High-gain high-sensitivity photon wireless signal transmitting and receiving sharing device and preparation method thereof

Abstract

The invention provides a transmitting and receiving sharing device for high-gain and high-sensitivity photon wireless signals and a preparation method of the transmitting and receiving sharing device for the high-gain and high-sensitivity photon wireless signals. Comprising a metal shell, and a silicon lens, a PCB circuit board, an optical fiber module, a PIN-PD integrated antenna chip and a planar antenna which are fixed in the metal shell, and a horn antenna interconnected with the metal shell. The high-gain and high-sensitivity receiving and transmitting shared device for the photon wireless signals provided by the embodiment of the invention not only can be used as a receiving device for the photon wireless signals, but also can be used as a transmitting device for the photon wireless signals; in addition, the photon wireless signal transmitting and receiving sharing device provided by the embodiment of the invention can achieve the effects of improving the signal transmitting power and improving the signal receiving sensitivity. In addition, the purpose of continuously adjusting the transmitting frequency can be achieved.

Description

Technical Field

[0001] The present invention relates to the technical field of photon wireless communication, and in particular to a high-gain and high-sensitivity photon wireless signal receiving and sending sharing device and a packaging method. Background Art

[0002] Millimeter wave (30GHz-100GHz) and terahertz (0.1-10THz) are popular frequency bands for wireless communication after the 0.5-5GHz frequency band resources are becoming increasingly scarce. Research in recent years has shown that the use of advanced CMOS technology can solve the problem of low-cost development of short-distance high-speed wireless communication in the millimeter wave frequency band, especially the 60GHz frequency band; the use of a combination of optical, electrical, and magnetic technical means can solve the problem of developing core components such as signal sources, modems, mixers, and antennas in terahertz communication. The research and development of wireless communication systems in millimeter wave and terahertz wave bands can provide a feasible technical approach for large-capacity wireless transmission, which can greatly alleviate the current congestion problem in the frequency band below 6GHz and become an important development direction for future wireless transmission.

[0003] With the emergence of various emerging communication services, the bandwidth requirements of end users are constantly increasing, and people's demand for network system bandwidth continues to increase. As the bandwidth of wireless communication continues to increase, traditional electronic technology can no longer meet the demand for increased transmission rates. The generation of millimeter wave / terahertz wave signals through photonic technology can be unaffected by the processing speed bottleneck of electronic technology. At the same time, combined with the low loss and high transmission bandwidth characteristics of optoelectronic communication itself, the transmission distance of the signal can be increased, thereby overcoming the disadvantage of the short transmission distance of wireless signals themselves.

[0004] Therefore, in recent years, research on millimeter wave / terahertz waves with frequencies ranging from 30GHz to 10THz has gradually become a hot field, because the characteristics of this electromagnetic wave are very suitable for spectrum analysis and ultra-wideband wireless communication. The first obstacle to the development of millimeter wave / terahertz wave applications is the lack of efficient, high-power, high-bandwidth and frequency-tunable signal sources, which requires the use of high-power RF amplifiers and high-gain antennas to make up for the lack of transmitted signal power, which will undoubtedly increase the complexity of the equipment. In addition, high-frequency electronic devices are relatively expensive, which will lead to a sharp increase in system construction costs. The second is the lack of high-sensitivity, high-gain, and high-signal-to-noise ratio wireless signal detector equipment. When the detector sensitivity is low, it is necessary to increase the signal transmission power to make up for the lack of receiver performance, but it is more difficult to increase the signal transmission power. Therefore, how to improve the transmission power of millimeter wave / terahertz signals and the sensitivity of receiving devices is a key issue that needs to be urgently solved in this field. Summary of the invention

[0005] The embodiment of the present invention provides a high-gain and high-sensitivity photon wireless signal transceiver sharing device and packaging method, so as to achieve the purpose of improving the transmission power of millimeter wave / terahertz signals and the sensitivity of receiving devices.

[0006] In a first aspect, according to an embodiment of the present invention, a high-gain and high-sensitivity photon wireless signal transmission and reception sharing device is provided, the transmission and reception sharing device comprising:

[0007] A metal housing and a PCB circuit board fixed in the metal housing, an optical fiber module located on the PCB circuit board, a PIN-PD integrated antenna chip, and a wireless signal enhancement processing module connected to the metal housing;

[0008] When the transmitting and receiving shared device is used as a transmitter of wireless signals:

[0009] The optical fiber module is connected to an external optical signal related device to receive an optical signal from the external optical signal related device;

[0010] A PIN-PD integrated antenna chip is coupled to the optical fiber module and is located in the central area of ​​the silicon lens where the PIN-PD integrated antenna chip is located. After receiving the reverse bias voltage applied through the coaxial optical cable, the received optical signal is converted into a first photocurrent signal, and the first photocurrent signal is converted into a first electromagnetic wave signal.

[0011] A wireless signal enhancement processing module is connected to the PIN-PD integrated antenna chip, converts the first electromagnetic wave signal into a second electromagnetic wave signal for directionally transmitted transmission, further amplifies the signal, and transmits the third electromagnetic wave signal obtained after amplification;

[0012] When used as a receiver for wireless signals:

[0013] The wireless signal enhancement processing module is used to receive the fourth electromagnetic wave signal by focusing, and transmit the received fourth electromagnetic wave signal to the PIN-PD integrated antenna chip;

[0014] A PIN-PD integrated antenna chip receives the fourth electromagnetic wave signal, converts the fourth electromagnetic wave signal into a second current signal, converts the second current signal into a voltage signal, and transmits the voltage signal through a coaxial optical cable;

[0015] The PCB circuit board is electrically connected to the PIN-PD integrated antenna chip, and the electrodes on the PCB circuit board are connected to the coaxial terminals on the metal shell.

[0016] Preferably, the optical fiber module comprises:

[0017] The single-mode optical fiber FA is used to receive the modulated optical signal transmitted by the single-mode pigtail optical fiber;

[0018] A lower cover plate, used for supporting the single-mode optical fiber FA;

[0019] Single-mode pigtail optical fiber is used to connect to the beam combining optical fiber of two lasers to generate millimeter wave / terahertz wave signals.

[0020] Preferably, the single-mode pigtail optical fiber is led out of the metal shell through a through hole provided on the metal shell to be connected to an external optical fiber.

[0021] Preferably, the wireless signal enhancement processing module further includes:

[0022] A horn antenna is connected to the metal housing to amplify the second electromagnetic wave signal from the silicon lens;

[0023] The silicon lens is in the shape of an extended silicon hemispherical lens, and is connected to the metal shell through an extended portion of a frosted structure;

[0024] The extended portion of the silicon lens is in the shape of a circular ring, wherein the outer diameter of the circular ring is slightly smaller than the inner diameter of the shell;

[0025] The shape of the metal shell is a cuboid or a cube with square sides.

[0026] Preferably, the PIN-PD integrated antenna chip comprises:

[0027] substrate layer;

[0028] A planar antenna, located on the surface of the substrate layer;

[0029] The PIN-PD is located in the central area of ​​the planar antenna and is interconnected with the planar antenna.

[0030] Preferably, the planar antenna is one of a planar helical antenna, a log-periodic antenna and a dipole antenna.

[0031] Preferably, it also includes:

[0032] A rear cover plate connected to the metal housing to encapsulate a portion of the optical fiber module, the PIN-PD integrated antenna chip and the wireless signal enhancement processing module in the metal housing;

[0033] The base is fixedly connected to the metal shell through a connecting device to support the metal shell.

[0034] In a second aspect, according to an embodiment of the present invention, a method for preparing a high-gain and high-sensitivity photon wireless signal transmitting and receiving sharing device is provided, comprising:

[0035] Providing a metal housing;

[0036] Connecting the wireless signal enhancement processing module to one side of the metal housing;

[0037] The PCB circuit board with the PIN-PD integrated antenna chip and the optical fiber module is encapsulated on the other side of the metal housing;

[0038] in:

[0039] The PIN-PD integrated antenna chip is coupled and connected to the optical fiber module;

[0040] A PIN-PD integrated antenna chip is connected to the electrodes of the PCB board;

[0041] The wireless signal enhancement processing module is connected to the PIN-PD integrated antenna chip.

[0042] Preferably, the step of connecting the wireless signal enhancement processing module to one side of the metal housing includes:

[0043] Determine the packaging position of the wireless signal enhancement processing module based on the bare PCB circuit board, and implement the packaging of the wireless signal enhancement processing module;

[0044] Remove the bare PCB circuit board;

[0045] Before encapsulating the PCB circuit board with the PIN-PD integrated antenna chip and the optical fiber module on the other side of the metal housing, the method includes:

[0046] Attach the PIN-PD integrated antenna chip to the surface of the PCB circuit board so that the lower surface of the PIN-PD integrated antenna chip contacts the PCB circuit board;

[0047] The optical fiber module is attached to the surface of the PCB circuit board, wherein the optical fiber module includes a single-mode pigtail optical fiber and a single-mode optical fiber FA, and the single-mode optical fiber FA is coupled and connected with the PIN-PD integrated antenna chip.

[0048] Preferably, the step of packaging the PIN-PD integrated antenna chip, the optical fiber module and the PCB circuit board on the other side of the metal housing includes:

[0049] The single-mode pigtail optical fiber in the optical fiber module extends out of the metal shell through the through hole provided on the metal shell to connect with the external modulator and controller to receive the optical signal from the external laser and modulator.

[0050] The photon wireless signal transceiver sharing device provided in the embodiment of the present invention can be used as both a photon wireless signal receiving device and a photon wireless signal transmitting device. In addition, in the embodiment of the present invention, a PCB circuit board mounted with a PIN-PD integrated antenna chip is encapsulated inside a metal box, and the wireless signal enhancement processing module includes a silicon lens and a metal horn antenna that further improves the wireless signal transmission power and the wireless signal detection sensitivity. Therefore, the photon wireless signal transceiver sharing device provided in the embodiment of the present invention can improve the signal transmission power and improve the sensitivity of the received signal.

[0051] The photon wireless signal transceiver sharing device provided in the embodiment of the present invention, when used as a photon wireless signal transmitting device, is connected to external optical signal related equipment, such as a combined optical fiber of an external laser and modulator. Since the frequencies of the laser and the modulator are continuously adjustable, the photon wireless signal transceiver sharing device provided in the embodiment of the present invention, when used as a photon wireless signal transmitting device, can achieve the purpose of continuously adjusting the transmitting frequency. BRIEF DESCRIPTION OF THE DRAWINGS

[0052] Figure 1 A schematic diagram of a high-gain and high-sensitivity photon wireless signal transmitting and receiving sharing device provided by an embodiment of the present invention;

[0053] Figure 2 This is a schematic diagram of mounting a PIN-PD integrated antenna chip and an optical fiber module on a PCB circuit board in an embodiment of the present invention;

[0054] Figure 3 A schematic diagram of a PCB circuit board mounted with a PIN-PD integrated antenna chip;

[0055] Figure 4 This is a schematic diagram of a silicon lens and a metal housing packaged together;

[0056] Figure 5 A schematic diagram of a wireless signal enhancement processing module including a silicon lens and a horn antenna;

[0057] Figure 6 It is a schematic diagram of a PCB circuit board provided with PCB electrodes;

[0058] Figure 7 A schematic diagram of another high-gain and high-sensitivity photon wireless signal transceiver sharing device provided in an embodiment of the present invention;

[0059] Figure 8 A flow chart of a method for preparing a high-gain and high-sensitivity photon wireless signal transmitting and receiving sharing device provided in an embodiment of the present invention;

[0060] Fig. 9A flow chart of a method for preparing another high-gain and high-sensitivity photon wireless signal transceiver sharing device provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0061] The present invention will be further described below in conjunction with specific drawings and embodiments.

[0062] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0063] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0064] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings. It should be noted that the terms "first", "second", "third", "fourth" and other serial numbers used in the following description are for the convenience of description and are not specific limitations on whether the devices must be the same or different.

[0065] , the words "bottom" and "top", "inside" and "outside" refer to directions toward and away from, respectively, the geometric center of a particular component.

[0066] This technical solution aims at the following problem: how to increase the transmission distance of optical signals without blindly increasing the transmission power of millimeter wave / terahertz signals and ensuring the sensitivity of receiving devices.

[0067] In view of the problems existing in the prior art, an embodiment of the present invention provides a high-gain and high-sensitivity photon wireless signal transceiver sharing device. The high-gain and high-sensitivity photon wireless signal transceiver sharing device provided in the embodiment of the present invention can be used as a photon wireless signal transmitter or as a photon wireless signal receiver. When it is used as a photon wireless signal transmitter, a photocurrent signal is generated based on an optical signal (optical signal of a laser and a modulator) from an external optical signal-related device, and the generated photocurrent signal is converted into a first electromagnetic wave signal, and the first electromagnetic wave signal formed by the conversion is further converted into a second electromagnetic wave signal for directional transmission, and the second electromagnetic wave signal for directional transmission is amplified to form a third electromagnetic wave signal for transmission. When it is used as a photon wireless signal receiver, a fourth electromagnetic wave signal from the outside is transmitted to a wireless signal enhancement processing module through focusing, and the received fourth electromagnetic wave signal is further transmitted to a planar antenna through the convergence of the wireless signal enhancement processing module, so as to convert the energy of the received fourth electromagnetic wave signal into a second current signal and transmit it to the PIN-PD integrated antenna chip. Under the condition of forward bias voltage (greater than the turn-on voltage of the semiconductor device), the PIN-PD integrated antenna chip realizes the conversion of the second current signal into a voltage signal through its own internal resistance or the transimpedance amplifier on the PCB. The generated voltage signal is connected to the external test equipment through the corresponding port on the PCB circuit board, which can realize the detection of the power size of the wireless signal.

[0068] The technical solution of the present invention is described below in conjunction with specific embodiments:

[0069] Example 1

[0070] The embodiment of the present invention provides a high-gain and high-sensitivity photon wireless signal transmission and reception sharing device, see Figure 1 and Figure 2 As shown, the high-gain and high-sensitivity photon wireless signal transceiver sharing device includes a metal shell 11 and a PCB circuit board 13 fixed in the metal shell 11, an optical fiber module 12 located on the PCB circuit board, a PIN-PD integrated antenna chip (including a PIN-PD 14 and a planar antenna 15) and a wireless signal enhancement processing module 16 connected to the metal shell 11, wherein the optical fiber module 12 includes a single-mode optical fiber FA121 and a single-mode pigtail optical fiber 122 and a lower cover plate 123. It is pointed out here that for the convenience of display, Figure 1 It is a schematic diagram of the components before assembly, therefore, the PCB circuit board 13 is not in the metal shell 11 , and similarly, the extended portion of the silicon lens in the wireless signal enhancement processing module is not connected to the metal shell 11 .

[0071] When the photon wireless signal transmitting and receiving sharing device provided in the embodiment of the present invention is used as a photon wireless signal transmitting device, the working process of each component is as follows:

[0072] The optical fiber module 12 is connected to an external optical signal related device to receive an optical signal from the external optical signal related device; in a specific embodiment of the present invention, the single-mode pigtail optical fiber in the optical fiber module 12 extends through the through hole above the metal shell, and is connected to the combined optical fiber of the external modulator and the laser, thereby receiving the optical signal from the external modulator and the laser. It is pointed out here that the external optical signal related device can be an optical signal generating device or an optical signal transmission device, and the embodiment of the present invention is described by taking it as a modulator and a laser as an example.

[0073] The PIN-PD integrated antenna chip includes a PIN-PD 14 and a planar antenna 15; wherein:

[0074] The PIN-PD 14 is coupled to the optical fiber module 12 and is located in the central area of ​​the planar antenna 15. After receiving the reverse bias voltage applied by the coaxial optical cable 5, the received optical signal is converted into a first photocurrent signal. It is pointed out that the optical signal is an optical signal from an external modulator and a laser received by the optical fiber module 12. When a reverse bias voltage signal is applied by the coaxial optical cable 5, the PIN-PD generates a first photocurrent signal according to the received optical signal under the condition of an external reverse bias voltage. As a preferred embodiment, the PIN-PD 14 is located in the central position of the planar antenna 15, and the conversion of the optical signal to the electrical signal is completed in the form of optoelectronic co-packaging. In this embodiment, the electrodes of the PCB circuit board are connected to the coaxial optical cable 5 on the metal box, thereby realizing the electrical connection between the PCB circuit board and the metal box. In addition, the two electrodes of the PCB circuit board are electrically connected to the planar antenna to realize the purpose of powering the PIN-PD through the electrodes of the PCB circuit board. It is pointed out that the PIN-PD integrated antenna chip is located in the central area of ​​the silicon lens where the PIN-PD integrated antenna chip is located.

[0075] The planar antenna 15 is located on the upper surface of the PCB circuit board to convert the first photocurrent signal into a first electromagnetic wave signal; as a specific implementation, the planar antenna 15 is arranged on the surface of the area between the two electrodes of the PCB circuit board, which is also convenient for electrically connecting the planar antenna 15 to the two electrodes of the PCB circuit board; specifically, in an embodiment of the present invention, the planar antenna 15 can be formed by integrating a planar logarithmic spiral antenna with a PIN-PD 14 to form a PIN-PD integrated antenna chip.

[0076] The wireless signal enhancement processing module 16 is coupled to the planar antenna 15, converts the first electromagnetic wave signal into a second electromagnetic wave signal for directionally transmitted transmission, further amplifies the signal, and transmits the third electromagnetic wave signal obtained after amplification; it is noted that Figure 2 Shown is Figure 1 The cross-sectional schematic diagram shows that a PIN-PD integrated antenna chip is mounted on the PCB circuit board. In the photon wireless signal transmitting device, the planar antenna 15 is coupled to the subsequent wireless signal enhancement processing module 16, and the wireless signal enhancement processing module 16 converts and amplifies the first electromagnetic wave signal formed by the planar antenna 15.

[0077] When the photon wireless signal transmitting and receiving shared device is used as a photon wireless signal receiving device:

[0078] The wireless signal enhancement processing module is used to receive the fourth electromagnetic wave signal through a focusing effect, and transmit the received fourth electromagnetic wave signal to the planar antenna 15;

[0079] The planar antenna 15 receives the fourth electromagnetic wave signal, converts the fourth electromagnetic wave signal into a second current signal, and transmits the second current signal to the PIN-PD 14;

[0080] PIN-PD 14 receives the second current signal, converts the second current signal into a voltage signal, and transmits it through the coaxial optical cable 5. Specifically, PIN-PD realizes the conversion of the second current signal into a voltage signal through its own internal resistance or the transimpedance amplifier on the PCB. The generated voltage signal is connected to an external test device through a corresponding port on the PCB circuit board, so as to detect the power of the wireless signal. Figure 3 The PCB circuit board with the antenna integrated PIN-PD chip and the optical fiber module which has completed the optoelectronic packaging, generates a voltage signal which is connected to the external test equipment through the ports RF1 and RF2 of the PCB circuit board, thereby detecting the power of the fourth electromagnetic wave signal.

[0081] The high-gain and high-sensitivity photon wireless signal transceiver sharing device provided in the embodiment of the present invention is designed so that the packaged PCB circuit is placed in a metal shell that can enhance the signal and can be used not only as a wireless signal transmitter but also as a photon wireless signal receiver.

[0082] In an embodiment of the present invention, the optical fiber module 12 includes a single-mode optical fiber FA 121, a lower cover plate 123 and a single-mode pigtail optical fiber 122. The single-mode pigtail optical fiber 122 is used to connect to a modulator and a laser when acting as a transmitter to receive external optical signals, such as receiving optical signals generated by external modulators and lasers. Specifically, in this embodiment, the single-mode pigtail optical fiber 122 is connected to the combined optical fiber of the external modulator and the laser to receive modulated optical signals from the modulator and the laser corresponding to the combined optical fiber to generate millimeter wave / electromagnetic wave signals at the PIN-PD integrated antenna chip: the single-mode optical fiber FA 121 is connected to the single-mode pigtail optical fiber 122 to receive the modulated optical signal transmitted by the single-mode pigtail optical fiber 122; the optical fiber module in the embodiment of the present invention also includes a lower cover plate 123, the bottom of which is connected to the upper surface of the PCB circuit board, and the top of the lower cover plate 123 is connected to the lower surface of the single-mode optical fiber FA 121, which is used to support the single-mode optical fiber FA 121, thereby realizing the single-mode optical fiber FA 121 for supporting effect.

[0083] In the embodiments of the present invention, see Figure 5 As shown, a through hole 20 is provided on the metal shell 11, and the single-mode pigtail optical fiber 122 is led out of the metal shell through the through hole 20 provided on the metal shell. As a specific embodiment, a through hole 20 for the single-mode pigtail optical fiber to pass through is preferably provided on the top of the metal shell 11, and the single-mode pigtail optical fiber 122 extends out of the metal shell 11 through the through hole 20 provided on the top to be connected with an external optical fiber, and the external optical fiber can be a combined optical fiber of a modulator and a laser.

[0084] In the embodiment of the present invention, the wireless signal enhancement processing module 16 includes a silicon lens 161 and a horn antenna 162, wherein the silicon lens 161 is an extended silicon hemispherical lens, including a hemispherical part and an extended part, wherein the extended part is a frosted structure, and the outer surface of the frosted structure is connected to the inner surface of the metal shell, and then the extended part of the silicon lens is mounted in the hole of the metal shell, and polyimide or other curable glue is dripped into the gap between the silicon lens and the hole of the metal shell, and then the glue is cured by ultraviolet (UV) light or heated to cure, etc., so as to achieve the fixation of the silicon lens 161 and the metal shell 11 and thus achieve the connection between the silicon lens and the metal shell, wherein the hemispherical part of the silicon lens is convex relative to the inner cavity of the metal shell, see for details Figure 4 The schematic diagram after packaging is shown.

[0085] In an embodiment of the present invention, the horn antenna 162 is connected to the metal shell 11, and the horn antenna 162 is covered on the side of the silicon lens close to the hemisphere, so that the hemisphere part is located on the inner side of the horn antenna. The specific connection method can be fixed by screws. In an embodiment of the present invention, the inner cavity of the metal shell 11 can be a rectangular or cube shape, and a cross-section of the rectangular can be a square, and the cross-section that needs to be fixedly connected to the extension part is the cross-section of the square shape. In a preferred embodiment of the present invention, the top surface of the horn antenna 162 connected to the metal shell 11 and the bottom surface opposite to the top surface are both rectangular. Specifically, the center of the top surface, the center of the bottom surface, the center of the hemisphere part and the center of the metal shell are on the same straight line.

[0086] In the embodiment of the present invention, when the photon wireless signal transceiver sharing device is used as a photon wireless signal transmitting device, the PIN-PD integrated antenna chip generates a first optical current under the condition of an external reverse bias voltage. After the generated first optical current is converted into a first electromagnetic wave signal through the planar antenna 15, it is transformed into a second electromagnetic wave signal of directional transmission through the enhanced transmission effect of the silicon lens 161, and then further enhanced by the horn antenna 162, the power of the wireless electromagnetic wave generated by the planar antenna is further increased to obtain a third electromagnetic wave signal and then radiate into the free space. In addition, by adjusting the wavelength of one or both of the two external lasers, the transmission of a millimeter wave / terahertz wave wireless signal with a continuous frequency change can be achieved. The range of variation of the wireless signal frequency depends on the combined effect of the PIN-PD bandwidth and the planar antenna operating frequency. Since the greater the photoelectric response rate of the PIN-PD, the greater the transmission power of the wireless signal, and the greater the gain of the structural device, the greater the transmission power of the wireless signal. Therefore, when the photon wireless signal transceiver sharing device in the embodiment of the present invention is used as a photon wireless signal transmitting device, the magnitude of the transmission power depends on the photoelectric response rate of the PIN-PD and the gain of the transceiver sharing device.

[0087] In the embodiment of the present invention, different operating frequencies correspond to different sizes of silicon lenses and horn antennas, but the entire assembly structure is the same. A specific embodiment is listed below:

[0088] Taking the central operating frequency of millimeter wave f = 30GHz as an example, a detailed description is given. According to the formula λ = c / f, the wavelength λ = 10mm corresponding to 30GHz can be calculated. When the radius of the silicon lens is less than or equal to 10mm, a very serious standing wave effect will be formed on the surface of the silicon lens. In order to eliminate the surface standing wave effect, the radius of the silicon lens should be greater than 10mm. At the same time, in order to take into account the use effect of the terahertz wave frequency band (>100GHz), after simulation optimization, the radius size of the silicon lens is selected to be 15mm, the thickness of the extended part of the silicon lens is 3.75mm, and the resistivity is greater than 10kΩ·cm. The length of the horn antenna is 50mm, and the expansion angle is 20°.

[0089] When the photon wireless signal transceiver sharing device provided in the embodiment of the present invention is used as a photon wireless signal receiving device, the single-mode pigtail optical fiber 122 is not connected to any device. The fourth electromagnetic wave signal is transmitted to the silicon lens 161 through the convergence effect of the horn antenna 162, and then the fourth electromagnetic wave signal is transmitted to the planar antenna 15 through the convergence effect of the silicon lens 161. The planar antenna 15 converts the energy of the fourth electromagnetic wave signal into a second current signal and transmits it to the PIN-PD 14. The PIN-PD 14 realizes the conversion of the photocurrent signal to the voltage signal through its own internal resistance (which can also be the transresistance connected on the PCB circuit board). The converted voltage signal is connected to the external test equipment through the coaxial optical cable 5, so as to realize the detection of the power size of the wireless signal.

[0090] In the embodiments of the present invention, see Figure 6 As shown, in the photon wireless signal transceiver sharing device, a PCB electrode is also provided on the PCB circuit board, thereby powering the planar antenna 15 and the PIN-PD 14 on the PCB circuit board. Specifically, a first PCB electrode 131 and a second PCB electrode 132 are provided on the PCB circuit board, and the first PCB electrode 131 and the second PCB electrode 132 are both electrically connected to the planar antenna 15. Specifically, the two PCB electrodes can be respectively connected to the planar antenna 15 through electrical connecting lines, thereby powering the PIN-PD.

[0091] In the embodiment of the present invention, the PIN-PD integrated antenna chip includes: a substrate layer, located at the bottom of the PIN-PD integrated antenna chip; a planar antenna 15, located on the surface of the substrate layer; and a PIN-PD 14, located in the central area of ​​the planar antenna 15 and interconnected with the planar antenna 15. In the embodiment of the present invention, a substrate layer is provided at the bottom of the PIN-PD integrated antenna chip so that the surface of the PIN-PD is insulated from the surface of the PCB board, such as Figure 6 Specifically, the material of the substrate layer can be silicon.

[0092] In the embodiment of the present invention, the planar antenna 15 may be one of, including but not limited to, a planar helical antenna, a log-periodic antenna, and a dipole antenna.

[0093] In the embodiments of the present invention, see Figure 7 As shown, the photon wireless signal transceiver sharing device also includes a rear cover plate 17. The rear cover plate 17 is connected to the metal shell to encapsulate the optical fiber module and the PIN-PD integrated antenna chip inside the metal shell. At the same time, a part of the wireless signal enhancement processing module is also encapsulated in the metal shell. It is pointed out that the definition here is to encapsulate a part of the wireless signal enhancement processing module in the metal shell because the single-mode pigtail optical fiber 122 needs to extend through the through hole 20 set on the metal shell 11, so the extended part is not strictly encapsulated in the metal shell. Therefore, it is defined here that a part of the wireless signal enhancement processing module is encapsulated in the metal shell.

[0094] In an embodiment of the present invention, the photon wireless signal transceiver sharing device further includes a base 18, and the base 18 is fixedly connected to the metal shell 11 by a screw connection device to support the metal shell. As a specific embodiment, through holes can be set at corresponding positions of the base 18 and the metal shell, and a connection device can be used to connect the through holes of the two, thereby realizing the connection between the metal shell 11 and the base 18. Specifically, the connection device can be a screw and a nut, and the screw is passed through the through holes set on the metal shell and the base, and the nut is continued to be used to lock the screw.

[0095] The photon wireless signal transceiver sharing device provided in the embodiment of the present invention encapsulates a PCB circuit board that has completed optoelectronic packaging and is mounted with a PIN-PD and a planar antenna inside a metal box. At the same time, the wireless signal enhancement processing module includes a silicon lens and a metal horn antenna that further improves the wireless signal transmission power and the wireless signal detection sensitivity. Therefore, the photon wireless signal transceiver sharing device provided in the embodiment of the present invention can improve the signal transmission power and improve the sensitivity of the received signal.

[0096] The photon wireless signal transceiver sharing device provided in the embodiment of the present invention, when used as a photon wireless signal transmitting device, has an external laser and a combined optical fiber of a modulator. Since the frequencies of the laser and the modulator are continuously adjustable, the photon wireless signal transceiver sharing device provided in the embodiment of the present invention, when used as a photon wireless signal transmitting device, can achieve the purpose of continuously adjusting the transmitting frequency.

[0097] Example 2

[0098] The embodiment of the present invention also provides a method for preparing a high-gain and high-sensitivity photon wireless signal transceiver sharing device, so as to prepare the high-gain and high-sensitivity photon wireless signal transceiver sharing device provided in the previous embodiment, see Figure 8 As shown, the method comprises:

[0099] Step S81, providing a metal shell;

[0100] In the embodiment of the present invention, the inner cavity of the metal shell is in the shape of a cuboid, preferably, one of the cross sections is a square cross section to encapsulate the extended portion of the silicon lens in the wireless signal enhancement processing module. Specifically, the side surface of the metal shell may be in the shape of a square.

[0101] In the embodiment of the present invention, a through hole is provided on the top surface of the metal shell for allowing the single-mode pigtail optical fiber of the optical fiber module to extend out.

[0102] In an embodiment of the present invention, a metal protrusion is provided inside the metal shell, which is connected to the electrode of the PCB circuit board during packaging to form a coaxial optical cable 5, so as to power the PCB circuit board and the planar antenna and PIN-PD on the PCB circuit board through the coaxial optical cable.

[0103] Step S82, connecting the wireless signal enhancement processing module to one side of the metal housing;

[0104] In an embodiment of the present invention, the wireless signal enhancement processing module includes a silicon lens and a horn antenna, wherein the silicon lens includes a hemispherical part and an extended part, the extended part is a frosted structure, and is connected to the inner cavity of the metal shell through an opening in the inner cavity of the metal shell.

[0105] Step S83, encapsulating the PCB circuit board with the PIN-PD integrated antenna chip and the optical fiber module encapsulated therein on the other side of the metal housing;

[0106] in:

[0107] The PIN-PD integrated antenna chip is coupled and connected to the optical fiber module;

[0108] A planar antenna connected to the electrodes of the PCB 13;

[0109] The wireless signal enhancement processing module 16 is connected to the planar antenna in the PIN-PD integrated antenna chip.

[0110] The PIN-PD integrated antenna chip is formed by setting a PIN-PD in the central area of ​​a planar antenna.

[0111] In the embodiment of the present invention, another opening of the inner cavity of the metal shell is connected to the cover plate, thereby encapsulating the PCB circuit board, the PIN-PD integrated antenna chip and part of the optical fiber module in the metal shell.

[0112] In the embodiment of the present invention, the PIN-PD integrated antenna chip is coupled to the optical fiber module, so that when the transceiver sharing device is used as the transmitting end of the photon wireless signal, the PIN-PD converts the optical signal transmitted through the optical fiber module into a photocurrent signal. The planar antenna further converts the photocurrent formed by the PIN-PD into an electromagnetic wave signal.

[0113] In an embodiment of the present invention, when the transmitting and receiving shared device is used as a photon wireless signal receiving device, the electromagnetic wave is transmitted to the planar antenna module through the convergence effect of the silicon lens in the wireless signal enhancement processing module. The planar antenna module converts the energy of the electromagnetic wave wireless signal into a current signal and transmits it to the PIN-PD at the center of the planar antenna. The PIN-PD realizes the conversion of the current signal to the voltage signal through its own internal resistance or the transresistance connected on the PCB. The generated voltage signal is connected to the external test equipment through a coaxial cable, thereby realizing the detection of the power size of the wireless signal.

[0114] In the embodiment of the present invention, step S82 includes:

[0115] Determine the packaging position of the wireless signal enhancement processing module based on the bare PCB circuit board, and implement the packaging of the wireless signal enhancement processing module;

[0116] Remove the bare PCB circuit board;

[0117] As a preferred implementation mode of the embodiment of the present invention, when packaging the wireless signal enhancement processing module, first take a bare PCB circuit board without any device mounted thereon, and first fix the bare PCB circuit board inside the metal box 11 with fixing screws, and then mount the extended part of the silicon lens in the wireless signal enhancement processing module in the hole of the metal box, and drip polyimide or other curable glue into the gap between the lens and the hole of the metal box, and then use ultraviolet (UV) light to irradiate and cure or heat and cure the glue to achieve the fixation of the silicon lens and the metal box.

[0118] In the embodiments of the present invention, see Fig. 9 As shown, before step S83, it includes:

[0119] S831. Attach the PIN-PD integrated antenna chip including the planar antenna 15 and the PIN-PD 14 to the surface of the PCB circuit board so that the lower surface of the PIN-PD integrated antenna chip contacts the PCB circuit board. It is pointed out that the upper surface is mentioned here for describing the example diagram given in the figure. Of course, it can be placed inverted according to actual needs, or attached to another surface. The upper surface is mentioned here only for the convenience of description, and it is not a limitation on the specific bonding surface.

[0120] S832. Attach the optical fiber module to the surface of the PCB circuit board, wherein the optical fiber module includes a single-mode pigtail optical fiber and a single-mode optical fiber FA, and the single-mode optical fiber FA is coupled and connected to the PIN-PD integrated antenna chip.

[0121] The optical fiber module includes a single-mode pigtail optical fiber, a lower cover plate and a single-mode optical fiber FA.

[0122] In one embodiment of the present invention, step S83, encapsulating the PCB circuit board with the PIN-PD integrated antenna chip and the optical fiber module encapsulated on the other side of the metal housing, includes:

[0123] The single-mode pigtail optical fiber in the optical fiber module extends out of the metal shell through the through hole provided on the metal shell to connect with the external modulator and controller to receive the modulated optical signal from the external laser and modulator.

[0124] In an embodiment of the present invention, some through holes are provided on the metal shell, such as at least one through hole for allowing the single-mode pigtail optical fiber to extend out, so that the single-mode pigtail optical fiber can be connected to an external modulator and laser to receive an external modulated optical signal.

[0125] It is pointed out here that the connection between the metal shell and the cover plate, the base, the PCB circuit board and the horn antenna can all be made by threaded hole connection in conventional technology.

[0126] The method for preparing a high-gain and high-sensitivity photon wireless signal transceiver sharing device provided in an embodiment of the present invention installs a PCB circuit board that completes the optoelectronic packaging of a PIN-PD integrated antenna chip in a metal shell, so that the high-gain and high-sensitivity photon wireless signal transceiver sharing device can be used as both a photon wireless signal receiving device and a photon wireless signal transmitting device.

[0127] The photon wireless signal transceiver sharing device prepared by the method provided in the embodiment of the present invention encapsulates a PCB circuit board mounted with a PIN-PD and a planar antenna inside a metal box, and the wireless signal enhancement processing module includes a silicon lens and a metal horn antenna that further improves the wireless signal transmission power and the wireless signal detection sensitivity. Therefore, the photon wireless signal transceiver sharing device provided in the embodiment of the present invention can improve the signal transmission power and improve the sensitivity of the received signal.

[0128] The photon wireless signal transceiver sharing device prepared by the method provided by the embodiment of the present invention, when used as a photon wireless signal transmitting device, is connected to a combined optical fiber of an external laser and a modulator. Since the frequencies of the laser and the modulator are continuously adjustable, the photon wireless signal transceiver sharing device provided by the embodiment of the present invention, when used as a photon wireless signal transmitting device, can achieve the purpose of continuously adjusting the transmitting frequency.

Claims

1. A high-gain and high-sensitivity photon wireless signal transmission and reception sharing device, characterized in that: The transmitting and receiving sharing device comprises: A metal housing and a PCB circuit board fixed in the metal housing, an optical fiber module located on the PCB circuit board, a PIN-PD integrated antenna chip, and a wireless signal enhancement processing module connected to the metal housing; When the transmitting and receiving shared device is used as a transmitter of wireless signals: The optical fiber module is connected to an external optical signal related device to receive an optical signal from the external optical signal related device; A PIN-PD integrated antenna chip is coupled to the optical fiber module and is located in the central area of ​​the silicon lens where the PIN-PD integrated antenna chip is located. After receiving the reverse bias voltage applied through the coaxial optical cable, the received optical signal is converted into a first photocurrent signal, and the first photocurrent signal is converted into a first electromagnetic wave signal. A wireless signal enhancement processing module is connected to the PIN-PD integrated antenna chip, converts the first electromagnetic wave signal into a second electromagnetic wave signal for directionally transmitted transmission, further amplifies the signal, and transmits the third electromagnetic wave signal obtained after amplification; When used as a receiver for wireless signals: The wireless signal enhancement processing module is used to receive the fourth electromagnetic wave signal by focusing, and transmit the received fourth electromagnetic wave signal to the PIN-PD integrated antenna chip; A PIN-PD integrated antenna chip receives the fourth electromagnetic wave signal, converts the fourth electromagnetic wave signal into a second current signal, converts the second current signal into a voltage signal, and transmits the voltage signal through a coaxial optical cable; The PCB circuit board is electrically connected to the PIN-PD integrated antenna chip, and the electrodes on the PCB circuit board are connected to the coaxial terminals on the metal shell.

2. The transmitting and receiving sharing device according to claim 1, characterized in that: The optical fiber module comprises: The single-mode optical fiber FA is used to receive the modulated optical signal transmitted by the single-mode pigtail optical fiber; A lower cover plate, used for supporting the single-mode optical fiber FA; Single-mode pigtail optical fiber is used to connect to the beam combining optical fiber of two lasers to generate millimeter wave / terahertz wave signals.

3. The transmitting and receiving sharing device according to claim 2, characterized in that: The single-mode pigtail optical fiber is led out of the metal shell through a through hole provided on the metal shell to be connected with an external optical fiber.

4. The transmitting and receiving sharing device according to claim 1, characterized in that: The wireless signal enhancement processing module further includes: A horn antenna is connected to the metal housing to amplify the second electromagnetic wave signal from the silicon lens; The silicon lens is in the shape of an extended silicon hemispherical lens, and is connected to the metal shell through an extended portion of a frosted structure; The extended portion of the silicon lens is in the shape of a circular ring, wherein the outer diameter of the circular ring is slightly smaller than the inner diameter of the shell; The shape of the metal shell is a cuboid or a cube with square sides.

5. The transmitting and receiving sharing device according to claim 1, characterized in that: The PIN-PD integrated antenna chip comprises: substrate layer; A planar antenna, located on the surface of the substrate layer; The PIN-PD is located in the central area of ​​the planar antenna and is interconnected with the planar antenna.

6. The transmitting and receiving sharing device according to claim 5, characterized in that: The planar antenna is one of a planar spiral antenna, a logarithmic periodic antenna and a dipole antenna.

7. The transmitting and receiving sharing device according to claim 1, characterized in that: Also includes: A rear cover plate connected to the metal housing to encapsulate a portion of the optical fiber module, the PIN-PD integrated antenna chip and the wireless signal enhancement processing module in the metal housing; The base is fixedly connected to the metal shell through a connecting device to support the metal shell.

8. A method for preparing a high-gain and high-sensitivity photon wireless signal transceiver sharing device, characterized in that: include: Providing a metal housing; Connecting the wireless signal enhancement processing module to one side of the metal housing; The PCB circuit board with the PIN-PD integrated antenna chip and the optical fiber module is encapsulated on the other side of the metal housing; in: The PIN-PD integrated antenna chip is coupled and connected to the optical fiber module; A PIN-PD integrated antenna chip is connected to the electrodes of the PCB board; The wireless signal enhancement processing module is connected to the PIN-PD integrated antenna chip.

9. The method according to claim 8, characterized in that The method of connecting the wireless signal enhancement processing module to one side of the metal housing includes: Determine the packaging position of the wireless signal enhancement processing module based on the bare PCB circuit board, and implement the packaging of the wireless signal enhancement processing module; Remove the bare PCB circuit board; Before encapsulating the PCB circuit board with the PIN-PD integrated antenna chip and the optical fiber module on the other side of the metal housing, the method includes: Attach the PIN-PD integrated antenna chip to the surface of the PCB circuit board so that the lower surface of the PIN-PD integrated antenna chip contacts the PCB circuit board; The optical fiber module is attached to the surface of the PCB circuit board, wherein the optical fiber module includes a single-mode pigtail optical fiber and a single-mode optical fiber FA, and the single-mode optical fiber FA is coupled and connected with the PIN-PD integrated antenna chip.

10. The method according to claim 9, characterized in that The method of packaging the PIN-PD integrated antenna chip, the optical fiber module and the PCB circuit board on the other side of the metal housing includes: The single-mode pigtail optical fiber in the optical fiber module extends out of the metal shell through the through hole provided on the metal shell to connect with the external modulator and controller to receive the optical signal from the external laser and modulator.

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