Chip resource management system

Abstract

The invention provides a chip resource management system. The chip resource management system comprises a chip management module, a part management module, a design change management module and a calculation module. The chip management module is used for classifying, storing and managing chips to be managed according to various management dimensions; the part management module performs data interaction with an external management system, the external management system stores configuration information of various parts of various vehicle types, and the part management module is used for establishing a mutual mapping relation among the vehicle types, the parts and chips; the design change management module is used for obtaining part design change information when part design is changed, and the design change management module is used for updating the mutual mapping relation according to the part design change information; and the calculation module is used for calculating chip localization rates of different vehicle types according to the updated mutual mapping relation. By adopting the scheme of the invention, the problem that related data cannot be accurately presented in multiple dimensions in chip resource management in the prior art is solved.

Description

Technical Field

[0001] The present invention relates to the field of electronics, and in particular to a chip resource management system. Background Art

[0002] With the rapid development of the automotive industry and the improvement of the level of intelligence, the application of automotive chips in automobiles is becoming more and more extensive. Automotive chips can not only improve the performance and safety of automobiles, but also realize functions such as intelligent driving and vehicle networking. Therefore, vehicle chip resource management has become an issue that automakers and chip suppliers need to focus on. Vehicle chip resource management involves the management of the selection, configuration, scheduling, and monitoring of automotive chips. First, automakers need to select suitable chips based on the functional and performance requirements of the vehicle, and then configure and integrate them. During the operation of the vehicle, chip resources need to be dynamically scheduled and monitored to ensure their stable operation and efficient utilization.

[0003] At present, data management tasks such as resource management, component chip statistics, and localization rate calculation for automotive-grade chips are all completed using Excel spreadsheets, which manually record the specific chip models, supplier manufacturers, and localization chip replacement models used in the corresponding configuration components of each model, and the statistics and calculation of the corresponding localization rate are also completed through spreadsheet calculations. There are related problems such as insufficient accuracy of information storage, inability to trace and version important sensitive information, inconvenient statistics due to large data volumes, and lack of management dimensions.

[0004] As sensitive commercial information, the BOM data of chips configured in each model of the brand must ensure that the information is accurate, the change records are traceable, the information dimensions are complete, the statistical data is accurate, and it has credibility to meet the needs of "precise localization". For example: As an important indicator, the chip localization rate has a clear calculation formula and many statistical dimensions. The design change time is an important reference in the calculation process of the chip localization rate, and is closely related to the contribution rate of domestic chips. The design change time for each component to switch to a domestic chip is different. It is a dynamic update process. The BOM of each chip will also change. The real-time updated data is difficult to maintain manually, and it is very easy to make mistakes, and it cannot be updated synchronously in real time.

[0005] Currently, no effective solution has been proposed to the above problems. Summary of the invention

[0006] The main purpose of the present invention is to provide a chip resource management system to solve the problem in the prior art that chip resource management cannot accurately present relevant data in multiple dimensions.

[0007] In order to achieve the above objective, according to one aspect of the present invention, a chip resource management system is provided.

[0008] Furthermore, the chip resource management system includes: a chip management module, which is used to classify and store the chips to be managed according to multiple management dimensions; a parts management module, which exchanges data with an external management system, which stores configuration information of multiple parts of multiple vehicle models, and the parts management module is used to establish a mutual mapping relationship between each vehicle model, each part and chip; a design change management module, which is used to obtain part design change information when changing part design, and the design change management module is used to update the mutual mapping relationship according to the part design change information; a calculation module, which is used to calculate the chip localization rate of different vehicle models according to the updated mutual mapping relationship.

[0009] Furthermore, the chip resource management system also includes: a calibration module, which is used to calibrate the origin labels of the parts in the configuration information, the origin labels include domestic labels and non-domestic labels, and the parts management module is used to establish a mutual mapping relationship between parts and chips of each model whose origin labels are domestic labels.

[0010] Furthermore, the management dimensions include at least one of chip model, chip style, manufacturer name, whether it is an automotive-grade chip, place of origin, and chip application status.

[0011] Furthermore, the calculation module includes: a time determination submodule, the time determination submodule is used to determine the boarding time after the chip is switched after the part design is changed, and the calculation module is used to calculate the chip localization rate of different models based on the boarding time after the chip is switched and the updated mutual mapping relationship.

[0012] Furthermore, the calculation module exchanges data with the TDS system, which stores the production information of each vehicle model. The calculation module is used to calculate the localization rate of chips for different vehicle models based on the production information and the updated mutual mapping relationship.

[0013] Furthermore, the external management system includes an EBOM system, and the configuration information includes at least the name, number, and number of parts mounted under each configuration of each vehicle model.

[0014] Furthermore, the parts management module includes a data filtering submodule, and the data filtering submodule is used to filter the configuration information of the parts that do not include the chip from the external management system.

[0015] Furthermore, the resource management system also includes an approval module, which is used to verify the legitimacy of the request object and the request operation when receiving a request to modify the information stored in the chip management module.

[0016] Furthermore, the resource management system also includes an encryption module, which is used to encrypt information stored in at least one of the chip management module, the parts management module, the design change management module, and the calculation module.

[0017] Furthermore, the resource management system also includes a visualization module, which is used to display information stored in at least one of the chip management module, the parts management module, the design change management module, and the calculation module in a visual form.

[0018] By applying the technical solution of the present invention, firstly, the chip management module is used to classify and store the chips according to the corresponding dimensions, thereby ensuring the traceability and version management of the chip data. Then, the parts management module is used to realize the mutual mapping relationship between each vehicle model, each part and chip, thereby realizing preliminary chip resource management, ensuring the visibility and traceability of the data, and providing basic data support for data statistics. Secondly, the design change management module updates the mutual mapping relationship according to the part design change information, thereby realizing the dynamic update of the statistical data and obtaining the data in real time. Finally, the calculation module is used to calculate the localization rate of the chips of different vehicle models according to the updated mutual mapping relationship, thereby ensuring the accuracy of the relevant calculations. The solution of the present invention solves the problems related to the insufficient storage accuracy of chip resource management information in the prior art, the inability to trace and version important sensitive information, the inconvenience of statistics due to large data volume, and the lack of management dimensions. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The drawings constituting a part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0020] Figure 1 A module distribution diagram of an embodiment of a chip resource management system according to the present invention is shown. DETAILED DESCRIPTION

[0021] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0022] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0023] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the terms used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0024] Now, exemplary embodiments according to the present application will be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments may be implemented in a variety of different forms and should not be construed as being limited to the embodiments described herein. It should be understood that these embodiments are provided to make the disclosure of the present application thorough and complete, and to fully convey the concepts of these exemplary embodiments to those of ordinary skill in the art. In the accompanying drawings, for the sake of clarity, the thickness of the layers and regions may be enlarged, and the same reference numerals are used to represent the same devices, and thus their descriptions will be omitted.

[0025] Combination Figure 1 As shown, according to a specific embodiment of the present application, a chip resource management system is provided.

[0026] like Figure 1 As shown, the chip resource management system includes: a chip management module, a parts management module, a design change management module, and a calculation module. The chip management module is used to classify and store the chips to be managed according to multiple management dimensions; the parts management module exchanges data with the external management system, which stores the configuration information of multiple parts of multiple vehicle models; the parts management module is used to establish the mutual mapping relationship between each vehicle model, each part and chip; the design change management module is used to obtain the part design change information when changing the part design, and the design change management module is used to update the mutual mapping relationship according to the part design change information; the calculation module is used to calculate the localization rate of chips of different vehicle models according to the updated mutual mapping relationship.

[0027] By applying the technical solution of the present invention, firstly, the chip management module is used to classify and store the chips according to the corresponding dimensions, thereby ensuring the traceability and version management of the chip data. Then, the parts management module is used to realize the mutual mapping relationship between each vehicle model, each part and chip, thereby realizing preliminary chip resource management, ensuring the visibility and traceability of the data, and providing basic data support for data statistics. Secondly, the design change management module updates the mutual mapping relationship according to the part design change information, thereby realizing the dynamic update of the statistical data and obtaining the data in real time. Finally, the calculation module is used to calculate the localization rate of the chips of different vehicle models according to the updated mutual mapping relationship, thereby ensuring the accuracy of the relevant calculations. The solution of the present invention solves the problems related to the insufficient storage accuracy of chip resource management information in the prior art, the inability to trace and version important sensitive information, the inconvenience of statistics due to large data volume, and the lack of management dimensions.

[0028] Specifically, the chip resource management system also includes: a calibration module, which is used to calibrate the origin labels of the parts in the configuration information, the origin labels include domestic labels and non-domestic labels, a parts management module is used to establish a mutual mapping relationship between each vehicle model, each part and chip, and the parts management module is used to establish a mutual mapping relationship between each vehicle model, parts with domestic origin labels and chips.

[0029] Preferably, the calibration module calibrates the origin labels of the parts in the configuration information, and can use text classification algorithms, such as naive Bayes classifiers, support vector machines, etc., to perform text analysis on product information, thereby automatically determining its labels. Through the classification model, accurate label predictions can be made for new product information, which is more intelligent. The original technology uses manual labeling, where humans analyze and judge product information and then manually label it accordingly. This method is time-consuming and labor-intensive.

[0030] Tag calibration refers to assigning a unique identifier to a tag in the chip resource management system so that the system can accurately identify and manage each tag. In the chip resource management system, tag calibration usually includes the following steps:

[0031] 1. Create a tag type: First, you need to define the tag type, including the tag name, description, attributes, etc. In this embodiment, the origin tag is calibrated, and the origin tag includes domestic tags and non-domestic tags.

[0032] 2. Assign tag identifiers: Assign a unique identifier to each tag, usually a number or a combination of letters. This identifier will uniquely identify the tag in the system.

[0033] 3. Associate tags and chips: Associate tags and chips to ensure that each chip has a corresponding tag.

[0034] 4. Update tag information: With the use and management of tags in the system, it may be necessary to continuously update tag information, such as tag status, location, etc.

[0035] 5. Delete label: When a label is no longer used or needs to be replaced, the label information needs to be deleted from the system to ensure the accuracy of the system data.

[0036] Through the above steps, the chip resource management system can accurately identify and manage each tag to ensure the accuracy and integrity of system data.

[0037] Preferably, a parts management module is created in the chip resource management system to realize the association of "car model-configuration-parts-chips", and the digital system captures data to form the BOM of chips for each car model. In this way, on the basis of the original classification of chips, the association between "car model-configuration-parts-chips" is realized, thus realizing the preliminary chip resource management, ensuring the visibility and traceability of data, and providing basic data support for data statistics.

[0038] Specifically, the management dimensions include at least one of chip model, chip style, manufacturer name, whether it is an automotive-grade chip, place of origin, and chip application status.

[0039] Preferably, the chips used in each vehicle model are classified and managed through multiple dimensions, and chip category and model labels are added. Different types of chips are classified according to the dimensions of "chip model-chip model-manufacturer name-whether it is a car-standard chip-whether it is a domestic chip-classification (applied / reserve)" to form a "chip information database". If the specific information of the chip needs to be modified, it is necessary to go through the approval process and apply for the corresponding authority, which ensures the traceability and version management of the chip data.

[0040] A total of 437 chip models are defined in the chip resource management system of this embodiment, which is the latest model classification based on the categories and parameters of automotive chips, and a category label is added to each chip.

[0041] Automotive chips can be classified and divided into parameters according to their uses and functional characteristics. Common categories and parameters include:

[0042] 1. Controller category: including vehicle controller, motor controller, charging controller, etc. Parameters include control mode (PWM, CAN, etc.), control accuracy, maximum power, etc.

[0043] 2. Sensor category: including vehicle speed sensor, steering sensor, temperature sensor, etc. Parameters include sensor type (Hall sensor, photoelectric sensor, etc.), measurement range, accuracy, etc.

[0044] 3. Communication: including CAN bus chips, LIN bus chips, etc., parameters include communication rate, communication protocol support, etc.

[0045] 4. Power management: including battery management chips, DC-DC conversion chips, etc. Parameters include input voltage range, output voltage range, efficiency, etc.

[0046] 5. Processor category: including MCU, DSP, etc., parameters include main frequency, storage capacity, number of interfaces, etc.

[0047] 6. General interface category: including USB chips, Ethernet chips, etc., parameters include interface type, rate, etc.

[0048] 7. Security category: including encryption chips, protection chips, etc., parameters include encryption algorithms, protection levels, etc.

[0049] Specifically, the calculation module includes: a time determination submodule, which is used to determine the time for the chip to be loaded on board after the chip is switched after the part design is changed, and the calculation module is used to calculate the chip localization rate of different models based on the time for the chip to be loaded on board after the chip is switched and the updated mutual mapping relationship.

[0050] It should be noted that the calculation formula for the chip localization rate is: chip localization rate = actual number of domestically produced chips / total number of chips*100%. The localization rate of each category of chips can also be calculated and counted separately. There are two statistical dimensions for the proportion of domestically produced chips:

[0051] (1) The localization rate is counted and calculated according to the base number of various types of chips proposed by the competent authorities. The calculation formula for the proportion of domestic chips used in each department is as follows: Numerator: The actual number of domestic chips completed = (the number of domestic chips for this part * the number of configuration 1 for this part * the sum of the actual output of configuration 1 + the number of domestic chips for this part * the number of configuration 2 for this part * the sum of the actual output of configuration 2 + ...); If a new part is replaced, the replaced part will be calculated as the new part.

[0052] Denominator: Total number of chips = the sum of actual production of parts for each department corresponding to the vehicle model * the sum of the base number of a single type of chips.

[0053] Chip localization rate = numerator / denominator.

[0054] (2) Calculated based on the total number of chips installed in the actual vehicle, the calculation formula is as follows:

[0055] Numerator: The actual number of domestically produced chips completed = (the number of domestically produced chips for this part * the number of configuration 1 for this part * the sum of the actual output of configuration 1 + the number of domestically produced chips for this part * the number of configuration 2 for this part * the sum of the actual output of configuration 2 + ...); if a new part is replaced, the replaced part will be calculated as the new part.

[0056] Denominator: Total number of chips = ∑((Total number of chips of this part (including domestic and foreign chips) * Number of chips of this part with configuration 1 * Sum of actual output of configuration 1 + Total number of chips of this part (including domestic and foreign chips) * Number of chips of this part with configuration 2 * Sum of actual output of configuration 2 + …)); If a new part is replaced, the replaced part will be calculated as the new part.

[0057] Chip localization rate = numerator / denominator.

[0058] Regardless of the calculation method used, after the old parts and new parts are switched, the contribution to the chip localization rate is different due to the different number of domestic chips. The time point of switching between old parts and new parts is defined as the time of chip installation after the chip is switched. Since the time of chip installation after each component is switched is different, the contribution to the annual localization rate is also different. The earlier the installation time, the greater the contribution to the localization rate. The setting change time may change due to various factors. Suppose a part undergoes a domestic chip switch on the Xth natural day of the year and is installed on the vehicle. The total number of chips of a part before the switch is C, the number of domestic chips is A, the number after the switch is B (B>A), and the daily output is M. Then the contribution rate of domestic chips before the switch is: A*M*(365-X) / C*M*(365-X). Among them, 365 is the number of natural days in the whole year.

[0059] After the switch, the contribution rate of domestic chips is: B*M*(365-X) / C*M*(365-X).

[0060] Specifically, the calculation module exchanges data with the TDS system. The TDS system stores the production information of each vehicle model. The calculation module is used to calculate the chip localization rate of different vehicle models based on the production information and the updated mutual mapping relationship.

[0061] Preferably, the above embodiment introduces a method for calculating the localization rate of chips. Because the time of installation of chips after replacement of different models and different parts is different, a more complicated calculation process will be generated. Use the TDS system to store the design change information of each part of different models in the system, capture the design change information of the parts through the part number in the chip resource management system, introduce the design change information into the localization rate calculation module, and use the two-month delay of the new part OTS approval date as the starting time for the chip to make a contribution value after replacement, so as to improve the accuracy of the localization rate calculation.

[0062] Specifically, the external management system includes an EBOM system, and the configuration information includes at least the name, number, and number of parts mounted under each configuration of each vehicle model.

[0063] It should be noted that the EBOM system is an engineering BOM (Bill of Materials) system used to manage the bill of materials during the product design phase. The EBOM system can help engineers and design teams manage and track the required parts and materials during the product design phase to ensure the accuracy and completeness of product design.

[0064] Optionally, the chip resource management system is interconnected with the EBOM system that stores the configuration information of each vehicle model, realizing information synchronization. That is, the information of the part name, part number, and number of parts mounted under each configuration of each vehicle model will be synchronized in the digital system and updated in real time. The system can assign tasks to each component designer, and the designer can mark the "whether it contains chip labels" of the component with "yes" and "no", and simultaneously maintain the total number of chips and the number of domestic chips of the chip-containing components. In this way, the formula can be edited to automatically calculate the localization rate of the chips configured for each vehicle model, ensuring the accuracy of the relevant calculations.

[0065] Optionally, when the "parts-chip" information of the chip management module and the parts management module is confirmed, the relevant vehicle configuration information in the EBOM system will be linked to the chip resource management system. The system will capture the data according to the "whether it contains chips, whether it is domestically produced" label, count the total number of chips and the number of domestic chips of the chip-containing parts, and calculate the number of chips, the number of domestic chips and the localization rate of each configuration of the vehicle model through the system according to the edited formula, so as to realize the online automatic calculation of relevant statistical data. The system can interact with the actual daily inventory volume (TDS system) and the order system of production, obtain the production information of each vehicle model, and obtain various statistical data according to actual needs. At the same time, the design change management module is also connected to the resource management system, and the current status of the parts is represented in the form of a timeline. The two months after the OTS approval time of the parts are creatively used as the time for the chips to be installed after the chip is replaced. From this point in time, the chips installed on the vehicle are calculated according to the chips after the replacement. The relevant statistical data are calculated according to the time points on the timeline of each part, and the dynamic update of the statistical data is realized, which confirms the accuracy of the relevant calculations.

[0066] Specifically, the parts management module includes a data filtering submodule, which is used to filter the configuration information of the parts that do not include the chip from the external management system. The data filtering submodule refers to a module for screening and filtering specific data, and is usually used to pre-process or clean the data in the data processing flow. Its function is to extract the data that meets the conditions from the original data according to the set conditions, or to eliminate the data that does not meet the conditions, so as to facilitate subsequent data analysis or processing. In this embodiment, the data filtering submodule filters out the configuration information of the parts that do not belong to the chip (for example: housing / housing material circuit board / PCB board, capacitors and inductors, connectors and sockets, switches and buttons, LED indicators, sensors, etc.), and the data filtering submodule can help to quickly and accurately extract the required data, reduce the complexity of data processing, and improve the efficiency and accuracy of data processing.

[0067] Specifically, the resource management system further includes an approval module, which is used to verify the legitimacy of the request object and the request operation when receiving a request to modify the information stored in the chip management module.

[0068] Optionally, when the chip information of a part of a certain vehicle model changes, the change information is clarified, and after going through the corresponding approval process, the information is modified in the chip library of the chip resource management system after approval to ensure the integrity of the information dimension. After confirming that the chip information is modified correctly, the chip resource management system updates the vehicle model statistics according to the previous function settings, and the corresponding mapping relationship is also updated accordingly.

[0069] Specifically, the resource management system also includes an encryption module, which is used to encrypt information stored in at least one of the chip management module, the parts management module, the design change management module, and the computing module.

[0070] The encryption module plays a very important role in the chip resource management system, mainly including the following aspects:

[0071] 1. Data security protection: The encryption module can encrypt sensitive data to ensure that the data is not stolen or tampered with during transmission and storage, thereby ensuring data security.

[0072] 2. Access control: The encryption module can implement access control to the system. Only authorized users can access the data and functions in the system, preventing unauthorized users from performing malicious operations on the system.

[0073] 3. Authentication: The encryption module can be used to verify the user's identity, ensuring that only legitimate users can access the system and preventing illegal users from impersonating others to perform operations.

[0074] 4. Secure communication: The encryption module can realize encrypted data transmission, protect data from being stolen or tampered with during network transmission, and ensure the security of communication.

[0075] In short, the role of the encryption module in the chip resource management system is to ensure the security of the system and data, prevent data leakage and malicious operations, and improve the security and stability of the system.

[0076] Specifically, the resource management system also includes a visualization module, which is used to display information stored in at least one of the chip management module, the parts management module, the design change management module, and the calculation module in a visual form.

[0077] Optionally, the visualization module can monitor the information stored in the chip management module, parts management module, design change management module, and computing module in real time, allowing users to promptly understand the status of chip operation. It can also provide an alarm function to detect problems and make adjustments in a timely manner, helping users better manage and optimize chip resources.

[0078] From the above description, it can be seen that the above embodiments of the present invention achieve the following technical effects:

[0079] 1. Use the chip resource management system to collect statistics on relevant data based on accurate basic data, enrich the presentation dimensions of the data, and complete the digital management of the entire process from chip resource management to "vehicle type-configuration-chip" in multiple dimensions to accurately present relevant data.

[0080] 2. Determine the time for chip installation after chip switching, introduce the time for chip installation into the statistical method of chip localization rate calculation and evaluation system, and update it in real time to improve the accuracy of localization rate calculation.

[0081] 3. The models are divided into 437 types according to the categories and parameters of automotive chips, and category labels are added to each chip. According to the specific application scenarios and needs of the vehicle, suitable automotive chips can be selected, which facilitates the replacement of chips.

[0082] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0083] In addition to the above, it should be noted that "one embodiment", "another embodiment", "embodiment", etc. mentioned in this specification refer to the specific features, structures or characteristics described in conjunction with the embodiment included in at least one embodiment generally described in this application. The same expression appearing in multiple places in the specification does not necessarily refer to the same embodiment. Further, when describing a specific feature, structure or characteristic in conjunction with any embodiment, it is claimed that the realization of such feature, structure or characteristic in conjunction with other embodiments also falls within the scope of the present invention.

[0084] In the above embodiments, the description of each embodiment has its own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0085] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A chip resource management system, characterized in that: include: A chip management module, which is used to classify and store the chips to be managed according to multiple management dimensions; A parts management module, wherein the parts management module exchanges data with an external management system, wherein the external management system stores configuration information of various parts of various vehicle models, and the parts management module is used to establish a mutual mapping relationship between each of the vehicle models, each of the parts, and the chip; A design change management module, the design change management module is used to obtain part design change information when changing part design, and the design change management module is used to update the mutual mapping relationship according to the part design change information; A calculation module is used to calculate the chip localization rate of different vehicle models based on the updated mutual mapping relationship.

2. The chip resource management system according to claim 1, characterized in that: The chip resource management system also includes: a calibration module, which is used to calibrate the origin labels of the parts in the configuration information, the origin labels include domestic labels and non-domestic labels, and the parts management module is used to establish a mutual mapping relationship between each of the vehicle models, the parts with the domestic origin labels and the chips.

3. The chip resource management system according to claim 1, characterized in that: The management dimensions include at least one of chip model, chip style, manufacturer name, whether it is an automotive-grade chip, origin, and chip application status.

4. The chip resource management system according to claim 1, characterized in that: The calculation module includes: a time determination submodule, which is used to determine the boarding time after the chip is switched after the part design is changed, and the calculation module is used to calculate the chip localization rate of different vehicle models based on the boarding time after the chip is switched and the updated mutual mapping relationship.

5. The chip resource management system according to claim 1, characterized in that: The calculation module exchanges data with the TDS system, the TDS system stores the production information of each vehicle model, and the calculation module is used to calculate the chip localization rate of different vehicle models based on the production information and the updated mutual mapping relationship.

6. The chip resource management system according to claim 1, characterized in that: The external management system includes an EBOM system, and the configuration information includes at least the name, number, and number of parts mounted under each configuration of each vehicle model.

7. The chip resource management system according to claim 1, characterized in that: The part management module includes a data filtering submodule, and the data filtering submodule is used to filter the configuration information of the part that does not include the chip from the external management system.

8. The chip resource management system according to claim 1, characterized in that: The resource management system further comprises an approval module, which is used to verify the legality of the request object and the request operation when receiving a request to modify the information stored in the chip management module.

9. The chip resource management system according to claim 1, characterized in that: The resource management system further includes an encryption module, which is used to encrypt information stored in at least one of the chip management module, the parts management module, the design change management module, and the calculation module.

10. The chip resource management system according to claim 1, characterized in that: The resource management system further includes a visualization module, which is used to display information stored in at least one of the chip management module, the parts management module, the design change management module, and the calculation module in a visual form.

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