Ultrasonic touch sensor with backlight

Abstract

The invention relates to an ultrasonic touch sensor with backlight. The ultrasonic touch sensor comprises: a housing having a packaging cavity; an ultrasonic transmitter disposed within the encapsulation cavity and configured to transmit an ultrasonic transmit wave; an ultrasonic receiver disposed within the encapsulation cavity and configured to receive a reflected ultrasonic wave generated by reflection of the transmitted ultrasonic wave and to generate a measurement signal representing the reflected ultrasonic wave; a measurement circuit disposed within the encapsulation cavity and coupled to the ultrasonic receiver, and configured to detect a touch or a non-touch based on the measurement signal; a light source configured to generate activation light; and a coupling medium which fills or at least partially fills the packaging cavity. The coupling medium includes a luminescent material configured to be activated by the activation light to produce backlight emanating from the encapsulation cavity.

Description

Background Art

[0001] Touch sensing using ultrasound through metal surfaces is currently being investigated as an alternative to capacitive touch sensing. Ultrasonic sensing relies on the emission of ultrasound directed at a touch structure, and the reception and processing of a reflected waveform reflected from the touch structure. The characteristics of the reflected waveform will depend on the presence or absence of a touch event, and can be used to discriminate the presence or absence of a touch event. Summary of the invention

[0002] In some implementations, an ultrasonic touch sensor includes: a shell having a packaging cavity; an ultrasonic transmitter arranged in the packaging cavity, wherein the ultrasonic transmitter is configured to transmit an ultrasonic transmission wave; an ultrasonic receiver arranged in the packaging cavity, wherein the ultrasonic receiver is configured to receive an ultrasonic reflection wave generated by reflection of the ultrasonic transmission wave and generate a measurement signal representing the ultrasonic reflection wave; a measurement circuit arranged in the packaging cavity and coupled to the ultrasonic receiver, wherein the measurement circuit is configured to detect touch or non-touch based on the measurement signal; a light source configured to generate activation light; and a coupling medium that at least partially fills the packaging cavity, wherein the coupling medium includes a luminescent material that is configured to be activated by the activation light to generate backlight emitted from the packaging cavity.

[0003] In some implementations, an ultrasonic touch system includes: a shell having a first packaging cavity and a second packaging cavity; a first ultrasonic transmitter, which is arranged in the first packaging cavity; a first ultrasonic receiver, which is arranged in the first packaging cavity and is acoustically coupled to the first ultrasonic transmitter; a second ultrasonic transmitter, which is arranged in the second packaging cavity; a second ultrasonic receiver, which is arranged in the second packaging cavity and is acoustically coupled to the second ultrasonic transmitter; a first activation light source, which is configured to generate a first activation light; a first coupling medium, which at least partially fills the first packaging cavity, wherein the first coupling medium includes a first luminescent material, which is configured to be activated by the first activation light to generate a first backlight emitted from the first packaging cavity; and a second coupling medium, which at least partially fills the second packaging cavity, wherein the second coupling medium includes a second luminescent material, which is configured to be activated by the first activation light to generate a second backlight emitted from the second packaging cavity.

[0004] In some implementations, the ultrasonic touch sensor includes: a touch structure arranged above a package cavity, wherein the touch structure includes a touch surface and an inner surface; a flexible circuit substrate having a front side and a back side coupled to the inner surface of the touch structure; an ultrasonic transmitter coupled to the back side of the flexible circuit substrate and configured to transmit an ultrasonic transmission wave toward the touch structure; an ultrasonic receiver coupled to the back side of the flexible circuit substrate and configured to receive an ultrasonic reflection wave generated by reflection of the ultrasonic transmission wave at the touch structure and generate a measurement signal representing the ultrasonic reflection wave; a measurement circuit coupled to the back side of the flexible circuit substrate and to the ultrasonic receiver, wherein the measurement circuit is configured to detect touch or non-touch based on the measurement signal; a light source coupled to the back side of the flexible circuit substrate and configured to generate activation light; and a coupling medium at least partially filling the package cavity, wherein the coupling medium couples the ultrasonic transmitter and the ultrasonic receiver to the touch structure, and wherein the coupling medium includes a luminescent material configured to be activated by the activation light to generate backlight emitted from the package cavity. BRIEF DESCRIPTION OF THE DRAWINGS

[0005] Various implementations are described herein with reference to the accompanying drawings.

[0006] Figure 1 An ultrasonic touch sensor is illustrated in accordance with one or more implementations.

[0007] Figure 2 An ultrasonic touch sensor is illustrated in accordance with one or more implementations.

[0008] Figure 3 An ultrasonic touch sensor is illustrated in accordance with one or more implementations.

[0009] Figure 4 An ultrasonic touch sensor is illustrated in accordance with one or more implementations.

[0010] Figure 5 Illustrated is a cross-section of an ultrasonic touch sensor according to one or more implementations.

[0011] Figure 6 Illustrated is a cross-section of an ultrasonic touch sensor according to one or more implementations.

[0012] Fig. 7A Illustrated is a cross-section of an ultrasonic touch sensor according to one or more implementations.

[0013] Figure 7B Illustrated is a cross-section of an ultrasonic touch sensor according to one or more implementations.

[0014] Figure 7CIllustrated is a cross-section of an ultrasonic touch sensor according to one or more implementations.

[0015] Fig.7D Illustrated is a cross-section of an ultrasonic touch sensor according to one or more implementations.

[0016] Figure 8 Illustrated is a cross-section of an ultrasonic touch sensor according to one or more implementations.

[0017] Fig. 9 Illustrated is a cross-section of an ultrasonic touch sensor according to one or more implementations.

[0018] Fig.10 Illustrated is a cross-section of an ultrasonic touch sensor according to one or more implementations.

[0019] Fig.11A A cross-section of an ultrasonic touch system is illustrated in accordance with one or more implementations.

[0020] Fig. 11B A cross-section of an ultrasonic touch system is illustrated according to one or more implementations.

[0021] Fig.12 Illustrated is a cross-section of an ultrasonic touch sensor according to one or more implementations. DETAILED DESCRIPTION

[0022] In the following, details will be set forth to provide a more detailed explanation of example implementations. However, it will be clear to those skilled in the art that these implementations can be practiced without these specific details. In other examples, well-known structures and devices are shown in block diagram form or schematic diagrams rather than being shown in detail to avoid obscuring the implementations. In addition, unless otherwise explicitly stated, the features of the different implementations described below can be combined with each other.

[0023] In addition, in the following description, equivalent or similar elements or elements having equivalent or similar functions are indicated by equivalent or similar reference numerals. Since the same or functionally equivalent elements are given the same reference numerals in the drawings, repeated descriptions of the elements having the same reference numerals may be omitted. Therefore, the descriptions provided for the elements having the same or similar reference numerals are mutually interchangeable.

[0024] Each of the illustrated x-axis, y-axis, and z-axis is substantially perpendicular to the other two axes. In other words, the x-axis is substantially perpendicular to the y-axis and the z-axis, the y-axis is substantially perpendicular to the x-axis and the z-axis, and the z-axis is substantially perpendicular to the x-axis and the y-axis. In some cases, a single reference numeral is shown to refer to a surface, or less than all instances of a portion may be labeled with all surfaces of the portion. Although not every surface is labeled, all instances of the portion may include the associated surface of the portion.

[0025] The orientation of various elements in the drawings is shown as an example, and the illustrated examples can be rotated relative to the depicted orientation. The description provided herein and the subsequent claims relate to any structure having the described relationship between various features, whether the structure is in a specific orientation of the drawing or rotated relative to the orientation. Similarly, for ease of description, the spatial relative terms such as "top", "bottom", "below", "below", "lower", "above", "upper", "middle", "left side" and "right side" used herein describe the relationship between an element illustrated in the figure and one or more other elements, as shown in the figure. In addition to the orientation depicted in the figure, the spatial relative terms are also intended to cover different orientations of elements, structures and / or components in use or operation. Structures and / or components can be oriented in other ways (rotated 90 degrees or in other orientations), and the spatial relative descriptors used herein can be interpreted accordingly. In addition, in order to simplify the drawings, unless otherwise indicated, the cross-sectional views in the figures only show the features in the cross-sectional plane, without showing the material behind the cross-sectional plane.

[0026] It should be understood that when an element is referred to as being "connected" or "coupled" to another element, it may be directly connected or coupled to the other element or there may be intervening elements. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements. Other words used to describe relationships between elements (e.g., "between" versus "directly between," "adjacent to" versus "directly adjacent to," etc.) should be interpreted in a similar manner.

[0027] In the implementations described herein or shown in the accompanying drawings, any direct electrical connection or coupling (e.g., any connection or coupling without additional intermediate elements) may also be implemented through an indirect connection or coupling (e.g., a connection or coupling with one or more additional intermediate elements, or vice versa), as long as the general purpose of the connection or coupling (e.g., for transmitting a certain signal or transmitting certain information) is basically maintained. Features from different implementations may be combined to form further implementations. For example, unless otherwise indicated, changes or modifications described for one implementation may also apply to other implementations.

[0028] As used herein, the terms "substantially" and "approximately" mean "within reasonable tolerances of manufacturing and measurement." For example, the terms "substantially" and "approximately" may be used herein to account for smaller manufacturing tolerances or other factors (e.g., within 5%) that are considered industry acceptable without departing from the implementations described herein. For example, a resistor having an approximate resistance value may actually have a resistance within 5% of the approximate resistance value. As another example, a signal having an approximate signal value may actually have a signal value within 5% of the approximate signal value.

[0029] In the present disclosure, expressions including ordinal numbers, such as "first", "second", etc., can modify various elements. However, these elements are not limited by these expressions. For example, these expressions do not limit the order and / or importance of the elements. In addition, these expressions are only used for the purpose of distinguishing elements from other elements. For example, the first box and the second box indicate different boxes, although both are boxes. By further example, the first element can be referred to as the second element, and similarly, the second element can also be referred to as the first element without departing from the scope of the present disclosure.

[0030] "Sensor" may refer to a component that converts a property to be measured into an electrical signal (e.g., a current signal or a voltage signal). The property to be measured may include, for example, a magnetic field, an electric field, an electromagnetic wave (e.g., a radio wave), a pressure, a force, a current, or a voltage, but is not limited thereto. For an ultrasonic touch sensor, the property to be measured is, for example, an ultrasonic wave generated by a microelectromechanical system (MEMS) transducer. The ultrasonic wave may be directed to a touch structure, where the ultrasonic wave is reflected back by the touch structure as a reflected ultrasonic wave. The reflected ultrasonic wave may be used to sense a touch (e.g., a touch event) at a touch surface of the touch structure. Specifically, the ultrasonic touch sensor may use the reflected ultrasonic wave to distinguish between the presence of a touch event or the absence of a touch event (e.g., no touch event).

[0031] The ultrasonic touch sensor has a touch structure having a touch surface that is sensitive to touch. However, in dark and low-light environments, the touch surface may be difficult to see, which makes it difficult to locate the touch surface.

[0032] Some implementations disclosed herein are directed to an ultrasonic touch sensor, which includes an acoustic coupling gel arranged inside a package cavity of the ultrasonic touch sensor. The acoustic coupling gel includes a luminescent material. The ultrasonic touch sensor also includes a light source (e.g., an activation light source) that generates an activation light for activating the luminescent material in the acoustic coupling gel to generate a backlight. Therefore, the acoustic coupling gel is configured to be activated by the activation light to generate a backlight, and the backlight is emitted from the package cavity to make the touch surface easier to identify. For example, the touch structure can be optically transparent, or can include an optically transparent area that is transparent to the backlight, so that the backlight is emitted from the ultrasonic touch sensor through the touch structure. By turning on the light source, the acoustic coupling gel emits a backlight, which can be used as a position indicator of the ultrasonic touch sensor.

[0033] Figure 1 An ultrasonic touch sensor 100 according to one or more implementations is illustrated. The ultrasonic touch sensor 100 includes a housing including a frame 101 and a touch structure 102 (e.g., a touch substrate) that form an encapsulation cavity 103. The frame 101 can be made of an encapsulant, such as an overmolded thermoplastic or another type of molding material. As part of the housing, the frame 101 can have a groove that becomes the encapsulation cavity 103 when the touch structure 102 closes the groove. In some implementations, a portion of the frame 101 can extend into the encapsulation cavity 103 and fill the encapsulation cavity 103, thereby covering one or more sensor components disposed therein. The groove can be cast using epoxy or some other ultrasound compatible material. The area of ​​the housing in which the ultrasonic transducer is located can be referred to as an acoustic port, an ultrasonic port, an acoustic chamber, an ultrasonic chamber, or the like.

[0034] The touch structure 102 can be used as a cover or packaging cover that rests on the touch side of the ultrasonic touch sensor 100. In the example shown, the packaging cavity 103 is an internal area enclosed by the frame 101 and the touch structure 102. The touch structure 102 can be made of one or more metal layers, one or more plastic layers, and / or one or more layers of other solid materials. Therefore, the touch structure 102 can be a cover coupled to the frame 101, and the packaging cavity 103 can be an internal area at least partially defined by the touch structure 102 (e.g., an internal area defined between the frame 101 and the touch structure 102). The touch structure 102 includes a touch surface 104 at the external interface of the touch structure and the environment. The touch surface 104 is arranged and operable to receive contact (e.g., touch) from a user that can be detected by the sensor circuit device.

[0035] In some implementations, the lateral sides of the frame 101 may be at least partially open so that the encapsulation cavity 103 is not a completely enclosed volume. For example, the lateral sides of the frame 101 may include columns that support the touch structure 102, and / or the touch structure 102 may be supported by a coupling medium (such as a film layer, silicone, or soft epoxy). For example, a coupling medium may be provided in the encapsulation cavity 103 and may be mechanically coupled between the circuit substrate at the bottom side of the encapsulation cavity 103 and the touch structure 102 at the top side of the encapsulation cavity 103 to provide support for the touch structure 102. In some implementations, the lateral sides of the encapsulation cavity 103 may be completely open, while the lateral sides of the frame 101 do not exist, and the touch structure 102 may be partially or completely supported by the coupling medium. Therefore, in the case where the lateral sides of the encapsulation cavity 103 are completely open, the coupling medium may be rigid enough to support the touch structure 102.

[0036] Package cavity 103 contains sensor circuitry for detecting no-touch events and touch events at touch surface 104. A touch event is an instance when a user makes contact with touch surface 104, while a no-touch event is any other instance, including the presence of interfering influences (e.g., error sources) that may occur in the absence of a touch event. The sensor circuitry is configured to distinguish between touch events and no-touch events while taking into account possible errors originating from interfering influences.

[0037] Ultrasonic waves are sound waves with a frequency of 20 kHz or higher. When ultrasonic waves are transmitted by a transmitter, they may be referred to as ultrasonic transmission waves, and when ultrasonic waves have been reflected by the touch structure 102 for reception at a receiver, they may be referred to as ultrasonic reflection waves. The sensor circuit device includes a transmitter (TX) 105 configured to transmit ultrasonic waves (e.g., ultrasonic transmission waves), a receiver (RX) 106 configured to receive reflected ultrasonic waves (e.g., ultrasonic reflection waves), and a sensor circuit 107 (e.g., an application-specific integrated circuit (ASIC)). The sensor circuit 107 may be configured to generate ultrasonic waves for transmission by the transmitter 105, and to perform signal processing on the reflected ultrasonic waves received by the receiver 106. In some implementations, the sensor circuit 107 may be configured to evaluate the reflected ultrasonic waves to detect no-touch events and touch events by applying a first touch detection algorithm, and to control one or more components of the ultrasonic touch sensor 100, including any signal processing components of the signal processing chain of the transmitter 105, the receiver 106, or the sensor circuit 107. In some implementations, the sensor circuit 107 can evaluate additional properties of the ultrasonic touch sensor 100 from which the measurement signal is obtained (e.g., internal pressure, bias voltage, or cross-coupling effects), and evaluate the additional properties by applying the second touch detection algorithm for detecting no-touch events and touch events. In some implementations, the first touch detection algorithm and the second touch detection algorithm can be used in combination for detecting no-touch events and touch events.

[0038] Both the transmitter 105 and the receiver 106 may be acoustic transducers having a flexible membrane that vibrates to generate acoustic waves (in the case of the transmitter 105) or in response to receiving acoustic waves (in the case of the receiver 106). Specifically, the transmitter 105 and the receiver 106 may be capacitive micromachined ultrasonic transducers (CMUTs) or piezoelectric micromachined ultrasonic transducers (PMUTs). In some implementations, the transmitter 105 and the receiver 106 may be combined into a single transceiver transducer having a single flexible membrane.

[0039] A CMUT is a MEMS transducer in which energy conversion is caused by a change in capacitance. A CMUT is constructed on silicon using micromachining techniques. A cavity can be formed in a silicon substrate, which serves as a first electrode of a capacitor. A thin layer suspended on top of the cavity serves as a flexible membrane, and a conductive layer on the flexible membrane serves as a second electrode of the capacitor. The first and second electrodes of the capacitor are biased with a bias voltage (e.g., a DC bias voltage), which establishes the initial operating conditions of the MEMS transducer. Therefore, the first and second electrodes of the capacitor can be referred to as bias electrodes.

[0040] When an AC signal is applied to the bias electrode of the capacitor, the AC signal is superimposed on the bias voltage. As a result, the flexible diaphragm will vibrate and generate ultrasonic waves in the medium of interest. In this way, the CMUT works as a transmitter. The sensor circuit 107 is configured to generate an excitation signal (e.g., an acoustic excitation signal) and transmit the excitation signal to the transmitter 105. The excitation signal is applied to the bias electrode so that the flexible diaphragm vibrates according to the waveform of the excitation signal and generates corresponding ultrasonic waves. Different excitation signals induce different ultrasonic waves. Therefore, the excitation signal is a signal applied by the sensor circuit 107 to the transmitter 105 to generate an ultrasonic wave, which is used to detect a touch event at the touch surface 104 of the touch structure 102 and the force applied thereto. Therefore, the sensor circuit 107 may include a signal generator configured to generate an excitation signal for generating an ultrasonic wave. The transmitter 105 is configured to receive the excitation signal from the signal generator and transmit the ultrasonic wave based on the excitation signal.

[0041] On the other hand, when ultrasonic waves are applied to (e.g., received by) the flexible diaphragm biasing the CMUT, the flexible diaphragm will vibrate according to the applied ultrasonic waves, and the CMUT will generate an alternating signal (e.g., a measurement signal) as the capacitance changes. In this way, the alternating signal is a measurement signal representing the received ultrasonic waves, and the CMUT operates as a receiver of ultrasonic waves. Each MEMS transducer can also be configured as a transceiver capable of transmitting and receiving ultrasonic waves.

[0042] PMUT is a piezoelectric ultrasonic transducer based on MEMS.PMUT may include a thin film piezoelectric diaphragm sandwiched between two electrodes (e.g., a top electrode and a bottom electrode), and a passive elastic layer.When an alternating electric field is applied between the top electrode and the bottom electrode, due to the inverse piezoelectric effect and the PMUT operation in the transmitting mode, the thin film piezoelectric diaphragm begins to expand and contract in the lateral dimension.Because the thin film piezoelectric diaphragm is clamped and suspended on the top of the package cavity 103, the clamped side of the thin film piezoelectric diaphragm acts as a boundary condition, which will force the thin film piezoelectric diaphragm to vibrate in the vertical direction during its expansion and contraction in the lateral dimension.As a result, an ultrasonic transmission wave is generated.In contrast, when operating in the receiving mode, the PMUT receives external vibrations, which cause charge to accumulate on a portion of the outer surface of the thin film piezoelectric diaphragm in contact with the electrode.The charge can be detected by the sensor circuit 107.

[0043] The transmitter 105, the receiver 106, and the sensor circuit 107 may be arranged on a circuit substrate 108 (e.g., a lead frame or a printed circuit board (PCB)), which is positioned at the base of the frame 101. The circuit substrate 108 is configured to electrically couple the sensor circuit 107 to both the transmitter 105 and the receiver 106. The transmitter 105, the receiver 106, and the sensor circuit 107 may be separate integrated circuits (ICs) (e.g., dies), or may be combined into one or two ICs in any combination. In addition, both the transmitter 105 and the receiver 106 may be implemented as separate transceivers, thereby providing two transmitters and two receivers.

[0044] The remaining portion of the encapsulation cavity 103 can be filled with a coupling medium 109, such as silicone, soft epoxy, liquid, or any other material that enables ultrasonic waves to propagate without attenuation or substantially without attenuation. Therefore, the coupling medium 109 can provide acoustic (e.g., ultrasonic) coupling without attenuation or substantially without attenuation between the transmitter 105 and the receiver 106. In some implementations, the material of the coupling medium 109 is also configured to provide elastic coupling to the receiver 106 and the touch structure 102, so that the receiver 106 and the touch structure 102 are mechanically coupled through the coupling medium 109. When providing mechanical coupling between the touch structure 102 and the receiver 106, the coupling medium 109 is a non-gaseous medium. In some implementations, the coupling medium 109 can provide structural support for the touch structure 102 (e.g., in an instance where the lateral sides of the encapsulation cavity 103 are completely open).

[0045] The touch structure 102 has a first interface 110 and a second interface 111 that interact with ultrasound, wherein the first interface 110 (e.g., an internal interface) is in contact with a coupling medium 109, and the second interface 111 (e.g., a touch interface) is in contact with the environment. The transmitter 105 is configured to transmit an ultrasonic transmission wave 112 toward the touch structure 102 (e.g., at the first interface 110 and the second interface 111). The first interface 110 and the second interface 111 are configured to reflect the ultrasonic transmission wave 112 back to the packaging cavity 103 to be received by the receiver 106 as ultrasonic reflection waves 113 and 114, respectively. The receiver 106 converts the ultrasonic reflection waves 113 and 114 into measurement signals for processing and analysis. Specifically, the first interface 110 reflects the ultrasonic transmission wave 112 by internal reflection to generate the ultrasonic reflection wave 113, and the second interface 111 reflects the ultrasonic transmission wave 112 by internal reflection to generate the ultrasonic reflection wave 114. Since the second interface 111 is farther from the transmitter 105 than the first interface 110, the ultrasonic reflection wave 114 occurs at a time after the ultrasonic reflection wave 113. In this way, both ultrasonic reflection waves 113 and 114 can be measured by corresponding measurement signals and evaluated.

[0046] The receiver 106 may output a continuous measurement signal while receiving the ultrasonic reflected waves 113 and 114, and the sensor circuit 107 may obtain a first measurement signal from the continuous measurement signal in a first observation window corresponding to the ultrasonic reflected wave 113, and may obtain a second measurement signal from the continuous measurement signal in a second observation window corresponding to the ultrasonic reflected wave 114. Therefore, the first measurement signal and the second measurement signal may be different parts of the continuous measurement signal output by the receiver 106. As described in more detail below, the waveform of the ultrasonic reflected wave 114 may be particularly useful for the sensor circuit 107 to make a touch / no-touch decision because the ultrasonic reflected wave 114 is more sensitive to a touch occurring at the second interface 111 (e.g., a touch interface).

[0047] In addition, the time difference between the reception times of the ultrasonic reflected waves 113 and 114 can be evaluated. Therefore, the transmitter 105 and the receiver 106 are coupled together through the coupling medium 109. The coupling medium 109 and the touch structure 102 form a propagation channel between the transmitter 105 and the receiver 106.

[0048] As a touch is applied to the touch surface 104, the change in acoustic impedance at the second interface 111 causes a change in the ultrasonic reflected wave 114. Specifically, when the touch surface 104 is touched by, for example, a user's finger (e.g., direct touch, skin in direct contact with the touch surface 104), the signal amplitude of the ultrasonic reflected wave 114 changes. The change in the ultrasonic reflected wave 114 can be detected or used on the receiver side of the ultrasonic touch sensor 100 for detecting a touch event or a no-touch event, and for determining a touch position and a touch force. Specifically, a touch event at the touch surface 104 can cause a damping effect, in which part of the energy of the ultrasonic transmission wave 112 is absorbed or dissipated by the finger. Therefore, the signal amplitude of the ultrasonic reflected wave 114 during the touch event can be reduced relative to the signal amplitude of the ultrasonic reflected wave 114 during the no-touch event. The sensor circuit 107 can use the waveform of the ultrasonic reflected wave 114 during the no-touch event as a reference waveform for touch / no-touch determination. For example, when the waveform of the ultrasonic reflected wave 114 remains similar to the reference waveform, the ultrasonic reflected wave 114 can correspond to a no-touch event. Alternatively, when the difference between the waveform of the ultrasonic reflected wave 114 and the reference waveform satisfies a threshold (eg, the difference is greater than a threshold, the difference is greater than or equal to a threshold, or the difference satisfies another threshold condition), the ultrasonic reflected wave 114 may correspond to a touch event.

[0049] In some implementations, the sensor circuit 107 may use the signal amplitude of the ultrasonic reflected wave 114 during the no-touch event as a reference level for touch / no-touch determination. The sensor circuit 107 may measure the signal amplitude of the ultrasonic reflected wave 114 and compare the signal amplitude with the reference level for touch / no-touch determination. If the difference between the signal amplitude of the ultrasonic reflected wave 114 and the reference level satisfies a threshold value (e.g., the difference is greater than the threshold value, the difference is greater than or equal to the threshold value, or the difference satisfies another threshold condition), the ultrasonic reflected wave 114 may correspond to a touch event. Therefore, the properties of the ultrasonic reflected wave 114 may depend on the presence or absence of a touch event. The properties of the reflected ultrasonic wave may be measured at the sensor circuit 107 to discriminate between the presence of a touch event or a no-touch event.

[0050] At the same time, at the first interface 110, the change in acoustic impedance caused by the touch event may be minimal. Therefore, the change in acoustic impedance may not cause a measurable change in the properties of the ultrasonic reflection wave 113. In other words, the ultrasonic reflection wave 113 may not undergo a measurable change due to the change in acoustic impedance at the touch surface 104. As a result, the ultrasonic reflection wave 114 can be used to detect the change in acoustic impedance at the touch surface 104 for distinguishing between a touch event and a no-touch event.

[0051] Specifically, a touch event at the touch surface 104 of the touch structure 102 causes a change in the properties of the propagation channel (e.g., the properties at the second interface 111), and thereby changes the propagation of the ultrasonic wave through the propagation channel from the transmitter 105 to the receiver 106. In other words, the properties of the ultrasonic wave propagating along the propagation channel change in response to the touch event at the touch surface 104, and the sensor circuit 107 is configured to detect the touch event, including one or more characteristics thereof (including the amount of contact pressure, the duration of contact, and the contact position on the touch surface 104).

[0052] During operation of the ultrasonic touch sensor 100, the sensor circuit 107 is configured to apply a touch detection algorithm to distinguish between touch events and no-touch events. The touch detection algorithm may take into account or be sensitive to various interferences, including electrical and ultrasonic crosstalk, multipath propagation, noise, temperature, and / or environmental interferences (such as dirt or water) on the touch surface 104. The touch detection algorithm may take into account or be insensitive to various calibration factors, including different touch surfaces, variations in mounting, non-linear behavior, large offsets, and drift effects.

[0053] In some implementations, the sensor circuit 107 may be configured to generate a first plurality of digital samples from a first signal (e.g., a reference measurement signal) generated by the receiver 106 and output from the receiver 106 during a no-touch event (e.g., a reference no-touch event) during an observation window corresponding to an ultrasonic reflection wave 114 reflected by the second interface 111. The first plurality of digital samples may represent an envelope of the first signal. The sensor circuit 107 may store the first plurality of digital samples in a memory as a plurality of reference samples. In other words, the first signal corresponds to the ultrasonic reflection wave 114 received during the no-touch event and is used as a reference signal for making a touch / no-touch decision during a touch monitoring operation. After obtaining and storing the plurality of reference samples, the sensor circuit 107 may be configured to generate a second plurality of digital samples from a second signal (e.g., a monitored measurement signal) generated by the receiver 106 and output from the receiver 106 during a touch monitoring operation (e.g., during an excitation frame used for a touch / no-touch decision). The second plurality of digital samples may represent an envelope of the second signal. The sensor circuit 107 can calculate the distance (e.g., Euclidean distance) of the second plurality of digital samples to the first plurality of digital samples (e.g., to the plurality of reference samples), and determine whether a no-touch event or a touch event has occurred at the touch surface 104 based on the distance. For example, if the distance is less than a threshold, the sensor circuit 107 can detect that a no-touch event has occurred. Alternatively, if the distance is equal to or greater than the threshold, the sensor circuit 107 can detect that a touch event has occurred.

[0054] Therefore, the sensor circuit 107 can be configured to receive a measurement signal corresponding to the ultrasonic reflected wave 114 from the receiver 106 during a touch monitoring operation, compare the measurement signal with a reference signal to generate a comparison result (for example, whether the measurement signal satisfies a threshold, or whether a defined correlation between the measurement signal and the reference signal satisfies a threshold), and determine a touch / no touch decision based on the comparison result.

[0055] Alternatively, in some implementations, the first signal (e.g., a reference measurement signal) may be generated by and output from the receiver 106 during a touch event (e.g., a reference touch event). As a result, a plurality of reference samples may correspond to ultrasonic reflected waves 114 received during a touch event and stored in a memory for use by the sensor circuit 107 during a touch monitoring operation to make a touch / no touch decision. Thus, in this case, if the distance calculated during the touch monitoring operation is less than a threshold, the sensor circuit 107 may detect that a touch event has occurred, and if the distance calculated during the touch monitoring operation is equal to or greater than the threshold, the sensor circuit 107 may detect that a no touch event has occurred.

[0056] In some implementations, digital samples can be obtained from ultrasonic reflected waves reflected by different interfaces during touch monitoring operations and compared with reference signals in a manner similar to that described above, including calculating the distance (e.g., Euclidean distance) between the digital samples of the reference signal and the reference samples, and determining whether a no-touch event or a touch event has occurred on the touch surface based on whether the distance meets a threshold.

[0057] The touch detection algorithm may include a machine learning model that is trained to distinguish between touch events and no-touch events. Machine learning involves computers learning from data to perform tasks. A machine learning algorithm is used to train a machine learning model based on sample data (referred to as "training data"). Once the training is complete, the machine learning model can be used to predict, decide, or classify new observations. The sensor circuit 107 can use a machine learning model to distinguish between touch events and no-touch events. The machine learning model may include, for example, a neural network and / or may be associated with, for example, a neural network. In some implementations, the sensor circuit 107 uses a machine learning model to distinguish between touch events and no-touch events in the following manner: providing candidate parameters as input to the machine learning model, and using the machine learning model to determine the possibility, probability, or confidence of determining a specific result of a subsequent touch detection operation (e.g., detecting no touch or detecting touch at the touch surface 104) using the candidate parameters. In some implementations, sensor circuit 107 provides one or more measurements as input to a machine learning model, and sensor circuit 107 uses the machine learning model to determine or identify the most likely specific outcome (e.g., the presence of no touch, touch, short touch, long touch, soft touch, hard touch, static touch, dynamic touch (e.g., moving touch), direct touch (e.g., touch made by direct contact of skin with touch surface 104), and / or indirect touch (e.g., touch made by non-skin contact with touch surface 104) on touch surface 104).

[0058] Sensor circuit 107 may train, update, and / or refine the machine learning model to improve the accuracy of results and / or parameters determined using the machine learning model. Sensor circuit 107 may train, update, and / or refine the machine learning model based on feedback and / or results from subsequent touch detection operations and from historical or related touch detection operations performed by sensor circuit 107 (e.g., from hundreds, thousands, or more historical or related touch detection operations).

[0059] A touch event at the touch surface 104 of the touch structure 102 may also result in a change in the properties of the receiver 106. For example, the touch force of the touch event may change the sensitivity of the receiver 106 because the touch force causes internal pressure to act on the flexible membrane of the receiver 106. The sensor circuit 107 may use this change in sensitivity to detect external forces applied to the touch surface 104 (including the touch force of the touch event).

[0060] During operation of the ultrasonic touch sensor 100, the sensor circuit 107 may be configured to generate an ultrasonic transmission wave 112 for each touch / no-touch decision by applying an excitation signal. Once each ultrasonic reflection wave is received, the sensor circuit 107 uses a touch detection algorithm to make a touch / no-touch decision. The time between subsequent touch detections (i.e., between consecutive excitation signals) may be, for example, about 25 microseconds (μs). The period between the triggering excitation signal and the next excitation signal may be referred to as an excitation frame. The sensor circuit 107 is configured to analyze the reflected ultrasonic wave for each excitation frame to make a touch / no-touch decision on a frame-by-frame basis. When the complexity of the touch detection algorithm is low, lower power consumption and higher frame rates (e.g., shorter time between excitation signals) may be achieved, for example, because when the touch detection algorithm is less complex, the sensor circuit 107 is able to make a touch / no-touch decision faster.

[0061] The excitation signal may be a short signal pulse or a pulse train consisting of a plurality of short pulses (e.g., a duration of about 100 nanoseconds (ns) to about 1 μs). The excitation signal may have any shape (e.g., rectangular, sinusoidal, Gaussian, or Gaussian derivative), or may be a chirp signal whose frequency increases or decreases continuously from a starting frequency to a stop frequency, such as by using linear frequency modulation. Therefore, the excitation signal may have a fixed (constant) frequency or a changing (modulated) frequency. In a pulse train, the pulses may have the same frequency or may have different frequencies, and / or the same pulse duration (i.e., bandwidth) or different pulse durations (i.e., bandwidth). The signal amplitude of the excitation signal is also configurable and may vary between excitation signals. The pulses of a pulse train may have a constant (fixed) amplitude or a varying amplitude. The number of pulses used in a pulse train is also configurable in the excitation signal. The pulse frequency (i.e., the period between consecutive pulses of a pulse train) may also be configurable and may be different in the excitation signal having a pulse train. The pulse train comprising the signal chirp may have fixed (constant) start and end frequencies among the signal chirps or may have varying start and / or end frequencies among the signal chirps.The signal chirps may have the same pulse duration or may have different pulse durations.

[0062] On the receiver side, the sensor circuit 107 includes an analog signal processing chain and / or a digital signal processing chain, both of which may include one or more optional components. The analog signal processing chain may include a direct down converter and a low pass filter as optional components. The direct down converter may include any form of direct down conversion of the ultrasonic reflected waves 113 and 114. For example, square, absolute value or rectification and other examples may be used to perform direct down conversion. The analog circuit block for such down conversion processing may include a multiplier or a diode. The low pass filter cutoff frequency may be tuned to the bandwidth of the transmitted ultrasonic signal and the bandwidth of the transmitter 105. For example, the low pass filter cutoff frequency may be set to 1 MHz or 2 MHz.

[0063] In some implementations, the sensor circuit 107 may include an analog-to-digital converter (ADC) configured to generate a plurality of digital samples (e.g., measurement samples) from the ultrasonic reflected waves 113 and 114 of each ultrasonic transmission wave 112, and store the digital samples in a memory for evaluation. Additionally or alternatively, in some implementations, the sensor circuit 107 may include an ADC configured to generate a plurality of digital samples from a measurement signal obtained by measuring another property of the ultrasonic touch sensor 100 (e.g., internal pressure, bias voltage, or cross-coupling effect), and store the digital samples in a memory for evaluation.

[0064] The digital processor of the sensor circuit 107 may be operable to evaluate the digital samples received in the observation window using a touch detection algorithm to determine whether there is a no-touch event or a touch event corresponding to the ultrasonic transmission wave 112. The digital processor may use different observation windows to evaluate the ultrasonic reflection waves 113 and 114, which may be due to the time difference between the time when the ultrasonic reflection wave 113 is reflected by the first interface 110 and the time when the ultrasonic reflection wave 114 is reflected by the second interface 111. That is, the sensor circuit 107 can predict when the ultrasonic reflection waves 113 and 114 will be received based on the time-of-flight principle. For example, the time-of-flight of the first reflection (e.g., ultrasonic reflection wave 113) is the time required for the ultrasonic transmission wave 112 to travel from the transmitter 105 to the first interface 110 and return to the receiver 106. Similarly, the time-of-flight of the second reflection (e.g., ultrasonic reflection wave 114) is the time required for the ultrasonic transmission wave 112 to travel from the transmitter 105 to the second interface 111 and return to the receiver 106. In both cases, the approximate travel distance and travel speed of the ultrasonic signal are known parameters. Therefore, each observation window has a predetermined start time and a predetermined end time for evaluating a corresponding one of the ultrasonic reflected waves 113 and 114 .

[0065] The ultrasonic touch sensor 100 may further include a light source 115 (e.g., an activation light source), such as a light emitting diode (LED), which is arranged in the package cavity 103. The light source 115 may generate activation light. For example, the light source 115 may be an ultraviolet (UV) light source or a blue light source, and the activation light may be ultraviolet light or blue light, respectively.

[0066] The coupling medium 109 may include a luminescent material configured to be activated (e.g., excited) by an activation light to produce a backlight emitted from the packaging cavity. The backlight may be visible light having an emission wavelength in the visible spectrum corresponding to the luminescent material. For example, the backlight may consist of a color or hue (such as red, green, or blue). The luminescent material may include a photoluminescent material or a chemiluminescent material. The photoluminescent material may include a fluorescent material, a phosphorescent material, or a quantum dot. The luminescent material may include luminescent particles suspended in one or more regions of the coupling medium 109 or suspended throughout the coupling medium. Therefore, the coupling medium 109 may be implemented as a uniform light source, which provides a low-cost solution for providing backlighting.

[0067] The coupling medium 109 may be an elastic gel that encapsulates the transmitter 105, the receiver 106, the sensor circuit 107, and the light source 115 in the packaging cavity 103. In addition, the coupling medium 109 may be coupled to the transmitter 105 and the receiver 106 such that the transmitter 105 and the receiver 106 are mechanically and acoustically coupled via the coupling medium 109. Thus, the coupling medium 109 may provide coupling and backlight generation.

[0068] Touch structure 102 may be optically transparent, or may include an optically transparent region that is transparent to a backlight such that the backlight is emitted from ultrasonic touch sensor 100 through touch structure 102 .

[0069] As indicated above, Figure 1 are provided as examples. Other examples may be related to Figure 1 For example, in some implementations, an array of transmitters, receivers, or transceivers may be provided within the package cavity 103 of the ultrasonic touch sensor 100. In some implementations, the touch structure 102 may include multiple layers to generate more than two ultrasonic reflections or echoes. In some implementations, additional circuit components may be added without departing from the disclosure provided above.

[0070] Figure 2 An ultrasonic touch sensor 200 is shown in accordance with one or more implementations. The ultrasonic touch sensor 200 is combined with Figure 1The ultrasonic touch sensor 100 described is similar, except that the transmitter 105 and the receiver 106 are combined into a single touch sensor chip 201. In some implementations, the touch sensor chip 201 may also include a sensor circuit 107. Thus, the touch sensor chip 201 includes a transceiver transducer (TX / RX) that can be configured in a transmit mode for transmitting ultrasonic transmit waves and a receive mode for receiving ultrasonic reflected waves.

[0071] The frame 101 may be an encapsulation molding, which is molded to form the encapsulation cavity 103. Therefore, the encapsulation cavity 103 may be a groove formed in the encapsulation molding.

[0072] In addition, the touch structure 102 can have an optically transparent area 202 (e.g., a transparent window) that is transparent to the backlight generated by the coupling medium 109 when activated by the activation light from the light source 115. In addition, the optically transparent area 202 can represent a sensitive area of ​​the touch structure 102, where the ultrasonic touch sensor 200 is sensitive to touch. Therefore, the touch structure 102 can be coupled to the housing (e.g., frame 101) and the coupling medium 109. The touch structure 102 is arranged above the package cavity 103 and includes a touch surface 104 for receiving a touch.

[0073] The touch sensor chip 201 may be electrically coupled to the first electrical interconnect 203 (e.g., first lead) through the first bonding wire 204. The light source 115 may be electrically coupled to the second electrical interconnect 205 (e.g., second lead) through the second bonding wire 206. The first electrical interconnect 203 and the second electrical interconnect 205 of the ultrasonic touch sensor 200 may be electrically coupled to a carrier substrate 207 (such as a PCB).

[0074] As indicated above, Figure 2 are provided as examples. Other examples may be related to Figure 2 Different than described.

[0075] Figure 3 An ultrasonic touch sensor 300 is shown according to one or more implementations. The ultrasonic touch sensor 300 is similar to a touch sensor that combines Figure 2 The ultrasonic touch sensor 200 described. In this example, the frame 101 is a package molding, and the package cavity 103 is a cavity defined by the package molding. The touch structure 102 can be coupled to the frame 101 and the coupling medium 109. In addition, the touch structure 102 is arranged above the package cavity 103 and includes a touch surface 104 for receiving a touch.

[0076] The circuit substrate 108 may form a base of the housing upon which the encapsulation molding is formed.

[0077] As indicated above, Figure 3 are provided as examples. Other examples may be related to Figure 3 Different than described.

[0078] Figure 4 An ultrasonic touch sensor 400 according to one or more implementations is illustrated. The ultrasonic touch sensor 400 includes a package cavity 103 including a first groove 401 and a second groove 402. The frame 101 may be a package molding that defines the first groove 401 and the second groove 402. The transmitter 105 may be arranged at the first groove 401, and the receiver 106 may be arranged at the second groove 402. In addition, the ultrasonic touch sensor 400 includes a first coupling medium 403 that fills or at least partially fills the first groove 401 and a second coupling medium 404 that fills or at least partially fills the second groove 402. For example, the first coupling medium 403 may couple the transmitter 105 to the touch structure 102, and the second coupling medium 404 may couple the receiver 106 to the touch structure 102. The first coupling medium 403 may include a first luminescent material configured to emit a first backlight. The second coupling medium 404 may include a second luminescent material configured to emit a second backlight.

[0079] The ultrasonic touch sensor 400 may also include a first light source 115-1 (e.g., a first activation light source) and a second light source 115-2 (e.g., a second activation light source), the first light source 115-1 being configured to generate a first activation light having a first wavelength, and the second light source 115-2 being configured to generate a second activation light having a second wavelength, which may be the same as the first wavelength or may be a wavelength different from the first wavelength. The first light source 115-1 may be optically coupled to the first coupling medium 403 so that the first activation light can activate the first luminescent material to generate a first backlight emitted from the package cavity 103. For example, the first optical path provided by the first waveguide 405 may guide the first activation light to the first groove 401. Alternatively, the first light source 115-1 may be arranged outside the package molding. The second light source 115-2 may be optically coupled to the second coupling medium 404 so that the second activation light can activate the second luminescent material to generate a second backlight emitted from the package cavity 103. For example, the second optical path provided by the second waveguide 406 may guide the second activation light to the second groove 402. Alternatively, the second light source 115 - 2 may be disposed outside the encapsulation molding.

[0080] As indicated above, Figure 4 are provided as examples. Other examples may be related to Figure 4 Described differently.

[0081] Figure 5 A cross section of an ultrasonic touch sensor 500 according to one or more implementations is illustrated. The ultrasonic touch sensor 500 includes a touch sensor chip 201 disposed on a circuit substrate 108 (e.g., a PCB) and disposed in a package cavity 103. A touch structure 102 having an optically transparent area 202 is disposed above the package cavity 103 and coupled to a first coupling medium 109-1 and a second coupling medium 109-2.

[0082] The wavelength filter 501 separates the package cavity into a first region 103-1 (e.g., a first light emitting region) and a second region 103-2 (e.g., a second light emitting region). The first coupling medium 109-1 may at least partially fill the first region 103-1 of the package cavity 103. The second coupling medium 109-2 may at least partially fill the second region 103-2 of the package cavity 103. The first coupling medium 109-1 may include a first luminescent material configured to emit a first backlight of a first wavelength corresponding to a first color. The second coupling medium 109-2 may include a second luminescent material configured to emit a second backlight of a second wavelength corresponding to a second color, which may be different from the first color. For example, the first color may be one of red, green, or blue, and the second color may be a different one of red, green, or blue. The first luminescent material may be configured to be activated by a first activation light to generate a first backlight to be emitted from the package cavity 103 (e.g., through the optically transparent region 202). The second luminescent material may be configured to be activated by the second activation light to generate a second backlight to be emitted from the encapsulation cavity 103 (eg, through the optically transparent region 202 ).

[0083] The ultrasonic touch sensor 500 further includes a first light source 115-1 disposed in the first region 103-1 and a second light source 115-2 disposed in the second region 103-2. The first coupling medium 109-1 may encapsulate the first light source 115-1 and a first portion of the touch sensor chip 201. The second coupling medium 109-2 may encapsulate the second light source 115-2 and a second portion of the touch sensor chip 201.

[0084] The first light source 115-1 and the second light source 115-2 may be electrically coupled to the circuit substrate 108 for receiving a power signal. The first light source 115-1 may generate a first activation light (e.g., a first UV light) configured to activate a first luminescent material for generating a first backlight. The second light source 115-2 may generate a second activation light (e.g., a second UV light) configured to activate a second luminescent material for generating a second backlight. The first light source 115-1 and the second light source 115-2 may be driven independently so that the first backlight and the second backlight may be generated independently. In some cases, only one of the first backlight and the second backlight may be activated. In other cases, both the first backlight and the second backlight may be activated simultaneously.

[0085] The wavelength filter 501 may be opaque to the first activation light and the second activation light, so that the wavelength filter 501 blocks the first activation light from entering the second area 103-2 of the encapsulation cavity 103, and blocks the second activation light from entering the first area 103-1 of the encapsulation cavity 103. As a result, the first backlight and the second backlight may be independently activated by the first light source 115-1 and the second light source 115-2, respectively. In addition, the wavelength filter 501 may be transparent to visible light (e.g., to the first backlight and the second backlight). Therefore, the first backlight may pass through the wavelength filter 501 to enter the second area 103-2, and the second backlight may pass through the wavelength filter 501 to enter the first area 103-1.

[0086] In some implementations, the wavelength filter 501 can extend from the top side of the touch sensor chip 201 to the touch structure 102 (eg, to the first interface 110 of the touch structure 102 ).

[0087] In some implementations, wavelength filter 501 may not exist. Instead, the first luminescent material may be sensitive only to the wavelength of the first activation light, and the second luminescent material may be sensitive only to the wavelength of the second activation light. Therefore, the first light source 115-1 and the second light source 115-2 may emit different wavelengths to independently activate (e.g., excite) the first luminescent material and the second luminescent material, respectively.

[0088] As indicated above, Figure 5 are provided as examples. Other examples may be related to Figure 5 Different than described.

[0089] Figure 6 A cross-section of an ultrasonic touch sensor 600 is shown according to one or more implementations. The ultrasonic touch sensor 600 is similar to the Figure 5The ultrasonic touch sensor 500 is described, except that the transmitter and the receiver are separated. Thus, the ultrasonic touch sensor 500 includes a transmitter 105 arranged in the first region 103-1 and a receiver 106 arranged in the second region 103-2. Thus, the wavelength filter 501 can extend from the top side of the circuit substrate 108 to the touch structure 102 (e.g., to the first interface 110 of the touch structure 102).

[0090] As indicated above, Figure 6 are provided as examples. Other examples may be related to Figure 6 Different than described.

[0091] Fig. 7A A cross section of an ultrasonic touch sensor 700A according to one or more implementations is illustrated. The ultrasonic touch sensor 700A includes a touch sensor chip 201 disposed on a circuit substrate 108 (e.g., a PCB) and disposed in a package cavity 103. A touch structure 102 having an optically transparent area 202 is disposed above the package cavity 103 and coupled to a first coupling medium 109-1, a second coupling medium 109-2, and a third coupling medium 109-3.

[0092] A plurality of wavelength filters that may be opaque to a certain wavelength range (e.g., a wavelength range corresponding to UV light) may be provided to separate the package cavity 103 into a plurality of regions, including a first region 103-1, a second region 103-2, and a third region 103-3 (e.g., a third light emitting region). For example, the ultrasonic touch sensor 700A may include a first wavelength filter 701 that separates the first region 103-1 and the second region 103-2, and a second wavelength filter 702 that separates the second region 103-2 and the third region 103-3. The first wavelength filter 701 and the second wavelength filter 702 may extend between the circuit substrate 108 and the touch structure 102 to form a vertical barrier.

[0093] The first coupling medium 109-1 may at least partially fill the first region 103-1 of the encapsulation cavity 103, the second coupling medium 109-2 may at least partially fill the second region 103-2 of the encapsulation cavity 103, and the third coupling medium 109-3 may at least partially fill the third region 103-3 of the encapsulation cavity 103. The first coupling medium 109-1 may include a first luminescent material configured to emit a first backlight of a first wavelength corresponding to a first color. The second coupling medium 109-2 may include a second luminescent material configured to emit a second backlight of a second wavelength corresponding to a second color, which may be different from the first color. The third coupling medium 109-3 may include a third luminescent material configured to emit a third backlight of a third wavelength corresponding to a third color, which may be different from the first color and the second color. For example, the first color may be green, the second color may be blue, and the third color may be red. The first luminescent material may be configured to be activated by a first activation light to generate a first backlight to be emitted from the encapsulation cavity 103 (e.g., through the optically transparent region 202). The second luminescent material may be configured to be activated by a second activation light to generate a second backlight to be emitted from the encapsulation cavity 103 (e.g., through the optically transparent region 202). The third luminescent material may be configured to be activated by a third activation light to generate a third backlight to be emitted from the encapsulation cavity 103 (e.g., through the optically transparent region 202).

[0094] The ultrasonic touch sensor 700A further includes a first light source 115-1 arranged in the first region 103-1, a second light source 115-2 arranged in the second region 103-2, and a third light source 115-3 (e.g., a third activation light source). The first coupling medium 109-1 may encapsulate the first light source 115-1. The second coupling medium 109-2 may encapsulate the second light source 115-2 and the touch sensor chip 201. The third coupling medium 109-3 may encapsulate the third light source 115-3.

[0095] The first light source 115-1, the second light source 115-2, and the third light source 115-3 may be electrically coupled to the circuit substrate 108 for receiving a power signal. The first light source 115-1 may generate a first activation light (e.g., a first UV light) configured to activate a first luminescent material for generating a first backlight. The second light source 115-2 may generate a second activation light (e.g., a second UV light) configured to activate a second luminescent material for generating a second backlight. The third light source 115-3 may generate a third activation light (e.g., a third UV light) configured to activate a third luminescent material for generating a third backlight. The first light source 115-1, the second light source 115-2, and the third light source 115-3 may be driven independently so that the first backlight, the second backlight, and the third backlight may be generated independently. In some cases, one backlight, two backlights, or all three backlights of the first backlight, the second backlight, and the third backlight may be activated simultaneously.

[0096] The first wavelength filter 701 may be opaque to the first activation light and the second activation light, so that the first wavelength filter 701 blocks the first activation light from entering the second area 103-2 of the encapsulation cavity 103, and blocks the second activation light from entering the first area 103-1 of the encapsulation cavity 103. As a result, the first backlight and the second backlight may be independently activated by the first light source 115-1 and the second light source 115-2, respectively. In addition, the first wavelength filter 701 may be transparent to visible light (e.g., to the first backlight, the second backlight, and the third backlight). Therefore, the first backlight may pass through the first wavelength filter 701 to enter the second area 103-2, and the second backlight may pass through the first wavelength filter 701 to enter the first area 103-1.

[0097] In addition, the second wavelength filter 702 may be opaque to the second activation light and the third activation light, so that the second wavelength filter 702 blocks the second activation light from entering the third area 103-3 of the encapsulation cavity 103, and blocks the third activation light from entering the second area 103-2 of the encapsulation cavity 103. Therefore, the second backlight and the third backlight can be independently activated by the second light source 115-2 and the third light source 115-3, respectively. In addition, the second wavelength filter 702 may be transparent to visible light (e.g., to the first backlight, the second backlight, and the third backlight). Therefore, the second backlight can pass through the second wavelength filter 702 to enter the third area 103-3, and the third backlight can pass through the second wavelength filter 702 to enter the second area 103-2.

[0098] In some implementations, one or both of wavelength filters 701 and 702 may not be present. Instead, the first luminescent material may be sensitive only to the wavelength of the first activation light, the second luminescent material may be sensitive only to the wavelength of the second activation light, and / or the third luminescent material may be sensitive only to the wavelength of the third activation light. Thus, the first light source 115-1, the second light source 115-2, and / or the third light source 115-3 may emit different wavelengths to independently activate (e.g., excite) the first luminescent material, the second luminescent material, and the third luminescent material, respectively.

[0099] In some implementations, the transmitter and receiver of the touch sensor chip 201 may be implemented in separate ultrasonic transducers. Figure 6 The transmitter 105 and the receiver 106 are similarly shown in FIG.

[0100] As indicated above, Fig. 7A are provided as examples. Other examples may be related to Fig. 7A Different than described.

[0101] Figure 7B A cross-section of an ultrasonic touch sensor 700B is shown according to one or more implementations. The ultrasonic touch sensor 700B is similar to the Fig. 7A The ultrasonic touch sensor 700A described above is different in that the first light source 115-1 and the third light source 115-3 are located outside the first coupling medium 109-1 and outside the third coupling medium 109-3, respectively. Therefore, one or more light sources can be located inside or outside the corresponding coupling medium, as long as the light source can simulate the luminescent material of the corresponding coupling medium for generating the corresponding backlight. The first light source 115-1 and the third light source 115-3 can be electrically coupled to the circuit substrate 108, or can be electrically coupled to one or more different circuit substrates for receiving power signals.

[0102] As indicated above, Figure 7B are provided as examples. Other examples may be related to Figure 7B Different than described.

[0103] Figure 7C A cross-section of an ultrasonic touch sensor 700C is shown according to one or more implementations. The ultrasonic touch sensor 700C is similar to the Fig. 7AThe ultrasonic touch sensor 700A described above is different in that the first wavelength filter 701 does not exist in the ultrasonic touch sensor 700C. Instead, the first light source 115-1 and the second light source 115-2 can emit light of different wavelengths used to excite different luminescent materials. For example, the first light source 115-1 can emit a first activation light of a first wavelength, and the second light source 115-2 can emit a second activation light of a second wavelength, which is in a different wavelength region from the first wavelength. The first luminescent material of the first coupling material 109-1 can be configured to be excited by the first wavelength and can be configured not to be excited by the second wavelength. In other words, the first luminescent material can be insensitive to the second wavelength. The second luminescent material of the second coupling material 109-2 can be configured to be excited by the second wavelength and can be configured not to be excited by the first wavelength. In other words, the second luminescent material can be insensitive to the first wavelength. Therefore, the first coupling material 109-1 and the second coupling material 109-2 can be in direct contact with each other. Alternatively, a transparent substrate that is transparent to both UV light and visible light can be used instead of a wavelength filter to separate the first area 103-1 and the second area 103-2.

[0104] As indicated above, Figure 7C are provided as examples. Other examples may be related to Figure 7C Different than described.

[0105] Fig.7D A cross-section of an ultrasonic touch sensor 700D is shown according to one or more implementations. The ultrasonic touch sensor 700D is similar to the Fig. 7A The ultrasonic touch sensor 700A is described except that the first wavelength filter 701 and the second wavelength filter 702 are not present in the ultrasonic touch sensor 700D.

[0106] Alternatively, the first light source 115-1, the second light source 115-2, and the third light source 115-3 may emit light of different wavelengths used to excite different luminescent materials. For example, the first light source 115-1 may emit a first activation light of a first wavelength, the second light source 115-2 may emit a second activation light of a second wavelength, and the third light source 115-3 may emit a third activation light of a third wavelength, wherein the first wavelength, the second wavelength, and the third wavelength are different wavelengths in different wavelength regions. The first luminescent material of the first coupling material 109-1 may be configured to be excited by the first wavelength, and may be configured not to be excited by the second wavelength or the third wavelength. In other words, the first luminescent material may be insensitive to the second wavelength and the third wavelength. The second luminescent material of the second coupling material 109-2 may be configured to be excited by the second wavelength, and may be configured not to be excited by the first wavelength or the third wavelength. In other words, the second luminescent material may be insensitive to the first wavelength and the third wavelength. The third luminescent material of the third coupling material 109-3 may be configured to be excited by the third wavelength, and may be configured not to be excited by the first wavelength or the second wavelength. In other words, the third luminescent material may be insensitive to the first wavelength and the second wavelength. Therefore, the first coupling material 109-1 and the second coupling material 109-2 may be in direct contact with each other. In addition, the second coupling material 109-2 and the third coupling material 109-2 may be in direct contact with each other. Alternatively, a first transparent substrate transparent to both UV light and visible light may be used instead of a wavelength filter to separate the first region 103-1 and the second region 103-2, and a second transparent substrate transparent to both UV light and visible light may be used instead of a wavelength filter to separate the second region 103-2 and the third region 103-3.

[0107] As indicated above, Fig.7D are provided as examples. Other examples may be related to Fig.7D Different than described.

[0108] Figure 8 A cross-section of an ultrasonic touch sensor 800 is shown according to one or more implementations. The ultrasonic touch sensor 800 is similar to the Figure 6The ultrasonic touch sensor 600 described above is different in that the ultrasonic touch sensor 800 includes a scattering coupling medium 801. The scattering coupling medium 801 can be arranged in the package cavity 103, on the first coupling medium 109-1 and the second coupling medium 109-2. In addition, the scattering coupling medium 801 can be coupled to the touch structure 102. Therefore, the scattering coupling medium 801 can be arranged between the first coupling medium 109-1 and the touch structure 102, and between the second coupling medium 109-2 and the touch structure 102. The scattering coupling medium 801 can be configured to mechanically and acoustically couple the transmitter 105 and the receiver 106 to the touch structure 102. For example, the scattering coupling medium 801 can be an elastic gel. In some implementations, the scattering coupling medium 801 can be made of the same or similar material as the material used for the first coupling medium 109-1 and the second coupling medium 109-2, except that the scattering coupling medium 801 can include a scattering material (e.g., scattering particles) instead of a luminescent material. The scattering coupling medium 801 can be transparent to visible light, but can be non-luminescent. Thus, the scattering material of the scattering coupling medium 801 may be configured to scatter or otherwise distribute visible light throughout the scattering coupling medium 801 .

[0109] In some implementations, the scattering material can scatter visible light more strongly than the activation light so as not to excite unintended luminescent materials. In some implementations, the wavelength filter 501 can extend from the top side of the circuit substrate 108, through the scattering coupling medium 801, to the touch structure 102 (e.g., to the first interface 110 of the touch structure 102). Thus, the wavelength filter 501 can prevent the first activation light from exciting the second luminescent material of the second coupling medium 109-2, and can prevent the second activation light from exciting the first luminescent material of the first coupling medium 109-1, while allowing the visible light to spread throughout the scattering coupling medium 801.

[0110] The scattering coupling medium 801 may receive the first backlight from the first coupling medium 109-1 and spread the first backlight in the package cavity 103 to uniformly emit the first backlight from the package cavity 103. As a result, the first backlight may uniformly leave the package cavity 103 through the optically transparent region 202 of the touch structure 102 as a first uniform backlight. Therefore, dark spots at the optically transparent region 202 may be reduced or avoided. In addition, the scattering coupling medium 801 may receive the second backlight from the second coupling medium 109-2 and spread the second backlight in the package cavity 103 to uniformly emit the second backlight from the package cavity 103. As a result, the second backlight may uniformly leave the package cavity 103 through the optically transparent region 202 of the touch structure 102 as a second uniform backlight. Therefore, dark spots at the optically transparent region 202 may be reduced or avoided. Therefore, visible light may be emitted from the package cavity 103 with the same and uniform light intensity over the entire portion of the optically transparent region 202. The scattering coupling medium 801 may be implemented in a similar manner in any of the implementations described herein.

[0111] As indicated above, Figure 8 are provided as examples. Other examples may be related to Figure 8 Different than described.

[0112] Fig. 9 A cross-section of an ultrasonic touch sensor 900 is shown according to one or more implementations. The ultrasonic touch sensor 900 is similar to a Fig.7D The ultrasonic touch sensor 700D described above, however, includes a scattering coupling medium 801 disposed on the first coupling medium 109 - 1 , the second coupling medium 109 - 2 , and the third coupling medium 109 - 3 .

[0113] Therefore, the scattering coupling medium 801 can receive the first backlight from the first coupling medium 109-1 and disperse the first backlight in the package cavity 103 to uniformly emit the first backlight from the package cavity 103. In addition, the scattering coupling medium 801 can receive the second backlight from the second coupling medium 109-2 and disperse the second backlight in the package cavity 103 to uniformly emit the second backlight from the package cavity 103. In addition, the scattering coupling medium 801 can receive the third backlight from the third coupling medium 109-3 and disperse the third backlight in the package cavity 103 to uniformly emit the third backlight from the package cavity 103.

[0114] The transmitter 105 and the receiver 106 may be arranged in the package cavity 103 according to various configurations, one of which is shown as an example. Fig. 9 Shown in.

[0115] As indicated above, Fig. 9 It is provided only as an example. Other examples can be found in Fig. 9 Different than described.

[0116] Fig.10 A cross section of an ultrasonic touch sensor 1000 according to one or more implementations is illustrated. The first region 103-1 of the package cavity 103 may surround or enclose the second region 103-2 of the package cavity 103. Thus, different light emission patterns (e.g., color patterns and shapes) may be achieved depending on the patterns of the first coupling medium 109-1 and the second coupling medium 109-2.

[0117] In some implementations, the wavelength filter 501 may also surround the second region 103-2 to separate the first region 103-1 from the second region 103-2. As a result, the first light source 115-1 and the second light source 115-2 may respectively generate the first activation light and the second activation light of the same wavelength to selectively activate the corresponding luminescent materials.

[0118] In some implementations, no wavelength filter 501 may be provided. As a result, the first light source 115-1 and the second light source 115-2 may respectively generate first activation light and second activation light of different wavelengths to selectively activate corresponding luminescent materials.

[0119] The transmitter 105 and the receiver 106 may be arranged in the package cavity 103 according to various configurations, one of which is shown as an example. Fig.10 Shown in.

[0120] As indicated above, Fig.10 are provided as examples. Other examples may be related to Fig.10 Different than described.

[0121] Fig.11A A cross section of an ultrasonic touch system 1100A according to one or more implementations is illustrated. The ultrasonic touch system 1100A may be a system of two or more ultrasonic touch sensors. The ultrasonic touch system 1100A may include a touch structure 102 implemented as part of a housing, the touch structure 102 being shared by two or more ultrasonic touch sensors. In addition, the touch structure 102 may include a corresponding optically transparent area for each ultrasonic touch sensor. For example, the touch structure 102 may include a first optically transparent area 202-1 and a second optically transparent area 202-2.

[0122] The ultrasonic touch system 1100A may include a first circuit substrate 108-1 and a second circuit substrate 108-2. The area between the first circuit substrate 108-1 and the touch structure 102 may define a first encapsulation cavity 1101-1. The area between the second circuit substrate 108-2 and the touch structure 102 may define a second encapsulation cavity 1101-2. Therefore, the touch structure 102 may be arranged above the first encapsulation cavity 1101-1 and the second encapsulation cavity 1101-2 and include a touch surface 104 for receiving a touch.

[0123] The ultrasonic touch system 1100A may include a first touch sensor chip 201-1 arranged in a first package cavity 1101-1, and a second touch sensor chip 201-2 arranged in a second package cavity 1101-2. The first touch sensor chip 201-1 may include a first transceiver transducer (TX / RX), which may be configured as a transmission mode for transmitting ultrasonic transmission waves and a reception mode for receiving ultrasonic reflection waves. The second touch sensor chip 201-2 may include a second TX / RX, which may be configured as a transmission mode for transmitting ultrasonic transmission waves and a reception mode for receiving ultrasonic reflection waves. Alternatively, the ultrasonic touch system 1100A may include a separate transmitter / receiver pair. For example, the ultrasonic touch system 1100A may include a first transmitter and a first receiver arranged in the first package cavity 1101-1 as separate ultrasonic transducers, and may include a second transmitter and a second receiver arranged in the second package cavity 1101-2 as separate ultrasonic transducers. In either case, the ultrasonic touch system 1100A includes a first ultrasonic transmitter arranged in a first package cavity, a first ultrasonic receiver arranged in the first package cavity and acoustically coupled to the first ultrasonic transmitter, a second ultrasonic transmitter arranged in a second package cavity, and a second ultrasonic receiver arranged in the second package cavity and acoustically coupled to the second ultrasonic transmitter.

[0124] The ultrasonic touch system 1100A may include a first coupling medium 109-1 that fills or at least partially fills the first encapsulation cavity 1101-1, and a second coupling medium 109-1 that fills or at least partially fills the second encapsulation cavity 1101-2. The first coupling medium 109-1 may be configured to mechanically and acoustically couple the first touch sensor chip 201-1 to the touch structure 102. The second coupling medium 109-2 may be configured to mechanically and acoustically couple the second touch sensor chip 201-2 to the touch structure 102.

[0125] The ultrasonic touch system 1100A also includes a light source 115 configured to generate activation light. The light source 115 can be arranged on one of the circuit substrates (e.g., the first circuit substrate 108-1) for receiving a power signal. The first coupling medium 109-1 may include a first luminescent material configured to be activated by the activation light to generate a first backlight emitted from the first encapsulation cavity 1101-1. The second coupling medium 109-2 may include a second luminescent material configured to be activated by the activation light to generate a second backlight emitted from the second encapsulation cavity 1101-1. The first luminescent material and the second luminescent material may emit light of the same wavelength or different wavelengths. Therefore, the light source 115 can be shared by the first coupling medium 109-1 and the second coupling medium 109-2 for simultaneously exciting both the first luminescent material and the second luminescent material. The first optically transparent region 202-1 can be transparent to the first backlight so that the first backlight is emitted from the first coupling medium 109-1 to the environment. The second optically transparent area 202-2 may be transparent to the second backlight, such that the second backlight is emitted from the second coupling medium 109-2 to the environment.

[0126] As indicated above, Fig.11A are provided as examples. Other examples may be related to Fig.11A Different than described.

[0127] Fig. 11B FIG. 1 shows a cross-section of an ultrasonic touch system 1100B according to one or more implementations. The ultrasonic touch system 1100B may be similar to the Fig.11A The ultrasonic touch system 1100A described above. However, the ultrasonic touch system 1100B may include additional light emitting areas and additional light sources. For example, the first encapsulation cavity 1101-1 may include a first area 103-1 and a second area 103-2, and the second encapsulation cavity 1101-2 may include a third area 103-3 and a fourth area 103-4. The first coupling medium 109-1 including the first luminescent material may fill or at least partially fill the first area 103-1, the second coupling medium 109-2 including the second luminescent material may fill or at least partially fill the second area 103-2, the third coupling medium 109-3 including the third luminescent material may fill or at least partially fill the third area 103-3, and the fourth coupling medium 109-4 including the fourth luminescent material may fill or at least partially fill the fourth area 103-4.

[0128] The ultrasonic touch system 1100B may further include: a first light source 115-1 arranged between the second area 103-2 and the third area 103-3; a second light source 115-2 arranged in or near the first area 103-1; and a third light source 115-3 arranged in the first area 103-4 or near the fourth area 103-4.

[0129] The first light source 115-1 can generate a first activation light for simultaneously and separately activating the second luminescent material in the second coupling medium 109-2 and the third luminescent material in the third coupling medium 109-3, thereby generating a second backlight and a third backlight. The second light source 115-2 can generate a second activation light for activating the first luminescent material of the first coupling medium 109-1, thereby generating a first backlight. The third light source 115-3 can generate a third activation light for activating the fourth luminescent material of the fourth coupling medium 109-4, thereby generating a fourth backlight.

[0130] The first backlight and the second backlight may be emitted from the first encapsulation cavity 1101-1 through the first optically transparent region 202-1 of the touch structure 102. The third backlight and the fourth backlight may be emitted from the second encapsulation cavity 1101-2 through the second optically transparent region 202-2 of the touch structure 102. Thus, the touch sensitive area of ​​the touch structure 102 may be illuminated.

[0131] In some implementations, the first region 103-1 and the second region 103-2 may be separated by a first wavelength filter, and the third region 103-3 and the fourth region 103-4 may be separated by a second wavelength filter.

[0132] As indicated above, Fig. 11B are provided as examples. Other examples may be related to Fig. 11B Different than described.

[0133] Fig.12 A cross section of an ultrasonic touch sensor 1200 according to one or more implementations is illustrated. The ultrasonic touch sensor 1200 may include a touch structure 1201 disposed above an encapsulation cavity 1202 provided in an interior region of the ultrasonic touch sensor 1200. The touch structure 1201 may include a touch surface 1203 and an interior surface 1204.

[0134] Ultrasonic touch sensor 1200 can also include a flexible circuit substrate 1205 having a front side 1206 and a back side 1207 , with front side 1206 coupled to inner surface 1204 of touch structure 1201 .

[0135] The ultrasonic touch sensor 1200 may also include a touch sensor chip 1208 that includes a transducer transceiver 1209 and is coupled to the back side 1207 of the flexible circuit substrate 1205. In other words, the touch sensor chip 1208 may be mechanically and electrically coupled to the flexible circuit substrate 1205 through one or more electrical interconnects 1210. The transducer transceiver 1209 may be configured in a transmit mode or a receive mode. Thus, when in the transmit mode, the transducer transceiver 1209 may be configured as an ultrasonic transmitter, and when in the receive mode, the transducer transceiver 1209 may be configured as an ultrasonic receiver. When configured as an ultrasonic transmitter, the transducer transceiver 1209 may transmit an ultrasonic transmit wave toward the touch structure 1201. When configured as an ultrasonic receiver, the transducer transceiver 1209 may receive an ultrasonic reflection wave generated by reflection of the ultrasonic transmit wave at the touch structure 1201, and generate a measurement signal representing the ultrasonic reflection wave.

[0136] The touch sensor chip 1208 may also include a measurement circuit (eg, sensor circuit 107) coupled to the ultrasonic receiver. The measurement circuit may detect touch or no touch based on the measurement signal.

[0137] The ultrasonic touch sensor 1200 may also include a light source 1211 (eg, an activation light source) coupled to the back side 1207 of the flexible circuit substrate 1205 and configured to generate activation light.

[0138] The ultrasonic touch sensor 1200 may also include a coupling medium 1212 that at least partially fills the package cavity 1202. The coupling medium 1212 may couple the transducer transceiver 1209 (e.g., an ultrasonic transmitter and an ultrasonic receiver) to the touch structure 1201. In addition, the coupling medium 1212 includes a luminescent material that is configured to be activated by an activation light to generate a backlight emitted from the package cavity 1202. In some implementations, the coupling medium 1212 couples the front side 1206 of the flexible circuit substrate 1205 to the inner surface 1204 of the touch structure 1201. In addition, in some implementations, the transducer transceiver 1209 (e.g., an ultrasonic transmitter and an ultrasonic receiver) and the light source 1211 may be encapsulated by the coupling medium 1212.

[0139] Touch structure 1201 may include an optically transparent area 1213 that is transparent to a backlight so that the backlight can be emitted from ultrasonic touch sensor 1200 into the environment.

[0140] As indicated above, Fig.12 are provided as examples. Other examples may be related to Fig.12 Different than described.

[0141] The following summarizes some aspects of the present disclosure:

[0142] Aspect 1: An ultrasonic touch sensor, comprising: a shell having a packaging cavity; an ultrasonic transmitter arranged in the packaging cavity, wherein the ultrasonic transmitter is configured to transmit an ultrasonic transmission wave; an ultrasonic receiver arranged in the packaging cavity, wherein the ultrasonic receiver is configured to receive an ultrasonic reflection wave generated by reflection of the ultrasonic transmission wave and generate a measurement signal representing the ultrasonic reflection wave; a measurement circuit arranged in the packaging cavity and coupled to the ultrasonic receiver, wherein the measurement circuit is configured to detect touch or non-touch based on the measurement signal; a light source configured to generate activation light; and a coupling medium filling or at least partially filling the packaging cavity, wherein the coupling medium includes a luminescent material, which is configured to be activated by the activation light to generate backlight emitted from the packaging cavity.

[0143] Aspect 2: The ultrasonic touch sensor of aspect 1, wherein the light source is arranged in the packaging cavity, and wherein the coupling medium encapsulates the ultrasonic transmitter, the ultrasonic receiver, the measurement circuit and the light source in the packaging cavity.

[0144] Aspect 3: The ultrasonic touch sensor of any one of Aspects 1-2, wherein a coupling medium is coupled to the ultrasonic transmitter and the ultrasonic receiver, and wherein the ultrasonic transmitter and the ultrasonic receiver are mechanically and acoustically coupled via the coupling medium.

[0145] Aspect 4: The ultrasonic touch sensor of any of Aspects 1-3, wherein the coupling medium is a gel, and wherein the luminescent material comprises a photoluminescent material or a chemiluminescent material.

[0146] Aspect 5: The ultrasonic touch sensor of any one of Aspects 1-4, wherein the light-emitting material comprises a photoluminescent material, the photoluminescent material comprising a fluorescent material, a phosphorescent material or a quantum dot.

[0147] Aspect 6: The ultrasonic touch sensor of any one of Aspects 1-5, wherein the light source is an ultraviolet light source or a blue light source, and the backlight is visible light.

[0148] Aspect 7: The ultrasonic touch sensor of any one of Aspects 1-6, further comprising: a touch structure coupled to the shell and a coupling medium, wherein the touch structure is arranged above the packaging cavity and includes a touch surface for receiving a touch, wherein the coupling medium couples an ultrasonic transmitter and an ultrasonic receiver to the touch structure, wherein the touch structure includes an optically transparent area that is transparent to a backlight so that the backlight is emitted from the ultrasonic touch sensor through the optically transparent area of ​​the touch structure, wherein the ultrasonic transmitter is configured to emit an ultrasonic transmit wave toward the touch structure, and wherein an ultrasonic reflected wave is generated by reflection of the ultrasonic transmit wave at the touch structure.

[0149] Aspect 8: An ultrasonic touch sensor of any one of Aspects 1-7, wherein the housing includes an encapsulation molding, and the encapsulation cavity is a groove formed in the encapsulation molding, and wherein the ultrasonic touch sensor further includes: a touch structure coupled to the housing and the coupling medium, wherein the touch structure is arranged above the encapsulation cavity and includes a touch surface for receiving a touch, and wherein the touch structure includes an optically transparent area that is transparent to a backlight.

[0150] Aspect 9: An ultrasonic touch sensor of any one of Aspects 1-8, wherein the shell includes an encapsulation molding, and the encapsulation cavity is a cavity defined by the encapsulation molding, and wherein the ultrasonic touch sensor further includes: a touch structure coupled to the shell and the coupling medium, wherein the touch structure is arranged above the encapsulation cavity and includes a touch surface for receiving a touch, and wherein the touch structure includes an optically transparent area that is transparent to the backlight.

[0151] Aspect 10: The ultrasonic touch sensor of any of Aspects 1-9, wherein the ultrasonic transmitter is a first capacitive micromachined ultrasonic transducer (CMUT) or a first piezoelectric micromachined ultrasonic transducer (PMUT), and wherein the ultrasonic receiver is a second CMUT or a second PMUT.

[0152] Aspect 11: An ultrasonic touch sensor of any one of Aspects 1-10, wherein the ultrasonic transmitter and the ultrasonic receiver are embodied in a single capacitive micromachined ultrasonic transducer (CMUT) or a single piezoelectric micromachined ultrasonic transducer (PMUT), wherein the single CMUT or the single PMUT can be configured in a transmitting mode to serve as an ultrasonic transmitter and can be configured in a receiving mode to serve as an ultrasonic receiver.

[0153] Aspect 12: An ultrasonic touch sensor according to any one of Aspects 1-11, wherein the light source is a first light source, the activation light generated by the first light source is a first activation light, the coupling medium is a first coupling medium, the luminescent material is a first luminescent material, and the backlight is a first backlight, wherein the ultrasonic touch sensor also includes: a first wavelength filter that separates the packaging cavity into a first area and a second area; a second light source that is configured to generate a second activation light; and a second coupling medium that fills or at least partially fills the second area of ​​the packaging cavity, wherein the second coupling medium includes a second luminescent material that is configured to be activated by the second activation light to generate a second backlight emitted from the packaging cavity, wherein the first coupling medium fills or at least partially fills the first area of ​​the packaging cavity, wherein the first wavelength filter is opaque to the first activation light and the second activation light, so that the first wavelength filter blocks the first activation light from entering the second area of ​​the packaging cavity and blocks the second activation light from entering the first area of ​​the packaging cavity, and wherein the first wavelength filter is transparent to the first backlight and the second backlight.

[0154] Aspect 13: The ultrasonic touch sensor of Aspect 12 also includes: a second wavelength filter that separates the packaging cavity into a second area and a third area; a third light source that is configured to generate a third activation light; and a third coupling medium that fills or at least partially fills the third area of ​​the packaging cavity, wherein the third coupling medium includes a third luminescent material that is configured to be activated by the third activation light to generate a third backlight emitted from the packaging cavity, wherein the second wavelength filter is opaque to the second activation light and the third activation light, so that the second wavelength filter blocks the second activation light from entering the third area of ​​the packaging cavity and blocks the third activation light from entering the second area of ​​the packaging cavity, and wherein the second wavelength filter is transparent to the first backlight, the second backlight, and the third backlight.

[0155] Aspect 14: The ultrasonic touch sensor of Aspect 13, wherein the first activation light, the second activation light, and the third activation light are ultraviolet light, wherein the first backlight has a first wavelength corresponding to a first color of visible light, the second backlight has a second wavelength corresponding to a second color of visible light, and the third backlight has a third wavelength corresponding to a third color of visible light, and wherein the first color, the second color, and the third color are different colors.

[0156] Aspect 15: The ultrasonic touch sensor of Aspect 14, wherein a first color among the first color, the second color, and the third color is red, a second color among the first color, the second color, and the third color is green, and a third color among the first color, the second color, and the third color is blue.

[0157] Aspect 16: The ultrasonic touch sensor of Aspect 12 further includes: a scattering coupling medium, which is arranged in the packaging cavity on the first coupling medium and the second coupling medium, wherein the scattering coupling medium is configured to receive a first backlight from the first coupling medium and to spread the first backlight through the packaging cavity so as to uniformly emit the first backlight from the packaging cavity, and wherein the scattering coupling medium is configured to receive a second backlight from the second coupling medium and to spread the second backlight through the packaging cavity so as to uniformly emit the second backlight from the packaging cavity.

[0158] Aspect 17: The ultrasonic touch sensor of Aspect 12, wherein the second area surrounds the first area such that the second coupling medium surrounds the first coupling medium.

[0159] Aspect 18: An ultrasonic touch sensor according to any one of Aspects 1-17, wherein the light source is a first light source, the activation light generated by the first light source is a first activation light having a first wavelength, the coupling medium is a first coupling medium, the luminescent material is a first luminescent material, and the backlight is a first backlight, wherein the encapsulation cavity includes a first area and a second area, wherein the first coupling medium fills or at least partially fills the first area of ​​the encapsulation cavity, wherein the ultrasonic touch sensor also includes: a second light source, which is configured to generate a second activation light having a second wavelength, which is different from the first wavelength; and a second coupling medium, which fills or at least partially fills the second area of ​​the encapsulation cavity, wherein the second coupling medium includes a second luminescent material, which is configured to be activated by the second activation light to generate a second backlight emitted from the encapsulation cavity, wherein the first luminescent material is not excited by the second wavelength, and wherein the second luminescent material is not excited by the first wavelength.

[0160] Aspect 19: The ultrasonic touch sensor of Aspect 18, wherein the packaging cavity includes a third area, wherein the ultrasonic touch sensor further includes: a third light source configured to generate a third activation light having a third wavelength, which is different from the first wavelength and the second wavelength; and a third coupling medium, which fills or at least partially fills the third area of ​​the packaging cavity, wherein the third coupling medium includes a third luminescent material, which is configured to be activated by the third activation light to generate a third backlight emitted from the packaging cavity, wherein the first luminescent material is not excited by the second wavelength or the third wavelength, wherein the second luminescent material is not excited by the first wavelength or the third wavelength, and wherein the third luminescent material is not excited by the first wavelength or the second wavelength.

[0161] Aspect 20: The ultrasonic touch sensor of Aspect 18 further includes: a scattering coupling medium, which is arranged in the packaging cavity on the first coupling medium and the second coupling medium, wherein the scattering coupling medium is configured to receive the first backlight from the first coupling medium and to spread the first backlight through the packaging cavity so as to uniformly emit the first backlight from the packaging cavity, and wherein the scattering coupling medium is configured to receive the second backlight from the second coupling medium and to spread the second backlight through the packaging cavity so as to uniformly emit the second backlight from the packaging cavity.

[0162] Aspect 21: The ultrasonic touch sensor of Aspect 18, wherein the second area surrounds the first area such that the second coupling medium surrounds the first coupling medium.

[0163] Aspect 22: An ultrasonic touch sensor of any one of Aspects 1-21, wherein the light source is a first light source, the activation light generated by the first light source is a first activation light, the coupling medium is a first coupling medium, the luminescent material is a first luminescent material, and the backlight is a first backlight, wherein the packaging cavity includes a first groove and a second groove, wherein the shell includes a packaging molding defining the first groove and the second groove, wherein the ultrasonic transmitter is arranged at the first groove and the ultrasonic receiver is arranged at the second groove, wherein the first coupling medium fills or at least partially fills the first groove, and wherein the ultrasonic touch sensor also includes: a second light source configured to generate a second activation light; and a second coupling medium that fills or at least partially fills the second groove, wherein the second coupling medium includes a second luminescent material, which is configured to be activated by the second activation light to generate a second backlight emitted from the packaging cavity.

[0164] Aspect 23: An ultrasonic touch system, comprising: a shell having a first packaging cavity and a second packaging cavity; a first ultrasonic transmitter, which is arranged in the first packaging cavity; a first ultrasonic receiver, which is arranged in the first packaging cavity and is acoustically coupled to the first ultrasonic transmitter; a second ultrasonic transmitter, which is arranged in the second packaging cavity; a second ultrasonic receiver, which is arranged in the second packaging cavity and is acoustically coupled to the second ultrasonic transmitter; a first activation light source, which is configured to generate a first activation light; a first coupling medium, which fills or at least partially fills the first packaging cavity, wherein the first coupling medium includes a first luminescent material, which is configured to be activated by the first activation light to generate a first backlight emitted from the first packaging cavity; and a second coupling medium, which fills or at least partially fills the second packaging cavity, wherein the second coupling medium includes a second luminescent material, which is configured to be activated by the first activation light to generate a second backlight emitted from the second packaging cavity.

[0165] Aspect 24: The ultrasonic touch system of Aspect 23, wherein the first packaging cavity includes a first area and a second area, wherein the second packaging cavity includes a third area and a fourth area, wherein the first coupling medium fills or at least partially fills the first area, wherein the second coupling medium fills or at least partially fills the third area, wherein the ultrasonic touch system also includes: a second activation light source, which is configured to generate a second activation light; a third activation light source, which is configured to generate a third activation light; a third coupling medium, which fills or at least partially fills the third area, wherein the third coupling medium includes a third luminescent material, which is configured to be activated by the second activation light to generate a third backlight emitted from the first packaging cavity; and a fourth coupling medium, which fills or at least partially fills the fourth area, wherein the fourth coupling medium includes a fourth luminescent material, which is configured to be activated by the third activation light to generate a fourth backlight emitted from the second packaging cavity.

[0166] Aspect 25: The ultrasonic touch system of any one of Aspects 23-24, further comprising: a touch structure coupled to the shell, coupled to the first coupling medium and coupled to the second coupling medium, wherein the touch structure is arranged above the first packaging cavity and the second packaging cavity, and includes a touch surface for receiving a touch, and wherein the touch structure includes a first optically transparent area that is transparent to the first backlight and a second optically transparent area that is transparent to the second backlight.

[0167] Aspect 26: An ultrasonic touch sensor, comprising: a touch structure arranged above a packaging cavity, wherein the touch structure includes a touch surface and an inner surface; a flexible circuit substrate having a front side and a rear side coupled to the inner surface of the touch structure; an ultrasonic transmitter coupled to the rear side of the flexible circuit substrate and configured to transmit an ultrasonic transmission wave toward the touch structure; an ultrasonic receiver coupled to the rear side of the flexible circuit substrate and configured to receive an ultrasonic reflection wave generated by reflection of the ultrasonic transmission wave at the touch structure and generate a measurement signal representing the ultrasonic reflection wave; a measurement circuit coupled to the back side of the flexible circuit substrate and to the ultrasonic receiver, wherein the measurement circuit is configured to detect touch or non-touch based on the measurement signal; a light source coupled to the rear side of the flexible circuit substrate and configured to generate activation light; and a coupling medium filling or at least partially filling the packaging cavity, wherein the coupling medium couples the ultrasonic transmitter and the ultrasonic receiver to the touch structure, and wherein the coupling medium includes a luminescent material configured to be activated by the activation light to generate backlight emitted from the packaging cavity.

[0168] Aspect 27: The ultrasonic touch sensor of Aspect 26, wherein the touch structure includes an optically transparent area that is transparent to the backlight.

[0169] Aspect 28: The ultrasonic touch sensor of any of Aspects 26-27, wherein the coupling medium couples the front side of the flexible circuit substrate to the inner surface of the touch structure.

[0170] Aspect 29: The ultrasonic touch sensor of any of Aspects 26-28, wherein the ultrasonic transmitter, the ultrasonic receiver, and the light source are enclosed by a coupling medium.

[0171] Aspect 30: A system configured to perform one or more operations recited in one or more of Aspects 1-29.

[0172] Aspect 31: An apparatus comprising means for performing one or more operations recited in one or more of Aspects 1-29.

[0173] Aspect 32: A non-transitory computer-readable medium for storing an instruction set, the instruction set comprising one or more instructions, which, when executed by a device, causes the device to perform one or more operations recited in one or more of aspects 1-29.

[0174] Aspect 33: A computer program product comprising instructions or codes for performing one or more operations recited in one or more of Aspects 1-29.

[0175] The foregoing disclosure provides illustration and description, but is not intended to be exhaustive or to limit the implementations to the precise forms disclosed. Modifications and variations are possible in light of the above disclosure or may be acquired from practice of the implementations.

[0176] Some implementations may be described herein in conjunction with thresholds. As used herein, "satisfying" a threshold may refer to a value being greater than a threshold, more than a threshold, above a threshold, greater than or equal to a threshold, less than a threshold, less than a threshold, below a threshold, less than or equal to a threshold, equal to a threshold, etc.

[0177] As used herein, the term "component" is intended to be broadly interpreted as hardware, firmware, or a combination of hardware and software. Obviously, the systems and / or methods described herein can be implemented in different forms of hardware, firmware, or a combination of hardware and software. The actual dedicated control hardware or software code used to implement these systems and / or methods does not limit the implementation. Therefore, the operation and behavior of the systems and / or methods are described herein without reference to specific software code - it should be understood that software and hardware can be designed to implement the systems and / or methods based on the description herein.

[0178] Any processing component can be implemented as a central processing unit (CPU) or other processor that reads and executes a software program from a non-transitory computer-readable recording medium such as a hard disk or a semiconductor memory device. For example, instructions can be executed by one or more processors, such as one or more CPUs, digital signal processors (DSPs), general-purpose microprocessors, application-specific integrated circuits (ASICs), field programmable logic arrays (FPLAs), programmable logic controllers (PLCs), or other equivalent integrated or discrete logic circuit devices. Therefore, the term "processor" used herein refers to any of the above structures or any other structure suitable for implementing the technology described herein. The software can be stored on a non-transitory computer-readable medium, so that the non-transitory computer-readable medium includes a program code or a program algorithm stored thereon, which causes the processor to perform the steps of the method via a computer program when executed.

[0179] A controller including hardware may also perform one or more of the techniques of the present disclosure. A controller including one or more processors may use electrical signals and digital algorithms to perform its reception, analysis, and control functions, which may also include correction functions. Such hardware, software, and firmware may be implemented in the same device or in separate devices to support the various techniques described in the present disclosure.

[0180] Signal processing circuitry and / or signal conditioning circuitry may receive one or more signals (e.g., measurement signals) in the form of raw measurement data from one or more components, and may derive further information from the measurement signals. Signal conditioning as used herein refers to manipulating an analog signal in a manner such that the signal meets the requirements of the next stage for further processing. Signal conditioning may include conversion from analog to digital (e.g., via an analog-to-digital converter), amplification, filtering, conversion, biasing, range matching, isolation, and any other process that makes the signal suitable for processing after conditioning.

[0181] Even if a specific combination of features is listed in the claims and / or disclosed in the specification, these combinations are not intended to limit the disclosure of the implementation described herein. Many of these features can be combined in a manner that is not clearly stated in the claims and / or not disclosed in the specification. For example, the disclosure includes the combination of each dependent claim in the claim set with each other independent claim in the claim set and each combination of multiple claims in the claim set. As used herein, the phrase "at least one" referring to the list of items refers to any combination of these items, including a single member. For example, "at least one of a, b or c" is intended to cover a, b, c, a+b, a+c, b+c and a+b+c, and any combination with multiple identical elements (e.g., a+a, a+a+a, a+a+b, a+a+c, a+b+b, a+c+c, b+b, b+b+b, b+b+c, c+c and c+c+c, or any other ordering of a, b and c).

[0182] In addition, it should be understood that the disclosure of multiple actions or functions disclosed in the specification or claims cannot be interpreted as being in a specific order. Therefore, the disclosure of multiple actions or functions does not limit them to a specific order unless these actions or functions are not interchangeable for technical reasons. In addition, in some implementations, a single action may include or may be decomposed into multiple sub-actions. Unless explicitly excluded, such sub-actions may be included and become part of the disclosure of the single action.

[0183] Unless clearly described, any element, action or instruction used herein should not be interpreted as key or necessary. In addition, as used herein, the article "a" and "an" are intended to include one or more projects, and can be used interchangeably with "one or more". In addition, as used herein, the article "the" is intended to include one or more projects quoted in conjunction with the article "the", and can be used interchangeably with "the one or more". When only intending to relate to a project, phrases "only one", "single" or similar language are used. In addition, as used herein, the term "has", "have", "having" etc. are intended to be open terms, and do not limit the elements they modify (for example, "having" A elements may also have B). In addition, unless otherwise clearly stated, the phrase "based on" is intended to mean "based at least in part". As used herein, the term "several" can be replaced with "multiple", and vice versa. Furthermore, as used herein, the term "or" is intended to be inclusive when used in a series and may be used interchangeably with "and / or" unless expressly stated otherwise (eg, if used in combination with "either" or "only one").

Claims

1. An ultrasonic touch sensor, comprising: A housing having a packaging cavity; an ultrasonic transmitter, the ultrasonic transmitter being arranged in the packaging cavity, wherein the ultrasonic transmitter is configured to transmit an ultrasonic transmission wave; an ultrasonic receiver, the ultrasonic receiver being arranged in the packaging cavity, wherein the ultrasonic receiver is configured to receive an ultrasonic reflection wave generated by reflection of the ultrasonic transmission wave and to generate a measurement signal representing the ultrasonic reflection wave; a measurement circuit disposed within the package cavity and coupled to the ultrasonic receiver, wherein the measurement circuit is configured to detect a touch or a non-touch based on the measurement signal; a light source configured to generate activation light; as well as A coupling medium fills or at least partially fills the encapsulation cavity, wherein the coupling medium includes a luminescent material configured to be activated by the activation light to generate backlight emitted from the encapsulation cavity.

2. The ultrasonic touch sensor according to claim 1, wherein the light source is arranged in the packaging cavity, and The coupling medium encapsulates the ultrasonic transmitter, the ultrasonic receiver, the measuring circuit and the light source in the packaging cavity.

3. The ultrasonic touch sensor of claim 1 , wherein the coupling medium is coupled to the ultrasonic transmitter and the ultrasonic receiver, and The ultrasonic transmitter and the ultrasonic receiver are mechanically and acoustically coupled via the coupling medium.

4. The ultrasonic touch sensor of claim 1 , wherein the coupling medium is a gel, and The luminescent material comprises a photoluminescent material or a chemiluminescent material. 5 . The ultrasonic touch sensor of claim 1 , wherein the light emitting material comprises a photoluminescent material, and the photoluminescent material comprises a fluorescent material, a phosphorescent material, or a quantum dot. 6 . The ultrasonic touch sensor according to claim 1 , wherein the light source is an ultraviolet light source or a blue light source, and the backlight is visible light.

7. The ultrasonic touch sensor according to claim 1, further comprising: a touch structure coupled to the housing and the coupling medium, wherein the touch structure is disposed above the package cavity and includes a touch surface for receiving the touch, wherein the coupling medium couples the ultrasonic transmitter and the ultrasonic receiver to the touch structure, wherein the touch structure includes an optically transparent area that is transparent to the backlight so that the backlight is emitted from the ultrasonic touch sensor through the optically transparent area of ​​the touch structure, wherein the ultrasonic transmitter is configured to transmit the ultrasonic transmission wave toward the touch structure, and The ultrasonic reflected wave is generated by reflection of the ultrasonic transmitted wave at the touch structure.

8. The ultrasonic touch sensor according to claim 1, wherein the housing comprises an encapsulation molding, and the encapsulation cavity is a groove formed in the encapsulation molding, and The ultrasonic touch sensor further comprises: A touch structure is coupled to the housing and the coupling medium, wherein the touch structure is disposed over the encapsulation cavity and includes a touch surface for receiving the touch, and wherein the touch structure includes an optically transparent region that is transparent to the backlight.

9. The ultrasonic touch sensor of claim 1, wherein the housing comprises an encapsulation molding, and the encapsulation cavity is a cavity defined by the encapsulation molding, and The ultrasonic touch sensor further comprises: A touch structure is coupled to the housing and the coupling medium, wherein the touch structure is disposed over the encapsulation cavity and includes a touch surface for receiving the touch, and wherein the touch structure includes an optically transparent region that is transparent to the backlight.

10. The ultrasonic touch sensor according to claim 1, wherein the ultrasonic transmitter is a first capacitive micromachined ultrasonic transducer (CMUT) or a first piezoelectric micromachined ultrasonic transducer (PMUT), and The ultrasonic receiver is a second CMUT or a second PMUT.

11. The ultrasonic touch sensor according to claim 1 , wherein the ultrasonic transmitter and the ultrasonic receiver are embodied in a single capacitive micromachined ultrasonic transducer (CMUT) or a single piezoelectric micromachined ultrasonic transducer (PMUT), The single CMUT or the single PMUT may be configured in a transmission mode to serve as the ultrasonic transmitter and may be configured in a reception mode to serve as the ultrasonic receiver.

12. The ultrasonic touch sensor of claim 1 , wherein the light source is a first light source, the activation light generated by the first light source is a first activation light, the coupling medium is a first coupling medium, the luminescent material is a first luminescent material, and the backlight is a first backlight, The ultrasonic touch sensor further comprises: a first wavelength filter, wherein the first wavelength filter divides the packaging cavity into a first area and a second area; a second light source configured to generate a second activation light; as well as a second coupling medium, the second coupling medium filling or at least partially filling the second region of the encapsulation cavity, wherein the second coupling medium comprises a second luminescent material, the second luminescent material being configured to be activated by the second activation light to generate a second backlight emitted from the encapsulation cavity, The first coupling medium fills or at least partially fills the first region of the packaging cavity, wherein the first wavelength filter is opaque to the first activation light and the second activation light, such that the first wavelength filter blocks the first activation light from entering the second region of the package cavity and blocks the second activation light from entering the first region of the package cavity, and The first wavelength filter is transparent to the first backlight and the second backlight.

13. The ultrasonic touch sensor according to claim 12, further comprising: a second wavelength filter, wherein the second wavelength filter divides the packaging cavity into the second area and a third area; a third light source configured to generate a third activation light; as well as a third coupling medium, the third coupling medium filling or at least partially filling the third region of the encapsulation cavity, wherein the third coupling medium comprises a third luminescent material, the third luminescent material being configured to be activated by the third activation light to generate a third backlight emitted from the encapsulation cavity, wherein the second wavelength filter is opaque to the second activation light and the third activation light, such that the second wavelength filter blocks the second activation light from entering the third region of the encapsulation cavity and blocks the third activation light from entering the second region of the encapsulation cavity, and The second wavelength filter is transparent to the first backlight, the second backlight and the third backlight.

14. The ultrasonic touch sensor according to claim 13, wherein the first activation light, the second activation light, and the third activation light are ultraviolet light, wherein the first backlight has a first wavelength corresponding to a first color of visible light, the second backlight has a second wavelength corresponding to a second color of visible light, and the third backlight has a third wavelength corresponding to a third color of visible light, and The first color, the second color and the third color are different colors.

15. The ultrasonic touch sensor of claim 14, wherein a first color among the first color, the second color, and the third color is red, a second color among the first color, the second color, and the third color is green, and a third color among the first color, the second color, and the third color is blue.

16. The ultrasonic touch sensor according to claim 12, further comprising: a scattering coupling medium, wherein the scattering coupling medium is arranged in the packaging cavity on the first coupling medium and the second coupling medium, wherein the scattering coupling medium is configured to receive the first backlight from the first coupling medium and spread the first backlight through the packaging cavity to uniformly emit the first backlight from the packaging cavity, and The scattering coupling medium is configured to receive the second backlight from the second coupling medium and spread the second backlight through the packaging cavity to uniformly emit the second backlight from the packaging cavity. 17 . The ultrasonic touch sensor of claim 12 , wherein the second region surrounds the first region such that the second coupling medium surrounds the first coupling medium.

18. The ultrasonic touch sensor of claim 1 , wherein the light source is a first light source, the activation light generated by the first light source is a first activation light having a first wavelength, the coupling medium is a first coupling medium, the luminescent material is a first luminescent material, and the backlight is a first backlight, The packaging cavity includes a first area and a second area. The first coupling medium fills or at least partially fills the first region of the packaging cavity, The ultrasonic touch sensor further comprises: a second light source configured to generate a second activation light having a second wavelength different from the first wavelength; as well as a second coupling medium, the second coupling medium filling or at least partially filling the second region of the encapsulation cavity, wherein the second coupling medium comprises a second luminescent material, the second luminescent material being configured to be activated by the second activation light to generate a second backlight emitted from the encapsulation cavity, wherein the first luminescent material is not excited by the second wavelength, and The second luminescent material is not excited by the first wavelength.

19. The ultrasonic touch sensor according to claim 18, wherein the package cavity comprises a third area, The ultrasonic touch sensor further comprises: a third light source configured to generate a third activation light having a third wavelength, the third wavelength being different from the first wavelength and the second wavelength; as well as a third coupling medium, the third coupling medium filling or at least partially filling the third region of the encapsulation cavity, wherein the third coupling medium comprises a third luminescent material, the third luminescent material being configured to be activated by the third activation light to generate a third backlight emitted from the encapsulation cavity, wherein the first luminescent material is not excited by the second wavelength or the third wavelength, wherein the second luminescent material is not excited by the first wavelength or the third wavelength, and The third luminescent material is not excited by the first wavelength or the second wavelength.

20. The ultrasonic touch sensor of claim 18, further comprising: a scattering coupling medium, wherein the scattering coupling medium is arranged in the packaging cavity on the first coupling medium and the second coupling medium, wherein the scattering coupling medium is configured to receive the first backlight from the first coupling medium and spread the first backlight through the packaging cavity to uniformly emit the first backlight from the packaging cavity, and The scattering coupling medium is configured to receive the second backlight from the second coupling medium and spread the second backlight through the packaging cavity to uniformly emit the second backlight from the packaging cavity.

21. The ultrasonic touch sensor of claim 18, wherein the second region surrounds the first region such that the second coupling medium surrounds the first coupling medium.

22. The ultrasonic touch sensor of claim 1, wherein the light source is a first light source, the activation light generated by the first light source is a first activation light, the coupling medium is a first coupling medium, the emissive material is a first emissive material, and the backlight is a first backlight, The packaging cavity includes a first groove and a second groove, wherein the housing comprises an encapsulation molding defining the first groove and the second groove, wherein the ultrasonic transmitter is arranged at the first groove and the ultrasonic receiver is arranged at the second groove, wherein the first coupling medium fills or at least partially fills the first groove, and The ultrasonic touch sensor further comprises: a second light source configured to generate a second activation light; as well as A second coupling medium fills or at least partially fills the second groove, wherein the second coupling medium includes a second luminescent material, and the second luminescent material is configured to be activated by the second activation light to generate a second backlight emitted from the packaging cavity.

23. Ultrasonic touch system, including: A housing having a first packaging cavity and a second packaging cavity; A first ultrasonic transmitter, wherein the first ultrasonic transmitter is arranged in the first packaging cavity; a first ultrasonic receiver, the first ultrasonic receiver being disposed in the first packaging cavity and being acoustically coupled to the first ultrasonic transmitter; a second ultrasonic transmitter, wherein the second ultrasonic transmitter is arranged in the second packaging cavity; a second ultrasonic receiver, the second ultrasonic receiver being disposed in the second packaging cavity and being acoustically coupled to the second ultrasonic transmitter; a first activation light source configured to generate a first activation light; a first coupling medium filling or at least partially filling the first encapsulation cavity, wherein the first coupling medium comprises a first luminescent material configured to be activated by the first activation light to generate a first backlight emitted from the first encapsulation cavity; as well as A second coupling medium fills or at least partially fills the second encapsulation cavity, wherein the second coupling medium includes a second luminescent material, and the second luminescent material is configured to be activated by the first activation light to generate a second backlight emitted from the second encapsulation cavity.

24. The ultrasonic touch system according to claim 23, wherein the first packaging cavity comprises a first area and a second area, The second packaging cavity includes a third area and a fourth area, wherein the first coupling medium fills or at least partially fills the first region, wherein the second coupling medium fills or at least partially fills the third region, The ultrasonic touch system further comprises: a second activation light source configured to generate a second activation light; a third activation light source, the third activation light source being configured to generate a third activation light; a third coupling medium, the third coupling medium filling or at least partially filling the third region, wherein the third coupling medium comprises a third luminescent material, the third luminescent material being configured to be activated by the second activation light to generate a third backlight emitted from the first encapsulation cavity; as well as A fourth coupling medium fills or at least partially fills the fourth area, wherein the fourth coupling medium includes a fourth luminescent material, and the fourth luminescent material is configured to be activated by the third activation light to generate a fourth backlight emitted from the second encapsulation cavity.

25. The ultrasonic touch system of claim 23, further comprising: a touch structure coupled to the housing, to the first coupling medium and to the second coupling medium, The touch structure is arranged above the first packaging cavity and the second packaging cavity and includes a touch surface for receiving a touch, and The touch structure includes a first optically transparent area that is transparent to the first backlight and a second optically transparent area that is transparent to the second backlight.

Images