A pressing process for rigid-flex printed circuit boards

Abstract

The present invention relates to the technical field of manufacturing rigid-flexible boards, and discloses a rigid-flexible board lamination process, including S1, material preparation: prepare a flexible circuit layer, which is usually made of polyimide material; prepare a rigid circuit layer, which is usually made of FR‑4 material; prepare an adhesive layer for bonding the flexible layer and the rigid layer together. The invention is provided with a detachable fixing frame and a carrier. When a rigid-flexible board has been pressed, the carrier part carrying it drives the rigid-flexible board to move in the downward direction, and the carrier gradually moves to the slotted area. Since the linkage parts are arranged in the three-division position of the carrier, when the carrier moves to the slotted area beyond its center line position, the carrier will rotate toward the bottom of the fixing frame due to gravity. The carrier rotates, and the pressed rigid-flexible board carried by its upper surface will gradually slide along the inclined carrier to the upper surface of the receiving plate to complete the unloading operation.

Description

Technical Field

[0001] The present invention relates to the technical field of manufacturing flexible-rigid printed circuit boards, and particularly to a lamination process for flexible-rigid printed circuit boards. Background Art

[0002] IC substrates, also known as IC packaging substrates, have replaced traditional lead frames in the high-end packaging field and have become an indispensable part of chip packaging. They not only provide support, heat dissipation, and protection for chips, but also provide electrical connections between chips and PCB motherboards, playing a "connecting link" role. In order to provide greater flexibility for packaging design, enable circuits to be laid out according to complex product shapes, and improve the thermal management ability of packaging, in the chip manufacturing process, the lamination process of flexible-rigid printed circuit boards involving the stacking and bonding of multiple layers of materials is a precise and important working process.

[0003] In the prior art, a laminator is used to perform lamination positioning on batches of flexible-rigid printed circuit boards. In the subsequent blanking process, workers or manipulators are required to blank one by one. Although the stability of the flexible-rigid printed circuit boards can be ensured, the blanking efficiency is low, the blanking time is long, which also affects the appearance quality of the products, reduces production efficiency, and increases costs. In view of this, we provide a lamination process for flexible-rigid printed circuit boards. Summary of the Invention

[0004] Technical Problems to be Solved

[0005] Aiming at the above-mentioned disadvantages of the prior art, the present invention provides a lamination process for flexible-rigid printed circuit boards, which can effectively solve the problem of low blanking efficiency after lamination of flexible-rigid printed circuit boards in the prior art.

[0006] Technical Solutions

[0007] To achieve the above objectives, the present invention is realized through the following technical solutions:

[0008] The present invention provides a lamination process for flexible-rigid printed circuit boards, including:

[0009] S1. Material preparation: Prepare a flexible circuit layer, usually made of polyimide or other flexible materials; prepare a rigid circuit layer, usually made of FR-4 or other rigid materials; prepare an adhesive layer for bonding the flexible layer and the rigid layer together;

[0010] S2. Preprocessing: Perform processes such as drilling, patterning, and etching on the flexible layer and the rigid layer to form circuit patterns, and clean and process the surfaces of the flexible layer and the rigid layer to ensure good bonding effects;

[0011] S3. Lamination: Stack the processed flexible layer and rigid layer in the carrier according to the design requirements, add an adhesive layer in the middle, and place the stacked flexible-rigid printed circuit board in the carrier;

[0012] S4. Pressing: Heat and press the stacked flexible-rigid printed circuit board through a press to cure the adhesive layer and firmly bond the flexible layer and the rigid layer together. During the pressing process, the temperature, pressure, and time need to be strictly controlled to ensure the bonding quality;

[0013] S5. Post-treatment: After pressing is completed, cool the flexible-rigid printed circuit board and then unload it, and perform subsequent process treatments such as contour machining, drilling, and plating;

[0014] S6. Inspection: Conduct appearance inspection, electrical testing, and mechanical property testing on the pressed flexible-rigid printed circuit board to ensure that it meets the design requirements;

[0015] Among them, in the pressing part of the press in S4, a transport part that moves cyclically is provided at the bottom of the pressing part. Above the transport part, a carrier part for carrying the flexible-rigid printed circuit board material is provided. At the lower left and right of both ends of the transport part, a receiving plate for receiving the pressed flexible-rigid printed circuit board is provided. The carrier part includes a fixed frame and a carrier plate with a split design. The fixed frame is fixedly connected to the upper surface of the transport part, and the inner part of the fixed frame is rotationally connected to the outer surface of the carrier plate. The rotation of the carrier plate can perform batch unloading operations on the flexible-rigid printed circuit board carried on its surface;

[0016] Among them, the carrier part further includes a pushing member provided inside the carrier plate to apply a force to the flexible-rigid printed circuit board and accelerate the unloading of the pressed flexible-rigid printed circuit board.

[0017] Further, a second clamping plate is provided on the side of the fixed frame, and the second clamping plate is arranged in a trapezoidal structure;

[0018] A first clamping plate is provided on the side of the inner wall of the fixed frame, and the first clamping plate is arranged in a complementary trapezoidal structure. The shape of the first clamping plate is designed to match the trapezoidal structure of the second clamping plate, and the two are clamped together.

[0019] Further, fixing grooves are symmetrically provided on the inner wall of the fixed frame. A sliding plate is connected to the inside of the fixing groove in a damping manner, and the inner side of the fixing groove is rotationally connected to the outer surface of the linkage member.

[0020] Further, a sliding groove is provided on the inner wall of the carrier plate, and a pushing member is connected inside the sliding groove. The pushing member includes a telescopic elastic rod elastically connected to the bottom end of the sliding groove, and a pushing plate is elastically connected to the top end of the telescopic elastic rod. In the initial state, the upper surface of the pushing plate is flush with the upper surface of the carrier plate. Fixing plates are fixedly connected to both ends of the carrier plate, and the fixing plates are embedded in the inner wall of the fixing groove. And in the initial state, there is a gap between the fixing plates and the side of the sliding plate.

[0021] Further, the linkage member includes a main spindle rod located on the inner wall of the sliding groove. In the initial state, the main spindle rod lies flat, and at this time, the distance between the lower surface of the push plate and the inner wall of the sliding groove is the shortest. Both ends of the main spindle rod are fixedly connected with fixing blocks. In the middle of the outer surface of the round shaft of the fixing block, there is a fixedly connected abutting block, and the other end of the fixing block is fixedly connected with a gear.

[0022] Further, the transportation part includes a transportation plate. On both sides of the transportation plate, there are sliding grooves. On the inner walls of the sliding grooves, there are symmetrically fixed toothed plates. On the side of the sliding groove, there is a limiting groove for limiting the gear. In the middle of the transportation plate, at the position directly below the pressing part, there is a lower pushing member that cooperates with the pressing part to perform the pressing operation. At both ends of the transportation plate, there are openings for facilitating the inclined blanking of the carrier plate.

[0023] Further, on the side of the carrier plate away from the material receiving plate, there is a cleaning member. The cleaning member includes a positioning frame fixedly connected to one side of the top of the carrier plate. Inside the positioning frame, there is a scraping knife for cleaning the surface of the carrier plate.

[0024] Beneficial effects

[0025] The technical solution provided by the present invention has the following beneficial effects compared with the prior art:

[0026] The present invention is provided with a separable fixing frame and a carrier plate. When a flexible-rigid printed circuit board has completed pressing and the carrier part carrying it drives the flexible-rigid printed circuit board to move in the blanking direction, the carrier plate gradually moves to the opening area. Since the linkage member penetrates through the carrier plate at the one-third position, when the carrier plate moves to the opening area and exceeds its center line position, the carrier plate will rotate downward under the fixing frame due to gravity. The pressed flexible-rigid printed circuit board carried on its upper surface will also gradually slide along the inclined carrier plate to the upper surface of the material receiving plate, completing the blanking operation.

[0027] Through the arrangement of the second clamping plate and the first clamping plate in the present invention, since the fixing frame is supported in all directions on the upper surface of the transportation plate during the stable movement on the upper surface of the transportation plate, the fixing frame and the carrier plate can be regarded as a load-bearing plate structure. At this time, this load-bearing plate structure will not rotate, avoiding physical damage to the un-pressed flexible-rigid printed circuit board material caused by the raised edge of the rotating carrier plate during the movement, and at the same time avoiding changes in the distribution of the load-bearing plate structure as the support point or support surface, resulting in uneven forces on the flexible material, which may cause local stress concentration phenomena, such as excessive deformation or local depression, etc. At the same time, it reduces the possible decrease in the overall stability of the load-bearing plate structure due to the rotation of the internal structure of the load-bearing plate structure, making the stability of the material on the load-bearing surface poor, easy to slide or shift, resulting in too low pressing efficiency. Therefore, through the cooperative arrangement of the second clamping plate and the second clamping plate in the present invention, the positions of the fixing frame and the carrier plate as the load-bearing structure are ensured to be stable.

[0028] In the present invention, through the setting of the additional pusher, while the carrier plate rotates, it drives the additional pusher to rotate synchronously. The carrier plate and the additional pusher rotate around the main spindle rod. Since the main spindle rod is set in a cam shape, while the carrier plate inclines to unload the rigid-flex printed circuit board, the additional pusher rotates, causing the contact position between the push plate and the main spindle rod to change from the position with the minimum diameter of the main spindle rod to the position with the maximum diameter of the main spindle rod. As a result, the distance between the bottom end of the push plate and the bottom end of the inner wall of the carrier plate increases. The push plate moves upward along the sliding groove and applies an additional thrust to the bottom end of the downward-moving rigid-flex printed circuit board, further increasing the downward movement rate of the rigid-flex printed circuit board. At the same time, the size of the push plate is larger than half of the size of the rigid-flex printed circuit board. When the semi-fixed piece of the rigid-flex printed circuit board melts, its components may flow and disperse to other positions, and may even penetrate to the edge of the core board or the surface of the carrier plate that bears it. The force applied by the push plate can effectively help release the adhesion between the rigid-flex printed circuit board and the carrier plate by pushing on a surface that exceeds half of the size of the rigid-flex printed circuit board itself, ensuring that the rigid-flex printed circuit board can slide from the inclined surface of the carrier plate to the surface of the receiving plate.

[0029] The present invention is provided with a linkage member. When the fixed block rotates, it drives the abutting block to rotate. The rotation of the abutting block no longer limits one side of the sliding plate. At this time, the carrier plate located in the grooved area reaches the maximum part, and the component of the downward rotation gravity of the carrier plate increases. Therefore, the thrust of the fixed plate on the sliding plate increases, and the fixed plate pushes the sliding plate on the other side that is not restricted to continue sliding along the inner wall of the sliding plate. At this time, the inclination angle of the carrier plate increases, and the gap between the carrier plate and the side of the receiving plate increases. The cleaned debris falls at a specific position and does not fall on the surface of the receiving plate, keeping the surface of the receiving plate clean and avoiding damage to the bottom surface of the rigid-flex printed circuit board due to falling debris on the surface of the receiving plate.

[0030] The present invention is provided with a carrier part that reciprocates on the surface of the transportation part. After one carrier part moves to one side of the transportation part to complete the unloading operation, the rigid-flex printed circuit board above the other carrier part also completes the lamination. Then, the carrier part moves in the reverse direction along the upper surface of the transportation part, moving the rigid-flex printed circuit board above the other carrier part in the direction of the receiving plate in the other direction to perform the unloading operation for another working station. The carrier part that has completed the unloading moves in the reverse direction, and the fixed frame drives the carrier plate to move in the reverse direction, reversely rotating the carrier plate under the restriction of the groove until the side of the carrier plate close to the unloading position also moves to the surface of the transportation part. The clamping plate 1 on the side of the fixed frame is clamped with the clamping plate 2 on the inner wall of the carrier plate again, and the fixed frame and the carrier plate are restored to the structure state of the bearing plate under the support of the transportation part. As another carrier part enters the unloading state, this carrier part also enters the loading state, and then the next cycle is carried out. Description of the Drawings

[0031] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0032] Figure 1 Schematic diagram of the process flow of the embodiment of the present invention;

[0033] Figure 2 Schematic diagram of the lamination process of the embodiment of the present invention;

[0034] Figure 3 Schematic diagram of the structure of the carrier part in the flat state of the embodiment of the present invention;

[0035] Figure 4 Schematic diagram of the separation structure of the carrier part of the embodiment of the present invention;

[0036] Figure 5 Schematic diagram of the cross-sectional structure of the carrier board of the embodiment of the present invention;

[0037] Figure 6 Schematic diagram of the connection structure of the linkage member of the embodiment of the present invention;

[0038] Figure 7 Schematic diagram of the overall structure and partial enlargement of the transportation part of the embodiment of the present invention.

[0039] The reference numerals in the figure respectively represent: 1, lamination part; 2, carrier part; 21, fixing frame; 211, first clamping plate; 212, fixing groove; 213, sliding plate; 22, carrier board; 221, second clamping plate; 222, sliding groove; 223, fixing plate; 23, pushing member; 231, pushing plate; 232, telescopic spring rod; 24, linkage member; 241, gear; 242, fixing block; 243, main shaft rod; 244, abutting block; 25, cleaning member; 251, positioning frame; 252, scraper; 3, transportation part; 31, transportation board; 32, chute; 33, toothed plate; 34, limiting groove; 35, downward pushing member; 36, slotted opening; 4, receiving plate. Detailed implementation manners

[0040] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present invention.

[0041] The present invention will be further described below in conjunction with embodiments.

[0042] Embodiment:

[0043] Please refer to Figures 1 - 7 , the present invention provides a lamination process technical solution for a rigid-flex printed circuit board: The lamination process includes the following steps:

[0044] S1. Material preparation: Prepare a flexible circuit layer, usually made of polyimide or other flexible materials; prepare a rigid circuit layer, usually made of FR-4 or other rigid materials; prepare an adhesive layer for bonding the flexible layer and the rigid layer together;

[0045] S2. Pre-processing: Perform processes such as drilling, patterning, and etching on the flexible layer and the rigid layer to form a circuit pattern, and clean and treat the surfaces of the flexible layer and the rigid layer to ensure good bonding effect;

[0046] S3. Lamination: Stack the processed flexible layer and rigid layer in a carrier according to the design requirements, and add an adhesive layer in the middle;

[0047] S4. Lamination: Heat and press the rigid-flex printed circuit board after lamination through a laminator to cure the adhesive layer and firmly bond the flexible layer and the rigid layer together. During the lamination process, the temperature, pressure, and time need to be strictly controlled to ensure the bonding quality;

[0048] S5. Post-processing: After lamination, cool the rigid-flex printed circuit board and then unload it, and perform subsequent process treatments such as shape processing, drilling, and plating;

[0049] S6. Inspection: Conduct appearance inspection, electrical testing, and mechanical property testing on the rigid-flex printed circuit board after lamination to ensure that it meets the design requirements.

[0050] As Figure 1 shown, the laminator includes a lamination part 1, a carrier part 2, a transportation part 3, and a receiving plate 4. The structure of the lamination part 1 is the same as the structural principle of the laminator in the prior art and is used to laminate the rigid-flex board materials. A transportation part 3 is arranged below the lamination part 1. Two carrier parts 2 for carrying the laminated rigid-flex board materials are evenly arranged above the transportation part 3. A receiving plate 4 for unloading and carrying the rigid-flex printed circuit board after lamination is arranged at the lower oblique positions at both ends of the transportation part 3.

[0051] As Figure 5 , Figure 3 and Figure 4, the vehicle part 2 includes a fixing frame 21 arranged above the transportation part 3. A carrier plate 22 is slidably connected to the inner wall of the fixing frame 21. A second clamping plate 221 is fixedly connected to the side of the carrier plate 22. One side of the inner wall of the fixing frame 21 is provided as a first clamping plate 211. The second clamping plate 221 is arranged in a trapezoidal structure. The shape of the first clamping plate 211 is designed to match the trapezoidal structure of the second clamping plate 221. Therefore, the second clamping plate 221 can only rotate away from the lower direction of the first clamping plate 211. When the second clamping plate 221 moves upward, it will be clamped and limited by the first clamping plate 211. The carrier plate 22 can only move to a position flush with the upper surface of the fixing frame 21. The transportation part 3 includes a transportation plate 31 located below the vehicle part 2. Slots 36 are opened at both ends of the transportation plate 31. The size of the slots 36 is larger than the size of the fixing frame 21. A downward pushing member 35 cooperating with the transportation part 3 is arranged on the upper surface of the transportation plate 31 at a position below the pressing part 1.

[0052] As Figure 2 shown, two vehicle parts 2 are sequentially placed above the transportation plate 31. One of the vehicle parts 2, after carrying the stacked materials, moves towards the pressing part 1 under the restriction of the transportation plate 31. This vehicle part 2 completes the pressing process under the combined action of the downward pushing member 35 at the bottom end and the pressing member in the pressing part 1 at the top end, pressing the stacked flexible-rigid printed circuit board materials into a flexible-rigid printed circuit board. When this vehicle part 2 enters the pressing part 1 for pressing operation, the other vehicle part 2 is located in the feeding area for feeding and stacking operation. When the previous vehicle part 2 completes pressing and is unloaded after cooling, the vehicle part 2 that has completed the feeding and stacking operation then enters the pressing part 1 for pressing operation.

[0053] When the flexible-rigid printed circuit board is in the state as Figure 2 shown, that is, when a flexible-rigid printed circuit board has completed pressing and the vehicle part 2 carrying it drives the flexible-rigid printed circuit board to move in the unloading direction, the carrier plate 22 gradually moves to the slot 36 area. Since the linkage member 24 is disposed through the one-third position of the carrier plate 22, when the carrier plate 22 moves to the slot 36 area beyond its center line position, the carrier plate 22 will rotate downward relative to the fixing frame 21 due to gravity. The pressed flexible-rigid printed circuit board carried on the upper surface of the carrier plate 22 will gradually slide along the inclined carrier plate 22 to the upper surface of the receiving plate 4, completing the unloading operation.

[0054] Since the fixing frame 21 is supported in all directions on the upper surface of the transport plate 31 during its stable movement on the upper surface of the transport plate 31, the fixing frame 21 and the carrier plate 22 can be regarded as a carrier plate structure. At this time, the carrier plate structure will not rotate, avoiding physical damage to the un-pressed flexible-rigid printed circuit board material caused by the raised edge of the rotating carrier plate 22 during the movement. At the same time, it avoids the change in the distribution of the carrier plate structure as the support point or support surface, resulting in uneven force on the flexible material, which may cause local stress concentration, such as excessive deformation or local depression. At the same time, it reduces the possible decrease in the overall stability of the carrier plate structure caused by the rotation of the internal structure of the carrier plate structure, making the stability of the material on the carrier surface poor, easy to slide or shift, resulting in too low lamination efficiency. Therefore, through the cooperative setting of the second clamping plate 221 and the second clamping plate 221, the present invention ensures the stability of the positions of the fixing frame 21 and the carrier plate 22 as the load-bearing structure.

[0055] Reference Figure 4 、 Figure 5 and Figure 6 , a sliding groove 222 is formed inside the carrier plate 22. A pushing member 23 is arranged inside the sliding groove 222. The main shaft 243 of the linkage member 24 penetrates through the middle of the sliding groove 222. The linkage member 24 further includes fixing blocks 242 fixedly connected to both ends of the main shaft 243. A resisting block 244 is fixedly connected to the outer surface of the round shaft of the fixing block 242. The fixing block 242 is located inside the fixing groove 212, and the resisting block 244 is in contact with one side of the sliding plate 213. The sliding plate 213 is in damping connection with the fixing groove 212, and the fixing block 242 is in damping connection with the sliding plate 213. The other end of the fixing block 242 is fixedly connected to a gear 241. A fixing plate 223 is fixedly connected to the side of the carrier plate 22. The fixing plate 223 is located inside the fixing groove 212, and there is a gap between the fixing plate 223 and the other side of the sliding plate 213. Reference Figure 7 , the transport part 3 further includes sliding grooves 32 formed on both sides of the transport plate 31. A limiting groove 34 for limiting the gear 241 is formed on the side of the inner wall of the sliding groove 32. Tooth plates 33 are symmetrically and fixedly connected to the bottom end of the inner wall of the sliding groove 32 near the material receiving plate 4. The top end of the tooth plate 33 is meshed with the bottom end of the scraping knife 252.

[0056] The rotation of the carrier plate 22 drives the fixed plate 223 fixedly connected thereto to rotate. The fixed plate 223 rotates inside the fixed slot 212. While the carrier plate 22 is tilted at a certain angle to unload the rigid-flex printed circuit board carried on its surface, the fixed plate 223 contacts the side of the sliding plate 213. The sliding plate 213 that rotates with damping in the fixed slot 212 limits the rotation of the fixed plate 223. At the same time, the abutting block 244 that fits against the other side of the sliding plate 213 limits the rotation of the fixed plate 223 again. Under the action of multiple sets of limits, the bottom end of the tilted carrier plate 22 is flush with the upper surface side of the receiving plate 4, and the rigid-flex printed circuit board carried on the upper surface of the carrier plate 22 slides smoothly onto the surface of the receiving plate 4. At this time, the carrier plate 22 is in an inclined state, and the side of the carrier plate 22 does not coincide with the side of the receiving plate 4, and the receiving plate 4 will not hinder the subsequent rotation of the carrier plate 22.

[0057] Reference Figure 5 and Figure 4 The pushing member 23 includes a telescopic elastic rod 232 elastically connected to the bottom end of the inner wall of the sliding slot 222. The top end of the telescopic elastic rod 232 is elastically connected to a pushing plate 231. The side of the pushing plate 231 is slidably connected to the sliding slot 222. In the initial state, as Figure 5 shown, the position where the main shaft rod 243 contacts the bottom end of the pushing plate 231 and the inner wall of the sliding slot 222 is the minimum dimension of the main shaft rod 243, and the main shaft rod 243 is located directly below the pushing plate 231.

[0058] While the carrier plate 22 rotates, it drives the pushing member 23 to rotate synchronously. The carrier plate 22 and the pushing member 23 rotate around the main shaft rod 243. Since the main shaft rod 243 is set in a cam shape, while the carrier plate 22 is tilted to unload the rigid-flex printed circuit board, the pushing member 23 rotates, so that the contact position between the pushing plate 231 and the main shaft rod 243 changes from the position with the minimum diameter of the main shaft rod 243 to the position with the maximum diameter of the main shaft rod 243, thereby increasing the distance between the bottom end of the pushing plate 231 and the bottom end of the inner wall of the carrier plate 22. The pushing plate 231 moves upward along the sliding slot 222 to apply an additional thrust to the bottom end of the downward moving rigid-flex printed circuit board, further increasing the downward movement rate of the rigid-flex printed circuit board. At the same time, the size of the pushing plate 231 is larger than half of the size of the rigid-flex printed circuit board. When the semi-fixed piece of the rigid-flex printed circuit board melts, its components may flow and escape to other positions, and may even penetrate to the edge of the core board or the surface of the carrier plate 22 carrying it. The force applied by the pushing plate 231 can effectively help release the adhesion between the rigid-flex printed circuit board and the carrier plate 22 by pushing on a surface that exceeds half of the size of the rigid-flex printed circuit board itself, ensuring that the rigid-flex printed circuit board can slide from the inclined surface of the carrier plate 22 to the surface of the receiving plate 4.

[0059] Reference Figure 2 、 Figure 3 、 Figure 4 and Figure 5, the fixing frame 21 that slides along the surface of the transportation part 3 drives the carrier plate 22 carrying the soft-rigid combination board after pressing to move synchronously. After the carrier plate 22 rotates a certain angle to complete the blanking operation, the fixing frame 21 drives the gear 241 to move to one end of the sliding groove 32. During this process, the gear 241 is meshed and connected with the toothed plate 33. While the gear 241 moves along the toothed plate 33, it rotates. The rotation of the gear 241 drives the fixed block 242 to rotate, and the rotation of the fixed block 242 drives the main spindle rod 243 to rotate. The main spindle rod 243 rotates until the position where the main spindle rod 243 contacts the bottom end of the push plate 231 and the inner wall of the sliding groove 222 changes from the maximum diameter of the main spindle rod 243 to the minimum diameter. The telescopic spring rod 232 recovers from elastic deformation and pulls the push plate 231 back to the inner wall of the sliding groove 222 again, making the surface of the sliding groove 222 flush with the upper surface of the fixing frame 21, avoiding the protrusion of the push plate 231 from interfering with the subsequent cleaning steps.

[0060] The rotation of the fixed block 242 drives the abutting block 244 to rotate, and the rotation of the abutting block 244 no longer limits one side of the sliding plate 213. At this time, the carrier plate 22 in the area of the opening groove 36 reaches the maximum part, and the component of the gravity of the carrier plate 22 rotating downward increases. Therefore, the thrust of the fixing plate 223 on the sliding plate 213 increases. The fixing plate 223 pushes the sliding plate 213 on the other side that is not restricted to continue sliding along the inner wall of the sliding plate 213. At this time, the inclination angle of the carrier plate 22 increases, and the gap between the carrier plate 22 and the side of the material receiving plate 4 increases. The cleaned debris falls off at a specific position and does not fall on the surface of the material receiving plate 4, keeping the surface of the material receiving plate 4 clean and avoiding damage to the bottom surface of the soft-rigid pressing plate due to falling debris on the surface of the material receiving plate 4.

[0061] Reference Figure 4 and Figure 5 , a cleaning part 25 is arranged above one side of the carrier plate 22 away from the material receiving plate 4. The cleaning part 25 includes a positioning frame 251 fixedly connected to the top end of the carrier plate 22. A scraper 252 is arranged inside the positioning frame 251. A telescopic part is arranged on one side of the scraper 252 close to the positioning frame 251. The driving switch of the telescopic part is electrically connected to the sensors at both ends of the inner wall of the sliding groove 32. When the gear 241 moves to the edge of the sliding groove 32, the sensor can be triggered. The sensor feeds back information to drive the switch to control the telescopic part to extend. The extension of the telescopic part drives the scraper 252 to move. The scraper 252 sliding along the surface of the carrier plate 22 can scrape off the melted residues of the semi-fixed pieces remaining on the surface of the carrier plate 22.

[0062] Such as Figure 1After one of the vehicle parts 2 shown is moved to one side of the transport part 3 to complete the blanking operation, the flexible-rigid printed circuit board above the other vehicle part 2 is also completed with lamination. Then, the vehicle part 2 moves in the reverse direction along the upper surface of the transport part 3, moving the flexible-rigid printed circuit board above the other vehicle part 2 in the direction of the receiving board 4 in the other direction to perform the blanking operation at another station. The vehicle part 2 that has completed the blanking moves in the reverse direction, and the fixing frame 21 drives the carrier plate 22 to move in the reverse direction, causing the carrier plate 22 to rotate in the reverse direction under the restriction of the slot 36 until the side of the carrier plate 22 close to the blanking position also moves to the surface of the transport part 3. The first clamping plate 211 on the side of the fixing frame 21 is clamped with the second clamping plate 221 on the inner wall of the carrier plate 22 again. The fixing frame 21 and the carrier plate 22 are restored to the state of the bearing plate structure under the support of the transport part 3. As another vehicle part 2 enters the blanking state, this vehicle part 2 also enters the loading state, and then the next cycle is carried out.

[0063] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A rigid-flexible board lamination process, characterized in that: include: S1. Material preparation: Prepare the flexible circuit layer, which is usually made of polyimide or other flexible materials; Prepare a rigid circuit layer, usually made of FR-4 or other rigid materials; prepare an adhesive layer for bonding the flexible layer and the rigid layer together; S2, pre-processing: drilling, patterning, etching and other processes are performed on the flexible layer and the rigid layer to form a circuit pattern, and the surfaces of the flexible layer and the rigid layer are cleaned and processed to ensure a good bonding effect; S3, stacking: stack the processed flexible layer and rigid layer in the carrier according to the design requirements, add an adhesive layer in the middle, and place the stacked rigid-flex board in the carrier; S4, Lamination: The laminated rigid-flexible board is heated and pressurized by a laminating machine to solidify the adhesive layer and firmly bond the flexible layer and the rigid layer together. During the lamination process, the temperature, pressure and time need to be strictly controlled to ensure the bonding quality; S5, post-processing: After the pressing is completed, the rigid-flexible board is cooled and unloaded, and then the subsequent process such as shape processing, drilling, and plating is carried out; S6. Inspection: Perform appearance inspection, electrical test and mechanical performance test on the laminated rigid-flex board to ensure that it meets the design requirements; The pressing machine in S4 comprises a pressing part (1), a transport part (3) which reciprocates in a circular motion is arranged at the bottom of the pressing part (1), a carrier part (2) which carries the hard-soft combined board material is arranged above the transport part (3), receiving plates (4) for receiving the hard-soft combined board after pressing are arranged at the lower sides of both ends of the transport part (3), the carrier part (2) comprises a fixed frame (21) and a carrier plate (22) which are designed separately, the fixed frame (21) is fixedly connected to the upper surface of the transport part (3), the interior of the fixed frame (21) is rotatably connected to the outer surface of the carrier plate (22), and the carrier plate (22) can be rotated to carry out batch unloading operation on the hard-soft combined boards carried on the surface; The carrier part (2) further comprises a pushing member (23) disposed inside the carrier plate (22) for applying a force to the rigid-flexible board to accelerate the unloading of the rigid-flexible board after lamination.

2. A rigid-flexible board lamination process according to claim 1, characterized in that: A second clamping plate (221) is arranged on the side of the fixing frame (21), and the second clamping plate (221) is arranged in a ladder-like structure; A first clamping plate (211) is provided on the inner wall side of the fixing frame (21), and the first clamping plate (211) is configured as a complementary ladder-shaped structure. The shape of the first clamping plate (211) is designed to match the ladder-shaped structure of the second clamping plate (221), and the two are mutually engaged.

3. A rigid-flexible board lamination process according to claim 2, characterized in that: The inner wall of the fixing frame (21) is symmetrically provided with fixing grooves (212), the interior of the fixing groove (212) is dampingly connected with a slide plate (213), and the inner side of the fixing groove (212) is rotatably connected to the outer surface of the linkage member (24).

4. A rigid-flexible board lamination process according to claim 3, characterized in that: The inner wall of the carrier plate (22) is provided with a sliding groove (222), and a pushing member (23) is connected inside the sliding groove (222). The pushing member (23) comprises a telescopic elastic rod (232) elastically connected to the bottom end of the sliding groove (222), and a pushing plate (231) is elastically connected to the top end of the telescopic elastic rod (232). In an initial state, the upper surface of the pushing plate (231) is flush with the upper surface of the carrier plate (22). Fixed plates (223) are fixedly connected at both ends of the carrier plate (22), and the fixed plates (223) are embedded in the inner wall of the fixing groove (212), and in an initial state, there is a gap between the fixed plates (223) and the side of the sliding plate (213).

5. A rigid-flexible board lamination process according to claim 4, characterized in that: The linkage member (24) includes a main shaft rod (243) located on the inner wall of the sliding groove (222). In an initial state, the main shaft rod (243) is placed flat. At this time, the distance between the lower surface of the push plate (231) and the inner wall of the sliding groove (222) is the shortest. The two ends of the main shaft rod (243) are fixedly connected to fixed blocks (242). The middle part of the outer surface of the circular shaft of the fixed block (242) is fixedly connected to a stop block (244). The other end of the fixed block (242) is fixedly connected to a gear (241).

6. A rigid-flexible board lamination process according to claim 5, characterized in that: The transporting part (3) comprises a transporting plate (31), and slide grooves (32) are provided on both sides of the transporting plate (31). Tooth plates (33) are symmetrically fixed on the inner wall of the slide groove (32). A limiting groove (34) for limiting the gear (241) is provided on the side of the slide groove (32). A push-down member (35) for cooperating with the pressing part (1) to perform a pressing operation is provided in the middle of the transporting plate (31) and located directly below the pressing part (1). Slots (36) are provided at both ends of the transporting plate (31) for facilitating the inclined unloading of the carrier plate (22).

7. The rigid-flexible board lamination process according to claim 1, characterized in that: A cleaning member (25) is provided on a side of the carrier plate (22) away from the receiving plate (4), the cleaning member (25) comprising a positioning frame (251) fixedly connected to one side of the top end of the carrier plate (22), the inner wall of the positioning frame (251) being connected to a scraper (252) for cleaning the surface of the carrier plate (22).

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