Display module and display device

Abstract

The invention relates to a display module and a display device. The display module comprises a display panel; the first film layer is located on the backlight side of the display panel; the circuit board is located on the side, away from the display panel, of the first film layer; the first film layer comprises a first sub-film layer and a second sub-film layer, and the material elasticity modulus of the first sub-film layer is larger than that of the second sub-film layer. The first sub-film layer and the second sub-film layer are at least partially located in the same horizontal plane parallel to the plane where the display panel is located in the direction perpendicular to the plane where the display panel is located, and the second sub-film layer and the circuit board are at least partially overlapped. According to the display module, the first sub-film layer and the second sub-film layer which are different in elastic modulus are spliced to form the first film layer, the structural strength of the display module is guaranteed, meanwhile, marks are avoided through the second sub-film layer which is higher in deformation absorption capacity, and the display effect of the display module is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0002] Related technologies usually set part of the structure in the display panel on the backlight side of the display module by bending or other means, thereby reducing the space occupied by this part of the structure on the front of the display panel to achieve a narrow border effect. This design not only improves the aesthetics and screen-to-body ratio of the device, but also provides users with a broader visual experience. Specifically, some non-display functional components in traditional display panels, such as flexible printed circuits (FPCs), driver chips (ICs) and other connectors, usually occupy a certain edge area, resulting in an increase in the width of the border. By cleverly bending these components to the back of the display module, the size of the border can be significantly reduced, and even a "borderless" design can be achieved. Summary of the invention

[0003] In order to solve the above technical problems, the present disclosure provides a display module and a display device.

[0004] The present disclosure provides a display module, comprising: a display panel; a first film layer, located on the backlight side of the display panel; a circuit board, located on the side of the first film layer away from the display panel; the first film layer comprises a first sub-film layer and a second sub-film layer, the elastic modulus of the material of the first sub-film layer is greater than the elastic modulus of the material of the second sub-film layer, the first sub-film layer and the second sub-film layer are at least partially located in the same horizontal plane parallel to the plane where the display panel is located, and in a direction perpendicular to the plane where the display panel is located, the second sub-film layer and the circuit board at least partially overlap.

[0005] Based on the same inventive concept, the present disclosure also provides a display device, comprising any one of the display modules described above.

[0006] The technical solution provided by the present invention has the following advantages over the prior art: the display module provided by the present invention utilizes a first sub-membrane layer and a second sub-membrane layer with different elastic moduli to form a first film layer, while ensuring the structural strength of the display module, the second sub-membrane layer with stronger deformation absorption ability is used to avoid the generation of imprints, thereby improving the display effect of the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0008] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0009] Figure 1 It is a schematic diagram of the cross-sectional structure of a display module in the related art;

[0010] Figure 2 A partial cross-sectional structural schematic diagram of a display module provided by an embodiment of the present disclosure;

[0011] Figure 3 A partial planar structural schematic diagram of a display module provided in an embodiment of the present disclosure;

[0012] Figure 4 A partial cross-sectional structural schematic diagram of another display module provided by an embodiment of the present disclosure;

[0013] Figure 5 A partial cross-sectional structural schematic diagram of another display module provided by an embodiment of the present disclosure;

[0014] Figure 6 A partial cross-sectional structural schematic diagram of another display module provided by an embodiment of the present disclosure;

[0015] Figure 7 A partial planar structural schematic diagram of another display module provided in an embodiment of the present disclosure;

[0016] Figure 8 A partial cross-sectional structural schematic diagram of another display module provided by an embodiment of the present disclosure;

[0017] Fig. 9 A partial cross-sectional structural schematic diagram of another display module provided by an embodiment of the present disclosure;

[0018] Fig.10 A partial cross-sectional structural schematic diagram of another display module provided by an embodiment of the present disclosure;

[0019] Fig.11 A partial cross-sectional structural schematic diagram of another display module provided by an embodiment of the present disclosure;

[0020] Fig.12 A schematic diagram of the planar structure of a display device provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0021] In order to more clearly understand the above-mentioned purposes, features and advantages of the embodiments of the present disclosure, the scheme of the embodiments of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features therein can be combined with each other without conflict.

[0022] In the following description, many specific details are set forth to facilitate a full understanding of the embodiments of the present disclosure, but the embodiments of the present disclosure may also be implemented in other ways different from those described herein; obviously, the embodiments in the specification are only part of the embodiments of the present disclosure, rather than all of the embodiments.

[0023] In a related technique, Figure 1 As shown, the Z1 direction is the light emitting direction of the display panel panel, the light emitting side of the display panel panel (i.e. the side close to the light emitting direction) includes structures such as a polarizer POL and a glass cover Lens, and the backlight side of the display panel panel (i.e. the side away from the light emitting direction) includes structures such as a metal layer M, a pressure-sensitive adhesive layer PSA and a flexible circuit board FPC. Among them, the flexible circuit board FPC is bent to the backlight side of the display panel panel, thereby reducing the occupation of the structure on the front space of the display panel to achieve a narrow frame effect.

[0024] The flexible circuit board FPC contains a complex circuit structure, and its surface is often uneven. After the flexible circuit board FPC is assembled to the display module, Figure 1 As shown, the stress F from the light emitting direction on the flexible circuit board FPC will cause marks P on other film structures, thereby affecting the display effect of the panel. As the thickness of the display module becomes thinner and thinner, the marks produced by the above-mentioned flexible circuit board FPC will be more obvious, further affecting the display effect.

[0025] In view of this, the present disclosure provides a display module, such as Figure 2 and Figure 3 As shown, it includes a display panel 100, a first film layer 11 and a circuit board 20. Among them, Figure 3 shows a schematic diagram of the planar structure of the display module, Figure 2 Shows Figure 3 Schematic diagram of the partial cross-sectional structure of the display module cut along L1.

[0026] The first film layer 11 is located on the backlight side of the display panel 100 (ie, the side away from the light emitting direction Z1), and the circuit board 20 is located on the side of the first film layer 11 away from the display panel 100. Figure 1The first film layer 11 in the embodiment of the present disclosure is equivalent to replacing the metal layer M in the related art. In specific implementation, the display module also includes an upper structure 50 located on the light emitting side of the display panel 100 (i.e., the side close to the light emitting direction Z1). The specific structure of the upper structure 50 will be further described in the following embodiments.

[0027] Specifically, the display panel 100 includes a plurality of pixels for display, each pixel includes a light-emitting element and a corresponding pixel driving circuit, the pixel driving circuit is electrically connected to the circuit board 20 and receives a display signal provided by the circuit board 20, thereby driving the light-emitting element to emit light and display the corresponding picture.

[0028] Specifically, the circuit board 20 is a flexible circuit board. A flexible printed circuit board (FPC) is a printed circuit board made of a flexible substrate (such as polyimide film, polyester film, etc.). Through a special manufacturing process, functional components such as wires and thin wires are printed or attached to the substrate to form a circuit. Compared with traditional rigid circuit boards, flexible circuit boards have the advantages of better bendability, scalability, light weight, and small size. The structure of a flexible circuit board mainly includes a substrate layer, a metal layer, and a protective layer. The substrate layer uses a flexible insulating material, the metal layer generally uses copper foil, and the protective layer is used to protect the wire layer from damage and prevent erosion by environmental factors such as oxidation and corrosion.

[0029] In a specific embodiment, Figure 4 As shown, the circuit board 20 includes a non-bending area 21 and a bending area 22 . The non-bending area 21 of the circuit board 20 is connected to the display panel 100 through the bending area 22 , so that the circuit board 20 can provide the display panel 100 with the driving signal required to display the image. Figure 2 and Figure 3 The circuit board 20 in the illustrated embodiment mainly refers to its non-bending area, and the following embodiments are similar and will not be described in detail.

[0030] like Figure 2 and Figure 3 As shown, the first film layer 11 includes a first sub-film layer 111 and a second sub-film layer 112, and the first sub-film layer 111 and the second sub-film layer 112 are at least partially located in the same horizontal plane parallel to the plane where the display panel 100 is located. Figure 2 As shown, the first sub-film layer 111 and the second sub-film layer 112 have the same thickness, and together constitute a first film layer 11 with uniform thickness.

[0031] The elastic modulus of the material of the first sub-film layer 111 is greater than the elastic modulus of the material of the second sub-film layer 112 . In a direction perpendicular to the plane where the display panel 100 is located, the second sub-film layer 112 at least partially overlaps with the circuit board 20 .

[0032] Elastic modulus, also known as Young's modulus, is a measure of the ratio of stress to strain in a material during elastic deformation. It describes the material's ability to resist deformation under force, that is, the unit strain of the material under unit stress. Materials with high elastic modulus exhibit greater rigidity and less deformation when subjected to force, while materials with low elastic modulus are better at absorbing and dissipating energy through greater deformation.

[0033] The material elastic modulus of the first sub-film layer 111 is larger, which can ensure the overall structural strength of the display module and avoid module failure caused by strong stress from the backlight side of the display module damaging the structure. The material elastic modulus of the second sub-film layer 112 is smaller, and it can absorb and dissipate energy through larger deformation when subjected to external stress, thereby reducing the stress transmitted to subsequent film layers. Figure 5 As shown, the second sub-film layer 112 at least partially overlaps with the circuit board 20. When the circuit board 20 is subjected to stress F from the light emitting direction, the stress F can be absorbed by the second sub-film layer 112, thereby avoiding the generation of marks in other film layers. Moreover, even if the stress F is not completely absorbed by the second sub-film layer 112 to generate marks, since the elastic modulus of the material of the second sub-film layer 112 is relatively small, after the external stress disappears, its ability to recover deformation is also stronger than that of the first sub-film layer 111, and the generated marks can also be quickly dissipated.

[0034] The display module provided by the embodiment of the present disclosure utilizes a first sub-membrane layer 111 and a second sub-membrane layer 112 with different elastic moduli to form a first film layer 11. While ensuring the structural strength of the display module, the second sub-membrane layer 112 with stronger deformation absorption ability is used to avoid the generation of marks, thereby improving the display effect of the display module.

[0035] In some embodiments, the first sub-layer 111 and the second sub-layer 112 both include conductive materials. In a specific implementation, the first film layer 11 needs to be grounded.

[0036] When the display module is actually used, static electricity may accumulate on the metal surface of the electronic device including the display module. If not handled, the static electricity may be suddenly released when in contact, causing damage to the internal circuit. Making the first film layer 11 with a conductive material and grounding the first film layer 11 can provide a safe path for the static electricity to be quickly released, thereby protecting the electronic components in the display module from static electricity damage.

[0037] At the same time, the entire first film layer 11, as a large-area conductor, can play a good electromagnetic shielding role, prevent external electromagnetic interference from entering the display module, and inhibit the electromagnetic radiation generated inside the display module from leaking out, which helps to reduce the impact of noise on the display effect.

[0038] In some embodiments, the first sub-layer 111 includes metal.

[0039] The first sub-film layer 111 is used to ensure the overall structural strength of the display module and avoid module failure caused by strong stress from the backlight side of the display module damaging the structure. Within the range of conductive materials, metal processing technology is simple and the cost is low, and it is preferably the material of the first sub-film layer 111.

[0040] At the same time, metal generally has good thermal conductivity, which can help evenly distribute heat and quickly conduct it to the housing or heat sink. The first sub-film layer 111 made of metal can effectively conduct and dissipate the heat generated by the display module when it is working to the surrounding environment, thereby reducing the operating temperature of the display panel and improving the heat dissipation efficiency.

[0041] In a specific embodiment, the first sub-layer 111 includes copper.

[0042] Copper has a high thermal conductivity (about 401W / m·K) and is a common metal with good thermal conductivity. It can quickly and effectively conduct heat from the heat source, thereby improving the heat dissipation efficiency of the entire system. In addition, as a conductive material, copper also has a low resistivity, which can further improve the conductivity of the first sub-film layer 111. In addition, copper has a low cost and can achieve a good balance between performance and price, making it suitable for large-scale production and wide application.

[0043] In some embodiments, the second sub-layer 112 includes conductive foam.

[0044] In electronic devices, foam materials are widely used due to their light weight, flexibility, cushioning and insulation properties. In specific implementation, the above-mentioned conductive foam is made of foam as a base material, and a conductive material is added to the surface or inside of the foam. The conductive material can be graphene with good thermal conductivity and high electron mobility.

[0045] In a specific embodiment, the substrate of the conductive foam can be polyurethane foam, polyethylene foam, silicone foam, polystyrene foam, EVA foam, etc. The conductive material in the conductive foam can be graphene coating or impregnation, graphene composite material, three-dimensional graphene network, graphene fiber or woven mesh, etc.

[0046] In some embodiments, Figure 6 and Figure 7 As shown, in a direction perpendicular to the plane where the display panel 100 is located, the entire area of ​​the circuit board 20 overlaps with the second sub-film layer 112. Figure 7 shows a schematic diagram of the planar structure of the display module, Figure 6 Shows Figure 7 Schematic diagram of the partial cross-sectional structure of the display module cut along L2.

[0047] Specifically, Figure 3 As shown, the circuit board 20 only occupies a part of the display module area, and the first film layer 11 in the overlapping area with the circuit board 20 can be entirely set as the second sub-film layer 112, so that the external stress on the entire area of ​​the circuit board 20 can be absorbed by the second sub-film layer 112, further avoiding the generation of marks.

[0048] In some embodiments, Figure 8 As shown, the display module further includes a back adhesive layer 30 .

[0049] The adhesive layer 30 is located between the circuit board 20 and the first film layer 11 .

[0050] The elastic modulus of the material of the first sub-film layer 111 is greater than the elastic modulus of the material of the adhesive layer 30 .

[0051] The circuit board 20 bent to the back of the display panel 100 needs to be fixed by a back adhesive layer. In the related art, usually only pressure sensitive adhesives (PSA) are used as the back adhesive layer. The viscosity of the pressure sensitive adhesive accounts for a large proportion, so that after the two film layers are pasted together, it can be regarded as a solid, with a large elastic modulus, and cannot be restored after deformation. In order to further solve the problem of display panel imprints, the above embodiment of the present disclosure uses a material with a small elastic modulus as the back adhesive layer 30, so that the display module can further absorb external stress and improve the display effect.

[0052] In a specific implementation, the material of the adhesive layer 30 includes the above-mentioned foam, which can be polyurethane foam, polyethylene foam, silicone foam, polystyrene foam, EVA foam, etc.

[0053] In a specific embodiment, the back adhesive layer 30 may also include a pressure-sensitive adhesive, specifically a foam material with a pressure-sensitive adhesive coated on one side or both sides, that is, foam adhesive.

[0054] In some embodiments, Fig. 9 As shown, the adhesive layer 30 includes a first adhesive layer 31 and a second adhesive layer 32 .

[0055] The display panel 100 further includes a support layer 40 . The support layer 40 is located between the first adhesive layer 31 and the second adhesive layer 32 . The material hardness of the support layer 40 is greater than the material hardness of the adhesive layer 30 .

[0056] By adding a support layer 40 with greater hardness between the adhesive layers, the overall structural strength of the display module can be further improved, thereby avoiding module failure caused by structural damage due to strong stress from the backlight side of the display module.

[0057] In a specific implementation, the materials of the first adhesive layer 31 and the second adhesive layer 32 include the above-mentioned foam, which can be polyurethane foam, polyethylene foam, silicone foam, polystyrene foam, EVA foam, etc.

[0058] In a specific embodiment, the first adhesive layer 31 and the second adhesive layer 32 may also include pressure-sensitive adhesive, specifically a foam material with pressure-sensitive adhesive coated on one side or both sides, that is, foam adhesive.

[0059] In some embodiments, support layer 40 includes polyester.

[0060] Specifically, the support layer 40 includes polyethylene terephthalate (PET), with the chemical formula (C10H8O4)n, commonly known as polyester resin, which is obtained by ester exchange of dimethyl terephthalate with ethylene glycol or esterification of terephthalic acid with ethylene glycol to synthesize dihydroxyethyl terephthalate, and then polycondensation reaction. It is a common resin in life and is collectively referred to as thermoplastic polyester or saturated polyester together with polybutylene terephthalate (PBT), which can be divided into APET, RPET and PETG.

[0061] PET has excellent physical and mechanical properties in a wide temperature range, and its operating temperature can reach 120°C. It has good creep resistance, fatigue resistance, friction resistance and dimensional stability. In addition, PET can be made into PET film, which is further conducive to reducing the overall thickness of the display module.

[0062] In some embodiments, Figure 2 As shown, in a direction perpendicular to the plane where the display panel 100 is located, the thickness h1 of the first film layer 11 is between 30 micrometers and 50 micrometers.

[0063] Since the elastic modulus of the material of the second sub-film layer 112 is relatively small, it can absorb and dissipate external stress with a relatively small thickness, thereby being able to reduce the overall thickness of the display module while avoiding the generation of prints, thereby improving the display effect of the display module and user experience.

[0064] In some embodiments, Figure 8 As shown, in a direction perpendicular to the plane where the display panel 100 is located, the thickness h2 of the back adhesive layer 30 is between 30 micrometers and 80 micrometers.

[0065] Since the elastic modulus of the back glue layer 30 is relatively small, it can absorb and dissipate external stress with a relatively small thickness, thereby reducing the overall thickness of the display module while avoiding the generation of marks, thereby improving the display effect of the display module and the user experience.

[0066] In some embodiments, Fig. 9As shown, in a direction perpendicular to the plane where the display panel 100 is located, the total thickness h3 of the first adhesive layer 31 , the second adhesive layer 32 and the support layer 40 is between 30 micrometers and 80 micrometers.

[0067] Since the elastic modulus of the material of the first adhesive layer 31 and the second adhesive layer 32 is relatively small, and the supporting layer 40 can be made of a polyester film, it can absorb and dissipate external stress with a relatively small thickness, while improving the structural strength of the display module. It can thus avoid the generation of marks while achieving the overall thickness reduction of the display module, while improving the display effect of the display module and the user experience.

[0068] In some embodiments, Fig.10 As shown, the display module further includes a second film layer 12 . The second film layer 12 is located on a side of the first film layer 11 close to the display panel 100 . The first film layer 11 and the second film layer 12 together constitute a composite film layer 10 .

[0069] The elastic modulus of the material of the first sub-film layer 111 is greater than the elastic modulus of the material of the second film layer 12 , which further prevents the conduction of external stress in the display module.

[0070] In a specific implementation, the first film layer 11 and the second film layer 12 are tightly combined outside the display module by adhesive or other means to form the composite film layer 10, and then the composite film layer 10 is arranged in the display module. The composite film layer 10 has the structural strength, stress absorption capacity, electrostatic protection capacity, electromagnetic shielding capacity and heat dissipation capacity of the above-mentioned embodiment, and can ensure the normal operation of the display module and the final display effect.

[0071] In a specific implementation, the material of the second film layer 12 includes the above-mentioned foam, which can be polyurethane foam, polyethylene foam, silicone foam, polystyrene foam, EVA foam, etc.

[0072] When implementing it, Fig.11 As shown, the display module further includes an upper structure 50 located on the light emitting side (i.e., the side close to the light emitting direction Z1) of the display panel 100, and the upper structure 50 specifically includes a polarizer 51, an optical adhesive layer 52, and a glass cover plate 53. In other embodiments, the display module may further include more film layer structures based on the above embodiments, all of which are within the protection scope of the present disclosure.

[0073] Based on the same inventive concept, corresponding to any of the above embodiments and methods, Fig.12 As shown, the present application further provides a display device 2, comprising the display module 1 in any one of the above embodiments.

[0074] The display device provided by the embodiment of the present disclosure utilizes a first sub-membrane layer and a second sub-membrane with different elastic moduli to form a first film layer. While ensuring the structural strength of the display module, the second sub-membrane layer with stronger deformation absorption ability is used to avoid the generation of imprints, thereby improving the display effect of the display module.

[0075] Specifically, the display device can be a 3C electronic product such as a computer and its peripherals, communications and consumer electronics, for example, a smart phone, a laptop computer, a tablet computer, a smart wearable device, a home appliance, a gaming device, etc. In addition, the display device can also be applied to other types of electronic devices such as automotive electronics.

[0076] The device of the above embodiment includes the corresponding display module in any of the above embodiments, and has the beneficial effects of the corresponding embodiments, which will not be described in detail here.

[0077] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "including a..." do not exclude the existence of other identical elements in the process, method, article or device including the above elements.

[0078] The above are only specific embodiments of the present disclosure, which enable those skilled in the art to understand or implement the present disclosure. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to the embodiments described above, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display module, characterized in that: include: Display panel; A first film layer, located on the backlight side of the display panel; A circuit board, located on a side of the first film layer away from the display panel; The first film layer includes a first sub-film layer and a second sub-film layer, the elastic modulus of the material of the first sub-film layer is greater than the elastic modulus of the material of the second sub-film layer, and the first sub-film layer and the second sub-film layer are at least partially located in the same horizontal plane parallel to the plane where the display panel is located; In a direction perpendicular to the plane where the display panel is located, the second sub-film layer at least partially overlaps with the circuit board.

2. The display module according to claim 1, characterized in that: The first sub-film layer and the second sub-film layer both include conductive materials.

3. The display module according to claim 2, characterized in that: The first sub-layer includes metal.

4. The display module according to claim 2, characterized in that: The second sub-membrane layer includes conductive foam.

5. The display module according to claim 1, characterized in that: In a direction perpendicular to the plane where the display panel is located, the entire area of ​​the circuit board overlaps with the second sub-film layer.

6. The display module according to claim 1, characterized in that: Also includes: A back adhesive layer, located between the circuit board and the first film layer; The elastic modulus of the material of the first sub-film layer is greater than the elastic modulus of the material of the back adhesive layer.

7. The display module according to claim 6, characterized in that: The back adhesive layer includes a first back adhesive layer and a second back adhesive layer; The display panel further comprises a supporting layer, wherein the supporting layer is located between the first adhesive layer and the second adhesive layer; The material hardness of the support layer is greater than the material hardness of the back adhesive layer.

8. The display module according to claim 6 or 7, characterized in that: The adhesive backing layer includes foam.

9. The display module according to claim 7, characterized in that: The support layer includes polyester.

10. The display module according to claim 1, characterized in that: In a direction perpendicular to the plane where the display panel is located, the thickness of the first film layer is between 30 micrometers and 50 micrometers.

11. The display module according to claim 6, characterized in that: In a direction perpendicular to the plane where the display panel is located, the thickness of the back adhesive layer is between 30 micrometers and 80 micrometers.

12. The display module according to claim 7, characterized in that: In a direction perpendicular to the plane where the display panel is located, the total thickness of the first back adhesive layer, the second back adhesive layer and the support layer is between 30 micrometers and 80 micrometers.

13. The display module according to claim 1, characterized in that: It also includes a second film layer, which is located on a side of the first film layer close to the display panel, and the first film layer and the second film layer together form a composite film layer; The elastic modulus of the material of the first sub-film layer is greater than the elastic modulus of the material of the second film layer.

14. A display device, characterized in that: A display module comprising any one of claims 1 to 13.

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