Method, device and equipment for solving equivalent thermal parameter of high-voltage cable and storage medium

Abstract

The application discloses a high-voltage cable equivalent thermal parameter solving method and device, equipment and a storage medium, comprising: in the process of the temperature rise experiment of the high-voltage cable, the outer skin temperature and the cable core temperature of the high-voltage cable are collected according to the preset period, the temperature rise equation group of the high-voltage cable is constructed based on the collected outer skin temperature and cable core temperature, and the equivalent thermal parameters of the high-voltage cable are solved by solving the temperature rise equation group. The application can shorten the time of the temperature rise experiment, reduce the time consumption of determining the thermal parameters, and solve all the equivalent thermal parameters by using the temperature data collected in the whole temperature rise experiment, thereby improving the solving speed of the equivalent thermal parameters of the high-voltage cable.

Description

Technical Field

[0001] This invention relates to the field of power transmission technology, and in particular to a method, apparatus, equipment, and storage medium for solving the equivalent thermal parameters of high-voltage cables. Background Technology

[0002] With the continuous development of society, the demand for electricity in cities is also increasing. In the power system, high-voltage cables bear a large number of power transmission tasks. Because heat loss occurs when current passes through the cable, causing the cable temperature to rise, excessively high cable temperature may reduce cable life, degrade cable performance, or even cause safety accidents. Therefore, in order to ensure the safe and stable operation of the power system, it is crucial to determine the core temperature of high-voltage cables.

[0003] The solution for the cable core temperature mainly relies on the thermal circuit model, which consists of three main elements: heat source, temperature, and thermal parameters. Knowing the values ​​of two of these elements allows us to calculate the value of the third. Since the heat source can be calculated based on the current flow and relevant electrical parameters of the cable, once the thermal parameters of the cable are known, the temperature of the cable conductor can be determined.

[0004] Currently, the equivalent thermal parameters of cables are generally solved based on experimental results. For the thermal resistance parameters of cables, the cables need to be heated to a constant temperature before the data values ​​at that constant temperature can be used for calculation. This process is time-consuming. Furthermore, the cable heat capacity parameters can only be calculated using transient temperature rise data after the thermal resistance parameters are obtained. Therefore, the solution for thermal resistance is the bottleneck in the calculation of equivalent thermal parameters. Summary of the Invention

[0005] This invention provides a method, apparatus, equipment, and storage medium for solving the equivalent thermal parameters of high-voltage cables, in order to solve the problem that it is time-consuming to solve the equivalent thermal parameters after heating the high-voltage cable to a constant temperature.

[0006] In a first aspect, the present invention provides a method for solving the equivalent thermal parameters of high-voltage cables, including:

[0007] During the temperature rise test of the high-voltage cable, the outer sheath temperature and core temperature of the high-voltage cable are collected according to a preset cycle.

[0008] A set of temperature rise equations for the high-voltage cable is constructed based on the collected outer sheath temperature and core temperature.

[0009] The equivalent thermal parameters of the high-voltage cable are obtained by solving the temperature rise equations.

[0010] Optionally, during the temperature rise test of the high-voltage cable, the outer sheath temperature and core temperature of the high-voltage cable are collected according to a preset cycle, including:

[0011] The high-voltage cable is energized with a preset current, causing the temperature of the outer sheath and core of the high-voltage cable to rise.

[0012] The outer sheath temperature and core temperature of the high-voltage cable are collected according to a preset cycle.

[0013] Optionally, a set of temperature rise equations for the high-voltage cable is constructed based on the collected outer sheath temperature and core temperature, including:

[0014] Construct a first-order thermal circuit model of the high-voltage cable;

[0015] Generate the first-order transient thermal circuit equations of the first-order thermal circuit model;

[0016] The temperature rise equations of the high-voltage cable are constructed by substituting the outer sheath temperature and core temperature of the high-voltage cable collected over multiple cycles into the first-order transient thermal circuit equation.

[0017] Optionally, a first-order thermal circuit model of the high-voltage cable is constructed, including:

[0018] A first-order thermal path model is constructed, consisting of an equivalent heat source, equivalent thermal resistance, and equivalent heat capacity.

[0019] Optionally, the first-order transient thermal circuit equations for the first-order thermal circuit model are generated as follows:

[0020]

[0021] Where k is the kth period, Δt is the time interval between two adjacent periods, Q is the equivalent heat source generated by the high-voltage cable under the preset current at Δt, C is the equivalent heat capacity, T is the equivalent thermal resistance, and θ c (k) represents the cable core temperature collected in the k-th cycle, θ o (k) represents the outer skin temperature collected in the k-th cycle, θ c (k+1) represents the core temperature of the cable in the (k+1)th cycle.

[0022] Optionally, the generated set of temperature rise equations is as follows:

[0023] Y = βX;

[0024] in:

[0025] Y = [θ] c (1)θ c (2)…θ c (N)] T ;

[0026]

[0027] Optionally, the equivalent thermal parameters of the high-voltage cable are obtained by solving the temperature rise equations, including:

[0028] The objective function for solving the temperature rise equations is constructed as follows:

[0029] F = min ||Y - Xβ|| 2 ;

[0030] The objective function is solved by linear regression to obtain β, which minimizes the objective function F, and is used as the equivalent thermal resistance T and equivalent heat capacity C of the high-voltage cable.

[0031] Secondly, the present invention provides a device for solving the equivalent thermal parameters of high-voltage cables, comprising:

[0032] The temperature acquisition module is used to acquire the outer sheath temperature and core temperature of the high-voltage cable according to a preset cycle during the temperature rise test of the high-voltage cable.

[0033] The equation construction module is used to construct a set of temperature rise equations for the high-voltage cable based on the collected outer sheath temperature and core temperature.

[0034] The equivalent thermal parameter solving module is used to solve the temperature rise equations to obtain the equivalent thermal parameters of the high-voltage cable.

[0035] Thirdly, the present invention provides an electronic device, the electronic device comprising:

[0036] At least one processor; and

[0037] A memory communicatively connected to the at least one processor; wherein,

[0038] The memory stores a computer program that can be executed by the at least one processor, the computer program being executed by the at least one processor to enable the at least one processor to perform the method for solving the equivalent thermal parameters of high-voltage cables according to any one of the first aspects of the present invention.

[0039] Fourthly, the present invention provides a computer-readable storage medium storing computer instructions, which are used to cause a processor to execute the method for solving the equivalent thermal parameters of high-voltage cables as described in any one of the first aspects of the present invention.

[0040] In this embodiment of the invention, during the temperature rise test of a high-voltage cable, the outer sheath temperature and core temperature of the high-voltage cable are collected according to a preset cycle. A set of temperature rise equations is constructed using the outer sheath temperature and core temperature collected during the temperature rise test. The equivalent thermal parameters of the high-voltage cable are then obtained by solving the set of temperature rise equations. This eliminates the need to raise the high-voltage cable to a constant temperature before collecting data to calculate the equivalent thermal parameters, which can shorten the temperature rise test time and reduce the time spent determining the thermal parameters. Furthermore, all equivalent thermal parameters can be solved simultaneously using the temperature data collected throughout the temperature rise test, thus improving the solution speed of the equivalent thermal parameters of the high-voltage cable.

[0041] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 This is a flowchart of a method for solving the equivalent thermal parameters of a high-voltage cable according to Embodiment 1 of the present invention;

[0044] Figure 2 This is a schematic diagram of the transient thermal circuit model of a high-voltage cable according to an embodiment of the present invention;

[0045] Figure 3 This is a schematic diagram of the simplified first-order thermal circuit model of the transient thermal circuit model of the high-voltage cable in an embodiment of the present invention.

[0046] Figure 4 This is a flowchart of a method for solving the equivalent thermal parameters of a high-voltage cable according to Embodiment 2 of the present invention;

[0047] Figure 5 This is a schematic diagram of the structure of a device for solving the equivalent thermal parameters of high-voltage cables provided in Embodiment 3 of the present invention;

[0048] Figure 6 This is a schematic diagram of the structure of the electronic device provided in Embodiment 4 of the present invention. Detailed Implementation

[0049] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0050] Example 1

[0051] Figure 1 This is a flowchart of a method for solving equivalent thermal parameters of a high-voltage cable according to Embodiment 1 of the present invention. This embodiment is applicable to solving the equivalent thermal resistance and equivalent heat source of a high-voltage cable. This method can be executed by a high-voltage cable equivalent thermal parameter solving device, which can be implemented in hardware and / or software and can be configured in an electronic device. Figure 1 As shown, the method for solving the equivalent thermal parameters of this high-voltage cable includes:

[0052] S101. During the temperature rise test of the high-voltage cable, the outer sheath temperature and core temperature of the high-voltage cable are collected according to the preset cycle.

[0053] In this embodiment, the high-voltage cable temperature rise experiment can refer to energizing the high-voltage cable, causing it to heat up, and collecting the temperature through temperature sensors installed on the outer sheath and core of the high-voltage cable. For example, when the temperature of the high-voltage cable begins to rise after being energized, the temperature sensors on the outer sheath and core can collect the temperature according to a preset cycle, obtaining the outer sheath temperature and core temperature collected in multiple cycles.

[0054] S102. Based on the collected outer sheath temperature and core temperature, construct a set of temperature rise equations for the high-voltage cable.

[0055] In the temperature rise equation set of this embodiment, each temperature rise equation has the equivalent heat capacity, equivalent thermal resistance, equivalent heat source (known quantity), and period interval of the high-voltage cable as constants, and the outer sheath temperature and core temperature of the current period as independent variables, and the core temperature of the next period as dependent variable. In the equation set formed, the equivalent heat capacity and equivalent thermal resistance are unknown quantities, which are the values ​​to be solved.

[0056] S103. Solve the temperature rise equations to obtain the equivalent thermal parameters of the high-voltage cable.

[0057] In one embodiment, an objective function can be constructed to solve the temperature rise equation system. The optimal solution that minimizes the objective function can be used to obtain the equivalent heat capacity and equivalent thermal resistance. After solving for the equivalent heat capacity and equivalent thermal resistance, the temperature of the high-voltage cable can be calculated using the equivalent heat capacity and equivalent thermal resistance.

[0058] In this embodiment of the invention, during the temperature rise test of a high-voltage cable, the outer sheath temperature and core temperature of the high-voltage cable are collected according to a preset cycle. A set of temperature rise equations is constructed using the outer sheath temperature and core temperature collected during the temperature rise test. The equivalent thermal parameters of the high-voltage cable are then obtained by solving the set of temperature rise equations. This eliminates the need to raise the high-voltage cable to a constant temperature before collecting data to calculate the equivalent thermal parameters, which can shorten the temperature rise test time and reduce the time spent determining the thermal parameters. Furthermore, all equivalent thermal parameters can be solved simultaneously using the temperature data collected throughout the temperature rise test, thus improving the solution speed of the equivalent thermal parameters of the high-voltage cable.

[0059] Example 2

[0060] Figure 2 This is a flowchart of a method for solving equivalent thermal parameters of high-voltage cables according to Embodiment 2 of the present invention. This embodiment optimizes Embodiment 1 as described above. Figure 4 As shown, the method for solving the equivalent thermal parameters of this high-voltage cable includes:

[0061] S201. A preset current is applied to the high-voltage cable, causing the temperature of the outer sheath and core of the high-voltage cable to rise.

[0062] Specifically, in the high-voltage cable temperature rise test, a high voltage can be applied to the high-voltage cable to obtain the current in the high-voltage cable as the preset current I. After the high-voltage cable is energized, the cable core heats up, causing the temperature of the cable core and the outer sheath to rise.

[0063] S202. Collect the outer sheath temperature and core temperature of the high-voltage cable according to the preset cycle.

[0064] In this embodiment, temperature sensors can be installed on the core and outer sheath of the high-voltage cable to collect the core temperature and outer sheath temperature. For example, the temperature can be collected at a preset interval, such as 5-second intervals. The core temperature can be denoted as {θ}. c (1), θ c (2), ..., θ c (k)}, the outer skin temperature can be denoted as {θ} o (1), θ o (2), ..., θ o (k)}.

[0065] S203. Construct a first-order thermal circuit model of the high-voltage cable.

[0066] like Figure 3The diagram shows a transient thermal circuit model established based on the structure of a cross-linked polyethylene (XLPE) high-voltage cable. From the inside out, the XLPE high-voltage cable consists of a cable core (conductor), an XLPE insulation layer, a buffer layer, an aluminum sheath layer, and an outer sheath layer. Figure 3 In, θ c θ i θ s θ o These represent the core temperature, insulation temperature, aluminum sheath temperature, and outer sheath temperature, respectively, T. i T b T o These represent the thermal resistance of the cable insulation layer, the thermal resistance of the cable buffer layer, and the thermal resistance of the cable outer sheath, respectively. c For the heat capacity of the cable core, C i1 C i2 For insulating distributed heat capacity, C b For the heat capacity of the buffer layer, C s For the heat capacity of the aluminum sheath, C o Q1 represents the heat capacity of the outer sheath, Q2 and Q3 represent the heat generated by the cable core, and Q4 represents the insulation loss of the cable.

[0067] Based on the principle of circuit simplification, the above Figure 3 The transient thermal circuit model can be simplified to Figure 4 The first-order thermal circuit model, in Figure 4 middle:

[0068] Q = Q1;

[0069] T = T i +T b +T o ;

[0070]

[0071] therefore, Figure 4 In the simplified first-order thermal circuit model, the equivalent thermal parameters of the cable have a corresponding relationship with the original transient thermal circuit model. Solving for the equivalent thermal parameters of the first-order transient thermal circuit model can also be used to characterize the thermal parameters in the transient thermal circuit model of the cable.

[0072] S204. Generate the first-order transient thermal circuit equations of the first-order thermal circuit model.

[0073] This embodiment can construct a first-order thermal path model consisting of an equivalent heat source Q, equivalent thermal resistance T, and equivalent heat capacity C. The following is combined with... Figure 4 The first-order thermal circuit model illustrates the generation process of the first-order transient thermal circuit equation.

[0074] Figure 4 The first-order transient thermal circuit equations of the first-order thermal circuit model are as follows:

[0075]

[0076] The equivalent heat source Q can be calculated using the IEC 60287 standard. The equivalent heat capacity C and equivalent thermal resistance T are unknowns. After performing a difference operation on the above first-order transient thermal circuit equations, the first-order transient thermal circuit equations of the first-order thermal circuit model can be obtained as follows:

[0077]

[0078] Where k is the kth period, Δt is the time interval between two adjacent periods, Q is the equivalent heat source generated by the high-voltage cable under the preset current at Δt, C is the equivalent heat capacity, T is the equivalent thermal resistance, and θ c (k) represents the cable core temperature collected in the k-th cycle, θ o (k) represents the outer skin temperature collected in the k-th cycle, θ c (k+1) represents the core temperature of the cable in the (k+1)th cycle.

[0079] S205. The outer sheath temperature and core temperature of the high-voltage cable collected over multiple cycles are substituted into the first-order transient thermal circuit equation to construct a set of temperature rise equations for the high-voltage cable.

[0080] Specifically, the following set of temperature rise equations can be constructed:

[0081] Y = βX;

[0082] in:

[0083] Y = [θ] c (1)θ c (2)…θ c (N)] T ;

[0084]

[0085] The core temperature θ is obtained in each cycle. c (N) and outer skin temperature θ o (N), and after calculating the heat generation Q and the periodic time interval Δt, substitute them into the above equations to obtain the temperature rise equations for the high-voltage cable.

[0086] S206. Construct the objective function for solving the temperature rise equation system.

[0087] The above temperature rise equations can be solved based on parameter identification, that is, the problem of solving the equations can be transformed into an optimization problem, i.e., the following objective function F can be constructed:

[0088] F = min ||Y - Xβ|| 2 .

[0089] S207. The objective function is solved by linear regression to obtain β that minimizes F, which is used as the equivalent thermal resistance T and equivalent heat capacity C of the high-voltage cable.

[0090] Linear regression is a statistical analysis method that uses regression analysis in mathematical statistics to determine the quantitative relationship of interdependence between two or more variables. Based on the type of relationship between independent and dependent variables, it can be divided into linear regression analysis and nonlinear regression analysis. Specifically, in this embodiment, linear regression is a regression analysis that uses a least-squares function called the linear regression equation to model the relationship between one or more independent and dependent variables. In this embodiment, for the objective function F, Y is the dependent variable and X is the independent variable. The goal is to find β that minimizes the objective function F. For example, the least squares method can be used to approximate and fit the optimal solution. T and C in the optimal solution β represent the equivalent thermal resistance T and equivalent heat capacity C of the high-voltage cable. After determining the equivalent thermal resistance T and equivalent heat capacity C, the cable core temperature in the (k+1)th cycle can be obtained using the first-order transient thermal circuit equation.

[0091] In this embodiment of the invention, a preset current is applied to a high-voltage cable, causing the temperature of the cable's outer sheath and core to rise. The outer sheath temperature and core temperature of the high-voltage cable are collected according to a preset cycle. After constructing a first-order thermal circuit model of the high-voltage cable, a first-order transient thermal circuit equation is generated. The outer sheath temperature and core temperature of the high-voltage cable collected over multiple cycles are substituted into the first-order transient thermal circuit equation to construct a set of temperature rise equations for the high-voltage cable. Furthermore, an objective function for solving the temperature rise equations is constructed. Linear regression is used to solve the objective function to obtain β, which minimizes F, and is used as the equivalent thermal resistance T and equivalent heat capacity C of the high-voltage cable. This eliminates the need to heat the high-voltage cable to a constant temperature before collecting data to calculate the equivalent thermal parameters, thus shortening the temperature rise experiment time and reducing the time required to determine the thermal parameters. Moreover, all equivalent thermal parameters can be solved simultaneously using the temperature data collected throughout the entire temperature rise experiment, improving the solution speed of the equivalent thermal parameters of the high-voltage cable.

[0092] Example 3

[0093] Figure 5 This is a schematic diagram of a device for solving the equivalent thermal parameters of a high-voltage cable according to Embodiment 3 of the present invention. Figure 5 As shown, the device for solving the equivalent thermal parameters of the high-voltage cable includes:

[0094] Temperature acquisition module 501 is used to acquire the outer sheath temperature and core temperature of the high-voltage cable according to a preset cycle during the temperature rise test of the high-voltage cable.

[0095] Equation construction module 502 is used to construct a set of temperature rise equations for the high-voltage cable based on the collected outer sheath temperature and core temperature.

[0096] The equivalent thermal parameter solving module 503 is used to solve the temperature rise equations to obtain the equivalent thermal parameters of the high-voltage cable.

[0097] Optionally, the temperature acquisition module 501 includes:

[0098] The energizing unit is used to energize the high-voltage cable with a preset current, thereby increasing the temperature of the outer sheath and core of the high-voltage cable.

[0099] The temperature acquisition unit is used to acquire the outer sheath temperature and core temperature of the high-voltage cable according to a preset cycle.

[0100] Optionally, the equation system construction module 502 includes:

[0101] A first-order thermal model construction unit is used to construct a first-order thermal circuit model of the high-voltage cable.

[0102] A first-order transient thermal circuit equation generation unit is used to generate the first-order transient thermal circuit equation of the first-order thermal circuit model.

[0103] The temperature rise equation construction unit is used to construct the temperature rise equation system of the high-voltage cable by substituting the outer sheath temperature and core temperature of the high-voltage cable collected in multiple cycles into the first-order transient thermal circuit equation.

[0104] Optionally, the first-order thermal model building unit is specifically used for:

[0105] A first-order thermal path model is constructed, consisting of an equivalent heat source, equivalent thermal resistance, and equivalent heat capacity.

[0106] Optionally, the first-order transient thermal circuit equations for the first-order thermal circuit model are generated as follows:

[0107]

[0108] Where k is the kth period, Δt is the time interval between two adjacent periods, Q is the equivalent heat source generated by the high-voltage cable under the preset current at Δt, C is the equivalent heat capacity, T is the equivalent thermal resistance, and θ c (k) represents the cable core temperature collected in the k-th cycle, θ o (k) represents the outer skin temperature collected in the k-th cycle, θ c (k+1) represents the core temperature of the cable in the (k+1)th cycle.

[0109] Optionally, the generated set of temperature rise equations is as follows:

[0110] Y = βX;

[0111] in:

[0112] Y = [θ] c (1)θ c (2)…θ c (N)] T ;

[0113]

[0114] Optionally, the equivalent thermal parameter solving module 503 includes:

[0115] The objective function construction unit is used to construct the objective function for solving the temperature rise equation system, and the objective function is as follows:

[0116] F = min ||Y - Xβ|| 2 ;

[0117] The optimal solution unit is used to solve the objective function using the linear regression method to obtain β that minimizes the objective function F, which is used as the equivalent thermal resistance T and equivalent heat capacity C of the high-voltage cable.

[0118] The high-voltage cable equivalent thermal parameter solving device provided in this embodiment of the invention can execute the high-voltage cable equivalent thermal parameter solving method provided in any embodiment of the invention, and has the corresponding functional modules and beneficial effects of the method.

[0119] Example 4

[0120] Figure 6 A schematic diagram of an electronic device 40 that can be used to implement embodiments of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices (e.g., helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the invention described and / or claimed herein.

[0121] like Figure 6As shown, the electronic device 40 includes at least one processor 41 and a memory, such as a read-only memory (ROM) 42 or a random access memory (RAM) 43, communicatively connected to the at least one processor 41. The memory stores computer programs executable by the at least one processor. The processor 41 can perform various appropriate actions and processes based on the computer program stored in the ROM 42 or loaded into the RAM 43 from storage unit 48. The RAM 43 may also store various programs and data required for the operation of the electronic device 40. The processor 41, ROM 42, and RAM 43 are interconnected via a bus 44. An input / output (I / O) interface 45 is also connected to the bus 44.

[0122] Multiple components in electronic device 40 are connected to I / O interface 45, including: input unit 46, such as keyboard, mouse, etc.; output unit 47, such as various types of monitors, speakers, etc.; storage unit 48, such as disk, optical disk, etc.; and communication unit 49, such as network card, modem, wireless transceiver, etc. Communication unit 49 allows electronic device 40 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0123] Processor 41 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processor 41 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. Processor 41 performs the various methods and processes described above, such as the method for solving the equivalent thermal parameters of high-voltage cables.

[0124] In some embodiments, the method for solving the equivalent thermal parameters of a high-voltage cable can be implemented as a computer program tangibly contained in a computer-readable storage medium, such as storage unit 48. In some embodiments, part or all of the computer program can be loaded and / or installed on electronic device 40 via ROM 42 and / or communication unit 49. When the computer program is loaded into RAM 43 and executed by processor 41, one or more steps of the method for solving the equivalent thermal parameters of a high-voltage cable described above can be performed. Alternatively, in other embodiments, processor 41 can be configured to perform the method for solving the equivalent thermal parameters of a high-voltage cable by any other suitable means (e.g., by means of firmware).

[0125] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.

[0126] Computer programs used to implement the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when executed by the processor, the computer programs cause the functions / operations specified in the flowcharts and / or block diagrams to be performed. The computer programs may be executed entirely on a machine, partially on a machine, or as a standalone software package, partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0127] In the context of this invention, a computer-readable storage medium can be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, apparatus, or device. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination thereof. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0128] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0129] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as data servers), or computing systems that include middleware components (e.g., application servers), or computing systems that include frontend components (e.g., user computers with graphical user interfaces or web browsers through which users can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., communication networks). Examples of communication networks include local area networks (LANs), wide area networks (WANs), blockchain networks, and the Internet.

[0130] A computing system can include clients and servers. Clients and servers are generally located far apart and typically interact through communication networks. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. The server can be a cloud server, also known as a cloud computing server or cloud host, which is a hosting product within the cloud computing service system to address the shortcomings of traditional physical hosts and VPS services, such as high management difficulty and weak business scalability.

[0131] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0132] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A method for solving the equivalent thermal parameter of a high voltage cable, characterized in that, The method comprises the following steps: During the temperature rise experiment of the high-voltage cable, the outer skin temperature and the cable core temperature of the high-voltage cable are collected according to a preset period; A temperature rise equation group of the high-voltage cable is constructed based on the collected outer skin temperature and cable core temperature; The equivalent thermal parameters of the high-voltage cable are obtained by solving the temperature rise equation group; The temperature rise equation group of the high-voltage cable is constructed based on the collected outer skin temperature and cable core temperature, which comprises the following steps: A first-order thermal circuit model composed of an equivalent heat source, an equivalent thermal resistance and an equivalent heat capacity is constructed; The first-order transient thermal circuit equation of the first-order thermal circuit model is generated as follows: ； wherein k is the kth cycle, Δt is the time interval between two adjacent cycles, Q is the equivalent heat source generated by the high voltage cable in Δt after energized with the preset current, C is the equivalent heat capacity, T is the equivalent thermal resistance, θ c (k) represents the cable core temperature collected in the kth cycle, θ o (k) represents the outer sheath temperature collected in the kth cycle, θ c (k+1) represents the cable core temperature in the k+1th cycle; The temperature rise equation group of the high-voltage cable is constructed by substituting the outer skin temperature and the cable core temperature of the high-voltage cable collected in multiple periods into the first-order transient thermal circuit equation as follows: ； Wherein: ； ； ； The equivalent thermal parameters of the high-voltage cable are obtained by solving the temperature rise equation group, which comprises the following steps: A target function for solving the temperature rise equation group is constructed, and the target function is as follows: ； The linear regression method is used to solve the target function to obtain β at the minimum value of the target function F, which is used as the equivalent thermal resistance T and the equivalent heat capacity C of the high-voltage cable.

2. The method for solving the equivalent thermal parameter of a high voltage cable according to claim 1, characterized in that, During the temperature rise experiment of the high-voltage cable, the outer skin temperature and the cable core temperature of the high-voltage cable are collected according to a preset period, which comprises the following steps: The high-voltage cable is energized with a preset current, so that the temperature of the outer skin and the cable core of the high-voltage cable rises; The outer skin temperature and the cable core temperature of the high-voltage cable are collected according to a preset period.

3. A device for solving the equivalent thermal parameter of a high voltage cable, characterized in that, The method comprises the following steps: A temperature collection module is configured to collect the outer skin temperature and the cable core temperature of the high-voltage cable according to a preset period during the temperature rise experiment of the high-voltage cable; An equation group construction module is configured to construct a temperature rise equation group of the high-voltage cable based on the collected outer skin temperature and cable core temperature; An equivalent thermal parameter solving module is configured to obtain the equivalent thermal parameters of the high-voltage cable by solving the temperature rise equation group; The equation group construction module comprises the following steps: A first-order thermal circuit model construction unit is configured to construct a first-order thermal circuit model of the high-voltage cable; A first-order transient thermal circuit equation generation unit is configured to generate a first-order transient thermal circuit equation of the first-order thermal circuit model as follows: ； wherein k is the kth cycle, Δt is the time interval between two adjacent cycles, Q is the equivalent heat source generated by the high-voltage cable in Δt after being powered with a preset current, C is the equivalent heat capacity, T is the equivalent thermal resistance, θ c (k) represents the cable core temperature collected in the kth cycle, θ o (k) represents the outer sheath temperature collected in the kth cycle, θ c (k+1) represents the cable core temperature in the k+1th cycle; A temperature rise equation group construction unit is configured to construct a temperature rise equation group of the high-voltage cable by substituting the outer skin temperature and the cable core temperature of the high-voltage cable collected in multiple periods into the first-order transient thermal circuit equation as follows: ； Wherein: ； ； ； The equivalent thermal parameter solving module comprises the following steps: A target function construction unit is configured to construct a target function for solving the temperature rise equation group, and the target function is as follows: ； An optimal solution solving unit is configured to use the linear regression method to solve the target function to obtain β at the minimum value of the target function F, which is used as the equivalent thermal resistance T and the equivalent heat capacity C of the high-voltage cable.

4. An electronic device, comprising: The electronic device comprises: at least one processor; and a memory connected with the at least one processor in communication; wherein The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor to enable the at least one processor to execute the high-voltage cable equivalent thermal parameter solving method in any one of claims 1-2.

5. A computer readable storage medium, characterized in that, The computer readable storage medium stores computer instructions for causing the processor to implement the high-voltage cable equivalent thermal parameter solving method in any one of claims 1-2 when executed.

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