Electronic package and fabrication method thereof

Abstract

An electronic package and a method of fabricating the same, including stacking an antenna module on a package module, the package module including an electronic component and a plurality of electrical contacts electrically connected to the electronic component, the antenna module including a board body, a circuit portion and an antenna portion respectively bonded to opposite surfaces of the board body, the circuit portion is disposed on the plurality of electrical contacts, and the antenna portion and the circuit portion are electromagnetically coupled to each other to form a standing wave in the antenna module.

Description

Technical Field

[0001] The present invention relates to a semiconductor packaging process, in particular to an electronic package with an antenna. Background Art

[0002] As the image quality of current multimedia content increases, the file data volume becomes larger, so the bandwidth of wireless transmission also needs to increase, resulting in the fifth generation of wireless transmission (5G) technology. In addition, due to the higher transmission frequency of 5G, the size requirements of its related wireless communication modules are also higher.

[0003] In addition, when the antenna structure is planar, the electromagnetic radiation characteristics between the antenna structure and the electronic components will be limited, making it difficult to improve the antenna performance.

[0004] Therefore, how to overcome the above-mentioned problems of the prior art has become a topic that needs to be overcome urgently in the current industry. Summary of the invention

[0005] In view of the above-mentioned deficiencies of the prior art, the present invention provides an electronic package and a method for manufacturing the same, which can at least partially solve the problems of the prior art.

[0006] The electronic package of the present invention comprises: a packaging module, which includes an electronic component and a plurality of electrical contacts electrically connected to the electronic component; and an antenna module, which is stacked on the packaging module, and the antenna module includes a plate having a first surface and a second surface relative to each other, a circuit portion combined with the first surface, and an antenna portion combined with the second surface, wherein the circuit portion is connected to the plurality of electrical contacts, and the antenna portion and the circuit portion are electromagnetically coupled to each other to form standing waves in the antenna module.

[0007] The present invention also provides a method for manufacturing an electronic package, comprising: forming a packaging module on a carrier, and the packaging module includes an electronic component and a plurality of electrical contacts electrically connected to the electronic component; stacking an antenna module on the packaging module, and the antenna module includes a plate having a first surface and a second surface relative to each other, a circuit portion combined with the first surface, and an antenna portion combined with the second surface, wherein the circuit portion is connected to the plurality of electrical contacts, and the antenna portion and the circuit portion are electromagnetically coupled to each other to form standing waves in the antenna module; and removing the carrier.

[0008] In the aforementioned electronic package and its manufacturing method, the manufacturing process of the packaging module includes: forming a supporting structure on the supporting component; forming a plurality of conductive pillars on the supporting structure, and arranging the electronic component on the supporting structure so that the supporting structure electrically connects the electronic component and the plurality of conductive pillars; and forming a coating layer on the supporting structure, so that the coating layer covers the plurality of conductive pillars and the electronic component, and the end surfaces of the plurality of conductive pillars are exposed from the coating layer to serve as the electrical contacts.

[0009] In the aforementioned electronic package and its manufacturing method, the plurality of electrical contacts provide grounding.

[0010] In the aforementioned electronic packaging component and its manufacturing method, the board is a semiconductor board having a plurality of penetrating conductive silicon vias.

[0011] In the aforementioned electronic package and its manufacturing method, the antenna part is in the form of an antenna layer.

[0012] As can be seen from the above, the electronic package and the manufacturing method thereof of the present invention mainly obtain better antenna performance by stacking the antenna module on the packaging module and the antenna module generates standing waves. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a cross-sectional schematic diagram of the electronic package of the present invention.

[0014] FIG. 2A to FIG. 2E It is a cross-sectional schematic diagram of a method for manufacturing an electronic package of the present invention.

[0015] Main component symbols

[0016] 1 Electronic packaging

[0017] 2a Encapsulation module

[0018] 2b Antenna module

[0019] 20 Load-bearing structure

[0020] 20a First side

[0021] 20b Second side

[0022] 200 First insulation layer

[0023] 201 First Circuit Layer

[0024] 21 Electronic components

[0025] 21a Action surface

[0026] 21b Non-active surface

[0027] 210 Electrode pads

[0028] 211 Conductive bump

[0029] 22 Antenna

[0030] 23 Conductive column

[0031] 23a End face

[0032] 230 Electrical contacts

[0033] 24 plates

[0034] 24a First surface

[0035] 24b Second surface

[0036] 240 Conductive Silicon Via

[0037] 25 Coating

[0038] 26 Line Department

[0039] 260 Second insulation layer

[0040] 261 Second circuit layer

[0041] 27 Conductive element

[0042] 28 Conductive bumps

[0043] 9 Bearing

[0044] 90 Temporary bonding layer

[0045] F Standing Wave

[0046] L Transmission path

[0047] S Cutting path. DETAILED DESCRIPTION

[0048] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0049] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions under which the present invention can be implemented, so they have no substantial technical significance. Any structural modification, change in proportional relationship, or adjustment in size should still fall within the scope of the technical contents disclosed by the present invention without affecting the effects and purposes that can be achieved by the present invention. At the same time, the terms such as "on", "first", "second", and "one" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of the present invention without substantially changing the technical contents.

[0050] Figure 1 FIG. 1 is a cross-sectional schematic diagram of the electronic package 1 of the present invention. Figure 1 As shown, the electronic package 1 includes a packaging module 2a and an antenna module 2b stacked on the packaging module 2a.

[0051] The packaging module 2 a includes at least one electronic component 21 and a plurality of electrical contacts 230 electrically connected to the electronic component 21 .

[0052] The antenna module 2b includes a plate 24 having a first surface 24a and a second surface 24b opposite to each other, a circuit portion 26 combined with the first surface 24a, and an antenna portion 22 combined with the second surface 24b, wherein the circuit portion 26 is connected to the multiple electrical contacts 230, and the antenna portion 22 and the circuit portion 26 are electromagnetically coupled to each other to form a standing wave F in the antenna module 2b.

[0053] In one embodiment, the packaging module 2a also includes: a supporting structure 20, which supports the electronic component 21 and is electrically connected to the electronic component 21; a plurality of conductive pillars 23, which are arranged on the supporting structure 20 and are electrically connected to the supporting structure 20; and a covering layer 25, which covers the plurality of conductive pillars 23 and the electronic component 21, so that the end surfaces of the plurality of conductive pillars 23 are exposed from the covering layer 25, thereby serving as the electrical contacts 230, so that the antenna module 2b is connected to the plurality of electrical contacts 230 through a plurality of conductive bumps 28.

[0054] In one embodiment, the plurality of electrical contacts 230 provide grounding.

[0055] In one embodiment, the board 24 is a semiconductor board having a plurality of penetrating conductive through silicon vias 240 .

[0056] In one embodiment, the antenna portion 22 is in the form of an antenna layer.

[0057] Therefore, the electronic package 1 of the present invention is mainly formed into a three-dimensional antenna by stacking the antenna module 2b on the package module 2a, and the antenna module 2b generates a standing wave F, which is then transmitted to the electronic component 21 (such as Figure 1 The transmission path L shown in the figure can thus achieve better antenna performance.

[0058] FIG. 2A to FIG. 2E It is a cross-sectional schematic diagram of a method for manufacturing an electronic package 1 of the present invention.

[0059] like Figure 2A As shown, a supporting structure 20 is formed on a supporting member 9, which has a first side 20a and a second side 20b opposite to each other, and then a plurality of conductive pillars 23 are formed on the first side 20a of the supporting structure 20, and at least one electronic component 21 is arranged on the first side 20a of the supporting structure 20.

[0060] In this embodiment, the carrier 9 can be selected from adhesive tape, wafer form substrate or general panel form substrate according to the needs, and can include semiconductor material carriers such as wafers, silicon plates, etc. or circular temporary carriers of glass materials, etc. For example, a temporary bonding layer 90 such as a release film can be formed on the carrier 9 to bond the second side 20b of the carrier structure 20.

[0061] Furthermore, the supporting structure 20 is, for example, a coreless circuit structure, which includes at least one first insulating layer 200 and at least one first circuit layer 201 combined with the first insulating layer, such as at least one fan-out redistribution layer (RDL), and the material forming the first insulating layer 200 is a dielectric material such as polybenzoxazole (PBO), polyimide (PI), or prepreg (PP).

[0062] In addition, the conductive pillar 23 is formed by a metal electroplating process, and the material forming the conductive pillar 23 is a metal material such as copper or a solder material.

[0063] In addition, the electronic component 21 is an active component, a passive component or a combination thereof. The active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor and an inductor. In the present embodiment, the electronic component 21 is a semiconductor chip having an active surface 21a and an inactive surface 21b opposite to each other. The active surface 21a has a plurality of electrode pads 210, which are disposed on the first circuit layer 201 of the first side 20a of the supporting structure 20 by a flip chip method through a plurality of conductive bumps 211 such as solder materials, metal pillars or others and electrically connected to the first circuit layer 201; or, the electronic component 21 can be electrically connected to the first circuit layer 201 of the first side 20a of the supporting structure 20 by a plurality of welding wires (not shown) by a wire bonding method; or, the electronic component 21 can directly contact the first circuit layer 201 of the first side 20a of the supporting structure 20. Therefore, the required type and quantity of electronic components can be placed on the supporting structure 20 to enhance its electrical function. There are many ways for the electronic components 21 to be electrically connected to the supporting structure 20, which are not limited to the above.

[0064] like Figure 2B As shown, a coating layer 25 is formed on the first side 20a of the supporting structure 20 so that the coating layer 25 covers the electronic component 21 and the conductive pillars 23 to form a packaging module 2a, and the end surface 23a of the conductive pillar 23 is exposed from the coating layer 25 to serve as an electrical contact 230.

[0065] In this embodiment, the material forming the coating layer 25 is an insulating material such as polyimide (PI), dry film, epoxy resin or molding compound, but is not limited to the above. For example, the coating layer 25 can be formed on the first side 20a of the supporting structure 20 by lamination or molding.

[0066] Furthermore, a flattening process may be performed as required to make the upper surface of the cladding layer 25 flush with the end surface 23a of the conductive pillar 23 so that the end surface 23a of the conductive pillar 23 is exposed from the cladding layer 25, or even to make the upper surface of the cladding layer 25 flush with the inactive surface 21b so that the inactive surface 21b is exposed from the cladding layer 25. For example, the flattening process may be performed by grinding to remove part of the material of the conductive pillar 23 and part of the material of the cladding layer 25.

[0067] In addition, the coating layer 25 coats the conductive bumps 211 ; alternatively, the conductive bumps 211 may be firstly coated with an insulating material such as a primer or a non-conductive film (NCF), and then the coating layer 25 coats the insulating material.

[0068] like Figure 2C As shown, an antenna module 2b is stacked on the packaging module 2a, and the antenna module 2b includes a board 24 having a first surface 24a and a second surface 24b opposite to each other, a circuit portion 26 combined with the first surface 24a, and an antenna portion 22 combined with the second surface 24b.

[0069] In this embodiment, the board 24 is a semiconductor board, such as a silicon substrate, a glass board or other suitable boards, and has a plurality of through-silicon vias (TSV) 240 to form a Through Silicon interposer (TSI).

[0070] Furthermore, the circuit portion 26 is connected to the electrical contact 230 of the conductive pillar 23 through a plurality of conductive bumps 28, and the circuit portion 26 includes a second insulating layer 260 and a second circuit layer 261, such as a redistribution layer (RDL), disposed on the insulating layer 260 and electrically connected to the plurality of conductive silicon vias 240. For example, the conductive bumps 28 may include solder material or metal pillars, and the material forming the second circuit layer 261 is copper, and the material forming the second insulating layer 260 is a dielectric material such as polybenzoxazole (PBO), polyimide (PI), or prepreg (PP).

[0071] In addition, the antenna portion 22 is in the form of an antenna layer, such as a patch material, which transmits signals in a coupled manner with the second circuit layer 261. For example, the antenna portion 22 and the second circuit layer 261 can be electromagnetically coupled to each other, so that the antenna signal can be transmitted between the antenna portion 22 and the second circuit layer 261.

[0072] In addition, the electrical contact 230 provides grounding, and the second circuit layer 261 also has a ground pad, so that the electrical contact 230 and the ground pad are connected through the conductive bump 28, so that the signals of the antenna part 22 and the second circuit layer 261 are coupled between multiple electrical contacts 230 to form a standing wave F.

[0073] like Figure 2D and Figure 2E As shown, the carrier 9 and the temporary bonding layer 90 are removed, and then a plurality of conductive elements 27 such as solder balls are formed on the first circuit layer 201 of the second side 20 b of the carrier structure 20 .

[0074] Next, along Figure 2D The cutting path S shown is used for performing a singulation process to obtain the electronic package 1 .

[0075] In this embodiment, the electronic package 1 can be bonded to a circuit board (not shown) via the plurality of conductive elements 27 .

[0076] Therefore, the manufacturing method of the electronic package of the present invention is mainly to stack the antenna module 2b on the packaging module 2a to form a three-dimensional antenna, so there is no need to increase the layout area on the supporting structure 20. Therefore, the present invention can increase the antenna function under the predetermined size of the supporting structure 20, so that the electronic package 1 can meet the needs of miniaturization.

[0077] In summary, the electronic package and the manufacturing method thereof of the present invention achieves better antenna performance by stacking the antenna module on the packaging module and the antenna module generates standing waves.

[0078] The above embodiments are only used to illustrate the principles and effects of the present invention, and are not used to limit the present invention. Any person skilled in the art may modify the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as listed in the claims.

Claims

1. An electronic package, comprising: A packaging module comprising an electronic component and a plurality of electrical contacts electrically connected to the electronic component; as well as The antenna module is stacked on the packaging module, and the antenna module includes a plate having a first surface and a second surface opposite to each other, a circuit portion combined with the first surface, and an antenna portion combined with the second surface, wherein the circuit portion is connected to the multiple electrical contacts, and the antenna portion and the circuit portion are electromagnetically coupled to each other to form a standing wave in the antenna module.

2. The electronic package according to claim 1, wherein: The package module also includes: A supporting structure for supporting and electrically connecting the electronic component; A plurality of conductive posts, which are disposed on the supporting structure and electrically connected to the supporting structure; and The covering layer covers the plurality of conductive posts and the electronic element, and exposes the end surfaces of the plurality of conductive posts from the covering layer to serve as the plurality of electrical contacts.

3. The electronic package of claim 1, wherein: The plurality of electrical contacts provide grounding.

4. The electronic package of claim 1, wherein: The plate body is a semiconductor plate having a plurality of penetrating conductive silicon through-holes.

5. The electronic package of claim 1, wherein: The antenna portion is in the form of an antenna layer.

6. A method for manufacturing an electronic package, comprising: Forming a packaging module on a carrier, wherein the packaging module includes an electronic component and a plurality of electrical contacts electrically connected to the electronic component; Stacking an antenna module on the packaging module, wherein the antenna module comprises a board having a first surface and a second surface opposite to each other, a circuit portion coupled to the first surface, and an antenna portion coupled to the second surface, wherein the circuit portion is connected to the plurality of electrical contacts, and the antenna portion and the circuit portion are electromagnetically coupled to each other to form a standing wave in the antenna module; and Remove the carrier.

7. The method for manufacturing an electronic package as claimed in claim 6, wherein: The process of the package module includes: forming a bearing structure on the bearing member; forming a plurality of conductive pillars on the supporting structure and disposing the electronic element so that the supporting structure electrically connects the electronic element and the plurality of conductive pillars; and A coating layer is formed on the supporting structure, so that the coating layer covers the plurality of conductive posts and the electronic element, and the end surfaces of the plurality of conductive posts are exposed from the coating layer to serve as the plurality of electrical contacts.

8. The method for manufacturing an electronic package as claimed in claim 6, wherein: The plurality of electrical contacts provide grounding.

9. The method for manufacturing an electronic package as claimed in claim 6, wherein: The plate body is a semiconductor plate having a plurality of penetrating conductive silicon through-holes.

10. The method for manufacturing an electronic package according to claim 6, wherein: The antenna portion is in the form of an antenna layer.

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