A staggered distribution microwave grounding hole structure to prevent flux overflow

Abstract

This invention provides a staggered distributed microwave grounding hole structure to prevent flux overflow. This structure replaces the traditional straight-through grounding hole with a staggered distributed grounding hole. By replacing the straight-through grounding hole with a staggered grounding hole, this invention cuts off the capillary effect path and prevents flux overflow. Simultaneously, it does not affect the heat dissipation and grounding characteristics of the device, avoids the risk of damage to microwave devices, improves the reliability of aerospace products, increases the yield rate of mass production, and reduces production costs.

Description

Technical Field

[0001] This invention belongs to the technical field of high-frequency gas-tight microwave products, and relates to the structural design of multilayer interconnect substrates, specifically to a staggered distribution microwave grounding hole structure to prevent flux overflow. Background Technology

[0002] In fully integrated MCM micro-packaged microwave products, microwave grounding typically uses a through-hole grounding via, which can lead to flux overflow. After reflow soldering, a small amount of flux overflows directly above the through-hole grounding via; after atomization cleaning and baking, a large amount of flux overflows. After multiple baking and atomization cleaning cycles, due to the lack of effective methods to check for residual flux in the solder layer, it is impossible to guarantee that the flux has been completely removed. If the flux is not completely removed, the module will undergo high-temperature processes such as conductive adhesive baking and pre-capping baking during subsequent micro-assembly, and residual flux may continue to overflow, ultimately leading to PIND failure. Even after reopening, a large amount of flux remains on the substrate surface, which can damage microwave devices over time. According to current testing standards, such microwave products are unqualified and cannot pass the test. The flux overflow phenomenon is more severe when there are many through-hole grounding vias.

[0003] The phenomenon of flux overflowing along the through-hole grounding orifice is mainly due to the inherent characteristics of low-temperature co-fired ceramic (LTCC) materials. Flux overflow poses several risks, including: first, poor grounding, affecting device heat dissipation; second, corrosion of microwave devices, leading to decreased electrical performance and, in severe cases, device failure; and third, failure of the PIND (Pin Duplicate) test for micro-packaged microwave products, posing a significant threat to yield.

[0004] Therefore, how to prevent flux spillage in fully chip-based MCM micro-packaged microwave products through microwave grounding holes is of great practical significance, improving the reliability of microwave devices, ensuring the reliability of aerospace products, and having certain economic advantages. Summary of the Invention

[0005] To address the shortcomings of existing technologies, the present invention aims to provide a staggered distribution microwave grounding hole structure to prevent flux overflow, thereby solving the technical problem of flux overflow in existing fully chip-based MCM micro-packaged microwave products.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0007] A staggered microwave grounding hole structure for preventing flux overflow is disclosed. The structure includes several substrates stacked vertically. Each substrate has multiple microwave grounding holes. The number of substrates is 4 to 6. At least two adjacent substrates have staggered and non-connected microwave grounding holes, and at least two adjacent substrates have one-to-one corresponding and connected microwave grounding holes.

[0008] The inner diameter of the microwave grounding hole is d. T 100μm≤d T ≤300μm.

[0009] The distance between two adjacent microwave grounding holes (2) located on the same substrate (1) is G. A If the inner diameters of the two microwave grounding holes (2) are equal, then 2d T ≤G A ≤6d T If the inner diameters of the two microwave grounding holes (2) are not equal, let the inner diameter of one of the microwave grounding holes (2) be d. T1 The inner diameter of the other microwave grounding hole (2) is d. T2 ,but

[0010] The distance between two adjacent microwave grounding holes (2) located on different substrate layers (1) and not connected is G. B If the inner diameters of the two microwave grounding holes (2) are equal, then d T ≤G B ≤3d T If the inner diameters of the two microwave grounding holes (2) are not equal, let the inner diameter of one of the microwave grounding holes (2) be d. T3 The inner diameter of the other microwave grounding hole (2) is d. T4 ,but

[0011] The present invention also has the following technical features:

[0012] Preferably, the inner diameter d of the microwave grounding hole T It is 200μm.

[0013] Preferably, if the inner diameters of the two microwave grounding holes are equal, then the spacing G between two adjacent microwave grounding holes located on the same substrate layer is... A 2d T If the inner diameters of two microwave grounding holes are not equal, then the spacing G between two adjacent microwave grounding holes located on the same substrate layer is... A For d T1 With d T2 sum.

[0014] Preferably, if the inner diameters of the two microwave grounding holes are equal, the spacing G between two adjacent microwave grounding holes located on different substrate layers and not connected is... B 2d T If the inner diameters of two microwave grounding holes are not equal, then the distance G between two adjacent microwave grounding holes located on different substrate layers and not connected is... B For d T3 With d T4 sum.

[0015] Specifically, the shortest distance between the microwave grounding hole and the edge of the substrate is I. T1 I T1 ≥200μm.

[0016] Specifically, rosin flux is used during substrate reflow soldering.

[0017] Specifically, the substrate is a low-temperature co-fired ceramic substrate.

[0018] Specifically, a cavity is also formed on the substrate, and the shortest distance between the microwave grounding hole and the edge of the cavity is I. T2 I T2 ≥200μm.

[0019] Specifically, each substrate layer is provided with multiple heat dissipation holes, which are arranged at equal intervals along the horizontal and vertical directions; the structure formed by the multiple heat dissipation holes is a heat dissipation hole matrix; the heat dissipation holes on each substrate layer are arranged in a one-to-one correspondence and are interconnected.

[0020] Specifically, the inner diameter of the heat dissipation hole is d. S 200μm≤d S ≤300μm.

[0021] Specifically, the spacing between two adjacent heat dissipation holes located on the same substrate layer is G. S 3D S ≤G S ≤5d S G is preferred S =3d S .

[0022] Specifically, the length of the heat dissipation hole matrix is ​​L. S 4.5mm≤L S ≤6.5mm, L preferred S = 6.5mm; the width of the heat dissipation hole matrix is ​​W S 4.5mm≤W S ≤6.5mm, W preferred S =6.5mm.

[0023] Specifically, the shortest distance between the heat dissipation hole matrix and the edge of the substrate is I. S I S ≥2mm.

[0024] Compared with the prior art, the present invention has the following technical effects:

[0025] (I) By changing the through grounding hole to a staggered distributed grounding hole, the present invention cuts off the capillary effect path, effectively prevents flux overflow, reduces baking time after atomization cleaning, greatly improves the product yield of mass production, and enhances packaging performance; at the same time, it does not affect the heat dissipation and grounding characteristics of the device, avoids the risk of damage to microwave devices, improves the reliability of aerospace products, increases the product yield of mass production, and reduces production costs.

[0026] (II) This invention utilizes staggered distribution of microwave grounding holes. When the microwave chip is a low-power device with a heat dissipation not exceeding 0.4W, thermal design simulation comparisons between staggered distribution and through-hole grounding holes are shown in the figure below. Figure 8 As shown, the heat dissipation design for low-power microwave devices involves soldering the devices onto a large ground plane with a staggered hole design. Thermal design simulation results show that the devices meet the first-level derating design requirements and their heat dissipation characteristics are not affected. Furthermore, the multilayer ceramic substrate fabrication process only requires changes to the screen and stencil patterns, eliminating the need for complex processes and avoiding additional production costs.

[0027] (III) The staggered distributed grounding holes designed in this invention do not affect the grounding impedance. According to actual microwave product measurements, the impedance value of the staggered distributed grounding holes is approximately 150mΩ, which is on the same order of magnitude as the impedance value of the through grounding holes, showing virtually no change and ensuring the grounding characteristics of microwave devices. The fully chip-based MCM micro-packaged microwave product has wide applicability and is more suitable for high-frequency applications. Attached Figure Description

[0028] Figure 1 This photo shows flux overflow found after opening the cover of a fully chip-based MCM micro-packaged microwave product with a through-hole grounding hole.

[0029] Figure 2 This is a schematic diagram of the through-type distributed microwave grounding hole structure in Comparative Example 1.

[0030] Figure 3 This is a schematic diagram of the staggered distribution microwave grounding hole structure for preventing flux overflow in Example 1.

[0031] Figure 4 This is a schematic diagram of the structure of a multilayer interconnect substrate.

[0032] Figure 5A schematic diagram of the parameters of the staggered distribution microwave grounding hole structure to prevent flux overflow.

[0033] Figure 6 The diagram shows a simulation comparison of the S11 parameters of the staggered distribution microwave grounding hole structure for preventing flux overflow in Example 1 and the straight-through distribution microwave grounding hole structure in Comparative Example 1.

[0034] Figure 7 The diagram shows a simulation comparison of the S21 parameters of the staggered distribution microwave grounding hole structure for preventing flux overflow in Example 1 and the straight-through distribution microwave grounding hole structure in Comparative Example 1.

[0035] Figure 8 The diagram shows a design simulation comparison of the staggered distribution microwave grounding hole structure for preventing flux overflow in Example 1 and the straight-through distribution microwave grounding hole structure in Comparative Example 1.

[0036] Figure 9 This is a schematic diagram illustrating other arrangements of the staggered distribution microwave grounding hole structure for preventing flux overflow according to the present invention.

[0037] The labels in the diagram represent: 1-substrate, 2-microwave grounding hole, 3-cavity, 4-heat dissipation hole.

[0038] d T -Inner diameter of the microwave grounding hole; G A - The spacing between two adjacent microwave grounding holes located on the same substrate layer; G B - The spacing between two adjacent, non-connected microwave grounding holes located on different substrate layers; I T1 - The shortest distance between the microwave grounding hole and the edge of the substrate; I T2 - The shortest distance between the microwave grounding hole and the edge of the cavity; d S - Inner diameter of the heat dissipation hole; G S - The spacing between two adjacent heat dissipation holes located on the same substrate layer; L S - Length of the heat dissipation hole matrix; W S - Width of the heat dissipation hole matrix; I S - The shortest distance between the heat dissipation hole matrix and the edge of the substrate.

[0039] The specific content of the present invention will be further explained in detail below with reference to the embodiments. Detailed Implementation

[0040] The design principles and concepts of this invention are as follows:

[0041] Figure 1 This demonstrates the phenomenon of flux overflow caused by a through-hole microwave grounding hole. For example... Figure 2As shown, a through-hole grounding hole can cause abnormal metal protrusion on the ceramic substrate surface, leading to airtightness issues after soldering in microwave products and causing PIND testing to fail. Upon reopening the package, a large amount of flux residue was found on the substrate surface. Over time, this will damage microwave devices. According to current testing standards, the microwave product is unqualified and cannot pass the test.

[0042] The flux overflow caused by microwave through-hole grounding is unrelated to the filler content, co-firing process control, post-firing process control, or slurry condition. The problem of flux overflowing along the through-hole grounding is due to the inherent material characteristics of the LTCC multilayer ceramic substrate. Due to its inherent material properties, both the film layers and metallized vias in multilayer ceramic substrates have a certain porosity, making it difficult to achieve airtightness. Because different batches of materials have slight variations in particle size, solid content, and component ratios, the density of the sintered metallized vias varies slightly. When the pore size of the metallized via is larger than the flux molecule size, the flux in the solder layer liquefies when the module is heated, and overflows to the substrate surface along the pores under capillary effect. Since the pore size of the metallized via is very small, as long as there are no macroscopic voids, a large amount of flux will not remain inside the substrate, greatly reducing the risk of flux overflowing from the substrate surface and fundamentally eliminating flux overflow after baking.

[0043] Based on the above situation, this invention designs a staggered microwave grounding hole structure to prevent flux overflow. The original through-hole grounding hole is replaced with a staggered grounding hole. In fully chip-based MCM micro-packaged microwave products, this ensures that no flux overflows after final capping and baking. The maximum number of stacked hole layers in this structure is no more than 6, and 4 layers are recommended. If this requirement is not met, at least 2 through-hole layers should be staggered, and sufficient space must be provided in the multilayer ceramic substrate to replace the through-hole grounding hole with a staggered hole. Replacing the through-hole grounding hole with a staggered grounding hole cuts off the capillary effect path, significantly reducing the risk of flux overflowing from the substrate surface. This fundamentally eliminates the problem of flux overflow after pre-capping baking, which could cause fully chip-based MCM micro-packaged microwave products to fail testing, resulting in higher reliability.

[0044] It should be noted that all electronic components, substrates, and reagents used in this invention, unless otherwise specified, are those known in the art. For example, substrate 1 is a substrate made of low-temperature co-fired ceramic material, as known in the prior art. The flux used is a conventional rosin flux, as known in the prior art.

[0045] The following are specific embodiments of the present invention. It should be noted that the present invention is not limited to the following specific embodiments. All equivalent modifications made based on the technical solutions of this application fall within the protection scope of the present invention.

[0046] Example 1:

[0047] This embodiment provides a staggered distribution microwave grounding hole structure to prevent flux overflow, such as... Figure 4 As shown, the structure includes six substrates 1, which are stacked in a vertical direction; the six substrates 1 are, from top to bottom, the first substrate 1, the second substrate 1, the third substrate 1, the fourth substrate 1, the fifth substrate 1 and the sixth substrate 1; each substrate 1 has a plurality of microwave grounding holes 2.

[0048] like Figure 3 As shown, the microwave grounding holes 2 on the first substrate 1, the second substrate 1, the third substrate 1, and the fourth substrate 1 are all arranged in a one-to-one correspondence and are connected; the microwave grounding holes 2 on the fourth substrate 1 and the fifth substrate 1 are all arranged alternately and are not connected; the microwave grounding holes 2 on the fifth substrate 1 and the sixth substrate 1 are arranged in a one-to-one correspondence and are connected.

[0049] In this embodiment, microwave grounding hole 2 ensures the grounding characteristics of microwave devices, and microwave power devices are designed for heat dissipation.

[0050] As one specific solution in this embodiment, such as Figure 5 As shown, the inner diameter of the microwave grounding hole 2 [before sintering] is d. T 100μm≤d T ≤300μm, preferably d T =200μm.

[0051] As one specific solution in this embodiment, such as Figure 3 and Figure 5 As shown, the distance between two adjacent microwave grounding holes 2 located on the same substrate 1 is G. A If the inner diameters of the two microwave grounding holes 2 are equal, then 2d T ≤G A ≤6d T G is preferred A =4d T If the inner diameters of the two microwave grounding holes 2 are not equal, let the inner diameter of one of the microwave grounding holes 2 be d. T1 The inner diameter of the other microwave grounding hole 2 is d. T2 ,but Preferred G A =2(d T1 +d T2 ).

[0052] As one specific solution in this embodiment, such as Figure 3 As shown, the spacing between two adjacent microwave grounding vias 2 [i.e., vias of different signal networks in adjacent layers] located on different substrate layers 1 and not connected is G. BIf the inner diameters of the two microwave grounding holes 2 are equal, then d T ≤G B ≤3d T G is preferred B =2d T If the inner diameters of the two microwave grounding holes 2 are not equal, let the inner diameter of one of the microwave grounding holes 2 be d. T3 The inner diameter of the other microwave grounding hole 2 is d. T4 ,but Preferred G B =d T3 +d T4 .

[0053] As one specific solution in this embodiment, such as Figure 5 As shown, the shortest distance between microwave grounding hole 2 and the edge of the substrate is I. T1 I T1 ≥200μm.

[0054] As one specific solution in this embodiment, such as Figure 5 As shown, a cavity 3 is also formed on the substrate 1, and the shortest distance between the microwave grounding hole 2 and the edge of the cavity 3 is I. T2 I T2 ≥200μm. In this embodiment, cavity 3 mainly ensures the grounding characteristics of microwave devices, and the microwave power devices are designed for heat dissipation.

[0055] As one specific solution in this embodiment, such as Figure 5 As shown, each substrate 1 is provided with multiple heat dissipation holes 4, which are arranged at equal intervals along the horizontal and vertical directions; the structure formed by the multiple heat dissipation holes 4 is a heat dissipation hole matrix; the heat dissipation holes 4 on each substrate 1 are arranged in a one-to-one correspondence and are connected.

[0056] As one specific solution in this embodiment, such as Figure 5 As shown, the inner diameter of the heat dissipation hole 4 [before sintering] is d. S 200μm≤d S ≤300μm, preferably d S =200μm; the spacing between two adjacent heat dissipation holes 4 located on the same substrate 1 is G. S 3D S ≤G S ≤5d S G is preferred S =3d S .

[0057] As one specific solution in this embodiment, such as Figure 5 As shown, the length of the heat dissipation hole matrix is ​​L. S 4.5mm≤LS ≤6.5mm, L preferred S = 6.5mm; the width of the heat dissipation hole matrix is ​​W S 4.5mm≤W S ≤6.5mm, W preferred S =6.5mm.

[0058] As one specific solution in this embodiment, such as Figure 5 As shown, the shortest distance between the heat dissipation hole matrix and the edge of the substrate is I. S I S ≥2mm.

[0059] As a specific embodiment, the flux's main component is rosin. When soldering with lead-tin solder, solder resist residue remains in the solder. Upon heating, this residue climbs up along the microwave grounding via and overflows from the surface. Microwave grounding vias are typically plugged, but plugging is not airtight, allowing flux to overflow due to capillary action.

[0060] As a specific embodiment of this invention, the engineering application of a multilayer interconnect substrate with a staggered distribution of microwave grounding holes to prevent flux overflow includes: applying lead-tin solder between the bottom layer of the LTCC substrate and the casing, and then soldering it in a reflow oven. The resulting multilayer substrate with the staggered distribution of microwave grounding holes effectively prevents flux from climbing upwards; even under capillary action, the flux only overflows to the middle layer of the substrate and does not spill over to the surface of the multilayer substrate.

[0061] Comparative Example 1:

[0062] This comparative example presents a through-type distributed microwave grounding hole structure, such as... Figure 2 As shown, the main difference between this structure and Embodiment 1 is that the microwave grounding holes 2 on the first substrate 1, the second substrate 1, the third substrate 1, the fourth substrate 1, the fifth substrate 1 and the sixth substrate 1 are all arranged in a one-to-one correspondence and are connected.

[0063] Verification of the effects of Example 1 and Comparative Example 1:

[0064] This invention uses the HFSS three-dimensional electromagnetic field model to simulate and verify microwave grounding performance. After optimization, the simulation results are as follows: Figure 6 and Figure 7 As shown, comparing the DC characteristics of the staggered distributed grounding hole in Example 1 and the straight-through grounding hole in Comparative Example 1, both exhibit losses better than 0.003dB and return losses better than 60dB, thus not affecting grounding impedance and grounding performance. Furthermore, according to engineering measurements, the impedance value of the staggered distributed grounding hole is approximately 150mΩ, which is on the same order of magnitude as the impedance value of the straight-through grounding hole, showing virtually no change. This demonstrates its excellent microwave grounding characteristics.

[0065] The microwave grounding heat dissipation characteristics of this invention were compared and analyzed using thermal design simulation. Figure 8 As can be seen, the staggered microwave grounding vias proposed in Example 1, when the heat dissipation of the microwave power device does not exceed 0.4W, show a clear difference in thermal design simulation results between staggered microwave grounding vias and through-hole grounding vias under the same operating conditions, as illustrated in the following figure. Figure 8 As shown in the figure. The thermal design simulation results show that the heat dissipation path of the staggered microwave grounding holes is longer than that of the straight grounding holes, the temperature rise is 1.5℃, and the first-level derating temperature of the power device is 110℃. Both meet the first-level derating design of the device, which proves that the thermal design of the staggered microwave grounding holes and the straight grounding holes is reasonable and does not affect the heat dissipation characteristics of the power devices.

[0066] Example 2:

[0067] This embodiment provides a staggered distribution microwave grounding hole structure to prevent flux overflow, such as... Figure 9 As shown in (A), the structure is basically the same as that in Embodiment 1, except that: the microwave grounding holes 2 on the first substrate 1, the second substrate 1 and the third substrate 1 are all arranged in a one-to-one correspondence and are connected; the microwave grounding holes 2 on the third substrate 1 and the fourth substrate 1 are not connected; the microwave grounding holes 2 on the fourth substrate 1, the fifth substrate 1 and the sixth substrate 1 are all arranged in a one-to-one correspondence and are connected.

[0068] Example 3:

[0069] This embodiment provides a staggered distribution microwave grounding hole structure to prevent flux overflow, such as... Figure 9 As shown in (B), the structure is basically the same as that in Embodiment 1, except that: the microwave grounding holes 2 on the first substrate 1 and the second substrate 1 are connected; the microwave grounding holes 2 on the second substrate 1 and the third substrate 1 are not connected; the microwave grounding holes 2 on the third substrate 1 and the fourth substrate 1 are connected; the microwave grounding holes 2 on the fourth substrate 1 and the fifth substrate 1 are not connected; and the microwave grounding holes 2 on the fifth substrate 1 and the sixth substrate 1 are connected.

[0070] Example 4:

[0071] This embodiment provides a staggered distribution microwave grounding hole structure to prevent flux overflow, such as... Figure 9As shown in (C), the structure is basically the same as that in Embodiment 1, except that: the structure includes five substrates 1, which are stacked in the vertical direction; the five substrates 1 are arranged from top to bottom as first substrate 1, second substrate 1, third substrate 1, fourth substrate 1 and fifth substrate 1; each substrate 1 has a plurality of microwave grounding holes 2; the microwave grounding holes 2 on the first substrate 1, second substrate 1 and third substrate 1 are arranged in a one-to-one correspondence and are connected; the microwave grounding holes 2 on the third substrate 1 and fourth substrate 1 are not connected; the microwave grounding holes 2 on the fourth substrate 1 and fifth substrate 1 are connected.

[0072] Example 5:

[0073] This embodiment provides a staggered distribution microwave grounding hole structure to prevent flux overflow, such as... Figure 9 As shown in (D), the structure is basically the same as that in Embodiment 4, except that: the microwave grounding holes 2 on the first substrate 1 and the second substrate 1 are connected; the microwave grounding holes 2 on the second substrate 1 and the third substrate 1 are not connected; and the microwave grounding holes 2 on the third substrate 1, the fourth substrate 1 and the fifth substrate 1 are connected.

[0074] Example 6:

[0075] This embodiment provides a staggered distribution microwave grounding hole structure to prevent flux overflow, such as... Figure 9 As shown in (E), the structure is basically the same as that in Embodiment 1, except that: the structure includes four substrates 1, which are stacked in the vertical direction; the four substrates 1 are, from top to bottom, a first substrate 1, a second substrate 1, a third substrate 1, and a fourth substrate 1; each substrate 1 has a plurality of microwave grounding holes 2; the microwave grounding holes 2 on the first substrate 1 and the second substrate 1 are connected; the microwave grounding holes 2 on the second substrate 1 and the third substrate 1 are not connected; the microwave grounding holes 2 on the third substrate 1 and the fourth substrate 1 are connected.

Claims

1. A staggered microwave grounding hole structure for preventing flux overflow, the structure comprising a plurality of substrates (1) stacked vertically in layers; each substrate (1) having a plurality of microwave grounding holes (2); characterized in that: The number of substrates (1) is 4 to 6; the microwave grounding holes (2) on at least two adjacent substrates (1) are staggered and not connected, and the microwave grounding holes (2) on at least two adjacent substrates (1) are connected in a one-to-one correspondence. The inner diameter of the microwave grounding hole (2) is d. T 100μm≤d T ≤300μm; The distance between two adjacent microwave grounding holes (2) located on the same substrate (1) is G. A If the inner diameters of the two microwave grounding holes (2) are equal, then 2d T ≤G A ≤6d T If the inner diameters of the two microwave grounding holes (2) are not equal, let the inner diameter of one of the microwave grounding holes (2) be d. T1 The inner diameter of the other microwave grounding hole (2) is d. T2 ,but The distance between two adjacent microwave grounding holes (2) located on different substrate layers (1) and not connected is G. B If the inner diameters of the two microwave grounding holes (2) are equal, then d T ≤G B ≤3d T If the inner diameters of the two microwave grounding holes (2) are not equal, let the inner diameter of one of the microwave grounding holes (2) be d. T3 The inner diameter of the other microwave grounding hole (2) is d. T4 ,but 2. The staggered microwave grounding hole structure for preventing flux overflow as described in claim 1, characterized in that, The shortest distance between the microwave grounding hole (2) and the edge of the substrate is I. T1 I T1 ≥200μm.

3. The staggered distribution microwave grounding hole structure for preventing flux overflow as described in claim 1, characterized in that, The flux used during the reflow soldering of the substrate (1) is rosin flux.

4. The staggered distribution microwave grounding hole structure for preventing flux overflow as described in claim 3, characterized in that, The substrate (1) is a low-temperature co-fired ceramic substrate.

5. The staggered microwave grounding hole structure for preventing flux overflow as described in claim 1, characterized in that, A cavity (3) is also provided on the substrate (1), and the shortest distance between the microwave grounding hole (2) and the edge of the cavity (3) is I. T2 I T2 ≥200μm.

6. The staggered distribution microwave grounding hole structure for preventing flux overflow as described in claim 1, characterized in that, Each substrate (1) is provided with multiple heat dissipation holes (4), which are arranged at equal intervals along the horizontal and vertical directions; the structure formed by the multiple heat dissipation holes (4) is a heat dissipation hole matrix; the heat dissipation holes (4) on each substrate (1) are arranged in a one-to-one correspondence and are connected.

7. The staggered distribution microwave grounding hole structure for preventing flux overflow as described in claim 6, characterized in that, The inner diameter of the heat dissipation hole (4) is d. S 200μm≤d S ≤300μm.

8. The staggered distribution microwave grounding hole structure for preventing flux overflow as described in claim 6, characterized in that, The spacing between two adjacent heat dissipation holes (4) located on the same substrate (1) is G. S 3D S ≤G S ≤5d S .

9. The staggered distribution microwave grounding hole structure for preventing flux overflow as described in claim 6, characterized in that, The length of the heat dissipation hole matrix is ​​L S 4.5mm≤L S ≤6.5mm; the width of the heat dissipation hole matrix is ​​W S , 4.5mm≤W S ≤6.5mm.

10. The staggered distribution microwave grounding hole structure for preventing flux overflow as described in claim 6, characterized in that, The shortest distance between the heat dissipation hole matrix and the edge of the substrate is I. S I S ≥2mm.

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