A three-dimensional packaging shell structure for a radio frequency microsystem

Abstract

The present invention belongs to the field of three-dimensional packaging technology, and provides a radio frequency microsystem three-dimensional packaging shell structure, a radio frequency microsystem three-dimensional packaging shell structure, comprising a metal base plate, a metal cover plate and a ceramic frame of a frame-type structure, wherein the metal base plate and the metal cover plate are respectively fixedly mounted on both ends of the ceramic frame; a plurality of mounting platforms are fixedly mounted on two symmetrical groups of side walls in the ceramic frame, and the plurality of mounting platforms on the same group of side walls are arranged in a stepped manner, so as to solve the technical problem that the cooling means in the prior art are single and it is difficult to meet the heat dissipation requirements of high-power chips. When in use, the present invention can cause air to circulate in a sealed area formed by the metal base plate, the metal cover plate and the ceramic frame, driven by the heat generated by the chip, and can dissipate heat from the air during the air circulation process. The present invention can be widely used in three-dimensional packaging scenarios of chips.

Description

Technical Field

[0001] The invention belongs to the technical field of three-dimensional packaging, and in particular relates to a three-dimensional packaging shell structure of a radio frequency microsystem. Background Art

[0002] The three-dimensional packaging technology of RF microsystem components is mainly used in active phased array radar systems. The technical paths for the design and manufacture of RF microsystem components at home and abroad are basically the same.

[0003] As the performance indicators of modern radars become increasingly stringent, RF microsystem components must develop towards higher integration and miniaturization; compared with LTCC technology, high-temperature co-fired ceramic (HTCC) technology has higher reliability, lower cost, and can achieve higher integration and miniaturization; at the same time, the RF microsystem three-dimensional packaging shell with vertical heat dissipation channels and multi-layer BGA pad array structure based on HTCC technology can achieve richer packaging forms and broader application scenarios; in terms of appearance, by designing a multi-cavity and multi-channel structure, the metal shell structure can be omitted to achieve further miniaturization of RF microsystem components. The existing three-dimensional packaging shell structure mostly only forms a vertical heat dissipation channel through heat dissipation connection materials when in use, and the cooling method is single, which makes it difficult to meet the heat dissipation requirements of high-power chips. Summary of the invention

[0004] The purpose of the present invention is to provide a three-dimensional packaging shell structure for a radio frequency microsystem, aiming to solve the technical problem that the existing technology has a single cooling method and is difficult to meet the heat dissipation requirements of high-power chips.

[0005] The present invention is implemented as follows: a radio frequency microsystem three-dimensional packaging shell structure includes a metal bottom plate, a metal cover plate and a ceramic frame of a frame structure, wherein the metal bottom plate and the metal cover plate are respectively fixedly mounted at two ends of the ceramic frame;

[0006] Multiple groups of mounting platforms are fixedly installed on two symmetrical groups of side walls in the ceramic rack, and the multiple groups of mounting platforms on the same group of side walls are arranged in a stepped manner, and the heights of the multiple groups of mounting platforms gradually increase from the middle of the ceramic rack to the outside;

[0007] A first cavity is defined in the metal bottom plate, a second cavity is defined in the metal cover plate, an area enclosed by the metal bottom plate, the ceramic frame and the metal cover plate are connected to both the first cavity and the second cavity, return pipes connected to the second cavity are fixedly installed at both ends of the metal cover plate, and the return pipes are connected to the first cavity.

[0008] Further technical solution: the mounting platform is provided with a plurality of groups of central metal holes, the mounting platform is provided with a plurality of groups of metal grounding holes distributed in a circular array around the central metal holes, and the central metal holes and the metal grounding holes are both covered with welding pads.

[0009] Further technical solution: Multiple groups of heat sinks are arranged on the metal base plate, each group of heat sinks is distributed corresponding to two groups of mounting platforms for mounting ceramic substrates, and the surface of the heat sink away from the metal base plate is flush with the surface of the mounting platform away from the metal base plate.

[0010] Further technical solution: the heat sink is fixedly mounted on the metal base plate through a plurality of heat sink pillars, and a plurality of through grooves are provided on the metal base plate, and the through grooves are distributed in the projection area of ​​the heat sink onto the metal base plate.

[0011] Further technical solution: two groups of positioning cylinders are fixedly installed on the metal bottom plate, the positions of the positioning cylinders correspond to the positions of the return pipes, a through hole connected to the first cavity is opened in the positioning cylinder, and the return pipe is connected to the first cavity after extending into the positioning cylinder.

[0012] Further technical solution: a heat sink is fixedly installed in the middle of the metal cover plate, the heat sink is connected to the second cavity, the two side surfaces of the heat sink are in contact with the inner wall of the ceramic frame, the surface of the heat sink away from the metal cover plate is in contact with the metal bottom plate, and the surface of the heat sink that is not in contact with the ceramic frame is provided with two sets of connecting grooves.

[0013] Further technical solution: The first shielding heat sink and the second shielding heat sink are fixedly installed on both sides of the heat sink, the first shielding heat sink and the second shielding heat sink correspond to the connecting groove, the position where the first shielding heat sink and the second shielding heat sink are connected to the heat sink is located at the upper side edge of the connecting groove, and the first shielding heat sink and the second shielding heat sink separate the two corresponding groups of mounting platforms on the side walls of the ceramic frame.

[0014] Further technical solution: The first shielding heat sink and the second shielding heat sink are both provided with a vertical section and an inclined section, the vertical sections of the first shielding heat sink and the second shielding heat sink are in contact with the metal base plate, the inclined sections of the first shielding heat sink and the second shielding heat sink are fixedly connected to the heat sink box, and the end of the inclined sections of the first shielding heat sink and the second shielding heat sink close to the heat sink box is the higher end.

[0015] Further technical solution: two groups of first heat dissipation fins are fixedly installed in the heat dissipation box, the first heat dissipation fins are located at the upper side of the connecting groove, and both ends of the first heat dissipation fins are spaced from the inner wall of the heat dissipation box. Two groups of second heat dissipation fins are arranged on the side of the first heat dissipation fins close to the metal cover plate, and the two groups of second heat dissipation fins are fixedly installed at both ends of the heat dissipation box, and a space is set between the two groups of second heat dissipation fins.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1. When the air in the ceramic frame is heated, it can enter the second cavity on the metal cover plate, and then the air enters the first cavity on the metal bottom plate through the return pipe. The air can be cooled in the first cavity and the second cavity. The cooled air returns to the ceramic frame from the first cavity, so that the air can circulate in the sealed area formed by the metal bottom plate, the metal cover plate and the ceramic frame driven by the heat generated by the chip, and the air can be dissipated during the circulation of the air, ensuring that there is always air with a lower temperature to cool the chip, thereby ensuring the cooling effect of the chip.

[0018] 2. The first shielding heat sink and the second shielding heat sink cooperate with the metal base plate, the metal cover plate, the ceramic frame and the heat sink to form two sets of air flow channels independently connected to the heat sink. The ceramic substrates are fixed in different heat dissipation channels respectively. The hot air will exchange heat with the first shielding heat sink and the second shielding heat sink. The first shielding heat sink and the second shielding heat sink can quickly transfer part of the heat in the hot air to the side ceramic frame and discharge it. At the same time, the first shielding heat sink and the second shielding heat sink can also transfer the heat to the heat sink, and then transfer it to the metal base plate, the metal cover plate and the ceramic frame through the heat sink and discharge the heat to the outside, thereby realizing the synchronization of the horizontal heat dissipation channel and the vertical heat dissipation channel, further increasing the discharge of heat in the hot air, so that the hot air can discharge the heat in time during the flow process, thereby improving the cooling effect of the hot air and further improving the heat dissipation effect of the chip.

[0019] 3. An independent channel is formed by the first shielding heat sink and the second shielding heat sink to avoid the heat generated by different chips from affecting each other, reduce the excessive temperature in a certain area caused by heat concentration, and ensure the stable operation of the chip. The air moves in a specific channel to increase the air flow rate, which is conducive to air cooling. At the same time, the specific channel limits the free flow of hot air in the ceramic frame, thereby reducing the distribution of heat to other areas in the ceramic frame, so that the heat can be quickly discharged to the outside through components such as the heat sink, the first shielding heat sink and the second shielding heat sink, thereby increasing the speed of heat discharge and further improving the cooling effect on the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0021] Figure 2 It is a schematic diagram of the cross-sectional structure of the present invention.

[0022] Figure 3 It is a schematic diagram of the explosion structure in the present invention.

[0023] Figure 4 It is a structural schematic diagram of the ceramic frame in the present invention.

[0024] Figure 5 It is a schematic diagram of the structure of the metal cover plate in the present invention.

[0025] Figure 6 It is a schematic diagram of the cross-sectional structure of the metal cover plate in the present invention.

[0026] Figure 7 It is the front view of the heat dissipation box in the present invention.

[0027] In the attached drawings: 1. metal base plate; 2. metal cover plate; 3. ceramic frame; 4. first cavity; 5. through groove; 6. heat sink; 7. heat sink pillar; 8. positioning tube; 9. mounting table; 10. center metal hole; 11. metal grounding hole; 12. welding pad; 13. second cavity; 14. return pipe; 15. heat sink; 16. first shielding heat sink; 17. second shielding heat sink; 18. connecting groove; 19. first heat sink horizontal fin; 20. second heat sink horizontal fin. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0029] The specific implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0030] like Figure 1-Figure 5 As shown, a radio frequency microsystem three-dimensional packaging shell structure provided by the present invention comprises a metal bottom plate 1, a metal cover plate 2 and a ceramic frame 3 of a frame structure, wherein the metal bottom plate 1 and the metal cover plate 2 are fixedly mounted at two ends of the ceramic frame 3 respectively;

[0031] Multiple groups of mounting platforms 9 are fixedly installed on two symmetrical groups of side walls in the ceramic frame 3. The multiple groups of mounting platforms 9 on the same group of side walls are arranged in a stepped manner. The height of the multiple groups of mounting platforms 9 gradually increases from the middle of the ceramic frame 3 to the outside. Multiple groups of central metal holes 10 are provided on the mounting platforms 9. Multiple groups of metal grounding holes 11 are distributed in a circular array around the central metal hole 10. The central metal hole 10 and the metal grounding hole 11 are both covered with a soldering pad 12.

[0032] A first cavity 4 is provided in the metal base plate 1, a second cavity 13 is provided in the metal cover plate 2, the area enclosed by the metal base plate 1, the ceramic frame 3 and the metal cover plate 2 is connected to the first cavity 4 and the second cavity 13, return pipes 14 connected to the second cavity 13 are fixedly installed at both ends of the metal cover plate 2, the return pipe 14 is connected to the first cavity 4, two groups of positioning tubes 8 are fixedly installed on the metal base plate 1, the position of the positioning tubes 8 corresponds to the position of the return pipes 14, a through hole connected to the first cavity 4 is provided in the positioning tubes 8, and the return pipe 14 is connected to the first cavity 4 after extending into the positioning tubes 8.

[0033] In actual application of this embodiment, the ceramic frame 3 is welded to the metal base plate 1, and then the ceramic substrate with the chip is welded to the mounting table 9. After the welding is completed, the metal cover plate 2 is welded to the other end of the ceramic frame 3, and the connection of the device is completed at this time;

[0034] When the chip on the ceramic substrate is working, a large amount of heat will be generated, which will then heat the air in the area surrounded by the metal bottom plate 1, the metal cover plate 2 and the ceramic frame 3. At this time, the hot air will enter the first cavity 4 upward from the middle of the metal cover plate 2. The hot air will exchange heat with the metal cover plate 2 in the first cavity 4, and the heat will be discharged to the outside through the metal cover plate 2. Due to the continuous generation of subsequent hot air entering the first cavity 4, the air cooled in the first cavity 4 will enter the first cavity 4 through the return pipe 14 under the push of the subsequent hot air. At this time, the air with a lower temperature can exchange heat with the metal bottom plate 1 in the first cavity 4 and discharge the heat through the metal bottom plate 1, further reducing the temperature of the air in the first cavity 4. After that, the temperature in the first cavity 4 can enter the ceramic frame 3 to cool the chip, and the air can be driven to circulate in the sealed area formed by the metal bottom plate 1, the metal cover plate 2 and the ceramic frame 3 by the heat generated by the chip, and the air can be dissipated during the circulation of the air, ensuring that there is always air with a lower temperature to cool the chip, ensuring the cooling effect of the chip.

[0035] like Figure 2 , Figure 3 As shown, a three-dimensional packaging shell structure of a radio frequency microsystem provided by the present invention is provided with multiple groups of heat sinks 6 on the metal base plate 1, and each group of heat sinks 6 is distributed corresponding to two groups of mounting platforms 9 for mounting ceramic substrates, and the surface of the heat sink 6 away from the metal base plate 1 is flush with the surface of the mounting platform 9 away from the metal base plate 1.

[0036] Specifically, the heat sink 6 is fixedly mounted on the metal base plate 1 through a plurality of heat sink pillars 7 . The metal base plate 1 is provided with a plurality of through slots 5 . The through slots 5 are distributed within the projection area of ​​the heat sink 6 onto the metal base plate 1 .

[0037] In actual application of this embodiment, after the ceramic substrate is mounted on the mounting platform 9, the bottom surface of the ceramic substrate contacts the heat sink 6. At this time, the heat on the ceramic substrate can be directly transferred to the metal base plate 1 through the heat sink 6 and the heat sink pillar 7, thereby realizing rapid heat transfer on the ceramic substrate and further improving the heat dissipation capacity of the chip thereon. The air in the first cavity 4 can flow out from the through groove 5 into the ceramic frame 3. The air can also further cool the heat sink 6 and the heat sink pillar 7 during the flow process, thereby further improving the cooling effect of the heat sink 6 on the ceramic substrate.

[0038] like Figure 2-Figure 7 As shown, a three-dimensional packaging shell structure of a radio frequency microsystem provided by the present invention, a heat sink 15 is fixedly installed in the middle of the metal cover plate 2, the heat sink 15 is connected to the second cavity 13, the two side surfaces of the heat sink 15 are in contact with the inner wall of the ceramic frame 3, the surface of the heat sink 15 away from the metal cover plate 2 is in contact with the metal bottom plate 1, and the surface of the heat sink 15 not in contact with the ceramic frame 3 is provided with two groups of connecting grooves 18.

[0039] Specifically, the first shielding heat sink 16 and the second shielding heat sink 17 are fixedly installed on both sides of the heat sink box 15, and the first shielding heat sink 16 and the second shielding heat sink 17 correspond to the connecting groove 18. The position where the first shielding heat sink 16 and the second shielding heat sink 17 are connected to the heat sink box 15 is located at the upper side edge of the connecting groove 18. The first shielding heat sink 16 and the second shielding heat sink 17 separate the two corresponding groups of mounting platforms 9 on the side walls of the ceramic frame 3.

[0040] Specifically, the first shielding heat sink 16 and the second shielding heat sink 17 are both provided with a vertical section and an inclined section. The vertical sections of the first shielding heat sink 16 and the second shielding heat sink 17 are in contact with the metal base plate 1, and the inclined sections of the first shielding heat sink 16 and the second shielding heat sink 17 are fixedly connected to the heat sink box 15, and the end of the inclined sections of the first shielding heat sink 16 and the second shielding heat sink 17 close to the heat sink box 15 is the higher end.

[0041] Specifically, two groups of first heat dissipation fins 19 are fixedly installed in the heat dissipation box 15, the first heat dissipation fins 19 are located at the upper side of the connecting groove 18, and both ends of the first heat dissipation fins 19 are spaced from the inner wall of the heat dissipation box 15. Two groups of second heat dissipation fins 20 are arranged on one side of the first heat dissipation fins 19 close to the metal cover plate 2, and the two groups of second heat dissipation fins 20 are fixedly installed at both ends of the heat dissipation box 15, and a space is set between the two groups of second heat dissipation fins 20.

[0042] In actual application of this embodiment, the first shielding heat sink 16 and the second shielding heat sink 17 cooperate with the metal base plate 1, the metal cover plate 2, the ceramic frame 3 and the heat sink box 15 to form two sets of air flow channels independently connected to the heat sink box 15. The ceramic substrates are fixed in different heat dissipation channels respectively. When the chip on the ceramic substrate generates heat during operation, the heat will heat the air around the chip. The hot air rises and contacts the inclined sections of the first shielding heat sink 16 and the second shielding heat sink 17. At this time, the hot air will exchange heat with the first shielding heat sink 16 and the second shielding heat sink 17. The first shielding heat sink 16 and the second shielding heat sink 17 can quickly transfer part of the heat in the hot air to the side ceramic frame 3 and discharge it. At the same time, the first shielding heat sink 16 and the second shielding heat sink 17 can also transfer the heat to the heat sink 15, and then transfer it to the metal base plate 1, the metal cover plate 2 and the ceramic frame 3 through the heat sink 15 and discharge the heat to the outside, further increasing the heat. The heat in the air is discharged so that the hot air can discharge the heat in time during the flow process. The setting of the inclined sections of the first shielding heat sink 16 and the second shielding heat sink 17 allows the hot air to quickly enter the heat dissipation box 15 along the inclined sections of the first shielding heat sink 16 and the second shielding heat sink 17, and an independent channel is formed by the first shielding heat sink 16 and the second shielding heat sink 17 to avoid the heat generated by different chips from affecting each other, reduce the excessive temperature of a certain area caused by heat concentration, and ensure the stable operation of the chip. The air moves in a specific channel to increase the flow rate of the air, which is beneficial to the cooling of the air. At the same time, the specific channel limits the free flow of hot air in the ceramic frame 3, thereby reducing the distribution of heat to other areas in the ceramic frame 3, so that the heat can be quickly discharged to the outside through the heat dissipation box 15, the first shielding heat sink 16 and the second shielding heat sink 17 and other components, thereby improving the speed of heat discharge and further improving the cooling effect on the chip.

[0043] The air entering the heat sink 15 will flow upward and contact the first heat sink fin 19. Since the hot air will always flow upward, the hot air will flow in the bent channel formed by the first heat sink fin 19, the second heat sink fin 20 and the heat sink 15, thereby increasing the moving path of the hot air, increasing the contact time of the hot air with the first heat sink fin 19, the second heat sink fin 20 and the heat sink 15, further improving the heat exchange efficiency between the heat sink 15 and the hot air, and further improving the heat dissipation effect.

[0044] Finally, the hot air in the heat dissipation box 15 enters the second cavity 13 on the metal cover plate 2, and the hot air in the second cavity 13 further exchanges heat with the metal cover plate 2, and the heat is discharged through the metal cover plate 2, thereby reducing the air temperature in the second cavity 13. Since the chip continuously generates heat during operation, hot air in the heat dissipation box 15 continuously enters the second cavity 13. At this time, the air with a lower temperature in the second cavity 13 will move to the two ends of the second cavity 13 under the push of the hot air that subsequently enters the second cavity 13, and then the air with a lower temperature flows into the first cavity 4 through the return pipe 14. The air in the first cavity 4 is The cavity 4 can still exchange heat with the metal base plate 1 to dissipate heat. The air with a lower temperature in the first cavity 4 can flow from the through groove 5 into two sets of independent air flow channels for placing the ceramic substrate. Then, the air with a lower temperature flows upward to exchange heat with the chip, thereby enabling the air to circulate in the sealed area formed by the metal base plate 1, the metal cover plate 2 and the ceramic frame 3 driven by the heat generated by the chip, and the air can dissipate heat during the circulation of the air, ensuring that there is always air with a lower temperature to cool the chip, thereby ensuring the cooling effect of the chip and further improving the cooling effect of the equipment.

[0045] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

[0046] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A three-dimensional packaging shell structure of a radio frequency microsystem with high efficiency in heat dissipation, comprising a metal base plate (1), a metal cover plate (2) and a ceramic frame (3) of a frame-type structure, characterized in that: The metal bottom plate (1) and the metal cover plate (2) are respectively fixedly mounted on two ends of the ceramic frame (3); Multiple groups of mounting platforms (9) are fixedly mounted on two symmetrical groups of side walls in the ceramic frame (3); the multiple groups of mounting platforms (9) on the same group of side walls are arranged in a stepped manner, and the heights of the multiple groups of mounting platforms (9) gradually increase from the middle of the ceramic frame (3) to the outside; A first cavity (4) is provided in the metal bottom plate (1), a second cavity (13) is provided in the metal cover plate (2), an area enclosed by the metal bottom plate (1), the ceramic frame (3) and the metal cover plate (2) is in communication with the first cavity (4) and the second cavity (13), and a return pipe (14) in communication with the second cavity (13) is fixedly mounted at both ends of the metal cover plate (2), and the return pipe (14) is in communication with the first cavity (4); A heat sink (15) is fixedly mounted in the middle of the metal cover plate (2), the heat sink (15) is connected to the second cavity (13), the surfaces on both sides of the heat sink (15) are in contact with the inner wall of the ceramic frame (3), the surface of the heat sink (15) away from the metal cover plate (2) is in contact with the metal bottom plate (1), and the surface of the heat sink (15) not in contact with the ceramic frame (3) is provided with two groups of connecting grooves (18); A first shielding heat sink (16) and a second shielding heat sink (17) are fixedly mounted on both sides of the heat sink box (15); the first shielding heat sink (16) and the second shielding heat sink (17) correspond to the connecting groove (18); the first shielding heat sink (16) and the second shielding heat sink (17) are connected to the heat sink box (15) at the upper side of the connecting groove (18); the first shielding heat sink (16) and the second shielding heat sink (17) separate two corresponding groups of mounting platforms (9) on the side walls of the ceramic frame (3); The first shielding heat sink (16) and the second shielding heat sink (17) are both provided with a vertical section and an inclined section, the vertical sections of the first shielding heat sink (16) and the second shielding heat sink (17) are in contact with the metal bottom plate (1), the inclined sections of the first shielding heat sink (16) and the second shielding heat sink (17) are fixedly connected to the heat sink box (15), and the ends of the inclined sections of the first shielding heat sink (16) and the second shielding heat sink (17) close to the heat sink box (15) are higher ends; Two groups of first heat dissipation transverse fins (19) are fixedly installed in the heat dissipation box (15), the first heat dissipation transverse fins (19) are located at the upper side of the connecting groove (18), and two ends of the first heat dissipation transverse fins (19) are spaced from the inner wall of the heat dissipation box (15), and two groups of second heat dissipation transverse fins (20) are arranged on one side of the first heat dissipation transverse fins (19) close to the metal cover plate (2), the two groups of second heat dissipation transverse fins (20) are fixedly installed at the two ends of the heat dissipation box (15), and a space is provided between the two groups of second heat dissipation transverse fins (20).

2. The three-dimensional packaging shell structure of a radio frequency microsystem with high heat dissipation efficiency according to claim 1, characterized in that: The mounting platform (9) is provided with a plurality of groups of central metal holes (10), the mounting platform (9) is provided with a plurality of groups of metal grounding holes (11) distributed in a circular array around the central metal hole (10), and both the central metal hole (10) and the metal grounding holes (11) are covered with solder pads (12).

3. The three-dimensional packaging shell structure of a radio frequency microsystem with high heat dissipation efficiency according to claim 1, characterized in that: The metal base plate (1) is provided with a plurality of groups of heat dissipation plates (6), each group of heat dissipation plates (6) being distributed correspondingly to two groups of mounting platforms (9) for mounting ceramic substrates, and the surface of the heat dissipation plates (6) away from the metal base plate (1) is flush with the surface of the mounting platforms (9) away from the metal base plate (1).

4. The three-dimensional packaging shell structure of a radio frequency microsystem with high heat dissipation efficiency according to claim 3, characterized in that: The heat sink (6) is fixedly mounted on the metal base plate (1) via a plurality of heat sink pillars (7); a plurality of through grooves (5) are provided on the metal base plate (1); the through grooves (5) are distributed within the projection area of ​​the heat sink (6) onto the metal base plate (1).

5. The three-dimensional packaging shell structure of a radio frequency microsystem with high heat dissipation efficiency according to claim 1, characterized in that: Two groups of positioning cylinders (8) are fixedly mounted on the metal bottom plate (1). The positions of the positioning cylinders (8) correspond to the positions of the return pipes (14). Through holes communicating with the first cavity (4) are provided in the positioning cylinders (8). The return pipes (14) are connected to the first cavity (4) after extending into the positioning cylinders (8).

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