set by the duty cycle value of the target pulse width modulation signal in order to dynamically control the heat dissipation of the system in zones.

[0191] The beneficial effects of the technical solutions provided in this application are:

[0192] This application can optimize the heat dissipation requirements of PCIe devices that do not support temperature acquisition or have abnormal temperatures; prevent overheating of devices that are in place and have no-reading temperatures, thus affecting device and server performance; compared with the previous approach of increasing the base fan speed by modifying the thermal curve of the ambient temperature sensor, this approach can reduce fan power consumption and solve the problem of excessive server noise.

[0193] The technical solution provided in this application embodiment is based on BMC to dynamically control the heat dissipation of PCIe devices with abnormal temperatures. It can increase the fan speed corresponding to the location of different devices according to their different types, locations, quantities, and models, so as to ensure the performance of PCIe devices and servers while reducing noise and power consumption.

[0194] Example 5

[0195] This application provides a computer device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, it can perform the following dynamic heat dissipation control method:

[0196] Obtain the location information and temperature information of the plurality of devices to be cooled;

[0197] Add the devices that are in place and can obtain temperature information to the first device set;

[0198] Add the devices that need to be cooled but whose temperature information cannot be obtained to the second device set;

[0199] The duty cycle value of the first pulse width modulation signal of the first fan is determined based on the temperature value of each device in the first device set and the corresponding heat dissipation curve.

[0200] The first pulse width modulation signal duty cycle change difference of the first fan is determined according to the type and quantity of the second device set; the target pulse width modulation signal duty cycle value of the first fan is determined according to the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference.

[0201] The speed of the first fan is set by the duty cycle value of the target pulse width modulation signal in order to dynamically control the heat dissipation of the system in zones.

[0202] The beneficial effects of the technical solutions provided in this application are:

[0203] This application can optimize the heat dissipation requirements of PCIe devices that do not support temperature acquisition or have abnormal temperatures; prevent overheating of devices that are in place and have no-reading temperatures, thus affecting device and server performance; compared with the previous approach of increasing the base fan speed by modifying the thermal curve of the ambient temperature sensor, this approach can reduce fan power consumption and solve the problem of excessive server noise.

[0204] The technical solution provided in this application embodiment is based on BMC to dynamically control the heat dissipation of PCIe devices with abnormal temperatures. It can increase the fan speed corresponding to the location of different devices according to their different types, locations, quantities, and models, so as to ensure the performance of PCIe devices and servers while reducing noise and power consumption.

[0205] Example 6

[0206] This application also provides a computer program product, including a computer program that, when executed by a processor, can implement the following method for dynamic heat dissipation control:

[0207] Obtain the location information and temperature information of the plurality of devices to be cooled;

[0208] Add the devices that are in place and can obtain temperature information to the first device set;

[0209] Add the devices that need to be cooled but whose temperature information cannot be obtained to the second device set;

[0210] The duty cycle value of the first pulse width modulation signal of the first fan is determined based on the temperature value of each device in the first device set and the corresponding heat dissipation curve.

[0211] The first pulse width modulation signal duty cycle change difference of the first fan is determined according to the type and quantity of the second device set; the target pulse width modulation signal duty cycle value of the first fan is determined according to the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference.

[0212] The speed of the first fan is set by the duty cycle value of the target pulse width modulation signal in order to dynamically control the heat dissipation of the system in zones.

[0213] The beneficial effects of the technical solutions provided in this application are:

[0214] This application can optimize the heat dissipation requirements of PCIe devices that do not support temperature acquisition or have abnormal temperatures; prevent overheating of devices that are in place and have no-reading temperatures, thus affecting device and server performance; compared with the previous approach of increasing the base fan speed by modifying the thermal curve of the ambient temperature sensor, this approach can reduce fan power consumption and solve the problem of excessive server noise.

[0215] The technical solution provided in this application embodiment is based on BMC to dynamically control the heat dissipation of PCIe devices with abnormal temperatures. It can increase the fan speed corresponding to the location of different devices according to their different types, locations, quantities, and models, so as to ensure the performance of PCIe devices and servers while reducing noise and power consumption.

[0216] Example 7

[0217] This application provides a computer storage medium, including a memory, a processor, and a computer program stored on the memory and executable on the processor. When the processor executes the computer program, it performs the following steps:

[0218] Obtain the location information and temperature information of the plurality of devices to be cooled;

[0219] Add the devices that are in place and can obtain temperature information to the first device set;

[0220] Add the devices that need to be cooled but whose temperature information cannot be obtained to the second device set;

[0221] The duty cycle value of the first pulse width modulation signal of the first fan is determined based on the temperature value of each device in the first device set and the corresponding heat dissipation curve.

[0222] The first pulse width modulation signal duty cycle change difference of the first fan is determined according to the type and quantity of the second device set; the target pulse width modulation signal duty cycle value of the first fan is determined according to the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference.

[0223] The speed of the first fan is set by the duty cycle value of the target pulse width modulation signal in order to dynamically control the heat dissipation of the system in zones.

[0224] In one embodiment, determining the duty cycle value of the first pulse width modulation signal of the first fan based on the temperature value of each device in the first device set and the corresponding heat dissipation curve includes:

[0225] The duty cycle value of the pulse width modulation signal of the first fan is determined based on the temperature value of each device in the first device set and the heat dissipation curve of the corresponding device.

[0226] The maximum value among the duty cycle values ​​of the pulse width modulation signal corresponding to the first fan of several devices is set as the duty cycle value of the first pulse width modulation signal.

[0227] In one embodiment, the target fan includes a second fan adjacent to the first fan, and the step of determining the difference in the duty cycle change of the first pulse width modulation signal of the first fan based on the type and quantity of the second device set includes:

[0228] Obtain the type and quantity of the second device set;

[0229] When the number of the second device set is a first preset value, the first fan speed duty cycle difference is set as a first threshold, and the first fan pulse width modulation signal duty cycle change difference is calculated based on the first threshold.

[0230] When the number of the second device set is greater than or equal to the second preset value, the first fan speed duty cycle difference is set as the second threshold, and the duty cycle change difference of the first fan pulse width modulation signal is calculated based on the second threshold; the second fan speed duty cycle difference is set as the first threshold, and the duty cycle change difference of the second fan pulse width modulation signal is calculated based on the first threshold.

[0231] When the number of second device sets on each expansion board is greater than or equal to the second preset value, the duty cycle variation difference of the first pulse width modulation signal of the first fan is determined according to the type of the second device set.

[0232] In one embodiment, determining the duty cycle variation difference of the first pulse width modulation signal of the first fan according to the type of the second device set includes:

[0233] When the second device set type includes network card and disk array card, the duty cycle change difference of the pulse width modulation signal of the first fan corresponding to the disk array card is calculated based on the duty cycle difference of the speed of the first fan corresponding to the disk array card, and the duty cycle change difference of the pulse width modulation signal of the first fan corresponding to the disk array card is set as the duty cycle change difference of the first pulse width modulation signal.

[0234] When one of the devices in the second set of devices includes several models, the maximum speed duty cycle difference of the first fan corresponding to the device model is set as the first speed duty cycle difference, and the first pulse width modulation signal duty cycle difference of the first fan is calculated based on the first speed duty cycle difference.

[0235] In one embodiment, determining the target pulse width modulation signal duty cycle value of the first fan based on the first pulse width modulation signal duty cycle value and the difference in the first pulse width modulation signal duty cycle includes:

[0236] Obtain the duty cycle value of the first pulse width modulation signal and the difference in the duty cycle change of the first pulse width modulation signal;

[0237] The sum of the duty cycle value of the first pulse width modulation signal and the difference in the duty cycle change of the first pulse width modulation signal is taken as the target pulse width modulation signal duty cycle value of the first fan.

[0238] In one embodiment, determining the pulse width modulation signal duty cycle value of the first fan based on the temperature value of each device in the first device set and the heat dissipation curve of the corresponding device includes:

[0239] Obtain the temperature value T(K) of one device K in the first device set at time K, the temperature value T(K-1) of device K-1 at time K-2, and the temperature value T(K-2) of device K-2 at time K-3.

[0240] Obtain the pulse width modulation signal duty cycle value of the first fan of one of the devices in the first device set at time K-1. Preset values: Tref, p-factor Kp, i-factor Ki, d-factor Kd;

[0241] Based on the formula for the first heat dissipation curve: Calculate the duty cycle value FS(K) of the pulse width modulation signal of the first fan;

[0242] The step of determining the pulse width modulation signal duty cycle value of the first fan based on the temperature value of each device in the first device set and the heat dissipation curve of the corresponding device further includes:

[0243] Obtain the duty cycle value of the first fan pulse width modulation signal and the temperature value of one of the devices in the first device set;

[0244] The linear control rate a is determined based on the duty cycle value of the first fan pulse width modulation signal and the corresponding temperature value of the equipment;

[0245] Obtain the current temperature value X of one of the devices in the first device set;

[0246] The duty cycle value Y of the pulse width modulation signal of the first fan is calculated using the second heat dissipation curve formula: Y = aX.

[0247] In one embodiment, the system further includes a temperature control device, and the method includes:

[0248] When the dynamic control of the system's heat dissipation zones fails, the weighting ratio of the duty cycle value of the pulse width modulation signal of the corresponding fan of each temperature control device is determined by the temperature of each temperature control device and the heat dissipation curve of the corresponding temperature control device.

[0249] By gradually increasing the weighting ratio of the duty cycle value of the corresponding fan pulse width modulation signal for all expansion cards, the system's heat dissipation is dynamically controlled.

[0250] This application can prevent PCIe devices from overheating and affecting server performance, while also reducing fan power consumption and solving the problem of excessive server noise.

[0251] Figure 5 This is an exemplary system provided for Embodiment Seven of this application, which can be used to implement the various embodiments described in this application;

[0252] like Figure 5 As shown, in some embodiments, the system can function as any of the aforementioned devices for dynamic heat dissipation control in each of the various embodiments. In some embodiments, the system may include one or more computer-readable media (e.g., system memory or NVM / storage device) having a result, and one or more processors (e.g., one or more processors) coupled to the one or more computer-readable media and configured to execute the result to implement the module thereby performing the actions described in this application.

[0253] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), dual data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), Rambus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0254] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0255] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A dynamic heat dissipation control method, characterized in that, The method is applied to a dynamic heat dissipation control system, the system including a plurality of devices to be cooled, an expansion card, and a target fan corresponding to the expansion card. The plurality of devices to be cooled are connected to the expansion card, and the target fan includes a first fan. The method includes: Obtain the location information and temperature information of the plurality of devices to be cooled; Add the devices that are in place and can obtain temperature information to the first device set; Add the devices that need to be cooled but whose temperature information cannot be obtained to the second device set; The duty cycle value of the first pulse width modulation signal of the first fan is determined based on the temperature value of each device in the first device set and the corresponding heat dissipation curve. The first pulse width modulation signal duty cycle change difference of the first fan is determined according to the type and quantity of the second device set; the target pulse width modulation signal duty cycle value of the first fan is determined according to the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference. The speed of the first fan is set by the duty cycle value of the target pulse width modulation signal in order to dynamically control the heat dissipation of the system by zone. The target fan includes a second fan, which is adjacent to the first fan. Determining the difference in the duty cycle change of the first pulse width modulation signal of the first fan based on the type and quantity of the second device set includes: Obtain the type and quantity of the second device set; When the number of the second device set is a first preset value, the first fan speed duty cycle difference is set as a first threshold, and the first fan pulse width modulation signal duty cycle change difference is calculated based on the first threshold. When the number of the second device set is greater than or equal to the second preset value, the first fan speed duty cycle difference is set as the second threshold, and the duty cycle change difference of the first fan pulse width modulation signal is calculated based on the second threshold; the second fan speed duty cycle difference is set as the first threshold, and the duty cycle change difference of the second fan pulse width modulation signal is calculated based on the first threshold. When the number of second device sets on each expansion board is greater than or equal to the second preset value, the difference in duty cycle change of the first pulse width modulation signal of the first fan is determined according to the type of the second device set. Determining the difference in duty cycle variation of the first pulse width modulation signal of the first fan based on the type of the second device set includes: When the second device set type includes network card and disk array card, the duty cycle change difference of the pulse width modulation signal of the first fan corresponding to the disk array card is calculated based on the duty cycle difference of the speed of the first fan corresponding to the disk array card, and the duty cycle change difference of the pulse width modulation signal of the first fan corresponding to the disk array card is set as the duty cycle change difference of the first pulse width modulation signal. When one of the devices in the second set of devices includes several models, the maximum speed duty cycle difference of the first fan corresponding to the device model is set as the first speed duty cycle difference, and the first pulse width modulation signal duty cycle difference of the first fan is calculated based on the first speed duty cycle difference. The step of determining the target pulse width modulation (PWM) signal duty cycle value of the first fan based on the duty cycle value of the first PWM signal and the difference in the duty cycle change of the first PWM signal includes: After calculating the duty cycle value of the pulse width modulation signal for all sensor heat dissipation curves, the maximum fan pulse width modulation signal duty cycle value in the first device set is taken, and the difference in the duty cycle change of the first pulse width modulation signal in the second device set is added to this value. The final target pulse width modulation signal duty cycle value is then output to the first fan to achieve dynamic control of the heat dissipation of the device to be cooled.

2. The dynamic heat dissipation control method according to claim 1, characterized in that, The step of determining the duty cycle value of the first pulse width modulation signal of the first fan based on the temperature value of each device in the first device set and the corresponding heat dissipation curve includes: The duty cycle value of the pulse width modulation signal of the first fan is determined based on the temperature value of each device in the first device set and the heat dissipation curve of the corresponding device. The maximum value among the duty cycle values ​​of the pulse width modulation signal corresponding to the first fan of several devices is set as the duty cycle value of the first pulse width modulation signal.

3. The dynamic heat dissipation control method according to claim 2, characterized in that, The step of determining the pulse width modulation signal duty cycle value of the first fan based on the temperature value of each device in the first device set and the heat dissipation curve of the corresponding device includes: Obtain the temperature value T(K) of one device K in the first device set at time K, the temperature value T(K-1) of device K-1 at time K-2, and the temperature value T(K-2) of device K-2 at time K-3. Obtain the pulse width modulation signal duty cycle value FS_act(K-1) of the first fan of one of the devices in the first device set at time K-1, with preset value Tref, p factor Kp, i factor Ki, and d factor Kd; The duty cycle value FS(K) of the pulse width modulation signal of the first fan is calculated using the first heat dissipation curve formula: FS(K) = FS_act(K-1) + Kp*(T(K)- T(K-1)) + Ki*(T(K)-Tref) + Kd*((T(K)- 2*T(K-1)+T(K-2)). The step of determining the pulse width modulation signal duty cycle value of the first fan based on the temperature value of each device in the first device set and the heat dissipation curve of the corresponding device further includes: Obtain the duty cycle value of the first fan pulse width modulation signal and the temperature value of one of the devices in the first device set; The linear control rate a is determined based on the duty cycle value of the first fan pulse width modulation signal and the corresponding temperature value of the equipment; Obtain the current temperature value X of one of the devices in the first device set; The duty cycle value Y of the pulse width modulation signal of the first fan is calculated using the second heat dissipation curve formula: Y=aX.

4. The dynamic heat dissipation control method according to claim 1, characterized in that, The system also includes a temperature control device, and the method includes: When the dynamic control of the system's heat dissipation zones fails, the weighting ratio of the pulse width modulation signal duty cycle of the corresponding fan of each temperature control device is determined by the temperature of each temperature control device and the heat dissipation curve of the corresponding temperature control device. By gradually increasing the weighting ratio of the duty cycle value of the corresponding fan pulse width modulation signal for all expansion cards, the system's heat dissipation is dynamically controlled.

5. A dynamic heat dissipation control device for implementing the method as described in claim 1, characterized in that, The device includes: The acquisition module is used to acquire the location information and temperature information of the plurality of devices to be cooled. The configuration module is used to add devices that are in place and can obtain temperature information to the first device set; and to add devices that are in place but cannot obtain temperature information to the second device set. The first determining module is used to determine the duty cycle value of the first pulse width modulation signal of the first fan based on the temperature value of each device in the first device set and the corresponding heat dissipation curve. The second determining module is used to determine the difference in the duty cycle change of the first pulse width modulation signal of the first fan according to the type and quantity of the second device set; and to determine the target pulse width modulation signal duty cycle value of the first fan according to the duty cycle value of the first pulse width modulation signal and the difference in the duty cycle change of the first pulse width modulation signal. The control module is used to set the speed of the first fan by the duty cycle value of the target pulse width modulation signal, so as to dynamically control the heat dissipation of the system by zone.

6. A computer device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the dynamic heat dissipation control method according to any one of claims 1 to 4.

7. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the steps of the dynamic heat dissipation control method according to any one of claims 1 to 4.

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