Edge computing device heat dissipation control method, device, equipment and storage medium

Abstract

The present application relates to the technical field of equipment heat dissipation, and provides a heat dissipation control method, device, equipment and storage medium for edge computing equipment. The method includes: obtaining temperature data information, and generating a three-dimensional temperature distribution map of the edge computing equipment based on the temperature data information; performing temperature gradient analysis on the three-dimensional temperature distribution map to generate a temperature gradient field; obtaining the state information of the heating component of the edge computing equipment; predicting the three-dimensional temperature prediction distribution map of the edge computing equipment after a preset time period based on the temperature gradient field and the state information of the heating component; generating the operating parameters of the heat dissipation device within the preset time period based on the three-dimensional temperature prediction distribution map, and controlling the heat dissipation device to perform heat dissipation processing on the edge computing device within the preset time period based on the operating parameters. The method reduces the continuous operation time of the heat dissipation device, thereby effectively reducing the total energy consumption of the edge computing equipment.

Description

Technical Field

[0001] The present application relates to the field of device heat dissipation technology, and in particular to a method, device, equipment and storage medium for heat dissipation control of edge computing equipment. Background Art

[0002] With the rapid development of technologies such as the Internet of Things, artificial intelligence, and big data, edge computing, as a new computing model, has attracted widespread attention and application because it can process and analyze data close to the data source, thereby reducing network bandwidth requirements, reducing latency, and improving data privacy. Edge computing devices are usually deployed at the edge of the network, such as base stations, street light poles, traffic lights, etc., and are responsible for processing large amounts of data from sensors and terminal devices.

[0003] However, as edge computing devices become increasingly powerful, the power consumption of their integrated chips, CPUs, GPUs and other high-performance computing components also increases, and the heat generated increases significantly. If the heat cannot be dissipated in a timely and effective manner, the operating temperature of the device will rise, resulting in performance degradation and even equipment failure, affecting the reliability and stability of the system. Therefore, effective heat dissipation control of edge computing devices is a key factor in ensuring the stable operation of edge computing devices.

[0004] Existing heat dissipation control methods for edge computing devices usually use fans or liquid cooling devices to continuously dissipate heat for edge computing devices. This heat dissipation method has high energy consumption and high cost. Summary of the invention

[0005] The present application provides a method, device, equipment and storage medium for controlling heat dissipation of an edge computing device to solve the problems raised by the above background technology.

[0006] In a first aspect, the present application provides a method for controlling heat dissipation of an edge computing device, comprising:

[0007] Acquire temperature data information through a plurality of temperature sensors evenly arranged on the edge computing device, and generate a three-dimensional temperature distribution map of the edge computing device based on the temperature data information;

[0008] Performing temperature gradient analysis on the three-dimensional temperature distribution diagram to generate a temperature gradient field;

[0009] Obtaining status information of a heat generating component of the edge computing device;

[0010] Predicting a three-dimensional temperature prediction distribution diagram of the edge computing device after a preset time period based on the temperature gradient field and the state information of the heat generating component;

[0011] Determining whether heat dissipation processing is required for the edge computing device based on the three-dimensional temperature prediction distribution map;

[0012] If necessary, the operating parameters of the heat dissipation device within the preset time period are generated based on the three-dimensional temperature prediction distribution map, and the heat dissipation device is controlled to perform heat dissipation processing on the edge computing device within the preset time period based on the operating parameters.

[0013] In a possible implementation, generating a three-dimensional temperature distribution map of the edge computing device based on the temperature data information includes:

[0014] Performing finite element segmentation processing on the edge computing device to obtain multiple finite element units of the edge computing device;

[0015] For each temperature value in the temperature data information, determining a finite element unit corresponding to the temperature value as a target finite element unit, and determining other finite element units except the target finite element unit as finite element units to be interpolated;

[0016] For each of the finite element units to be interpolated, determine the temperature value corresponding to the finite element unit to be interpolated based on the temperature value corresponding to each of the target finite element units;

[0017] The three-dimensional temperature distribution diagram is generated based on the temperature values ​​corresponding to each of the finite element units.

[0018] In a possible implementation, the determining the temperature value corresponding to the to-be-interpolated finite element unit based on the temperature value corresponding to each of the target finite element units includes:

[0019] Perform binary combination on each of the target finite element units to obtain a plurality of binary combination pairs;

[0020] For each of the binary combination pairs, obtaining a distance value between two target finite element units in the binary combination pair;

[0021] For each of the distance values, obtaining a semivariogram function value corresponding to the distance value based on each binary combination pair corresponding to the distance value;

[0022] Based on the semivariogram values ​​corresponding to the distance values, a fitting curve of the semivariogram value changing with the distance value is constructed;

[0023] A Kriging equation group corresponding to the finite element unit to be interpolated is constructed based on the fitting curve, and a weight coefficient of each of the target finite element units relative to the finite element unit to be interpolated is determined based on the Kriging equation group, and the product of the temperature value and the weight coefficient corresponding to each of the target finite element units is calculated respectively, and each of the products is added to obtain the temperature value corresponding to the finite element unit to be interpolated.

[0024] In a possible implementation, the heat generating component status information includes power consumption and occupied finite element units of each heat generating component, and the three-dimensional temperature prediction distribution diagram of the edge computing device after a preset time period is predicted based on the temperature gradient field and the heat generating component status information, including:

[0025] For each of the finite element units, an internal heat source term of the finite element unit is determined based on a heat generating component at the finite element unit, and a density, a specific heat capacity and a thermal conductivity of the finite element unit are obtained; and based on the internal heat source term, the density, the specific heat capacity, the thermal conductivity and the temperature gradient field, a discretized heat conduction equation corresponding to the finite element unit is constructed using a heat conduction equation;

[0026] For each of the finite element units, calculating a predicted temperature value of the finite element unit after the preset time period based on a discretized heat conduction equation corresponding to the finite element unit;

[0027] Generate the three-dimensional temperature prediction distribution map based on the temperature prediction values ​​corresponding to each of the finite element units;

[0028] Wherein, determining the internal heat source item of the finite element unit based on the heat generating component at the finite element unit comprises:

[0029] The number of finite element units occupied by the heat generating component at the finite element unit is determined, and the internal heat source item of the finite element unit is obtained by dividing the power consumption of the heat generating component at the finite element unit by the number of finite element units occupied by the heat generating component at the finite element unit.

[0030] In a possible implementation, generating the operating parameters of the heat dissipation device within the preset time period based on the three-dimensional temperature prediction distribution map includes:

[0031] For each of the finite element units, determining whether a temperature prediction value of the finite element unit is greater than a preset temperature value;

[0032] If so, obtaining a temperature difference between the temperature prediction value of the finite element unit and the preset temperature value, and determining the heat dissipation of the finite element unit based on the temperature difference, the specific heat capacity of the finite element unit, the volume of the finite element unit, and the density of the finite element unit;

[0033] Adding the heat dissipations to obtain a sum of the heat dissipations, and dividing the sum of the heat dissipations by the preset time length to obtain the heat dissipation power consumption corresponding to the heat dissipation device;

[0034] The operating parameter is determined based on the heat dissipation power consumption.

[0035] In a second aspect, the present application provides a heat dissipation control device for an edge computing device, comprising:

[0036] A first acquisition module, configured to acquire temperature data information through a plurality of temperature sensors evenly arranged on an edge computing device, and generate a three-dimensional temperature distribution map of the edge computing device based on the temperature data information;

[0037] An analysis module, used for performing temperature gradient analysis on the three-dimensional temperature distribution diagram to generate a temperature gradient field;

[0038] A second acquisition module is used to obtain status information of a heating component of the edge computing device;

[0039] A prediction module, configured to predict a three-dimensional temperature prediction distribution diagram of the edge computing device after a preset time period based on the temperature gradient field and the state information of the heating component;

[0040] A judgment module, used to judge whether it is necessary to perform heat dissipation processing on the edge computing device based on the three-dimensional temperature prediction distribution map;

[0041] A control module is used to generate operating parameters of the heat dissipation device within the preset time period based on the three-dimensional temperature prediction distribution map when heat dissipation treatment is required for the edge computing device, and control the heat dissipation device to perform heat dissipation treatment on the edge computing device within the preset time period based on the operating parameters.

[0042] In a third aspect, the present application provides a terminal device, comprising a processor, a memory, and a computer program stored in the memory and executable by the processor, wherein when the computer program is executed by the processor, the edge computing device heat dissipation control method as described in any of the above items is implemented.

[0043] In a fourth aspect, the present application provides a computer-readable storage medium, on which a computer program is stored, wherein when the computer program is executed by a processor, the heat dissipation control method of an edge computing device as described in any of the above items is implemented.

[0044] The present application provides a method, device, equipment and storage medium for controlling heat dissipation of edge computing equipment. The method includes: obtaining temperature data information through multiple temperature sensors evenly arranged on the edge computing equipment, and generating a three-dimensional temperature distribution map of the edge computing equipment based on the temperature data information; performing temperature gradient analysis on the three-dimensional temperature distribution map to generate a temperature gradient field; obtaining the state information of the heating component of the edge computing equipment; predicting the three-dimensional temperature prediction distribution map of the edge computing equipment after a preset time based on the temperature gradient field and the state information of the heating component; judging whether it is necessary to perform heat dissipation treatment on the edge computing equipment based on the three-dimensional temperature prediction distribution map; if necessary, generating the operating parameters of the heat dissipation device within the preset time based on the three-dimensional temperature prediction distribution map, and controlling the heat dissipation device to perform heat dissipation treatment on the edge computing equipment within the preset time based on the operating parameters. This method, on the one hand, can perform predictive heat dissipation control when the temperature of the edge computing equipment is likely to exceed the safety range, reducing the continuous operation time of the heat dissipation device, thereby effectively reducing the total energy consumption of the edge computing equipment, improving the heat dissipation efficiency, and saving costs. On the other hand, it can reduce the loss of the heat dissipation device, extend its service life, and reduce the overall power consumption of the edge computing equipment at the same time, thereby improving the long-term stability and reliability of the edge computing equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying any creative work.

[0046] Figure 1 A schematic diagram of a process flow of a heat dissipation control method for an edge computing device provided in an embodiment of the present application;

[0047] Figure 2 A schematic block diagram of the structure of the heat dissipation control device for edge computing equipment provided in an embodiment of the present application;

[0048] Figure 3 A schematic block diagram of the structure of a terminal device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0049] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0050] The flowcharts shown in the accompanying drawings are only examples and do not necessarily include all the contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps may also be decomposed, combined or partially merged, so the actual execution order may change according to actual conditions.

[0051] It should also be understood that the terms used in this application specification are only for the purpose of describing specific embodiments and are not intended to limit the application. As used in this application specification and the appended claims, unless the context clearly indicates otherwise, the singular forms "a", "an" and "the" are intended to include plural forms.

[0052] It should be further understood that the term “and / or” used in the specification and appended claims refers to any combination and all possible combinations of one or more of the associated listed items, and includes these combinations.

[0053] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0054] See also Figure 1 , Figure 1 A flow chart of a method for controlling heat dissipation of an edge computing device provided in an embodiment of the present application is shown in FIG. Figure 1 As shown, the heat dissipation control method of the edge computing device provided in the embodiment of the present application includes steps S1 to S6.

[0055] Step S1: Acquire temperature data information through multiple temperature sensors evenly distributed on an edge computing device, and generate a three-dimensional temperature distribution map of the edge computing device based on the temperature data information.

[0056] Wherein, each of the temperature sensors is evenly arranged on the edge computing device in three-dimensional space, and generating a three-dimensional temperature distribution map of the edge computing device based on the temperature data information includes the following steps:

[0057] The edge computing device is subjected to finite element segmentation processing to obtain a plurality of finite element units of the edge computing device; it can be understood that by performing finite element segmentation processing on the edge computing device, the overall space of the edge computing device is divided into a plurality of finite element units, which provides a fine calculation basis for the subsequent spatial interpolation of the temperature value, and helps to improve the effectiveness of the heat dissipation control method;

[0058] For each temperature value in the temperature data information, determine the finite element unit corresponding to the temperature value as the target finite element unit, and determine the remaining finite element units except the target finite element unit as the finite element units to be interpolated; specifically, the finite element unit where the test point of the temperature sensor corresponding to the temperature value is located is the finite element unit corresponding to the temperature value;

[0059] For each of the finite element units to be interpolated, determine the temperature value corresponding to the finite element unit to be interpolated based on the temperature value corresponding to each of the target finite element units;

[0060] The three-dimensional temperature distribution diagram is generated based on the temperature values ​​corresponding to each of the finite element units; specifically, for each of the finite element units, the finite element units are colored and rendered based on the temperature values ​​corresponding to the finite element units. It can be understood that different temperature values ​​correspond to different colors.

[0061] Wherein, determining the temperature value corresponding to the finite element unit to be interpolated based on the temperature value corresponding to each of the target finite element units comprises the following steps:

[0062] Perform binary combination on each of the target finite element units to obtain a plurality of binary combination pairs; it can be understood that the plurality of binary combination pairs are all possible combination pairs of the binary combination of each of the target finite element units;

[0063] For each of the binary combination pairs, obtain the distance value between the two target finite element units in the binary combination pair; specifically, construct a spatial rectangular coordinate system with the specified point of the edge computing device as the origin, and determine the coordinate points of the two target finite element units in the binary combination pair in the spatial rectangular coordinate system, and use the distance value between the two coordinate points as the distance value between the two target finite element units;

[0064] For each of the distance values, based on each binary combination pair corresponding to the distance value, a semivariogram function value corresponding to the distance value is obtained; specifically, a sum of squares of temperature differences between two target finite element units corresponding to each binary combination pair is obtained, and the sum of squares is divided by twice the number of binary combination pairs corresponding to the distance value to obtain a semivariogram function value corresponding to the distance value;

[0065] Based on the semivariogram values ​​corresponding to the distance values, a fitting curve of the semivariogram value changing with the distance value is constructed;

[0066] Based on the fitting curve, a Kriging equation group corresponding to the finite element unit to be interpolated is constructed, and based on the Kriging equation group, a weight coefficient of each target finite element unit relative to the finite element unit to be interpolated is determined, and the product of the temperature value and the weight coefficient corresponding to each target finite element unit is calculated respectively, and each of the products is added to obtain the temperature value corresponding to the finite element unit to be interpolated; specifically, the Kriging equation group is shown in formula (1);

[0067] (1)

[0069] in, λ i is the weight coefficient to be determined of the i-th target finite element unit relative to the finite element unit to be interpolated;

[0070] γ xi，xj is the semivariogram function value between the i-th target finite element unit and the j-th target finite element unit, which can be obtained through the fitting curve;

[0071] γ xj，X is the semivariogram function value between the j-th target finite element unit and the finite element unit to be interpolated, which can be obtained through the fitting curve;

[0072] μ is the Lagrange multiplier;

[0073] The temperature value of the finite element unit to be differentiated is shown in formula (2);

[0074] (2)

[0076] in, T(X) is the temperature value of the finite element unit to be interpolated;

[0077] λ i is the weight coefficient of the i-th target finite element unit relative to the finite element unit to be interpolated;

[0078] T i is the temperature value corresponding to the i-th finite element unit.

[0079] It can be understood that the method provided in step S1, using the Kriging interpolation method, can generate a three-dimensional temperature distribution map with high spatial continuity inside the edge computing device, avoiding the loss of accuracy caused by simple linear interpolation, and helping to improve the control accuracy of the heat dissipation control method.

[0080] Step S2: performing temperature gradient analysis on the three-dimensional temperature distribution diagram to generate a temperature gradient field.

[0081] Specifically, based on the spatial derivative of the temperature field corresponding to the three-dimensional temperature distribution diagram, the partial derivatives of the center points of each finite element unit of the three-dimensional temperature distribution diagram are calculated respectively by using the central difference method to obtain the temperature gradient field.

[0082] Step S3: Obtain status information of the heating components of the edge computing device.

[0083] The state information of the heating components includes the power consumption of each heating component and the finite element unit occupied. The power consumption of the heating component is obtained through component specification information or by obtaining the product of the voltage and current of the heating component. The heating components include but are not limited to the CPU, GPU and power module of the edge computing device.

[0084] Step S4: predicting a three-dimensional temperature prediction distribution diagram of the edge computing device after a preset time period based on the temperature gradient field and the state information of the heating component.

[0085] Specifically, step S4 includes the following steps:

[0086] For each of the finite element units, the internal heat source term of the finite element unit is determined based on the heat-generating component at the finite element unit, and the density, specific heat capacity and thermal conductivity of the finite element unit are obtained, and based on the internal heat source term, the density, the specific heat capacity, the thermal conductivity and the temperature gradient field, a discretized heat conduction equation corresponding to the finite element unit is constructed using a heat conduction equation; wherein the density, specific heat capacity and thermal conductivity of the finite element unit are obtained through product specification information of an edge computing device; it should be noted that constructing a discretized heat conduction equation is a prior art and will not be described in detail here;

[0087] For each of the finite element units, calculating a predicted temperature value of the finite element unit after the preset time period based on a discretized heat conduction equation corresponding to the finite element unit;

[0088] The three-dimensional temperature prediction distribution diagram is generated based on the temperature prediction values ​​corresponding to each of the finite element units; specifically, for each of the finite element units, the finite element units are colored and rendered based on the temperature prediction values ​​corresponding to the finite element units, and it can be understood that different temperature prediction values ​​correspond to different colors;

[0089] Wherein, determining the internal heat source item of the finite element unit based on the heat generating component at the finite element unit comprises:

[0090] Determine the number of finite element units occupied by the heat-generating component at the finite element unit, and divide the power consumption of the heat-generating component at the finite element unit by the number of finite element units occupied by the heat-generating component at the finite element unit to obtain the internal heat source item of the finite element unit; it can be understood that when there is no heat-generating component at the finite element unit, the internal heat source item corresponding to the finite element unit is 0.

[0091] Step S5: determine whether heat dissipation processing is required for the edge computing device based on the three-dimensional temperature prediction distribution map.

[0092] Specifically, the temperature prediction value of each finite element unit of the three-dimensional temperature prediction distribution diagram is compared with the preset temperature value. If the temperature prediction value of any finite element unit is greater than the preset temperature value, it is determined that the edge computing device needs to be cooled.

[0093] Step S6: If necessary, generate operating parameters of the heat dissipation device within the preset time period based on the three-dimensional temperature prediction distribution map, and control the heat dissipation device to perform heat dissipation processing on the edge computing device within the preset time period based on the operating parameters.

[0094] The step of generating the operating parameters of the heat dissipation device within the preset time period based on the three-dimensional temperature prediction distribution graph comprises the following steps:

[0095] For each of the finite element units, determining whether a temperature prediction value of the finite element unit is greater than a preset temperature value;

[0096] If yes, obtain the temperature difference between the temperature prediction value of the finite element unit and the preset temperature value, and determine the heat dissipation of the finite element unit based on the temperature difference, the specific heat capacity of the finite element unit, the volume of the finite element unit and the density of the finite element unit; specifically, multiply the temperature difference, the specific heat capacity of the finite element unit, the volume of the finite element unit and the density of the finite element unit to obtain the heat dissipation of the finite element unit;

[0097] Adding the heat dissipations to obtain a sum of the heat dissipations, and dividing the sum of the heat dissipations by the preset time length to obtain the heat dissipation power consumption corresponding to the heat dissipation device;

[0098] The operating parameters are determined based on the heat dissipation power consumption; specifically, the operating parameters are determined by the power consumption model of the heat dissipation device and the heat dissipation power consumption, and the power consumption model of the heat dissipation device is obtained by the specification information of the heat dissipation device. Exemplarily, the heat dissipation device is a fan, and the power consumption model of the heat dissipation device is P=K.ω 3, where P is the power consumption of the fan in watts (W), ω is the speed of the fan in revolutions per second (rps), and K is a constant related to the fan characteristics. The heat dissipation power consumption is used to replace P in the power consumption model, and then ω is calculated to obtain the operating parameters of the fan. It can be understood that by determining the operating parameters through the heat dissipation power consumption, on the one hand, the heat dissipation device can be stably operated within the preset time period, and on the other hand, the heat dissipation device can be maintained at a low power consumption as much as possible while dissipating heat.

[0099] The method provided in this embodiment, on the one hand, can perform predictive heat dissipation regulation when the temperature of the edge computing device is likely to exceed the safe range, reducing the continuous operation time of the heat dissipation device, thereby effectively reducing the total energy consumption of the device, improving the heat dissipation efficiency, and saving costs; on the other hand, it can reduce the loss of the heat dissipation device, extend its service life, and at the same time reduce the overall power consumption of the edge computing device, thereby improving the long-term stability and reliability of the edge computing device.

[0100] See also Figure 2 , Figure 2 A schematic block diagram of the structure of the edge computing device heat dissipation control device 100 provided in an embodiment of the present application is shown in FIG. Figure 2 As shown, the edge computing device heat dissipation control device 100 provided in the embodiment of the present application includes:

[0101] The first acquisition module 110 is used to acquire temperature data information through a plurality of temperature sensors evenly distributed on the edge computing device, and generate a three-dimensional temperature distribution map of the edge computing device based on the temperature data information.

[0102] The analysis module 120 is used to perform temperature gradient analysis on the three-dimensional temperature distribution diagram to generate a temperature gradient field.

[0103] The second acquisition module 130 is used to obtain status information of a heating component of the edge computing device.

[0104] The prediction module 140 is used to predict the three-dimensional temperature prediction distribution diagram of the edge computing device after a preset time period based on the temperature gradient field and the state information of the heating component.

[0105] The judgment module 150 is used to judge whether it is necessary to perform heat dissipation processing on the edge computing device based on the three-dimensional temperature prediction distribution map.

[0106] The control module 160 is used to generate operating parameters of the heat dissipation device within the preset time period based on the three-dimensional temperature prediction distribution map if heat dissipation treatment is required for the edge computing device, and control the heat dissipation device to perform heat dissipation treatment on the edge computing device within the preset time period based on the operating parameters.

[0107] It should be noted that technical personnel in the relevant technical field can clearly understand that, for the convenience and conciseness of description, the specific working process of the above-described device and each module can refer to the corresponding process in the aforementioned edge computing device heat dissipation control method embodiment, and will not be repeated here.

[0108] The edge computing device heat dissipation control device 100 provided in the above embodiment can be implemented in the form of a computer program. The computer program can be used in Figure 3 The system is run on the terminal device 200 shown.

[0109] See also Figure 3 , Figure 3 The present invention provides a schematic block diagram of the structure of a terminal device 200 according to an embodiment of the present application. The terminal device 200 includes a processor 201 and a memory 202. The processor 201 and the memory 202 are connected via a device bus 203, wherein the memory 202 may include a non-volatile storage medium and an internal memory.

[0110] The non-volatile storage medium can store a computer program. The computer program includes program instructions, and when the program instructions are executed by the processor 201, the processor 201 can execute any of the above-mentioned edge computing device heat dissipation control methods.

[0111] The processor 201 is used to provide computing and control capabilities to support the operation of the entire terminal device 200.

[0112] The internal memory provides an environment for the operation of the computer program in the non-volatile storage medium. When the computer program is executed by the processor 201, the processor 201 can execute any of the above-mentioned edge computing device heat dissipation control methods.

[0113] Those skilled in the art will understand that Figure 3 The structure shown in the figure is only a block diagram of a partial structure related to the scheme of the present application, and does not constitute a limitation on the terminal device 200 involved in the scheme of the present application. The specific terminal device 200 may include more or fewer components than shown in the figure, or combine certain components, or have a different component arrangement.

[0114] It should be understood that the processor 201 may be a central processing unit (CPU), and the processor 201 may also be other general-purpose processors, digital signal processors (DSP), application-specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. Among them, the general-purpose processor may be a microprocessor or the processor may also be any conventional processor, etc.

[0115] In some embodiments, the processor 201 is used to run a computer program stored in the memory to implement the following steps:

[0116] Acquire temperature data information through a plurality of temperature sensors evenly arranged on the edge computing device, and generate a three-dimensional temperature distribution map of the edge computing device based on the temperature data information;

[0117] Performing temperature gradient analysis on the three-dimensional temperature distribution diagram to generate a temperature gradient field;

[0118] Obtaining status information of a heat generating component of the edge computing device;

[0119] Predicting a three-dimensional temperature prediction distribution diagram of the edge computing device after a preset time period based on the temperature gradient field and the state information of the heat generating component;

[0120] Determining whether heat dissipation processing is required for the edge computing device based on the three-dimensional temperature prediction distribution map;

[0121] If necessary, the operating parameters of the heat dissipation device within the preset time period are generated based on the three-dimensional temperature prediction distribution map, and the heat dissipation device is controlled to perform heat dissipation processing on the edge computing device within the preset time period based on the operating parameters.

[0122] It should be noted that technical personnel in the relevant field can clearly understand that for the convenience and conciseness of description, the specific working process of the terminal device 200 described above can refer to the corresponding process of the aforementioned edge computing device heat dissipation control method, and will not be repeated here.

[0123] An embodiment of the present application also provides a computer-readable storage medium, which stores a computer program. When the computer program is executed by one or more processors, the one or more processors implement the edge computing device heat dissipation control method provided in the embodiment of the present application.

[0124] The computer-readable storage medium may be an internal storage unit of the terminal device 200 in the aforementioned embodiment, such as a hard disk or memory of the terminal device 200. The computer-readable storage medium may also be an external storage device of the terminal device 200, such as a plug-in hard disk, a smart memory card (Smart Media Card, SMC), a secure digital (Secure Digital, SD) card, a flash card (Flash Card), etc. equipped with the terminal device 200.

[0125] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, and these modifications or replacements should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A method for controlling heat dissipation of an edge computing device, characterized in that: include: Acquire temperature data information through a plurality of temperature sensors evenly arranged on the edge computing device, and generate a three-dimensional temperature distribution map of the edge computing device based on the temperature data information; Performing temperature gradient analysis on the three-dimensional temperature distribution diagram to generate a temperature gradient field; Obtaining status information of a heat generating component of the edge computing device; Predicting a three-dimensional temperature prediction distribution diagram of the edge computing device after a preset time period based on the temperature gradient field and the state information of the heat generating component; Determining whether heat dissipation processing is required for the edge computing device based on the three-dimensional temperature prediction distribution map; If necessary, generating operating parameters of the heat dissipation device within the preset time period based on the three-dimensional temperature prediction distribution map, and controlling the heat dissipation device to perform heat dissipation processing on the edge computing device within the preset time period based on the operating parameters; Wherein, generating a three-dimensional temperature distribution map of the edge computing device based on the temperature data information includes: Performing finite element segmentation processing on the edge computing device to obtain multiple finite element units of the edge computing device; For each temperature value in the temperature data information, determining a finite element unit corresponding to the temperature value as a target finite element unit, and determining other finite element units except the target finite element unit as finite element units to be interpolated; For each of the finite element units to be interpolated, determine the temperature value corresponding to the finite element unit to be interpolated based on the temperature value corresponding to each of the target finite element units; Generate the three-dimensional temperature distribution map based on the temperature values ​​corresponding to each of the finite element units; The determining the temperature value corresponding to the to-be-interpolated finite element unit based on the temperature value corresponding to each of the target finite element units includes: Perform binary combination on each of the target finite element units to obtain a plurality of binary combination pairs; For each of the binary combination pairs, obtaining a distance value between two target finite element units in the binary combination pair; For each of the distance values, based on each binary combination pair corresponding to the distance value, obtain a semivariogram function value corresponding to the distance value; Based on the semivariogram values ​​corresponding to the distance values, a fitting curve of the semivariogram value changing with the distance value is constructed; A Kriging equation group corresponding to the finite element unit to be interpolated is constructed based on the fitting curve, and a weight coefficient of each of the target finite element units relative to the finite element unit to be interpolated is determined based on the Kriging equation group, and the product of the temperature value and the weight coefficient corresponding to each of the target finite element units is calculated respectively, and each of the products is added to obtain the temperature value corresponding to the finite element unit to be interpolated.

2. The heat dissipation control method for edge computing equipment according to claim 1, characterized in that: The heat generating component status information includes the power consumption of each heat generating component and the finite element unit occupied. The three-dimensional temperature prediction distribution diagram of the edge computing device after a preset time period is predicted based on the temperature gradient field and the heat generating component status information, including: For each of the finite element units, an internal heat source term of the finite element unit is determined based on a heat generating component at the finite element unit, and a density, a specific heat capacity and a thermal conductivity of the finite element unit are obtained; and based on the internal heat source term, the density, the specific heat capacity, the thermal conductivity and the temperature gradient field, a discretized heat conduction equation corresponding to the finite element unit is constructed using a heat conduction equation; For each of the finite element units, calculating a predicted temperature value of the finite element unit after the preset time period based on a discretized heat conduction equation corresponding to the finite element unit; Generate the three-dimensional temperature prediction distribution map based on the temperature prediction values ​​corresponding to each of the finite element units; Wherein, determining the internal heat source item of the finite element unit based on the heat generating component at the finite element unit comprises: The number of finite element units occupied by the heat generating component at the finite element unit is determined, and the internal heat source item of the finite element unit is obtained by dividing the power consumption of the heat generating component at the finite element unit by the number of finite element units occupied by the heat generating component at the finite element unit.

3. The heat dissipation control method for edge computing equipment according to claim 2, characterized in that: The generating the operating parameters of the heat dissipation device within the preset time period based on the three-dimensional temperature prediction distribution map includes: For each of the finite element units, determining whether a temperature prediction value of the finite element unit is greater than a preset temperature value; If so, obtaining a temperature difference between the predicted temperature value of the finite element unit and the preset temperature value, and determining the heat dissipation of the finite element unit based on the temperature difference, the specific heat capacity of the finite element unit, the volume of the finite element unit, and the density of the finite element unit; Adding the heat dissipations to obtain a sum of the heat dissipations, and dividing the sum of the heat dissipations by the preset time length to obtain the heat dissipation power consumption corresponding to the heat dissipation device; The operating parameter is determined based on the heat dissipation power consumption.

4. A heat dissipation control device for edge computing equipment, characterized in that: include: A first acquisition module, configured to acquire temperature data information through a plurality of temperature sensors evenly arranged on an edge computing device, and generate a three-dimensional temperature distribution map of the edge computing device based on the temperature data information; An analysis module, used for performing temperature gradient analysis on the three-dimensional temperature distribution diagram to generate a temperature gradient field; A second acquisition module is used to obtain status information of a heating component of the edge computing device; A prediction module, configured to predict a three-dimensional temperature prediction distribution diagram of the edge computing device after a preset time period based on the temperature gradient field and the state information of the heating component; A judgment module, used to judge whether it is necessary to perform heat dissipation processing on the edge computing device based on the three-dimensional temperature prediction distribution map; A control module, configured to generate operating parameters of a heat dissipation device within the preset time period based on the three-dimensional temperature prediction distribution map if heat dissipation processing is required for the edge computing device, and control the heat dissipation device to perform heat dissipation processing on the edge computing device within the preset time period based on the operating parameters; Wherein, generating a three-dimensional temperature distribution map of the edge computing device based on the temperature data information includes: Performing finite element segmentation processing on the edge computing device to obtain multiple finite element units of the edge computing device; For each temperature value in the temperature data information, determining a finite element unit corresponding to the temperature value as a target finite element unit, and determining other finite element units except the target finite element unit as finite element units to be interpolated; For each of the finite element units to be interpolated, determine the temperature value corresponding to the finite element unit to be interpolated based on the temperature value corresponding to each of the target finite element units; Generate the three-dimensional temperature distribution map based on the temperature values ​​corresponding to each of the finite element units; The determining the temperature value corresponding to the to-be-interpolated finite element unit based on the temperature value corresponding to each of the target finite element units includes: Perform binary combination on each of the target finite element units to obtain a plurality of binary combination pairs; For each of the binary combination pairs, obtaining a distance value between two target finite element units in the binary combination pair; For each of the distance values, based on each binary combination pair corresponding to the distance value, obtain a semivariogram function value corresponding to the distance value; Based on the semivariogram values ​​corresponding to the distance values, a fitting curve of the semivariogram value changing with the distance value is constructed; A Kriging equation group corresponding to the finite element unit to be interpolated is constructed based on the fitting curve, and a weight coefficient of each of the target finite element units relative to the finite element unit to be interpolated is determined based on the Kriging equation group, and the product of the temperature value and the weight coefficient corresponding to each of the target finite element units is calculated respectively, and each of the products is added to obtain the temperature value corresponding to the finite element unit to be interpolated.

5. A terminal device, characterized in that: The terminal device includes a processor, a memory, and a computer program stored in the memory and executable by the processor, wherein when the computer program is executed by the processor, the heat dissipation control method of the edge computing device as described in any one of claims 1 to 3 is implemented.

6. A computer-readable storage medium, characterized in that: A computer program is stored on the computer-readable storage medium, wherein when the computer program is executed by a processor, the heat dissipation control method for an edge computing device as described in any one of claims 1 to 3 is implemented.

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