An active clamp three-level inverter

Abstract

The application discloses an active clamp three-level inverter, which comprises a shell and a main circuit unit, wherein the shell is provided with an openable operation panel; the main circuit unit comprises an incoming line laminated busbar, a main copper bar, a magnetic ring assembly, a main circuit laminated busbar, two EMI filter boards, a first copper bar and a second copper bar; the incoming line laminated busbar is connected with the main circuit laminated busbar through the main copper bar; the main copper bar passes through the magnetic ring assembly; one of the EMI filter boards is detachably connected with the incoming line laminated busbar through the first copper bar; the other EMI filter board is detachably connected with the main circuit laminated busbar through the second copper bar; and the first copper bar and the second copper bar are arranged close to the operation panel. Compared with the prior art, the active clamp three-level inverter provided by the application has the magnetic ring assembly and the EMI filter boards, can reduce strong electric interference, and improve the electromagnetic compatibility of the whole inverter; meanwhile, the first copper bar and the second copper bar are arranged close to the operation panel, so that the inverter is convenient to disassemble, debug and install.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electric propulsion devices, in particular to an active clamp three-level inverter. BACKGROUND

[0002] The frequency converter is a key component of the marine electric propulsion system, and the inverter is the core module of the frequency converter. The marine environment has high requirements for the reliability and quietness of navigation, and the performance of the inverter will directly affect the performance of the entire electric propulsion system.

[0003] At present, the inverter is in the form of a module, and the internal switching device generally adopts an IGBT module, so the universal switching frequency is not high, the electromagnetic compatibility is low, the volume of the matching reactor is large, and the volume of the frequency converter cabinet group is increased, and the inverter is not convenient for detection, debugging, installation, maintenance and replacement after being installed in the cabinet. SUMMARY

[0004] The purpose of the present application is to overcome the above technical deficiencies, and to provide an active clamp three-level inverter to solve the technical problems of low electromagnetic compatibility of the inverter and inconvenience for detection and debugging after installation in the cabinet in the prior art.

[0005] To achieve the above technical purpose, the following technical scheme is adopted in the present application:

[0006] The present application provides an active clamp three-level inverter, comprising:

[0007] A shell, the shell has an openable operation panel;

[0008] A main circuit unit, the main circuit unit includes an incoming line laminated busbar, a main copper bar, a magnetic ring assembly, a main circuit laminated busbar, two EMI filter boards, a first copper bar and a second copper bar, the incoming line laminated busbar is connected to the main circuit laminated busbar through the main copper bar, the main copper bar passes through the magnetic ring assembly, one of the EMI filter boards is detachably connected to the incoming line laminated busbar through the first copper bar, the other EMI filter board is detachably connected to the main circuit laminated busbar through the second copper bar, and the first copper bar and the second copper bar are arranged close to the operation panel.

[0009] In some embodiments, a cooling unit is further included, the cooling unit includes a water cooling plate and a cooling pipeline, the water cooling plate is built-in in the shell, and the cooling pipeline is communicated with the water cooling plate.

[0010] In some embodiments, the main circuit unit further includes an IGBT device and a support capacitor, the IGBT device and the support capacitor are connected to the main circuit laminated busbar respectively, the IGBT device is arranged on the upper surface of the water cooling plate, and the support capacitor is arranged on the lower surface of the water cooling plate.

[0011] In some embodiments, the main circuit unit further comprises a SiC device, an output copper bar and a current sensor, the SiC device is connected to the output copper bar and the current sensor, and the SiC device is arranged on the upper surface of the water-cooled plate.

[0012] In some embodiments, an absorption circuit assembly is further included, which is arranged between the IGBT device and the SiC device, and is used for reducing the peak voltage and the peak current in the circuit.

[0013] In some embodiments, the absorption circuit assembly comprises an absorption capacitor, an absorption circuit laminated busbar, an absorption resistor and a fast recovery diode, the absorption resistor and the fast recovery diode are arranged on the upper surface of the water-cooled plate, the absorption circuit laminated busbar is arranged on the absorption resistor and the fast recovery diode, and the absorption capacitor is arranged on the absorption circuit laminated busbar.

[0014] In some embodiments, two voltage sensors are further included, and the voltage sensors and the EMI filter plate are arranged on two sides of the magnetic ring assembly, respectively.

[0015] In some embodiments, the main circuit unit further comprises a main control board, and the IGBT device, the SiC device, the voltage sensor and the current sensor are in signal transmission connection with the main control board, respectively.

[0016] In some embodiments, the main circuit unit further comprises a direct current power supply, and the direct current power supply is connected to the main control board, the IGBT device, the SiC device, the voltage sensor and the current sensor for power supply, respectively.

[0017] In some embodiments, the input line of the direct current power supply is connected to the terminal of the EMI filter plate.

[0018] Compared with the prior art, the active clamp three-level inverter provided by the application has a magnetic ring assembly and an EMI filter plate, can reduce strong electric interference, and improve the electromagnetic compatibility of the whole inverter; meanwhile, the first copper bar and the second copper bar are installed at a position close to the operation panel, when the inverter is assembled into a cabinet and needs to be tested for voltage resistance, only the first copper bar and the second copper bar need to be removed by opening the operation panel, so that the EMI filter plate can be avoided from being knocked down, thereby improving the debugging and installation convenience of the inverter. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 The structural schematic diagram of the active clamp three-level inverter provided by the embodiments of the application is shown in the figure;

[0020] Figure 2 The structural schematic diagram of the active clamp three-level inverter provided by the embodiments of the application is shown in the figure; Figure 1 The structural schematic diagram of the active clamp three-level inverter provided by the embodiments of the application is shown in the figure;

[0021] Figure 3 The structural schematic diagram of the active clamp three-level inverter provided by the embodiments of the application is shown in the figure; Figure 2 The structural schematic diagram of the active clamp three-level inverter provided by the embodiments of the application is shown in the figure;

[0022] Figure 4 A structure schematic diagram of another perspective of the active clamp three-level inverter provided by the embodiment of the present application is shown in the figure;

[0023] Figure 5 For Figure 4 The local enlarged view in the figure. DETAILED DESCRIPTION

[0024] In order to make the purpose, technical solutions and advantages of the present application more clear, the present application is further described in detail below in combination with the figures and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and do not limit the present application.

[0025] In order to solve the technical problems of low electromagnetic compatibility of the inverter, inconvenience in detection and debugging after installation into the cabinet, the present application provides an active clamp three-level inverter, which can reduce strong electric interference and improve the electromagnetic compatibility of the entire inverter; when voltage withstand test is performed, the first copper bar and the second copper bar can be removed to avoid the EMI filter board from being knocked down, and the inverter has high debugging and installation convenience.

[0026] Please refer to Figures 1 to 5 The active clamp three-level inverter comprises a shell 1 and a main circuit unit.

[0027] The shell 1 has an openable operation panel 11.

[0028] The main circuit unit comprises an incoming line laminated busbar 201, a main copper bar 202, a magnetic ring assembly 203, a main circuit laminated busbar 204, two EMI filter boards 205, a first copper bar 206 and a second copper bar 207. The incoming line laminated busbar 201 is connected to the main circuit laminated busbar 204 through the main copper bar 202, and the main copper bar 202 passes through the magnetic ring assembly 204. One of the EMI filter boards 205 is detachably connected to the incoming line laminated busbar 201 through the first copper bar 206. The other EMI filter board 205 is detachably connected to the main circuit laminated busbar 204 through the second copper bar 207, and the first copper bar 206 and the second copper bar 207 are arranged close to the operation panel 11. The existence of the magnetic ring assembly 203 and the EMI filter boards 205 can reduce strong electric interference and improve the electromagnetic compatibility of the entire inverter. When the inverter is assembled into the cabinet and needs to be tested for voltage withstand, the operation panel 11 on the manual operation side of the inverter is only needed to be opened, and the first copper bar 206 and the second copper bar 207 are removed, so that the components such as the EMI filter board 205 can be avoided from being knocked down, and the design can improve the debugging and installation convenience of the inverter.

[0029] In some embodiments, the active clamp three-level inverter further comprises a cooling unit, the cooling unit comprises a water-cooled plate 31 and a cooling pipe, the water-cooled plate 31 is built-in in the shell 1, the cooling pipe is communicated with the water-cooled plate 31, and the other end is used for connecting an external water cooling device, so that cooling water continuously flows through the water-cooled plate 31.

[0030] In some embodiments, the main circuit unit further comprises an IGBT device 208 and a support capacitor 209, the IGBT device 208 and the support capacitor 209 are respectively connected with the main circuit laminated busbar 204, the IGBT device 208 is arranged on the upper surface of the water-cooled plate 31, and the support capacitor 209 is arranged on the lower surface of the water-cooled plate 31.

[0031] In some embodiments, the main circuit unit further comprises a SiC device 210, an output copper bar 211 and a current sensor 212, the SiC device 210 is connected with the output copper bar 211 and the current sensor 212, and the SiC device 210 is arranged on the upper surface of the water-cooled plate 31. Before these electrical elements are mounted on the water-cooled plate 31, thermal conductive silicone grease is coated on the contact surface, and then the electrical elements are mounted on the water-cooled plate 31, so that the heat transfer of the device is facilitated.

[0032] In some embodiments, the active clamp three-level inverter further comprises an absorption circuit assembly 4, the absorption circuit assembly 4 is arranged between the IGBT device 208 and the SiC device 210, and is used for reducing the peak voltage and the peak current in the circuit.

[0033] In some embodiments, the absorption circuit assembly 4 comprises an absorption capacitor 41, an absorption circuit laminated busbar 42, an absorption resistor 43 and a fast recovery diode 44. The absorption resistor 43 and the fast recovery diode 44 are arranged on the upper surface of the water-cooled plate 31, the absorption circuit laminated busbar 42 is arranged on the absorption resistor 43 and the fast recovery diode 44, and the absorption capacitor 41 is arranged on the absorption circuit laminated busbar 42. The absorption circuit laminated busbar 42 is adopted, so that the stray inductance thereof is reduced, the absorption circuit is arranged, so that the peak voltage and the peak current in the circuit are reduced, and the absorption protection of the inverter peak voltage and the current is improved.

[0034] In some embodiments, the active clamp three-level inverter further comprises two voltage sensors 5, and the voltage sensors 5 and the EMI filter plate 205 are arranged on the two sides of the magnetic ring assembly 203.

[0035] In some embodiments, the main circuit unit further comprises a main control board 213, and the IGBT device 208, the SiC device 210, the voltage sensor 5 and the current sensor 212 are respectively connected with the main control board 213 in signal transmission.

[0036] In some embodiments, the main circuit unit further comprises a direct current power supply 214, which is connected to the main control board 213, the IGBT device 208, the SiC device 210, the voltage sensor 5 and the current sensor 212 for power supply, respectively.

[0037] In some embodiments, the input line of the direct current power supply 214 is connected to the terminal of the EMI filter board 205. When the inverter cabinet is completed and needs to be tested, the first copper bar 206 and the second copper bar 207 can be removed to avoid the problem that the direct current power supply 214 is knocked down.

[0038] In some embodiments, the discharge resistor 215 is arranged on the water-cooled plate 31, and the discharge resistor 215 generates a large amount of heat when working, so that it is necessary to cool it by water.

[0039] In some embodiments, the first mounting plate 61 is arranged above the magnetic ring assembly 203, and the first mounting plate 61 is provided with the terminal 62, the filter 63, the common cathode diode 64, the alternating current power supply 65, the direct current power supply 214, the aviation plug 66 and other components. The main control board 213 is installed on the second mounting plate 67 through the hexagonal isolation copper column.

[0040] It is easy to understand that the application focuses on the arrangement of the electronic components in the inverter, and the connection mode between the electronic components adopts the conventional connection mode in the art, which is a well-known technology familiar to those skilled in the art, so it will not be repeated.

[0041] The specific embodiments of the application described above do not constitute a limitation on the protection scope of the application. Any various other corresponding changes and modifications made according to the technical concept of the application shall be included in the protection scope of the claims of the application.

Claims

1. An active-clamp three-level inverter, characterized by, The utility model relates to a kind of power supply device, including: A housing has an openable operating panel; Main circuit unit, the main circuit unit includes incoming line laminated busbar, main copper bar, magnetic ring assembly, main circuit laminated busbar, two EMI filter boards, first copper bar and second copper bar, the incoming line laminated busbar is connected the main circuit laminated busbar by the main copper bar, the main copper bar passes through the magnetic ring assembly, one of the EMI filter boards is detachably connected with the incoming line laminated busbar by the first copper bar, another EMI filter board is detachably connected with the main circuit laminated busbar by the second copper bar, the first copper bar and the second copper bar are arranged close to the operating panel; It also includes a cooling unit, the cooling unit includes a water-cooled plate and a cooling pipeline, the water-cooled plate is built into the housing, and the cooling pipeline is connected to the water-cooled plate. The main circuit unit also includes IGBT devices and support capacitors, the IGBT devices and the support capacitors are connected to the main circuit laminated busbar respectively, the IGBT devices are arranged on the upper surface of the water-cooled plate, and the support capacitors are arranged on the lower surface of the water-cooled plate.

2. The active-clamp three-level inverter according to claim 1, characterized in that, The main circuit unit also includes SiC devices, output copper bars and current sensors, the SiC devices are connected to the output copper bars and the current sensors, and the SiC devices are arranged on the upper surface of the water-cooled plate.

3. The active-clamp three-level inverter according to claim 2, characterized in that It also includes an absorption circuit assembly arranged between the IGBT devices and the SiC devices for reducing peak voltage and peak current in the circuit.

4. The active-clamp three-level inverter according to claim 3, characterized in that The absorption circuit assembly includes absorption capacitors, absorption circuit laminated busbars, absorption resistors and fast recovery diodes, the absorption resistors and the fast recovery diodes are arranged on the upper surface of the water-cooled plate, the absorption circuit laminated busbars are arranged on the absorption resistors and the fast recovery diodes, and the absorption capacitors are arranged on the absorption circuit laminated busbars.

5. The active-clamp three-level inverter according to claim 4, characterized in that It also includes two voltage sensors arranged on both sides of the magnetic ring assembly.

6. The active-clamp three-level inverter according to claim 5, characterized in that The main circuit unit also includes a main control board, and the IGBT devices, the SiC devices, the voltage sensors and the current sensors are signal transmission connected to the main control board respectively.

7. The active-clamp three-level inverter according to claim 6, characterized in that The main circuit unit also includes a DC power supply connected to the main control board, the IGBT devices, the SiC devices, the voltage sensors and the current sensors for power supply.

8. The active-clamp three-level inverter according to claim 7, characterized in that The input line of the DC power supply is connected to the wiring terminal of the EMI filter board.

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