A multilayer ceramic substrate

Abstract

The present invention provides a multilayer ceramic substrate, which relates to the technical field of ceramic substrates, including: a multilayer substrate; the multilayer substrate is composed of a ceramic lower plate, a ceramic upper plate and copper wiring, the top of the ceramic lower plate is connected to the ceramic upper plate, and the copper wiring is located in the gap between the ceramic lower plate and the ceramic upper plate; the bottom of the multilayer substrate is connected to a base, the base is fixedly connected to the chassis by screws, sleeves are installed at the four ends of the multilayer substrate, and the base is connected to the four sleeves. The present invention uses a circulating pump to transport the low-temperature cooling oil in the oil guide channel to the oil guide groove, which has an auxiliary cooling effect on the multilayer substrate, so that the multilayer substrate is kept at a low temperature, and effectively avoids the multilayer substrate from being too hot, which causes the electronic components to overheat and fail. This solves the problem that the existing multilayer ceramic substrate generally uses the outer surface for heat dissipation during application, which has a poor actual cooling effect and easily causes the ceramic substrate to be too hot, causing the electronic components to overheat and fail.

Description

Technical Field

[0001] The present invention relates to the technical field of ceramic substrates, and in particular to a multilayer ceramic substrate. Background Art

[0002] Ceramic substrates are specially crafted boards made by directly bonding copper foil to an alumina or aluminum nitride ceramic substrate at high temperatures. The resulting ultra-thin, multi-layer composite substrates exhibit excellent electrical insulation, high thermal conductivity, superior solderability, and high adhesion strength. They can also be etched with various patterns, similar to PCBs, and possess a high current-carrying capacity. Consequently, ceramic substrates have become a fundamental material for high-power power electronics circuit structure and interconnect technologies.

[0003] For example, the Chinese patent "CN109076709B multilayer ceramic substrate" comprises: a plurality of stacked base layers, each of which contains a low-temperature sintering ceramic material; a plurality of first constrained layers, each of which contains a metal oxide that does not substantially sinter at the sintering temperature of the above-mentioned low-temperature sintering ceramic material and is arranged between the above-mentioned base layers; and a protective layer, which contains the above-mentioned metal oxide and is arranged on the surface so as to be in contact with the above-mentioned base layer. When the content ratio of the above-mentioned metal oxide in the surface portion of the above-mentioned protective layer is set to X1 and the content ratio of the above-mentioned metal oxide in the boundary portion of the above-mentioned protective layer and the base layer is set to X2, X1>X2 is satisfied.

[0004] The common multi-layer ceramic substrates currently on the market generally use the outer surface for heat dissipation during application. The actual cooling effect is poor, and it is difficult to release heat into the air quickly, which can easily lead to excessively high temperatures of the ceramic substrate and cause electronic components to overheat and fail. In addition, ceramic substrates are mostly installed and fixed with screws, and tools are required for disassembly and assembly. During disassembly and assembly, the tools can easily damage the ceramic substrate and electronic components. Summary of the Invention

[0005] The present disclosure relates to a multilayer ceramic substrate, which solves the problem that existing multilayer ceramic substrates generally use the outer surface for heat dissipation during application, but the actual cooling effect is poor, and it is difficult to quickly release heat into the air, which easily leads to excessive temperature of the ceramic substrate and causes electronic components to overheat and fail. In addition, ceramic substrates are mostly installed and fixed with screws, and tools are required for disassembly and assembly, which easily damages the ceramic substrate and electronic components during disassembly and assembly.

[0006] In a first aspect of the present disclosure, a multilayer ceramic substrate is provided, specifically comprising: a multilayer substrate, a base, a sleeve, an elastic frame, a circulation pump and a heat exchanger; the multilayer substrate is composed of a ceramic lower plate, a ceramic upper plate and copper wiring, the top of the ceramic lower plate is connected to the ceramic upper plate, and the copper wiring is located in the gap between the ceramic lower plate and the ceramic upper plate; the bottom of the multilayer substrate is connected to the base, the base is fixedly connected to the chassis by screws, the four ends of the multilayer substrate are installed with sleeves, and the base is connected to the four sleeves; the top of the base is connected to the elastic frame, and the elastic frame is located above the multilayer substrate; a circulation pump is installed at one end of the top of the multilayer substrate, and a heat exchanger is installed at the other end of the top of the multilayer substrate.

[0007] Furthermore, the exterior of the ceramic lower plate is covered with a reinforcing coating A, and the exterior of the ceramic upper plate is covered with a reinforcing coating B. By setting the reinforcing coating A and the reinforcing coating B, the wear resistance of the surface of the ceramic substrate is effectively improved, and the hardness of the surface of the ceramic substrate is improved.

[0008] Furthermore, four plug posts are provided on the top of the base, and the positions of the plug posts correspond to the positions of the four connecting holes. The plug posts provided on the base pass through the sleeve, and the bottom of the sleeve contacts the base.

[0009] Furthermore, a positioning hole is provided near the upper end of the plug post, and the end of the elastic frame is inserted into the positioning hole provided in the plug post, and the elastic frame contacts the top of the four sleeves. When the multi-layer substrate is installed on the top of the base, the plug post is inserted into the sleeve, and the positioning hole leaks out from the top of the sleeve. The end of the elastic frame elastically resets and is inserted into the positioning hole, which has the effect of fixing the installation of the multi-layer substrate. When the electronic components on the multi-layer substrate are damaged and need to be replaced and repaired, a deformation force is applied inward to the elastic frame to separate the end of the elastic frame from the positioning hole, and the multi-layer substrate can be moved upward to separate the multi-layer substrate from the base, so that the damaged electronic components on the multi-layer substrate can be replaced and repaired.

[0010] Furthermore, the four ends of the multi-layer substrate are provided with connecting holes, the sleeve slides through the connecting holes provided on the multi-layer substrate, and the two ends of the sleeve are turned outward.

[0011] Furthermore, two springs are mounted on the outside of the sleeve, and the two springs are respectively located on the upper and lower sides of the multi-layer substrate. One end of the spring contacts the sleeve, and the other end of the spring contacts the multi-layer substrate. When the chassis is hit by external force, the multi-layer substrate moves along the sleeve, and the spring contracts under the force, thereby reducing the impact force on the multi-layer substrate, thereby protecting the electronic components on the multi-layer substrate.

[0012] Furthermore, two oil guide grooves are provided inside the ceramic lower plate, and cooling oil flows in the oil guide grooves. The two oil guide grooves are located in a circular shape at the edge of the ceramic lower plate, and four oil guide holes are provided inside the ceramic upper plate. The two ends of the oil guide grooves are connected to the two oil guide holes.

[0013] Furthermore, the inlet and outlet of the circulating pump are connected to the two oil guide grooves through the oil guide hole, an oil guide channel is provided inside the heat exchanger, and both ends of the oil guide channel are connected to the two oil guide grooves through the oil guide hole, and the circulating pump is connected to the oil guide channel provided in the heat exchanger through the oil guide channel.

[0014] Furthermore, a cooling channel is provided inside the heat exchanger, in which coolant flows. The cooling channel is spiral-shaped and surrounds the outer periphery of the oil guide channel. Both ends of the cooling channel are connected to the pipeline of the liquid cooling equipment inside the chassis. The circulating pump transports the low-temperature cooling oil in the oil guide channel to the oil guide groove, which plays an auxiliary cooling effect on the multi-layer substrate, keeps the multi-layer substrate in a low-temperature state, effectively avoids the multi-layer substrate temperature being too high, resulting in the occurrence of overheating failure of electronic components, and keeps the electronic components at normal operating temperature. The heated cooling oil flows back to the oil guide channel, and the coolant flowing inside the cooling channel efficiently cools the cooling oil flowing in the oil guide channel, thereby ensuring the auxiliary cooling effect of the cooling oil on the multi-layer substrate.

[0015] The present invention provides a multilayer ceramic substrate having the following beneficial effects:

[0016] When the present invention is in use, when the multi-layer substrate is mounted on the top of the base, the pin is inserted into the sleeve, the positioning hole leaks out from the top of the sleeve, and the end of the elastic frame is elastically reset and inserted into the positioning hole, thereby achieving the effect of fixing the multi-layer substrate and making the installation and fixing of the multi-layer substrate easier. When the electronic components on the multi-layer substrate are damaged and need to be replaced or repaired, a deformation force is applied inward to the elastic frame to separate the end of the elastic frame from the positioning hole, so that the multi-layer substrate can be moved upward to separate the multi-layer substrate from the base, so that the damaged electronic components on the multi-layer substrate can be replaced or repaired. The operation is simpler and more time-saving, which helps to solve the problem that traditional disassembly and assembly require the use of tools and are prone to damage.

[0017] In addition, by setting up the reinforcing coating A and the reinforcing coating B, the wear resistance of the surface of the ceramic substrate is effectively improved, thereby preventing serious scratches on the surface, and the hardness of the surface of the ceramic substrate is increased, thereby reducing the probability of notches appearing when the surface of the ceramic substrate is bumped; when the chassis is hit by external force, the multi-layer substrate moves along the sleeve, and the spring contracts under force, thereby reducing the impact force on the multi-layer substrate, thereby protecting the electronic components on the multi-layer substrate and effectively reducing the probability of electronic components being damaged due to impact.

[0018] In addition, the circulating pump transports the low-temperature cooling oil in the oil guide channel to the oil guide groove, which plays an auxiliary cooling effect on the multi-layer substrate, keeps the multi-layer substrate in a low-temperature state, effectively avoids the multi-layer substrate from being too hot, and causes the electronic components to overheat and fail, so that the electronic components maintain normal operating temperature. The heated cooling oil flows back to the oil guide channel, and the coolant circulating in the cooling channel efficiently cools the cooling oil circulating in the oil guide channel, ensuring the cooling oil's auxiliary cooling effect on the multi-layer substrate. By designing the cooling channel to be spirally wrapped around the periphery of the oil guide channel, the heat exchange area is increased, and the heat of the cooling oil in the oil guide channel is more efficiently transferred to the coolant in the cooling channel.

[0019] Other advantages, objectives and features of the present invention will be reflected in part through the following description, and in part will be understood by those skilled in the art through study and practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings of the embodiments are briefly introduced below.

[0021] The drawings described below only relate to some embodiments of the present invention, but are not intended to limit the present invention.

[0022] In the attached figure:

[0023] Figure 1 A schematic diagram of the overall top axis structure of the multilayer ceramic substrate of the present application is shown;

[0024] Figure 2 A schematic diagram of the overall bottom axis structure of the multilayer ceramic substrate of the present application is shown;

[0025] Figure 3 A schematic diagram of the axial structure of a multi-layer substrate of the present application is shown;

[0026] Figure 4 A schematic diagram of the multi-layer substrate split structure of the present application is shown;

[0027] Figure 5 The figure shows the axial side structure diagram of the ceramic lower plate of the present application;

[0028] Figure 6 Shows a schematic diagram of the base axial side structure of the present application;

[0029] Figure 7 A schematic diagram of the connection structure between the sleeve and the spring of the present application is shown;

[0030] Figure 8 It shows a schematic diagram of the axial side structure of the elastic frame of the present application;

[0031] Figure 9A schematic diagram of the cross-sectional structure of the heat exchange component of the present application is shown.

[0032] Reference Signs List

[0033] 1. Multi-layer substrate; 11. Ceramic lower plate; 1101. Reinforced coating A; 1102. Oil guide groove; 12. Ceramic upper plate; 1201. Reinforced coating B; 1202. Oil guide hole; 13. Copper trace; 101. Connecting hole; 2. Base; 201. Plug; 2011. Positioning hole; 3. Sleeve; 4. Spring; 5. Elastic frame; 6. Circulating pump; 7. Heat exchanger; 701. Oil guide channel; 702. Cooling channel. DETAILED DESCRIPTION

[0034] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the described embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] Example 1: Please refer to Figures 1 to 9 :

[0036] The present invention proposes a multilayer ceramic substrate, comprising: a multilayer substrate 1, a base 2, a sleeve 3, an elastic frame 5, a circulating pump 6 and a heat exchanger 7; the multilayer substrate 1 is composed of a ceramic lower plate 11, a ceramic upper plate 12 and a copper trace 13, the top of the ceramic lower plate 11 is connected to the ceramic upper plate 12, and the copper trace 13 is located between the ceramic lower plate 11 and the ceramic upper plate 12; the bottom of the multilayer substrate 1 is connected to the base 2, and the base 2 is fixedly connected to the chassis by screws, and the four ends of the multilayer substrate 1 are installed with sleeves 3, and the base 2 is connected to the four sleeves 3; the top of the base 2 is connected to the elastic frame 5 The elastic frame 5 is located above the multi-layer substrate 1; a circulation pump 6 is installed at one end of the top of the multi-layer substrate 1, and a heat exchanger 7 is installed at the other end of the top of the multi-layer substrate 1; the outside of the ceramic lower plate 11 is covered with a reinforcing coating A1101, and the outside of the ceramic upper plate 12 is covered with a reinforcing coating B1201; through the setting of the reinforcing coating A1101 and the reinforcing coating B1201, the wear resistance of the surface of the ceramic substrate is effectively improved, thereby preventing serious scratches on the surface, and improving the hardness of the surface of the ceramic substrate, thereby reducing the probability of notches when the surface of the ceramic substrate is bumped.

[0037] In the embodiment of the present disclosure, four plug posts 201 are provided on the top of the base 2. The positions of the plug posts 201 correspond to the positions of the four connecting holes 101. The plug posts 201 provided on the base 2 pass through the sleeve 3. The bottom of the sleeve 3 contacts the base 2. Positioning holes 2011 are provided near the upper ends of the plug posts 201. The ends of the elastic frame 5 are inserted into the positioning holes 2011 provided on the plug posts 201. The elastic frame 5 contacts the tops of the four sleeves 3.

[0038] By adopting the above technical solution, when the multi-layer substrate 1 is installed on the top of the base 2, the pin 201 is inserted into the sleeve 3, the positioning hole 2011 is exposed from the top of the sleeve 3, and the end of the elastic frame 5 is elastically reset and inserted into the positioning hole 2011, which has the effect of fixing the multi-layer substrate 1 and making the installation and fixation of the multi-layer substrate 1 easier. When the electronic components on the multi-layer substrate 1 are damaged and need to be replaced or repaired, a deformation force is applied inward to the elastic frame 5 to separate the end of the elastic frame 5 from the positioning hole 2011, and the multi-layer substrate 1 can be moved upward to separate the multi-layer substrate 1 from the base 2, so that the damaged electronic components on the multi-layer substrate 1 can be replaced and repaired. The operation is simpler and more time-saving, which helps to solve the problem that traditional disassembly and assembly require the use of tools and are prone to damage.

[0039] In the embodiment of the present disclosure, the multilayer substrate 1 is provided with connecting holes 101 at the four ends. The sleeve 3 slides through the connecting holes 101 provided on the multilayer substrate 1. The two ends of the sleeve 3 are turned outward. Two springs 4 are mounted on the outside of the sleeve 3. The two springs 4 are respectively located on the upper and lower sides of the multilayer substrate 1. One end of the spring 4 contacts the sleeve 3, and the other end of the spring 4 contacts the multilayer substrate 1.

[0040] By adopting the above technical solution, when the chassis is hit by external force, the multi-layer substrate 1 moves along the sleeve 3, and the spring 4 contracts under the force, thereby reducing the impact force on the multi-layer substrate 1, thereby protecting the electronic components on the multi-layer substrate 1 and effectively reducing the probability of electronic components being damaged due to impact.

[0041] Example 2, on the basis of Example 1, two oil guide grooves 1102 are provided inside the ceramic lower plate 11, cooling oil flows in the oil guide grooves 1102, the two oil guide grooves 1102 are arranged in a surrounding shape at the edge of the ceramic lower plate 11, and four oil guide holes 1202 are provided inside the ceramic upper plate 12, and the two ends of the oil guide grooves 1102 are connected to the two oil guide holes 1202. The inlet and outlet of the circulating pump 6 are connected to the two oil guide grooves 1102 through the oil guide holes 1202, and the heat exchange element 7 is provided inside. The oil guide channel 701 has two ends connected to the two oil guide grooves 1102 through the oil guide holes 1202. The circulating pump 6 is connected to the oil guide channel 701 provided in the heat exchange element 7 through the oil guide channel 701. The heat exchange element 7 is provided with a cooling channel 702 inside. Coolant flows through the cooling channel 702. The cooling channel 702 is spiral and surrounds the outer periphery of the oil guide channel 701. The two ends of the cooling channel 702 are connected to the pipeline of the liquid cooling device inside the chassis.

[0042] By adopting the above technical solution, the circulating pump 6 transports the low-temperature cooling oil in the oil guide channel 701 to the oil guide groove 1102, which plays an auxiliary cooling effect on the multi-layer substrate 1, so that the multi-layer substrate 1 remains in a low temperature state, effectively avoiding the multi-layer substrate 1 from being too hot, which causes the electronic components to overheat and fail, so that the electronic components maintain normal operating temperature. The heated cooling oil flows back to the oil guide channel 701, and the coolant circulating in the cooling channel 702 efficiently cools the cooling oil circulating in the oil guide channel 701, ensuring the cooling oil's auxiliary cooling effect on the multi-layer substrate 1. By designing the cooling channel 702 to be spirally wrapped around the outer periphery of the oil guide channel 701, the heat exchange area is increased, and the heat of the cooling oil in the oil guide channel 701 is more efficiently transferred to the coolant in the cooling channel 702.

[0043] The working principle of this embodiment is as follows: when the multi-layer substrate 1 is installed on the top of the base 2, the plug post 201 is inserted into the sleeve 3, the positioning hole 2011 leaks out from the top of the sleeve 3, and the end of the elastic frame 5 is elastically reset and inserted into the positioning hole 2011, which plays a role in fixing the multi-layer substrate 1, making the installation and fixing of the multi-layer substrate 1 easier; when the electronic components on the multi-layer substrate 1 are damaged and need to be replaced or repaired, a deformation force is applied inward to the elastic frame 5 to separate the end of the elastic frame 5 from the positioning hole 2011, and the multi-layer substrate 1 can be moved upward to separate the multi-layer substrate 1 from the base 2, so that the damaged electronic components on the multi-layer substrate 1 can be replaced and repaired, which is easier and more time-saving; by setting the strengthening coating A1101 and the strengthening coating B1201, the wear resistance of the surface of the ceramic substrate is effectively improved, thereby preventing serious scratches on the surface and increasing the hardness of the surface of the ceramic substrate, thereby reducing the probability of cracks when the surface of the ceramic substrate is bumped; the circulating pump 6 will The low-temperature cooling oil in the oil guide channel 701 is transported to the oil guide groove 1102, which plays an auxiliary cooling effect on the multi-layer substrate 1, so that the multi-layer substrate 1 is kept at a low temperature, effectively avoiding the multi-layer substrate 1 from being overheated and causing the electronic components to fail, so that the electronic components maintain normal operating temperature. The heated cooling oil flows back to the oil guide channel 701, and the coolant flowing in the cooling channel 702 efficiently cools the cooling oil flowing in the oil guide channel 701, ensuring the cooling oil's auxiliary cooling effect on the multi-layer substrate 1; by designing the cooling channel 702 to be spirally wrapped around the outer periphery of the oil guide channel 701, the heat exchange area is increased, and the heat of the cooling oil in the oil guide channel 701 is more efficiently transferred to the coolant in the cooling channel 702; when the chassis is hit by external force, the multi-layer substrate 1 moves along the sleeve 3, and the spring 4 is forced to contract, thereby reducing the impact force on the multi-layer substrate 1, thereby playing a protective effect on the electronic components on the multi-layer substrate 1.

[0044] In this article, there are several points to note:

[0045] 1. The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure. Other structures may refer to conventional designs.

[0046] 2. In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to form new embodiments.

[0047] The above are only specific embodiments of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this disclosure should be included in the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A multilayer ceramic substrate comprising: A multi-layer substrate (1), a base (2), a sleeve (3), an elastic frame (5), a circulation pump (6) and a heat exchanger (7); characterized in that the multi-layer substrate (1) is composed of a ceramic lower plate (11), a ceramic upper plate (12) and a copper trace (13), the top of the ceramic lower plate (11) is connected to the ceramic upper plate (12), and the copper trace (13) is located at the interval between the ceramic lower plate (11) and the ceramic upper plate (12); the bottom of the multi-layer substrate (1) is connected to the base (2), the base (2) is fixedly connected to the chassis by screws, the four ends of the multi-layer substrate (1) are installed with sleeves (3), the base (2) and the four sleeves (3) are connected. The top of the base (2) is connected to an elastic frame (5), and the elastic frame (5) is located above the multi-layer substrate (1); a circulation pump (6) is installed at one end of the top of the multi-layer substrate (1), and a heat exchanger (7) is installed at the other end of the top of the multi-layer substrate (1); four plugs (201) are provided on the top of the base (2), and the positions of the plugs (201) correspond to the positions of the four connecting holes (101). The plugs (201) provided on the base (2) pass through the sleeve (3), and the bottom of the sleeve (3) contacts the base (2); a positioning hole (2011) is provided near the upper end of the plug (201), and the end of the elastic frame (5) is provided. Inserted into the positioning hole (2011) provided in the plug column (201), the elastic frame (5) contacts the top of the four sleeves (3); two oil guide grooves (1102) are provided inside the ceramic lower plate (11), cooling oil flows in the oil guide grooves (1102), the two oil guide grooves (1102) are arranged in a circular shape at the edge of the ceramic lower plate (11), and four oil guide holes (1202) are provided inside the ceramic upper plate (12), and the two ends of the oil guide grooves (1102) are connected to the two oil guide holes (1202); the inlet and outlet of the circulating pump (6) are connected to the two oil guide grooves (1102) through the oil guide holes (1202). The heat exchange element (7) is provided with an oil guide channel (701) inside, and the two ends of the oil guide channel (701) are connected to the two oil guide grooves (1102) through the oil guide holes (1202). The circulating pump (6) is connected to the oil guide channel (701) provided in the heat exchange element (7) through the oil guide channel (701); the heat exchange element (7) is provided with a cooling channel (702) inside, and coolant flows in the cooling channel (702). The cooling channel (702) is spiral-shaped and surrounds the outer periphery of the oil guide channel (701). The two ends of the cooling channel (702) are connected to the pipeline of the liquid cooling device inside the chassis.

2. The multilayer ceramic substrate according to claim 1, wherein: The exterior of the ceramic lower plate (11) is covered with a reinforcement coating A (1101), and the exterior of the ceramic upper plate (12) is covered with a reinforcement coating B (1201).

3. The multilayer ceramic substrate according to claim 1, wherein: The multi-layer substrate (1) is provided with connecting holes (101) at four ends, and the sleeve (3) slides through the connecting holes (101) provided on the multi-layer substrate (1), with both ends of the sleeve (3) being turned outward.

4. The multilayer ceramic substrate according to claim 1, wherein: Two springs (4) are sleeved on the outside of the sleeve (3), and the two springs (4) are respectively located on the upper and lower sides of the multi-layer substrate (1). One end of the spring (4) contacts the sleeve (3), and the other end of the spring (4) contacts the multi-layer substrate (1).

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